KR20140047107A - 튜너 모듈, 회로 기판 및 회로 기판의 조립 방법 - Google Patents

튜너 모듈, 회로 기판 및 회로 기판의 조립 방법 Download PDF

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Publication number
KR20140047107A
KR20140047107A KR1020147002715A KR20147002715A KR20140047107A KR 20140047107 A KR20140047107 A KR 20140047107A KR 1020147002715 A KR1020147002715 A KR 1020147002715A KR 20147002715 A KR20147002715 A KR 20147002715A KR 20140047107 A KR20140047107 A KR 20140047107A
Authority
KR
South Korea
Prior art keywords
circuit board
tuner module
tuner
leg portion
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147002715A
Other languages
English (en)
Korean (ko)
Inventor
다다시 이마이
게이스케 요시다
가즈나리 우에다
도시유키 수도
마코토 마키시마
Original Assignee
소니 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 주식회사 filed Critical 소니 주식회사
Publication of KR20140047107A publication Critical patent/KR20140047107A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M7/00—Arrangements for interconnection between switching centres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10803—Tapered leads, i.e. leads having changing width or diameter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Structure Of Receivers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020147002715A 2011-08-12 2012-08-03 튜너 모듈, 회로 기판 및 회로 기판의 조립 방법 Withdrawn KR20140047107A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011177302A JP2013042311A (ja) 2011-08-12 2011-08-12 チューナモジュール、回路基板、及び回路基板の組立方法
JPJP-P-2011-177302 2011-08-12
PCT/JP2012/069808 WO2013024711A1 (ja) 2011-08-12 2012-08-03 チューナモジュール、回路基板、及び回路基板の組立方法

Publications (1)

Publication Number Publication Date
KR20140047107A true KR20140047107A (ko) 2014-04-21

Family

ID=47715033

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147002715A Withdrawn KR20140047107A (ko) 2011-08-12 2012-08-03 튜너 모듈, 회로 기판 및 회로 기판의 조립 방법

Country Status (5)

Country Link
US (1) US20140160709A1 (enExample)
JP (1) JP2013042311A (enExample)
KR (1) KR20140047107A (enExample)
CN (1) CN103733524A (enExample)
WO (1) WO2013024711A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3029702B1 (fr) * 2014-12-03 2016-12-09 Sagemcom Broadband Sas Connecteur coaxial integre a un blindage et carte electronique equipee d'un tel connecteur
USD867994S1 (en) * 2016-12-22 2019-11-26 Sony Semiconductor Solutions Corporation Tuner
WO2018163588A1 (ja) * 2017-03-06 2018-09-13 ソニーセミコンダクタソリューションズ株式会社 チューナモジュール及び受信装置
JP7142454B2 (ja) * 2018-04-13 2022-09-27 Juki株式会社 実装装置、実装方法
JP2019197943A (ja) * 2018-05-07 2019-11-14 ソニーセミコンダクタソリューションズ株式会社 チューナ装置
CN113345339B (zh) * 2021-06-30 2024-09-13 深圳利亚德光电有限公司 箱体组件、led显示屏组件及箱体组件的拆装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19625934C1 (de) * 1996-06-28 1998-01-02 Bosch Gmbh Robert Elektrischer Leiter
TW443717U (en) * 1996-06-28 2001-06-23 Sharp Kk Tuner structure and cable modem tuner using the same
JPH10256426A (ja) * 1997-03-06 1998-09-25 Ricoh Co Ltd 半導体装置
JP3678158B2 (ja) * 2001-03-14 2005-08-03 株式会社村田製作所 モジュール基板の実装構造
CN101176395A (zh) * 2005-04-12 2008-05-07 Nxp股份有限公司 包括安装销的电子模块
JP5242302B2 (ja) * 2008-09-02 2013-07-24 古河電気工業株式会社 バスバー、このバスバーが搭載されるプリント基板及びこのプリント基板を備える自動車用電装部品

Also Published As

Publication number Publication date
JP2013042311A (ja) 2013-02-28
US20140160709A1 (en) 2014-06-12
CN103733524A (zh) 2014-04-16
WO2013024711A1 (ja) 2013-02-21

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140129

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid