TW202142588A - Resin composition capable of obtaining a cured product having excellent impact resistance - Google Patents

Abstract

The present invention provides a resin composition capable of obtaining a cured product having excellent impact resistance. A resin composition includes (A) an epoxy resin, (B) a thiol compound, and (C) magnetic powder, wherein the epoxy equivalent of component (A) is from 200 g/eq to 1000 g/eq, the (B) component is a thiol compound having two or more functional groups, and the ratio of the total number of thiol groups in (B) the thiol compound to the total number of epoxy groups in (A) the epoxy resin (thiol group/epoxy group) is from 0.3 to 1.0, and the cured product of the resin composition has an elastic modulus of 500 MPa or less at 25 DEG C and the elongation at the breaking point of the cured product of the resin composition at 25 DEG C is more than 30%.

Description

Resin composition

The present invention relates to a resin composition containing magnetic powder. Furthermore, the present invention relates to hardened products, electronic parts, motors containing rubidium magnets, etc. obtained by using the resin composition.

In electronic parts with permanent magnets and magnetic circuits with magnetic yokes, adhesives are usually used. Because of the leakage of magnetic flux in the electronic parts using the adhesive, there is a problem that the performance of electronic parts such as motors due to magnetic loss is degraded.

With regard to these issues, it is known that by adding magnetic powder to the adhesive to make the adhesive magnetic, it is known to suppress the magnetic leakage of the adhesive on the magnetic circuit and improve the performance of electronic parts such as motors (Patent Document 1) .

Generally used in camera modules, etc., in order to have impact resistance, an adhesive with low elasticity is preferred. However, if magnetic powder is filled in the adhesive, the cured product of the adhesive becomes harder and the elastic modulus becomes higher. tendency. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 1-289883

[The problem to be solved by the invention]

Therefore, the subject of the present invention is to provide a resin composition containing magnetic powder, which can obtain a cured product having excellent impact resistance. [Means to solve the problem]

In order to achieve the subject of the present invention, the inventors of the present invention conducted active reviews and found that the subject of the present invention can be solved by using a resin composition containing a thiol compound, thus completing the present invention.

That is, the present invention includes the following contents. [1] A resin composition comprising (A) epoxy resin, (B) thiol compound and (C) magnetic powder, The elastic modulus of the cured resin composition at 25°C is below 500MPa, and The elongation at the breaking point of the cured product of the resin composition at 25°C is more than 30%. [2] The resin composition of [1] above, wherein the epoxy equivalent of component (A) is 200 g/eq. to 1000 g/eq. [3] The resin composition according to [1] or [2] above, wherein the component (B) is a thiol compound having two or more functions. [4] The resin composition of any one of [1] to [3] above, wherein the ratio of the total number of mercapto groups of the (B) thiol compound to the total number of epoxy groups of the epoxy resin (A) (mercapto group/ring Oxy) is 0.3 to 1.0. [5] The resin composition of any one of [1] to [4] above, wherein the content of component (C) is 40% by mass when the non-volatile content in the resin composition is 100% by mass ~75% by mass. [6] The resin composition according to any one of [1] to [5] above, which further contains a latent hardening accelerator. [7] The resin composition according to any one of [1] to [6] above, wherein the component (A) contains (A-1) a flexible skeleton-containing epoxy resin. [8] The resin composition according to any one of [1] to [7] above, wherein the reaction peak temperature based on differential scanning calorimetry is 100° C. or less. [9] The resin composition of any one of [1] to [8] above, which is used as an adhesive. [10] The resin composition of [9] above, which is used as an adhesive for bonding the rubidium magnet as the adherend. [11] The resin composition according to any one of [1] to [8] above, which is used as a sealing material. [12] A cured product, which is a cured product of the resin composition of any one of [1] to [11] above. [13] A motor containing a rubidium magnet, which contains the hardened product as described in [12] above. [14] An electronic component comprising the hardened product as described in [12] above. [15] An electronic component comprising a motor containing a rubidium magnet and the hardened object as described in [12] above. [Effects of the invention]

According to the present invention, a resin composition containing magnetic powder can be provided, and a cured product having excellent impact resistance can be obtained.

Hereinafter, the present invention will be described in detail with its preferred embodiments. However, the present invention is not limited to the following embodiments and exemplified materials, and arbitrary changes can be made without departing from the scope of the present invention and the scope of its equivalents.

＜Resin composition＞ The resin composition of the present invention includes (A) epoxy resin, (B) thiol compound, and (C) magnetic powder. The elastic modulus of the cured resin composition of the present invention at 25°C is 500 MPa or less. The elongation at the breaking point of the cured product of the resin composition of the present invention at 25° C. is 30% or more. The hardened products of these resin compositions have excellent impact resistance.

In addition to (A) epoxy resin, (B) thiol compound, and (C) magnetic powder, the resin composition of the present invention may further include (D) stabilizer, (E) dispersant, and (F) hardening promotion Agent, (G) organic filler, (H) other additives and (I) organic solvent. Hereinafter, each component contained in the resin composition will be described in detail.

＜(A) Epoxy resin＞ The resin composition of the present invention contains (A) epoxy resin. The (A) epoxy resin means a curable resin having an epoxy group.

(A) The epoxy equivalent of the epoxy resin is not particularly limited, but based on the viewpoint of suppressing the elastic modulus to be low and increasing the elongation at the breaking point, it is preferably 50g/eq. or more, more preferably 100g/eq. Above, it is more preferably 150 g/eq. or more, still more preferably 180 g/eq. or more, and particularly preferably 200 g/eq. or more. (A) The upper limit of the epoxy equivalent of the epoxy resin is not particularly limited, but it is preferably 5000 g/eq. or less based on the point of obtaining a resin composition that is easier to handle in the form used as an adhesive or sealing material. It is more preferably 2000 g/eq. or less, still more preferably 1000 g/eq. or less, still more preferably 700 g/eq. or less, particularly preferably 500 g/eq. or more. Epoxy equivalent is the mass of resin per equivalent of epoxy group. The epoxy equivalent can be measured in accordance with JIS K7236.

(A) The weight average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and still more preferably 400 to 1,500. The weight average molecular weight of the resin is measured by gel permeation chromatography (GPC) as a value in terms of polystyrene.

The content of (A) epoxy resin in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 99% by mass or less, and more preferably 90% by mass or less. It is still more preferably 80% by mass or less, still more preferably 65% by mass or less, and particularly preferably 50% by mass or less. The lower limit of the (A) epoxy resin content of the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably 5% by mass Above, it is more preferably 10% by mass or more, still more preferably 20% by mass or more, and particularly preferably 30% by mass or more. In one embodiment, the content of (A) epoxy resin can be set based on the content of (B) thiol compound or thiol equivalent.

＜(A-1) Epoxy resin with flexible skeleton＞ In the present invention, based on the viewpoint of suppressing the elastic modulus to be lower and increasing the elongation at the breaking point, the (A) epoxy resin preferably includes (A-1) an epoxy resin containing a flexible skeleton. The so-called (A-1) epoxy resin containing a flexible skeleton means a curable resin having a flexible skeleton and an epoxy group. The flexible skeleton herein may be a saturated chain skeleton formed by skeleton atoms selected from 6 or more (preferably 8 or more) carbon atoms and oxygen atoms as the main chain. (A-1) The epoxy resin containing a flexible skeleton preferably has 1 to 5 epoxy groups per molecule, more preferably has 1 to 3, and particularly preferably has 2. (A-1) The epoxy resin containing a flexible skeleton may further have functional groups such as a hydroxyl group and an amino group.

Examples of (A-1) epoxy resins containing flexible skeletons are (A-1-1) aromatic epoxy resins containing flexible skeletons (those having aromatic rings) and (A-1-2) containing flexible Non-aromatic epoxy resin (without aromatic ring) with a sexual skeleton. (A-1) The epoxy resin containing a flexible skeleton can be used alone or in combination of two or more in any ratio.

(A-1-1) Aromatic epoxy resin with flexible skeleton has at least one aromatic group (such as phenylene, etc.) and the main chain is selected from 6 or more (preferably 8 or more) An epoxy resin with at least one saturated chain skeleton formed by the skeleton atoms of carbon atoms and oxygen atoms.

Examples of (A-1-1) aromatic epoxy resins containing flexible skeletons include modified bisphenol epoxy resins containing flexible skeletons, modified biphenyl epoxy resins containing flexible skeletons, and modified biphenyl epoxy resins containing flexible skeletons. Modified novolak type epoxy resin with flexible skeleton, modified phenol aralkyl type epoxy resin with flexible skeleton, etc., but not particularly limited.

The modified bisphenol-type epoxy resin with a flexible skeleton has, for example, bisphenol A ether structure, bisphenol AP ether structure, bisphenol B ether structure, bisphenol BP ether structure, bisphenol C ether structure, and bisphenol E ether structure. , Bisphenol F ether structure, bisphenol TMC ether structure and other bisphenol ether skeletons.

(A-1-1) The aromatic epoxy resin containing a flexible skeleton can be, for example, an epoxy resin represented by formula (1):

[In the formula, R each independently represents a single bond, -CR ¹ ₂ -, -O-, -CO-, -S-, -SO- or -SO ₂ -, and R ¹ each independently represents a hydrogen atom, an alkyl group (more Preferred carbon number is 1~6) or aryl group (preferably carbon number is 6~14), or 2 R ¹ bonded to the same carbon atom are bonded together to form a cycloalkane ring (preferably carbon number is 3~8 ), R ² each independently represents an alkyl group (preferably carbon number is 1 to 6) or an aryl group (preferably carbon number is 6 to 14), and X and Y each independently represent an alkylene group that may have a hydroxyl group (preferably carbon number The number is 2~20, preferably the carbon number is 2~10), a each independently represents an integer of 0 or more, b each independently represents an integer of 2 or more, c represents an integer of 1 or more, d each independently represents an integer of 0~3 ].

The alkyl group refers to a linear, branched, and/or cyclic monovalent aliphatic saturated hydrocarbon group. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, second butyl, tertiary butyl, pentyl, isopentyl, neopentyl, and second pentyl. Group, tertiary pentyl group, cyclopentyl group, cyclohexyl group, etc., preferably methyl group. The aryl group refers to a monovalent aromatic hydrocarbon group. Examples of the aryl group include phenyl, 1-naphthyl, 2-naphthyl, etc., and phenyl is preferred. The cycloalkane ring refers to a cyclic aliphatic saturated hydrocarbon ring. Examples of the cycloalkane ring include a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a methylcyclohexane ring, a dimethylcyclohexane ring, and a trimethylcyclohexane ring. Alkylene means a linear or branched divalent aliphatic saturated hydrocarbon group. Examples of alkylene groups that may have a hydroxyl group are, for example, -CH ₂ -CH ₂ -, -CH(CH ₃ )-, -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH(CH ₃ )-,- CH(CH ₃ )-CH ₂ -, -C(CH ₃ ) ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH(CH ₃ )-, -CH ₂ -CH(CH ₃ )-CH ₂ -, -CH(CH ₃ )-CH ₂ -CH ₂ -, -CH ₂ -C(CH ₃ ) ₂ -, -C(CH ₃ ) ₂ -CH ₂ -,- CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH(CH ₃ )-CH ₂ -CH (CH ₃ )-CH ₂ -CH(CH ₃ )-, -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-, -CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH _2- CH(CH ₃ )-CH ₂ -CH(CH ₃ )-CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -, -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -CH ₂ -and other alkylene groups with 2 to 10 carbons; -CH ₂ -CH(OH)- , -CH(OH)-CH ₂ -, -CH ₂ -CH(OH)-CH ₂ -, -CH(CH ₂ OH)-CH ₂ -, -CH ₂ -CH(CH ₂ OH)-, -CH _2- CH(CH ₂ OH)-CH ₂ -and other hydroxyalkylene groups with carbon number 2-10.

In formula (1), R is preferably -CR ¹ -each independently. R ^{1 is} preferably each independently a hydrogen atom or an alkyl group, more preferably a hydrogen atom or a methyl group. R ^{2 is} preferably each independently an alkyl group. a is preferably independently an integer of 0-20 (0 or an integer of 1-20), and more preferably an integer of 0-10 (an integer of 0 or 1-10). b is preferably an integer of 3-20 independently, more preferably an integer of 3-10. c is preferably an integer of 1-20, more preferably an integer of 1-10, and still more preferably an integer of 1-8. d is preferably 0 or 1 independently, and more preferably 0.

(A-1-1) Specific examples of the aromatic epoxy resin containing a flexible skeleton are epoxy resins represented by formulas (1A) to (1G).

[In the formula, R ³ , R ⁴ and R ⁵ each independently represent a hydrogen atom or a methyl group, x represents an integer of 1-10, and y each independently represents an integer of 1-10].

(A-1-2) A non-aromatic epoxy resin with a flexible skeleton is an epoxy resin with a saturated aliphatic chain formed by skeleton atoms selected from carbon atoms and oxygen atoms as the basic skeleton. Examples of aromatic epoxy resins containing flexible skeletons include alkylene glycols such as ethylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether. Diglycidyl ether; Polyalkylene glycol diglycidyl ether such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, polybutylene glycol diglycidyl ether, etc.

(A-1-2) The non-aromatic epoxy resin containing a flexible skeleton may be, for example, an epoxy resin represented by formula (2).

[In the formula, Z each independently represents an alkylene group which may have a hydroxyl group (preferably carbon number is 2-20, more preferably carbon number is 2-10), e represents an integer of 1 or more].

In the formula (2), Z preferably independently represents an alkylene group (preferably, the carbon number is 2-20, more preferably the carbon number is 2-10). e is preferably an integer of 1-20.

(A-1) Commercial products of epoxy resins containing flexible skeletons, for example, "EP-4000S" and "EP-4010S" (modified bisphenol type epoxy resin) manufactured by ADEKA; manufactured by Mitsubishi Chemical Corporation "YL7175-500", "YL7175-1000", "YL7410", "YX7105" (modified bisphenol epoxy resin); "EXA-4850", "EXA-4850-150", "EXA- 4816", "EXA-4822" (modified bisphenol epoxy resin); "EG-280" manufactured by Osaka Gas Chemical Co., Ltd.; "EX-830" manufactured by NAGASE CHEMTEX (modified bisphenol epoxy resin); "YX7400" (polybutylene glycol diglycidyl ether) manufactured by Mitsubishi Chemical Corporation, etc.

(A-1) The epoxy equivalent of the epoxy resin containing a flexible skeleton is not particularly limited, but it is preferably 50 g/eq. or more, more preferably 100 g/eq. or more, and even more preferably 200 g/eq. or more , More preferably more than 300g/eq., particularly preferably more than 400g/eq. (A-1) The lower limit of the epoxy equivalent of the epoxy resin containing the flexible skeleton is not particularly limited, but it is preferably 5000 g/eq. or less, more preferably 2000 g/eq. or less, and still more preferably 1000 g/eq. Hereinafter, it is more preferably 700 g/eq. or less, and particularly preferably 500 g/eq. or less. Epoxy equivalent is the mass of resin per equivalent of epoxy group and can be measured in accordance with JIS K7236.

(A-1) The weight average molecular weight (Mw) of the epoxy resin containing a flexible skeleton is preferably 100 to 5,000, more preferably 250 to 3,000, and still more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) method in terms of polystyrene.

(A-1) The content of the epoxy resin containing the flexible skeleton of the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 70% by mass or less, and more It is preferably 60% by mass or less, more preferably 55% by mass or less, still more preferably 50% by mass or less, and particularly preferably 45% by mass or less. (A-1) The lower limit of the content of the flexible skeleton-containing epoxy resin in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 0.1% by mass or more , More preferably 1 mass% or more, still more preferably 5 mass% or more, still more preferably 8 mass% or more, particularly preferably 10 mass% or more.

＜(A-2) Any other epoxy resin＞ In the present invention, the (A) epoxy resin may include (A-2) any other epoxy resins other than the (A-1) flexible skeleton-containing epoxy resin.

Examples of (A-2) other optional epoxy resins include, for example, bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tertiary butylcatechol type epoxy resin Resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolak type epoxy resin, phenol aralkyl group Type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy containing spiro ring Resin, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, naphthyl ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, isocyanuric acid Ester type epoxy resin, phenol-phthalimidine type epoxy resin, phenol-phenolphthalimidine type epoxy resin, etc. (A-2) Any other epoxy resin can be used alone or in combination of two or more.

The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as (A-2) other optional epoxy resins. Relative to (A-2) other arbitrary epoxy resin 100% by mass, the ratio of epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, especially Preferably, it is 70% by mass or more.

(A-2) Other arbitrary epoxy resins can be classified into epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C Resin (hereinafter sometimes referred to as "solid epoxy resin"). The resin composition of the present invention as (A-2) other optional epoxy resins may include only liquid epoxy resin or solid epoxy resin, or a combination of liquid epoxy resin and solid epoxy resin. Oxy resin.

The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

Examples of liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, and glycidylamine type epoxy resin. Epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin and epoxy resin with butadiene structure .

Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC; "828US", "828EL", and "jER828EL" manufactured by Mitsubishi Chemical Corporation. , "825", "EPICOTE 828EL" (bisphenol A type epoxy resin); "jER807" and "1750" (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" (made by Mitsubishi Chemical Corporation) Phenolic novolac type epoxy resin); "630", "630LSD", "604" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycidyl alcohol type epoxy resin) manufactured by ADEKA Oxygen resin); "EP-3950L" and "EP-3980S" (glycidylamine epoxy resin) made by ADEKA; "EP-4088S" (dicyclopentadiene epoxy resin) made by ADEKA; "ZX1059" (a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co.; "EX-721" (glycidyl ester epoxy resin) manufactured by NAGASE CHEMTEX ); "CELOXIDE 2021P" (alicyclic epoxy resin with ester skeleton) manufactured by DAICEL; "PB-3600" manufactured by DAICEL, "JP-100" and "JP-200" manufactured by Soda Corporation of Japan ( Epoxy resin with butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidyl cyclohexane epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. These can be used individually by 1 type or in combination of 2 or more types.

The solid epoxy resin is preferably a solid epoxy resin having 3 or more epoxy groups in a molecule, and more preferably an aromatic solid epoxy resin having 3 or more epoxy groups in a molecule.

The solid epoxy resin is preferably a dixylenol type epoxy resin, a naphthalene type epoxy resin, a naphthalene type tetrafunctional epoxy resin, a naphthol novolak type epoxy resin, and a cresol novolak type epoxy resin. , Dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthyl ether type epoxy resin, anthracene type epoxy resin, bisphenol A type ring Oxygen resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, phenol benzolamine type epoxy resin, phenol phenolphthalein type epoxy resin.

Specific examples of solid epoxy resin include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resin) manufactured by DIC ; "N-690" (cresol novolac epoxy resin) made by DIC; "N-695" (cresol novolak epoxy resin) made by DIC; "HP-7200" made by DIC , "HP-7200HH", "HP-7200H", "HP-7200L" (dicyclopentadiene epoxy resin); "EXA-7311", "EXA-7311-G3", "EXA" manufactured by DIC -7311-G4", "EXA-7311-G4S", "HP6000" (naphthyl ether type epoxy resin); "EPPN-502H" (triphenol type epoxy resin) manufactured by Nippon Kayaku Corporation; Nippon Kayaku Corporation "NC7000L" (naphthol novolak epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; Japan "ESN475V" (naphthalene type epoxy resin) manufactured by Ferro Chemicals; "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; "ESN375" (dihydroxynaphthalene epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd. Type epoxy resin); "YX4000H", "YX4000", "YX4000HK", "YL7890" (dixylenol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation Oxygen resin); "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX7700" (phenol aralkyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" manufactured by Osaka Gas Chemical Corporation , "CG-500"; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (茀-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" manufactured by Mitsubishi Chemical Corporation ( Bisphenol A type epoxy resin); "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "WHR991S" (phenoxybenzamide type epoxy resin) manufactured by Nippon Kayaku Co., Ltd. Wait. These can be used individually by 1 type or in combination of 2 or more types.

(A-2) The epoxy equivalent of any other epoxy resin is preferably 50g/eq.~5,000 g/eq., more preferably 60g/eq.~2,000g/eq., and still more preferably 70g/eq. .~1000g/eq., more preferably 80g/eq.~500g/eq. Epoxy equivalent is the mass of resin per equivalent of epoxy group. The epoxy equivalent can be measured in accordance with JIS K7236.

(A-2) The weight average molecular weight (Mw) of other arbitrary epoxy resins is preferably 100 to 5,000, more preferably 250 to 3,000, and still more preferably 400 to 1,500. The weight average molecular weight of the resin is measured by gel permeation chromatography (GPC) as a value in terms of polystyrene.

The content of (A-2) other arbitrary epoxy resins in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass or less, more preferably 30% by mass or less, more preferably 20% by mass or less, particularly preferably 15% by mass or less. The lower limit of the content of (A-2) other arbitrary epoxy resins in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably, for example, 0% by mass or more, and more Preferably, it is 0.01 mass% or more, 0.1 mass% or more, 0.5 mass% or more, 1 mass% or more, 3 mass% or more, 5 mass% or more, etc.

When the resin composition contains (A-2) other optional epoxy resins, the mass of (A-2) other optional epoxy resins in the resin composition relative to (A-1) epoxy resin with flexible skeleton The ratio ((A-2)/(A-1)) may preferably be 2 or less, more preferably 1.5 or less, still more preferably 1 or less, particularly preferably 0.7 or less.

＜(B) Thiol compound＞ The resin composition of the present invention contains (B) a thiol compound, and when the (B) thiol compound is used as a curing agent for the (A) epoxy resin, it can be cured at a relatively low temperature and the reduction in magnetic force can be suppressed.

The so-called (B) thiol compound means an organic compound having a mercapto group (-SH). From the viewpoint of obtaining excellent epoxy curability, it is preferably a thiol compound with more than two functions, and from the viewpoint of increasing the crosslinking density. It is preferably a thiol compound with three or more functions. (B) In the description of the thiol compound, when the number of functional groups is displayed, the number of mercapto groups (-SH) contained in one molecule is used as a reference. In addition, these thiol compounds are preferably first- and/or second-tier thiol compounds from the viewpoint of improving reactivity.

(B) The thiol compound includes not only a saturated hydrocarbon structure but also an unsaturated hydrocarbon structure. (B) The thiol compound includes those containing linear, branched, and/or cyclic structures (for example, isocyanuric acid structure, glycoluril structure, benzene ring structure, etc.), but in one embodiment, it is based on more improved impact resistance From this point of view, it is preferable to include a thiol compound that does not contain a cyclic structure (a straight chain and/or branched chain that does not contain a cyclic structure). (B) The thiol compound may be a non-aromatic thiol compound (with no aromatic ring) or an aromatic thiol compound (with an aromatic ring). However, in one embodiment, it is based on the improvement of impact resistance. From a viewpoint, a non-aromatic thiol compound (one that does not contain an aromatic ring) is preferable. (B) The thiol compound may have functional groups such as a hydroxyl group, a carboxyl group, or an amino group in addition to a mercapto group. In one embodiment, it is preferable not to have these functional groups.

Examples of (B) thiol compounds include hydrocarbon thiol compounds, ether-containing thiol compounds, thioether-containing thiol compounds, amine-containing thiol compounds, alcohol-containing thiol compounds, and carboxylic acid esters. Structured thiol compound, isocyanurate structure-containing thiol compound, carboxylate structure-containing isocyanurate structure, thiol compound containing glycoluril structure, etc. (B) The thiol compound may be used individually by 1 type, and may be used in combination of 2 or more types at arbitrary ratios.

The so-called hydrocarbon thiol compound means a thiol compound with a hydrocarbon as a basic skeleton, for example, 1,4-butane dithiol, 1,6-hexane dithiol, 1,8-octane dithiol, 1,10-decane dithiol, 2,2-dimethyl-propane-1,3-dithiol, 1,4-cyclohexane dithiol, 1,2-cyclohexane dithiol, 2-functional hydrocarbon thiol compounds such as m-xylene-α,α'-dithiol, p-xylene-α,α'-dithiol; 2-mercaptomethyl-1,3-propane dithiol , 2-Ethyl-2-(mercaptomethyl)-1,3-propane dithiol, 2-mercaptomethyl-1,4-butane dithiol, 1,2,3-propane trithiol, etc. The trifunctional hydrocarbon thiol compound; Tetra(mercaptomethyl)methane, 2,2-bis(mercaptomethyl)-1,3-propane dithiol and other tetrafunctional hydrocarbon thiol compounds.

The so-called thiol compound containing ether structure means a thiol compound having an ether structure, for example, 3,6-dioxa-1,8-octanedithiol, 3,6,9-trioxaundecane -1,11-dithiol, 3,4-dimethoxybutane-1,2-dithiol, 2,3-dimercaptopropyl methyl ether, bis(2-mercaptoethyl) ether, Bis[4-(2-mercaptoethyloxy)phenyl]methane, bis[4-(3-mercaptopropyloxy)phenyl]methane, 2,2-bis[4-(2-mercaptoethyl) (Oxy)phenyl]propane, 2,2-bis[4-(3-mercaptopropyloxy)phenyl]propane and other bifunctional ether-containing thiol compounds; (2-mercaptoethyl)( 2,3-Dimercaptopropyl) ether, trimethylolpropane tris(2-mercaptoethyl) ether, trimethylolethane tris(2-mercaptoethyl) ether, trimethylolpropane tris(3 -Mercaptopropyl) ether, trimethylolethane tris(3-mercaptopropyl) ether, trimethylolpropane tris(4-mercaptobutyl) ether, trimethylolethane tris(4-mercaptobutyl) Base) ether, glycerol tris(3-mercaptopropyl) ether, glycerol tris(4-mercaptobutyl) ether, trimethylolpropane tris(2-mercaptopropyl) ether, trimethylolethane tri(2 -Mercaptopropyl) ether, trimethylolpropane tris(3-mercaptobutyl) ether, trimethylolethane tris(3-mercaptobutyl) ether, glycerol tris(2-mercaptopropyl) ether, glycerin Tri-functional thiol compounds containing ether structure such as tris(3-mercaptobutyl) ether; bis(2,3-dimercaptopropyl) ether, pentaerythritol tetra(2-mercaptoethyl) ether, pentaerythritol tetra(3) -Mercaptopropyl) ether, pentaerythritol tetra(4-mercaptobutyl) ether, pentaerythritol tetra(2-mercaptopropyl) ether, pentaerythritol tetra(3-mercaptobutyl) ether and other 4-functional ether-containing mercaptans Compound; Dipentaerythritol hexa(3-mercaptopropyl) ether, dipentaerythritol hexa(2-mercaptopropyl) ether and other polyfunctional ether-containing thiol compounds with five or more functions.

The so-called thiol compound containing a thioether structure means a thiol compound having a thioether structure, for example, bis(2-mercaptoethyl)sulfide, 3,6-dithia-1,8-octanedithiol , 3,6,9-trithiaundecane-1,11-dithiol, 1,4-dithia-2,5-bis(methanethiol) and other bifunctional thioether structures Thiol compound; 4-(2-mercaptoethyl)-3,6-dithia-1,8-octanedithiol, 4-mercaptomethyl-3,6-dithia-1,8-octane Dithiol and other trifunctional thiol compounds containing thioether structure; 1,2,6,7-tetramercapto-4-thiaheptane, 4,7-bis(mercaptomethyl)-3,6, 9-Trithiaundecane-1,11-dithiol, 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 2 ,6-bis(mercaptomethyl)-3,5-dithiaheptane-1,7-dithiol, 3,5-bis(mercaptomethylthio)-2,6-dithiaheptane- 4-functional thioether-containing thiol compounds such as 1,7-dithiol; 1,2,9,10-tetramercapto-6-mercaptomethyl-4,7-dithiadecane, 1, 2,6,10,11-pentamercapto-4,8-dithiaundecane, 1,2,9,13,14-pentamercapto-6-mercaptomethyl-4,7,11-trithia Tetradecane, 1,2,6,10,14,15-hexamercapto-4,8,12-trithiaheptadecane and other polyfunctional thiol-containing thiol compounds with five functions or more.

The so-called amine-containing thiol compound means a thiol compound having an amine structure (preferably a secondary amine structure or a tertiary amine structure) (and may further have an ether structure or a thioether structure), for example, bis[4- (3-phenoxy-2-mercaptopropylamino)phenyl]methane, bis{4-[3-(4-methylphenoxy)-2-mercaptopropylamino]phenyl)methane, 1,4- Bifunctional amine-containing thiol compounds such as bis(3-phenoxy-2-mercaptopropylamino)benzene, etc.

The so-called alcohol-containing thiol compound means a thiol compound having a hydroxyl group (and may also have an ether structure or a thioether structure), for example, 1,3-dimercapto-2-propanol, 2,3-dimercapto- 2-functional alcohol-containing thioether compounds such as 1-propanol, 2,2-bis(mercaptomethyl)-1,3-propanediol; pentaerythritol tris(3-mercaptopropyl) ether, 3-mercapto-2, Trifunctional alcohol-containing thiol compounds such as 2-bis(mercaptomethyl)-1-propanol, etc.

The so-called carboxylic acid ester-containing thiol compound means a thiol compound having a carboxylic acid ester structure (and may also have an ether structure or a thioether structure), for example, bis(2-mercaptoethyl) succinate, o-benzene Bis(2-mercaptoethyl) dicarboxylate, bis(3-mercaptopropyl) phthalate, bis(4-mercaptobutyl) phthalate, ethylene glycol bis(mercaptoacetate) , Ethylene glycol bis(3-mercaptopropionate), ethylene glycol bis(4-mercaptobutyrate), propylene glycol bis(3-mercaptopropionate), propylene glycol bis(4-mercaptobutyrate), two Ethylene glycol bis(3-mercaptopropionate), diethylene glycol bis(4-mercaptobutyrate), tetraethylene glycol bis(3-mercaptopropionate), 1,4-butanediol bis( Mercaptoacetate), 1,4-butanediol bis(3-mercaptopropionate), 1,4-butanediol bis(4-mercaptobutyrate), 1,8-octanediol bis(3 -Mercaptopropionate), 1,8-octanediol bis(4-mercaptobutyrate), phthalic acid bis(1-mercaptoethyl) ester, phthalic acid bis(2-mercaptopropyl) Esters, bis(3-mercaptobutyl) phthalate, ethylene glycol bis(2-mercaptopropionate), ethylene glycol bis(3-mercaptobutyrate), propylene glycol bis(2-mercaptopropionic acid) Ester), propylene glycol bis(3-mercaptobutyrate), diethylene glycol bis(2-mercaptopropionate), diethylene glycol bis(3-mercaptobutyrate), tetraethylene glycol bis(2- Mercaptopropionate), 1,4-butanediol bis(2-mercaptopropionate), 1,4-butanediol bis(3-mercaptobutyrate), 1,8-octanediol bis(2 -Mercaptopropionate), 1,8-octanediol bis(3-mercaptobutyrate) and other bifunctional thiol compounds containing carboxylic acid ester structure; thiomalic acid bis(2-mercaptoethyl) Ester, trimethylolpropane tris (thioglycolate), trimethylolethane tris (thioglycolate), trimethylolpropane tris (3-mercaptopropionate), trimethylolethane Tris(3-mercaptopropionate), trimethylolpropane tris(4-mercaptobutyrate), trimethylolethane tris(4-mercaptobutyrate), glycerol tris(3-mercaptopropionate) ), glycerol tris (4-mercaptobutyrate), trimethylolpropane tris (2-mercaptopropionate), trimethylolethane tris (2-mercaptopropionate), trimethylolpropane tris (3-Mercaptobutyrate), Trimethylolethane Tris (3-Mercaptobutyrate), Triglyceride (2-Mercaptopropionate), Triglyceride (3-Mercaptobutyrate), etc. The thiol compound containing carboxylic acid ester structure; 2,3-dimercaptosuccinate bis(2-mercaptoethyl) ester, pentaerythritol tetra (mercaptoacetate), pentaerythritol tetra (3-mercaptopropionate), pentaerythritol Tetra(4-mercaptobutyrate), pentaerythritol tetra(2-mercaptopropionate), pentaerythritol tetra(3-mercaptobutyrate) and other 4-functional thiol compounds containing carboxylate structure; dipentaerythritol hexa( 3-mercaptopropionate), dipentaerythritol hexa(2-mercaptopropionate) and other pentafunctional or more multifunctional thiol compounds containing carboxylic acid ester structure.

The so-called thiol compound containing isocyanurate structure means the sulfur with the structure of isocyanuric acid (that is, 1,3,5-triazine-2,4,6(1H,3H,5H)-trione) Alcohol compounds (which may further have an ether structure or a thioether structure) are, for example, tris(3-mercaptopropyl) isocyanurate, tris(2-mercaptopropyl) isocyanurate, tris(2- Tri-functional thiol compounds containing isocyanurate structure such as mercaptoethyl) isocyanurate and tris(4-mercaptobutyl) isocyanurate.

The so-called thiol compound containing carboxylic acid ester structure and isocyanurate structure means a thiol compound having a carboxylic acid ester structure and an isocyanuric acid structure (and may further have an ether structure or a thioether structure), for example, three [2-(3-Mercaptopropanoxy)ethyl]isocyanurate, tris[2-(4-mercaptobutoxy)ethyl]isocyanurate, tris[2-(2- Mercaptopropionyloxy)ethyl]isocyanurate, tris[2-(3-mercaptobutyroxy)ethyl]isocyanurate and other trifunctional carboxylic acid ester structure isocyanuric acid Thiol compounds of ester structure, etc.

The so-called thiol compound containing glycoluril structure means a thiol compound having a glycoluril (ie tetrahydroimidazo[4,5-d]imidazole-2,5(1H,3H)-dione) structure, for example For example, 1,3-bis(2-mercaptoethyl) glycoluril, 1,3-bis(3-mercaptopropyl) glycoluril, 1,4-bis(2-mercaptoethyl) glycoluril, 1,4- Bis (3-mercaptopropyl) glycoluril, 1,6-bis(2-mercaptoethyl) glycoluril, 1,6-bis(3-mercaptopropyl) glycoluril and other bifunctional glycoluril structures Thiol compound; 1,3,4-tris (2-mercaptoethyl) glycoluril, 1,3,4-tris (3-mercaptopropyl) glycoluril, etc. tri-functional thiol compound containing glycoluril structure ; 1,3,4,6-Tetra (2-mercaptoethyl) glycoluril, 1,3,4,6-tetra(3-mercaptopropyl) glycoluril, etc. 4-functional thiol containing glycoluril structure Compound etc.

In one embodiment, from the viewpoint of further improving hydrolysis resistance, (B) the thiol compound is preferably a thiol compound that does not contain a carboxylic acid ester structure.

In one embodiment, the (B) thiol compound may be a thiol compound that is solid at 25°C, or may be a thiol compound that is liquid at 25°C, but when the resin composition is used as a sealant or adhesive , Preferably a thiol compound that is liquid at 25°C.

(B) The molecular weight of the thiol compound is not particularly limited, but is preferably 200 or more, more preferably 250 or more, still more preferably 300 or more, particularly preferably 350 or more. (B) The upper limit of the molecular weight of the thiol compound is not particularly limited, but it is preferably 1,500 or less, more preferably 1,000 or less, still more preferably 800 or less, particularly preferably 700 or less.

(B) The thiol equivalent of the thiol compound is not particularly limited, but it is preferably 1000 g/eq. or less, more preferably 500 g/eq. or less, still more preferably 300 g/eq. or less, and still more preferably 200 g/eq. eq. or less, particularly preferably 150g/eq. or less. (B) The lower limit of the thiol equivalent of the thiol compound is not particularly limited, but it is preferably 50 g/eq. or more, more preferably 70 g/eq. or more, still more preferably 90 g/eq. or more, and still more preferably 100 g /eq. or more, particularly preferably 110g/eq. or more. The thiol equivalent is the mass of the thiol compound per equivalent of the mercapto group.

The ratio of the total number of mercapto groups of (B) thiol compound to the total number of epoxy groups of (A) epoxy resin in the resin composition (mercapto group/epoxy group) is 0.1 or more, more preferably 0.3 or more, and still more preferably 0.5 or more, particularly preferably 0.8 or more. The upper limit of the ratio (mercapto group/epoxy group) of the total number of mercapto groups of the (B) thiol compound to the total number of epoxy groups of the (A) epoxy resin in the resin composition is preferably 2.0 or less, more preferably 1.5 or less, It is more preferably 1.2 or less, particularly preferably 1.0 or less.

The content of the (B) thiol compound in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass or less, It is more preferably 30% by mass or less, still more preferably 25% by mass or less, and particularly preferably 20% by mass or less. The lower limit of the content of the (B) thiol compound in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 0.1% by mass or more, more preferably 1% by mass or more , More preferably 2% by mass or more, still more preferably 5% by mass or more, and particularly preferably 7% by mass or more. In one embodiment, the content of (B) thiol compound can be set based on the content of (A) epoxy resin or epoxy equivalent.

The mass ratio of (B) thiol compound to (A) epoxy resin in the resin composition ((B) thiol compound/(A) epoxy resin) is not particularly limited, but it is preferably 0.1 or more, more It is preferably 0.15 or more, more preferably 0.2 or more, and particularly preferably 0.25 or more. The upper limit of the mass ratio of (B) thiol compound to (A) epoxy resin ((B) thiol compound/(A) epoxy resin) in the resin composition is not particularly limited, but is preferably 1.5 or less , More preferably 1 or less, still more preferably 0.7 or less, particularly preferably 0.5 or less.

＜(C) Magnetic powder＞ The resin composition of the present invention contains (C) magnetic powder. Since the resin composition of the present invention contains (C) magnetic powder, the specific permeability of the cured product can be increased.

(C) The magnetic powder may be any of soft magnetic powder and hard magnetic powder, but from the viewpoint of remarkably obtaining the effect of the present invention, soft magnetic powder is preferred.

Examples of (C) magnetic powder include Fe-Mn ferrite, Fe-Mn-Zn ferrite, Mg-Zn ferrite, Mn-Zn ferrite, and Mn-Mg ferrite. Ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, Ni-Zn-based ferrite, Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based iron Ferrite, Ba-Co ferrite, Ba-Ni-Co ferrite, Y ferrite, iron oxide powder (III), iron oxide powder such as ferroferric oxide; pure iron powder; Fe- Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Ni-Cr-based alloy powder, Fe-Cr-Al-based alloy powder, Fe- Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, or Fe-Ni-Co-based alloy powder, such as ferroalloy metal powder; Co-based Amorphous alloys such as amorphous. (C) Magnetic powder may be used singly, or two or more of them may be used in combination.

Among them, (C) the magnetic powder is preferably at least one selected from iron oxide powder and iron alloy metal powder. The iron oxide powder preferably contains a ferrite containing at least one element selected from the group consisting of Ni, Cu, Mn, and Zn, more preferably selected from the group consisting of Fe-Mn ferrite and Fe-Mn-Zn ferrite. At least one. In addition, as the iron alloy metal powder, it is preferable to include iron alloy metal powder containing at least one selected from Si, Cr, Al, Ni, and Co.

(C) A commercially available product can be used as the magnetic powder, or two or more types can be used in combination. Examples of commercially available magnetic powders that can be used include M series such as "M05S" and "M05SWD" manufactured by POWDER TECH; "MZ05" manufactured by POWDER TECH; and "PST-S" manufactured by Sanyo Special Steel Co., Ltd. ; "AW2-08", "AW2-08PF20F", "AW2-08PF10F", "AW2-08PF3F", "Fe-3.5Si-4.5CrPF20F", "Fe-50NiPF20F", "Fe-80Ni- 4MoPF20F"; "LD-M", "LD-MH", "KNI-106", "KNI-106GSM", "KNI-106GS", "KNI-109", "KNI-109GSM", " KNI-109GS"; "KNS-415", "BSF-547", "BSF-029", "BSN-125", "BSN-125", "BSN-714", "BSN-828" manufactured by Toda Kogyo Co., Ltd. ", "S-1281", "S-1641", "S-1651", "S-1470", "S-1511", "S-2430"; "JR09P2" manufactured by Japan Heavy Chemical Industry Co., Ltd.; CIK NANOTEK "Nanotek" manufactured by the company; "JEMK-S" and "JEMK-H" manufactured by KINSEI MATEC; "Yttria Iron Oxide" manufactured by ALDRICH, etc.

(C) The magnetic powder is preferably spherical. As the value of the length of the major axis divided by the length of the minor axis (aspect ratio) of the magnetic powder, it is preferably 2 or less, more preferably 1.5 or less, and still more preferably 1.2 or less. By using spherical magnetic powder, the magnetic loss can be reduced, and a resin composition with the desired better viscosity can be obtained.

(C) The average particle diameter of the magnetic powder is preferably 0.01 μm or more, more preferably 0.5 μm or more, and still more preferably 1 μm or more from the viewpoint of increasing the specific permeability. (C) The upper limit of the average particle size of the magnetic powder is preferably 10 μm or less, more preferably 9 μm or less, and still more preferably 8 μm or less.

(C) The average particle size of the magnetic powder can be measured by the laser diffraction and scattering method based on the Mie scattering theory. Specifically, a laser diffraction particle size distribution measuring device can be used to create the particle size distribution of the magnetic powder on a volume basis, and measure the median diameter as the average particle size. For the measurement sample, it is preferable to use a magnetic powder dispersed in water by ultrasonic waves. As a laser diffraction type particle size distribution measuring device, "LA-500" manufactured by Horiba Manufacturing Co., Ltd., "SALD-2200" manufactured by Shimadzu Manufacturing Co., Ltd., etc. can be used.

In one embodiment, based on the viewpoint of adjusting the viscosity of the resin composition to improve moisture resistance and dispersibility, (C) the magnetic powder may also be treated with a surface treatment agent. Examples of surface treatment agents include vinyl silane coupling agents, (meth)acrylic coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxy silane coupling agents, mercaptosilane coupling agents, silanes Coupling agent, alkoxysilane, organosilazane compound, titanate coupling agent, etc. A surface treatment agent may be used individually by 1 type, and may be used in combination of 2 or more types arbitrarily.

Examples of commercially available products as surface treatment agents include "KBM1003" (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and "KBM503" (3-methacryloxypropyltriethyl triethyl) manufactured by Shin-Etsu Chemical Co., Ltd. Oxysilane), "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical "KBE903" (3-aminopropyltriethoxysilane) manufactured by Kogyo Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd. "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and "KBM-4803" manufactured by Shin-Etsu Chemical Co., Ltd. (long-chain epoxy silane) Coupling agent), "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc.

The degree of surface treatment by the surface treatment agent is preferably limited to a specific range from the viewpoint of improving the dispersibility of the (C) magnetic powder. Specifically, (C) 100 parts by mass of the magnetic powder is preferably surface-treated with a surface treatment agent of 0.01 parts by mass to 5 parts by mass, preferably 0.05 parts by mass to 3 parts by mass, and more preferably 0.1 parts by mass Part~2 parts by mass for surface treatment.

(C) The content (vol%) of the magnetic powder, based on the viewpoints of increasing the specific permeability and reducing the loss coefficient, when the non-volatile content in the resin composition is set to 100% by volume, it is preferably 0.1% by volume or more, more It is preferably 1 vol% or more, more preferably 5 vol% or more, still more preferably 10 vol% or more, and particularly preferably 14 vol% or more. (C) The upper limit of the content (vol%) of the magnetic powder is not particularly limited. However, in one embodiment, based on the viewpoint of exerting the function as a paste-like magnetic adhesive, the non-volatile content in the resin composition is set to 100 In the case of volume %, it is preferably 85 volume% or less, more preferably 70 volume% or less, still more preferably 60 volume% or less, still more preferably 50 volume% or less, particularly preferably 40 volume% or less.

(C) The content (mass%) of the magnetic powder, based on the viewpoints of increasing the specific permeability and reducing the loss coefficient, when the non-volatile content in the resin composition is set to 100% by mass, it is preferably 5% by mass or more, more It is preferably 20% by mass or more, more preferably 30% by mass or more, still more preferably 35% by mass or more, and particularly preferably 40% by mass or more. (C) The upper limit of the content (% by mass) of the magnetic powder is not particularly limited, but in one embodiment, based on the viewpoint of exerting the function as a magnetic adhesive in the form of a paste, the non-volatile content in the resin composition is set to 100 In mass %, it is preferably 90% by mass or less, more preferably 85% by mass or less, still more preferably 80% by mass or less, still more preferably 77% by mass or less, particularly preferably 75% by mass or less.

＜(D) Stabilizer＞ The resin composition of the present invention may include (D) stabilizer as an optional component. (D) The stabilizer has the function of improving the storage stability of the resin composition (especially the one-component resin composition).

Examples of (D) stabilizers include borate compounds, titanate compounds, aluminate compounds, zirconate compounds, isocyanate compounds, carboxylic acids, and carboxylic anhydrides. (D) The stabilizer may be used alone or in combination of two or more in any ratio.

Examples of borate compounds include, for example, trimethyl borate, triethyl borate, tripropyl borate, triisopropyl borate, tributyl borate, tripentyl borate, trihexyl borate, tricyclohexyl borate, Tris(2-ethylhexyl) borate, trioctyl borate, trinonyl borate, tridecyl borate, tri-dodecyl borate, trihexadecyl borate, trioctadecyl borate, etc. Trialkyl borate; Trienyl borate; Triphenyl borate, Tris(2-methylphenyl) borate, Tris(3-methylphenyl) borate, Trienyl borate, etc. (4-methylphenyl) ester, tris(2-ethylphenyl) borate, tris(3-ethylphenyl) borate, tris(4-ethylphenyl) borate, tris(3 ,5-Dimethylphenyl) ester, triaryl borate such as tris(2,4-dimethylphenyl) borate; triarylalkyl borate such as tribenzyl borate; triethanolamine borate, etc. Amino borate and so on.

Examples of the titanate compound include tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetrabutyl titanate, tetraoctyl titanate, and the like.

Examples of the aluminate compound include triethyl aluminate, tripropyl aluminate, triisopropyl aluminate, tributyl aluminate, trioctyl aluminate, and the like.

Examples of the zirconate compound include tetraethyl zirconate, tetrapropyl zirconate, tetraisopropyl zirconate, and tetrabutyl zirconate.

Examples of isocyanate compounds include, for example, n-butyl isocyanate, isopropyl isocyanate, 2-chloroethyl isocyanate, phenyl isocyanate, p-chlorophenyl isocyanate, benzyl isocyanate, Hexamethylene diisocyanate, 2-ethylphenyl isocyanate, 2,6-dimethylphenyl isocyanate, toluene diisocyanate (e.g. 2,4-toluene diisocyanate, 2,6-toluene diisocyanate ), 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, toluidine diisocyanate, isophorone diisocyanate, xylene diisocyanate, p-phenylene diisocyanate, dicycloheptane Triisocyanate and so on.

Examples of carboxylic acids include saturated aliphatic monoacids such as formic acid, acetic acid, propionic acid, butyric acid, caproic acid, and caprylic acid; unsaturated aliphatic monoacids such as acrylic acid, methacrylic acid, and crotonic acid; glycolic acid, lactic acid, etc. Monobasic oxyacids; aliphatic aldehydes such as glyoxalic acid and glucic acid; aliphatic polybasic acids such as oxalic acid, malonic acid, succinic acid, and maleic acid; benzoic acid, p-toluic acid, benzene Aromatic monoacids such as acetic acid, cinnamic acid and mandelic acid; aromatic polybasic acids such as phthalic acid and trimellitic acid; halogenated fatty acids such as monochloroacetic acid and dichloroacetic acid.

Examples of carboxylic acid anhydrides include aliphatic polybasic acid anhydrides such as succinic anhydride, dodecenyl succinic anhydride, maleic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, etc., phthalic anhydride, etc. Aromatic polybasic acid anhydrides such as acid anhydride, trimellitic anhydride, pyromellitic anhydride, etc.

The content of (D) stabilizer in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 1% by mass or less, more preferably 0.5% by mass or less, and More preferably, it is 0.3% by mass or less. The lower limit of the (D) stabilizer content in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it can be, for example, 0% by mass or more, preferably 0.001% by mass or more. It is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and still more preferably 0.1% by mass or more.

＜(E) Dispersant＞ The resin composition of the present invention may contain (E) a dispersant as an optional component.

Examples of (E) dispersants include phosphate ester-based dispersants such as polyoxyethylene alkyl ether phosphoric acid; polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan fatty acid esters, and polyoxyethylene sorbitan fatty acid esters. Polyoxyalkylene-based dispersants such as oxyethylene alkyl phenyl ether, polyoxyethylene alkyl amine, polyoxyethylene alkyl amide, etc.; acetylene-based dispersants such as acetylene glycol; polyether modified polydimethyl siloxane Silicone-based dispersants for oxane, polyether modified siloxane, polyester modified polydimethylsiloxane, etc.; sodium polyacrylate, sodium dodecylbenzene sulfonate, sodium laurate, polyoxyethylene Anionic dispersants for alkyl ether ammonium sulfate, sodium carboxymethyl cellulose, etc.; cationic dispersants for polyacrylate resins containing amino groups, polystyrene resins containing amino groups, etc. (E) A dispersant may be used individually by 1 type, or may use 2 or more types together.

Examples of commercially available products of the phosphate-based dispersant include "RS-410", "RS-610", and "RS-710" of the "PHOSPHANOL" series manufactured by Toho Chemical Industry Co., Ltd.

Examples of commercially available products as polyoxyalkylene-based dispersants are the "MALIALIM" series "AKM-0531", "AFB-1521", "SC-0505K", "SC-1015F" and "SC-0708A" manufactured by NOF Corporation "And "HKM-50A" etc.

Examples of commercially available products of acetylene glycol include "82", "104", "440", "465" and "485" of the "SURFYNOL" series manufactured by Air Products and Chemicals Inc., and "OLEFIN Y".

Examples of commercially available silica-based dispersants include "BYK347" and "BYK348" manufactured by BYK CHEMIE.

Examples of commercially available products as anionic dispersants are "PN-411" and "PA-111" manufactured by Ajinomoto Precision Technology Co., Ltd.; "A-550" and "PS-1900" manufactured by LION Corporation.

Examples of commercially available products as cationic dispersants are "161", "162", "164", "182", "2000", and "2001" manufactured by BYK CHEMIE; "PB-821" manufactured by Ajinomoto Precision Technology Co., Ltd. ", "PB-822", "PB-824"; Japanese ISP company "V-216", "V-220"; LUBRIZOL company "SOLSPERSE 13940", "SOLSPERSE 24000", "SOLSPERSE 32000", etc.

The content of the (E) dispersant in the resin composition is not particularly limited. When the non-volatile content in the resin composition is 100% by mass, it is preferably 1% by mass or less, more preferably 0.7% by mass or less, It is more preferably 0.5% by mass or less. The lower limit of the content of the (E) dispersant in the resin composition is not particularly limited. When the non-volatile content in the resin composition is 100% by mass, for example, 0% by mass or more, 0.001% by mass or more, or 0.01% by mass % Or more, preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and still more preferably 0.2% by mass or more.

＜(F) Hardening accelerator＞ The resin composition of the present invention may contain (F) a hardening accelerator as an optional component.

(F) As the hardening accelerator, a latent hardening accelerator is preferably used. The latent hardening accelerator is an important component especially when it is a one-component resin composition. It does not contribute to the hardening of (A) epoxy resin at room temperature (25°C) but promotes the hardening of (A) epoxy resin when heated. The function. (F) A hardening accelerator may be used individually by 1 type, and may be used in combination of 2 or more types at arbitrary ratios.

The latent hardening accelerator may be a liquid latent hardening accelerator, or a solid dispersion type latent hardening accelerator, more preferably a solid dispersion type latent hardening accelerator.

The so-called liquid latent hardening accelerator is a compound that is soluble in epoxy resin at room temperature (25°C) and can function as a hardening accelerator of epoxy resin by heating. Examples of liquid latent hardening accelerators include ionic liquids, but they are not limited to them.

Examples of cations constituting the ionic liquid include imidazolium ions, piperidinium ions, pyrrolidinium ions, pyrazolium ions, guanidinium ions, pyridinium ions, and such hydrocarbon groups (alkyl, phenyl, etc.) Combinations, etc.) Ammonium-based cations such as substituents; Phosphonium-based cations such as tetraalkylphosphonium ions; Phosphonium-based cations such as trialkylphosphonium ions, etc.

Examples of anions constituting the ionic liquid include halide anions such as fluoride ion, chloride ion, bromide ion, and iodide ion; alkylsulfuric acid anion such as methanesulfonate ion; trifluoromethanesulfonate ion, hexafluoromethane Phosphonic acid ion, trifluorotris(pentafluoroethyl)phosphonic acid ion, bis(trifluoromethanesulfonyl)imide ion, trifluoroacetic acid ion, tetrafluoroborate ion and other fluorine-containing compound anions; phenol ion, Phenolic anions such as 2-methoxyphenol ion and 2,6-di-tert-butylphenol ion; acidic amino acid ions such as aspartic acid ion and melanine ion; glycine ion and alanine ion , Phenylalanine ion and other neutral amino acid ions; N-phenylalanine ion, N-acetyl phenylalanine ion, N-acetylglycine ion, N-acetyl glycine ion N-amino acid ions such as glycine ion; carboxylic acid anions such as formic acid ion, lactic acid ion, tartrate ion, hippuric acid ion, N-methyl hippuric acid ion, and benzoic acid ion.

The so-called solid dispersion type latent hardening accelerator is a solid that is insoluble in epoxy resin at room temperature (25°C), and is soluble in epoxy resin by heating, and is a compound that functions as a hardening accelerator of epoxy resin.

Examples of the solid dispersion type latent hardening accelerator include, for example, imidazole compounds that are solid at room temperature (25° C.) and solid dispersion type amine adduct type latent hardening accelerators, but are not limited to these.

Examples of imidazole compounds that are solid at room temperature (25°C) include 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-[2-(2-methyl -1-imidazolyl)ethyl]-1,3,5-triazine, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3 ,5-Triazine. Isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl -2-Methylimidazole-tricarboxylate, 1-cyanoethyl-2-phenylimidazole-tricarboxylate, N-(2-methylimidazolyl-1-ethyl)urea, etc., But it is not limited to this.

Preferred examples of the solid dispersion type amine adduct series latent hardening accelerator are selected from epoxy adducts of amine compounds, urea adducts of amine compounds, and hydroxyl addition reaction to epoxy adducts At least one of the group of compounds obtained from the isocyanate compound.

Examples of epoxy compounds used as one of the raw materials for the production of epoxy adducts of amine compounds are, for example, polyphenols such as bisphenol A, bisphenol F, catechol, resorcinol, or glycerin Or polyglycidyl ether obtained by reacting polyol of polyethylene glycol and epichlorohydrin; such as glycidyl ether ester obtained by reacting hydroxycarboxylic acid of p-hydroxybenzoic acid and β-hydroxynaphthoic acid with epichlorohydrin; such as o- Polyglycidyl ester obtained by reaction of polycarboxylic acid of phthalic acid and terephthalic acid with epichlorohydrin; obtained by reaction of 4,4'-diaminodiphenylmethane or meta-aminophenol with epichlorohydrin Glycidylamine compound; epoxidized phenol novolak resin, epoxidized cresol novolak resin, epoxidized polyolefin and other multifunctional epoxy compounds or butyl glycidyl ether, phenyl glycidyl ether, glycidyl methacrylate Monofunctional epoxy compounds such as esters; etc., but not limited to these.

An example of an amine compound used as a raw material for the production of a solid dispersion type amine adduct-based latent hardening accelerator, as long as it has at least one active hydrogen in the molecule that can react with epoxy groups and at least one in the molecule More than one functional group may be selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group. As the amine compound, for example, diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane Aliphatic amines, such as 4,4'-diaminodiphenylmethane, 2-methylaniline and other aromatic amine compounds; such as 2-ethyl-4-methylimidazole, 2-ethyl-4 -Nitrogen-containing heterocyclic compounds such as methylimidazoline, 2,4-dimethylimidazoline, piperidine, and piperazine, but are not limited to these.

In addition, compounds having tertiary amine groups in the molecule are the raw materials for imparting latent hardening accelerators with excellent hardening promoting ability. Examples of these compounds include dimethylaminopropylamine and diethylamino groups. Propylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, N-methylpiperazine and other amine compounds, and such as 2-methylimidazole, 2-ethyl Imidazole compounds such as 2-ethyl-4-methylimidazole, 2-phenylimidazole, etc., have first- or second-level amines with tertiary amino groups in the molecule; such as 2-dimethylaminoethanol, 1 -Methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol Ethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole , 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-ethyl-4-methylimidazoline , 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidazoline, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazoline, 2-( Dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercapto Pyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethylaminobenzoic acid, N,N-dimethylglycine, Nicotinic acid, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazine, N,N-dimethyl propionate hydrazine, nicotinic acid hydrazine, isonicotinic acid hydrazine, etc. Alcohols with tertiary amino groups in the molecule, phenols, mercaptans, carboxylic acids and hydrazines, etc.

When an epoxy compound and an amine compound are added to produce a latent hardening accelerator, it is also possible to further react an active hydrogen compound having two or more active hydrogens in the molecule. Examples of these active hydrogen compounds are, for example, bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol (pyrogallol), phenol novolac resin, etc. Polyols such as phenols and trimethylolpropane, polycarboxylic acids such as adipic acid and phthalic acid, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-thio-3-benzene Oxy-2-propanol, thioglycolic acid, aminobenzoic acid, lactic acid, etc., but not limited to these.

The isocyanate compound used as the raw material of the solid dispersion type amine adduct series latent hardening accelerator can be used, for example, n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate, etc. The monofunctional isocyanate compound; hexamethylene diisocyanate, toluene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylene diisocyanate, Polyfunctional isocyanate compounds such as p-phenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, and bicycloheptane triisocyanate; furthermore, the terminal obtained by reacting these polyfunctional isocyanate compounds with active hydrogen compounds can be used Compounds containing isocyanate groups, etc. Examples of the compounds having isocyanate groups at the ends are an addition compound having an isocyanate group at the end obtained by reacting toluene diisocyanate with trimethylolpropane, and an isocyanate group at the end obtained by reacting toluene diisocyanate with pentaerythritol. The addition compound is not limited to these.

In addition, examples of urea compounds used as raw materials for the production of solid dispersion type amine adduct-based latent hardening accelerators are urea and thiourea, but are not limited to these.

The solid dispersion type latent hardening accelerator can be prepared by appropriately mixing the above-mentioned manufacturing materials, reacting at room temperature to 200°C, cooling and solidifying and then pulverizing, or in solvents such as methyl ethyl ketone, dioxane, tetrahydrofuran, etc. After the middle reaction and solvent removal, the solid content is pulverized and easily obtained.

Examples of commercially available solid dispersion type amine adduct-based latent hardening accelerators are, for example, "AMICURE PN-FJ" (manufactured by Ajinomoto Precision Technology Co., Ltd.) and "AMICURE PN-23" (manufactured by Ajinomoto Precision Technology Co., Ltd.) ), "AMICURE PN-H" (manufactured by Ajinomoto Precision Technology Co., Ltd.), "HARDNER X-3661S" (manufactured by ACR Corporation), "HARDNER X-3670S" (manufactured by ACR Corporation), "FXR1081" (manufactured by T&K TOKA Corporation) ), "FUJICURE FXR-1000" (manufactured by T&K TOKA), "FUJICURE FXR-1030" (manufactured by T&K TOKA), "NOVACURE HX-3721" (manufactured by Asahi Kasei Corporation), "HX-3722" (manufactured by Asahi Kasei Corporation) , "NOVACURE HX-3742" (manufactured by Asahi Kasei Corporation), etc.

The content of (F) hardening accelerator in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 20% by mass or less, more preferably 10% by mass or less , And more preferably 7 mass% or less. The lower limit of the content of (F) hardening accelerator in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, for example, it can be 0% by mass or more, 0.01% by mass or more, or 0.1 Mass% or more, preferably 0.5 mass% or more, more preferably 1 mass% or more, and still more preferably 2 mass% or more.

＜(G)Organic filler＞ The resin composition of the present invention may further include (G) an organic filler as an optional component.

(G) The organic filler is present in the resin composition in the form of particles. As the (G) organic filler, rubber particles are preferably used from the viewpoint of remarkably obtaining the desired effect of the present invention. (G) The organic filler may be used alone or in combination of two or more in any ratio.

Examples of rubber components contained in rubber particles include silicone elastomers such as polydimethylsiloxane; polybutadiene, polyisoprene, polychloroprene, and ethylene-vinyl acetate copolymers. , Styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene Copolymers, ethylene-propylene-diene terpolymers, ethylene-propylene-butene terpolymers and other olefin-based thermoplastic elastomers; poly(meth)acrylate, poly(butyl)acrylate, Acrylic thermoplastic elastomers such as polycyclohexyl (meth)acrylate and polyoctyl (meth)acrylate, etc. Furthermore, silicone rubber such as polyorganosiloxane rubber may be mixed with the rubber component. The glass transition temperature of the rubber component contained in the rubber particles is, for example, 0°C or lower, preferably -10°C or lower, more preferably -20°C or lower, and still more preferably -30°C or lower.

From the viewpoint of remarkably obtaining the desired effect of the present invention, the (G) organic filler is preferably core-shell rubber particles. The so-called core-shell type rubber particles are particulate organic fillers composed of core particles containing the rubber components exemplified above and one or more shells covering them. Furthermore, the core-shell type particles are preferably composed of a core particle containing the rubber component as exemplified above and a shell part of which the monomer component copolymerizable with the rubber component contained in the core particle is grafted and copolymerized. Core-shell type graft copolymer rubber particles. The so-called core-shell type here does not only mean that only the core particle and the shell part must be clearly distinguishable, but also include those where the boundary between the core particle and the shell part is not clear, and it can also mean that the core particle is not completely covered by the shell part.

The rubber component is preferably contained in the core-shell rubber particles by 40% by mass or more, more preferably by 50% by mass or more, and still more preferably by 60% by mass or more. The upper limit of the content of the rubber component in the core-shell rubber particles is not particularly limited, but based on the viewpoint that the shell portion sufficiently covers the core particles, it is, for example, 95% by mass or less, preferably 90% by mass.

The monomer components forming the shell part of the core-shell rubber particles include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, ( (Meth)acrylates such as octyl meth)acrylate and glycidyl (meth)acrylate; (meth)acrylic acid; N-methylmaleimide, N-phenylmaleimide, etc. N-substituted maleimines; maleimines; α, β-unsaturated carboxylic acids such as maleic acid and itaconic acid; styrene, 4-vinyl toluene, α-methylstyrene, etc. The aromatic vinyl compound; (meth)acrylonitrile, etc., which preferably contains (meth)acrylate, and more preferably contains methyl (meth)acrylate.

Examples of commercially available products as core-shell rubber particles are "CHT" manufactured by CHEIL INDUSTRIES; "B602" manufactured by UMGABS; "PARALOID EXL-2602" and "PARALOID EXL-2603" manufactured by Dow Chemical Japan , "PARALOID EXL-2655", "PARALOID EXL-2311", "PARALOID-EXL2313", "PARALOID EXL-2315", "PARALOID KM-330", "PARALOID KM-336P", "PARALOID KCZ-201", Mitsubishi "METABLEN C-223A", "METABLEN E-901", "METABLEN S-2001", "METABLEN W-450A", "METABLEN SRK-200", and "KANEACE M-511" made by KANEKA , "KANEACE M-600", "KANEACE M-400", "KANEACE M-580", "KANEACE MR-01", etc.

(G) The organic filler can also be a dispersion in (A) epoxy resin. (G) Dispersion in (A) epoxy resin of organic filler, (G) organic filler can be dispersed in the state of primary particles in (A) epoxy resin. (G) In the dispersion in (A) epoxy resin of organic filler, the content of (G) organic filler is preferably 10-40% by weight.

As a commercially available product of the dispersion in (A) epoxy resin of (G) organic filler, for example, NANEACE manufactured by KANEKA is sold as a rubber-like core-shell polymer modified bisphenol A epoxy resin. MX120", "MX125", "MX130" (containing 25% by weight of rubber-like core-shell polymer (rubber particle shell is styrene-butadiene copolymer)), "MX960", "MX965" (containing 25% by weight It is a rubber-like core-shell polymer made of silicone rubber (rubber particle core is polydimethylsiloxane, etc.), "RKB-3040" manufactured by KUREHA TRADING (containing 29% by weight of rubber-like core-shell Polymer (Rubber particle core is butadiene rubber), "RKB-3040H" (containing 25% by weight of rubber-like core-shell polymer (Rubber particle core is butadiene rubber)), etc.

(G) The average particle diameter (average primary particle diameter) of the organic filler is not particularly limited, but is preferably 20 nm or more, more preferably 30 nm or more, and still more preferably 50 nm or more. (G) The upper limit of the average particle diameter (average primary particle diameter) of the organic filler is not particularly limited, but it is preferably 5,000 nm or less, more preferably 2,000 nm or less, and still more preferably 1,000 nm or less. (G) The average particle size (average primary particle size) of the organic filler can be measured using a zeta potential particle size distribution measuring device or the like.

The content of (G) organic filler in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, it is preferably 20% by mass or less, more preferably 10% by mass or less , And more preferably 5% by mass or less. The lower limit of the content of (G) organic filler in the resin composition is not particularly limited, but when the non-volatile content in the resin composition is 100% by mass, for example, it can be 0% by mass or more, 0.01% by mass or more, or 0.1 Mass% or more, 1 mass% or more, 1.5 mass% or more.

＜(H) Other additives＞ The resin composition of the present invention may further contain optional additives as non-volatile components. Examples of such additives include, for example, phenolic hardeners, naphthol hardeners, acid anhydride hardeners, active ester hardeners, benzoxazine hardeners, cyanate ester hardeners, carbodiimide hardeners Hardeners other than thiol compounds such as hardeners and imidazole hardeners; phenoxy resins, polyvinyl acetal resins, polyolefin resins, polyether resins, polyether sulfide resins, polyphenylene ether resins, and polycarbonates Thermoplastic resins such as resins, polyetheretherketone resins, polyester resins; organic copper compounds, organic zinc compounds, organic cobalt compounds, and other organic metal compounds; phthalocyanine blue, phthalocyanine green, iodo green, diazonium yellow, crystal violet, Coloring agents for titanium oxide, carbon black, etc.; polymerization inhibitors for hydroquinone, catechol, biphenyl, phenothiazine, etc.; leveling agents for silicones, etc.; increase of bentonite, montmorillonite, etc. Adhesives; defoamers of silicone defoamers, acrylic defoamers, fluorine defoamers, and vinyl resin defoamers; UV absorbers such as benzotriazole UV absorbers; urea silane Adhesion enhancers such as silane coupling agents, triazole-based adhesion-imparting agents, tetrazole-based adhesion-imparting agents, triazine-based adhesion-imparting agents, etc.; hindered phenol-based antioxidants , Hindered amine-based antioxidants, etc.; fluorescent whitening agents such as diphenylethylene derivatives; fluorine-based surfactants, silicone-based surfactants, and other surfactants; phosphorus-based flame retardants (such as Phosphate ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g. melamine sulfate), halogen-based flame retardants, inorganic flame retardants (e.g. antimony trioxide), etc. Wait. An additive may be used individually by 1 type, and may combine 2 or more types in arbitrary ratios. (H) The content of other additives can be appropriately set if they are familiar with the art.

＜(I) Organic solvent＞ In addition to the above-mentioned non-volatile components, the resin composition of the present invention may further contain any organic solvent as a volatile component. (I) As long as the organic solvent can dissolve at least a part of the non-volatile components, conventional ones can be suitably used, and the type is not particularly limited. Examples of (I) organic solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, acetic acid Ester solvents such as isoamyl ester, methyl propionate, ethyl propionate, γ-butyrolactone; tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl Ether solvents such as ether and diphenyl ether; alcohol solvents such as methanol, ethanol, propanol, butanol, ethylene glycol, etc.; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene two Alcohol monoethyl ether acetate, ethylene glycol acetate, γ-butyrolactone, methyl methoxypropionate and other ether ester solvents; methyl lactate, ethyl lactate, methyl 2-hydroxyisobutyrate Ester alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butyl carbitol), etc. Ether alcohol solvents; N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and other amide solvents; dimethyl sulfide, etc. Subsoil solvents; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, methylcyclohexane, etc.; benzene, toluene, xylene, ethylbenzene , Aromatic hydrocarbon solvents such as trimethylbenzene, etc. (I) An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more types in arbitrary ratios. When (I) an organic solvent is used, one type may be used alone, or two or more types may be used in combination at any ratio. (I) The smaller the amount of organic solvent, the better (for example, when the non-volatile content in the resin composition is 100% by mass, it is 3% by mass or less, 1% by mass or less, 0.5% by mass or less, 0.1% by mass or less, 0.01 Mass% or less), particularly preferably not containing (0 mass%).

＜Manufacturing method of resin composition＞ The resin composition of the present invention can be prepared by, for example, mixing (A) epoxy resin, (B) thiol compound, (C) magnetic powder, (D) stabilizer as required, and as required (E) Dispersant, (F) hardening accelerator as required, (G) organic filler as required, (H) other additives as required, and (I) organic solvent as required, in any order and/ Or part or all of them are added and mixed at the same time to manufacture. In addition, in the process of adding and mixing each component, the temperature may be appropriately set, and heating and/or cooling may be temporarily or continuously. And during the process of adding and mixing the ingredients, stirring or shaking can also be carried out. In addition, during or after the addition and mixing, a stirring device or an oscillating device such as a mixing base may be used to stir or oscillate the resin composition to uniformly disperse it. In addition, while stirring or shaking, degassing can also be performed under low-pressure conditions such as vacuum. The mixing temperature may be 10-40°C, for example. The stirring speed during mixing can be, for example, 100 to 10000 rpm. The mixing time can be, for example, 10 seconds to 10 minutes.

＜Characteristics of resin composition＞ Since the resin composition of the present invention contains (A) epoxy resin, (B) thiol compound and (C) magnetic powder, the elastic modulus of the cured resin composition at 25°C is 500 MPa or less, and the resin composition The elongation at the breaking point of the cured product at 25°C is more than 30%, so a cured product with excellent impact resistance can be obtained. The impact resistance can be evaluated by the method of Test Example 5 below, for example.

The elastic modulus of the cured resin composition of the present invention at 25°C is 500 MPa or less. In one embodiment, based on the viewpoint of further improving impact resistance, the elastic modulus of the cured resin composition of the present invention at 25° C. is preferably 450 MPa or less, 400 MPa or less, more preferably 350 MPa or less, 300 MPa or less, and It is more preferably 250 MPa or less and 200 MPa or less, and particularly preferably 150 MPa or less and 100 MPa or less. The modulus of elasticity can be measured, for example, by the method of Test Example 1 below. In addition, the elastic modulus can be controlled to a desired elastic modulus by changing the selection or content of the compounding ingredients.

The elongation at the breaking point of the cured product of the resin composition of the present invention at 25° C. is 30% or more. In one embodiment, based on the viewpoint of further improving impact resistance, the elongation at break of the cured product of the resin composition of the present invention at 25°C is preferably 35% or more, 40% or more, and more preferably 45% or more. More than 50%, more preferably more than 55%, more than 60%, particularly preferably more than 65%, more than 70%. The elongation at the breaking point can be measured, for example, by the method of Test Example 2 below. In addition, the elongation at the breaking point can be controlled to the desired elongation at the breaking point by changing the selection of ingredients or their contents.

In one embodiment, the specific permeability (μ') of the cured product of the resin composition of the present invention at 23°C (measurement frequency 100MHz) may preferably be 1 or more, more preferably 1.3 or more, and still more preferably 1.6 or more, Particularly preferably, it is 2 or more. The specific permeability can be measured, for example, by the method of Test Example 3 below.

In one embodiment, the viscosity of the resin composition of the present invention at 25°C is not particularly limited, but it may preferably be 0.001 Pa·s or more, more preferably 0.01 Pa·s or more, and still more preferably 0.1 Pa·s or more , More preferably 1Pa·s or more, particularly preferably 10Pa·s or more. The lower limit of the viscosity of the resin composition of the present invention at 25°C is not particularly limited, but it is preferably 1000 Pa·s or more, more preferably 500 Pa·s or more, still more preferably 100 Pa·s or more, and particularly preferably 50 Pa·s s above. The viscosity can be measured by the method of Test Example 4 below, for example.

The peak temperature of the reaction based on differential scanning calorimetry is preferably 150°C or less, 140°C or less, more preferably 130°C or less, 120°C or less, still more preferably 110°C or less, 100°C or less, particularly preferably 95°C or less, Below 90℃, below 85℃ or below 80℃. With this range, since the resin composition can be cured at a relatively low temperature, the decrease in magnetic force can be suppressed. The lower limit of the reaction peak temperature may be, for example, 50°C or higher. Here, the reaction peak temperature based on differential scanning calorimetry means the position of the differential scanning calorimetry curve (DSC curve) obtained when performing differential scanning calorimetry at a temperature rise rate of 5°C/min in the temperature range of 25°C to 300°C The temperature at the top of the peak measured at the lowest temperature.

The curing temperature of the resin composition of the present invention may be set at a temperature judged to allow the curing reaction to proceed sufficiently with reference to the reaction start temperature or the reaction peak temperature of the resin composition based on differential scanning calorimetry (DSC), for example. In one embodiment, since the resin composition of the present invention can be cured at a relatively low temperature, the curing temperature of the resin composition of the present invention can be, for example, 180°C or less, preferably 150°C or less, 140°C or less, more preferably 130°C Below, 120°C or less, more preferably 110°C or less, 100°C or less, and particularly preferably 95°C or less and 90°C or less. In order to further suppress the decrease in magnetic force, the hardening temperature is preferably a low temperature. As the lower limit of the curing temperature, for example, 50°C or higher, 60°C or higher, 70°C or higher, etc. are mentioned. At the above-mentioned curing temperature, the curing time can be set to, for example, 10 minutes or more, 20 minutes or more. The upper limit of the hardening time can be set to 60 minutes or less.

＜Use of resin composition＞ The resin composition of the present invention can be used in various semiconductor devices (such as electrical products (such as computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical equipment, televisions, etc.) and vehicles (such as motorcycles). , Automobiles, trams, ships, airplanes, etc.), etc.), etc.), for example, can be suitably used as adhesives, injection molding agents, caulking agents; sealants, fiber-reinforced resins, coating agents, paints, etc., Among them, it is particularly suitable for use as an adhesive or a sealant.

In particular, since the resin composition of the present invention can suppress the magnetic loss of the magnet, it can be suitably used for electronic parts equipped with magnets, for example, suitable for the application of bonding a magnet as a bonded body (especially as a magnet for bonded body The use of bonding with other components); the use of bonding components other than magnets (especially the use of bonding components other than the magnets to be bonded); in the bonding step of electronic parts after the parts containing magnets are mounted The purpose, etc.

The magnet here is not particularly limited, but it may be a conventional permanent magnet such as a ferrite magnet, an alnico magnet, a rare earth magnet (especially a rubidium magnet) and the like. Moreover, it is known that rubidium magnets shrink when heated, and expand when cooled. However, in one embodiment, the resin composition of the present invention has excellent adhesion to rubidium magnets, so it is particularly suitable for Adhesive for rubidium magnets.

The electronic component equipped with the magnet may be, for example, an electronic component including a motor, especially a motor including a rubidium magnet. The resin composition of the present invention can be used as an adhesive for electronic parts equipped with a motor containing a rubidium magnet, especially an adhesive for bonding a magnet in a motor containing a rubidium magnet to the frame.

The resin composition of the present invention is used due to the final curing. Therefore, electronic parts using the resin composition of the present invention may include the cured product of the resin composition of the present invention. In a specific embodiment, it may include a motor containing a rubidium magnet and The cured product of the resin composition of the present invention. In addition, a motor containing a rubidium magnet using the resin composition of the present invention may include a hardened product of the resin composition of the present invention. [Example]

The following examples illustrate the present invention in detail. The present invention is not limited to these embodiments. In addition, in the following, the "parts" and "%" that indicate the quantity, unless otherwise specified, mean "parts by mass" and "% by mass" respectively. Especially when there is no specified temperature, the temperature condition is room temperature (25°C).

First, each component was mixed with the compounding composition of Table 1 shown below, and the resin composition of Examples 1-11 and Comparative Examples 1-4 was prepared. The details are as follows.

<Example 1> In a special plastic container, measure 60 parts of epoxy resin containing a flexible skeleton ("EXA-4850-150" manufactured by DIC Corporation, epoxy equivalent 450g/eq), and the dispersion of butadiene rubber particles in the epoxy resin (KUREHA TRADING "RKB-3040H", dispersed 25% of bisphenol A type/F type epoxy resin (rubber-like core-shell polymer (core is butadiene rubber)), epoxy equivalent 223g/eq) 40 Parts, thiol compound containing carboxylic acid ester structure ("TMTP" manufactured by Yodo Chemical Industry Co., Ltd., trimethylolpropane tris(3-mercaptopropionate), thiol equivalent 140g/eq) 39 parts, magnetic powder ( "M05SWD" manufactured by POWDER TECH) 110 parts, stabilizer ("TEB" manufactured by Tokyo Kasei Co., Ltd., triethyl borate) 0.8 parts, dispersant ("SC-1015F" manufactured by NOF Corporation) 1.1 parts, amine epoxy Adduct series hardening accelerator ("PN-FJ" manufactured by Ajinomoto Precision Technology Co., Ltd.) each of 14 parts.

Then use the rotation and revolution mixer AWATORY Nentaro (manufactured by THINKY; ARE-310), and mix thoroughly at room temperature 25°C at 2000 rpm (use a spoon to confirm that the magnetic powder is fully dispersed and mixed. The mixing time is about 30 seconds to about 1 minute) , And then use the automatic revolution type stirring and degassing machine "HM-200W" manufactured by Kyoritsu Seiki Co., Ltd. to degas under vacuum (set to pressure 0), 1000 rpm, and 2 minutes to defoam to obtain a resin composition.

<Example 2> In addition to replacing 60 parts of epoxy resin with flexible skeleton ("EXA-4850-150" manufactured by DIC), epoxy resin with flexible skeleton ("YX-7400" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 440g) is used /eq) 60 parts of thiol compound containing carboxylic acid ester structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.) changed from 39 parts to 40 parts. Magnetic powder (“M05SWD” manufactured by POWDER TECH Co., Ltd.) Except having changed the usage amount from 110 parts to 120 parts, a resin composition was obtained in the same manner as in Example 1.

<Example 3> Except that the use amount of epoxy resin with flexible skeleton ("EXA-4850-150" manufactured by DIC Corporation) was changed from 60 parts to 100 parts, butadiene rubber particles epoxy resin dispersion (manufactured by KUREHA TRADING) was not used. "RKB-3040H") 40 parts, the use amount of thiol compound containing carboxylate structure ("TMTP" manufactured by Yodo Chemical Industry Co., Ltd.) changed from 39 parts to 28 parts, magnetic powder ("M05SWD" manufactured by POWDER TECH Co., Ltd.) Except that the usage amount of) was changed from 110 parts to 105 parts, a resin composition was obtained in the same manner as in Example 1.

<Example 4> A resin composition was obtained in the same manner as in Example 1, except that 110 parts of magnetic powder (“AW2-08PF3F” produced by EPSON ATMIX) were used instead of 110 parts of magnetic powder (“M05SWD” manufactured by POWDER TECH).

<Example 5> A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder (“M05SWD” manufactured by POWDER TECH Co., Ltd.) was changed from 110 parts to 155 parts.

<Example 6> A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder (“M05SWD” manufactured by POWDER TECH Co., Ltd.) was changed from 110 parts to 268 parts.

<Example 7> A resin composition was obtained in the same manner as in Example 1, except that the amount of magnetic powder (“M05SWD” manufactured by POWDER TECH Co., Ltd.) was changed from 110 parts to 416 parts.

<Example 8> In addition to replacing 39 parts of thiol compounds containing carboxylic acid ester structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.), thiol compounds containing isocyanurate structure (“TMPIC” manufactured by Ajinomoto Precision Technology Co., Ltd., different A resin composition was obtained in the same manner as in Example 1 except that tris(3-mercaptopropyl)cyanurate had 38 parts of mercaptan equivalent 117 g/eq.

<Example 9> In addition to replacing 39 parts of thiol compounds containing carboxylic acid ester structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.), thiol compounds containing carboxylic acid ester structure (“PE-1” manufactured by Showa Denko Corporation, pentaerythritol tetrakis (3 -Mercaptobutyrate), except that the mercaptan equivalent of 136 g/eq) was 33 parts, a resin composition was obtained in the same manner as in Example 1.

<Example 10> A resin composition was obtained in the same manner as in Example 1, except that 1.1 parts of a dispersant ("SC-1015F" manufactured by NOF Corporation) was used instead of 1.1 parts of a dispersant ("PB-821" manufactured by Ajinomoto Precision Technology Co., Ltd.).

<Example 11> A resin composition was obtained in the same manner as in Example 1, except that 1.1 parts of a dispersant ("SC-1015F" manufactured by NOF Corporation) was not used.

<Comparative example 1> In addition to substituting 39 parts of thiol compound containing carboxylic acid ester structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.), 15 parts of polyamine (“FXR-1081” manufactured by T&K TOKA Co., Ltd.) and magnetic powder (manufactured by POWDER TECH Co., Ltd.) are used. Except that the usage amount of "M05SWD") was changed from 110 parts to 90 parts, a resin composition was obtained in the same manner as in Example 1.

＜Comparative example 2＞ In addition to substituting 39 parts of thiol compound containing carboxylate structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.), 39 parts containing allyl phenol (“MEH-8000H” manufactured by Meiwa Kasei Co., Ltd., hydroxyl equivalent weight 141g/eq) was used instead , The amount of magnetic powder (M05SWD made by POWDER TECH) has been changed from 110 parts to 111 parts without using stabilizer ("TEB" made by Tokyo Chemical Co., Ltd., triethyl borate) 0.8 part and dispersant (NOF Company’s "SC-1015F") 1.1 parts, and instead of 14 parts of amine epoxy adduct-based hardening accelerator (Ajinomoto Precision Technology Co.’s "PN-FJ") and using phosphorus-based hardening accelerator (Beixing Chemical Co., Ltd.) Except for making "TBP-DA", tetrabutylphosphonium decanoate) 0.4 part, a resin composition was obtained in the same manner as in Example 1.

＜Comparative example 3＞ In addition to replacing 39 parts of thiol compound containing carboxylic acid ester structure ("TMTP" manufactured by Yodo Chemical Industry Co., Ltd.), phenol novolac type cyanate ester ("PT-30" manufactured by Ronza Co., Ltd.) is used. The functional group equivalent of cyanate ester is 124g/eq) 35 parts, the use amount of magnetic powder ("M05SWD" manufactured by POWDER TECH) changed from 110 parts to 105 parts, without using stabilizer ("TEB" manufactured by Tokyo Kasei Co., Ltd., triethyl borate) 0.8 part And dispersant (NOF Corporation "SC-1015F") 1.1 parts, and instead of 14 parts of amine epoxy adduct hardening accelerator (Ajinomoto Precision Technology Co., Ltd. "PN-FJ"), using metal-based hardening A resin composition was obtained in the same manner as in Example 1, except that the accelerator (manufactured by Tokyo Kasei Co., Ltd., manganese acetonate (III) (tris(2,4-glutarate) manganese (III))) was 0.4 parts.

＜Comparative example 4＞ Except that 39 parts of thiol compound containing carboxylic acid ester structure (“TMTP” manufactured by Yodo Chemical Industry Co., Ltd.) is not used, the usage amount of magnetic powder (“M05SWD” manufactured by POWDER TECH Company) has been changed from 110 parts to 79 parts. Stabilizer ("TEB" manufactured by Tokyo Kasei Co., Ltd., triethyl borate) 0.8 parts and dispersant ("SC-1015F" manufactured by NOF Corporation) 1.1 parts, and replaced the amine epoxy adduct hardening accelerator (Mizano Resin was obtained in the same manner as in Example 1, except that 14 parts of "PN-FJ" manufactured by Sono Precision Technology Co., Ltd.) and 2 parts of a phosphorus-based hardening accelerator ("TBP-DA" manufactured by Beixing Chemical Co., Ltd., tetrabutylphosphonium caprate) were used Composition.

<Test Example 1: Measurement of Elastic Modulus> Each resin composition obtained in the Examples and Comparative Examples was coated on a mold release PET film (NS-80A: Toray Co., Ltd.) using a bar coater, and heated separately (set at the curing temperature of the reaction peak temperature ± 30°C) And the curing time of more than 30 minutes (the same below): Examples 1 to 11 are at 80°C for 30 minutes, Comparative Example 1 is at 100°C for 30 minutes, and Comparative Example 2 is at 180°C for 60 minutes, Comparative Example 3 It was set at 200°C for 120 minutes, and Comparative Example 4 was set at 150°C for 60 minutes) to obtain a hardened product. The obtained cured product having a thickness of 100 μm was punched with dumbbells (trade name "SUPER DEMBBELL CUTTER (model: SDMK-5889-01)", manufactured by Dumbbell) to prepare test pieces for tensile strength measurement. The PET film was peeled from the test piece. Under the conditions of a temperature of 25° C., a humidity of 50%, and a tensile speed of 5 mm/min, a tensile test was performed using a TENSILON universal testing machine (manufactured by ORIENTEC, RTM-500) to measure the modulus of elasticity (MPa).

In addition, in each example, the DSC (Differential Scanning Calorie) was measured before and after curing to confirm the peak (60 The wave peak near ℃~90℃) did not appear. The DSC system uses a differential scanning calorimeter (DSC7000X, manufactured by Hitachi High-Technologies Corporation), and measures the temperature from 25°C to 300°C at 5°C/min. The peak reaction temperature of Examples 1 to 11 is below 90°C. Fig. 1 shows the DSC spectrum of the differential scanning calorimetry curve (DSC curve) of the resin composition obtained in Example 1 before and after curing. In Fig. 1, the solid line indicates before curing, and the broken line indicates after curing.

<Test Example 2: Measurement of Elongation at Breaking Point> The resin compositions obtained in the Examples and Comparative Examples were coated on a release PET film (NS-80A: manufactured by Toray) using a bar coater, and heated separately (Examples 1 to 11 were at 80°C for 30 (Comparative Example 1 was at 100°C for 30 minutes, Comparative Example 2 was at 180°C for 60 minutes, Comparative Example 3 was at 200°C for 120 minutes, and Comparative Example 4 was at 150°C for 60 minutes) to obtain a hardened product . The obtained cured product having a thickness of 100 μm was punched with dumbbells (trade name "SUPER DEMBBELL CUTTER (model: SDMK-5889-01)", manufactured by Dumbbell) to prepare test pieces for tensile strength measurement. The PET film was peeled from the test piece. Under the conditions of a temperature of 25°C, a humidity of 50%, and a tensile speed of 5 mm/min, a tensile test was performed using a TENSILON universal testing machine (manufactured by ORIENTEC, RTM-500), and the elongation at break (%) was measured.

<Test Example 3: Measurement of Specific Magnetic Permeability> The resin compositions obtained in the Examples and Comparative Examples were coated on a release PET film (NS-80A: manufactured by Toray) using a bar coater, and heated separately (Examples 1 to 11 were at 80°C for 30 (Comparative Example 1 was at 100°C for 30 minutes, Comparative Example 2 was at 180°C for 60 minutes, Comparative Example 3 was at 200°C for 120 minutes, and Comparative Example 4 was at 150°C for 60 minutes) to obtain a hardened product . The PET film was peeled from the test piece. The obtained cured product having a thickness of 400 μm was cut into test pieces of 10 mm in width and 30 mm in length to prepare test pieces for measurement. This evaluation sample used Agilent Technologies (manufactured by Agilent Technologies, "HP8362B"), and measured the specific permeability (μ') at a room temperature of 23°C using a short-circuit stripline method with a measurement frequency in the range of 0.1 MHz to 500 MHz. The specific permeability shown in Table 1 below is the specific permeability (μ') when the measured frequency is 100 MHz.

<Test Example 4: Measurement of Viscosity> The temperature of each resin composition obtained in the Examples and Comparative Examples was maintained at 25°C (±2°C), and the E-type viscometer (RE-85U manufactured by Toki Sangyo Co., Ltd., 3°×R9, 7 rotor) was used to measure The sample is 0.22ml, and the viscosity (Pa·s) is measured under the measuring condition of 20rpm.

<Test Example 5: Evaluation of Impact Resistance> The fluororubber plate (manufactured by AS ONE) which was cut into 60mm×100mm with a thickness of 4mm was further cut in half, and a 10mm×80mm rectangle was dug out in the center of one of the two pieces. Spray release agent DAIFREE (GA-9700, manufactured by Daikin Industrial Co., Ltd.) on the inside of the excavated, and heat it for 30 minutes under hardening conditions.

After taking out the heated fluororubber plate from the thermostat and cooling it, overlap two fluororubber plates, fix the surroundings with paper clips, and pour into each resin composition obtained in the examples and comparative examples to make the surface To become flat, heat separately (Examples 1-11 are at 80°C for 30 minutes, Comparative Example 1 is at 100°C for 30 minutes, Comparative Example 2 and Comparative Example 3 are at 180°C for 60 minutes, and Comparative Example 4 is at 200°C for 60 minutes) to harden it.

After being taken out from the constant temperature bath and cooled, the mold frame was removed from the hardened product, and a test piece of 10mm×80mm×4mm was obtained. The test piece was inserted into the fixed part of the Ai-type impact tester (manufactured by ORIENTEC Co., Ltd.) with a thickness of 30 mm, and a hammer was used at a distance of 450 mm from the fixed part to confirm that the test piece was damaged or undamaged. The gap between the test piece and the fixed part of the impact test piece is not connected. And the test piece was not cut (notch).

The result of the impact resistance test (N=3) was evaluated as "○" when it was not broken in each time, and "×" when it was broken. As the final judgment, among the 3 times, the ones that were not broken in 3 times were recorded as "○". If it is "◎", if it is undamaged twice, it is recorded as "○", if it is undamaged only once, it is recorded as "△", and if it is destroyed all three times, it is recorded as "×".

The non-volatile components of the resin compositions of the examples and comparative examples and their usage amounts, as well as the measurement results and evaluation results of the test examples, are shown in Table 1 below.

＜Discussion on Evaluation Results＞ From the resin compositions of Examples 1 to 11, cured products with better impact resistance than the resin compositions of Comparative Examples 1 to 4 were obtained. Specifically, in Examples 1 to 11 using a thiol compound, the modulus of elasticity was suppressed to be low, and the elongation at breaking point was high, and it was found that the impact resistance was excellent. In addition, in Comparative Examples 1 to 3 using other hardeners or Comparative Example 4 of a homopolymerized epoxy resin system, the modulus of elasticity and the elongation at break were deteriorated, and it was confirmed that it was not effective for impact resistance.

[Fig. 1] A DSC chart showing the differential scanning calorimetry curve (DSC curve) of the resin composition obtained in Example 1 before and after curing.

Claims (15)

A resin composition comprising (A) epoxy resin, (B) thiol compound and (C) magnetic powder, The elastic modulus of the cured resin composition at 25°C is below 500MPa, and The elongation at the breaking point of the cured product of the resin composition at 25°C is more than 30%. Such as the resin composition of claim 1, wherein the epoxy equivalent of component (A) is 200g/eq.~1000g/eq. The resin composition of claim 1, wherein the component (B) is a thiol compound having two or more functions. Such as the resin composition of claim 1, wherein the ratio of the total number of mercapto groups of (B) thiol compound to the total number of epoxy groups of (A) epoxy resin (mercapto group/epoxy group) is 0.3 to 1.0. Such as the resin composition of claim 1, wherein the content of component (C) is 40% to 75% by mass when the non-volatile content in the resin composition is set to 100% by mass. The resin composition of claim 1, which further contains a latent hardening accelerator. The resin composition of claim 1, wherein the component (A) includes (A-1) an epoxy resin containing a flexible skeleton. The resin composition of claim 1, wherein the reaction peak temperature based on differential scanning calorimetry is 100°C or less. Such as the resin composition of claim 1, which is used as an adhesive. Such as the resin composition of claim 9, which is used as an adhesive for bonding the rubidium magnet as the adherend. Such as the resin composition of claim 1, which is used as a sealing material. A cured product, which is a cured product of the resin composition according to any one of claims 1 to 11. A motor containing a rubidium magnet, which contains the hardened substance as claimed in claim 12. An electronic component, which contains the hardened substance as claimed in claim 12. An electronic component comprising a motor containing a rubidium magnet and a hardened product as claimed in claim 12.

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