KR20140086846A - 기판 세정 장치 및 기판 세정 방법 - Google Patents

기판 세정 장치 및 기판 세정 방법 Download PDF

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Publication number
KR20140086846A
KR20140086846A KR1020130159803A KR20130159803A KR20140086846A KR 20140086846 A KR20140086846 A KR 20140086846A KR 1020130159803 A KR1020130159803 A KR 1020130159803A KR 20130159803 A KR20130159803 A KR 20130159803A KR 20140086846 A KR20140086846 A KR 20140086846A
Authority
KR
South Korea
Prior art keywords
substrate
cleaning
fluid
holding mechanism
fluid nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020130159803A
Other languages
English (en)
Korean (ko)
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20140086846A publication Critical patent/KR20140086846A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
KR1020130159803A 2012-12-28 2013-12-20 기판 세정 장치 및 기판 세정 방법 Withdrawn KR20140086846A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012287121A JP2014130883A (ja) 2012-12-28 2012-12-28 基板洗浄装置及び基板洗浄方法
JPJP-P-2012-287121 2012-12-28

Publications (1)

Publication Number Publication Date
KR20140086846A true KR20140086846A (ko) 2014-07-08

Family

ID=51015749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130159803A Withdrawn KR20140086846A (ko) 2012-12-28 2013-12-20 기판 세정 장치 및 기판 세정 방법

Country Status (4)

Country Link
US (1) US20140182632A1 (https=)
JP (1) JP2014130883A (https=)
KR (1) KR20140086846A (https=)
TW (1) TWI610359B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377153B (zh) * 2014-11-18 2018-07-17 通富微电子股份有限公司 一种圆片清洗机及其喷嘴移动方法、圆片移动方法
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법
CN105826224B (zh) * 2016-05-11 2019-05-21 中国电子科技集团公司第四十五研究所 一种用于半导体晶圆的清洁腔
JP7355618B2 (ja) * 2018-12-04 2023-10-03 株式会社ディスコ ウエーハ分割装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5778554A (en) * 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
WO1999016109A1 (en) * 1997-09-24 1999-04-01 Interuniversitair Micro-Elektronica Centrum Vereniging Zonder Winstbejag Method and apparatus for removing a liquid from a surface
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
KR100523635B1 (ko) * 2003-02-04 2005-10-25 동부아남반도체 주식회사 웨이퍼 표면의 슬러리 제거 장치 및 그 방법
US7837804B2 (en) * 2004-04-23 2010-11-23 Tokyo Electron Limited Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
KR100940136B1 (ko) * 2006-08-29 2010-02-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 기판처리장치
JP5686647B2 (ja) * 2011-03-28 2015-03-18 株式会社東芝 基板保持装置、基板洗浄装置および基板処理装置

Also Published As

Publication number Publication date
JP2014130883A (ja) 2014-07-10
TW201428842A (zh) 2014-07-16
US20140182632A1 (en) 2014-07-03
TWI610359B (zh) 2018-01-01

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000