WO2012093510A1

WO2012093510A1 - Resin composition

Info

Publication number: WO2012093510A1
Application number: PCT/JP2011/070917
Authority: WO
Inventors: 一希岩谷; 洋平細野; 留香横山
Original assignee: ナミックス株式会社
Priority date: 2011-01-05
Filing date: 2011-09-14
Publication date: 2012-07-12
Also published as: TWI629291B; KR101819785B1; TW201229080A; CN103282401A; KR20140047574A

Abstract

Provided is an epoxy resin composition which has superior low-temperature rapid curability, in which the Tg (glass transition point) of the cured material is low, and in which the Tg of the cured material substantially does not change even when a long period of time has elapsed after curing. This resin composition comprises (A) an epoxy resin that does not contain benzene rings, (B) a thiol compound having at least two thiol groups in the molecule, and (C) a latent curing agent. Preferably, the (B) component is admixed in a ratio of 1.0 to 2.0 in terms of the thiol equivalent ratio, relative to the epoxy equivalent of the (A) component.

Description

Resin composition

The present invention relates to an epoxy resin composition that is excellent in low-temperature rapid curing properties, has a low Tg (glass transition point) of the cured product, and does not change the Tg of the cured product almost even after a long time after curing.

A resin composition comprising an epoxy resin, a thiol compound, and a curing accelerator is a resin composition excellent in low-temperature fast-curing property that can be cured in a short time even from 0 ° C. to −20 ° C., and is used for sealing adhesives and electronic components. It is used for various applications such as agents. As examples of such a resin composition, Patent Documents 1 and 2 include (1) an epoxy resin having two or more epoxy groups in the molecule, (2) a polythiol compound having two or more thiol groups in the molecule, And (3) a resin composition containing a solid dispersion type latent curing accelerator is disclosed. Patent Document 3 discloses an epoxy resin composition containing a bisphenol A type epoxy resin having a flexible skeleton and a polar bonding group and a polythiol having two or more thiol groups.

JP-A-6-211969 Japanese Patent Laid-Open No. 6-21970 JP 2006-36935 A

By the way, when two parts having different thermal expansion coefficients are joined to each other with an adhesive, thermal stress may act on the joint due to a change in ambient temperature, which may cause cracks or the like. For this reason, the adhesive for joining these parts needs to be flexible enough to follow the thermal deformation of the parts, and has a low Tg (glass transition point) after the adhesive is cured. The elastic modulus is required to be low.

However, the epoxy resin compositions described in Patent Documents 1 and 2 described above have a problem that Tg cannot be sufficiently lowered although excellent low-temperature curability and storage stability can be obtained. Moreover, although the epoxy resin composition described in the above-mentioned patent document 3 can be cured at a low temperature and the cured product has a certain degree of flexibility and flexibility, it can absorb stress. However, there is a problem that as the time passes, the cured product is further cured and the flexibility and flexibility are gradually lost.

The present invention has been made in view of the above-described problems, and is excellent in low-temperature rapid curability, has a low Tg (glass transition point) of the cured product, and is cured even after a long time after curing. An object of the present invention is to provide an epoxy resin composition in which the Tg of the resin hardly changes.

As a result of conducting various experiments to solve the above problems, the present inventors contain an epoxy resin that does not contain a benzene ring, a thiol compound having two or more thiol groups in the molecule, and a latent curing agent. It has been found that the resin composition to be cured is excellent in low-temperature rapid curability, the Tg of the cured product is low, and the Tg of the cured product hardly changes even after a long time after curing.

The present invention is a resin composition containing (A) an epoxy resin not containing a benzene ring, (B) a thiol compound having two or more thiol groups in the molecule, and (C) a latent curing agent.

In the resin composition of the present invention, the component (A) is preferably a compound represented by the following formula (1).

In the resin composition of the present invention, the component (A) is preferably a compound represented by the following formula (2).

In the resin composition of the present invention, the component (A) is preferably a compound represented by the following formula (3).

In the resin composition of the present invention, the component (A) is preferably a compound represented by the following formula (4).

In the resin composition of the present invention, the component (B) is preferably blended at a thiol equivalent ratio of 1.0 to 2.0 with respect to the epoxy equivalent of the component (A).

In the resin composition of the present invention, the component (B) is tetraethylene glycol bis3-mercaptopropionate, trimethylolpropane tris3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and di Pentaerythritol is preferably at least one selected from tetrakis 3-mercaptopropionate.

The resin composition of the present invention further includes at least one additive selected from the group consisting of a silica filler, a silane coupling agent, an ion trapping agent, a leveling agent, an antioxidant, an antifoaming agent, and a tampering agent. It is preferable to contain.

Moreover, this invention provides the electronic component sealed with the sealing agent containing either of the said resin compositions.
The present invention also provides an adhesive containing any one of the above resin compositions.

According to the present invention, it is possible to provide an epoxy resin composition that is excellent in low-temperature rapid curability, has a low Tg (glass transition point) of a cured product, and has a Tg that hardly changes even after a long time after curing. .

Hereinafter, embodiments for carrying out the present invention will be described in detail.
A resin composition according to an embodiment of the present invention includes (A) an epoxy resin not containing a benzene ring, (B) a thiol compound having two or more thiol groups in the molecule, and (C) a latent curing agent. contains.

The epoxy resin as the component (A) is preferably a compound represented by the following formula (1), for example.

The compound represented by the above formula (1) is preferably, for example, a compound represented by the following formula (2) and / or formula (3).

Moreover, it is preferable that the compound represented by the said Formula (1) is a compound represented, for example by the following formula | equation (4).
In the following formula (4), R ₂ to R ₅ are preferably methyl groups.

The thiol compound as the component (B) may be any compound having two or more thiol groups per molecule. From the viewpoint of storage stability, those having as little basic impurity content as possible are preferred. Examples of such thiol compounds include trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, trimethylolpropane tris (β-thiopropionate), pentaerythritol tetrakis. By esterification reaction of a polyol such as (β-thiopropionate), dipentaerythritol poly (β-thiopropionate), tris-[(3-mercaptopropionyloxy) -ethyl] -isocyanurate and mercapto organic acid Examples include thiol compounds obtained.

Similarly, as examples of thiol compounds, 1,4-butanedithiol, 1,5-pentanedithiol, 1,6-hexanedithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,10-decanedithiol Alkyl thiol compounds such as: terminal thiol group-containing polyethers; terminal thiol group-containing polythioethers; thiol compounds obtained by reaction of epoxy compounds with hydrogen sulfide; terminal thiol groups obtained by reaction of polythiol compounds with epoxy compounds Thiol compounds; and the like. In the case of using a basic substance as a reaction catalyst in the production process, a thiol compound having two or more thiol groups in a molecule that has been subjected to dealkalization treatment and has an alkali metal ion concentration of 50 ppm or less is preferable.

The latent curing agent of the component (C) is a compound that is insoluble in an epoxy resin at room temperature, is a compound that is solubilized by heating and functions as a curing accelerator, and is an imidazole compound that is solid at room temperature or a solid dispersion type Amine adduct-based latent curing accelerators such as reaction products of amine compounds and epoxy compounds (amine-epoxy adduct systems), reaction products of amine compounds with isocyanate compounds or urea compounds (urea-type adduct systems), etc. Can be mentioned.

Examples of imidazole compounds that are solid at room temperature used in the present invention include, for example, 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl-5- Hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6- (2-methylimidazolyl- (1))-ethyl-S-triazine, 2,4-diamino-6 -(2'-methylimidazolyl- (1) ')-ethyl-S-triazine isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2 -Phenylimidazole, 1-cyanoethyl-2-methylimidazole Trimellitate, 1-cyanoethyl-2-phenylimidazole-trimellitate, N- (2-methylimidazolyl-1-ethyl) -urea, N, N '-(2-methylimidazolyl- (1) -ethyl) -adiboyldiamide, etc. However, it is not limited to these.

Examples of the epoxy compound used as a raw material for producing the solid dispersion type amine adduct type latent curing accelerator (amine-epoxy adduct type) used in the present invention include, for example, bisphenol A, bisphenol F, catechol, resorcinol and the like. Polyglycidyl ethers obtained by reacting polyhydric alcohols such as monohydric phenols or glycerin or polyethylene glycol with epichlorohydrin; hydroxycarboxylic acids such as p-hydroxybenzoic acid and β-hydroxynaphthoic acid and epichloro Glycidyl ether ester obtained by reacting with hydrin; polyglycidyl ester obtained by reacting polycarboxylic acid such as phthalic acid and terephthalic acid with epichlorohydrin; 4,4'-diaminodiphenylmethane and m- Ami Glycidylamine compounds obtained by reacting phenol and epichlorohydrin; and polyfunctional epoxy compounds such as epoxidized phenol novolak resin, epoxidized cresol novolak resin, epoxidized polyolefin, butyl glycidyl ether, phenyl glycidyl ether Monofunctional epoxy compounds such as glycidyl methacrylate; and the like, but are not limited thereto.

The amine compound used as another raw material for producing the solid dispersion type amine adduct-based latent curing accelerator used in the present invention has at least one active hydrogen capable of addition reaction with an epoxy group in the molecule. What is necessary is just to have at least one functional group selected from a secondary amino group, secondary amino group and tertiary amino group in the molecule. Examples of such amine compounds are shown below, but are not limited thereto. That is, for example, aliphatic amines such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane; 4,4'-diaminodiphenylmethane , Aromatic amine compounds such as 2-methylaniline; heterocyclic rings containing nitrogen atoms such as 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, piperazine Compound; and the like.

Among them, a compound having a tertiary amino group in the molecule is a raw material that provides a latent curing accelerator having excellent curing acceleration ability. Examples of such a compound include dimethylaminopropyl. Amine compounds such as amine, diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, N-methylpiperazine, 2-methylimidazole, 2-ethylimidazole, 2-ethyl Primary or secondary amines having a tertiary amino group in the molecule, such as imidazole compounds such as -4-methylimidazole and 2-phenylimidazole; 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol , 1-phenoxime 2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1- (2-hydroxy-3-phenoxypropyl) -2-methylimidazole, 1- (2-hydroxy-3 -Phenoxypropyl) -2-ethyl-4-methylimidazole, 1- (2-hydroxy-3-butoxypropyl) -2-methylimidazole, 1- (2-hydroxy-3-butoxypropyl) -2-ethyl-4 -Methylimidazole, 1- (2-hydroxy-3-phenoxypropyl) -2-phenylimidazoline, 1- (2-hydroxy-3-butoxypropyl) -2-methylimidazoline, 2- (dimethylaminomethyl) phenol, 2 , 4,6-Tris (dimethylaminomethyl) phenol, N-β -Hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 4-mercaptopyridine, N, N-dimethylaminobenzoic acid, N, N-dimethylglycine, nicotinic acid, isonicotinic acid, picolinic acid, N, N-dimethylglycine hydrazide, N, N-dimethylpropionic hydrazide, nicotinic hydrazide, isonicotinic hydrazide, etc. And alcohols having amino groups, phenols, thiols, carboxylic acids and hydrazides.

In order to further improve the storage stability of the epoxy resin composition of the present invention, when the latent curing accelerator used in the present invention is produced by addition reaction of the above epoxy compound and amine compound, It is also possible to add an active hydrogen compound having two or more active hydrogens. Examples of such active hydrogen compounds are shown below, but are not limited thereto. That is, for example, polyphenols such as bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol, phenol novolac resin, polyhydric alcohols such as trimethylolpropane, polyhydric alcohols such as adipic acid and phthalic acid. Examples thereof include carboxylic acids, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercaptoacetic acid, anthranilic acid, and lactic acid.

Examples of the isocyanate compound used as another production raw material of the solid dispersion type amine adduct-based latent curing accelerator used in the present invention include, for example, n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate and the like. Functional isocyanate compounds; hexamethylene diisocyanate, toluylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, Polyfunctional isocyanate compounds such as bicycloheptane triisocyanate; and further, these polyfunctional isocyanate compounds and active water Obtained by reaction of a compound, terminal isocyanate group-containing compound; and the like can also be used. Examples of such terminal isocyanate group-containing compounds include addition compounds having terminal isocyanate groups obtained by reaction of toluylene diisocyanate and trimethylolpropane, and terminal isocyanate groups obtained by reaction of toluylene diisocyanate and pentaerythritol. However, the present invention is not limited thereto.

Further, examples of the urea compound include urea and thiourea, but are not limited thereto.

The solid dispersion type latent curing accelerator used in the present invention includes, for example, (a) two components of an amine compound and an epoxy compound, (b) three components of the two components and an active hydrogen compound, or (c) an amine. A combination of two or three components of a compound and an isocyanate compound or / and a urea compound is mixed and reacted at a temperature of room temperature to 200 ° C. and then cooled and solidified and then ground, or methyl ethyl ketone, It can be easily obtained by reacting in a solvent such as dioxane or tetrahydrofuran, removing the solvent, and grinding the solid.

Representative examples commercially available as the above solid dispersion type latent curing accelerator are shown below, but are not limited thereto. That is, for example, as the amine-epoxy adduct system (amine adduct system), “Amicure PN-23” (Ajinomoto Co., Ltd. trade name), “Amicure PN-40” (Ajinomoto Co., Ltd. trade name), “Hardener X” -3661S "(trade name of ARC Corporation)," Hardener X-3670S "(tradename of ARC Corporation)," Novacure HX-3742 "(tradename of Asahi Kasei Corporation), “Novacure HX-3721” (trade name of Asahi Kasei Co., Ltd.) and the like, and examples of urea-type adducts include “Fujicure FXE-1000” (trade name of Fuji Kasei Co., Ltd.) and “Fujicure FXR-1030”. (Fuji Kasei Co., Ltd.).

There is no particular difficulty in preparing the resin composition of the present invention using the components (A) to (C) described above as raw materials, and conventional methods can be applied. For example, the resin composition of the present invention can be prepared by mixing with a mixer such as a Henschel mixer.

Also, there is no particular difficulty in curing the resin composition of the present invention, and a conventionally known method can be used. For example, the resin composition of the present invention can be cured by heating at 50 to 120 ° C.

The resin composition of the present invention is characterized by containing the components (A) to (C). Thereby, the resin composition which is excellent in low temperature rapid curability and has low Tg (glass transition point) of hardened | cured material can be obtained. Moreover, even if it passes for a long time after the resin composition hardens | cures by heating and turns into hardened | cured material, the resin composition in which Tg of the hardened | cured material hardly changes can be obtained.

It is considered that the reason why such a resin composition is obtained is that the benzene ring is not contained in the molecule of the epoxy resin as the component (A). Or it is thought that it originates in the epoxy equivalent of the compound represented by the said Formula (2) and (3) being comparatively high. Alternatively, it is considered that the silicon skeleton is present in the molecule of the compound represented by the above formula (4).

In the resin composition of the present invention, the component (B) is 1.0 to 2.0 (1.0 to 2.0) in terms of the thiol equivalent ratio with respect to the epoxy equivalent of the component (A). It is preferable that it is blended. Here, “epoxy equivalent” is a numerical value obtained by dividing the molecular weight of the epoxy resin by the number of epoxy groups in one molecule. The “thiol equivalent” is a numerical value obtained by dividing the molecular weight of the thiol compound by the number of thiol groups in one molecule. That is, the component (B) has a thiol equivalent ratio of 1.0 to 2.0 with respect to the epoxy equivalent of the component (A) because the number of epoxy groups is 1 and the number of thiol groups is 1. It means 0.0-2.0.

By setting the blending ratio of the component (A) and the component (B) within such a range, even if a long time elapses after the resin composition is cured to become a cured product, A resin composition in which Tg hardly changes can be obtained. The reason why such a resin composition is obtained is considered to be that the ratio of the thiol equivalent of the component (B) to the epoxy equivalent of the component (A) is set in an appropriate range. That is, when the thiol equivalent ratio of the component (B) to the epoxy equivalent of the component (A) is smaller than 1.0, a part of the epoxy group remains without reacting with the thiol group. It is considered that the curing of the cured product further proceeds due to the remaining epoxy group. On the other hand, when the thiol equivalent ratio of the component (B) to the epoxy equivalent of the component (A) is larger than 2.0, a part of the thiol group remains without reacting with the epoxy group, It is thought that the curing of the cured product further proceeds due to the surplus thiol group.

The resin composition of the present invention is further selected from the group consisting of a silica filler, a silane coupling agent, an ion trapping agent, a leveling agent, an antioxidant, an antifoaming agent, and a tampering agent as necessary. It may contain at least one additive. Moreover, you may contain a viscosity modifier, a flame retardant, or a solvent.

The resin composition of the present invention can be used as an adhesive or a raw material for bonding parts together.
The resin composition of the present invention can be used as a sealant for electronic parts or a raw material thereof.

The elastic modulus of the adhesive using the resin composition of the present invention is preferably 0.01 to 1.5 GPa, more preferably 0.4 to 0.8 GPa.
When the elastic modulus is smaller than 0.01 GPa, the cured portion of the adhesive becomes brittle. When the elastic modulus is higher than 1.5 GPa, the cured product may crack in the shrinkage stress of the adhesive.

The Tg of the adhesive using the resin composition of the present invention is preferably −20 to −55 ° C., more preferably −30 to −38 ° C.
If Tg is greater than −20 ° C., cracks may occur in the cured portion of the adhesive. In addition, cracks may occur in the adherend depending on the adhesive strength with the adherend. When Tg is smaller than −55 ° C., the cured part becomes brittle.

Hereinafter, examples of the present invention will be described, but the present invention is not limited thereto.

(Preparation of resin composition)
Resin compositions according to Examples 1 to 20 were prepared by mixing the components shown in Tables 1 and 2 below.
The components shown in Table 3 below were mixed to prepare resin compositions according to Comparative Examples 1 to 4.
In Tables 1 to 3, the numbers indicating the blending ratio of the components (A) to (F) all indicate parts by weight.

Specific substance names and the like of each component in Tables 1 to 3 are as follows.
(A1) Epoxy resin 1: “YDF8170” manufactured by Nippon Steel Chemical Co., Ltd., bisphenol F type epoxy resin, weight average molecular weight 165
(A2) Epoxy resin 2: “YL7410” (epoxy resin of the above formula (2)) manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 435
(A3) Epoxy resin 3: “PP300P” (epoxy resin of the above formula (3)) manufactured by Sanyo Chemical Industries, Ltd., weight average molecular weight 181.3
(A4) Epoxy resin 4: “TSL9906” manufactured by Momentive Performance Materials (an epoxy resin in which R ₂ to R ₅ are methyl groups in the above formula (4)), weight average molecular weight 296
(B1) Thiol compound 1: “PEMP” pentaerythritol tetrakis (3-mercaptopropionate) manufactured by SC Organic Chemical Co., Ltd., weight average molecular weight 489
(B2) Thiol compound 2: “TMMP” trimethylolpropane tris (3-mercaptopropionate) manufactured by SC Organic Chemical Co., Ltd., weight average molecular weight 398
(B3) Thiol compound 3: “DPMP” manufactured by SC Organic Chemical Co., Ltd., dipentaerythritol hexakis (3-mercaptopropionate), weight average molecular weight 783
(C) Latent curing agent: “PN40J” manufactured by Ajinomoto Fine-Techno Co., Ltd., epoxy resin amine adduct (D) Stabilizer: “L07N” manufactured by Shikoku Kasei Kogyo Co., Ltd., bisphenol A type epoxy resin / phenol resin / borate ester ( E) Fading agent: Nippon Aerosil Co., Ltd. “R805”, fumed silica (F) Coupling agent: Shin-Etsu Chemical Co., Ltd. “KBM403”, 3-glycidoxypropyltrimethoxysilane

(Production of cured product)
Each resin composition of Examples 1 to 20 and Comparative Examples 1 to 4 was heated at 80 ° C. for 10 minutes. As a result, for Examples 1 to 20 and Comparative Example 1, cured products obtained by curing the resin compositions were obtained. In Comparative Examples 2 to 4, no cured product was obtained because the resin composition was not cured.

(Measurement of Tg and elastic modulus)
About the cured product obtained by curing the resin composition, the elastic modulus [GPa], the elastic modulus [GPa] after standing for 48 hours at 120 ° C. after curing, the glass transition point Tg [° C.], after curing The glass transition point Tg [° C.] and the adhesive strength [N / mm ² ] after standing at 120 ° C. for 48 hours were measured. The measurement results are shown in Tables 1 to 3.

The elastic modulus was measured at −40 ° C. using dynamic thermomechanical measurement (DMA) manufactured by Seiko Instruments Inc. according to Japanese Industrial Standard JIS C6481.

Tg was measured using a dynamic thermomechanical measurement (DMA) manufactured by Seiko Instruments Inc. according to Japanese Industrial Standard JIS C 6481.

The adhesive strength was measured using the following test method.
(1) A sample is stencil printed on a glass epoxy substrate with a size of 2 mmφ.
(2) Place a 2 mm x 2 mm Si chip on the printed sample. This is cured for 60 minutes at 180 ° C. using a blow dryer.
(3) The shear strength is measured with a desktop universal testing machine (1605HTP manufactured by Aiko Engineering Co., Ltd.).

Evaluation Method If the change in Tg after leaving the cured product for 48 hours at 120 ° C. is within ± 5 ° C., the change in Tg was evaluated as “None”.
If the change in elastic modulus after leaving the cured product at 120 ° C. for 48 hours was within ± 0.1 GPa, the change in elastic modulus was evaluated as “none”.

As can be seen from the results of Examples 1 to 20, it was found that all of the resin compositions of the present invention can be cured in a short time even under a heating condition of 80 ° C., and are excellent in low-temperature rapid curability. On the other hand, as can be seen from the results of Comparative Examples 2 to 4, the resin composition according to the comparative example has a thiol equivalent ratio with respect to the epoxy equivalent of 0.5 which is too small. It was found that it did not cure.

As can be seen from the results of Examples 1 to 20, the resin composition of the present invention has a cured product having a modulus of elasticity at −40 ° C. of 0.1 to 0.8 [Gpa] and a small modulus of elasticity. Was found to be obtained. On the other hand, as can be seen from the results of Comparative Example 1, the resin composition according to Comparative Example has an elastic modulus at −40 ° C. of 4.0 [GPa], and a cured product having a low elastic modulus can be obtained. There wasn't.

As can be seen from the results of Examples 1 to 20, it was found that the resin composition of the present invention had a Tg of −50 ° C. to −30 ° C. and a low Tg of the cured product. On the other hand, as can be seen from the results of Comparative Example 1, the resin composition according to the comparative example had a Tg of 40 ° C., and a cured product having a low Tg was not obtained.

As can be seen from the results of Examples 1 to 17, the resin composition of the present invention showed almost no change in the elastic modulus and Tg of the cured product even after being left at 120 ° C. for 48 hours after curing. From this, the resin composition of the present invention was able to demonstrate that Tg hardly changed even after a long time passed after curing.

Claims

A resin composition containing the following components (A) to (C).
(A) Epoxy resin containing no benzene ring (B) Thiol compound having two or more thiol groups in the molecule (C) Latent curing agent
The resin composition whose said (A) component is a compound represented by following formula (1).
The resin composition according to claim 2, wherein the component (A) is a compound represented by the following formula (2).
The resin composition according to claim 2, wherein the component (A) is a compound represented by the following formula (3).
The resin composition according to claim 1, wherein the component (A) is a compound represented by the following formula (4).
The component (B) is blended at a thiol equivalent ratio of 1.0 to 2.0 with respect to the epoxy equivalent of the component (A). The resin composition as described.
The component (B) is tetraethylene glycol bis 3-mercaptopropionate, trimethylolpropane tris 3-mercaptopropionate, pentaerythritol tetrakis 3-mercaptopropionate, and dipentaerythritol tetrakis 3-mercaptopropionate. The resin composition according to any one of claims 1 to 6, wherein the resin composition is at least one selected from nates.
Furthermore, it contains at least one additive selected from the group consisting of a silica filler, a silane coupling agent, an ion trapping agent, a leveling agent, an antioxidant, an antifoaming agent, and a tampering agent. 8. The resin composition according to any one of items 7.
An electronic component sealed with a sealant containing the resin composition according to any one of claims 1 to 8.
The adhesive agent containing the resin composition of any one of Claims 1-8.