KR20140047574A - Resin composition - Google Patents

Abstract

The present invention provides an epoxy resin composition which is excellent in low temperature fast curing property, has a low Tg (glass transition point) of the cured product, and hardly changes the Tg of the cured product even after a long time after curing. The resin composition of this invention contains the epoxy resin which does not contain the (A) benzene ring, the thiol compound which has two or more thiol groups in the (B) molecule, and (C) latent hardening | curing agent. It is preferable that the said (B) component is mix | blended in the ratio of 1.0-2.0 by thiol equivalent ratio with respect to the epoxy equivalent of the said (A) component.

Description

Resin composition {RESIN COMPOSITION}

The present invention relates to an epoxy resin composition which is excellent in low temperature fast curing property, has a low Tg (glass transition point) of the cured product, and hardly changes the Tg of the cured product even after a long time of curing.

The resin composition containing an epoxy resin, a thiol compound, and a hardening accelerator is a resin composition excellent in the low temperature quick-curability which can be cured in a short time even at 0 degreeC --20 degreeC, and is used for various uses, such as an adhesive agent and the sealing agent of an electronic component. As examples of such a resin composition, Patent Documents 1 and 2 include (1) an epoxy resin having two or more epoxy groups in a molecule, (2) a polythiol compound having two or more thiol groups in a molecule, and (3) a solid dispersion type A resin composition containing a latent curing accelerator is disclosed. Patent Literature 3 discloses an epoxy resin composition containing a bisphenol A type epoxy resin having a flexible skeleton and a polar bonding group, and a polythiol having two or more thiol groups.

Japanese Patent Publication No. 6-211969 Japanese Patent Laid-Open No. 6-211970 Japanese Patent Laid-Open No. 2006-36935

However, in the case where two parts having different thermal expansion coefficients are joined to each other with an adhesive, thermal stress may act on the joints depending on the change in the ambient temperature, thereby causing cracks or the like. For this reason, the adhesive for joining these components requires flexibility that can follow the thermal deformation of the component, and the one having a low Tg (glass transition point) after the adhesive has cured, that is, having a low elastic modulus Required.

However, the epoxy resin compositions described in Patent Documents 1 and 2 described above had problems of not being able to sufficiently lower Tg, although excellent low temperature curability and storage stability were obtained. Moreover, although the epoxy resin composition of the said patent document 3 can harden | cure at low temperature, and since hardened | cured material has some flexibility and flexibility, it can absorb stress, but as time passes, hardening of hardened | cured material further There was a problem that the flexibility and flexibility gradually disappeared.

This invention is made | formed in view of the above-mentioned problem, The epoxy resin composition which is excellent in low temperature quick-curing property, has a low Tg (glass transition point) of hardened | cured material, and hardly changes the Tg of hardened | cured material even after long time after hardening. The purpose is to provide.

MEANS TO SOLVE THE PROBLEM The present inventors conducted various experiments in order to solve the said subject, and, as a result, the resin composition containing the epoxy resin which does not contain a benzene ring, the thiol compound which has two or more thiol groups in a molecule | numerator, and a latent hardening | curing agent has low temperature fast hardening property. It was found that the Tg of the cured product was excellent, the Tg of the cured product was low, and the cured product hardly changed even after a long time after curing.

This invention is a resin composition containing the epoxy resin (A) which does not contain a benzene ring, the thiol compound which has two or more thiol groups in the molecule | numerator (B), and (C) latent hardening | curing agent.

In the resin composition of this invention, it is preferable that the said (A) component is a compound represented by the following formula (1).

In the resin composition of this invention, it is preferable that the said (A) component is a compound represented by the following formula (2).

Moreover, in the resin composition of this invention, it is preferable that the said (A) component is a compound represented by the following formula (3).

In the resin composition of this invention, it is preferable that the said (A) component is a compound represented by the following formula (4).

In the resin composition of this invention, it is preferable that the said (B) component is mix | blended in the ratio of 1.0-2.0 by thiol equivalent ratio with respect to the epoxy equivalent of the said (A) component.

In the resin composition of the present invention, the component (B) is tetraethylene glycol bis3-mercaptopropionate, trimethylolpropane tris3-mercaptopropionate, pentaerythritol tetrakis3-mercaptopropionate And at least one selected from dipentaerythritol tetrakis 3-mercaptopropionate.

It is preferable that the resin composition of this invention contains at least 1 additive further chosen from the group which consists of a silica filler, a silane coupling agent, an ion trap agent, a leveling agent, antioxidant, an antifoamer, and a thixotropic agent. Do.

Moreover, this invention provides the electronic component sealed by the sealing agent containing any one of said resin compositions.

Moreover, this invention provides the adhesive agent containing any one of said resin compositions.

According to the present invention, it is possible to provide an epoxy resin composition which is excellent in low temperature fast curing property, has a low Tg (glass transition point) of a cured product, and hardly changes in Tg even after a long time after curing.

EMBODIMENT OF THE INVENTION Hereinafter, the specific content for implementing this invention is demonstrated in detail.

The resin composition which concerns on embodiment of this invention contains the epoxy resin which does not contain the (A) benzene ring, the thiol compound which has two or more thiol groups in the (B) molecule, and (C) latent hardening | curing agent.

It is preferable that the epoxy resin of the said (A) component is a compound represented by following formula (1), for example.

It is preferable that the compound represented by the said General formula (1) is a compound represented by following formula (2) and / or formula (3), for example.

In addition, it is preferable that the compound represented by the said General formula (1) is a compound represented, for example by the following formula (4).

In addition, in following formula (4), it is preferable that R <_2> -R <_5> is a methyl group.

The thiol compound of the said (B) component should just have two or more thiol groups per molecule. In terms of storage stability, it is desirable that the content of basic impurities be as small as possible. Examples of such thiol compounds include trimethylolpropanetris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, trimethylolpropanetris (β-thiopropionate), pentaerythrate Polyols such as lititol tetrakis (β-thiopropionate), dipentaerythritol poly (β-thiopropionate), tris-[(3-mercaptopropionyloxy) -ethyl] -isocyanurate And thiol compounds obtained by esterification of mercapto organic acids.

Likewise as examples of thiol compounds, 1,4-butanedithiol, 1,5-pentanedithiol, 1,6-hexanedithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,10 Alkyl polythiol compounds such as decandithiol; Terminal thiol group-containing polyethers; Terminal thiol group-containing polythioether; Thiol compounds obtained by the reaction of an epoxy compound with hydrogen sulfide; Thiol compound which has a terminal thiol group obtained by reaction of a polythiol compound and an epoxy compound; And the like. In using a basic substance as a reaction catalyst in the manufacturing process, the thiol compound which has two or more thiol groups in the molecule which carried out the alkali removal process and made alkali metal ion concentration 50 ppm or less is preferable.

The latent curing agent of the component (C) is a compound which is solubilized by heating with a solid insoluble in an epoxy resin at room temperature to function as a curing accelerator, and is a solid imidazole compound or a solid dispersion-type amine adduct type latent at room temperature. A curing accelerator, for example, a reaction product of an amine compound with an epoxy compound (amine-epoxy duct type), a reaction product of an amine compound with an isocyanate compound or an urea compound (urea type duct type), and the like.

As an imidazole compound which is solid at normal temperature used for this invention, 2-heptadecyl imidazole, 2-phenyl-4, 5- dihydroxy methyl imidazole, 2- undecyl imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6- (2-methylimidazolyl -(1))-ethyl-S-triazine, 2,4-diamino-6- (2'-methylimidazolyl- (1) ')-ethyl-S-triazine-isocyanuric acid adduct , 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimida Sol-trimelitate, 1-cyanoethyl-2-phenylimidazole-trimelitate, N- (2-methylimidazolyl-1-ethyl) -urea, N, N '-(2-methyldi Midazolyl- (1) -ethyl) -adifoyldiamide, etc. are mentioned, but it is not limited to this.

As an epoxy compound used as one of the manufacturing raw materials of the solid dispersion type | mold amine adduct type latent hardening accelerator (amine-epoxy adduct type) used for this invention, it is bisphenol A, bisphenol F, catechol, resor, for example. Polyglycidyl ethers obtained by reacting a polyhydric phenol such as lecinol or a polyhydric alcohol such as glycerin or polyethylene glycol with epichlorohydrin; glycidyl ether esters obtained by reacting hydroxycarboxylic acids such as p-hydroxybenzoic acid and β-hydroxynaphthoic acid with epichlorohydrin; Polyglycidyl esters obtained by reacting polycarboxylic acids such as phthalic acid and terephthalic acid with epichlorohydrin; Glycidylamine compounds obtained by reacting 4,4'-diaminodiphenylmethane, m-aminophenol and epichlorohydrin; Moreover, polyfunctional epoxy compounds, such as epoxidized phenol novolak resin, epoxidized cresol novolak resin, and epoxidized polyolefin, monofunctional epoxy compounds, such as butyl glycidyl ether, phenyl glycidyl ether, and glycidyl methacrylate; Although these etc. are mentioned, it is not limited to this.

The amine compound used as a raw material for the production of the other of the above-mentioned solid dispersion type amine adduct-based latent curing accelerators used in the present invention has at least one active hydrogen capable of reacting with addition of an epoxy group in a molecule, a primary amino group, What is necessary is just to have at least 1 functional group selected from a secondary amino group and a tertiary amino group in a molecule | numerator. Although the example of such an amine compound is shown below, it is not limited to this. That is, for example, aliphatic amines such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane; Aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; Heterocyclic compounds containing nitrogen atoms such as 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, and piperazine; And the like.

Moreover, especially the compound which has tertiary amino group in a molecule | numerator is a raw material which provides the latent hardening accelerator which has the outstanding hardening accelerating ability, As an example of such a compound, For example, dimethylaminopropylamine, diethylaminopropylamine Amine compounds such as di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, and N-methylpiperazine, 2-methylimidazole and 2-ethylimida Primary or secondary amines having a tertiary amino group in a molecule such as an imidazole compound such as sol, 2-ethyl-4-methylimidazole, 2-phenylimidazole, etc .; 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1- ( 2-hydroxy-3-phenoxypropyl) -2-methylimidazole, 1- (2-hydroxy-3-phenoxypropyl) -2-ethyl-4-methylimidazole, 1- (2- Hydroxy-3-butoxypropyl) -2-methylimidazole, 1- (2-hydroxy-3-butoxypropyl) -2-ethyl-4-methylimidazole, 1- (2-hydroxy -3-phenoxypropyl) -2-phenylimidazoline, 1- (2-hydroxy-3-butoxypropyl) -2-methylimidazoline, 2- (dimethylaminomethyl) phenol, 2,4, 6-tris (dimethylaminomethyl) phenol, N-β-hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzoimidazole, 2-mercaptobenzoimidazole, 2-mer Captobenzothiazole, 4-mercaptopyridine, N, N-dimethylaminobenzoic acid, N, N-dimethylglycine, nicotinic acid, isnicotinic acid, picolinic acid, N, N- Methyl-glycine hydrazide, N, N- dimethyl propionic acid hydrazide, nicotinic acid hydrazide, isonicotinic acid hydrazide Drew if alcohols, phenols, thiols, carboxylic acids, and Hydra having a tertiary amino group in the molecule such as; And the like.

In order to further improve the storage stability of the epoxy resin composition of the present invention, when the latent curing accelerator used in the present invention is prepared by addition reaction of the epoxy compound and the amine compound, active hydrogen is added to the molecule as a third component. It is also possible to add an active hydrogen compound having two or more. Although the example of such an active hydrogen compound is shown below, it is not limited to this. Namely, for example, polyhydric phenols such as bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol, phenol novolak resin, polyhydric alcohols such as trimethylolpropane, adipic acid, phthalic acid, and the like. Polyhydric carboxylic acids, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercaptoacetic acid, anthranilic acid, lactic acid and the like.

As an isocyanate compound used as an additional raw material for producing the solid dispersion type amine adduct latent curing accelerator used in the present invention, for example, n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate, etc. Functional isocyanate compounds; Hexamethylene diisocyanate, toluylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylenedi isocyanate, 1,3,6 Polyfunctional isocyanate compounds such as hexamethylene triisocyanate and bicycloheptane triisocyanate; Moreover, the terminal isocyanate group containing compound obtained by reaction of these polyfunctional isocyanate compounds and an active hydrogen compound; Can also be used. Examples of such a terminal isocyanate group-containing compound include an addition compound having a terminal isocyanate group obtained by the reaction of toluylene diisocyanate and trimethylolpropane, and an addition having a terminal isocyanate group obtained by the reaction of toluylene diisocyanate and pentaerythritol. Although a compound etc. are mentioned, It is not limited to this.

Moreover, although urea, thiourea, etc. are mentioned as a urea compound, it is not limited to these, for example.

The solid dispersion type latent curing accelerator used in the present invention may be, for example, two components of the above-mentioned (a) amine compound and epoxy compound, (b) three components of these two components and active hydrogen compound, or (c) amine Each component is employed in a combination of two or three components of a compound, an isocyanate compound and / or a urea compound, mixed, reacted at a temperature of 200 ° C. from room temperature, and then cooled and solidified, or pulverized, or methyl ethyl ketone or dioxane. It is easily obtained by pulverizing solid content after making it react by desolvating in solvents, such as and tetrahydrofuran.

Although the typical example marketed as said solid dispersion type latent hardening accelerator is shown below, it is not limited to this. That is, for example, "Amicure PN-23" (Ajino Moto Co., Ltd.), "Amicure PN-40" (Ajino Moto Co., Ltd.) ), "Hardner X-3661S" (ECR Co., Ltd. brand name), "Hardner X-3670S" (ECR Co., Ltd. brand name), "Novacure HX-3742" (Asahi Kasei Co., Ltd. product name), "Novacure HX -3721 "(Asahi Kasei Co., Ltd. brand name) etc. are mentioned, As an element type adduct system," Ajicure FXE-1000 "(Fuji Kasei Co., Ltd. brand name)," Ajicure FXR-1030 "(Fuji Kasei ( Note) etc. can be mentioned.

In order to manufacture the resin composition of this invention using the (A)-(C) component demonstrated above as a raw material, there is no difficulty in particular, According to a conventionally well-known method. For example, the resin composition of this invention can be manufactured by mixing by mixers, such as a Henschel mixer.

In addition, there is no particular difficulty in curing the resin composition of the present invention, and a conventionally known method can be used. For example, the resin composition of this invention can be hardened by heating at 50-120 degreeC.

The resin composition of this invention contains the said (A)-(C) component, It is characterized by the above-mentioned. Thereby, the resin composition which is excellent in low temperature fast hardenability and low in Tg (glass transition point) of hardened | cured material can be obtained. Moreover, even if it passes for a long time after a resin composition hardens | cures by heating and it becomes hardened | cured material, the resin composition which Tg hardly changes the hardened | cured material can be obtained.

The reason why such a resin composition is obtained is considered to be because it does not contain the benzene ring in the molecule | numerator of the epoxy resin of the said (A) component. Or it is considered that the epoxy equivalent of the compound represented by the said General formula (2) and (3) originates in comparatively high thing. Or it is considered that it originates in the presence of a silicone skeleton in the molecule | numerator of the compound represented by the said General formula (4).

In the resin composition of this invention, it is preferable that the said (B) component is mix | blended in the ratio of 1.0-2.0 (1.0 or more and 2.0 or less) by thiol equivalent ratio with respect to the epoxy equivalent of the said (A) component. The "epoxy equivalent" here means the numerical value which divided the molecular weight of an epoxy resin by the number of epoxy groups in 1 molecule. The "thiol equivalent weight" means the numerical value which divided the molecular weight of a thiol compound by the number of thiol groups in 1 molecule. That is, with respect to the epoxy equivalent of the said (A) component, when (B) component is 1.0-2.0 by thiol equivalent ratio, it means that the number of thiol groups is 1.0-2.0 with respect to the number of epoxy groups.

By setting the compounding ratio of the said (A) component and the said (B) component in such a range, even if it passes for a long time after hardening a resin composition and it becomes a hardened | cured material, the resin composition which hardly changes Tg of the hardened | cured material can be obtained. have. The reason why such a resin composition is obtained is considered to be that the thiol equivalent ratio of the component (B) to the epoxy equivalent of the component (A) is set in an appropriate range. That is, when the thiol equivalent ratio of the said (B) component with respect to the epoxy equivalent of the said (A) component is smaller than 1.0, since a part of epoxy groups remain without reacting with a thiol group, this remaining epoxy group causes and hardening of hardened | cured material I think it goes further. On the other hand, when the thiol equivalent ratio of the said (B) component with respect to the epoxy equivalent of the said (A) component is larger than 2.0, since a part of thiol group will remain without reacting with an epoxy group, this remaining thiol group will be the cause and hardened | cured hardened | cured material I think that is going further.

The resin composition of the present invention may further contain at least one additive selected from the group consisting of a silica filler, a silane coupling agent, an ion trapping agent, a leveling agent, an antioxidant, an antifoaming agent, and a thixotropic agent as necessary. Moreover, a viscosity modifier, a flame retardant, a solvent, etc. can also be contained.

The resin composition of this invention can be used as an adhesive agent or its raw material for joining parts.

The resin composition of this invention can be used as a sealing agent of an electronic component, or its raw material.

The elasticity modulus of the adhesive agent using the resin composition of this invention becomes like this. Preferably it is 0.01-1.5 GPa, More preferably, it is 0.4-0.8 GPa.

When the elastic modulus is smaller than 0.01 GPa, the cured portion of the adhesive becomes brittle. If the modulus of elasticity is larger than 1.5 GPa, there is a fear that cracks occur in the cured product due to the shrinkage stress of the adhesive.

Moreover, Tg of the adhesive agent using the resin composition of this invention becomes like this. Preferably it is -20-55 degreeC, More preferably, it is -30-38 degreeC.

When Tg is larger than -20 degreeC, there exists a possibility that a crack may generate | occur | produce in the hardened part of an adhesive agent. In addition, a crack may generate | occur | produce in a to-be-adhered body by adhesive strength with a to-be-adhered body. When Tg is smaller than -55 degreeC, a hardened part will become brittle.

[Example]

Hereinafter, although the Example of this invention is described, this invention is not limited to this.

(Preparation of resin composition)

Each component was mixed by the combination shown in the following Tables 1 and 2, and the resin composition concerning Examples 1-20 was manufactured.

Each component was mixed by the formulation shown in the following Table 3, and the resin composition concerning Comparative Examples 1-4 was manufactured.

In addition, in Tables 1-3, the number which shows the compounding ratio of (A)-(F) component has shown all the weight part.

Specific substance names, etc. of each component in Tables 1-3 are as follows.

(A1) Epoxy resin 1: Shinnitetsu Chemical Co., Ltd. "YDF8170", bisphenol F-type epoxy resin, weight average molecular weight 165

(A2) Epoxy resin 2: "YL7410" (the epoxy resin of the said Formula (2)) by Japan Epoxy Resin Co., Ltd., weight average molecular weight 435

(A3) Epoxy resin 3: "PP300P" (the epoxy resin of the said Formula (3)) by Sanyo Kasei Kogyo Co., Ltd., weight average molecular weight 181.3

(A4) Epoxy resin 4: "TSL9906" by Momentive Performance Materials, Inc. (epoxy resin wherein R ₂ to R ₅ are methyl groups in the formula (4)), weight average molecular weight 296

(B1) Thiol compound 1: SC Organic Chemical Co., Ltd. "PEMP" pentaerythritol tetrakis (3-mercaptopropionate), weight average molecular weight 489

(B2) Thiol compound 2: SC Organic Chemicals Co., Ltd. "TMMP" trimethylol propane tris (3-mercaptopropionate), weight average molecular weight 398

(B3) Thiol compound 3: SC DPK "DPMP", dipentaerythritol hexakis (3-mercaptopropionate), the weight average molecular weight 783

(C) Latent hardener: "PN40J" by Ajinomoto Fine Techno Co., Epoxy resin amine adduct

(D) Stabilizer: Shikoku Kasei Kogyo Co., Ltd. "L07N", bisphenol A type epoxy resin / phenol resin / boric acid ester

(E) Thixotropic agent: "R805" manufactured by Nippon Aerosil Co., Ltd., fumed silica

(F) Coupling agent: "KBM403" by Shin-Etsu Chemical Co., Ltd., 3-glycidoxy propyl trimethoxysilane

(Production of light cargo)

Each resin composition of Examples 1-20 and Comparative Examples 1-4 was heated for 10 minutes on 80 degreeC conditions. As a result, about Examples 1-20 and Comparative Example 1, the hardened | cured material which the resin composition hardened | cured. About Comparative Examples 2-4, hardened | cured material was not obtained because the resin composition did not harden.

(Measurement of Tg and Modulus)

About the hardened | cured material obtained by hardening | curing a resin composition, the elasticity modulus [GPa] after leaving for 48 hours at 120 degreeC temperature conditions after hardening | curing, at the temperature conditions of 120 degreeC after glass transition point Tg [degreeC] and hardening After leaving for 48 hours, the glass transition point Tg [° C.] and the adhesive strength [N / mm ² ] were measured. The measurement results are shown in Tables 1-3.

About the elasticity modulus, the elasticity modulus in -40 degreeC was measured using Seiko Instruments Co., Ltd. make, dynamic thermomechanical measurement (DMA) according to Japanese Industrial Standard JIS C6481.

About Tg, it measured using Seiko Instruments Co., Ltd. product and dynamic thermomechanical measurement (DMA) according to Japanese Industrial Standard JIS C6481.

About adhesive strength, it measured using the following test methods.

(1) The sample is engraved on a glass epoxy substrate with a size of 2 mmφ.

(2) Place a 2 mm x 2 mm Si chip on the printed sample. This was cured at 180 ° C. for 60 minutes using a blow dryer.

(3) Shear strength is measured by a table universal testing machine (1605HTP manufactured by Aiko Engineering Co., Ltd.).

Assessment Methods

When the change of Tg after leaving hardened | cured material at 120 degreeC for 48 hours was within +/- 5 degreeC, the change of Tg was evaluated as "none".

When the change in elastic modulus after leaving hardened | cured material for 48 hours at 120 degreeC was within +/- 0.1 GPa, the change in elastic modulus was evaluated as "none."

As can be seen from the results of Examples 1 to 20, it was found that all of the resin compositions of the present invention can be cured in a short time even under heating conditions of 80 ° C., and excellent in low temperature fast curing properties. On the other hand, the resin composition concerning a comparative example shows that the thiol equivalent ratio with respect to an epoxy equivalent is too small as 0.5, as can be seen when looking at the result of Comparative Examples 2-4, and it does not fully harden | cure at 80 degreeC heating conditions. Could.

As can be seen from the results of Examples 1 to 20, in the resin composition of the present invention, it was found that the cured product having a small elastic modulus was obtained at an elastic modulus of 0.1 to 0.8 [Gpa] at -40 ° C of the cured product. . On the other hand, as for the resin composition which concerns on the comparative example, as seen from the result of the comparative example 1, the elasticity modulus in -40 degreeC is 4.0 [GPa], and the hardened | cured material with small elasticity modulus was not obtained.

As can be seen from the results of Examples 1 to 20, it was found that the resin composition of the present invention had a Tg of -50 ° C to -30 ° C and a low Tg of the cured product. On the other hand, as for the resin composition which concerns on the comparative example, when seeing the result of the comparative example 1, Tg was 40 degreeC and the hardened | cured material with low Tg was not obtained.

As can be seen from the results of Examples 1 to 17, even after leaving the resin composition of the present invention for 48 hours at 120 ° C. after curing, the modulus and Tg of the cured product were hardly changed. Thereby, the resin composition of this invention was able to demonstrate that Tg hardly changes even if it passes for a long time after hardening.

Claims (10)

The resin composition containing the following (A)-(C) component.
(A) Epoxy resin not containing benzene ring
(B) Thiol compound having two or more thiol groups in the molecule
(C) latent curing agents Resin composition whose said (A) component is a compound represented by following General formula (1).

The resin composition of Claim 2 whose said (A) component is a compound represented by following General formula (2).

The resin composition of Claim 2 whose said (A) component is a compound represented by following General formula (3).

The resin composition of Claim 1 whose said (A) component is a compound represented by following General formula (4).

The resin composition according to any one of claims 1 to 5, wherein the component (B) is blended in a ratio of 1.0 to 2.0 in a thiol equivalent ratio to the epoxy equivalent of the component (A). The said (B) component is a tetraethylene glycol bis 3- mercapto propionate, a trimethylol propane tris 3- mercapto propionate, and a pentaerythritol tetrakis3, The said (B) component of any one of Claims 1-6. A resin composition which is at least one selected from mercaptopropionate and dipentaerythritol tetrakis 3-mercaptopropionate. The method according to any one of claims 1 to 7, further comprising at least one additive selected from the group consisting of silica filler, silane coupling agent, ion trapping agent, leveling agent, antioxidant, antifoaming agent and thixotropic agent. Resin composition. The electronic component sealed with the sealing agent containing the resin composition of any one of Claims 1-8. The adhesive agent containing the resin composition of any one of Claims 1-8.