JP2014130883A - 基板洗浄装置及び基板洗浄方法 - Google Patents

基板洗浄装置及び基板洗浄方法 Download PDF

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Publication number
JP2014130883A
JP2014130883A JP2012287121A JP2012287121A JP2014130883A JP 2014130883 A JP2014130883 A JP 2014130883A JP 2012287121 A JP2012287121 A JP 2012287121A JP 2012287121 A JP2012287121 A JP 2012287121A JP 2014130883 A JP2014130883 A JP 2014130883A
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JP
Japan
Prior art keywords
substrate
cleaning
fluid nozzle
holding mechanism
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012287121A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014130883A5 (https=
Inventor
Tomoatsu Ishibashi
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012287121A priority Critical patent/JP2014130883A/ja
Priority to KR1020130159803A priority patent/KR20140086846A/ko
Priority to TW102147709A priority patent/TWI610359B/zh
Priority to US14/139,626 priority patent/US20140182632A1/en
Publication of JP2014130883A publication Critical patent/JP2014130883A/ja
Publication of JP2014130883A5 publication Critical patent/JP2014130883A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP2012287121A 2012-12-28 2012-12-28 基板洗浄装置及び基板洗浄方法 Pending JP2014130883A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012287121A JP2014130883A (ja) 2012-12-28 2012-12-28 基板洗浄装置及び基板洗浄方法
KR1020130159803A KR20140086846A (ko) 2012-12-28 2013-12-20 기판 세정 장치 및 기판 세정 방법
TW102147709A TWI610359B (zh) 2012-12-28 2013-12-23 基板洗淨裝置及基板洗淨方法
US14/139,626 US20140182632A1 (en) 2012-12-28 2013-12-23 Substrate cleaning apparatus and substrate cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287121A JP2014130883A (ja) 2012-12-28 2012-12-28 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
JP2014130883A true JP2014130883A (ja) 2014-07-10
JP2014130883A5 JP2014130883A5 (https=) 2015-08-27

Family

ID=51015749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012287121A Pending JP2014130883A (ja) 2012-12-28 2012-12-28 基板洗浄装置及び基板洗浄方法

Country Status (4)

Country Link
US (1) US20140182632A1 (https=)
JP (1) JP2014130883A (https=)
KR (1) KR20140086846A (https=)
TW (1) TWI610359B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018501665A (ja) * 2015-07-13 2018-01-18 ゼウス カンパニー リミテッド 基板液処理装置及び方法
JP2021015998A (ja) * 2018-12-04 2021-02-12 株式会社ディスコ ウエーハ洗浄装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377153B (zh) * 2014-11-18 2018-07-17 通富微电子股份有限公司 一种圆片清洗机及其喷嘴移动方法、圆片移动方法
CN105826224B (zh) * 2016-05-11 2019-05-21 中国电子科技集团公司第四十五研究所 一种用于半导体晶圆的清洁腔

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506061A (ja) * 1997-09-24 2001-05-08 アンテルユニヴェルシテール・ミクロ―エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ 表面から液体を除去する方法及び装置
JP2003517201A (ja) * 1999-12-17 2003-05-20 ナトゥール・インコーポレイテッド 処理チャンバ、収納チャンバ、処理装置、並びに、処理方法。
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2012204759A (ja) * 2011-03-28 2012-10-22 Toshiba Corp 基板保持装置、基板洗浄装置および基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5778554A (en) * 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
KR100523635B1 (ko) * 2003-02-04 2005-10-25 동부아남반도체 주식회사 웨이퍼 표면의 슬러리 제거 장치 및 그 방법
US7837804B2 (en) * 2004-04-23 2010-11-23 Tokyo Electron Limited Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
KR100940136B1 (ko) * 2006-08-29 2010-02-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 기판처리장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506061A (ja) * 1997-09-24 2001-05-08 アンテルユニヴェルシテール・ミクロ―エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ 表面から液体を除去する方法及び装置
JP2003517201A (ja) * 1999-12-17 2003-05-20 ナトゥール・インコーポレイテッド 処理チャンバ、収納チャンバ、処理装置、並びに、処理方法。
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2012204759A (ja) * 2011-03-28 2012-10-22 Toshiba Corp 基板保持装置、基板洗浄装置および基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018501665A (ja) * 2015-07-13 2018-01-18 ゼウス カンパニー リミテッド 基板液処理装置及び方法
JP2021015998A (ja) * 2018-12-04 2021-02-12 株式会社ディスコ ウエーハ洗浄装置
JP7092847B2 (ja) 2018-12-04 2022-06-28 株式会社ディスコ ウエーハ洗浄装置

Also Published As

Publication number Publication date
KR20140086846A (ko) 2014-07-08
TW201428842A (zh) 2014-07-16
US20140182632A1 (en) 2014-07-03
TWI610359B (zh) 2018-01-01

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