KR20140029071A - Radiation apparatus having linear structure for increased installation efficiency - Google Patents

Radiation apparatus having linear structure for increased installation efficiency Download PDF

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Publication number
KR20140029071A
KR20140029071A KR1020120096813A KR20120096813A KR20140029071A KR 20140029071 A KR20140029071 A KR 20140029071A KR 1020120096813 A KR1020120096813 A KR 1020120096813A KR 20120096813 A KR20120096813 A KR 20120096813A KR 20140029071 A KR20140029071 A KR 20140029071A
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KR
South Korea
Prior art keywords
heat sink
linear structure
radiator
circuit board
printed circuit
Prior art date
Application number
KR1020120096813A
Other languages
Korean (ko)
Other versions
KR101463946B1 (en
Inventor
민명식
Original Assignee
주식회사 뉴파워 프라즈마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 뉴파워 프라즈마 filed Critical 주식회사 뉴파워 프라즈마
Priority to KR1020120096813A priority Critical patent/KR101463946B1/en
Publication of KR20140029071A publication Critical patent/KR20140029071A/en
Application granted granted Critical
Publication of KR101463946B1 publication Critical patent/KR101463946B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Abstract

A radiator device having a linear structure for increasing installation efficiency comprises: a radiator body having a contact surface being contacted with multiple devices mounted on a printed circuit board and a linear structure for absorbing and radiating heat generated from the multiple devices; a refrigerant passage formed inside the radiator body; refrigerant inlet and outlet provided in the radiator body to be connected to both ends of the refrigerant passage; and a support bar for connecting and supporting the printed circuit board and the radiator body. The radiator device of the present invention can have a small size, a light weight and a lower price by optimizing a radiation area through the linear structure for increasing installation efficiency. In addition, the radiator device can effectively absorb and radiator heat generated from the multiple devices since the radiator device directly contacts the multiple devices. Particularly, the refrigerant passage formed inside the radiator body has a constant surface distance to the radiator body, whereby the temperature distribution in the radiator body can be uniform and the heat radiation efficiency can be maximized.

Description

TECHNICAL FIELD [0001] The present invention relates to a radiating apparatus having a linear structure for improving mounting efficiency. [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat sink apparatus for heat dissipation of a device mounted on a printed circuit board, and more particularly, to a heat sink apparatus having a linear structure for improving the mounting efficiency.

A heat sink is generally used to solve the problem of heat generated by a device mounted on a printed circuit board. The heat generation problem of a device is a problem in a circuit operating at a high frequency, so it is very important to effectively dissipate the heat generated by a device mounted on a printed circuit board.

In the case of a semiconductor manufacturing apparatus using high frequency power, a heat sink apparatus is mounted in the case of a printed circuit board used for a power supply for supplying a high frequency power. Power supply devices used in a semiconductor manufacturing apparatus are required to minimize the mounting volume when mounted on a semiconductor manufacturing apparatus.

In order to reduce the volume of the power supply, the heat sink to be mounted needs to be optimized. In addition, as matters to be considered in configuring the power supply device, it is necessary to achieve miniaturization, weight reduction, and cost reduction.

It is an object of the present invention to provide a heat sink device having a linear structure optimized for a high frequency power supply device capable of achieving miniaturization, light weight and low cost, while maximizing heat dissipation efficiency.

According to an aspect of the present invention, there is provided a heat sink apparatus. The heat sink device according to the present invention includes: a heat sink main body having a linear structure having a contact surface in contact with a plurality of devices mounted on a printed circuit board and absorbing and radiating heat generated in the plurality of devices; A refrigerant passage formed in the heat sink main body; A refrigerant inlet / outlet port provided in the heat sink main body to be connected to both ends of the refrigerant channel; And a support for connecting and supporting the printed circuit board and the heat sink body.

In one example of the present invention, the surface distance between the heat sink plate main body and the refrigerant channel is made uniform so that the temperature distribution of the heat sink main body is uniform.

In one example of the present invention, the heat sink main body is made of copper.

In one embodiment of the present invention, the heat sink further includes a connection heat sink which is in contact with the heat sink main body and contacts another device mounted on the printed circuit board to transfer heat generated from the other device to the heat sink main body to dissipate heat.

The heat sink device of the present invention has a linear structure in order to improve the mounting efficiency, thereby making it possible to miniaturize, lighten, and reduce the cost by optimizing the heat radiation area. The heat sink device directly contacts a plurality of devices to effectively absorb heat generated by a plurality of devices and dissipate heat. In particular, since the coolant flow path formed inside the heat sink main body is formed with a uniform distance from the surface of the heat sink main body, the temperature distribution of the heat sink main body is uniform, thereby maximizing the heat radiation efficiency.

1 is a perspective view of a heat sink apparatus having a linear structure for improving mounting efficiency according to a preferred embodiment of the present invention.
Fig. 2 is a perspective view showing an example in which the heat sink device of Fig. 1 is mounted on a printed circuit board.
3 is a side view showing the mounting structure of the heat sink device of FIG. 2;

For a better understanding of the present invention, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that the same components are denoted by the same reference numerals in the drawings. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

1 is a perspective view of a heat sink apparatus having a linear structure for improving mounting efficiency according to a preferred embodiment of the present invention.

The heat sink device 10 according to the preferred embodiment of the present invention has a linear structure in order to improve the mounting efficiency, thereby making it possible to miniaturize, lighten, and reduce the cost by optimizing the heat radiation area. The heat sink device (10) has a heat sink main body (11) having a linear structure. The heat sink body 11 has a contact surface in contact with a plurality of devices mounted on a printed circuit board. Refrigerant outlets (12, 13) are provided at both ends of the heat sink main body (11). As will be described later, the refrigerant outlets 12 and 13 are connected to both ends of the refrigerant passage formed in the heat sink main body 11.

FIG. 2 is a perspective view showing an example in which the heat sink device of FIG. 1 is mounted on a printed circuit board, and FIG. 3 is a side view showing a mounting structure of the heat sink device of FIG.

Referring to Figs. 2 and 3, the heat sink main body 11 is fixed to the printed circuit board 20 through a plurality of support rods 14, 15. Fig. At this time, the heat sink device 10 is mounted on the printed circuit board 20 so as to directly contact the plurality of devices 21 mounted on the printed circuit board 20. The heat sink main body 11 directly contacts with a plurality of devices to absorb heat generated by the plurality of devices 21 and dissipate heat.

The heat sink device 10 of the present invention may have one or more connection heat sinks 16 directly contacting the heat sink main body 11. The connection heat sink 16 is in direct contact with one or more other devices 22 having one side mounted on the printed circuit board 20 and the other side directly contacting the heat sink main body 11. Thus, the connection heat sink 16 absorbs the heat generated by the at least one other device 22 and dissipates heat by itself, but transfers the heat to the heat sink main body 11 so as to radiate heat.

In the heat sink device (10) of the present invention, the refrigerant flow path (17) is formed in the heat sink main body (11). The refrigerant flow path 17 is formed with a constant surface distance from the heat sink main body 11, so that the temperature distribution of the heat sink main body 11 is uniform, thereby maximizing the heat radiation efficiency.

 It is preferable that the heat sink main body 11 is made of a copper material having good thermal conductivity and heat radiation characteristics. However, it is also possible to construct the heat sink main body 11 by using aluminum or other materials.

The heat sink device of the present invention can be used in various electronic devices using a printed circuit board. In particular, it can be effectively used as a power supply for supplying a high frequency power for a semiconductor manufacturing apparatus using high frequency power.

The embodiments of the heat sink device having a linear structure for improving the mounting efficiency of the present invention described above are merely illustrative and those skilled in the art will appreciate that various modifications and equivalent implementations You can see that examples are possible. Accordingly, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

10: heat sink device 11: heat sink main body
12, 13: refrigerant inlet / outlet 14, 15: support
16: connection heat sink 17: refrigerant flow path
20: printed circuit board 21, 22: mounting device

Claims (4)

A heat sink body having a contact surface in contact with a plurality of devices mounted on a printed circuit board and having a linear structure for absorbing and radiating heat generated from the plurality of devices;
A refrigerant passage formed in the heat sink body;
A refrigerant inlet / outlet port provided in the heat sink main body to be connected to both ends of the refrigerant channel; And
And a support for connecting and supporting the printed circuit board and the heat sink main body, wherein the heat sink device has a linear structure to increase mounting efficiency. The method of claim 1,
And a surface distance between the heat sink body and the refrigerant passage is constant so that the temperature distribution of the heat sink body is uniform. The method of claim 1,
The heat sink body has a linear structure to increase the mounting efficiency, characterized in that consisting of copper. The method of claim 1,
And a connection heat sink which is in contact with the heat sink body and is connected to another device mounted on the printed circuit board to transfer heat generated from the other device to the heat sink body to radiate heat. Heat sink device having a.
KR1020120096813A 2012-08-31 2012-08-31 Radiation apparatus having linear structure for increased installation efficiency KR101463946B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120096813A KR101463946B1 (en) 2012-08-31 2012-08-31 Radiation apparatus having linear structure for increased installation efficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120096813A KR101463946B1 (en) 2012-08-31 2012-08-31 Radiation apparatus having linear structure for increased installation efficiency

Publications (2)

Publication Number Publication Date
KR20140029071A true KR20140029071A (en) 2014-03-10
KR101463946B1 KR101463946B1 (en) 2014-11-26

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Application Number Title Priority Date Filing Date
KR1020120096813A KR101463946B1 (en) 2012-08-31 2012-08-31 Radiation apparatus having linear structure for increased installation efficiency

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536896U (en) * 1991-10-17 1993-05-18 株式会社アドバンテスト Semiconductor IC cooling structure
JP4140138B2 (en) 1999-08-30 2008-08-27 横河電機株式会社 Printed circuit board cooling structure
KR100863585B1 (en) 2008-03-17 2008-10-15 프롬써어티 주식회사 Colling apparatus for heating element
JP2009230505A (en) * 2008-03-24 2009-10-08 Fujitsu Ltd Board unit and electronic apparatus

Also Published As

Publication number Publication date
KR101463946B1 (en) 2014-11-26

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E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
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X701 Decision to grant (after re-examination)