KR20130132786A - 기판의 표면 개질 방법, 컴퓨터 기억 매체 및 기판의 표면 개질 장치 - Google Patents

기판의 표면 개질 방법, 컴퓨터 기억 매체 및 기판의 표면 개질 장치 Download PDF

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Publication number
KR20130132786A
KR20130132786A KR1020137011210A KR20137011210A KR20130132786A KR 20130132786 A KR20130132786 A KR 20130132786A KR 1020137011210 A KR1020137011210 A KR 1020137011210A KR 20137011210 A KR20137011210 A KR 20137011210A KR 20130132786 A KR20130132786 A KR 20130132786A
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KR
South Korea
Prior art keywords
template
substrate
surface modification
board
unit
Prior art date
Application number
KR1020137011210A
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English (en)
Korean (ko)
Inventor
고오키치 히로시로
다카노리 니시
쇼이치 데라다
다카히로 기타노
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20130132786A publication Critical patent/KR20130132786A/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58Applying the releasing agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020137011210A 2010-11-02 2011-10-18 기판의 표면 개질 방법, 컴퓨터 기억 매체 및 기판의 표면 개질 장치 KR20130132786A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-246891 2010-11-02
JP2010246891A JP5282077B2 (ja) 2010-11-02 2010-11-02 基板の表面改質方法、プログラム、コンピュータ記憶媒体及び基板の表面改質装置
PCT/JP2011/073918 WO2012060217A1 (ja) 2010-11-02 2011-10-18 基板の表面改質方法、コンピュータ記憶媒体及び基板の表面改質装置

Publications (1)

Publication Number Publication Date
KR20130132786A true KR20130132786A (ko) 2013-12-05

Family

ID=46024334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137011210A KR20130132786A (ko) 2010-11-02 2011-10-18 기판의 표면 개질 방법, 컴퓨터 기억 매체 및 기판의 표면 개질 장치

Country Status (4)

Country Link
JP (1) JP5282077B2 (ja)
KR (1) KR20130132786A (ja)
TW (1) TW201246375A (ja)
WO (1) WO2012060217A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5638017B2 (ja) * 2012-02-27 2014-12-10 東京エレクトロン株式会社 基板の表面改質方法、コンピュータ記憶媒体及び基板の表面改質装置
KR101934165B1 (ko) * 2016-12-12 2018-12-31 연세대학교 산학협력단 산화물 박막, 이의 제조방법 및 이를 포함하는 산화물 박막 트랜지스터

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5258635B2 (ja) * 2008-03-18 2013-08-07 キヤノン株式会社 ナノインプリント方法、ナノインプリントに用いられるモールド及び構造体の製造方法
EP2759395A1 (en) * 2008-03-19 2014-07-30 Konica Minolta Opto, Inc. Method for producing a wafer lens
WO2009145003A1 (ja) * 2008-05-28 2009-12-03 コニカミノルタオプト株式会社 ウエハレンズ又はウエハレンズ集合体の製造方法
WO2010032511A1 (ja) * 2008-09-22 2010-03-25 コニカミノルタオプト株式会社 ウエハレンズの製造方法
JP2010107891A (ja) * 2008-10-31 2010-05-13 Konica Minolta Opto Inc ウエハレンズ集合体及びその製造方法、レンズユニット、撮像装置

Also Published As

Publication number Publication date
WO2012060217A1 (ja) 2012-05-10
JP5282077B2 (ja) 2013-09-04
TW201246375A (en) 2012-11-16
JP2012099677A (ja) 2012-05-24

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