KR20140019593A - Wireless lan module assembly and manufacturing method therefor - Google Patents

Wireless lan module assembly and manufacturing method therefor Download PDF

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Publication number
KR20140019593A
KR20140019593A KR1020120085882A KR20120085882A KR20140019593A KR 20140019593 A KR20140019593 A KR 20140019593A KR 1020120085882 A KR1020120085882 A KR 1020120085882A KR 20120085882 A KR20120085882 A KR 20120085882A KR 20140019593 A KR20140019593 A KR 20140019593A
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KR
South Korea
Prior art keywords
layer
module assembly
wlan module
metal layer
resin layer
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Application number
KR1020120085882A
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Korean (ko)
Inventor
박현도
Original Assignee
삼성전기주식회사
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120085882A priority Critical patent/KR20140019593A/en
Publication of KR20140019593A publication Critical patent/KR20140019593A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The WLAN module assembly of the present invention includes a WLAN module; A resin layer formed on the bus module; An active layer formed on the surface of the resin layer; And a metal layer formed on the active layer and shielding electromagnetic waves harmful to the WLAN module.

Description

Wireless LAN module assembly and manufacturing method therefor {Wireless LAN module assembly and manufacturing method therefor}

The present invention relates to a WLAN module assembly and a method of manufacturing the same, and more particularly, to a WLAN module assembly having a shielding layer that blocks harmful electromagnetic waves and a method of manufacturing the same.

In general, the WLAN module assembly may have a structure for shielding electromagnetic waves. For example, the conventional WLAN module assembly includes a shield can covering the top of the WLAN module. The shield can is made of a metal material to block harmful electromagnetic waves to the WLAN module and to reduce the external shock to the WLAN module to some extent.

However, such a conventional WLAN module assembly is difficult to reduce the weight because it uses a metal shield can. In addition, since the ground connection between the shield can made of metal and the WLAN module is not easy, it is difficult to expect stable performance of the WLAN module.

On the other hand, there are patent documents 1 and 2 as the prior art related to this invention.

Patent Document 1 describes a configuration in which the base frame 100 is plated with a metal material, and Patent Document 2 describes a configuration in which the resin portion 20 is formed on the wireless communication module substrates 10 and 15.

However, these patent documents do not describe any configuration that can achieve the weight reduction of the wireless LAN module while effectively shielding harmful electromagnetic waves.

KR 2009-090418 A KR 2010-101494 A

The present invention is to solve the above problems, the manufacture of a wireless LAN module assembly capable of forming an electromagnetic shielding layer on a wireless LAN module through a simple process and a wireless LAN module assembly having an electromagnetic shielding layer having a uniform thickness. The purpose is to provide a process.

WLAN module assembly according to an embodiment of the present invention for achieving the above object is a WLAN module; A resin layer formed on the bus module; An active layer formed on the surface of the resin layer; And a metal layer formed on the active layer and shielding electromagnetic waves harmful to the WLAN module.

In the WLAN module assembly according to an embodiment of the present invention, the metal layer may include at least one of copper (Cu) and nickel (Ni).

The WLAN module assembly according to an embodiment of the present invention may further include a protective layer formed on the surface of the metal layer to prevent the metal layer from being damaged.

Method of manufacturing a WLAN module assembly according to an embodiment of the present invention for achieving the above object comprises the steps of forming a resin layer on the WLAN module; Forming an active layer on the surface of the resin layer; And forming a metal layer capable of shielding harmful electromagnetic waves in the active layer.

In the method of manufacturing a WLAN module assembly according to an embodiment of the present invention, the active layer may be formed by an LDS (Laser Direct Structuring) method.

In the method of manufacturing a WLAN module assembly according to an embodiment of the present invention, the metal layer may include at least one of copper (Cu) and nickel (Ni).

In the method of manufacturing a WLAN module assembly according to an embodiment of the present invention, the metal layer may be formed through an electroless plating process.

The method of manufacturing a WLAN module assembly according to an embodiment of the present invention may further include forming a protective layer on the surface of the metal layer.

The present invention can form an electromagnetic shielding layer on a wireless LAN module through a simple process. Therefore, according to the present invention, it is possible to provide a WLAN module assembly having improved electromagnetic shielding efficiency.

1 is a cross-sectional view of a WLAN module assembly according to an embodiment of the present invention,
FIG. 2 is a perspective view illustrating the WLAN module illustrated in FIG. 1;
3 is a cross-sectional view of a WLAN module assembly according to another embodiment of the present invention;
4 is a view showing a method of manufacturing a wireless LAN module assembly according to an embodiment of the present invention,
5 is a view showing a method of manufacturing a wireless LAN module assembly according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, terms that refer to the components of the present invention are named in consideration of the function of each component, it should not be understood as a meaning limiting the technical components of the present invention.

1 is a cross-sectional view of a wireless LAN module assembly according to an embodiment of the present invention, Figure 2 is a perspective view showing a wireless LAN module shown in Figure 1, Figure 3 is a wireless according to another embodiment of the present invention 4 is a cross-sectional view illustrating a LAN module assembly, and FIG. 4 is a view illustrating a method of manufacturing a wireless LAN module assembly according to an embodiment of the present invention, and FIG. 5 is a view of manufacturing a wireless LAN module assembly according to another embodiment of the present invention. A diagram illustrating the method.

The WLAN module assembly according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

The WLAN module assembly 10 according to the present embodiment may include the WLAN module 100, the resin layer 200, the active layer 300, and the metal layer 400.

As illustrated in FIG. 2, the WLAN module 100 may include a substrate 110 and electronic components 120, 122, and 124. The WLAN module 100 configured as described above may be a device used in a wireless communication device, and may transmit an external signal to a main body (for example, a portable telephone main body) or transmit a signal of the main body to the outside.

The substrate 110 may be made of a silicon substrate or a ceramic substrate. In addition, the substrate 110 may be a laminated substrate in which a plurality of substrates are stacked along a thickness direction (up and down direction based on FIG. 1) of the substrate.

The circuit pattern 112 may be formed on the substrate 110. Here, the circuit pattern 112 may be formed by spraying a conductive metal by an inkjet method or a photolithography method. In addition, the circuit pattern 112 may vary according to the type of the WLAN module 100.

One or more ground electrodes 114 and 116 may be formed on the substrate 110. Each of the ground electrodes 114 and 116 may be formed in the form of a via electrode penetrating the substrate 110. Meanwhile, at least one of the ground electrodes 114 and 116 may be used for grounding the electronic component 120 mounted on the substrate 110.

The electronic components 120, 122, and 124 may be mounted on the substrate 110. The electronic components 120, 122, and 124 may be components required to perform a function of the WLAN module 100, and may include a (matching) filter for detecting only a specific signal from an external signal. In addition, the electronic components 120, 122, and 124 may be connected to the circuit pattern 112, and may be connected to at least one ground electrode 114 and 116 as described above.

On the other hand, since the above-described WLAN module 100 is an exemplary form, it may vary depending on the electronic device on which the WLAN module assembly 10 is mounted. For example, in the above-described WLAN module 100, the substrate 110 is described as a stacked substrate, but the form of the substrate 110 is not limited thereto and may be changed to a single substrate.

The resin layer 200 may be formed in the WLAN module 100. In detail, the resin layer 200 may be formed on one surface of the WLAN module 100 or on all surfaces of the WLAN module 100.

The resin layer 200 may be formed by a molding method. However, in addition to this, the resin layer 200 may be formed by various methods such as printing, spin coating, jetting, and the like.

The resin layer 200 may be made of an epoxy mold compound (EMC). However, the material of the resin layer 200 is not limited thereto, and may be made of other polymers.

The resin layer 200 may further include a predetermined metal component. For example, the resin layer 200 may include at least one of copper (Cu), gold (Au), and nickel (Ni) to enable activation by heat. However, the metal component included in the resin layer 200 is not limited to the above-described components, and may include other components. For example, the resin layer 200 may include a metal component that reacts to a laser.

The resin layer 200 formed as described above may absorb the impact applied to the WLAN module 100 from the external impact.

The active layer 300 may be formed in the resin layer 200. In detail, the active layer 300 may be formed by surface treatment of the resin layer 200. For example, the active layer 300 may be a layer formed by activating the surface of the resin layer 200 with a laser (that is, a layer formed by activating a metal component of the resin layer 200 with a laser).

The active layer 300 formed as described above may be easily coupled to the metal layer 400 because the metal component is exposed to the surface.

Meanwhile, in the present exemplary embodiment, the active layer 300 is a layer formed by activating the surface of the resin layer 200 with a laser, but the method of forming the active layer 300 is not limited thereto. For example, the active layer 300 may be formed by activating the surface of the resin layer 200 with a device other than a laser.

The metal layer 400 may be formed in the active layer 300. In detail, the metal layer 400 may be formed on the active layer 300 by a method such as electrolytic plating or electroless plating. The metal layer 400 formed as described above may have a uniform thickness on the surface of the active layer 300 to block harmful electromagnetic waves from penetrating into the WLAN module 100.

The metal layer 400 may include at least one of copper (Cu) and nickel (Ni). Alternatively, the metal layer 400 may be made of a single metal component of copper (Cu) or nickel (Ni). However, the components of the metal layer 400 are not limited thereto. For example, the metal layer 400 may include any component as long as it is a metal component capable of shielding harmful electromagnetic waves.

Since the WLAN module assembly 10 configured as described above is directly formed on the resin layer 200 via the active layer 300 to shield the harmful electromagnetic waves, the WLAN module 100 and the electromagnetic shielding member (ie , To provide a stable coupling structure between the metal layer (400).

In addition, since the wireless LAN module assembly 10 according to the present embodiment may be formed with a relatively uniform thickness, the metal layer 400 may exhibit stable electromagnetic shielding performance.

In addition, since the WLAN module assembly 10 according to the present embodiment may form the metal layer 400 relatively thin, the WLAN module assembly 10 may be very advantageous in weight reduction of the WLAN module assembly.

A WLAN module assembly according to another embodiment of the present invention will be described with reference to FIG. 3. For reference, in the present embodiment, the same components as the above-described embodiments use the same reference numerals as the above-described embodiments, and detailed descriptions of these components are omitted.

The WLAN module assembly 10 according to the present embodiment may be distinguished from the above-described embodiment in that it further includes a protective layer 500.

The protective layer 500 may be formed on the metal layer 400. In detail, the protective layer 500 may be formed on the surface of the metal layer 400 by a molding method. However, the protective layer 500 may be formed on the surface of the metal layer 400 by various methods such as printing, spin coating, jetting, or the like.

The protective layer 500 may be made of an epoxy mold compound (EMC). However, the material of the protective layer 500 is not limited thereto, and may be made of other polymers. In addition, the protective layer 500 may be made of a material having low electrical conductivity.

The protective layer 500 configured as described above may be formed on the surface of the metal layer 400 to prevent the metal layer 400 from being separated or damaged.

Therefore, the WLAN module assembly 10 according to the present embodiment may be usefully used in an apparatus in which the metal layer 400 is exposed to the outside or the metal layer 400 is easily in electrical contact with other electronic components.

A method of manufacturing a WLAN module assembly according to an embodiment of the present invention will be described with reference to FIG. 4.

The method of manufacturing a WLAN module assembly according to the present embodiment may include forming a resin layer 200, forming an active layer 300, and forming a metal layer 400.

1) Formation Step of Resin Layer 200

This step may be a step of forming the resin layer 200 in the WLAN module 100. Here, the resin layer 200 may be formed in the WLAN module 100 by a molding method. However, the resin layer 200 may be formed in the WLAN module 100 by various methods such as printing, spin coating, jetting, and the like.

The resin layer 200 may be made of an epoxy mold compound (EMC). However, the material of the resin layer 200 is not limited thereto, and may be made of other polymers.

The resin layer 200 may further include a predetermined metal component. For example, the resin layer 200 may include at least one of copper (Cu), gold (Au), and nickel (Ni) to enable activation by heat. However, the metal component included in the resin layer 200 is not limited to the above-described components, and may include other components. For example, the resin layer 200 may include a metal component that reacts to a laser.

The resin layer 200 formed as described above may absorb the impact applied to the WLAN module 100 from the external impact.

2) forming the active layer 300

This step may be a step of forming the active layer 300 in the resin layer 200. Here, the active layer 300 may be formed by a laser direct structuring (LDS) method. For example, the active layer 300 may be a layer formed by irradiating the surface of the resin layer 200 with a laser. In this case, the active layer 300 may be made of metal components included in the resin layer 200.

As described above, this step may be a step of irradiating the resin layer 200 with a laser. However, this step does not mean only the process of irradiating the resin layer 200 with a laser. For example, this step may include all of the processes capable of forming the active layer 300 directly or indirectly on the resin layer 200.

3) forming the metal layer 400

This step may be a step of forming the metal layer 400 on the active layer 300. Here, the metal layer 400 may be formed in the active layer 300 by electrolytic plating or electroless plating. Therefore, this step may include an electrolytic plating process or an electroless plating process.

However, the formation of the metal layer 400 is not limited to electrolytic plating or electroless plating, and may be formed by other processes.

Meanwhile, the metal layer 400 may include at least one of copper (Cu) and nickel (Ni). Alternatively, the metal layer 400 may be made of a single metal component of copper (Cu) or nickel (Ni). However, the components of the metal layer 400 are not limited thereto. For example, the metal layer 400 may include any component as long as it is a metal component capable of shielding harmful electromagnetic waves.

The method for manufacturing a WLAN assembly configured as described above includes a WLAN module having an electromagnetic shielding layer having a uniform thickness by forming a resin layer, forming an active layer (or laser processing), and forming a metal layer (or plating). It can be formed in the assembly.

In addition, the manufacturing method of the WLAN assembly configured as described above may automate a series of steps through inline, thereby increasing the production efficiency of the WLAN assembly.

A method of manufacturing a WLAN module assembly according to another embodiment of the present invention will be described with reference to FIG. 5.

The method of manufacturing a WLAN module assembly according to the present embodiment may further perform the forming of the protective layer 500.

The forming of the protective layer 500 may be a step of forming another resin layer on the metal layer 400. Therefore, the protective layer 500 may be made of the same material as the resin layer 200. However, the material of the protective layer 500 is not necessarily the same as the resin layer 200, and may be made of a different material from the resin layer 200 as necessary.

Since the method of manufacturing the WLAN module assembly configured as described above further performs the step of forming the protective layer 400 on the surface of the metal layer 400, the damage of the metal layer 400 can be effectively prevented.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions And various modifications may be made.

10 WLAN module assembly
100 wlan module
110 substrate
112 circuit patterns
120, 122, 124 Electronic Components
200 resin layers
300 active layers
400 metal layer
500 protective layer

Claims (8)

Wireless LAN module;
A resin layer formed on the bus module;
An active layer formed on the surface of the resin layer; And
A metal layer formed on the active layer and shielding electromagnetic waves harmful to the WLAN module;
WLAN module assembly comprising a. The method of claim 1,
The metal layer is a wireless ram module assembly including at least one of copper (Cu) and nickel (Ni). The method of claim 1,
And a protective layer formed on a surface of the metal layer to prevent the metal layer from being damaged. Forming a resin layer on the WLAN module;
Forming an active layer on the surface of the resin layer; And
Forming a metal layer capable of shielding harmful electromagnetic waves in the active layer;
Method of manufacturing a wireless LAN module assembly comprising a. 5. The method of claim 4,
The active layer is a method of manufacturing a wireless LAN module assembly formed by the laser direct structuring (LDS) method. 5. The method of claim 4,
The metal layer is a method of manufacturing a WLAN module assembly including at least one of copper (Cu) and nickel (Ni). 5. The method of claim 4,
The metal layer is a method of manufacturing a wireless LAN module assembly formed through an electroless plating process. 5. The method of claim 4,
The method of claim 1, further comprising forming a protective layer on the surface of the metal layer.
KR1020120085882A 2012-08-06 2012-08-06 Wireless lan module assembly and manufacturing method therefor KR20140019593A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021078541A1 (en) * 2019-10-25 2021-04-29 Gn Hearing A/S Audio device, electronic circuit, and related methods of manufaturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021078541A1 (en) * 2019-10-25 2021-04-29 Gn Hearing A/S Audio device, electronic circuit, and related methods of manufaturing

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