KR20140018880A - 복제된 미세구조화 배킹을 갖는 연마재 물품 및 그것을 이용하는 방법 - Google Patents
복제된 미세구조화 배킹을 갖는 연마재 물품 및 그것을 이용하는 방법 Download PDFInfo
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- KR20140018880A KR20140018880A KR1020137022016A KR20137022016A KR20140018880A KR 20140018880 A KR20140018880 A KR 20140018880A KR 1020137022016 A KR1020137022016 A KR 1020137022016A KR 20137022016 A KR20137022016 A KR 20137022016A KR 20140018880 A KR20140018880 A KR 20140018880A
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
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- 230000009969 flowable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
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- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
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- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
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- 229920000058 polyacrylate Polymers 0.000 description 1
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- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
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- 238000007650 screen-printing Methods 0.000 description 1
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- 239000007779 soft material Substances 0.000 description 1
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- 239000007921 spray Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
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- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
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- 229920006029 tetra-polymer Polymers 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
- B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161436407P | 2011-01-26 | 2011-01-26 | |
| US61/436,407 | 2011-01-26 | ||
| PCT/US2012/022142 WO2012102978A1 (en) | 2011-01-26 | 2012-01-23 | Abrasive article with replicated microstructured backing and method of using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140018880A true KR20140018880A (ko) | 2014-02-13 |
Family
ID=45755505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137022016A Withdrawn KR20140018880A (ko) | 2011-01-26 | 2012-01-23 | 복제된 미세구조화 배킹을 갖는 연마재 물품 및 그것을 이용하는 방법 |
Country Status (7)
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10518388B2 (en) * | 2013-12-23 | 2019-12-31 | 3M Innovative Properties Company | Coated abrasive article maker apparatus |
| CN104369120B (zh) * | 2014-09-15 | 2016-11-09 | 西安德谦新材料科技发展有限公司 | 一种基于磨削单元植入的金刚石或cbn磨具制备方法 |
| WO2016085791A1 (en) * | 2014-11-26 | 2016-06-02 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
| CN104403575B (zh) * | 2014-12-23 | 2016-09-21 | 包头市华辰稀土材料有限公司 | 一种高精度氧化铝抛光粉的制备方法 |
| WO2016209651A1 (en) * | 2015-06-22 | 2016-12-29 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
| CN105500186A (zh) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | 晶片抛光用抛光垫及抛光垫的自吸附方法 |
| CN105751090A (zh) * | 2016-04-15 | 2016-07-13 | 常州市金牛研磨有限公司 | 防滑强化砂带 |
| US10849660B2 (en) * | 2017-02-21 | 2020-12-01 | Diamabrush Llc | Sanding screen device |
| CN111032284B (zh) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| TWI674947B (zh) * | 2018-04-19 | 2019-10-21 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法及研磨方法 |
| CN108747876B (zh) * | 2018-06-11 | 2021-03-19 | 河北思瑞恩新材料科技有限公司 | 一种漆面研磨砂碟的制备方法 |
| US10954803B2 (en) * | 2019-01-17 | 2021-03-23 | Rolls-Royce Corporation | Abrasive coating for high temperature mechanical systems |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318083A (en) * | 1976-08-04 | 1978-02-18 | Sankyo Rikagaku Co | Grinding instruments of multiilayer structure |
| US4629473A (en) * | 1985-06-26 | 1986-12-16 | Norton Company | Resilient abrasive polishing product |
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| CA2113318A1 (en) * | 1993-01-28 | 1994-07-29 | Robert J. Jantschek | Abrasive attachment system for rotative abrading applications |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| EP1276593B1 (en) * | 2000-04-28 | 2005-08-17 | 3M Innovative Properties Company | Abrasive article and methods for grinding glass |
| US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6838142B2 (en) * | 2001-05-18 | 2005-01-04 | 3M Innovative Properties Company | Specular laminates |
| US6846232B2 (en) * | 2001-12-28 | 2005-01-25 | 3M Innovative Properties Company | Backing and abrasive product made with the backing and method of making and using the backing and abrasive product |
| CN1411038A (zh) * | 2002-05-30 | 2003-04-16 | 株式会社日立制作所 | 抛光方法和设备 |
| US6755878B2 (en) * | 2002-08-02 | 2004-06-29 | 3M Innovative Properties Company | Abrasive articles and methods of making and using the same |
| WO2008079708A1 (en) * | 2006-12-20 | 2008-07-03 | 3M Innovative Properties Company | Coated abrasive disc and method of making the same |
| EP2101952B1 (en) * | 2006-12-21 | 2013-02-13 | Saint-Gobain Abrasives, Inc. | Abrasive article with cured backsize layer |
| US20100022174A1 (en) * | 2008-07-28 | 2010-01-28 | Kinik Company | Grinding tool and method for fabricating the same |
-
2012
- 2012-01-23 WO PCT/US2012/022142 patent/WO2012102978A1/en active Application Filing
- 2012-01-23 JP JP2013551260A patent/JP2014508650A/ja active Pending
- 2012-01-23 CN CN2012800056627A patent/CN103328158A/zh active Pending
- 2012-01-23 SG SG2013054051A patent/SG191978A1/en unknown
- 2012-01-23 KR KR1020137022016A patent/KR20140018880A/ko not_active Withdrawn
- 2012-01-23 US US13/979,233 patent/US20130295821A1/en not_active Abandoned
- 2012-01-30 TW TW101102916A patent/TW201238716A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012102978A1 (en) | 2012-08-02 |
| US20130295821A1 (en) | 2013-11-07 |
| TW201238716A (en) | 2012-10-01 |
| SG191978A1 (en) | 2013-08-30 |
| CN103328158A (zh) | 2013-09-25 |
| JP2014508650A (ja) | 2014-04-10 |
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| PA0105 | International application |
Patent event date: 20130821 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |