KR20220155481A - Bonding plate and thin film deposition apparatus having the same - Google Patents

Abstract

The present invention is to provide a fastening plate and a thin film deposition apparatus having the same to more accurately fasten a plate member to a chamber and prevent deviation or the like that may occur during processes. An aspect of the present invention provides a fastening plate comprising a plate having at least one opening and a nut member penetrating the plate through the at least one opening and forming a spacing from the plate, wherein the nut member includes a first part having a convex portion which protrudes in the thickness direction of the plate and passes through the at least one opening and a second part coupled to the end of the convex portion.

Description

Bonding plate and thin film deposition apparatus having the same {Bonding plate and thin film deposition apparatus having the same}

Embodiments of the present invention relate to a bonding plate and a thin film deposition apparatus having the same.

A process of manufacturing an information processing device such as a display, a microprocessor, or a memory includes a process of depositing various kinds of thin films having a thickness of several nanometers to several micrometers.

A thin film deposition apparatus for performing such a thin film deposition process includes a chamber, and the thin film deposition process is performed in an inner space of the chamber. A film forming material used in the deposition process may cause contamination by adhering to an inner wall surface of a chamber as well as an object to be processed. To prevent this, a plate member such as an anti-chak plate covering at least a portion of an inner wall surface of the chamber may be disposed inside the chamber.

However, such a conventional bonding plate and thin film deposition apparatus having the same have problems in that a processing error occurs when the plate member and the chamber are coupled, or the plate member and the chamber coupling are distorted according to the process.

Embodiments of the present invention are intended to solve various problems, including the above problems, and to more accurately combine a plate member with a chamber, and a plate for bonding that can prevent distortion that may occur according to the process. And to provide a thin film deposition apparatus having the same. However, these tasks are illustrative, and the scope of the present invention is not limited thereby.

According to one aspect of the present invention, a plate having at least one opening and a nut member penetrating the plate through the at least one opening and forming a space apart from the plate, the nut member comprising: A coupling plate including a first portion having a concave-convex portion protruding in a thickness direction of the plate and passing through the at least one opening, and a second portion coupled to an end of the concave-convex portion is provided.

According to this embodiment, the nut member may be movable through the separation space.

According to this embodiment, the nut member may be movable in a thickness direction of the plate and a radial direction crossing the thickness direction.

According to the present embodiment, in a cross-sectional view, a thickness of the concave-convex portion protruding in the thickness direction may be greater than a thickness of the plate.

According to the present embodiment, a diameter of the concave-convex portion may be smaller than a diameter of the at least one opening in a plan view.

According to this embodiment, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion may be greater than a diameter of the at least one opening in a plan view.

According to the present embodiment, in a plan view, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion may be larger than diameters of the concavo-convex portion.

According to this embodiment, the nut member may include a fastening hole penetrating the center of the nut member.

According to another aspect of the present invention, a chamber, a deposition source disposed inside the chamber, a holder disposed opposite to the deposition source inside the chamber, and an inside of the chamber so as to cover at least one inner wall surface of the chamber. and a coupling plate disposed thereon, the coupling plate having at least one opening, penetrating the plate through the at least one opening, forming a separation space with the plate, and forming a space between the plate and the plate. A nut member for supporting the nut member includes a first portion having a concave-convex portion protruding in a thickness direction of the plate and passing through the at least one opening, and a second portion coupled to an end of the concave-convex portion. To, a thin film deposition apparatus is provided.

According to this embodiment, the nut member may be coupled to the bolt member and fixed to the at least one inner wall surface.

According to this embodiment, the plate may expand through the separation space without being coupled to the nut member.

According to this embodiment, the nut member may include a fastening hole penetrating the center of the nut member, and the chamber may include a fastening groove formed on the at least one inner wall surface.

According to this embodiment, the bolt member may be disposed to fill the fastening hole and the fastening groove.

According to the present embodiment, in a cross-sectional view, a thickness of the concave-convex portion protruding in the thickness direction may be greater than a thickness of the plate.

According to the present embodiment, a diameter of the concave-convex portion may be smaller than a diameter of the at least one opening in a plan view.

According to this embodiment, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion may be greater than a diameter of the at least one opening in a plan view.

According to the present embodiment, in a plan view, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion may be larger than diameters of the concavo-convex portion.

According to the present embodiment, the at least one inner wall surface may include one or more of a lower inner wall surface of the chamber, an upper inner wall surface of the chamber, a left inner wall surface of the chamber, and a right inner wall surface of the chamber.

According to this embodiment, the plate covering the lower inner wall surface and the plate covering the upper inner wall surface may contact a portion of the inner surface of the nut member parallel to the plate.

According to this embodiment, the plate covering the left inner wall surface and the plate covering the right inner wall surface may contact a portion of the inner surface of the nut member perpendicular to the plate.

Other aspects, features, and advantages other than those described above will become clear from the detailed description, claims, and drawings for carrying out the invention below.

According to one embodiment of the present invention made as described above, a bonding plate capable of more accurately coupling a plate member to a chamber and preventing distortion that may occur during a process, and a thin film deposition apparatus having the same can be implemented. Of course, the scope of the present invention is not limited by these effects.

1 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing a state in which a coupling plate is coupled to a thin film deposition apparatus according to an embodiment of the present invention.
Figure 3 is a cross-sectional view schematically showing a part of the configuration provided by the coupling plate according to an embodiment of the present invention.
Figure 4 is a cross-sectional view schematically showing a portion of the coupling plate according to an embodiment of the present invention.
FIG. 5 is a plan view schematically showing a part of the coupling plate of FIG. 4 .
6 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention.
7 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention.
8 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and methods for achieving them will become clear with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

In the following embodiments, terms such as first and second are used for the purpose of distinguishing one component from another component without limiting meaning.

In the following examples, expressions in the singular number include plural expressions unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that features or elements described in the specification exist, and do not preclude the possibility that one or more other features or elements may be added.

In the following embodiments, when a part such as a film, region, component, etc. is said to be on or on another part, not only when it is directly above the other part, but also when another film, region, component, etc. is interposed therebetween. Including if there is

In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated bar.

When an embodiment is otherwise implementable, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order reverse to the order described.

In the present specification, "A and/or B" represents the case of A, B, or A and B. And, "at least one of A and B" represents the case of A, B, or A and B.

In the following embodiments, when films, regions, components, etc. are connected, when films, regions, and components are directly connected, or/and other films, regions, and components are interposed between the films, regions, and components. It also includes cases where they are interposed and indirectly connected. For example, when a film, region, component, etc. is electrically connected in this specification, when a film, region, component, etc. is directly electrically connected, and/or another film, region, component, etc. is interposed therebetween. This indicates an indirect electrical connection.

The x-axis, y-axis, and z-axis are not limited to the three axes of the Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and overlapping descriptions thereof will be omitted. .

1 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention.

As shown in FIG. 1 , a thin film deposition apparatus 1 according to an embodiment of the present invention may include a chamber 10 , a holder 20 and a deposition source 30 .

In one embodiment, the thin film deposition apparatus 1 may be a display device manufacturing device that performs a part of a process of manufacturing a display device. Specifically, the thin film deposition apparatus 1 may be a device that performs a process of depositing (or forming a film) a thin film on a substrate s of a display device.

Here, the type of deposition process performed by the thin film deposition apparatus 1 is not limited. For example, the thin film deposition apparatus 1 may perform a physical vapor deposition (PVD) method such as a vacuum deposition method, an ion plating method, and a sputtering method, and a chemical vapor deposition (CVD) method based on a gas reaction. In addition, there is no limitation on the type of thin film formed by the deposition process performed by the thin film deposition apparatus 1. For example, an electrode layer, a metal layer, an inorganic insulating layer, an organic insulating layer, and the like constituting a display device may be formed on the substrate s, which is a target object disposed inside the chamber 10 of the thin film deposition apparatus 1.

The chamber 10 serves to provide a space in which a deposition process can be performed. That is, the chamber 10 may be a reaction chamber having a predetermined reaction space therein. In one embodiment, the inside of the chamber 10 may be maintained in a low vacuum state or a high vacuum state. To this end, a pumping unit (not shown) may be provided on one side of the chamber 10 . The pumping unit may serve to discharge air inside the chamber 10 to the outside of the chamber 10 to maintain the inside of the chamber 10 in a low vacuum state or a high vacuum state.

Various components used in the deposition process may be provided inside the chamber 10 . For example, a holder 20 capable of loading and supporting an object to be processed inside the chamber 100, and a holder 20 disposed to face the holder 20 inside the chamber 10 to supply a deposition material (eg, thin film material). A deposition source 30 may be provided.

The holder 20 has a surface on which an object to be processed can be placed, and can support and fix the object placed in the holder 20 . In one embodiment, the holder 20 may be provided to be movable up and down inside the chamber 10 . The holder 20 may move up and down in response to loading and unloading of an object or a deposition process. In addition, in one embodiment, the holder 20 may have a heating member or be connected to the heating member to heat and maintain the target object disposed in the holder 20 at a preset temperature.

Referring to FIG. 1 , a substrate s as an object to be processed may be loaded into the holder 20 . The substrate s may be fixed to the holder 20 such that one surface faces the deposition source 30 . In one embodiment, a mask (not shown) for patterning may be disposed between the substrate s and the deposition source 30 .

The deposition source 30 serves to supply deposition materials into the chamber 10 . The deposition source 30 may store and store deposition materials, and spray the deposition materials toward the substrate s. In one embodiment, the deposition source 30 may include a nozzle (not shown) capable of injecting a deposition material.

The deposition material sprayed from the deposition source 30 may diffuse from the deposition source 30 in a radial direction. Referring to FIG. 1 , a portion of the deposition material sprayed from the deposition source 30 diffuses in a direction in which the substrate s is disposed, thereby forming a thin film on the substrate s. On the other hand, the remaining portion of the deposition material sprayed from the deposition source 30 may diffuse in a direction where the substrate s is not disposed and reach a structure other than the substrate s. There is a problem in that components other than the substrate s, for example, deposition materials reaching the inner wall surface of the chamber 10 may adhere to or react with the inner wall surface of the chamber 10 to form an unnecessary thin film or cause contamination. In order to prevent this, the thin film deposition apparatus 1 according to an embodiment of the present invention may include a bonding plate 40 inside the chamber 10, and a detailed description thereof will be described later with reference to FIG. 2.

2 is a cross-sectional view schematically showing a state in which a coupling plate is coupled to a thin film deposition apparatus according to an embodiment of the present invention. Hereinafter, the same reference numerals in the drawings denote the same components, and descriptions of overlapping contents with the above descriptions will be omitted.

As shown in FIG. 2 , the thin film deposition apparatus 1 according to an embodiment of the present invention may further include a bonding plate 40 disposed inside the chamber 10 .

The coupling plate 40 may be disposed inside the chamber 10 to cover at least one inner wall surface of the chamber 10 . In this regard, in FIG. 2, the coupling plate 40 is the lower inner wall surface of the chamber 10, the upper inner wall surface of the chamber 10, the left inner wall surface of the chamber 10, and the chamber ( 10), but is not limited thereto. For example, the coupling plate 40 is the lower inner wall surface of the chamber 10, the upper inner wall surface of the chamber 10, the left inner wall surface of the chamber 10, and the right side of the chamber 10 among the inner wall surfaces of the chamber 10. It may be disposed only on some of the inner wall surfaces and may not be disposed on other parts. That is, at least one inner wall surface of the chamber 10 on which the coupling plate 40 is disposed is the lower inner wall surface of the chamber 10, the upper inner wall surface of the chamber 10, the chamber ( It may include at least one of the left inner wall surface of 10) and the right inner wall surface of the chamber 10.

The coupling plate 40 may include a plate 41 and a nut member 42 . The nut member 42 may be fixed to the inner wall surface of the chamber 10 through the bolt member 50 . The nut member 42 may serve to support the plate 41 while being fixed to the inner wall surface of the chamber 10 . That is, the plate 41 may be disposed to cover the inner wall surface of the chamber 10 in a state of spanning the nut member 42 without being directly coupled to the chamber 10 . A detailed description of the structure of the coupling plate 40 will be described later with reference to FIGS. 3 to 5 .

Figure 3 is a cross-sectional view schematically showing a portion of the configuration of the coupling plate according to an embodiment of the present invention, Figure 4 is a cross-sectional view schematically showing a portion of the coupling plate according to an embodiment of the present invention And, Figure 5 is a plan view schematically showing a portion of the coupling plate of Figure 4.

The coupling plate 40 may include a plate 41 and a nut member 42 . Specifically, the plate-shaped plate 41 may have at least one opening 41h. The nut member 42 may be disposed to pass through the plate 41 through the opening 41h of the plate 41 .

3 and 4, the nut member 42 is a portion located on one side of the plate 41 when disposed to pass through the plate 41, a portion penetrating the plate 41, and a portion of the plate 41. It may include a part located on the other surface. After being disposed in the portion of the plate 41 where the openings 41h are formed, they can form the nut member 42 by being coupled to each other.

In one embodiment, as shown in FIG. 3, when the nut member 42 is disposed to penetrate the plate 41, the portion located on one side of the plate 41 and the portion penetrating the plate 41 are integrally formed. It is formed as one body, and after being disposed in the portion of the plate 41 where the opening 41h is formed, it may be combined with the portion located on the other surface of the plate 41. Specifically, the nut member 42 has a first portion 42a having a concave-convex portion cv protruding in the thickness direction of the plate 41 and passing through the opening 41h of the plate 41, and an end portion of the concave-convex portion. It may include a coupled second part (42b). As shown in FIG. 4, the first part 42a may have a 'T' shape, and the first part 42a and the second part 42b are coupled to each other with a plate 41 interposed therebetween, so that the nut member 42 can be constituted. For example, the first part 42a is disposed on one surface of the plate 41 so that the uneven portion of the first part 42a passes through the opening 41h of the plate 41, and the second part 42b is placed on the plate 41 ) It can be disposed at the end of the exposed first portion (42a) on the other side. Here, the first part 42a and the second part 42b may be coupled by welding or the like.

On the other hand, the first part (42a) and the second part (42b) each have a fastening groove, and when the first part (42a) and the second part (42b) are coupled, the fastening groove of the first part (42a) and the second part (42a) The fastening grooves of the two portions 42b may be matched with each other to form one fastening path. This fastening path may provide a path through which a bolt member (50, see FIG. 6) to be described later passes and is coupled to the nut member 42, and a detailed description thereof will be described later with reference to FIG. 6.

In another embodiment, when the nut member 42 is disposed to pass through the plate 41, a portion located on one side of the plate 41, a portion passing through the plate 41, and a portion located on the other side of the plate 41 The parts are each separate components, and can be coupled to each other after being placed in the part where the opening 41h of the plate 41 is formed.

The nut member 42 of the coupling plate 40 may be provided to be movable without being coupled with the plate 41 . To this end, the nut member 42 may form a predetermined separation space from the plate 41 . Specifically, at least a portion of the nut member 42 may be spaced apart without contacting the plate 41 . The nut member 42 is not fixed to the plate 41 and can move by a predetermined range through the separation space. For example, the nut member 42 may be movable in the thickness direction of the plate 41 and in a radial direction crossing the thickness direction of the plate 41 .

That is, the nut member 42 provided in the coupling plate 40 according to an embodiment of the present invention is a movable nut and can move in an upward direction, a downward direction, a left direction, and/or a right direction. Accordingly, when the coupling plate 40 is disposed inside the chamber 10, the nut member 42 is moved and the nut member 42 can be adjusted to match the groove formed on the inner wall surface of the chamber 10. . Therefore, there is an effect that the coupling plate 40 can be coupled even when there is a processing error of the opening 41h formed in the plate 41 or the chamber 10 having a different standard. In addition, even after the coupling plate 40 is coupled to the inner wall surface of the chamber 10, the nut member 42 is not coupled to the plate 41 and is disposed such that at least a portion thereof is spaced apart from the plate 41, so that the plate 41 ) and the separation space can be maintained. Accordingly, even if the plate 41 contracts or expands according to changes in conditions inside the chamber 10 during a process or the like, the shape of the plate 41 can be maintained. For example, even if the plate 41 contracts or expands as the vacuum level inside the chamber 10 changes from a low vacuum state to a high vacuum state or from a high vacuum state to a low vacuum state, there is a gap between the plate 41 and the nut member 42. Since the separation space formed in absorbs the change of the plate 41, it is possible to prevent the plate 41 from changing in shape such as twisting.

The plate 41 and the nut member 42 may be designed to satisfy preset conditions so that the nut member 42 forms a space separated from the plate 41 .

In one embodiment, in a plan view, the diameter d1 of the uneven portion cv of the first portion 42a of the nut member 42 may be smaller than the diameter hd of the opening 41h of the plate 41 . Through this, the uneven portion cv of the first portion 42a of the nut member 42 can form a space apart from the plate 41, and the nut member 42 can move using the space. Specifically, the nut member 42 can move leftward and rightward in a cross-sectional view, and can move in a radial direction crossing the thickness direction of the plate 41 in a plan view.

In one embodiment, in a plan view, the diameter d2 of the lower surface of the first portion 42a of the nut member 42 and the diameter of the upper surface of the second portion 42b of the nut member 42 are the opening of the plate 41 It may be larger than the diameter (hd) of (41h). Further, in a plan view, the diameter d2 of the lower surface of the first portion 42a of the nut member 42 and the diameter of the upper surface of the second portion 42b of the nut member 42 are the irregularities of the first portion 42a. It may be larger than the diameter of (cv). As a result, the nut member 42 may have an 'H' shape in cross section.

Through this, the nut member 42 is disposed to pass through the plate 41 through the opening 41h of the plate 41, and may have a groove formed along the circumference of the uneven portion cv. When the coupling plate 40 is disposed inside the chamber 10, at least a portion of the plate 41 may be inserted into the groove and supported by the nut member 42. At the same time, the plate 41 is disposed to overlap the lower surface of the first part 42a and the upper surface of the second part 42b of the nut member 42, the plate 41 is the nut member 42 and the chamber ( 10), it is possible to cover the inner wall surface of the chamber 10 without leaving the position without being directly coupled to the inner wall surface.

Meanwhile, in a plan view, the diameter of the upper surface of the second portion 42b of the nut member 42 may be the same as the diameter d2 of the lower surface of the first portion 42a of the nut member 42 . However, it is not limited thereto, and the diameter of the upper surface of the second portion 42b of the nut member 42 in a plan view may be different from the diameter d2 of the lower surface of the first portion 42a of the nut member 42 .

In one embodiment, the protruded thickness (d3) of the uneven portion (cv) of the first portion (42a) of the nut member 42 in the thickness direction of the plate 41 in the cross-sectional view is the thickness (t) of the plate 41 may be thicker. Through this, the thickness of the groove formed along the circumference of the concavo-convex part (cv) of the nut member 42 in the cross-sectional view is formed thicker than the thickness of the plate 41, so that the upper surface of the plate 41 and the lower surface of the plate 41 are spaced apart. Can be formed, the nut member 42 can move using the separation space. Specifically, the nut member 42 may move upward and downward in a cross-sectional view.

Hereinafter, with reference to FIGS. 6 to 8 , a state in which the bonding plate 40 is disposed inside the chamber 10 will be described in detail.

6 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention. FIG. 6 may correspond to a cross-sectional view of the thin film deposition apparatus in which portion A1 of FIG. 2 is enlarged. Also, portion A1 may correspond to a portion of the lower inner wall surface of the chamber.

As shown in FIG. 6 , the bonding plate 40 may be disposed to cover the lower inner wall surface of the chamber 10 of the thin film deposition apparatus 1 (see FIG. 2 ).

The nut member 42 of the coupling plate 40 may be coupled and fixed to the lower inner wall surface of the chamber 10 through the bolt member 50 . Specifically, the nut member 42 includes a fastening hole penetrating the center of the nut member 42, and the bolt member 50 penetrates the fastening hole of the nut member 42 and is coupled to the nut member 42. . In addition, the end of the bolt member 50 may be coupled to the lower inner wall surface of the chamber 10 while filling a fastening groove formed on the lower inner wall surface of the chamber 10 .

The plate 41 of the coupling plate 40 is disposed to cover the lower inner wall surface of the chamber 10 . At least a portion of the plate 41 may be inserted into a groove formed on a side surface of the nut member 42 and supported by the nut member 42 . Here, the plate 41 forms a separation space without being coupled with the nut member 42, and is expandable or movable through the separation space. That is, the plate 41 is not directly coupled to or fixed to the inner wall surface of the nut member 42 and the chamber 10 . The plate 41 is in contact with a part of the inner surface of the nut member 42 and forms a separation space without contact with the other part. Here, "the inner surface of the nut member 42" means the inner surface of the groove formed on the side of the nut member 42.

For example, as shown in FIG. 6 , the plate 41 may contact a portion of the inner surface of the nut member 42 parallel to the plate 41 among the inner surfaces of the nut member 42 . Specifically, the plate 41 may contact a portion of the upper surface of the first portion 42a exposed through a groove formed on a side surface of the nut member 42 . In addition, the plate 41 is formed on the remaining part of the upper surface of the first portion 42a exposed through the groove formed on the side surface of the nut member 42, the side surface of the concave-convex portion cv and the side surface of the nut member 42. A separation space may be formed without contact with the lower surface of the second portion 42b exposed through the groove. The plate 41 may expand or move through the separation space, and the separation space may absorb changes in the plate 41 according to changes in conditions within the chamber 10 . Through this, even if the plate 41 contracts or expands in response to a change in conditions inside the chamber 10, it is possible to prevent the plate 41 from changing in shape, such as twisting the plate 41.

7 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention. FIG. 7 may correspond to a cross-sectional view of the thin film deposition apparatus in which portion A2 of FIG. 2 is enlarged. Also, portion A2 may correspond to a portion of the inner wall surface on the right side of the chamber.

As shown in FIG. 7 , the coupling plate 40 may be disposed to cover the right inner wall surface of the chamber 10 of the thin film deposition apparatus 1 (see FIG. 2 ).

The nut member 42 of the coupling plate 40 may be coupled and fixed to the right inner wall surface of the chamber 10 through the bolt member 50 . Specifically, the nut member 42 includes a fastening hole penetrating the center of the nut member 42, and the bolt member 50 penetrates the fastening hole of the nut member 42 and is coupled to the nut member 42. . In addition, the end of the bolt member 50 may be coupled to the right inner wall surface of the chamber 10 while filling a fastening groove formed on the right inner wall surface of the chamber 10 .

The plate 41 of the coupling plate 40 is disposed to cover the right inner wall surface of the chamber 10 . At least a portion of the plate 41 may be inserted into a groove formed on a side surface of the nut member 42 and supported by the nut member 42 . Here, the plate 41 forms a separation space without being coupled with the nut member 42, and is movable through the separation space. That is, the plate 41 is not directly coupled to or fixed to the inner wall surface of the nut member 42 and the chamber 10 . The plate 41 is in contact with a part of the inner surface of the nut member 42 and forms a separation space without contact with the other part. Here, "the inner surface of the nut member 42" means the inner surface of the groove formed on the side of the nut member 42.

For example, as shown in FIG. 7 , the plate 41 may contact a portion of the inner surface of the nut member 42 perpendicular to the plate 41 among the inner surfaces of the nut member 42 . Specifically, the plate 41 may contact a portion of the side surface of the concave-convex portion cv of the nut member 42 . In addition, the plate 41 is exposed through the remaining part of the side surface of the concave-convex portion cv and the groove formed on the side surface of the nut member 42, the upper surface of the first part 42a and the lower surface of the second part 42b and A separation space can be formed without contact. The plate 41 can move through the separation space, and the separation space absorbs the change of the plate 41 according to the change in conditions inside the chamber 10, thereby preventing the plate 41 from changing its shape, such as twisting. can do.

Meanwhile, although FIG. 7 shows and describes the coupling plate 40 disposed to cover the right inner wall surface of the chamber 10, the coupling plate 40 disposed to cover the left inner wall surface of the chamber 10 also The same can be applied.

That is, the nut member 42 of the coupling plate 40 may be coupled and fixed to the left inner wall surface of the chamber 10 through the bolt member 50 . Specifically, the nut member 42 includes a fastening hole penetrating the center of the nut member 42, and the bolt member 50 penetrates the fastening hole of the nut member 42 and is coupled to the nut member 42. . In addition, an end of the bolt member 50 may be coupled to the left inner wall surface of the chamber 10 while filling a fastening groove formed on the left inner wall surface of the chamber 10 .

The plate 41 of the coupling plate 40 is disposed to cover the left inner wall surface of the chamber 10 . At least a portion of the plate 41 may be inserted into a groove formed on a side surface of the nut member 42 and supported by the nut member 42 . Here, the plate 41 forms a separation space without being coupled with the nut member 42, and is movable through the separation space. That is, the plate 41 is not directly coupled to or fixed to the inner wall surface of the nut member 42 and the chamber 10 . The plate 41 is in contact with a part of the inner surface of the nut member 42 and forms a separation space without contact with the other part.

The plate 41 may contact a portion of the inner surface of the nut member 42 perpendicular to the plate 41 among the inner surfaces of the nut member 42 . Specifically, the plate 41 may contact a portion of the side surface of the concave-convex portion cv of the nut member 42 . In addition, the plate 41 is exposed through the remaining part of the side surface of the concave-convex portion cv and the groove formed on the side surface of the nut member 42, the upper surface of the first part 42a and the lower surface of the second part 42b and A separation space can be formed without contact.

8 is a schematic cross-sectional view of a part of a thin film deposition apparatus according to an embodiment of the present invention. FIG. 8 may correspond to a cross-sectional view of the thin film deposition apparatus in which portion A3 of FIG. 2 is enlarged. Also, portion A3 may correspond to a portion of an upper inner wall surface of the chamber.

As shown in FIG. 8 , the bonding plate 40 may be disposed to cover the upper inner wall surface of the chamber 10 of the thin film deposition apparatus 1 (see FIG. 2 ).

The nut member 42 of the coupling plate 40 may be coupled and fixed to the upper inner wall surface of the chamber 10 through the bolt member 50 . Specifically, the nut member 42 includes a fastening hole penetrating the center of the nut member 42, and the bolt member 50 penetrates the fastening hole of the nut member 42 and is coupled to the nut member 42. . Also, an end of the bolt member 50 may be coupled to the upper inner wall surface of the chamber 10 while filling a fastening groove formed on the upper inner wall surface of the chamber 10 .

The plate 41 of the coupling plate 40 is disposed to cover the upper inner wall surface of the chamber 10 . At least a portion of the plate 41 may be inserted into a groove formed on a side surface of the nut member 42 and supported by the nut member 42 . Here, the plate 41 forms a separation space without being coupled with the nut member 42, and is movable through the separation space. That is, the plate 41 is not directly coupled to or fixed to the inner wall surface of the nut member 42 and the chamber 10 . The plate 41 is in contact with a part of the inner surface of the nut member 42 and forms a separation space without contact with the other part. Here, "the inner surface of the nut member 42" means the inner surface of the groove formed on the side of the nut member 42.

For example, as shown in FIG. 8 , the plate 41 may contact a portion of the inner surface of the nut member 42 parallel to the plate 41 among the inner surfaces of the nut member 42 . Specifically, the plate 41 may contact a portion of the upper surface of the first portion 42a exposed through a groove formed on a side surface of the nut member 42 . In addition, the plate 41 is formed on the remaining part of the upper surface of the first portion 42a exposed through the groove formed on the side surface of the nut member 42, the side surface of the concave-convex portion cv and the side surface of the nut member 42. A separation space may be formed without contact with the lower surface of the second portion 42b exposed through the groove. The plate 41 can move through the separation space, and the separation space absorbs the change of the plate 41 according to the change in conditions inside the chamber 10, thereby preventing the plate 41 from changing its shape, such as twisting. can do.

The contents described above with reference to FIGS. 6 to 8 may be simultaneously applied, but are not limited thereto, and only some of them may be selectively applied.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1: thin film deposition device
10: chamber
20: holder
30: deposition source
40: plate for bonding
41: plate
41h: opening
42: nut member
42a: first part
42b: second part
50: bolt member

Claims (20)

a plate having at least one opening; and
a nut member penetrating the plate through the at least one opening and forming a separation space with the plate;
to provide,
The nut member,
A coupling plate comprising a first portion having a concave-convex portion protruding in a thickness direction of the plate and passing through the at least one opening, and a second portion coupled to an end of the concave-convex portion. According to claim 1,
The nut member is movable through the separation space, plate for coupling. According to claim 2,
The nut member is movable in the thickness direction of the plate and in a radial direction intersecting the thickness direction, plate for coupling. According to claim 1,
In a cross-sectional view, a thickness of the concave-convex portion protruding in the thickness direction is thicker than the thickness of the plate, a plate for coupling. According to claim 1,
In a plan view, a diameter of the concavo-convex portion is smaller than a diameter of the at least one opening. According to claim 5,
In a plan view, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion are larger than a diameter of the at least one opening. According to claim 6,
In a plan view, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion are larger than a diameter of the concavo-convex portion. According to claim 1,
The nut member includes a fastening hole penetrating the center of the nut member, plate for coupling. chamber;
an evaporation source disposed inside the chamber;
a holder disposed inside the chamber facing the evaporation source; and
a coupling plate disposed inside the chamber to cover at least one inner wall surface of the chamber;
to provide,
The bonding plate,
a plate having at least one opening; and
A nut member passing through the plate through the at least one opening, forming a separation space with the plate, and supporting the plate;
The nut member includes a first portion having a concave-convex portion protruding in a thickness direction of the plate and passing through the at least one opening, and a second portion coupled to an end of the concave-convex portion. According to claim 9,
The nut member is coupled to the bolt member and fixed to the at least one inner wall surface, thin film deposition apparatus. According to claim 10,
The plate is not coupled to the nut member, and can expand through the separation space, thin film deposition apparatus. According to claim 10,
The nut member includes a fastening hole penetrating the center of the nut member,
The chamber includes a fastening groove formed on the at least one inner wall surface, thin film deposition apparatus. According to claim 12,
The bolt member is disposed to fill the fastening hole and the fastening groove, thin film deposition apparatus. According to claim 9,
In a cross-sectional view, the protruding thickness of the uneven portion in the thickness direction is thicker than the thickness of the plate. According to claim 9,
In a plan view, a diameter of the concavo-convex portion is smaller than a diameter of the at least one opening. According to claim 9,
In a plan view, a diameter of a lower surface of the first portion and a diameter of an upper surface of the second portion are larger than a diameter of the at least one opening. According to claim 9,
In a plan view, the diameter of the lower surface of the first part and the diameter of the upper surface of the second part are larger than the diameter of the concavo-convex portion. According to claim 9,
The at least one inner wall surface includes at least one of a lower inner wall surface of the chamber, an upper inner wall surface of the chamber, a left inner wall surface of the chamber, and a right inner wall surface of the chamber. According to claim 18,
The plate covering the lower inner wall surface and the plate covering the upper inner wall surface are in contact with a portion of the inner surface of the nut member parallel to the plate. According to claim 19,
The plate covering the left inner wall surface and the plate covering the right inner wall surface are in contact with a portion of the inner surface of the nut member perpendicular to the plate.

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