KR20130086754A - Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof - Google Patents
Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof Download PDFInfo
- Publication number
- KR20130086754A KR20130086754A KR1020120007672A KR20120007672A KR20130086754A KR 20130086754 A KR20130086754 A KR 20130086754A KR 1020120007672 A KR1020120007672 A KR 1020120007672A KR 20120007672 A KR20120007672 A KR 20120007672A KR 20130086754 A KR20130086754 A KR 20130086754A
- Authority
- KR
- South Korea
- Prior art keywords
- powder
- cleaning
- tank
- semiconductor
- cleaning tank
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cleaning method for removing dots, adhesion or deposition on a semiconductor or display panel, and other contaminants in the manufacturing process of a semiconductor or display panel, and a cleaning apparatus thereof. Claims [1] A powder cleaning tank comprising: a powder cleaning tank installed in a housing and filled with a predetermined amount of inorganic powder and loaded with a plurality of cleaning objects; A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank; A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And an exhaust facility installed in the housing to collect and filter fine dust and exhaust gas generated in the powder cleaning tank, and to clean by burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the powder cleaning tank. The present invention can be completely removed by the combustion or peeling of the plastic material or the polymer organic matter by the fine high-temperature flowable powder in the powder cleaning tank, it is possible to use a relatively inexpensive energy source such as electric heater, far infrared generator, gas burner, The powder cleaning tank is modularized and applied to existing cleaning equipment, which provides cost savings, convenience of cleaning, and reliability of the cleaning equipment. Due to the use of expensive materials in preparation for corrosion of the device, prevention of the generation of CO2 in the air of molten alkali and prevention of moisture absorption, the device configuration is simplified and the convenience of cleaning is improved.
Description
The present invention relates to a method and apparatus for cleaning semiconductors and display panels, and more particularly, to remove dots, adhesion or deposition on semiconductors or display panels, and other contaminants in the manufacturing process of semiconductors or display panels. A cleaning method and a cleaning apparatus thereof.
In general, cleaning processes are essential in processes for manufacturing semiconductors and display panels. Semiconductor and display panels use a variety of raw materials or subsidiary materials in the manufacturing process, and the manufacturing process of the semiconductor and display panels requires a variety of cleaning processes in order to maintain a clean state.
Cleaning of semiconductors and display panels is for removing contaminants or removing oxide films. The cleaning process requires cleaning wafers, masks, or tool-related tools, and is a process that must be passed through before and after each process in the manufacture of display panels such as semiconductors, LCDs, LEDs, and OLEDs. In the washing process, hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, ultrapure water, isopropyl alcohol (IPA) or various organic solvents are used alone or a mixed solution is used.
In addition, various chemical reactants generated after thin film application, photo, etching, ion implantation, etc. using a cleaning device using ultrasonic, plasma, laser, pressurized injection, or heating in parallel with the use of various chemicals. Removed or unnecessary foreign matter.
In the prior art, most of the problems for semiconductor and display panel cleaning can be solved. However, the polymerized foreign matter stuck to the semiconductor and display panel manufacturing process, or the lump of the organic material or the oxidized thin film that has undergone curing has a problem in that it is not easily removed due to its strong chemical resistance and physical strength or elasticity. Therefore, there is a need for a device or method that can solve these problems.
The present invention is to solve the above problems, using a small amount of chemical, that is, inorganic powder to polymerize or harden the polymerized or hardened to the cleaning object such as semiconductor, display panel or wafer, masks or process-related tools The purpose is to remove effectively.
In order to achieve the above object, the present invention provides a cleaning method for a semiconductor and display panel manufacturing process, the method comprising the steps of: (a) filling a predetermined amount of inorganic powder in a powder cleaning tank installed in a housing having an exhaust facility; (b) injecting and loading one or more cleaning objects into the powder cleaning tank; (c) heating the powder washing tank by direct heating or indirect heating with a constant temperature using a heating device to clean and burn the organic and inorganic substances adhered to the object to be cleaned using inorganic powder at a predetermined temperature. The present invention provides a cleaning method for a semiconductor and display panel manufacturing process.
In addition, in the present invention, the cleaning object may be added to the powder cleaning tank filled with the inorganic powder in the temperature range of 50 ℃ ~ 900 ℃.
In the present invention, the inorganic powder is a metal oxide (MxOy), or a composite metal oxide (M1xM2yOz), including silica (SiO2), alumina (Al2O3), titanium oxide (TiO2), sodium carbonate, sodium bicarbonate, potassium carbonate Or any one or more of carbonate metal (MxCOy) or metal nitrate (MxNOy) or metal hydroxide (Mx (OH) y) including calcium nitrate, sodium nitrate, potassium nitrate, sodium hydroxide, potassium hydroxide, potassium oxide It may include a complex.
In addition, in the present invention, the inorganic powder may be selected from the range of the particle size of 0.1μm ~ 500μm in a certain range, the dispersion of the particles in the range is within the 3 sigma range.
In addition, the present invention provides a cleaning apparatus for a semiconductor and display panel manufacturing process, comprising: a powder cleaning tank installed in a housing, filled with a certain amount of inorganic powder, and loaded with a plurality of cleaning objects; A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank; A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And an exhaust system installed in the housing to collect and filter the fine dust and exhaust gas generated in the powder cleaning tank, wherein the semiconductor is cleaned by burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the powder cleaning tank. It is characterized by providing a cleaning device for a display panel manufacturing process.
In addition, in the present invention, the first heating device is a method of heating directly inside the powder cleaning tank or indirect heating is applied to the outside of the powder cleaning tank, the first heating device is heated by electricity, gas burner or far infrared rays In addition, the first heating device may heat the inorganic powder that has already been heated and supplied from the outside, or increase or decrease the inorganic powder to reach a predetermined temperature, or keep the inorganic powder at a constant temperature.
In addition, in the present invention, the convection device includes a mechanical rotating body or a rotating plate, and includes a blower for supplying a gas to the powder cleaning tank through the blower tube, the gas supplied may include air, oxygen, nitrogen or argon. .
In addition, in the present invention, the exhaust facility is provided with a duct for guiding and discharging the air inside the housing, the exhaust duct is provided with an exhaust fan for sucking and discharging the fine dust and exhaust gas generated in the powder cleaning tank, An air shower or a dust collecting filter for collecting and filtering fine dust and exhaust gas may be installed in the duct.
In addition, in the present invention, the first circulating pipe connected from the upper side to the lower side to the side of the powder washing tank, and the inorganic powder introduced from the lower portion of the powder washing tank to the predetermined temperature by heating to the upper portion of the powder washing tank. A powder circulation device including a second heating device to be introduced, and a porous plate for filtering foreign matters contained in the inorganic powder may be installed in the powder cleaning tank.
In addition, in the present invention, the supply device for supplying the inorganic powder to the powder cleaning tank through the supply pipe, the third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a constant temperature, and the supply through the supply pipe It may further include a powder heating supply device including a supply control device for adjusting the amount of inorganic powder.
In addition, in the present invention, a second circulation pipe for purifying and circulating inorganic powder is provided between the powder cleaning tank and the supply device, and the second circulation pipe is used to burn unburned substances contained in the inorganic powder or to treat aggregates. Purifiers may be installed.
In addition, the present invention provides a cleaning apparatus for a semiconductor and display panel manufacturing process, comprising: a plurality of single-layer powder cleaning tanks installed in a housing, filled with a certain amount of inorganic powder, and filled with cleaning objects; A fourth heating device for applying heat of a predetermined temperature to the inorganic powder filled in the sheet type powder cleaning tank; A carrier supported by a support provided outside the sheet-type powder cleaning tank and held by a frame fixed to the frame to move up and down by the sheet-type powder cleaning tank; A filtering net installed on the carrier side to filter the decomposition residue contained in the inorganic powder; When the object to be cleaned is separated from the sheet-type powder cleaning tank by the carrier and separated from the sheet-type powder cleaning tank, the cleaning object and the carrier are sealed and accommodated on both sides of the upper part of the sheet-type powder cleaning tank so as to be contained in the carrier and the cleaning object. A pair of scattering preventing members for preventing the powder from scattering; At least one convection device that stirs the inorganic powder filled in the sheet type powder cleaning tank or generates convection using ultrasonic waves or gas; And an exhaust system installed in the housing for collecting and filtering fine dust and exhaust gas generated in the single-leaf powder cleaning tank, and burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the single-leaf powder cleaning tank. It is characterized by providing a cleaning device for a semiconductor and display panel manufacturing process for cleaning.
In addition, in the present invention, the single-leaf powder washing tank is a supply device for supplying the inorganic powder through the supply pipe, a third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a constant temperature, and the supply pipe It may further include a powder heating supply device including a supply control device for adjusting the amount of the inorganic powder supplied through.
In addition, in the present invention, the convection device includes a blower pipe that is mechanically rotated, and includes a blower for blowing gas through the blower hole of the blower pipe in the upper and lower or upper or lower portion of the convection device, the blower is heat The heat generating member is generated, and the gas may include air, oxygen, nitrogen, or argon.
In addition, in the present invention, any one of the plurality of single-leaf powder washing tank is kept in the idle state while the cleaning object is put into the cleaning, and in the idle state to heat the inside of the single-leaf powder washing tank to a certain temperature. Can be.
In addition, in the present invention, a plurality of washing tanks for washing the object to be cleaned in the single-leaf powder washing tank with pure water or gas is installed, the drying tank for drying the washing object washed in the washing tank may be further included.
In addition, in the present invention, the sieve is folded when the carrier is introduced into the sheet-type powder cleaning tank and is folded at an angle when the carrier rises to fold to filter out the decomposition residue contained in the inorganic powder, the sieve is inorganic powder It may be made of a mesh larger than the diameter of.
The present invention can be completely removed by burning or peeling of a plastic material or a polymer organic matter by means of fine high temperature fluid powder in a powder cleaning tank by means of the above-mentioned solution, and relatively inexpensive energy such as an electric heater, a far infrared ray generator, a gas burner, etc. It is possible to use raw materials, and by applying the modular washing tank to the existing washing equipment, it provides cost saving, convenience of washing, and reliability of the washing equipment, and almost no chemical consumption compared to the existing melting tank cleaning equipment. In addition, due to the reactivity of the molten alkali, the use of expensive materials for the corrosion of the device and the implementation of the molten alkali, such as preventing the absorption of CO2 and moisture in the air, simplify the device configuration and improve the convenience of cleaning operations.
1 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a first embodiment according to the present invention.
2 is a flowchart illustrating a cleaning method for a semiconductor and display panel manufacturing process according to the present invention.
3 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a second embodiment of the present invention.
4 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a third embodiment of the present invention.
5 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a fourth embodiment of the present invention.
6 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process equipped with a single-leaf powder cleaning tank according to a fifth embodiment of the present invention.
7 is a block diagram showing a carrier according to the present invention.
8 is a perspective view showing that the carrier and the dustproof member according to the present invention are coupled to a support.
9 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process equipped with a single-leaf powder cleaning tank and a plurality of washing tank and drying tank according to the present invention.
Hereinafter, a cleaning apparatus for a semiconductor and display panel manufacturing process according to the present invention will be described in detail with reference to the accompanying drawings.
In FIG. 1, in the first embodiment of the present invention, the
The
The
The
The
The
In addition, the
The
In addition, the
Next, Figure 3 shows a cleaning apparatus constructed as a second embodiment of the present invention, the
The
In addition, the
Next, Figure 4 shows a cleaning apparatus constructed as a third embodiment of the present invention, the
The
In the third embodiment, the
Next, Fig. 5 shows a washing apparatus constructed as a fourth embodiment of the present invention.
In the
The
In addition, a
Next, Fig. 6 shows a washing apparatus constructed as a fifth embodiment of the present invention.
A plurality of sheet type
Then, the powder
A
The
In addition, a
Rather than injecting and cleaning the
In addition, in Figure 7, the carrier for lifting or removing the object to be lifted by the single-leaf powder washing tank is shown. First, the
In FIG. 8, a
In addition, in FIG. 9, the washing | cleaning object in which the washing | cleaning was completed in the single-leaf type
2, a flowchart of a cleaning method using a cleaning device for a semiconductor and display panel manufacturing process according to the present invention will be described.
First, the
Then, one or
Under the above conditions, the
An example of the actual experiment through the powder cleaning tank of the cleaning device using the cleaning method is shown in Table 1 below.
Tally (PET) (170 μm)
In Table 1, in the first experimental example, the
In the second experimental example, the
In the third experimental example, the
In the fourth experimental example, the
On the other hand, for comparison with the first embodiment of the present invention it can be confirmed through the experiment the results appearing in the apparatus for cleaning with a melt in the molten bath as shown in Table 2.
In Table 2, in Comparative Example 1, a 200 μm polyacryl film was immersed in a sodium hydroxide (NaOH) melt for about 5 minutes as a cleaning object fixed on a metal plate, but the removal effect was good, but the NaOH and N2 atmosphere gases were excessive. Was exhausted.
Also in the case of the second comparative example, the same results as in the first comparative example were obtained.
Accordingly, the present invention has an excellent effect of removing polymerized and fixed impurities that are difficult to remove with mixed acid, organic and inorganic materials by using inorganic materials such as semiconductors and display panels and / or heating devices.
While the invention has been shown and described in connection with specific embodiments thereof, it is well known in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as indicated by the claims. Anyone who has a can easily know.
DESCRIPTION OF
Claims (17)
(a) filling a predetermined amount of inorganic powder into a powder cleaning tank installed in a housing equipped with exhaust facilities;
(b) injecting and loading one or more cleaning objects into the powder cleaning tank;
(c) heating the powder washing tank by direct heating or indirect heating with a constant temperature using a heating device to clean and burn the organic and inorganic substances adhered to the object to be cleaned using inorganic powder at a predetermined temperature. Cleaning method for semiconductor and display panel manufacturing process.
A powder cleaning tank installed in the housing, filled with a predetermined amount of inorganic powder, and loaded with a plurality of cleaning objects;
A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank;
A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And
It is installed in the housing and includes an exhaust facility for collecting and filtering the fine dust and exhaust gas generated in the powder cleaning tank,
A cleaning apparatus for a semiconductor and display panel manufacturing process for cleaning by burning or peeling off organic or inorganic substances adhered to a cleaning object put into the powder cleaning tank.
A plurality of single-leaf powder cleaning tanks installed in the housing to fill a predetermined amount of inorganic powder and to put the cleaning objects in;
A fourth heating device for applying heat of a predetermined temperature to the inorganic powder filled in the sheet type powder cleaning tank;
A carrier supported by a support provided outside the sheet-type powder cleaning tank and held by a frame fixed to the frame to move up and down by the sheet-type powder cleaning tank;
A filtering net installed on the carrier side to filter the decomposition residue contained in the inorganic powder;
When the object to be cleaned is separated from the sheet-type powder cleaning tank by the carrier and separated from the sheet-type powder cleaning tank, the cleaning object and the carrier are sealed and accommodated on both sides of the upper part of the sheet-type powder cleaning tank so as to be contained in the carrier and the cleaning object. A pair of scattering preventing members for preventing the powder from scattering;
At least one convection device that stirs the inorganic powder filled in the sheet type powder cleaning tank or generates convection using ultrasonic waves or gas; And
It is installed in the housing includes an exhaust facility for collecting and filtering the fine dust and exhaust gas generated in the single-leaf powder washing tank,
A cleaning apparatus for a semiconductor and display panel manufacturing process for cleaning by burning or peeling off organic or inorganic substances adhered to a cleaning object put into the sheet-type powder cleaning tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120007672A KR20130086754A (en) | 2012-01-26 | 2012-01-26 | Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120007672A KR20130086754A (en) | 2012-01-26 | 2012-01-26 | Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130086754A true KR20130086754A (en) | 2013-08-05 |
Family
ID=49213843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120007672A KR20130086754A (en) | 2012-01-26 | 2012-01-26 | Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20130086754A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170001058U (en) | 2015-09-14 | 2017-03-22 | 주식회사 신성이앤드지 | Hand axe for fire fighting |
KR20200032791A (en) * | 2018-09-18 | 2020-03-27 | 주식회사 삼에스코리아 | Apparatus and method for impurity removal of silica-based powder |
KR102109158B1 (en) * | 2020-03-17 | 2020-05-11 | 전홍규 | Air filter for manufacturing device of semiconductor and display panel, and air filter manufacturing apparatus for manufacturing the air filter for manufacturing device of semiconductor and display panel |
-
2012
- 2012-01-26 KR KR1020120007672A patent/KR20130086754A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170001058U (en) | 2015-09-14 | 2017-03-22 | 주식회사 신성이앤드지 | Hand axe for fire fighting |
KR20200032791A (en) * | 2018-09-18 | 2020-03-27 | 주식회사 삼에스코리아 | Apparatus and method for impurity removal of silica-based powder |
KR102109158B1 (en) * | 2020-03-17 | 2020-05-11 | 전홍규 | Air filter for manufacturing device of semiconductor and display panel, and air filter manufacturing apparatus for manufacturing the air filter for manufacturing device of semiconductor and display panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103008311B (en) | A kind of dry-type cleaning method based on ultraviolet light | |
JP6596735B2 (en) | Method of recovering valuable material from solar cell module and processing device for recovery | |
TWI452623B (en) | Substrate processing apparatus and substrate processing method | |
JP2019176125A (en) | Substrate processing method and substrate processing apparatus | |
CN102832101B (en) | Crystalline silicon cleaning method | |
CN106233449A (en) | Air cushion equipment and technology for substrate coating | |
JP6282904B2 (en) | Substrate processing equipment | |
JPH0349224A (en) | Treating method for substrate | |
KR20090032505A (en) | Box cleaner for cleaning wafer shipping box | |
TW202314925A (en) | Substrate processing apparatus and substrate processing method | |
KR20130086754A (en) | Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof | |
CN1163947C (en) | Processor, method and robot device therefor | |
CN208437283U (en) | Substrate cleaning apparatus | |
KR20130007389A (en) | Substrate processing apparatus and substrate processing method | |
CN116423838A (en) | Cleaning module, cleaning equipment and cleaning method | |
CN202189222U (en) | Photomask cleaning device | |
TWI660795B (en) | Substrate processing apparatus and substrate processing method | |
KR20130086760A (en) | Apparatus for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel | |
JP2004165636A (en) | Substrate-treating apparatus | |
KR200433078Y1 (en) | One body type cleaning apparatus for flat panel display | |
KR101395248B1 (en) | nozzle unit | |
WO2003092054A1 (en) | Mounting method and mounting system | |
EP3583286A1 (en) | Thermal treatment of pane elements for vacuum insulating glass units | |
CN204353149U (en) | A kind of plasma cleaning device | |
JP2005319377A (en) | Washing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |