KR20140092708A - Wet process chamber and wet process apparatus having the same - Google Patents
Wet process chamber and wet process apparatus having the same Download PDFInfo
- Publication number
- KR20140092708A KR20140092708A KR1020130005107A KR20130005107A KR20140092708A KR 20140092708 A KR20140092708 A KR 20140092708A KR 1020130005107 A KR1020130005107 A KR 1020130005107A KR 20130005107 A KR20130005107 A KR 20130005107A KR 20140092708 A KR20140092708 A KR 20140092708A
- Authority
- KR
- South Korea
- Prior art keywords
- housing
- wet process
- opening
- friction
- side member
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 160
- 230000008569 process Effects 0.000 title claims description 134
- 239000000463 material Substances 0.000 claims abstract description 92
- 230000000903 blocking effect Effects 0.000 claims abstract description 56
- 238000012545 processing Methods 0.000 claims abstract description 9
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 239000013077 target material Substances 0.000 abstract 2
- 239000012535 impurity Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Weting (AREA)
- Braking Arrangements (AREA)
- Ink Jet (AREA)
Abstract
Description
The present invention relates to a wet process chamber and a wet process apparatus including the same. More particularly, the present invention relates to a wet process chamber for preventing wetting of the interior of a wet process chamber during a wet process, And a wet process apparatus including the same.
The wet process is used in the manufacture of various products, for example, the wet process includes a cleaning process, a plating process or an etching process, and may be various processes using a solution.
In particular, wet processing is used to precisely process various electrical and electronic products and other mechanical parts.
FIG. 1 is a schematic view showing a process including a conventional wet process, and FIG. 2 is a perspective view schematically showing a single wet process chamber of FIG.
Referring to Figs. 1 and 2, the
The material to be treated 1 may be in various forms such as a film, a substrate, a wafer, and the like to be subjected to a wet process.
The
The solution to be used for the wet process performed in the
That is, as described above, the material to be treated 1 may undergo at least one wet process before passing through the
The remaining solution flows into the
Particularly, it is not easy to manufacture the opening 11a to have a small size corresponding to the thickness of the material to be treated 1 due to the difficulty in manufacturing the
Therefore, when the material to be treated 1 flows into the opening 11a, the impurity solution flows into the
The present invention can provide a wet process chamber that prevents the interior of a wet process chamber from being contaminated and improves wet process characteristics and a wet process apparatus including the same.
The present invention relates to a wet process chamber for carrying out a wet process on a material to be treated, the process chamber comprising a housing having at least one opening portion through which the material to be processed passes, and a housing disposed so as to correspond to the opening, Wherein the blocking portion has a larger size than the opening portion and the slit of the blocking portion has a smaller width than the opening portion.
In the present invention, the blocking portion may include an outer portion disposed on the outer side of the housing, an inner portion corresponding to the outer portion, an inner portion disposed on the inner side of the housing, and a coupling portion coupling the outer portion and the inner portion.
In the present invention, the blocking portion may be formed to be attachable to and detachable from the housing through the coupling portion.
In the present invention, the outer side portion and the inner side portion may each include a first side member and a second side member arranged to face each other.
In the present invention, the outer side and the inner side may have slits formed between the first side member and the second side member.
In the present invention, the slit of the blocking portion may overlap the slit of each of the outer side portion and the inner side portion.
In the present invention, the first side member and the second side member may have grooves formed on respective side surfaces facing each other, and the grooves may form the slits of the outer side and the inner side.
In the present invention, the first side member of the outer side part is coupled with the first side member of the inner side part through the engagement part, and the second side member of the outer side part is coupled with the second side member of the inner side part through the engagement part have.
In the present invention, the outer side portion may include a groove corresponding to the engaging portion, and the inner side portion may include a through hole corresponding to the engaging portion.
In the present invention, the coupling portion may be arranged to correspond to the opening while coupling the outer side and the inner side.
In the present invention, the outer side portion may be formed thicker than the inner side portion.
In the present invention, the length of the slit of the blocking portion may be equal to or smaller than the length of the opening.
In the present invention, it may further comprise a friction portion corresponding to the opening portion and disposed adjacent to the blocking portion, the friction portion being formed to be in contact with the surface of the material to be treated.
In the present invention, the friction portion may include a first friction member and a second friction member arranged to face each other.
In the present invention, the friction portion may be arranged to correspond to the inside of the slit of the blocking portion.
In the present invention, the friction portions may be disposed on the inner side of the housing.
In the present invention, the friction portion may have a roll shape.
In the present invention, the object to be processed is subjected to the wet process so that the material to be treated passes through the slit of the opening and the blocking portion while being oriented in a direction parallel to the paper surface or in a direction perpendicular to the paper surface, .
The apparatus may further include an inner housing disposed in the housing and configured to provide a space in which the wet process is performed, the inner housing having at least one opening for allowing and receiving the material to be processed.
In the present invention, the inner housing may have a box shape.
In the present invention, the inner housing may have a box shape without a bottom surface and be in contact with a bottom surface of the housing.
The apparatus may further include a friction portion corresponding to the opening portion of the inner housing and disposed inside or outside the inner housing and configured to contact the surface of the material to be treated.
In the present invention, the friction portion may include a first friction member and a second friction member arranged to face each other.
In the present invention, the friction portion may have a roll shape.
In the present invention, the wet process may include a cleaning, plating or etching process.
In the present invention, the material to be treated may comprise a film material, a wafer or a substrate.
According to another aspect of the present invention, there is provided a wet process apparatus comprising the wet process chamber.
In the present invention, the wet process apparatus may include a plurality of process chambers, and at least one of the process chambers may be the wet process chamber.
The wet process chamber and the wet process apparatus including the same according to the present invention easily prevent the contamination of the wet process chamber, which is generated when an undesired solution flows into the wet process together with the material to be treated.
This makes it possible to maintain the cleanliness inside the wet process chamber easily and precisely control the wet process.
As a result, the improvement of wet process characteristics can be maximized.
FIG. 1 is a view schematically showing a process including a conventional wet process.
2 is a perspective view schematically illustrating one wet process chamber of FIG.
3 is a perspective view schematically illustrating a wet process chamber according to an embodiment of the present invention.
Fig. 4 is a side view seen in the direction of K in Fig. 3;
5 is an enlarged view of A in Fig.
Fig. 6 is a view showing only an opening portion in Fig. 5. Fig.
Fig. 7 is a view seen from the direction M in Fig.
FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIGS. 5 and 7. FIG.
9 is a cross-sectional view schematically illustrating a wet process chamber according to another embodiment of the present invention.
10 is an enlarged view of FIG. 9A.
11 is a perspective view schematically showing a wet process chamber according to another embodiment of the present invention.
12 is a plan view viewed from the direction M in Fig.
13 is a perspective view schematically illustrating a wet process chamber according to another embodiment of the present invention.
14 is a plan view schematically illustrating a wet process chamber according to another embodiment of the present invention.
15 is a plan view schematically illustrating a wet process chamber according to another embodiment of the present invention.
16 is a view schematically showing an example of a wet processing apparatus to which the wet process chamber of the present invention is applied.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The following examples are intended to illustrate the present invention and should not be construed as limiting the scope of the present invention.
Here, i) the shape, size, ratio, angle, number, operation, etc. shown in the accompanying drawings are schematic and may be modified somewhat. ii) Since the figure is shown by the observer's line of sight, the direction and position of the figure can be variously changed depending on the position of the observer. iii) The same reference numerals can be used for the same parts even if the drawing numbers are different. iv) If 'include', 'have', 'done', etc. are used, other parts may be added unless '~ only' is used. v) can be interpreted in a plurality of cases as described in the singular. vi) Comparison of numerical values, shapes, sizes, and positional relations are interpreted to include normal error ranges even if they are not described as 'weak', 'substantial', or 'relative'. vii) The term 'after', 'before', 'after', 'and', 'here', 'following', etc. are used, but are not used to limit the temporal position. viii) If the positional relationship between two parts is described by 'on', 'on', etc., one or more other parts may be interposed between the two parts, unless 'right' is used. ix) When parts are connected by '~' or ',' and / or 'parts are interpreted to include not only singles but also combinations,
FIG. 3 is a perspective view schematically showing a wet process chamber according to an embodiment of the present invention, FIG. 4 is a side view in the direction of K in FIG. 3, FIG. 5 is an enlarged view of A in FIG. FIG. 7 is a view taken along line M of FIG. 4, and FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG.
Referring to FIGS. 3-8, the
The
The
The
A
4 may be provided in various forms. For example, the nozzle unit may be provided without a body member, and the number of the nozzle members may be limited none. In addition, the nozzle member can be arranged at various positions in the
The blocking
The blocking
5, the
The
Specifically, the
Like the
As shown in FIG. 5, it is preferable that the
The
The
That is, the width and length of the
The
The
6, the
The
The
The
The
Specifically, the
Like the
As shown in FIG. 7, the
The
The
The
The
That is, the width and length of the
The
The through
Referring to FIG. 8, the blocking
8, the
Also, the engaging
The
The
Since the engaging
The depths of the
In the
Thereby preventing the
In particular, the blocking
FIG. 9 is a cross-sectional view schematically showing a wet process chamber according to another embodiment of the present invention, and FIG. 10 is an enlarged view of FIG. 9A. For the sake of convenience of description, different points from the above-described embodiment will be mainly described, and the same reference numerals denote the same members.
The wet process chamber includes a
Specifically, the
The
For this purpose, the
The other components are the same as those of the above-described embodiment, and a detailed description thereof will be omitted.
FIG. 11 is a perspective view schematically showing a wet process chamber according to another embodiment of the present invention, and FIG. 12 is a plan view seen from the direction M of FIG.
Referring to FIGS. 11 and 12, the
The
The
The
For this purpose, the
The
13 is a perspective view schematically illustrating a wet process chamber according to another embodiment of the present invention.
Referring to FIG. 13, the
In the above-described embodiment, the material to be treated 1 flows into the
That is, as shown in Fig. 13, the material to be treated 1 can be arranged in the horizontal direction, that is, the surface to be treated of the material to be treated 1 is in parallel with the ground. The opening (not shown) of the
The detailed contents of the
14 is a plan view schematically illustrating a wet process chamber according to another embodiment of the present invention.
Referring to FIG. 14, the
In the above-described embodiment, after the material to be treated 1 has flowed into the
However, in this embodiment, as shown in FIG. 12, the wet process for the material to be treated (not shown) proceeds in the
To this end, the
The detailed contents of the
15 is a plan view schematically illustrating a wet process chamber according to another embodiment of the present invention.
15, the
In this embodiment, the wet process for the material to be treated (not shown) proceeds in the
To this end, the
The
The
For this, the
The
The
For this purpose, the
Also, although not shown, the
The
The details of the
16 is a view schematically showing an example of a wet processing apparatus to which the wet process chamber of the present invention is applied.
Specifically, FIG. 16 illustrates a
The material to be treated 1 sequentially passes through a plurality of chambers 100-1, 100-2, and 100-3 while moving in the X1 direction, and continuously performs a plurality of wet processes. At least one of the plurality of chambers 100-1, 100-2, and 100-3, for example, the chamber 100-2, may include the
When the material to be treated 1 passes through the chamber 100-1 and then flows into the chamber 100-2, the solution remaining in the
16 is one example of applying the present invention. Although not shown, the present invention is also applicable to a wet process chamber having only one wet process chamber. That is, the present invention is also applicable to a single-chamber structure wet process apparatus having only one of the
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.
1:
100, 200, 300, 400, 500: wet process chamber
101, 201, 301, 401, 501: housing
110, 210, 310, 410, 510:
250: Friction part
402, 502: inner housing
550: first friction portion
Claims (28)
A housing having at least one opening formed such that the material to be treated passes therethrough; And
And a shielding portion disposed so as to correspond to the opening portion and having a slit through which the material to be treated passes,
Wherein the blocking portion has a larger size than the opening portion and the slit of the blocking portion has a smaller width than the opening portion.
Wherein the blocking portion includes an outer portion disposed on an outer side of the housing, an inner portion corresponding to the outer portion and disposed on an inner side of the housing, and a coupling portion coupling the outer portion and the inner portion.
Wherein the blocking portion is attachable to and detachable from the housing through the coupling portion.
Wherein the outer side and the inner side each have a first side member and a second side member arranged to face each other.
The outer side and the inner side having a slit formed between the first side member and the second side member.
Wherein the slit of the blocking portion overlaps the slit of each of the outer side and the inner side.
Wherein the first side member and the second side member are formed with grooves on opposite sides thereof and the grooves form slits in the outer side and the inner side.
The first side member of the outer side engages with the first side member of the inner side through the engaging portion,
Wherein the second side member of the outer side engages the second side member of the inner side through the engaging portion.
The outer side portion has a groove corresponding to the engaging portion,
And the medial portion includes a through hole corresponding to the engagement portion.
Wherein the coupling portion is disposed to correspond to the opening while coupling the outer side and the inner side.
Wherein the outer side is thicker than the inner side.
Wherein the length of the slit of the blocking portion is equal to or less than the length of the opening.
And a friction portion corresponding to the opening portion and disposed adjacent to the blocking portion, the friction portion being formed to be in contact with the surface of the material to be treated.
Wherein the friction portion comprises a first friction member and a second friction member disposed opposite to each other.
Wherein the friction portion is disposed corresponding to the slit of the blocking portion.
Wherein the friction portions are disposed on the inside of the housing with respect to each other.
Said friction portion having a roll configuration.
A wet process in which the opening to be processed and the blocking portion are formed so that the to-be-treated material to be processed through the wet process passes through the slit of the opening and the blocking portion while being oriented in a direction parallel to the paper surface or in a direction perpendicular to the paper surface chamber.
Further comprising an inner housing disposed within the housing and configured to provide a space in which a wet process is performed, the inner housing having at least one opening to allow the material to be processed to enter and exit.
Said inner housing having a box shape.
Wherein the inner housing has a box-like shape without a bottom surface and contacts the bottom surface of the housing.
Further comprising a friction portion corresponding to the opening of the inner housing and disposed inside or outside the inner housing, the friction portion being configured to contact the surface of the material to be treated.
Wherein the friction portion comprises a first friction member and a second friction member disposed opposite to each other.
Said friction portion having a roll configuration.
Wherein the wet process comprises a cleaning, plating or etching process.
Wherein the material to be treated comprises a film material, a wafer or a substrate.
The wet processing apparatus includes a plurality of process chambers,
Wherein at least one of the process chambers is the wet process chamber of any one of claims 1 to 26.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130005107A KR101654293B1 (en) | 2013-01-16 | 2013-01-16 | Wet process chamber and wet process apparatus having the same |
PCT/KR2014/000495 WO2014112818A1 (en) | 2013-01-16 | 2014-01-16 | Wet processing chamber and apparatus for wet processing comprising same |
CN201480015848.XA CN105163873B (en) | 2013-01-16 | 2014-01-16 | Wet process chamber and the wet process device for including it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130005107A KR101654293B1 (en) | 2013-01-16 | 2013-01-16 | Wet process chamber and wet process apparatus having the same |
Publications (2)
Publication Number | Publication Date |
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KR20140092708A true KR20140092708A (en) | 2014-07-24 |
KR101654293B1 KR101654293B1 (en) | 2016-09-06 |
Family
ID=51209849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020130005107A KR101654293B1 (en) | 2013-01-16 | 2013-01-16 | Wet process chamber and wet process apparatus having the same |
Country Status (3)
Country | Link |
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KR (1) | KR101654293B1 (en) |
CN (1) | CN105163873B (en) |
WO (1) | WO2014112818A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070034887A (en) * | 2005-09-26 | 2007-03-29 | 세메스 주식회사 | Substrate Drying Equipment |
JP2007273974A (en) * | 2006-03-31 | 2007-10-18 | Semes Co Ltd | Substrate processing apparatus and substrate processing method |
JP2010087079A (en) * | 2008-09-30 | 2010-04-15 | Sekisui Chem Co Ltd | Surface processing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5746903A (en) * | 1980-09-05 | 1982-03-17 | Mitsubishi Chem Ind Ltd | Agricultural and gardening fungicide |
KR100268448B1 (en) * | 1998-08-17 | 2000-10-16 | 윤종용 | Etching end point detector |
KR100607414B1 (en) * | 2000-05-17 | 2006-08-01 | 삼성전자주식회사 | Etching apparatus |
JP3778071B2 (en) * | 2001-11-30 | 2006-05-24 | 日立ハイテク電子エンジニアリング株式会社 | Substrate dipping type continuous liquid processing equipment |
JP4022115B2 (en) * | 2002-09-06 | 2007-12-12 | 豊 佐藤 | Dam type continuous immersion treatment equipment |
JP4704181B2 (en) * | 2005-10-20 | 2011-06-15 | 上村工業株式会社 | Immersion processing equipment |
JP5398223B2 (en) * | 2008-10-23 | 2014-01-29 | 上村工業株式会社 | Gate device for treatment tank |
JP5133428B2 (en) * | 2009-02-02 | 2013-01-30 | シャープ株式会社 | Substrate processing equipment |
-
2013
- 2013-01-16 KR KR1020130005107A patent/KR101654293B1/en active IP Right Grant
-
2014
- 2014-01-16 WO PCT/KR2014/000495 patent/WO2014112818A1/en active Application Filing
- 2014-01-16 CN CN201480015848.XA patent/CN105163873B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070034887A (en) * | 2005-09-26 | 2007-03-29 | 세메스 주식회사 | Substrate Drying Equipment |
JP2007273974A (en) * | 2006-03-31 | 2007-10-18 | Semes Co Ltd | Substrate processing apparatus and substrate processing method |
JP2010087079A (en) * | 2008-09-30 | 2010-04-15 | Sekisui Chem Co Ltd | Surface processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2014112818A1 (en) | 2014-07-24 |
CN105163873A (en) | 2015-12-16 |
KR101654293B1 (en) | 2016-09-06 |
CN105163873B (en) | 2018-03-06 |
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