CN113851055B - Display module, preparation method thereof and spliced display device - Google Patents
Display module, preparation method thereof and spliced display device Download PDFInfo
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- CN113851055B CN113851055B CN202111134766.5A CN202111134766A CN113851055B CN 113851055 B CN113851055 B CN 113851055B CN 202111134766 A CN202111134766 A CN 202111134766A CN 113851055 B CN113851055 B CN 113851055B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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Abstract
The disclosure relates to the technical field of display, and discloses a display module, a preparation method thereof and a spliced display device. The display module comprises a PCB and a bracket, wherein the bracket is provided with a central positioning hole, a first positioning hole and a second positioning hole which correspond to the same PCB, and the aperture of the central positioning hole is matched with the diameter of the first magnet; at normal temperature, the side wall of the first positioning hole far away from the central positioning hole and the first magnet positioned in the first positioning hole are provided with first gaps, the first gaps corresponding to the first positioning holes far away from the central positioning hole are larger than the first gaps corresponding to the first positioning holes close to the central positioning hole, and the apertures of the first positioning holes in the column direction are the same; the second locating holes are far away from the side wall of the central locating hole and the first magnet positioned in the second locating holes are provided with second gaps, the second gaps corresponding to the second locating holes far away from the central locating hole are larger than the second gaps corresponding to the second locating holes close to the central locating hole, and the apertures of the second locating holes in the row direction are the same.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a spliced display device.
Background
In the related art, the temperature strain capacity among materials of some glue-filled packaged LED display modules is different, and under the condition of large temperature difference, uneven stress can be caused by different temperature change conditions (such as shrinkage) of different materials, so that the product is deformed.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The disclosure aims to overcome the defects of the prior art and provides a display module, a preparation method thereof and a spliced display device. At least one object of the present disclosure is to solve the problem of product deformation caused by different temperature change conditions of different constituent materials of a display module.
According to one aspect of the present disclosure, there is provided a display module including: the display device comprises a plurality of display substrates, wherein the display substrates are distributed at intervals along the row direction and the column direction, a display device is arranged on a first surface of each display substrate, a plurality of first magnets are arranged on a second surface of each display substrate, and the plurality of first magnets are distributed at intervals along the row direction and the column direction; the bracket is used for fixing the display substrates and comprises a plurality of positioning holes which are arranged corresponding to the first magnets, a second magnet is arranged in each positioning hole, and the second magnet is attracted with the first magnet so that the first magnet is at least partially positioned in the corresponding positioning hole; the plurality of positioning holes corresponding to the same display substrate comprise a central positioning hole, a first positioning hole which is positioned in the same row with the central positioning hole, and a second positioning hole which is positioned in the same column with the central positioning hole, and the central positioning hole is closer to the central position of the bracket relative to other positioning holes;
in the same row of positioning holes, the first positioning holes and the first magnets positioned in the first positioning holes have first gaps along the row direction, the first gaps corresponding to the first positioning holes gradually increase along the direction away from the central positioning holes, and the apertures of the first positioning holes in the column direction are the same;
in the same column of positioning holes, the second positioning holes and the first magnets positioned in the second positioning holes are provided with second gaps along the column direction, the second gaps corresponding to the second positioning holes are gradually increased along the direction away from the central positioning holes, and the apertures of the second positioning holes in the row direction are the same.
According to a second aspect of the present disclosure, there is also provided a method for manufacturing a display module, including: providing a plurality of display substrates, wherein the display substrates are distributed at intervals along the row direction and the column direction, a display device is arranged on a first surface of the display substrate, a plurality of first magnets are arranged on a second surface of the display substrate, and the plurality of first magnets are distributed at intervals along the row direction and the column direction; providing a bracket, wherein a plurality of positioning holes are formed in the bracket, the positioning holes are arranged in one-to-one correspondence with the first magnets, a second magnet is arranged in each positioning hole, and the second magnet is attracted with the first magnet so that the first magnet is at least partially positioned in the corresponding positioning hole; the plurality of positioning holes corresponding to the same display substrate comprise a central positioning hole, a first positioning hole which is positioned in the same row with the central positioning hole, and a second positioning hole which is positioned in the same column with the central positioning hole, and the central positioning hole is closer to the central position of the bracket relative to other positioning holes; in the same row of positioning holes, the first positioning holes and the first magnets positioned in the first positioning holes have first gaps along the row direction, the first gaps corresponding to the first positioning holes gradually increase along the direction away from the central positioning holes, and the apertures of the first positioning holes in the column direction are the same; in the same column of positioning holes, the second positioning holes and the first magnets positioned in the second positioning holes are provided with second gaps along the column direction, the second gaps corresponding to the second positioning holes are gradually increased along the direction away from the central positioning holes, and the apertures of the second positioning holes in the row direction are the same.
According to a third aspect of the present disclosure, there is further provided a tiled display device, including a plurality of display modules according to any embodiment of the present disclosure, and the plurality of display modules are distributed in an array in a row-column direction, display modules adjacent in the row direction are abutted in a column direction, and display modules adjacent in the column direction are abutted in the row direction.
The display module provided by the exemplary embodiment comprises a plurality of PCB boards, wherein the PCB boards are fixed on the bracket through the attraction of the first magnet on the PCB boards and the second magnet on the bracket; the support is provided with positioning holes for accommodating the second magnets, each PCB comprises a central positioning hole, the aperture of each central positioning hole is matched with the diameter of each first magnet, the first gaps between other positioning holes in the same row and the magnets in the same row are gradually increased along the direction away from the central positioning holes, the column direction apertures of the positioning holes in the same row are kept the same, the second gaps between other positioning holes in the same row and the magnets in the same row are gradually increased along the direction away from the central positioning holes, and the row direction apertures of the positioning holes in the same row are kept the same. Like this, the locating hole can exert the constraint power to the PCB board of deformation, force the PCB board to carry out orderly deformation, the PCB board that is listed as the orientation and offset promptly is forced to carry out deformation along the row direction because of the constraint of locating hole in the row direction, the PCB board that the row direction offset can be forced to carry out deformation along the row direction because of the constraint of locating hole in the row direction, when temperature resumes normal, the PCB board that produces deformation also can orderly resume to original position under the reverse constraint force effect of locating hole, from this, the product deformation problem that the unable recovery of display module assembly after warping leads to among the prior art is solved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.
Fig. 1 is a schematic structural view of a tiled display device according to an embodiment of the present disclosure;
FIG. 2 is a top view of one of the display modules of FIG. 1;
FIG. 3 is a partial cross-sectional view of the left half of the display module of FIG. 2 taken along the direction AA;
fig. 4 is a partial cross-sectional view of the upper half of the display module of fig. 2 taken along the BB direction;
fig. 5 is a schematic structural view of a PCB board provided with a stiffener according to an embodiment of the present disclosure;
fig. 6 is a schematic structural view of two reinforcing ribs disposed on a PCB board according to another embodiment of the present disclosure;
fig. 7 is another schematic structural view of a PCB board provided with two reinforcing ribs according to still another embodiment of the present disclosure;
fig. 8 is a graph showing shrinkage of a protective layer and a PCB board of a display module according to an embodiment of the present disclosure with temperature;
fig. 9 is a partial enlarged view of the D position of fig. 3.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.
The terms "a," "an," "the," "said" and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and do not limit the number of their objects.
In the related art, a spliced display device is formed by splicing a plurality of LED display modules in an array mode, and overall display with an oversized size can be achieved. Fig. 1 is a schematic structural diagram of a tiled display device, and fig. 1 shows an LED display module by a dashed box indicated by reference numeral 1, where the LED display module is tiled by 4 PCB panels. Therefore, the splice joint of the entire splice display device mainly includes two kinds: one is a seam G1 inside the display module, and the other is a seam G2 between the display modules. In the conventional case, the modules are closely assembled to each other when displayed at normal room temperature, and the joints G1 and G2 are substantially invisible when displayed. However, when large temperature difference fluctuation occurs in the environment, especially under the low temperature condition below-20 ℃, the shrinkage ratio of the PCB taking the epoxy glass fiber as the base material in the display module is larger than that of the protective layer taking the epoxy resin as the base material at the low temperature, wherein the low-temperature linear shrinkage ratio of the PCB, the bracket and the rear shell of the display module is smaller and is below 0.5%, and the shrinkage ratio of the protective layer is larger and is above 5%. Under the conventional condition, the protective layer covered on the PCB becomes a whole with the PCB through vacuum glue filling, but under the low-temperature environment, as the shrinkage rate of the PCB and the protective layer is large, the protective layer is more in shrinkage, and can deform together with the PCB to form a curved surface with four sides concave upwards and inwards, and at the moment, the support loses the original limiting effect. When the temperature is restored to normal temperature, the original size of the PCB and the protective layer are restored, and as the PCB and the protective layer are restored unordered, the flatness after restoration is difficult to be the same as before deformation, so that the display module is obviously uneven at the splicing seams G1 and G2.
To above-mentioned problem, this disclosure improves through a plurality of dimensions to support, PCB board and protective layer to solve the deformation problem of display module assembly under the low temperature. It should be noted that, the first magnet and the second magnet mentioned in the disclosure may be magnetic beads or magnetic adsorbates with other shapes, and the positioning holes may be circular positioning holes, oval positioning holes, square positioning holes, and the like. For simplicity, the disclosure uses only the first magnet and the second magnet as magnetic beads as examples, and the positioning holes are circular positioning holes as examples for illustration. In addition, the display substrate disclosed in the present disclosure may be a PCB board or other types of substrates, and the present disclosure only uses the display substrate as a PCB board as an example to illustrate the improvement of the present disclosure to the display module.
Fig. 2 is a top view of one display module of fig. 1, fig. 3 is a partial cross-sectional view of a left half of the display module of fig. 2 taken along the direction AA, and fig. 4 is a partial cross-sectional view of an upper half of the display module of fig. 2 taken along the direction BB. Referring to fig. 1 to 4, the display module 1 may include a plurality of PCBs 20 and a bracket 10 for fixing the PCBs 20, wherein the PCBs 20 are spaced apart along a row direction and a column direction (the row direction may be an X direction shown in the drawing, the column direction may be a Y direction shown in the drawing), a first surface of the PCBs 20 is provided with a display device 21, a second surface is provided with a plurality of first magnets 22, and the plurality of first magnets 22 are spaced apart along the row direction and the column direction; the bracket 10 comprises a plurality of positioning holes which are arranged corresponding to the first magnet 22, wherein a second magnet 12 is arranged in each positioning hole, and the second magnet 12 is attracted with the first magnet 22 so that the first magnet 22 is at least partially positioned in the corresponding positioning hole; the plurality of positioning holes corresponding to the same PCB 20 comprise a central positioning hole 11, a first positioning hole 13 positioned in the same row with the central positioning hole 11, and a second positioning hole 14 positioned in the same column with the central positioning hole 11, wherein the central positioning hole 11 is closer to the central position 19 of the bracket than other positioning holes, and the aperture of the central positioning hole 11 is matched with the diameter of the first magnet 22; in the same row of positioning holes, the first positioning holes 13 and the first magnets 22 positioned therein have first gaps 15 along the row direction, the first gaps 15 corresponding to each first positioning hole 13 gradually increase along the direction away from the central positioning hole, and the apertures of each first positioning hole 13 in the column direction are the same; in the same column of positioning holes, the second positioning holes 14 and the first magnets 22 positioned therein have second gaps 16 along the column direction, the second gaps 16 corresponding to each second positioning hole 14 gradually increase along the direction away from the central positioning hole, and the apertures of each second positioning hole 14 in the row direction are the same.
The display module provided by the exemplary embodiment comprises a plurality of PCB boards, wherein the PCB boards are fixed on the bracket through the attraction of the first magnet on the PCB boards and the second magnet on the bracket; the support is provided with positioning holes for accommodating the second magnets, each PCB comprises a central positioning hole, the aperture of each central positioning hole is matched with the diameter of each first magnet, the first gaps between other positioning holes in the same row and the magnets in the same row are gradually increased along the direction away from the central positioning holes, the column direction apertures of the positioning holes in the same row are kept the same, the second gaps between other positioning holes in the same row and the magnets in the same row are gradually increased along the direction away from the central positioning holes, and the row direction apertures of the positioning holes in the same row are kept the same. Like this, the locating hole can exert the constraint power to the PCB board of deformation, force the PCB board to carry out orderly deformation, the PCB board that is listed as the orientation and offset promptly is forced to carry out deformation along the row direction because of the constraint of locating hole in the row direction, the PCB board that the row direction offset can be forced to carry out deformation along the row direction because of the constraint of locating hole in the row direction, when temperature resumes normal, the PCB board that produces deformation also can orderly resume to original position under the reverse constraint force effect of locating hole, from this, the product deformation problem that the unable recovery of display module assembly after warping leads to among the prior art is solved.
It will be appreciated that the inner side of each PCB 20 is in contact with the other PCBs 20 within the display module, and the outer side of each PCB 20 is in contact with the PCBs 20 of other display modules than the display module. As shown in fig. 3, in the present exemplary embodiment, the first positioning holes 13 may be distributed on an inner side of the PCB 20 extending in the row direction (X direction), and the second positioning holes 14 may be distributed on an inner side of the PCB 20 extending in the column direction (Y direction). In the same row of positioning holes, the first positioning hole 13 and the first magnet 22 located therein have the first gap 15 in the row direction, it is understood that the side wall of the first positioning hole 13 away from the center positioning hole 11 and the first magnet 22 located therein have the first gap 15, or that the side wall of the first positioning hole 13 away from the center positioning hole 11 and the first magnet 22 located therein, the side wall of the first positioning hole 13 close to the center positioning hole 11 and the first magnet 22 located therein all have the first gap 15 therebetween. Furthermore, it should be appreciated that the sidewall of the first positioning hole 13 adjacent to the central positioning hole 11 may also contact the first magnet 22 located therein (i.e., without the first gap 15). Thus, on the one hand, the first magnet 22 can be guaranteed to be assembled into the first positioning hole 13, and on the other hand, due to the existence of the first gap 15, when the PCB board 20 is deformed due to temperature change, the magnet is forced to move towards the area of the first gap 15, so that the PCB board 20 is forced to be orderly deformed along the extending direction of the first gap 15 (i.e. the row direction away from the central positioning hole 11) and to be orderly restored along the row direction and the direction approaching the central positioning hole 11 after the deformation. Moreover, the first gap 15 corresponding to the first positioning hole 13 far from the central positioning hole 11 is larger than the first gap 15 corresponding to the first positioning hole 13 near to the central positioning hole 11, that is, the first gap 15 gradually increases from the near to the far relative to the central positioning hole 11 in the row direction, so that the aperture of the first positioning hole 13 in the row direction is adapted to the variation of the PCB board 20 in the range. For example, as shown in fig. 3, the row direction aperture of the first positioning hole 13 at the P2 position is set to be larger than the row direction aperture of the first positioning hole 13 at the P1 position, wherein the first positioning hole 13 at the P1 position in fig. 3 is to match the deformation amount of the PCB 20 in the first section L1 shown in the figure, the first positioning hole 13 at the P2 position is to match the deformation amount of the PCB 20 in the second section L2 shown in the figure, and the deformation amount of the PCB 20 in the second section L2 is larger than the deformation amount in the first section L1, so that the aperture of each first positioning hole in the row direction can adapt to the deformation amount of the PCB. Further, in the present exemplary embodiment, the first gaps 15 corresponding to the respective first positioning holes 13 may be set to gradually increase from inside to outside in the same gap increment. For example, if the temperature variation of the single display module 1 is Δl, X0 is the minimum assembly gap (e.g., may be set to 0.1 mm), xn is the first gap of the nth positioning hole, n is the number of first positioning holes 13, the gap increment from X0 to Xn is (Xn-X0)/(n-1), and Xn-x0= Δl.
Also, as shown in fig. 4, the second positioning hole 14 and the first magnet 22 located therein have the second gap 16 in the column direction (Y direction), it is understood that the second positioning hole 14 has the second gap 16 away from the side wall of the center positioning hole 11 and the first magnet 22 located in the second positioning hole 14, or that the second positioning hole 14 has the second gap 16 between the side wall of the second positioning hole 14 away from the center positioning hole 11 and the first magnet 22 located in the second positioning hole 14, the side wall of the second positioning hole 14 close to the center positioning hole 11, and the first magnet 22 located in the second positioning hole 14. Furthermore, it should be understood that the side wall of the second positioning hole 14 near the center positioning hole 11 may also contact the first magnet 22 located in the second positioning hole 14 (i.e., without the second gap 16), thereby ensuring that the first magnet 22 in the column direction can be fitted into the second positioning hole 14, and because of the presence of the second gap 16, when the PCB board 20 is deformed due to temperature change, the magnet is forced to move toward the area of the second gap 16, thereby forcing the PCB board 20 to be sequentially deformed in the extending direction of the second gap 16 (i.e., in the column direction away from the center positioning hole 11), and to be sequentially restored in the column direction and the direction approaching the center positioning hole 11 after the deformation. The second gap 16 corresponding to the second positioning hole 14 far from the central positioning hole 11 is larger than the second gap 16 corresponding to the second positioning hole 14 close to the central positioning hole 11, so that the aperture of the second positioning hole 14 at a different position can adapt to the deformation of the PCB 20, and the purpose is the same as the purpose of setting the first gap 15 in the row direction, and the second gap is not expanded here. In the present exemplary embodiment, the normal temperature may be 0 ℃ to 30 ℃. Furthermore, it should be appreciated that after the PCB 20 is deformed, some or all of the first gap 15 and/or some or all of the second gap 16 may no longer exist because the amount of deformation of the PCB 20 may occupy the space of the first gap 15.
Referring to fig. 1 and 2, in the present exemplary embodiment, each PCB 20 contacts with the vertex angle of the adjacent PCB 20 through a vertex angle, the positioning hole at the vertex angle is the central positioning hole 11 of the PCB 20, when one display module 1 includes four PCBs 20, the intersection point of the vertex angles of the four PCBs 20 is the central position 19 of the bracket, and the four central positioning holes 11 of the four PCBs 20 surround the central position 19 of the bracket 10. As shown in fig. 3 and 4, the central positioning hole 11 may be a right circular hole, which may have a first aperture. The fact that the aperture of the central positioning hole 11 matches the diameter of the first magnet 22 is understood to mean that the first aperture is the same as or comparable to the diameter of the first magnet 22 located in the central positioning hole 11, so that the first magnet 22 can just fall into the positioning hole and cannot be displaced in the positioning hole, and thus the positioning hole can have a limiting effect on the first magnet 22. Further, in the present exemplary embodiment, the first positioning hole has an aperture in the row direction gradually increased by the first aperture and an aperture in the column direction is the same as the first aperture, and the second positioning hole has an aperture in the column direction gradually increased by the first aperture and an aperture in the row direction is the same as the first aperture.
In this exemplary embodiment, in order to further reduce the deformation of the display module 1, the positioning holes may be uniformly distributed in the circumferential direction of each PCB 20, as shown in fig. 2, where the plurality of positioning holes corresponding to the same PCB 20 further includes: the plurality of third positioning holes 17 and the plurality of fourth positioning holes 18 are positioned on the outer side edge of the PCB 20, wherein the plurality of third positioning holes 17 and the first positioning holes 13 farthest from the central positioning hole 11 are positioned in the same column, the plurality of fourth positioning holes 18 and the second positioning holes 14 farthest from the central positioning hole 11 are positioned in the same row, the row direction aperture of the third positioning holes 17 is the same as the row direction aperture of the first positioning holes 13, and the column direction aperture of the third positioning holes 17 is gradually increased along the direction away from the first positioning holes 13; the column-direction aperture of the fourth positioning hole 18 is the same as the column-direction aperture of the second positioning hole 14, and the row-direction aperture of the fourth positioning hole 18 increases in a direction away from the second positioning hole 14. The third positioning holes 17 are specifically distributed on the outer side extending in the column direction of the PCB 20, and the fourth positioning holes 18 are specifically distributed on the outer side extending in the row direction of the PCB 20. The row-direction aperture of the third positioning hole 17 remains the same, and the column-direction aperture increases from the middle to the side, so that the third positioning hole 17 applies a constraint force to the PCB 20 on the outer side of the display module 1, forcing the outer side edge of the PCB 20 in the column direction to deform along the column direction. Similarly, the column-direction aperture of the fourth positioning hole 18 remains the same and the row-direction aperture increases from the middle to the side, and the fourth positioning hole 18 will deform the PCB 20 at the outer side of the display module 1, forcing the outer side edge of the PCB 20 in the row direction to deform. It can be seen that the positioning holes are formed in the circumferential direction of the PCB 20 to form an even and comprehensive constraint force on the PCB 20, and each PCB 20 deforms from inside to outside under the constraint of the positioning holes on the inner side and the positioning holes on the outer side, so that the whole display module 1 is characterized by orderly deforming from inside to outside. When the temperature is recovered to be normal, each PCB 20 in the display module 1 is orderly recovered, the display module 1 can be recovered to the flatness before deformation, and the first splicing seam G1 in the row direction and the second splicing seam G2 in the column direction formed by each PCB 20 cannot be changed due to the deformation of the PCB 20, and the splicing seam in the display module 1 is still kept flat due to the small influence of the deformation of the PCB 20. In addition, as shown in fig. 2, in some embodiments, the plurality of positioning holes corresponding to the same PCB board 20 may be arranged in more than two rows and/or more than two columns, and the positioning holes in the same row also satisfy the rule that the hole diameters in the row direction gradually increase from inside to outside and the hole diameters in the column direction are the same in the display module, and the hole diameters in the column direction gradually increase from inside to outside and the hole diameters in the row direction are the same in the display module, which will not be described herein.
In addition, it can be understood that, because the apertures of the positioning holes in the same row gradually increase from the middle to the two sides, the aperture of the positioning hole near the middle position is small, and when the PCB 20 is deformed, the positioning hole applies a force opposite to the deformation direction to the PCB 20, so that the deformation of the PCB 20 can be suppressed to a certain extent, and the deformation amount of the PCB is reduced. Similarly, the apertures of the positioning holes in the same row are gradually increased from the middle to the two sides, and the aperture of the positioning hole close to the middle position is small, so that the positioning hole can apply an acting force opposite to the deformation direction to the PCB 20 in the deformation process of the PCB 20, thereby inhibiting the deformation of the PCB 20 to a certain extent, reducing the deformation amount of the whole PCB 20 caused by temperature change to a certain extent, and obviously being more beneficial to the recovery of the PCB 20 to the state before deformation after deformation.
As shown in fig. 1, in the present exemplary embodiment, among the plurality of PCB boards 20, a first splice seam G1 along the column direction is provided between the PCB boards 20 that are in contact in the row direction, and a second splice seam G2 along the row direction is provided between the PCB boards 20 that are in contact in the column direction, and the orthographic projection of the intersection position of the first splice seam G1 and the second splice seam G2 on the bracket 10 is the center position 19 of the bracket 10. In an alternative embodiment, the display module 1 includes four PCB boards 20 distributed in rows and columns, each PCB board 20 is abutted against the adjacent PCB board 20 through the top angle near the center positioning hole 11 thereof, and the four PCB boards 20 form a symmetrical structure in the row direction and the column direction. In addition, as shown in fig. 2, the positioning holes on each PCB 20 may be arranged in the same manner, and each positioning hole of the display module 1 forms a symmetrical structure about the first and second splice seams G1 and G2, so that each positioning hole in the display module 1 can uniformly constrain each PCB 20 in the whole, which is beneficial to orderly deformation and orderly recovery of the PCBs 20. Of course, in other exemplary embodiments, the positioning holes on different PCBs 20 may not have a symmetrical structure, for example, two PCBs 20 in the same row, the PCB 20 on the left side may have four positioning holes in the row direction, the PCB 20 on the right side may have five positioning holes in the row direction, and so on. In addition, the positioning holes of the four corners of the display module 1 may be configured as right circular holes having a second aperture, and obviously, the second aperture is larger than the first aperture, and the positioning holes of the second aperture may provide a moving space for the first magnet 22 located therein after the PCB 20 is deformed. As shown in fig. 1 and 2, in the present exemplary embodiment, the PCB board 20 may be configured as a rectangle or square, which is advantageous for forming a stable and regular display module 1. It should be understood that when the PCB 20 is rectangular, the total deformation of the PCB 20 in the length direction should be greater than the total deformation in the width direction. Taking the row direction as the length direction and the column direction as the width direction as an example, the total deformation of the PCB board 20 in the row direction should be greater than the total deformation in the column direction, and accordingly, the overall deformation of the entire display module 1 in the row direction should be greater than the overall deformation in the column direction, so that the number of positioning holes in the row direction may be set to be greater than the number of positioning holes in the column direction. Of course, in other exemplary embodiments, the PCB board 20 may have other shapes.
Further, in the present exemplary embodiment, the first positioning holes 13 may be disposed in one-to-one correspondence with the fourth positioning holes 18 in the column direction, and the second positioning holes 14 may be disposed in one-to-one correspondence with the third positioning holes 17 in the row direction. Of course, in other exemplary embodiments, the first positioning holes 13 and the fourth positioning holes 18, and the second positioning holes 14 and the third positioning holes 17 may also have other arrangements, for example, the first positioning holes 13 and the fourth positioning holes 18 are staggered in the column direction and/or the second positioning holes 14 and the third positioning holes 17 are staggered in the row direction, etc.
In addition, in an exemplary embodiment of the present disclosure, the material of the PCB 20 may be modified to increase the strength of the PCB 20. For example, the strength of the PCB 20 may be improved by using the PCB 20 with an aluminum substrate, so as to reduce the deformation of the PCB 20 during temperature change, and it is apparent that the PCB 20 is easier to recover to a state before deformation when the temperature returns to normal temperature in a case where the deformation of the PCB 20 is small.
In addition, as shown in fig. 1, in this exemplary embodiment, a reinforcing rib may be further disposed on the back surface of the PCB 20 to improve the strength of the PCB 20 and reduce the deformation of the PCB 20 during temperature change. In an embodiment, as shown in fig. 5, considering that the deformation amount of the PCB 20 in the length direction is greater than the deformation amount in the width direction, only one reinforcing rib 24 may be disposed on the back surface of the PCB 20 in the length direction, and the reinforcing rib 24 is located at the central axis of the PCB 20 in the length direction, so as to reduce the deformation amount of the PCB 20 in the length direction, and facilitate the restoration of the PCB 20 to the original position after the deformation. In another embodiment, as shown in fig. 6, two reinforcing ribs may be disposed symmetrically, specifically, the two reinforcing ribs intersect at the center of the PCB 20, and the two reinforcing ribs are symmetrical about the central axis of the PCB 20, that is, the portion of one reinforcing rib 25 on one side of the central axis and the portion of the other reinforcing rib 26 on the other side of the central axis are symmetrical about the central axis, where the central axis may be the central axis in the row direction or the central axis in the column direction, and by disposing a set of reinforcing ribs, an balanced deformation resistance may be applied to the PCB 20, so as to improve the strength of the PCB 20. In addition, in the case where two reinforcing ribs are provided, each reinforcing rib may extend to a vertex angle position of the PCB panel 20. In yet another embodiment, as shown in fig. 7, the first reinforcing ribs 25 and the second reinforcing ribs 26 may be disposed perpendicular to each other and intersect at the central position of the PCB 20, and under this condition, each reinforcing rib may extend to the side position of the PCB 20, which may also improve the strength of the PCB 20 and improve the deformation resistance of the PCB 20. Of course, in other exemplary embodiments, more sets of reinforcing ribs may be provided and the reinforcing ribs may have other configurations. Further, in the present exemplary embodiment, the reinforcing ribs may be made of an aluminum alloy material. Of course, in other exemplary embodiments, other materials may be selected to form the stiffener. It should be appreciated that after the reinforcing ribs are provided on the back of the PCB, a certain groove structure may be provided on the bracket to accommodate the reinforcing ribs, so as to ensure that the PCB is tightly fixed on the bracket. Of course, the structure on the bracket is not limited thereto, and other structures can be adopted to ensure close fit between the PCB board and the bracket.
The present disclosure also improves the protective layer to increase the strength of the protective layer and reduce the temperature deformation thereof to prevent the PCB 20 from being deformed due to the large shrinkage rate of the protective layer. In an exemplary embodiment of the present disclosure, a curing agent is added based on a liquid epoxy resin in a low temperature environment to form a protective layer, and thermal stress in the epoxy resin matrix is released in advance, so that when the molded protective layer is in a low temperature environment, the protective layer is not deformed or has a small deformation amount because the thermal stress in the epoxy resin matrix is released in advance. The protective layer may be, for example, a protective layer formed by curing a liquid epoxy resin at an ambient temperature of-20 ℃ to 0 ℃. Fig. 8 is a graph showing a shrinkage ratio of a protective layer and a PCB board of a display module according to an embodiment of the present disclosure, wherein an abscissa indicates a temperature, an ordinate indicates a shrinkage ratio, S1 indicates a shrinkage ratio of a PCB board 20, S2 indicates a shrinkage ratio of the protective layer before material improvement, and S2' indicates a shrinkage ratio of the protective layer after material improvement, and it can be seen that the thermal stress change of the protective layer provided by the present disclosure is small when the protective layer is changed from normal temperature to low temperature, so that the protective layer cannot be deformed or has a small deformation amount.
In addition, in the present exemplary embodiment, 5 to 20phr of polyether sulfone (PES) may be added to the epoxy resin to improve the strength of the protective layer (e.g., 5phr,10phr,15phr,20phr, etc.), so that the molded protective layer has better resistance strength at low temperature and reduced deformation amount. Alternatively, 10-30 phr of hyperbranched polyester can be added to improve the strength of the protective layer (such as 10phr,15phr,20phr,25phr,30phr and the like), and a large number of flexible group ether bonds contained in the hyperbranched polyester molecules can not be frozen at low temperature, can provide space for low-temperature molecular movement, and can form hydrogen bonds between a large number of hydroxyl functional groups at the tail end of the molecules and between hydroxyl groups and amino groups in the epoxy agent after ring opening, so that the tensile strength and impact strength of the epoxy resin after molding are enhanced.
In addition, in an exemplary embodiment of the present disclosure, the thickness of the protective layer and the PCB 20 may be adjusted to improve the strength of the PCB 20 and reduce the deformation thereof. For example, fig. 9 is a partial enlarged view of the D position in fig. 3, and as shown in fig. 9, the protective layer has a first thickness b, the PCB 20 has a second thickness a, and a thickness ratio b/a of the first thickness b to the second thickness a may be 1/3 to 5/4, for example, b/a may be 1/3, 2/3, 1, 5/4, etc.
In addition, the present disclosure also provides a method for preparing a display module, including the following steps:
s110, providing a plurality of PCB boards, wherein a display device is arranged on a first surface of the PCB boards, a plurality of first magnets are arranged on a second surface of the PCB boards, and the plurality of first magnets are distributed at intervals along the direction of the PCB boards and the column direction;
s120, providing a support, wherein a plurality of positioning holes are formed in the support, the positioning holes are arranged in one-to-one correspondence with the first magnets, a second magnet is arranged in each positioning hole, and the second magnet is attracted with the first magnet so that the first magnet is at least partially positioned in the corresponding positioning hole; the plurality of positioning holes corresponding to the same PCB comprise a central positioning hole, a first positioning hole which is positioned in the same row with the central positioning hole, and a second positioning hole which is positioned in the same column with the central positioning hole, wherein the central positioning hole is closer to the central position of the bracket relative to other positioning holes; in the same row of positioning holes, the first positioning holes and the first magnets positioned in the first positioning holes have first gaps along the row direction, the first gaps corresponding to the first positioning holes gradually increase along the direction away from the central positioning holes, and the apertures of the first positioning holes in the column direction are the same; in the same column of positioning holes, the second positioning holes and the first magnets positioned in the second positioning holes are provided with second gaps along the column direction, the second gaps corresponding to the second positioning holes are gradually increased along the direction away from the central positioning holes, and the apertures of the second positioning holes in the row direction are the same.
The specific structure and the principle of the positioning holes can be described in the above embodiments, and will not be described herein.
Furthermore, the method may further comprise the steps of:
s130, adding a modified material with a preset mass ratio into liquid epoxy resin;
s140, adding a curing agent into the epoxy resin and the modified material, and curing at the temperature of-20 ℃ to 0 ℃ to form a protective layer;
and S150, covering the display device on the PCB by using the protective layer.
In addition, the disclosure further provides a tiled display device, which includes a plurality of display modules described in any embodiment, wherein the plurality of display modules are distributed in an array in a row direction and a column direction, wherein display modules adjacent in the row direction are propped against each other in the column direction, and display modules adjacent in the column direction are propped against each other in the row direction, and a complete display device is formed by stitching the plurality of display modules. It should be appreciated that the tiled display device provided by the present disclosure includes the benefits described in any of the embodiments described above.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (17)
1. A display module, comprising:
the display device comprises a plurality of display substrates, wherein the display substrates are distributed at intervals along the row direction and the column direction, a display device is arranged on a first surface of each display substrate, a plurality of first magnets are arranged on a second surface of each display substrate, and the plurality of first magnets are distributed at intervals along the row direction and the column direction;
the bracket is used for fixing the display substrates and comprises a plurality of positioning holes which are arranged corresponding to the first magnets, a second magnet is arranged in each positioning hole, and the second magnet is attracted with the first magnet so that the first magnet is at least partially positioned in the corresponding positioning hole;
the plurality of positioning holes corresponding to the same display substrate comprise a central positioning hole, a first positioning hole which is positioned in the same row with the central positioning hole, and a second positioning hole which is positioned in the same column with the central positioning hole, wherein the central positioning hole is closer to the central position of the bracket than other positioning holes, and the aperture of the central positioning hole is matched with the diameter of the first magnet;
in the same row of positioning holes, the first positioning holes and the first magnets positioned in the first positioning holes have first gaps along the row direction, the first gaps corresponding to the first positioning holes gradually increase along the direction away from the central positioning holes, and the apertures of the first positioning holes in the column direction are the same as the apertures of the central positioning holes in the column direction;
in the same column of positioning holes, the second positioning holes and the first magnets positioned in the second positioning holes are provided with second gaps along the column direction, the second gaps corresponding to the second positioning holes are gradually increased along the direction away from the central positioning hole, and the aperture of each second positioning hole in the row direction is the same as the row square aperture of the central positioning hole.
2. The display module of claim 1, wherein the plurality of positioning holes corresponding to the same display substrate further comprises: a plurality of third positioning holes in the same column as the first positioning holes located away from the center positioning Kong Zuiyuan, a plurality of fourth positioning holes in the same row as the second positioning holes located away from the center positioning Kong Zuiyuan;
the row-direction aperture of the third positioning hole is the same as the row-direction aperture of the first positioning hole, and the column-direction aperture of the third positioning hole increases progressively in a direction away from the first positioning hole;
the column-direction aperture of the fourth positioning hole is the same as the column-direction aperture of the second positioning hole, and the row-direction aperture of the fourth positioning hole increases progressively in a direction away from the second positioning hole.
3. The display module according to claim 2, wherein the display module comprises four display substrates distributed in rows and columns, each display substrate being abutted against an adjacent display substrate by a vertex angle near a center positioning hole thereof;
the number of the first positioning holes is the same as that of the fourth positioning holes, the number of the second positioning holes is the same as that of the third positioning holes, and the number of the first positioning holes is larger than that of the second positioning holes.
4. A display module according to claim 3, wherein the positioning holes at the four corners of the display module are all right circular holes.
5. The display module of claim 1, wherein the first magnet and the second magnet are magnetic beads, and the center positioning hole is a right circular hole;
the row-direction aperture of the first positioning hole is larger than the aperture of the central positioning hole, and the column-direction aperture is the same as the aperture of the central positioning hole;
the aperture in the column direction of the second positioning hole is larger than the aperture of the central positioning hole, and the aperture in the row direction is the same as the aperture of the central positioning hole.
6. The display module of claim 1, wherein the display substrate further comprises:
the first reinforcing rib is located on the second face of the display substrate, extends along the length direction of the display substrate and is located at the central axis of the display substrate.
7. The display module of claim 1, wherein the display substrate further comprises: a second reinforcing rib and a third reinforcing rib;
the second reinforcing ribs and the third reinforcing ribs intersect at the center point of the display substrate and are mirror images relative to the central axis of the display substrate; or alternatively, the process may be performed,
the second reinforcing ribs are perpendicular to the third reinforcing ribs and intersect at the center point of the display substrate, the second reinforcing ribs are symmetrical about the center point, and the third reinforcing ribs are symmetrical about the center point.
8. The display module of claim 1, wherein the display module further comprises:
and a protective layer covering the display devices on the plurality of display substrates, wherein a base material of the protective layer comprises epoxy resin and a strength modifying material for improving the epoxy resin.
9. The display module of claim 8, wherein the modifying material comprises polyethersulfone, and the mass ratio of the epoxy resin to the modifying material is 100: (5-20).
10. The display module of claim 8, wherein the modified material comprises hyperbranched polyester, and the mass ratio of the epoxy resin to the modified material is 100: (10-30).
11. The display module of claim 1, further comprising a protective layer covering the display devices on the plurality of display substrates, wherein the protective layer is a protective layer cured at-20 ℃ to 0 ℃.
12. The display module of claim 1, further comprising a protective layer having a first thickness and the display substrate having a second thickness, wherein a thickness ratio of the first thickness to the second thickness is 1/3 to 5/4.
13. The display module of claim 1, wherein the substrate of the display substrate is an aluminum substrate.
14. The display module of any one of claims 1-13, wherein the display substrate is a PCB.
15. The preparation method of the display module is characterized by comprising the following steps:
providing a plurality of display substrates, wherein the display substrates are distributed at intervals along the row direction and the column direction, a display device is arranged on a first surface of the display substrate, a plurality of first magnets are arranged on a second surface of the display substrate, and the plurality of first magnets are distributed at intervals along the row direction and the column direction;
providing a bracket, wherein a plurality of positioning holes are formed in the bracket, the positioning holes are arranged in one-to-one correspondence with the first magnets, a second magnet is arranged in each positioning hole, and the second magnet is attracted with the first magnet so that the first magnet is at least partially positioned in the corresponding positioning hole; the plurality of positioning holes corresponding to the same display substrate comprise a central positioning hole, a first positioning hole which is positioned in the same row with the central positioning hole, and a second positioning hole which is positioned in the same column with the central positioning hole, wherein the central positioning hole is closer to the central position of the bracket than other positioning holes, and the aperture of the central positioning hole is matched with the diameter of the first magnet; in the same row of positioning holes, the first positioning holes and the first magnets positioned in the first positioning holes have first gaps along the row direction, the first gaps corresponding to the first positioning holes gradually increase along the direction away from the central positioning holes, and the apertures of the first positioning holes in the column direction are the same as the apertures of the central positioning holes in the column direction; in the same column of positioning holes, the second positioning holes and the first magnets positioned in the second positioning holes are provided with second gaps along the column direction, the second gaps corresponding to the second positioning holes are gradually increased along the direction away from the central positioning hole, and the aperture of each second positioning hole in the row direction is the same as the aperture of the central positioning hole in the row direction.
16. The method for manufacturing a display module according to claim 15, further comprising:
adding a modified material with a preset mass ratio into the liquid epoxy resin;
adding a curing agent into the epoxy resin and the modified material, and curing at the temperature of-20 ℃ to 0 ℃ to form a protective layer;
and covering the display device on the display substrate with the protective layer.
17. A tiled display device, characterized in that the tiled display device comprises a plurality of display modules according to any one of claims 1-14, wherein the plurality of display modules are distributed in an array in a row-column direction, display modules adjacent in the row direction are abutted in a column direction, and display modules adjacent in the column direction are abutted in the row direction.
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