KR20140017311A - Apparatus and method fdr cleaning substrates - Google Patents

Abstract

The present invention relates to an apparatus for fabricating a semiconductor and a method thereof. More particularly, the present invention relates to an apparatus and a method for cleaning a substrate. According to an embodiment of the present invention, an apparatus for cleaning a substrate includes a substrate support unit supporting a substrate, and an organic solvent supply unit formed in one side of the substrate support unit and spraying a liquefied organic solvent including bubbles onto the substrate. The apparatus for cleaning a substrate further includes a dry gas supply unit formed in the other side of the organic solvent supply unit and supplying a dry gas to the substrate. The organic solvent supply unit includes a nozzle head spraying the organic solvent to the substrate, an organic solvent supply line supplying the organic solvent from a storage tank to the nozzle head, and a bubble supply member supplying the bubbles to the liquefied organic solvent.

Description

Substrate cleaning apparatus and substrate cleaning method {APPARATUS AND METHOD FDR CLEANING SUBSTRATES}

The present invention relates to an apparatus and method for manufacturing a semiconductor substrate, and more particularly, to an apparatus and method for cleaning a substrate.

Generally, a semiconductor device is formed through various processes such as a photo process, an etching process, an ion implantation process, and a deposition process for a substrate such as a silicon wafer .

In addition, a cleaning process is performed to remove various contaminants attached to the substrate in each process. The cleaning process includes a chemical treatment process for removing contaminants on a substrate by a chemical, a wet cleaning process for removing a chemical solution remaining on the substrate by pure water, And a drying process for drying the pure water remaining on the surface.

In the past, a drying process was performed by supplying heated nitrogen gas onto a substrate where pure water remained. However, as the line width of the pattern formed on the substrate is narrowed and the aspect ratio is increased, the removal of pure water between the patterns is not performed well. To this end, recently, pure water is substituted on a substrate with a liquid organic solvent such as isopropyl alcohol, which is more volatile and has a lower surface tension than pure water, and then heated nitrogen gas is supplied to dry the substrate.

However, since the nonpolar organic solvent and the polar pure water are not mixed well, in order to replace the pure water with the liquid organic solvent, a large amount of the organic solvent must be supplied for a long time.

An object of the present invention is to provide a substrate cleaning apparatus and method capable of improving the drying efficiency of a substrate.

It is also an object of the present invention to provide a substrate cleaning apparatus and method which can facilitate the substitution of a liquid organic solvent and pure water, thereby saving a liquid organic solvent.

The problem to be solved by the present invention is not limited to the above-described problem, and the objects not mentioned may be clearly understood by those skilled in the art from the present specification and the accompanying drawings. will be.

The present invention provides a substrate cleaning apparatus.

A substrate cleaning apparatus according to an embodiment of the present invention includes a substrate support unit for supporting a substrate and an organic solvent supply unit provided on one side of the substrate support unit, and spraying a liquid organic solvent including bubbles on the substrate. Can be.

The substrate cleaning apparatus may further include a dry gas supply unit which is provided on the other side of the organic solvent supply unit and injects dry gas to the substrate.

The organic solvent supply unit is provided in a nozzle head for discharging the organic solvent to the substrate, an organic solvent supply line for supplying the organic solvent from the storage tank to the nozzle head, and the supply line, and bubbles in the liquid organic solvent. It may include a bubble providing member for providing a.

The bubble providing member may include an ultrasonic wave applying member for applying ultrasonic waves to the liquid organic solvent flowing through the supply line.

The ultrasonic wave applying member may include a vibration member provided in the supply line and an oscillator for providing the ultrasonic wave to the vibration member.

The ultrasonic application member may include a container containing a fluid medium, an oscillator for applying vibration to the fluid medium in the container, an oscillator for applying ultrasonic waves to the vibrator, and a controller for adjusting the frequency of the ultrasonic wave applied to the vibrating member. And a portion of the supply line may be provided to submerge inside the fluid medium in the vessel.

The organic solvent supply unit may further include a circulation line which is branched from the supply line and connected to the storage tank, and moves the liquid organic solvent to the storage tank.

The bubble providing member may be provided between a branch point branched from the supply line to the circulation line and the nozzle head, and the branch point between the bubble supply member branching from the supply line to the circulation line and the storage tank. It can be provided on the organic solvent supply line.

The present invention also provides a substrate cleaning method.

Substrate cleaning method according to an embodiment of the present invention includes the step of supplying a liquid organic solvent containing bubbles to the substrate to replace the pure water remaining in the pattern of the substrate with the liquid organic solvent, the liquid Bubbles can be generated by applying ultrasonic waves to the organic solvent.

The method may further include removing bubbles from the substrate by discharging the liquid organic solvent containing no bubbles to the substrate.

According to this invention, the drying efficiency of a board | substrate cleaning apparatus and method can be improved.

In addition, according to the present invention, it is possible to easily replace the organic solvent and pure water due to the bubbles contained in the liquid organic solvent to save the liquid organic solvent used for drying the substrate.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a plan view showing an embodiment of a substrate processing apparatus.
2 is a cross-sectional view illustrating an embodiment of the substrate cleaning apparatus of FIG. 1.
3 is a view showing an embodiment of an organic solvent supply unit.
4 is a view showing a modification of the organic solvent supply unit of FIG.
5 is a cross-sectional view illustrating a first embodiment of the ultrasonic wave applying member of FIG. 3.
FIG. 6 is a cross-sectional view of the ultrasonic wave applying member cut along the line AA ′ of FIG. 5.
7 is a cross-sectional view illustrating a modified example of the ultrasonic wave applying member of FIG. 5.
FIG. 8 is a cross-sectional view of the ultrasonic wave applying member cut along the line BB ′ of FIG. 7.
9 is a view showing a second embodiment of the ultrasonic wave applying member of FIG.
10 is a view showing a modification of the ultrasonic wave applying member of FIG.
11 is a flowchart illustrating an example of a method of cleaning a substrate using the substrate processing apparatus of FIG. 1.
FIG. 12 is a view illustrating a circulation path of a liquid organic solvent using the organic solvent supply unit of FIG. 3.
FIG. 13 is a view illustrating a process of spraying a liquid organic solvent in which bubbles are generated to a substrate by using the organic solvent supply unit of FIG. 3.
FIG. 14 is a view illustrating a process in which a liquid organic solvent having bubbles generated in FIG. 13 is replaced with pure water on a substrate.
15 is a view illustrating a process in which vortices are generated in a three-phase interface of a liquid organic solvent, pure water, and a gas.
16 is a photograph showing the vortices actually occurring in the three-phase interface of FIG.
FIG. 17 is a view illustrating a process in which a liquid-free organic solvent is sprayed onto a substrate by using the organic solvent supply unit of FIG. 3.
18 is a view illustrating a process of removing bubbles from the liquid organic solvent of FIG. 17.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

1 is a plan view showing an embodiment of a substrate processing apparatus.

Referring to FIG. 1, the substrate processing facility 1 of the present invention has an index module 10 and a process processing module 20, and the index module 10 has a load port 120 and a transfer frame 140. . The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a row. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 20 are arranged is referred to as a first direction 12, and when viewed from the top, the direction perpendicular to the first direction 12 is observed. The direction is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction 16.

The carrier 18 in which the substrate is accommodated is mounted in the load port 140. A plurality of load ports 120 are provided and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on process efficiency and footprint conditions of the process processing module 20. The carrier 18 is formed with a plurality of slots (not shown) for accommodating the substrates in a state arranged horizontally with respect to the ground. As the carrier 18, a front opening unified pod (FOUP) may be used.

The process module 20 has a transfer chamber 240, a buffer unit 220, and a process chamber 260. The transfer chamber 240 is arranged such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed at both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the process chambers 260 are provided to be symmetrical to each other with respect to the transfer chamber 240. One side of the transfer chamber 240 is provided with a plurality of process chambers 260. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, the process chambers 260 may be arranged in an array of A X B on one side of the transfer chamber 240. Where A is the number of process chambers 260 provided in a line along the first direction 12 and B is the number of process chambers 260 provided in a line along the second direction 14. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 × 2 or 3 × 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, unlike the above, the process chamber 260 may be provided as a single layer on one side and both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space in which the substrate stays before the substrate is transferred between the process chamber 260 and the carrier 18. The buffer unit 220 is provided with a slot (not shown) in which a substrate is placed therein, and a plurality of slots (not shown) are provided to be spaced apart from each other along the third direction 16. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transports the substrate between the carrier 18 seated in the load port 120 and the buffer unit 220. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided with its longitudinal direction parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and linearly moves in the second direction 14 along the index rail 142. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b, which is provided to be movable forward and backward relative to the body 144b. The plurality of index arms 144c are provided to be individually driven. The index arms 144c are arranged to be stacked apart from each other along the third direction 16. Some of the index arms 144c are used when transporting the substrate from the process processing module 20 to the carrier 18, and other parts thereof are used when transporting the substrate from the carrier 18 to the process processing module 20. Can be. This can prevent particles generated from the substrate before the process treatment from being attached to the substrate after the process treatment while the index robot 144 loads and unloads the substrate.

The transfer chamber 240 transports the substrate between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rail 242 is disposed such that its longitudinal direction is parallel to the first direction 12. The main robot 244 is installed on the guide rail 242, which is linearly moved along the first direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided to be movable forward and backward relative to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are stacked to be spaced apart from each other along the third direction 16.

In the process chamber 260, a substrate cleaning apparatus 300 that performs a cleaning process on a substrate is provided. The substrate cleaning apparatus 300 may have a different structure according to the type of cleaning process to be performed. Alternatively, the substrate cleaning apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups so that the substrate cleaning apparatuses 300 in the process chamber 260 belonging to the same group are the same as each other and the substrate cleaning apparatuses in the process chamber 260 belonging to different groups. The structures of 300 may be provided differently from each other. For example, when the process chamber 260 is divided into two groups, one side of the transfer chamber 240 is provided with a first group of process chambers 260, and the other side of the transfer chamber 240 has a second group of processes. Chambers 260 may be provided. Optionally, the first group of process chambers 260 may be provided in the lower layer on both sides of the transfer chamber 240, and the second group of process chambers 260 may be provided in the upper layer. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to types of chemicals used or types of cleaning methods. Alternatively, the first group of process chambers 260 and the second group of process chambers 260 may be provided to sequentially process one substrate.

Hereinafter, an example of a substrate cleaning apparatus for cleaning a substrate using a processing liquid will be described.

2 is a cross-sectional view illustrating an embodiment of the substrate cleaning apparatus of FIG. 1.

Referring to FIG. 2, the substrate cleaning apparatus 300 includes a substrate support unit 310, a container 320, a lifting unit 330, and fluid supply units 3000 and 3900.

The substrate support unit 310 supports the substrate w during the cleaning process. The substrate support unit 310 has a spin head 311, a spindle 312 and a rotating member 313.

The spin head 311 is disposed in the inner space of the container 320. The spin head 311 has an upper surface 319 on which a substrate w is loaded. The upper surface 319 is provided with support pins 315 protruding therefrom. The support pin 315 supports the rear edge of the substrate w such that the substrate w is spaced a predetermined distance from the upper surface 319 of the spin head 311. The chucking pins 316 are provided in the upper edge region of the substrate w. The chucking pins 316 support the sides of the substrate w so that the substrate w does not deviate laterally from the home position when the spin head 311 is rotated.

Spindle 312 is coupled to the lower center of the spin head 311. Spindle 312 is in the form of a hollow shaft that is hollow inside. The spindle 312 transmits the rotational force of the rotating member 313 to the spin head 311. Although not shown in detail, the rotating member 313 may be formed of a conventional configuration such as a drive unit such as a motor generating a rotational force, a belt, a power transmission unit such as a chain, and the like, which transmits the rotational force generated from the drive unit to the spindle.

On the other hand, the back nozzle part 317 is provided in the spin head 311. The bag nozzle unit 317 injects fluid such as ultrapure water and nitrogen gas to the bottom of the substrate. The back nozzle portion 317 is located at the center of the spin head 311.

The container 320 wraps around the spin head 311 and has an open top. The container 320 has a structure capable of separating and recovering the chemical liquids used in the process. This makes it possible to reuse the chemicals. The vessel 320 has a plurality of recovery bins 3210, 3220, 3230. Each recovery container 3210, 3220, and 3230 recovers different types of treatment liquids from among treatment liquids used in the process. In this embodiment, the container 320 has three recovery bins 3210, 3220, and 3230. Each recovery container is referred to as an internal recovery container 3210, an intermediate recovery container 3220, and an external recovery container 3230.

The inner recovery container 321 is provided in an annular ring shape surrounding the spin head 311. The intermediate recovery container 322 is provided in an annular ring shape surrounding the internal recovery container 321. The outer recovery container 323 is provided in an annular ring shape surrounding the intermediate recovery container 322. Each recovery bin 321, 322, 323 has inlets 321a, 322a, 323a in the vessel 320 that communicate with the space 32 in the vessel. Each inlet 321a, 322a, 323a is provided in a ring shape around the spin head 311. Chemical liquids injected into the substrate w and used in the process are introduced into the recovery vessels 321, 322, and 323 through the inlets 321 a, 322a, and 323a by centrifugal force due to the rotation of the substrate w. The inlet 323a of the outer waste container 323 is provided at the vertical upper portion of the inlet 322a of the middle waste container 322, and the inlet 322a of the middle waste container 322 is the inlet of the inner waste container 321. It is provided at the vertical top of 321a. That is, the inner recovery container 321, the intermediate recovery container 322, and the inlets 321a, 322a, and 323a of the external recovery container 323 are provided to have different heights from each other.

Each of the internal recovery container 321, the intermediate recovery container 322, and the external recovery container 323 are combined with discharge pipes 321b, 322b, and 323b for discharging the liquid and an exhaust pipe 329 for exhausting the gas including the fume. do.

The lifting unit 330 linearly moves the container 320 in the vertical direction. As the vessel 320 moves up and down, the relative height of the vessel 320 relative to the spin head 311 changes. The lifting unit 330 has a bracket 331, a moving shaft 332, and a driver 333. The bracket 331 is fixed to the outer wall of the container 320, the movement shaft 332 which is moved up and down by the driver 333 is fixedly coupled to the bracket 331. The container 320 is lowered so that the spin head 311 protrudes above the container 320 when the substrate w is placed on the spin head 311 or lifted from the spin head 311. In addition, when the process is in progress, the height of the container 320 is adjusted to allow the processing liquid to flow into the predetermined recovery containers 321, 322, and 323 according to the type of processing liquid supplied to the substrate W. Contrary to the above, the lifting unit 330 may move the spin head 311 in the vertical direction.

The fluid supply units 3000 and 3900 supply the chemical liquid, the cleaning liquid, the organic solvent, and the dry gas necessary for the substrate cleaning process to the substrate. The fluid supply units 3000 and 3900 have a chemical liquid supply unit (not shown), a cleaning liquid supply unit (not shown), an organic solvent supply unit 3000, and a dry gas supply unit 3900 according to the fluid to be supplied. Referring to FIG. 2, the organic solvent supply unit 3000 is disposed on one side of the vessel 320, and the dry gas supply unit 3900 is disposed on the other side of the vessel 320. Alternatively, the organic solvent and the dry gas may be supplied in one supply unit. Although not shown, the chemical liquid supply unit and the cleaning liquid supply unit may be provided on one side of the container 320 together with the organic solvent supply unit 3000 and the dry gas supply unit 3900 in one chamber.

The organic solvent supply unit 3000 sprays a liquid organic solvent on the upper surface of the substrate w to dry the substrate w. The liquid organic solvent provided on the substrate w is replaced with the pure water remaining on the surface of the substrate w after the washing process. Thereafter, the organic solvent is volatilized by the rotation of the substrate w, the drying gas or the heating. Initially, the liquid organic solvent is supplied to the substrate w in a state of containing bubbles, thereby improving the substitution efficiency with pure water remaining on the surface of the substrate w. Thereafter, the liquid organic solvent is supplied to the substrate w without containing bubbles, and bubbles are removed in the pattern of the substrate w. As a liquid organic solvent, isopropyl alcohol may be provided.

 The organic solvent supply unit 3000 includes a nozzle member 3010, an organic solvent supply line 3020, a recovery line 3030, and a bubble providing member 3050.

The nozzle member 3010 includes a nozzle head 3011, a nozzle arm 3012, a support shaft 3013, and a driver 3014.

The support shaft 3013 is located outside of the container 320. The longitudinal direction of the support shaft 3013 is arrange | positioned. The support shaft 3013 is coupled to the driver 3014 and is rotated about the central axis by the driver 3014. In addition, the support shaft 3013 is moved up and down by the driver 3014. The nozzle arm 3012 is mounted on the upper end of the support shaft 3013. The nozzle arm 3012 is disposed perpendicular to the support shaft 3013. The nozzle head 3011 is mounted at the end of the nozzle arm 3012. The nozzle head 3011 has a spray nozzle 3015. The spray nozzle 3015 is connected to the organic solvent supply line 3020 to inject a liquid organic solvent onto the substrate w. Rotation of the support shaft 3013 causes the nozzle head 3011 to swing between the center region and the edge region of the substrate w.

Hereinafter, an embodiment of the organic solvent supply unit will be described. 3 is a view showing an embodiment of an organic solvent supply unit.

Referring to FIG. 3, the organic solvent supply unit 3100 includes a nozzle member 3110, an organic solvent supply line 3120, a recovery line 3130, and a bubble supply member 3150.

The organic solvent supply line 3120 connects the storage tank 390 and the nozzle head 3111. The recovery line 3130 is branched from the organic solvent supply line 3120 and connected to the storage tank 390. Hereinafter, the branch point P where the recovery line 3130 is branched from the organic solvent supply line 3120. The liquid organic solvent stored in the storage tank 390 is supplied to the nozzle head 3111 through the organic solvent supply line 3120 or is recovered back to the storage tank 390 through the recovery line 3130. According to an example, a portion of the organic solvent supply line 3120 may be located in the nozzle arm, and the bubble providing member 3150 may be located in the nozzle arm. Optionally, bubble providing member 3150 may be located outside of the nozzle arm.

The bubble providing member 3150 includes an ultrasonic wave applying member 3151, a bubble amount measuring instrument 3152, and a controller 3153. The ultrasonic wave applying member 3151 is provided on the organic solvent supply line 3120. The ultrasonic wave applying member 3151 generates bubbles in the liquid organic solvent by applying ultrasonic waves to the liquid organic solvent. A bubble amount measuring instrument 3152 is provided between the ultrasonic wave applying member 3151 and the nozzle head 3111 on the organic solvent supply line 3120. The bubble amount measuring instrument 3152 measures the amount of bubbles inside the liquid organic solvent and provides the measured value to the controller 3153. The controller 3153 receives the measurement value from the bubble amount measuring instrument 3152 and controls the frequency of generating ultrasonic waves in the ultrasonic wave applying member 3151 based on the measured value. Through this, it is possible to control the amount of bubbles generated in the liquid organic solvent. According to one example, the controller 3153 controls the ultrasonic wave applying member 3151 to apply a frequency of 1 MHz to 2 MHz. When applying ultrasonic waves generated through a frequency of 1MHz to 2MHz to provide bubbles generated in the liquid organic solvent, the substitution of the liquid organic solvent and pure water is most efficient.

4 is a view showing a modification of the organic solvent supply unit of FIG.

Referring to FIG. 4, the bubble providing member 3250 of the organic solvent supply unit 3200 is provided on the organic solvent supply line 3220 between the branch point P of the recovery line 3230 and the organic solvent storage tank 390. do. In this case, the organic solvent supply unit 3200 further includes a degassing member 3290. A degassing member 3290 is provided on the return line 3230. The liquid organic solvent generates bubbles while passing through the bubble providing member 3250. When the liquid organic solvent is not sprayed onto the substrate, the liquid is moved through the recovery line 3230 to remove bubbles from the degassing member 3290.

In the above-described examples, the recovery lines 3130 and 3230 are connected to the organic solvent supply lines 3120 and 3220. However, at least one of the recovery lines 3130 and 3230 may not be provided.

5 is a cross-sectional view illustrating a first embodiment of the ultrasonic wave applying member of FIG. 3. FIG. 6 is a cross-sectional view of the ultrasonic wave applying member cut along the line AA ′ of FIG. 5.

5 and 6, the ultrasonic wave applying member 3160 includes a body 3151, a vibrator 3152, and an oscillator 3203. The body 3151 has a cylindrical shape in which a hollow is formed. The body 3151 is positioned to surround a portion of the organic solvent supply line 3120. The inner wall of the body 3151 is provided to be in contact with the organic solvent supply line 3120. Optionally, the body 3151 may have a curved plate shape. The vibrator 3152 is positioned in the wall forming the body 3151. The vibrator 3152 is electrically connected to the oscillator 3203. The oscillator 3203 applies ultrasonic waves to the vibrator 3152. In an example, the vibrator 3152 may be spaced apart from the organic solvent supply line 3120, and the vibration of the vibrator 3322 may be transmitted to the organic solvent supply line 3120 through the body 3151. At this time, bubbles are generated from the liquid organic solvent flowing in the organic solvent supply line 3120.

7 is a cross-sectional view illustrating a modified example of the ultrasonic wave applying member of FIG. 5. FIG. 8 is a cross-sectional view of the ultrasonic wave applying member cut along the line BB ′ of FIG. 7.

Referring to FIGS. 7 and 8, the ultrasonic wave applying member 3170 includes a body 3171, a vibrator 3172, and an oscillator 3317. The body 3171 has a cylindrical shape in which a hollow is formed. The body 3171 is positioned to surround a portion of the organic solvent supply line 3120. The inner wall of the body 3171 is provided to be in contact with the organic solvent supply line 3120. Optionally, the body 3171 may have a curved plate shape. The vibrator 3172 is positioned in the wall forming the body 3171. The vibrator 3172 is provided to directly contact the organic solvent supply line 3120 to apply vibration.

9 is a view showing a second embodiment of the ultrasonic wave applying member of FIG.

Referring to FIG. 9, the ultrasonic wave applying member 3180 includes a container 3222, a vibrator 3183, and an oscillator 3184. The container 3222 is filled with a fluid medium 3181. The organic solvent supply line 3120 is provided to pass through the fluid medium 3141 inside the vessel 3222. Oscillator 3183 is connected to oscillator 3184 and is provided to submerge in fluid medium 3181 inside vessel 3142. When the oscillator 3184 applies ultrasonic waves to the vibrator 3183, the vibrator 3183 converts the applied ultrasonic waves into vibrations and transmits the ultrasonic waves to the fluid medium 3181 inside the container 3222. The fluid medium 3181 to which vibration is applied transmits vibration to a portion of the organic solvent supply line 3120 which is immersed in the fluid medium 3181, and the vibration generates bubbles in the liquid organic solvent. The fluid medium 3181 may be water.

10 is a view showing a modification of the ultrasonic wave applying member of FIG.

Referring to FIG. 10, the ultrasonic wave applying member 3190 includes a container 3152, a vibrator 3193, and an oscillator 3194. It is possible to increase the length of the organic solvent supply line 3120 immersed in the fluid medium 3191 within the vessel 3152. In this case, the area of the organic solvent supply line 3120 in contact with the fluid medium 3191 may be increased to efficiently generate bubbles in the liquid organic solvent.

Hereinafter, a method of cleaning a substrate using the substrate cleaning apparatus according to the present invention will be described.

The substrate cleaning method according to the present invention may be performed using another substrate cleaning apparatus that performs the same or similar functions in addition to the substrate cleaning apparatus according to the present invention.

11 is a flowchart illustrating an example of a method of cleaning a substrate using the substrate processing apparatus of FIG. 1.

According to FIG. 11, the substrate cleaning method includes an etching process of selectively removing a thin film using chemicals to form a circuit pattern, a rinsing process of removing chemicals using pure water, and drying the pure water remaining on the substrate using an organic solvent. Drying process. In the substrate drying method according to an embodiment of the present invention, the liquid organic solvent containing bubbles is replaced with pure water remaining on the substrate. Thereafter, the liquid organic solvent containing bubbles on the substrate is replaced with the liquid organic solvent containing no bubbles. The liquid organic solvent containing no substituted bubbles is volatilized on the substrate. In this case, to facilitate volatilization of the liquid organic solvent, the substrate may be rotated, the substrate may be heated, or an inert gas may be supplied.

Next, a process of performing a drying process will be described with reference to FIGS. 12 to 18. First, the liquid organic solvent circulates without being supplied to the nozzle head during the cleaning process on the substrate.

FIG. 12 is a view illustrating a circulation path of a liquid organic solvent using the organic solvent supply unit of FIG. 3.

Referring to FIG. 12, when the cleaning process is performed on the substrate, the valve 3122 on the organic solvent supply line 3120 is closed in the organic solvent supply unit 3100, and the valve 3131 on the circulation line 3130 is opened. At this time, the liquid organic solvent is not sprayed onto the substrate. As a result, the liquid organic solvent is not moved to the nozzle head 3111 and is recovered to the organic solvent storage tank 390.

FIG. 13 is a view illustrating a process of spraying a liquid organic solvent in which bubbles are generated to a substrate by using the organic solvent supply unit of FIG. 3.

Referring to FIG. 13, if pure water remains on the substrate after the cleaning process, the valve 3122 on the organic solvent supply line 3120 is opened and the valve 3131 on the recovery line 3130 is closed in the organic solvent supply unit 3100. . The liquid organic solvent 50 is conveyed to the ultrasonic wave applying member 3151 through the organic solvent supply line 3120. Bubble 70 is generated inside the liquid organic solvent 50 while passing through the ultrasonic wave applying member 3151. The liquid organic solvent 50 in which the bubbles 70 are generated is transported to the nozzle head 3111 through the organic solvent supply line 3120, and sprayed from the spray nozzle 3115 to the substrate.

FIG. 14 is a view illustrating a process in which a liquid organic solvent having bubbles generated in FIG. 13 is replaced with pure water on a substrate.

Referring to FIG. 14, the liquid organic solvent 50 including the bubbles 70 injected onto the substrate w is in contact with the pure water 60 remaining on the substrate w. At this time, the bubble 70 contained in the liquid organic solvent 50 moves into the pure water 60 together with the liquid organic solvent 50. In this process, the bubble 70 and the liquid organic solvent 50 come into contact with the pure water 60. At this contact surface, a liquid organic solvent 50, pure water 60, and a gas three-phase interface 80 are generated. When the liquid organic solvent 50 and the pure water 60 contact each bubble 70 included in the liquid organic solvent 50 on the substrate w, a plurality of three-phase interfaces 80 may be generated. Vortex 90 is generated in this three-phase interface 80. Vortex 90 facilitates the replacement of the liquid organic solvent 50 and the pure water 60.

15 is a view illustrating a process in which vortices are generated in a three-phase interface of a liquid organic solvent, pure water, and a gas. 16 is a photograph showing the vortices actually occurring in the three-phase interface of FIG.

Referring to FIGS. 15 and 16, a vortex 90 is generated for each three-phase interface 80 of the liquid organic solvent 50, the pure water 60, and the gas 70. This is because the surface tensions of the organic solvent 50, the pure water 60, and the gas 70 are different. The generated vortex 90 facilitates the movement between the liquid organic solvent 50 and the pure water 60, thereby facilitating the replacement of the liquid organic solvent 50 and the pure water 60.

The liquid organic solvent 50 is replaced with the pure water 60 remaining on the substrate on the substrate. The liquid organic solvent 50, which is substituted and remains on the substrate, is more volatilized than the pure water 60, and thus volatilized easily from the substrate. However, the polar pure water 60 and the non-polar liquid organic solvent 50 are not mixed well. In addition, the surface of the pure water 60 remaining on the substrate is easily replaced by air, but when only pure water 60 remains inside the pattern, there is no air and the substitution is not performed well. Therefore, the substitution time of the pure water 60 and the liquid organic solvent 50 becomes long, and the consumption amount of the liquid organic solvent 50 is large.

According to one embodiment of the present invention, due to the vortices 90 generated in the three-phase interface 80 of the liquid organic solvent 50, the pure water 60 and the gas 70 in the pure water and the pure water 60 and Substitution of the liquid organic solvent 50 becomes easy. This reduces the substitution time and shortens the substrate drying time. In addition, the liquid organic solvent 50 used for drying the substrate can be reduced. This improves the efficiency of substrate drying.

Next, a liquid organic solvent containing no bubbles is supplied from the nozzle head to the substrate. FIG. 17 is a view illustrating a process in which a liquid-free organic solvent is sprayed onto a substrate by using the organic solvent supply unit of FIG. 3. 18 is a view illustrating a process of removing bubbles from the liquid organic solvent of FIG. 17.

17 and 18, when the liquid organic solvent 50 including the bubbles 70 remains on the substrate w, the valve 3122 on the supply line 3120 and the valve on the recovery line 3130 are provided. 3131 is closed, and the controller 3153 controls the ultrasonic wave applying member 3151 not to apply ultrasonic waves to the organic solvent. The liquid organic solvent 50 passes through the ultrasonic wave applying member 3151 through the supply line 3120. However, the liquid organic solvent 50 is transported to the spray nozzle 3115 of the nozzle head 3111 in a state where bubbles are not generated. The liquid organic solvent 50 that does not include the bubble 70 is sprayed onto the substrate w from the spray nozzle 3115. The liquid organic solvent 50 containing no bubbles 70 is sprayed onto the substrate w, and the liquid organic solvent 50 containing the bubbles 70 remaining on the substrate w is transferred to the substrate w. ) It is discharged to the outside. If the liquid organic solvent 50 remains on the substrate w in a state in which the bubbles 70 are included, the bubbles 70 burst between the patterns p on the upper portion of the substrate w, and thus the pattern p This can be damaged. However, in the present embodiment, by removing the bubbles 70 from the liquid organic solvent 50 on the substrate w, there is an effect of preventing the damage to the pattern (p).

In the first embodiment of the substrate cleaning method described above, the recovery line 3130 is connected to the organic solvent supply line 3120. Alternatively, recovery line 3130 may not be provided.

In addition, the step of supplying a liquid organic solvent containing no bubbles may not be provided.

In the above-described example, the organic solvent supply unit has been described as having an ultrasonic wave applying member in the bubble providing member. Alternatively, the organic solvent supply unit may include a plurality of bubble providing members.

300: substrate cleaning device 310: substrate support unit
320 container 330 lifting unit
3000: organic solvent supply unit 3010: nozzle member
3020: organic solvent supply line 3030: recovery line
3050: bubble supply member 3900: dry gas supply unit

Claims (2)

A substrate support unit for supporting a substrate; And
And an organic solvent supply unit provided on one side of the substrate support unit and spraying a liquid organic solvent including bubbles on the substrate. The method of claim 1,
The substrate cleaning device,
And a dry gas supply unit provided on the other side of the organic solvent supply unit and injecting dry gas to the substrate.

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