KR20140054628A - Manufacture method of printed circuit board - Google Patents

Abstract

The present invention relates to a method for manufacturing a printed circuit board and, more particularly, to a method for manufacturing a printed circuit board capable of forming a fine circuit. The present invention includes the steps of: providing a base substrate which includes copper foils laminated on both sides thereof (S1); laminating a photosensitive film on one side of the base substrate and exposing and developing the photosensitive film (S2); adding a penetration prevention plating layer on the exposed part (S3); forming a via hole on the base substrate with the penetration prevention plating layer (S4); forming a first plating layer on both sides of the base substrate including the inside of the via hole (S5); patterning the photosensitive film by laminating and exposing the photosensitive film on the first plating layer (S6); and forming a second plating layer on the first plating layer (S7).

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a printed circuit board,

The present invention relates to a method of manufacturing a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board capable of forming a fine circuit.

Printed Circuit Board (PCB) is used to electrically connect components mounted through a circuit pattern formed on an insulating material such as a phenol resin insulating plate or an epoxy resin insulating plate, supply the power supply, and mechanically fix the components A printed circuit board has a single-sided PCB on which a circuit layer is formed on only one side of an insulating substrate, a double-sided PCB on which circuit layers are formed on both sides, and an MLB (Multi Layered Board) .

As a method of forming a circuit pattern on such a printed circuit board, there are a Subtractive method, an additive method, a Semi-additive method and a Modified semi-additive method ) Method, whereby a circuit pattern can be formed on one surface and both surfaces of the insulating material.

However, as the semiconductor substrate becomes a microcircuit, the microcircuit can no longer be formed by the subtractive process. Therefore, there is an increasing tendency to use SAP techniques to implement microcircuits.

Generally, a process for manufacturing a printed circuit board by a SAP method includes providing an insulating material having a copper foil on one surface, forming a via hole exposing the copper foil, and then forming a seed layer on one surface of the insulating material and an inner wall of the via hole. Thereafter, an electrolytic plating process is performed to form a plating layer, and patterning is performed to form a wiring pattern.

However, in the process of forming the via hole on the substrate, when the copper thin film is too thin when the laser drill is used, there is a problem that the copper under the via hole to be processed is damaged and the via hole penetrates.

Accordingly, in recent years, a copper thin film of about 5 탆 or more has been used to compensate for the above problems.

However, when the copper thin film is entirely stacked on the base substrate at a thickness of 5 μm or more, the copper thin film becomes thick, and the seed layer to be removed in the etching process for forming a circuit becomes thick, making it difficult to form a microcircuit.

Patent Document 1: Korean Patent Publication No. 2008-0101762

SUMMARY OF THE INVENTION The present invention has been conceived in view of the above problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a copper thin film is thickened only in a region where holes are formed, The present invention also provides a method of manufacturing a printed circuit board capable of realizing a fine circuit.

Another object of the present invention is to provide a method of manufacturing a printed circuit board which can reduce the manufacturing cost due to the lamination of a copper thin film which is thinner than the thickness of a typical copper thin film laminated on the surface of a base substrate.

In order to achieve the above object, the present invention provides a method of manufacturing a semiconductor device, comprising: (S1) providing a base substrate on which copper foils are stacked on both sides; (S2) of laminating a photosensitive film on one surface of the base substrate and exposing and developing the photosensitive film; (S3) of adding a penetration-resistant plating layer to the exposed portion; (S4) forming a via hole in the base substrate on which the penetration preventing plating layer is formed; (S5) forming a first plating layer on both sides of the base substrate including the inside of the via hole; Laminating a photosensitive film on the first plating layer, exposing and patterning (S6); And forming a second plating layer on the first plating layer (S7); .

After the step S2, a step of laminating a photosensitive film on the plating layer and masking the laminated photosensitive film may be further performed.

At this time, the step of removing the masking after the exposure of the photosensitive film is performed after the progress of the masking may be further performed.

After the step S3, a step of removing the photosensitive film from the plating layer and forming a via hole in the base substrate may be further performed.

After the step S5, the photosensitive film is laminated on the first plating layer, and the masking and exposure are successively performed on the photosensitive film, followed by removing the masking.

As a final step, after the step S7, a step of etching and removing a residue existing between the second plating layer and the first plating layer may be further performed.

The second plating layer in the portion where the penetration preventing plating layer is formed may have an area larger than that of the second plating layer formed on the opposite surface with respect to the base substrate.

In the method of manufacturing a printed circuit board according to an embodiment of the present invention, a copper thin film is thickened only in a region where a hole is formed in a hole process by a laser, and a copper thin film in a region where a circuit is to be formed is relatively By forming the thin film, it is possible to realize a uniform thin film layer as well as a simplification of a working process, thereby providing an effect of realizing a microcircuit.

In addition, the use of copper deposited on the base substrate can be greatly reduced, and the manufacturing cost can be greatly reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1M illustrate a process example of a method of manufacturing a printed circuit board according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1A to 1M are views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

As shown in the figure, a method of manufacturing a printed circuit board according to an embodiment of the present invention includes a plating layer 12 in which copper copper foil is laminated on both sides of a base substrate 10. The plating layer 12 is laminated to a thickness of 3 탆 or less to form a fine circuit.

DPR (dry photo resist) coating, that is, the photosensitive film 14 is laminated on the plating layer 12 of the base substrate. After the photosensitive film 14 is laminated, the photosensitive film 14 is exposed.

At this time, when the photosensitive film 14 is exposed, the masking 16 is laminated on the photosensitive film 14 except for the exposed portion. In other words, the masking 16 is laminated on the remaining photosensitive film 14 except for the exposed portion.

After the completion of the stacking of the masking 16, exposure is performed to a portion where the masking 16 is not laminated, thereby removing a part of the photosensitive film 14. After the exposure is completed, the masking 16 is removed from the photosensitive film 14, .

Next, the photosensitive film 14 is removed from the plating layer 12 on which the exposure development has progressed in the photosensitive film 14, and the penetration preventing plating layer 18 made of copper copper is laminated.

The penetration preventing plating layer 18 serves to compensate the strength and heat resistance of the plating layer 12 so that the base substrate 10 is not completely penetrated in the process of forming the via hole 20 in the base substrate 10.

In other words, in the process of forming the via hole 20 in the base substrate 10, a laser drill which can not melt the plated layer 12 through the insulating layer (not shown) of the base substrate is usually used. However, in the process of laser drilling the insulating layer of the base substrate 10, relatively high temperature heat is generated. In the case where the plating layer of the base substrate is laminated to 3 m or less, the thickness of the plating layer 12 is So that the via hole 20 can be completely penetrated.

Therefore, the penetration preventing plating layer 18 can increase the strength and heat resistance of the plating layer 12, and even if the via hole 20 is processed through the laser, it can be laminated to a thickness of about 2 탆 so that the via hole 20 is not penetrated by heat have.

When the total thickness of the plating layer 12 and the penetration preventing plating layer 18 is about 5 占 퐉, the via hole 20 is not completely penetrated even if the via hole 20 is processed through the laser.

At this time, when the thickness of the plating layer 12 and the penetration preventing plating layer 18 are 4 μm or less, which is significantly smaller than 5 μm, the via hole 20 may be penetrated by a heat source generated during the roughing process It is preferable that the total thickness of these layers is kept within about 5 탆.

The cross section after the penetration preventing plating layer 18 is laminated on one surface of the plating layer 12 has a stepped portion where the layered portion of the penetration preventing plating layer 18 protrudes from the periphery of the via hole 20.

After the penetration preventing plating layer 18 is laminated, the first plating layer 22 is laminated on both sides of the base substrate including the inside of the via hole 20.

The first plating layer 22 may be made of copper, which is the same metallic material as the plating layer 12 and the penetration preventing plating layer 18 laminated on the base substrate 10.

After the first plating layer 22 is laminated, the photosensitive film 24 may be laminated on the first plating layer 22. Further, the photosensitive film 24 may be patterned by removing the masking 25 after the masking 25 and exposure are sequentially performed.

Next, a second plating layer 26 is laminated on the first plating layer 22. At this time, since the first plating layer 22 is laminated on both sides of the base substrate 10, the second plating layer 26 can be laminated on both sides of the first plating layer 22 simultaneously.

After the second plating layer 26 is laminated, the photosensitive film 24 may be removed using NaOH or an amine-based chemical, and an unnecessary portion of the first plating layer 22 may be removed through etching.

After the unnecessary portions of the photosensitive film 24 and the first plating layer 22 are removed, a part of the first plating layer 22 may remain as a residue. These residues are removed by etching.

Therefore, the through-hole prevention plating layer 18 and the plating layer 12 ensure sufficient strength and heat resistance in the process of forming the via hole 20 in the base substrate 10, thereby significantly reducing the defective rate due to the processing of the via hole 20 .

In addition, since the plating layer 12 and the penetration preventing plating layer 18 are formed only at the position where the via hole 20 is processed, the use of copper can be minimized and the manufacturing cost can be reduced.

Although the method of manufacturing a printed circuit board according to an embodiment of the present invention has been described above, the present invention is not limited thereto.

10: base substrate 12: plated layer
14,24: Photosensitive film 16,25: Masking
18: penetration preventing plating layer 20: via hole
22: first plating layer 26: second plating layer

Claims (7)

(S1) providing a base substrate on which copper foils are stacked on both sides;
(S2) of laminating a photosensitive film on one surface of the base substrate and exposing and developing the photosensitive film;
(S3) of adding a penetration-resistant plating layer to the exposed portion;
(S4) forming a via hole in the base substrate on which the penetration preventing plating layer is formed;
(S5) forming a first plating layer on both sides of the base substrate including the inside of the via hole;
Laminating a photosensitive film on the first plating layer, exposing and patterning (S6); And
Forming a second plating layer on the first plating layer (S7); And a step of forming the printed circuit board. The method according to claim 1,
Wherein the step (S2) further includes the step of laminating a photosensitive film on the plating layer and masking the laminated photosensitive film. 3. The method of claim 2,
Further comprising the step of removing the masking after the exposure of the photosensitive film is performed after the masking has progressed. The method according to claim 1,
After the step S3, removing the photosensitive film from the plating layer and forming a via hole in the base substrate. The method according to claim 1,
And after the step S5, a photosensitive film is laminated on the first plating layer, and the masking and exposure are sequentially performed on the photosensitive film, followed by removing the masking. The method according to claim 1,
And after the step S7, etching and removing the residue existing between the second plating layer and the first plating layer is further performed. The method according to claim 1,
Wherein the second plating layer of the portion where the penetration preventing plating layer is formed has an area larger than a second plating layer formed on the opposite surface with respect to the base substrate.

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