KR101463946B1 - Radiation apparatus having linear structure for increased installation efficiency - Google Patents

Abstract

A heat sink device having a linear structure for enhancing the mounting efficiency of the present invention includes a heat sink main body having a linear structure having a contact surface in contact with a plurality of devices mounted on a printed circuit board and absorbing and radiating heat generated in the plurality of devices, A refrigerant flow path formed inside the heat sink main body, a coolant inlet / outlet port provided in the heat sink main body so as to be connected to both ends of the refrigerant flow path, and a support rod connecting and supporting the printed circuit board and the heat sink main body. The heat sink device of the present invention has a linear structure in order to improve the mounting efficiency, so that the heat dissipation area can be optimized to enable downsizing, weight reduction, and cost reduction. The heat sink device directly contacts a plurality of devices to effectively absorb heat generated by a plurality of devices and dissipate heat. In particular, since the coolant flow path formed inside the heat sink main body is formed with a uniform distance from the surface of the heat sink main body, the temperature distribution of the heat sink main body is uniform, thereby maximizing the heat radiation efficiency.

Description

TECHNICAL FIELD [0001] The present invention relates to a radiating apparatus having a linear structure for improving mounting efficiency. [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat sink apparatus for heat dissipation of a device mounted on a printed circuit board, and more particularly, to a heat sink apparatus having a linear structure for improving the mounting efficiency.

A heat sink is generally used to solve the problem of heat generated by a device mounted on a printed circuit board. The heat generation problem of a device is a problem in a circuit operating at a high frequency, so it is very important to effectively dissipate the heat generated by a device mounted on a printed circuit board.

In the case of a semiconductor manufacturing apparatus using high frequency power, a heat sink apparatus is mounted in the case of a printed circuit board used for a power supply for supplying a high frequency power. Power supply devices used in a semiconductor manufacturing apparatus are required to minimize the mounting volume when mounted on a semiconductor manufacturing apparatus.

In order to reduce the volume of the power supply, the heat sink to be mounted needs to be optimized. In addition, as matters to be considered in configuring the power supply device, it is necessary to achieve miniaturization, weight reduction, and cost reduction.

It is an object of the present invention to provide a heat sink device having a linear structure optimized for a high frequency power supply device capable of achieving miniaturization, light weight and low cost, while maximizing heat dissipation efficiency.

According to an aspect of the present invention, there is provided a heat sink apparatus. The heat sink device according to the present invention includes: a heat sink main body having a linear structure having a contact surface in contact with a plurality of devices mounted on a printed circuit board and absorbing and radiating heat generated in the plurality of devices; A refrigerant passage formed in the heat sink main body; A refrigerant inlet / outlet port provided in the heat sink main body to be connected to both ends of the refrigerant channel; And a support table for supporting the printed circuit board and the heat dissipation plate main body in connection with each other; And a connection heat sink which is in contact with the heat sink main body and is in contact with another device mounted on the printed circuit board to transmit heat generated from the other device to the heat sink main body and self heat dissipation.

In one example of the present invention, the surface distance between the heat sink plate main body and the refrigerant channel is made uniform so that the temperature distribution of the heat sink main body is uniform.

In one example of the present invention, the heat sink main body is made of copper.

In one embodiment of the present invention, the heat sink further includes a connection heat sink which is in contact with the heat sink main body and contacts another device mounted on the printed circuit board to transfer heat generated from the other device to the heat sink main body to dissipate heat.

The heat sink device of the present invention has a linear structure in order to improve the mounting efficiency, thereby making it possible to miniaturize, lighten, and reduce the cost by optimizing the heat radiation area. The heat sink device directly contacts a plurality of devices to effectively absorb heat generated by a plurality of devices and dissipate heat. In particular, since the coolant flow path formed inside the heat sink main body is formed with a uniform distance from the surface of the heat sink main body, the temperature distribution of the heat sink main body is uniform, thereby maximizing the heat radiation efficiency.

1 is a perspective view of a heat sink apparatus having a linear structure for improving mounting efficiency according to a preferred embodiment of the present invention.
Fig. 2 is a perspective view showing an example in which the heat sink device of Fig. 1 is mounted on a printed circuit board.
3 is a side view showing the mounting structure of the heat sink device of FIG. 2;

For a better understanding of the present invention, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that the same components are denoted by the same reference numerals in the drawings. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

1 is a perspective view of a heat sink apparatus having a linear structure for improving mounting efficiency according to a preferred embodiment of the present invention.

The heat sink device 10 according to the preferred embodiment of the present invention has a linear structure in order to improve the mounting efficiency, thereby making it possible to miniaturize, lighten, and reduce the cost by optimizing the heat radiation area. The heat sink device (10) has a heat sink main body (11) having a linear structure. The heat sink body 11 has a contact surface in contact with a plurality of devices mounted on a printed circuit board. Refrigerant outlets (12, 13) are provided at both ends of the heat sink main body (11). As will be described later, the refrigerant outlets 12 and 13 are connected to both ends of the refrigerant passage formed in the heat sink main body 11.

FIG. 2 is a perspective view showing an example in which the heat sink device of FIG. 1 is mounted on a printed circuit board, and FIG. 3 is a side view showing a mounting structure of the heat sink device of FIG.

Referring to Figs. 2 and 3, the heat sink main body 11 is fixed to the printed circuit board 20 through a plurality of support rods 14, 15. Fig. At this time, the heat sink device 10 is mounted on the printed circuit board 20 so as to directly contact the plurality of devices 21 mounted on the printed circuit board 20. The heat sink main body 11 directly contacts with a plurality of devices to absorb heat generated by the plurality of devices 21 and dissipate heat.

The heat sink device 10 of the present invention may have one or more connection heat sinks 16 directly contacting the heat sink main body 11. The connection heat sink 16 is in direct contact with one or more other devices 22 having one side mounted on the printed circuit board 20 and the other side directly contacting the heat sink main body 11. Thus, the connection heat sink 16 absorbs the heat generated by the at least one other device 22 and dissipates heat by itself, but transfers the heat to the heat sink main body 11 so as to radiate heat.

In the heat sink device (10) of the present invention, the refrigerant flow path (17) is formed in the heat sink main body (11). The refrigerant flow path 17 is formed with a constant surface distance from the heat sink main body 11, so that the temperature distribution of the heat sink main body 11 is uniform, thereby maximizing the heat radiation efficiency.

 It is preferable that the heat sink main body 11 is made of a copper material having good thermal conductivity and heat radiation characteristics. However, it is also possible to construct the heat sink main body 11 by using aluminum or other materials.

The heat sink device of the present invention can be used in various electronic devices using a printed circuit board. In particular, it can be effectively used as a power supply for supplying a high frequency power for a semiconductor manufacturing apparatus using high frequency power.

The embodiments of the heat sink device having a linear structure for improving the mounting efficiency of the present invention described above are merely illustrative and those skilled in the art will appreciate that various modifications and equivalent implementations You can see that examples are possible. Accordingly, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

10: heat sink device 11: heat sink main body
12, 13: refrigerant inlet / outlet 14, 15: support
16: connection heat sink 17: refrigerant flow path
20: printed circuit board 21, 22: mounting device

Claims (4)

A heat sink body having a linear structure which is made of copper and fixed to the printed circuit board via a plurality of supports and has a contact surface to be in contact with a plurality of devices mounted on the printed circuit board and absorbs and radiates heat generated in the plurality of devices, ;
A coolant channel formed inside the heat sink main body and having a constant surface distance from the heat sink main body so that the temperature distribution of the heat sink main body is uniform;
A refrigerant inlet / outlet port provided in the heat sink main body to be connected to both ends of the refrigerant channel;
A supporting base for connecting and supporting the printed circuit board and the heat sink main body; And
And a connection heat sink which is in direct contact with the heat sink main body and is in contact with another device mounted on the printed circuit board to transfer the heat generated in the other device to the heat sink main body and self heat dissipation. A heat sink device having a linear structure.
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