KR20130106967A - Printede circuit board and manufacturing method for the printede circuit board - Google Patents

Printede circuit board and manufacturing method for the printede circuit board Download PDF

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Publication number
KR20130106967A
KR20130106967A KR1020120028668A KR20120028668A KR20130106967A KR 20130106967 A KR20130106967 A KR 20130106967A KR 1020120028668 A KR1020120028668 A KR 1020120028668A KR 20120028668 A KR20120028668 A KR 20120028668A KR 20130106967 A KR20130106967 A KR 20130106967A
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KR
South Korea
Prior art keywords
circuit board
chip mounting
printed circuit
layer
reflective layer
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KR1020120028668A
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Korean (ko)
Inventor
백지흠
황고은
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엘지이노텍 주식회사
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Priority to KR1020120028668A priority Critical patent/KR20130106967A/en
Priority to PCT/KR2013/001948 priority patent/WO2013141509A1/en
Publication of KR20130106967A publication Critical patent/KR20130106967A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

PURPOSE: A printed circuit board (PCB) and a manufacturing method thereof are provided to form a side reflection layer for covering the side of a chip mounting part, thereby improving the reflectivity. CONSTITUTION: A circuit pattern is formed with the patterning of a metal layer (30). A plating layer (40) is coated on the circuit pattern. A side reflection layer (50) is formed in the top of the plating layer. The side reflection layer covers the side of a first chip mounting part. The side reflection layer is formed by any one of solder resist (SR) and photo solder resist (PSR). [Reference numerals] (AA) Highly reflective substrate unit

Description

인쇄회로기판 및 그 제조방법{PRINTEDE CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE PRINTEDE CIRCUIT BOARD}Printed circuit board and its manufacturing method {PRINTEDE CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE PRINTEDE CIRCUIT BOARD}

본 발명은 인쇄회로기판의 광속을 향상하기 위한 방안에 관한 것이다.
The present invention relates to a method for improving the luminous flux of a printed circuit board.

인쇄회로기판 (PCB; Printed Circuit Board)은 전기 절연성 기판에 구리와 같은 전도성 재료로 회로 라인 인쇄회로기판 (line pattern)을 인쇄 형성시킨 것으로, 전자 부품을 탑재하기 직전의 기판을 말한다. 즉 여러 종류의 많은 전자 부품을 평판 위에 밀집 탑재시키기 위해, 각 부품의 장착 위치를 확정하고, 부품을 연결하는 회로 라인을 평판 표면에 인쇄하여 고정시킨 회로 기판을 뜻한다.A printed circuit board (PCB) is a circuit line printed circuit board formed of a conductive material such as copper on an electrically insulating substrate, and refers to a substrate immediately before mounting an electronic component. That is, it means a circuit board which fixed the mounting position of each component, and printed and fixed the circuit line which connects components on the flat surface in order to mount many electronic components of various types densely on a flat plate.

종래의 방식으로는 광원(LED chip )에서 빛이 절연체층(Dielectric layer)과 접착층(Adhesive) 등에서 반사되지 못하고 흡수되어 일부 광속을 저해하는 요인으로 작용하였다. In the conventional method, light is absorbed in the light source (LED chip) without being reflected by the dielectric layer, the adhesive layer, and the like.

도 1은 종래기술에 따른 인쇄회로기판 제조공정을 도시한 도면이다.1 is a view showing a printed circuit board manufacturing process according to the prior art.

도 1을 참고하면, 인쇄회로기판 제조공정은 접착층(Adhesive, 21)이 붙여진 절연체층(10)을 준비한다(S110). 접착층(21) 위에, 금속층(30)을 라미네이트(Laminate)하고(S120), 절연체층(10) 하부에 접착층(22)을 붙인다(S130). 금속층(30)을 패터닝하여 회로패턴을 형성하고(S140), 형성된 회로패턴 위에 도금층(40)을 도포한다(S150). 도금층(40) 상부에 반사층(50)을 형성하고(S160), 기판 중앙에 칩 실장부를 펀칭한다(S170).Referring to FIG. 1, in a process of manufacturing a printed circuit board, an insulator layer 10 having an adhesive layer 21 is prepared (S110). On the adhesive layer 21, the metal layer 30 is laminated (S120), and the adhesive layer 22 is attached to the lower portion of the insulator layer 10 (S130). The metal layer 30 is patterned to form a circuit pattern (S140), and the plating layer 40 is coated on the formed circuit pattern (S150). The reflective layer 50 is formed on the plating layer 40 (S160), and the chip mounting part is punched in the center of the substrate (S170).

이때, 칩 실장부의 측면(60)에는 반사층(50)이 형성되지 않아, 빛이 반사되지 못하고 일부 소실되어, 반사율이 좋지 못하다.At this time, the reflective layer 50 is not formed on the side surface 60 of the chip mounting portion, and thus the light is not reflected and partially disappears, resulting in poor reflectance.

도 2는 종래기술에 따른 인쇄회로기판의 단면을 도시한 단면도이다.2 is a cross-sectional view showing a cross-section of a printed circuit board according to the prior art.

도 2를 참조하면, 인쇄회로기판은 고반사 기판부 상부로 접착층(22), 절연체층(10), 접착층(21), 회로패턴이 형성되는 금속층(30), 도금층(40) 및 반사층(50)을 포함한다.Referring to FIG. 2, the printed circuit board may include an adhesive layer 22, an insulator layer 10, an adhesive layer 21, a metal layer 30 on which a circuit pattern is formed, a plating layer 40, and a reflective layer 50 on the high reflective substrate. ).

이때, 인쇄회로기판 중앙에는 칩이 실장되는 칩 실장부가 형성되는데, 칩 실장부의 측면에는 반사층(50)이 형성되지 않는다. 즉, 칩 실장부의 측면에는 절연체층(10), 접착층(21, 22), 금속층(30)에서 빛을 반사하지 못하고 일부 흡수하여 광속을 저해하는 문제점이 발생하고 있다.At this time, the chip mounting portion in which the chip is mounted is formed in the center of the printed circuit board, but the reflective layer 50 is not formed on the side of the chip mounting portion. That is, the insulator layer 10, the adhesive layers 21 and 22, and the metal layer 30 do not reflect light but partially absorb the light flux on the side surface of the chip mounting part.

이러한 문제점을 해결하기 위해, 원소재 자체의 색이 화이트 계열인 화이트 접착층, 화이트 폴리이미드(White Polyimide)가 대체방안으로 떠오르고 있으나 가격 경쟁력이 저하되고, 자재 수급에 어려움이 발생하고 있다.
In order to solve this problem, the white adhesive layer and the white polyimide, which is a white-based color of the raw material itself, have emerged as alternatives, but the price competitiveness is deteriorated and the supply and demand of materials is difficult.

본 발명의 일실시예는 칩 실장부의 측면을 감싸도록 측면 반사층을 형성함으로써, 칩 실장부의 측면에서도 반사율이 좋은 인쇄회로기판 및 그 제조방법을 제공한다.An embodiment of the present invention provides a printed circuit board having a high reflectance even on the side of the chip mounting portion by forming a side reflection layer to surround the side of the chip mounting portion, and a method of manufacturing the same.

본 발명의 일실시예는 화이트 계열 잉크로 측면 반사층을 형성하고, 상기 측면 반사층이 칩 실장부의 측면을 커버할 수 있도록 하여, 반사율을 향상시키는 인쇄회로기판 및 그 제조방법을 제공한다.An embodiment of the present invention provides a printed circuit board and a method of manufacturing the same, which form a side reflection layer using a white-based ink and allow the side reflection layer to cover the side surface of the chip mounting part, thereby improving reflectance.

본 발명의 일실시예는 절연체층이나 접착층에 화이트 계열 자재를 사용하지 않고도, 칩 실장부의 측면 반사율을 높일 수 있는 인쇄회로기판 및 그 제조방법을 제공한다.
One embodiment of the present invention provides a printed circuit board and a method of manufacturing the same, which can increase the side reflectance of a chip mounting part without using a white material for an insulator layer or an adhesive layer.

본 발명의 일실시예에 따른 인쇄회로기판 제조방법은 회로패턴을 포함하는 기판 상에 제1 칩 실장부를 형성하고, 상기 제1 칩 실장부의 측면을 커버하도록 측면 반사층을 형성한다.In a method of manufacturing a printed circuit board according to an embodiment of the present invention, a first chip mounting part is formed on a substrate including a circuit pattern, and a side reflection layer is formed to cover the side surface of the first chip mounting part.

상기 측면 반사층을 형성할 때, 화이트 계열 잉크를 이용하여 상기 측면 반사층을 형성할 수 있다.When the side reflection layer is formed, the side reflection layer may be formed using white ink.

상기 측면 반사층을 형성할 때, SR, PSR 중 어느 하나로 형성할 수 있다.When the side reflection layer is formed, it may be formed of any one of SR and PSR.

상기 측면 반사층을 형성할 때, 상기 제1 칩 실장부의 크기보다 작게 제2 칩 실장부를 펀칭하고, 상기 펀칭된 제2 칩 실장부의 측면을 커버하도록 상기 측면 반사층을 형성할 수 있다.When the side reflection layer is formed, the side reflection layer may be formed to punch the second chip mounting portion smaller than the size of the first chip mounting portion, and cover the side surface of the punched second chip mounting portion.

상기 펀칭할 때 툴 펀칭 방식, 드릴 방식, 또는 레이저 방식 중 어느 하나를 이용하여 펀칭할 수 있다.When punching, punching may be performed using any one of a tool punching method, a drill method, or a laser method.

본 발명의 일실시예에 따른 인쇄회로기판은 회로패턴이 형성되는 기판, 상기 기판 상에 형성되는 제1 칩 실장부, 및 상기 제1 칩 실장부의 측면에 형성되는 측면 반사층을 포함한다.
A printed circuit board according to an embodiment of the present invention includes a substrate on which a circuit pattern is formed, a first chip mounting portion formed on the substrate, and a side reflective layer formed on a side of the first chip mounting portion.

본 발명의 일실시예에 따르면, 칩 실장부의 측면을 감싸도록 측면 반사층을 형성함으로써, 칩 실장부의 측면에서도 반사율이 좋도록 한다.According to one embodiment of the present invention, the side reflecting layer is formed to surround the side of the chip mounting portion, so that the reflectance is also good on the side of the chip mounting portion.

본 발명의 일실시예에 따르면, 화이트 계열 잉크로 측면 반사층을 형성하고, 상기 측면 반사층이 칩 실장부의 측면을 커버할 수 있도록 하여, 반사율을 향상시킬 수 있다.According to an embodiment of the present invention, the side reflecting layer may be formed of white ink, and the side reflecting layer may cover the side surface of the chip mounting part, thereby improving the reflectance.

본 발명의 일실시예에 따르면, 절연체층이나 접착층에 화이트 계열 자재를 사용하지 않고도, 칩 실장부의 측면 반사율을 높일 수 있다.
According to one embodiment of the present invention, the side reflectance of the chip mounting portion may be increased without using a white-based material for the insulator layer or the adhesive layer.

도 1은 종래기술에 따른 인쇄회로기판 제조공정을 도시한 도면이다.
도 2는 종래기술에 따른 인쇄회로기판의 단면을 도시한 단면도이다.
도 3은 본 발명의 일실시예에 따른 인쇄회로기판 제조방법을 설명하기 위한 처리공정을 도시한 도면이다.
도 4는 본 발명의 다른 실시예에 따른 인쇄회로기판 제조방법을 설명하기 위한 처리공정을 도시한 도면이다.
도 5는 본 발명의 일실시예에 따른 인쇄회로기판의 단면을 도시한 단면도이다.1 is a view showing a printed circuit board manufacturing process according to the prior art.
2 is a cross-sectional view showing a cross-section of a printed circuit board according to the prior art.
3 is a view illustrating a processing process for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.
4 is a view illustrating a processing process for explaining a method of manufacturing a printed circuit board according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a cross section of a printed circuit board according to an exemplary embodiment of the present invention.

이하에서는 첨부한 도면을 참조하여 본 발명에 따른 구성 및 작용을 구체적으로 설명한다. 첨부 도면을 참조하여 설명함에 있어, 도면 부호에 관계없이 동일한 구성요소는 동일한 참조부여를 부여하고, 이에 대한 중복설명은 생략하기로 한다. 제1, 제2 등의 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되어서는 안 된다. 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다.Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

도 3은 본 발명의 일실시예에 따른 인쇄회로기판 제조방법을 설명하기 위한 처리공정을 도시한 도면이다.3 is a view illustrating a processing process for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.

도 3을 참고하면, 인쇄회로기판 제조방법은 접착층(21)이 붙여진 절연체층(10)을 준비한다(S310). 절연체층(Dielectric layer, 10)은 PET(polyethylene terephthalate), PC(polycarbonate), PES(polyether sulfone), PI(polyimide), PMMA(PolyMethly MethaAcrylate) 중 어느 하나로 형성될 수 있다. 또한, 접착층(Adhesive, 21)은 PSA(Pressure Sensitive Adhesive), DPSA(Detackified PS Adhesives), 또는 WAA(Water Activated Adhesives) 중 어느 하나로 형성될 수 있다.Referring to FIG. 3, a method of manufacturing a printed circuit board prepares an insulator layer 10 to which an adhesive layer 21 is attached (S310). The insulator layer 10 may be formed of any one of polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polyimide (PI), and polymethyacrylate (PMMA). In addition, the adhesive layer 21 may be formed of any one of pressure sensitive adhesive (PSA), stacked PS adhesives (DPSA), and water activated adhesives (WAA).

상기 인쇄회로기판 제조방법은 절연체층(10)을 1차 펀칭하여 칩이 실장될 제1 칩 실장부를 형성한다(S320). 이때, 제1 칩 실장부는 최종 제품의 중앙부 치수보다 크게 형성된다.In the method of manufacturing a printed circuit board, the insulator layer 10 is first punched to form a first chip mounting part on which a chip is mounted (S320). At this time, the first chip mounting portion is formed larger than the central dimension of the final product.

상기 인쇄회로기판 제조방법은 접착층(21) 위에 금속층(30)을 라미네이트(Laminate)하고(S330), 절연체층(10) 하부에 접착층(22)을 붙인다(S340). 실시예로, 금속층(30)은 Cu, Ni, Pd, Au, Sn, Ag, Co 중 하나 이상의 금속으로 전해 또는 무전해 도금을 선택적으로 진행할 수 있다.In the printed circuit board manufacturing method, the metal layer 30 is laminated on the adhesive layer 21 (S330), and the adhesive layer 22 is attached to the lower portion of the insulator layer 10 (S340). In an embodiment, the metal layer 30 may selectively perform electrolytic or electroless plating with one or more metals of Cu, Ni, Pd, Au, Sn, Ag, and Co.

상기 인쇄회로기판 제조방법은 금속층(30)을 패터닝하여 회로패턴을 형성하고(S350), 형성된 회로패턴 위에 도금층(40)을 도포한다(S360). 상기 인쇄회로기판 제조방법은 여러 약품 처리를 통해 필요 영역에 회로를 형성하여 전기적 특성을 지닌 회로패턴을 형성한다. 이때, 상기 인쇄회로기판 제조방법은 인쇄를 먼저하고 도금을 하거나(후도금), 도금을 먼저하고, 인쇄를 하는 방식(선도금)을 선택하여 와이어 본딩(Wire bonding)이 가능하도록 한다.In the printed circuit board manufacturing method, the metal layer 30 is patterned to form a circuit pattern (S350), and the plating layer 40 is coated on the formed circuit pattern (S360). In the method of manufacturing a printed circuit board, a circuit pattern having electrical characteristics is formed by forming a circuit in a required area through various chemical treatments. In this case, the method of manufacturing a printed circuit board may be wire-bonded by first printing and plating (post-plating), or plating, and then printing (pre-plating).

상기 인쇄회로기판 제조방법은 도금층(40) 상부에 측면 반사층(50)을 형성한다(S370). 이때, 상기 1차 펀칭된 제1 칩 실장부를 모두 덮도록 측면 반사층(50)이 형성될 수 있다. 실시예로, 상기 인쇄회로기판 제조방법은 표면 처리 및 전기적 특성 방해를 막고 동시에 반사율을 증가시키도록 측면 반사층(50)을 SR(Solder Resist), PSR(Photo Solder Resist) 중 어느 하나로 형성할 수 있다. 또한, 측면 반사층(50)은 화이트 계열 잉크로 형성될 수 있다.The printed circuit board manufacturing method forms a side reflective layer 50 on the plating layer 40 (S370). In this case, the side reflective layer 50 may be formed to cover all of the first punched first chip mounting parts. In an embodiment, the method of manufacturing the printed circuit board may form the side reflecting layer 50 as any one of SR (Solder Resist) and PSR (Photo Solder Resist) to prevent surface treatment and interference with electrical characteristics and simultaneously increase reflectance. . In addition, the side reflective layer 50 may be formed of white ink.

상기 인쇄회로기판 제조방법은 2차 펀칭하여 제2 칩 실장부를 형성한다(S380). 상기 2차 펀칭은 툴 펀칭 방식, 드릴 방식 또는 레이저 방식 중 어느 하나일 수 있다. 여기서 중요한 부분은 1차 펀칭이 절연체층(10)을 대상으로 상대적으로 넓게 펀칭(Punching)했다면, 이번 2차 펀칭에서는 그보다 좁도록 설계하여 최종적으로는 본제품의 중앙치수에 맞도록 하고, 동시에 절연체층(10)이 아닌 측면 반사층(50)에 2차 펀칭이 이루어지게 하여 노출되는 격벽이 화이트가 되도록 한다.The method of manufacturing the printed circuit board is second punched to form a second chip mounting part (S380). The secondary punching may be any one of a tool punching method, a drill method, or a laser method. The important part here is that if the primary punches are punched relatively broadly against the insulator layer 10, the secondary punches are designed to be narrower and finally fit to the center dimension of the product, and at the same time Secondary punching is performed on the side reflective layer 50, not the layer 10, so that the exposed partition is white.

즉, S320과 S380의 도면을 비교해 보면, 측면 반사층(50)이 제2 칩 실장부의 측면을 감싸는 부분을 제외하고, 2차 펀칭되기 때문에, S320에서 형성된 제1 칩 실장부(가로 길이)보다 S380에서 형성된 제2 칩 실장부의 가로 길이가 더 작은 것을 알 수 있다.That is, comparing the drawings of S320 and S380, since the side reflection layer 50 is secondary punched except for the portion surrounding the side of the second chip mounting portion, S380 is larger than the first chip mounting portion (horizontal length) formed in S320. It can be seen that the lateral length of the second chip mounting portion formed at is smaller.

그리고 난 후, 접착층(22)을 통해 방열재료인 Al, Cu, Ag 등등 열전도도가 높은 재료를 부착한다. 이후 광원(LED Chip or 반도체 Chip)을 인쇄회로기판의 하부 금속부분(고반사 기판부)과 바로 Paste(Silver, Epoxy, Phenol, Urethane 등) 로 부착하여 패키지를 형성한다. Then, through the adhesive layer 22, a material having high thermal conductivity, such as Al, Cu, Ag, or the like, is attached. After that, the light source (LED chip or semiconductor chip) is attached to the lower metal part (high reflecting substrate part) of the printed circuit board directly with Paste (Silver, Epoxy, Phenol, Urethane, etc.) to form a package.

도 4는 본 발명의 다른 실시예에 따른 인쇄회로기판 제조방법을 설명하기 위한 처리공정을 도시한 도면이다.4 is a view illustrating a processing process for explaining a method of manufacturing a printed circuit board according to another embodiment of the present invention.

도 4를 참고하면, 인쇄회로기판 제조방법은 접착층(21)이 붙여진 절연체층(10)을 준비하고(S410), 절연체층(10)을 1차 펀칭하여 칩이 실장될 제1 칩 실장부를 형성한다(S420). 이때, 제1 칩 실장부는 최종 제품의 중앙부 치수보다 크게 형성된다. 상기 인쇄회로기판 제조방법은 접착층(21) 위에 금속층(30)을 라미네이트(Laminate)하고(S430), 금속층(30)을 패터닝하여 회로패턴을 형성하고(S440), 절연체층(10) 하부에 접착층(22)을 붙인다(S450).Referring to FIG. 4, the method of manufacturing a printed circuit board includes preparing an insulator layer 10 to which an adhesive layer 21 is attached (S410), and first punching the insulator layer 10 to form a first chip mounting part on which a chip is mounted. (S420). At this time, the first chip mounting portion is formed larger than the central dimension of the final product. The printed circuit board manufacturing method is to laminate the metal layer 30 on the adhesive layer 21 (S430), pattern the metal layer 30 to form a circuit pattern (S440), the adhesive layer below the insulator layer 10 Attach (22) (S450).

도 4가 도 3과 다른점은 회로패턴 형성 후, 절연체층 하부에 접착층을 붙이는 것이다. 이하, S460 내지 S480은 도 3의 S360 내지 S380과 동일하므로, 설명을 생략한다.4 differs from FIG. 3 in that after the circuit pattern is formed, an adhesive layer is attached to the lower part of the insulator layer. Hereinafter, since S460 to S480 are the same as S360 to S380 in FIG. 3, description thereof is omitted.

도 5는 본 발명의 일실시예에 따른 인쇄회로기판의 단면을 도시한 단면도이다.5 is a cross-sectional view illustrating a cross section of a printed circuit board according to an exemplary embodiment of the present invention.

도 5를 참고하면, 인쇄회로기판은 회로패턴이 형성되는 기판, 상기 기판 상에 형성되는 제1 칩 실장부, 및 상기 제1 칩 실장부의 측면에 형성되는 측면 반사층(50)을 포함한다. Referring to FIG. 5, the printed circuit board includes a substrate on which a circuit pattern is formed, a first chip mounting portion formed on the substrate, and a side reflective layer 50 formed on a side of the first chip mounting portion.

인쇄회로기판은 절연체층(10) 및 접착층(21) 상에 1차 펀칭하여 제1 칩 실장부를 형성하고, 이후, 접착층(21) 위에 회로패턴이 형성되는 금속층(30), 도금층(40) 및 측면 반사층(50)을 형성한 후, 2차 펀칭하여 제2 칩 실장부를 형성할 수 있다.The printed circuit board is first punched on the insulator layer 10 and the adhesive layer 21 to form a first chip mounting part, and then the metal layer 30, the plating layer 40, and the circuit pattern formed on the adhesive layer 21. After the side reflection layer 50 is formed, the second chip mounting portion may be formed by second punching.

상기 제2 칩 실장부는 상기 제1 칩 실장부의 크기보다 작게 형성된다. 측면 반사층(50)은 상기 형성된 제2 칩 실장부의 측면을 커버하도록 형성될 수 있다.The second chip mounting portion is formed smaller than the size of the first chip mounting portion. The side reflective layer 50 may be formed to cover the side surface of the formed second chip mounting portion.

실시예로, 측면 반사층(50)은 화이트 계열 잉크를 이용하여 형성된다. 또한, 측면 반사층(50)은 반사율이 1.0~1.4일 수 있다. 측면 반사층(50)은 SR, PSR 중 어느 하나로 형성될 수 있다.In an embodiment, the side reflection layer 50 is formed using white ink. In addition, the side reflecting layer 50 may have a reflectance of about 1.0 to about 1.4. The side reflective layer 50 may be formed of any one of SR and PSR.

다른 실시예로, 측면 반사층(50)은 알루미늄, 구리, 은, 금, TiO2, CaCO3, BaSO4, Al2O3, Silicon, PS 중 선택되는 어느 하나 또는 둘 이상의 물질이 혼합되어 형성될 수 있다.In another embodiment, the side reflection layer 50 may be formed by mixing any one or two or more materials selected from aluminum, copper, silver, gold, TiO 2, CaCO 3, BaSO 4, Al 2 O 3, Silicon, and PS.

따라서, 본 발명의 인쇄회로기판은 절연체층이나 접착층에 화이트 계열 자재를 사용하지 않고도, 칩 실장부의 측면을 감싸도록 측면 반사층을 형성함으로써, 칩 실장부의 측면 반사율을 향상시킬 수 있다.Therefore, the printed circuit board of the present invention can improve the side reflectance of the chip mounting portion by forming a side reflection layer to surround the side of the chip mounting portion without using a white material for the insulator layer or the adhesive layer.

전술한 바와 같은 본 발명의 상세한 설명에서는 구체적인 실시예에 관해 설명하였다. 그러나 본 발명의 범주에서 벗어나지 않는 한도 내에서는 여러 가지 변형이 가능하다. 본 발명의 기술적 사상은 본 발명의 기술한 실시예에 국한되어 정해져서는 안 되며, 특허청구범위뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.
In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

10: 절연체층
21, 22: 접착층
30: 금속층
40: 도금층
50: 측면 반사층10: insulator layer
21, 22: adhesive layer
30: metal layer
40: plating layer
50: side reflective layer

Claims (12)

회로패턴을 포함하는 기판 상에 제1 칩 실장부를 형성하고,
상기 제1 칩 실장부의 측면을 커버(cover)하도록 측면 반사층을 형성하는, 인쇄회로기판 제조방법.
Forming a first chip mounting part on a substrate including a circuit pattern,
And forming a side reflective layer to cover the side surface of the first chip mounting part.
제1항에 있어서,
상기 측면 반사층을 형성할 때,
화이트 계열 잉크를 이용하여 상기 측면 반사층을 형성하는, 인쇄회로기판 제조방법.
The method of claim 1,
When forming the side reflective layer,
Forming the side reflection layer using a white-based ink, a printed circuit board manufacturing method.
제2항에 있어서,
상기 측면 반사층을 형성할 때,
SR(Solder Resist), PSR(Photo Solder Resist) 중 어느 하나로 형성하는, 인쇄회로기판 제조방법.
3. The method of claim 2,
When forming the side reflective layer,
Formed by any one of SR (Solder Resist), PSR (Photo Solder Resist), a printed circuit board manufacturing method.
제1항에 있어서,
상기 측면 반사층을 형성할 때,
상기 제1 칩 실장부의 크기보다 작게 제2 칩 실장부를 펀칭하고,
상기 펀칭된 제2 칩 실장부의 측면을 커버하도록 상기 측면 반사층을 형성하는, 인쇄회로기판 제조방법.
The method of claim 1,
When forming the side reflective layer,
Punching the second chip mounting portion smaller than the size of the first chip mounting portion,
And forming the side reflective layer to cover the side surface of the punched second chip mounting part.
제4항에 있어서,
상기 펀칭할 때,
툴 펀칭 방식, 드릴 방식, 또는 레이저 방식 중 어느 하나를 이용하여 펀칭하는, 인쇄회로기판 제조방법.
5. The method of claim 4,
When punching,
A punching method using any one of a tool punching method, a drill method, or a laser method.
회로패턴이 형성되는 기판;
상기 기판 상에 형성되는 제1 칩 실장부; 및
상기 제1 칩 실장부의 측면에 형성되는 측면 반사층
을 포함하는 인쇄회로기판.
A substrate on which a circuit pattern is formed;
A first chip mounting unit formed on the substrate; And
Side reflection layer formed on the side of the first chip mounting portion
And a printed circuit board.
제6항에 있어서,
상기 측면 반사층은,
화이트 계열 잉크를 이용하여 형성되는, 인쇄회로기판.
The method according to claim 6,
The side reflective layer,
A printed circuit board formed using white ink.
제7항에 있어서,
상기 측면 반사층은,
반사율이 1.0~1.4인, 인쇄회로기판.
The method of claim 7, wherein
The side reflective layer,
Printed circuit board with a reflectance of 1.0 to 1.4.
제7항에 있어서,
상기 측면 반사층은,
SR, PSR 중 어느 하나로 형성되는, 인쇄회로기판.
The method of claim 7, wherein
The side reflective layer,
A printed circuit board formed of any one of SR and PSR.
제6항에 있어서,
상기 제1 칩 실장부의 크기보다 작게 펀칭되는 제2 칩 실장부
를 더 포함하고,
상기 측면 반사층은,
상기 형성된 제2 칩 실장부의 측면을 커버하도록 형성되는, 인쇄회로기판.
The method according to claim 6,
The second chip mounting portion punched smaller than the size of the first chip mounting portion.
Further comprising:
The side reflective layer,
The printed circuit board is formed to cover the side of the formed second chip mounting portion.
제10항에 있어서,
상기 제2 칩 실장부는,
툴 펀칭 방식, 드릴 방식, 또는 레이저 방식 중 어느 하나를 이용하여 펀칭되는, 인쇄회로기판.
The method of claim 10,
The second chip mounting unit,
A printed circuit board punched using any one of a tool punching method, a drill method, or a laser method.
제6항에 있어서,
상기 측면 반사층은,
알루미늄, 구리, 은, 금, TiO2, CaCO3, BaSO4, Al2O3, Silicon, PS 중 선택되는 어느 하나 또는 둘 이상의 물질이 혼합되어 형성되는, 인쇄회로기판.The method according to claim 6,
The side reflective layer,
A printed circuit board formed by mixing any one or two or more materials selected from aluminum, copper, silver, gold, TiO 2, CaCO 3, BaSO 4, Al 2 O 3, Silicon, and PS.
KR1020120028668A 2012-03-21 2012-03-21 Printede circuit board and manufacturing method for the printede circuit board KR20130106967A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101578143B1 (en) * 2015-06-03 2015-12-28 김응곤 Method for Manufacturing White Coverlay of Inkjet Type

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT515372B1 (en) * 2014-01-29 2019-10-15 At & S Austria Tech & Systemtechnik Ag Method for producing a printed circuit board
FR3024527B1 (en) * 2014-07-31 2019-06-28 Valeo Vision ELECTROLUMINESCENCE DIODE SUPPORT (LED) FOR SIGNALING MODULE
CN113133194B (en) * 2020-01-16 2022-08-09 庆鼎精密电子（淮安）有限公司 Circuit board, manufacturing method thereof and display screen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119174A (en) * 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
KR20090104580A (en) * 2008-03-31 2009-10-06 서울반도체 주식회사 Light emitting diode package using printed circuit board
JP2011159812A (en) * 2010-02-01 2011-08-18 Panasonic Electric Works Co Ltd Light emitting device
KR101131150B1 (en) * 2010-02-25 2012-03-28 에스에스씨피 주식회사 A backlight unitBLU for display device using LEDs
KR101101297B1 (en) * 2011-03-03 2012-01-05 (주)참빛 Metal printed circuit board for high heat radiation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101578143B1 (en) * 2015-06-03 2015-12-28 김응곤 Method for Manufacturing White Coverlay of Inkjet Type

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