KR20130086754A - Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof - Google Patents

Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof Download PDF

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Publication number
KR20130086754A
KR20130086754A KR1020120007672A KR20120007672A KR20130086754A KR 20130086754 A KR20130086754 A KR 20130086754A KR 1020120007672 A KR1020120007672 A KR 1020120007672A KR 20120007672 A KR20120007672 A KR 20120007672A KR 20130086754 A KR20130086754 A KR 20130086754A
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KR
South Korea
Prior art keywords
powder
cleaning
tank
semiconductor
cleaning tank
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KR1020120007672A
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Korean (ko)
Inventor
최영준
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(주)에스피에이시티
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Priority to KR1020120007672A priority Critical patent/KR20130086754A/en
Publication of KR20130086754A publication Critical patent/KR20130086754A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cleaning method for removing dots, adhesion or deposition on a semiconductor or display panel, and other contaminants in the manufacturing process of a semiconductor or display panel, and a cleaning apparatus thereof. Claims [1] A powder cleaning tank comprising: a powder cleaning tank installed in a housing and filled with a predetermined amount of inorganic powder and loaded with a plurality of cleaning objects; A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank; A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And an exhaust facility installed in the housing to collect and filter fine dust and exhaust gas generated in the powder cleaning tank, and to clean by burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the powder cleaning tank. The present invention can be completely removed by the combustion or peeling of the plastic material or the polymer organic matter by the fine high-temperature flowable powder in the powder cleaning tank, it is possible to use a relatively inexpensive energy source such as electric heater, far infrared generator, gas burner, The powder cleaning tank is modularized and applied to existing cleaning equipment, which provides cost savings, convenience of cleaning, and reliability of the cleaning equipment. Due to the use of expensive materials in preparation for corrosion of the device, prevention of the generation of CO2 in the air of molten alkali and prevention of moisture absorption, the device configuration is simplified and the convenience of cleaning is improved.

Description

Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus

The present invention relates to a method and apparatus for cleaning semiconductors and display panels, and more particularly, to remove dots, adhesion or deposition on semiconductors or display panels, and other contaminants in the manufacturing process of semiconductors or display panels. A cleaning method and a cleaning apparatus thereof.

In general, cleaning processes are essential in processes for manufacturing semiconductors and display panels. Semiconductor and display panels use a variety of raw materials or subsidiary materials in the manufacturing process, and the manufacturing process of the semiconductor and display panels requires a variety of cleaning processes in order to maintain a clean state.

Cleaning of semiconductors and display panels is for removing contaminants or removing oxide films. The cleaning process requires cleaning wafers, masks, or tool-related tools, and is a process that must be passed through before and after each process in the manufacture of display panels such as semiconductors, LCDs, LEDs, and OLEDs. In the washing process, hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, ultrapure water, isopropyl alcohol (IPA) or various organic solvents are used alone or a mixed solution is used.

In addition, various chemical reactants generated after thin film application, photo, etching, ion implantation, etc. using a cleaning device using ultrasonic, plasma, laser, pressurized injection, or heating in parallel with the use of various chemicals. Removed or unnecessary foreign matter.

In the prior art, most of the problems for semiconductor and display panel cleaning can be solved. However, the polymerized foreign matter stuck to the semiconductor and display panel manufacturing process, or the lump of the organic material or the oxidized thin film that has undergone curing has a problem in that it is not easily removed due to its strong chemical resistance and physical strength or elasticity. Therefore, there is a need for a device or method that can solve these problems.

The present invention is to solve the above problems, using a small amount of chemical, that is, inorganic powder to polymerize or harden the polymerized or hardened to the cleaning object such as semiconductor, display panel or wafer, masks or process-related tools The purpose is to remove effectively.

In order to achieve the above object, the present invention provides a cleaning method for a semiconductor and display panel manufacturing process, the method comprising the steps of: (a) filling a predetermined amount of inorganic powder in a powder cleaning tank installed in a housing having an exhaust facility; (b) injecting and loading one or more cleaning objects into the powder cleaning tank; (c) heating the powder washing tank by direct heating or indirect heating with a constant temperature using a heating device to clean and burn the organic and inorganic substances adhered to the object to be cleaned using inorganic powder at a predetermined temperature. The present invention provides a cleaning method for a semiconductor and display panel manufacturing process.

In addition, in the present invention, the cleaning object may be added to the powder cleaning tank filled with the inorganic powder in the temperature range of 50 ℃ ~ 900 ℃.

In the present invention, the inorganic powder is a metal oxide (MxOy), or a composite metal oxide (M1xM2yOz), including silica (SiO2), alumina (Al2O3), titanium oxide (TiO2), sodium carbonate, sodium bicarbonate, potassium carbonate Or any one or more of carbonate metal (MxCOy) or metal nitrate (MxNOy) or metal hydroxide (Mx (OH) y) including calcium nitrate, sodium nitrate, potassium nitrate, sodium hydroxide, potassium hydroxide, potassium oxide It may include a complex.

In addition, in the present invention, the inorganic powder may be selected from the range of the particle size of 0.1μm ~ 500μm in a certain range, the dispersion of the particles in the range is within the 3 sigma range.

In addition, the present invention provides a cleaning apparatus for a semiconductor and display panel manufacturing process, comprising: a powder cleaning tank installed in a housing, filled with a certain amount of inorganic powder, and loaded with a plurality of cleaning objects; A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank; A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And an exhaust system installed in the housing to collect and filter the fine dust and exhaust gas generated in the powder cleaning tank, wherein the semiconductor is cleaned by burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the powder cleaning tank. It is characterized by providing a cleaning device for a display panel manufacturing process.

In addition, in the present invention, the first heating device is a method of heating directly inside the powder cleaning tank or indirect heating is applied to the outside of the powder cleaning tank, the first heating device is heated by electricity, gas burner or far infrared rays In addition, the first heating device may heat the inorganic powder that has already been heated and supplied from the outside, or increase or decrease the inorganic powder to reach a predetermined temperature, or keep the inorganic powder at a constant temperature.

In addition, in the present invention, the convection device includes a mechanical rotating body or a rotating plate, and includes a blower for supplying a gas to the powder cleaning tank through the blower tube, the gas supplied may include air, oxygen, nitrogen or argon. .

In addition, in the present invention, the exhaust facility is provided with a duct for guiding and discharging the air inside the housing, the exhaust duct is provided with an exhaust fan for sucking and discharging the fine dust and exhaust gas generated in the powder cleaning tank, An air shower or a dust collecting filter for collecting and filtering fine dust and exhaust gas may be installed in the duct.

In addition, in the present invention, the first circulating pipe connected from the upper side to the lower side to the side of the powder washing tank, and the inorganic powder introduced from the lower portion of the powder washing tank to the predetermined temperature by heating to the upper portion of the powder washing tank. A powder circulation device including a second heating device to be introduced, and a porous plate for filtering foreign matters contained in the inorganic powder may be installed in the powder cleaning tank.

In addition, in the present invention, the supply device for supplying the inorganic powder to the powder cleaning tank through the supply pipe, the third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a constant temperature, and the supply through the supply pipe It may further include a powder heating supply device including a supply control device for adjusting the amount of inorganic powder.

In addition, in the present invention, a second circulation pipe for purifying and circulating inorganic powder is provided between the powder cleaning tank and the supply device, and the second circulation pipe is used to burn unburned substances contained in the inorganic powder or to treat aggregates. Purifiers may be installed.

In addition, the present invention provides a cleaning apparatus for a semiconductor and display panel manufacturing process, comprising: a plurality of single-layer powder cleaning tanks installed in a housing, filled with a certain amount of inorganic powder, and filled with cleaning objects; A fourth heating device for applying heat of a predetermined temperature to the inorganic powder filled in the sheet type powder cleaning tank; A carrier supported by a support provided outside the sheet-type powder cleaning tank and held by a frame fixed to the frame to move up and down by the sheet-type powder cleaning tank; A filtering net installed on the carrier side to filter the decomposition residue contained in the inorganic powder; When the object to be cleaned is separated from the sheet-type powder cleaning tank by the carrier and separated from the sheet-type powder cleaning tank, the cleaning object and the carrier are sealed and accommodated on both sides of the upper part of the sheet-type powder cleaning tank so as to be contained in the carrier and the cleaning object. A pair of scattering preventing members for preventing the powder from scattering; At least one convection device that stirs the inorganic powder filled in the sheet type powder cleaning tank or generates convection using ultrasonic waves or gas; And an exhaust system installed in the housing for collecting and filtering fine dust and exhaust gas generated in the single-leaf powder cleaning tank, and burning or peeling off the organic and inorganic substances adhered to the cleaning object put into the single-leaf powder cleaning tank. It is characterized by providing a cleaning device for a semiconductor and display panel manufacturing process for cleaning.

In addition, in the present invention, the single-leaf powder washing tank is a supply device for supplying the inorganic powder through the supply pipe, a third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a constant temperature, and the supply pipe It may further include a powder heating supply device including a supply control device for adjusting the amount of the inorganic powder supplied through.

In addition, in the present invention, the convection device includes a blower pipe that is mechanically rotated, and includes a blower for blowing gas through the blower hole of the blower pipe in the upper and lower or upper or lower portion of the convection device, the blower is heat The heat generating member is generated, and the gas may include air, oxygen, nitrogen, or argon.

In addition, in the present invention, any one of the plurality of single-leaf powder washing tank is kept in the idle state while the cleaning object is put into the cleaning, and in the idle state to heat the inside of the single-leaf powder washing tank to a certain temperature. Can be.

In addition, in the present invention, a plurality of washing tanks for washing the object to be cleaned in the single-leaf powder washing tank with pure water or gas is installed, the drying tank for drying the washing object washed in the washing tank may be further included.

In addition, in the present invention, the sieve is folded when the carrier is introduced into the sheet-type powder cleaning tank and is folded at an angle when the carrier rises to fold to filter out the decomposition residue contained in the inorganic powder, the sieve is inorganic powder It may be made of a mesh larger than the diameter of.

The present invention can be completely removed by burning or peeling of a plastic material or a polymer organic matter by means of fine high temperature fluid powder in a powder cleaning tank by means of the above-mentioned solution, and relatively inexpensive energy such as an electric heater, a far infrared ray generator, a gas burner, etc. It is possible to use raw materials, and by applying the modular washing tank to the existing washing equipment, it provides cost saving, convenience of washing, and reliability of the washing equipment, and almost no chemical consumption compared to the existing melting tank cleaning equipment. In addition, due to the reactivity of the molten alkali, the use of expensive materials for the corrosion of the device and the implementation of the molten alkali, such as preventing the absorption of CO2 and moisture in the air, simplify the device configuration and improve the convenience of cleaning operations.

1 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a first embodiment according to the present invention.
2 is a flowchart illustrating a cleaning method for a semiconductor and display panel manufacturing process according to the present invention.
3 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a second embodiment of the present invention.
4 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a third embodiment of the present invention.
5 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process according to a fourth embodiment of the present invention.
6 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process equipped with a single-leaf powder cleaning tank according to a fifth embodiment of the present invention.
7 is a block diagram showing a carrier according to the present invention.
8 is a perspective view showing that the carrier and the dustproof member according to the present invention are coupled to a support.
9 is a block diagram showing a cleaning apparatus for a semiconductor and display panel manufacturing process equipped with a single-leaf powder cleaning tank and a plurality of washing tank and drying tank according to the present invention.

Hereinafter, a cleaning apparatus for a semiconductor and display panel manufacturing process according to the present invention will be described in detail with reference to the accompanying drawings.

In FIG. 1, in the first embodiment of the present invention, the powder cleaning bath 12 is embedded in the housing 11 of the cleaning device 10. The cleaning device 10 may be cleaned by thermal decomposition of the inorganic powder 13 heated by the heating of the first heating device 14 and convection of the heated inorganic powder 13 by the convection device 40. 1) In other words, cleaning is performed by removing foreign matter that has adhered to the minute portion of the semiconductor or display panel.

The powder cleaning tank 12 is installed in the housing 11 and is for loading one or more cleaning objects 1. The powder cleaning tank 12 has a volume into which one or more cleaning objects 1 can be put, and preferably has a structure in which the cleaning objects 1 can be easily added and separated.

The inorganic powder 13 is put into the powder cleaning tank 12 in a predetermined amount to remove foreign matters stuck to the cleaning object 1. Powder is an aggregate of solid fine particles. The powder is an object in which a plurality of solid particles are collected and can be divided according to the size of the particles forming them. Treated as a powder is an aggregate of solid materials having a particle diameter of approximately 0.1 μm to 1 mm, and has an agglomeration and adsorption effect with flour, powdered alumina (aluminum oxide), or soot.

The inorganic powder 13 applied in the present invention is a metal oxide (MxOy), or a composite metal oxide (M1xM2yOz) including silica (SiO 2), alumina (Al 2 O 3), titanium oxide (TiO 2), sodium carbonate, sodium bicarbonate, potassium carbonate , Calcium nitrate, sodium nitrate, potassium nitrate, sodium hydroxide, potassium hydroxide, carbonated metal (MxCOy) including potassium oxide or metal nitrate (MxNOy) or metal hydroxide (Mx (OH) y), and the like, or any of these Any one or more may be mixed into the complex. Furthermore, the inorganic powder 13 can select a certain range from the range of particle size 0.1 micrometer-500 micrometers, and it is preferable that the dispersion of particle | grains exists in 3 sigma range in that range.

The exhaust system 20 is installed at one side of the housing 11 of the cleaning device 10. The exhaust system 15 sucks and discharges gas, dust, etc. generated in the housing 11. Exhaust system 20 is connected to the duct 21 to guide the air discharged from the housing (11). An exhaust fan 22 is mounted in the duct 21 to suck air containing gas or dust inside the housing 11. In addition, an air shower 23 or a dust collecting filter 24 for collecting and filtering fine dust and exhaust gas passing through the exhaust fan 22 may be selectively installed in the duct 21.

The 1st heating apparatus 14 is installed in the outer periphery of the powder washing tank 12, and heats the powder washing tank 12. As shown in FIG. The first heating device 14 includes an electric heater that generates heat with electric energy, a far infrared generator that generates far infrared rays, or a gas burner that generates heat with gas energy. If necessary, one or more electric heaters, far infrared generators, and gas burners may be used. The first heating device 14 is for heating the powder cleaning tank 12 to heat the inorganic powder 13 introduced into the powder cleaning tank 12, and may be installed inside the powder cleaning tank 12. Moreover, the heating temperature of the inorganic powder 13 thrown into the powder washing tank 12 is about 50 to 900 degreeC, Preferably it is about 350 degreeC.

In addition, the first heating device 14 is to heat the inorganic powder that has already been heated and supplied from the outside, or to raise or lower the inorganic powder to reach a predetermined temperature, or to maintain the inorganic powder at a constant temperature.

The convection device 40 stirs the inorganic powder 13 filled in the powder washing tank 12 or causes convection by using ultrasonic radiation or injection of gas. The convection device 40 includes a mechanical rotating body 41 or a rotating plate, and may further include a blower 50 for supplying gas to the powder cleaning tank 12 through the blower pipe 51. The gas supplied to the powder washing tank 12 includes air, oxygen, nitrogen, argon, or the like.

In addition, the powder cleaning tank 12 including the first heating device 14 may be configured as an integrated unit module and applied to an existing cleaning device. In addition, the substrate of the cleaning object 1 may include metal or stone, and the cleaning object 1 may be a wafer, masks, or a tool associated with a process. In particular, the present invention is useful for separating and removing the polymerized foreign matter adhered to the surface of the semiconductor or display panel.

Next, Figure 3 shows a cleaning apparatus constructed as a second embodiment of the present invention, the housing 10 and the exhaust system 20 is not shown.

The first circulation pipe 31 is connected to the lower side from the upper side to the lower side of the powder cleaning tank 12, and the first circulation pipe 31 is provided with a powder circulation device 30 having a second heating device 32. . The second heating device 32 heats the inorganic powder 13 introduced from the lower portion of the powder washing tank 12 to a predetermined temperature and inputs the upper portion of the powder washing tank 12. In this case, although both the first heating device 14 and the second heating device 32 may be installed, when the second heating device 32 is installed, the first heating device 14 may be omitted. The second heating device 32 is for heating while circulating the inorganic powder 13 so that the inorganic powder 13 filled in the powder cleaning tank 12 does not fall below a predetermined predetermined temperature.

In addition, the porous plate 45 may be installed in the lower portion of the powder cleaning tank 12 to filter foreign matter contained in the inorganic powder 13 filled in the powder cleaning tank 12.

Next, Figure 4 shows a cleaning apparatus constructed as a third embodiment of the present invention, the housing 10 and the exhaust facility 20 is not shown.

The powder washing tank 12 is provided with a powder heating supply device 60. The powder heating supply device 60 is provided with a supply pipe 62 for supplying the inorganic powder 13 to the powder cleaning tank 12, and the inorganic powder supplied from the powder supply device 61 through the supply pipe 62. A third heating device (63) for heating the temperature (13) to a predetermined temperature is installed in the supply pipe (62), and a supply control device for adjusting the input amount of the inorganic powder (13) supplied through the supply pipe (62) 64 is provided in the supply pipe 62. The supply pipe 62 may be installed above the powder cleaning tank 12 or may be installed across the top.

In the third embodiment, the first heating device 14 of the first embodiment and the powder circulation device 30 of the second embodiment may be omitted.

Next, Fig. 5 shows a washing apparatus constructed as a fourth embodiment of the present invention.

In the powder washing tank 12, a plurality of convection devices 40, a powder heating supply device 60, and a circulation purification device 70 are provided. The convection device 40 is installed at regular intervals, and the cleaning object 13 is positioned between the convection devices 40. Convection device 40 is equipped with a blower 53 for supplying gas from the upper and / or lower, the blower pipe 43 for injecting the blown gas into the powder cleaning tank 12 is installed vertically, On the outer circumference of the blowing pipe 43, a plurality of blowing holes 44 through which gas is injected are formed. In addition, the blower pipe 43 may be mechanically rotated, and the blower 53 may include a heat generating member 54 that generates heat, and the gas injected into the powder cleaning tank 12 may be air, oxygen, nitrogen, or argon. And the like.

The powder washing tank 12 is provided with a powder heating supply device 60. The powder heating supply device 60 is provided with a supply pipe 62 for supplying the inorganic powder 13 to the powder cleaning tank 12, and the inorganic powder supplied from the powder supply device 61 through the supply pipe 62. A third heating device (63) for heating the temperature (13) to a predetermined temperature is installed in the supply pipe (62), and a supply control device for adjusting the input amount of the inorganic powder (13) supplied through the supply pipe (62) 64 is provided in the supply pipe 62. The supply pipe 62 is provided across the upper portion of the powder washing tank 12, and a plurality of feeding holes 62a for feeding the powder into the powder washing tank 12 are formed in the supply pipe 62.

In addition, a circulation purification device 70 for circulating and purifying the inorganic powder 13 to the side of the powder washing tank 12 is provided. The circulating purification device 70 burns unburned material contained in the powder introduced from the powder cleaning tank 12 via the second circulation pipe 71 or processes the aggregate, and then supplies the purified powder to the powder heating supply device 60. ) Is re-injected into the powder supply device 61.

Next, Fig. 6 shows a washing apparatus constructed as a fifth embodiment of the present invention.

A plurality of sheet type powder cleaning tanks 15 are installed in the housing 11. In FIG. 6, three sheet-type powder washing tanks 15 are provided for three sheets, but may be added or subtracted as necessary. Each sheet type powder washing tank 15 is provided with a fourth heating device 75, and the fourth heating unit 75 is heated to maintain the inorganic powder filled in the sheet type powder washing tank 15 at a constant temperature. Is to add.

Then, the powder heating supply device 60 is installed on the plurality of sheet type powder washing tanks 15, and the convection device 40 is installed in the sheet type powder washing tank 15, and the sheet type powder washing tank 15 is provided. The circulation purification device 70 is installed. The single-leaf powder washing tank 15 may not be easy to maintain a large amount of powder at a uniform temperature in a single powder washing tank, and thus may be applied when the effect due to the intended convection is not large. It would be. In the case of washing the cleaning object 1 using the independent sheet type powder washing tank 15, it is easy to maintain and maintain the PM and prevent maintenance in the event of any failure of the sheet type powder washing tank 15. have.

A convection device 40 is installed in each of the single-leaf powder washing tank 15, and a powder heating supply device 60 is installed above the single-leaf powder washing tank 15, and the side of the single-leaf powder washing tank 15 is provided. The circulation purification device 70 is installed.

The convection device 40 installed in the single-leaf powder washing tank 15 for cleaning a single object to be cleaned is equipped with a blower 53 for supplying gas from the upper and / or lower portion, and the blown gas is refilled. A blowing pipe 43 for spraying into the powder cleaning tank 15 is installed vertically, and a plurality of blowing holes 44 through which gas is injected are formed at the outer circumference of the blowing pipe 43. In addition, the blower pipe 43 may be mechanically rotated, and the blower 53 may include a heat generating member 54 that generates heat, and the gas injected into the single-leaf powder washing tank 15 may be air, oxygen, or nitrogen. Or argon and the like.

In addition, a circulation purification device 70 for circulating and purifying the inorganic powder 13 to the side of the single-leaf powder washing tank 15 is provided. The circulating purification device 70 burns the unburned material contained in the powder introduced from the single-leaf powder washing tank 15 through the second circulation pipe 71 or treats the aggregate, and then supplies the powder to heat the purified powder. It is reloaded into the powder supply device 61 of the device 60.

Rather than injecting and cleaning the cleaning object 1 into the sheet-type powder washing tank 15 according to the fifth embodiment, at least one of the single-leaf powder washing tank 15 may maintain an idle state. . For example, while cleaning or separating by inserting a cleaning object into two single-leaf powder cleaning tanks on both sides, the inorganic powder is heated by a fourth heating device without putting the cleaning object into one single-leaf powder cleaning tank in the center. Is to be maintained.

In addition, in Figure 7, the carrier for lifting or removing the object to be lifted by the single-leaf powder washing tank is shown. First, the frame 85 is fixedly coupled to the edge of the cleaning object 1. And the carrier 80 for holding and transporting or lifting the object (1) to which the frame 85 is coupled is provided. The carrier 80 is a jig for mechanical transportation required for cleaning the cleaning object 1. Therefore, any device for transporting the carrier 80 will be generally used conveyors and lifting devices and the like.

Carrier 80 is provided with a hook portion 81 for holding the upper and lower frame 85 on both sides of the frame 85 to which the cleaning object (1) is coupled, the sieve net 82 on the upper and lower rear surface of the carrier 80 ) Is installed. The sieve 82 is hinged so that the carrier 80 is folded by the powder when the carrier 80 is introduced into the single wafer cleaning tank 15 and then fixed when the carrier 80 rises from the single wafer cleaning tank 15. To expand at an angle. The strainer 82 is folded to filter the decomposition residue contained in the inorganic powder 13. The mesh of the sieve 82 should be formed of a mesh larger than the diameter of the inorganic powder. The angle at which the strainer 82 is unfolded is preferably within about 10 to 20 degrees from the horizontal to the top. Therefore, the hinge axis for supporting and rotating the strainer 82 is preferably designed so that the strainer 82 does not fall below a certain angle. In the sieve 82, the molten inorganic powder or the decomposition residues are filtered out.

In FIG. 8, a support 86 is provided as a lifting device for lowering, injecting, raising, and separating the carrier 80 into the sheet type powder cleaning tank 15, and the support 86 is provided with the carrier 80. A pair of scatter preventing members 87 are coupled. Carrier 80 is a structure capable of lifting the support 86 to the shaft is made by mechanical lifting by the rotational force of the motor or hydraulic or pneumatic. In addition, the support 86 may be additionally provided with a separate transfer device for transferring the carrier 80 to the left and right. In addition, the pair of scattering prevention members 87 are mounted on the support 86, when the object to be cleaned 1 is lifted from the single-leaf powder cleaning tank 15 by the carrier 80 and separated, the single-leaf powder cleaning tank By sealing the carrier 80 and the cleaning object 1 on both sides of the upper side so as to be able to be prevented from scattering the powder on the carrier and the cleaning object. Shatterproof member 87 is coupled to the structure that is rotated around the support 86, but may be coupled to the structure that is moved horizontally from the top of the single-leaf powder washing tank 15. The scattering preventing member 87 is intended to prevent the cleaning object 1 held by the carrier 80 and the powder deposited on the carrier 80 from scattering during the transfer, so that they do not stick to the floor or other tool. Therefore, the scattering prevention member 87 is provided in pairs in a shape that can seal the carrier 80 holding the cleaning object 1 on both left and right sides.

In addition, in FIG. 9, the washing | cleaning object in which the washing | cleaning was completed in the single-leaf type powder washing tank 15 is wash | cleaned through the several washing tanks 16 and 17 and the drying tank 18, and are completed. The washing tanks 16 and 17 wash the washing object with pure water or gas. That is, after the first washing with deionized water (DIW) in the first washing tank (16) and the second washing with deionized water in the second washing tank (17), the drying tank (18) is washed in the washing tank (17) The object is washed with isopropyl alcohol (IPA) and dried by generating hot air or the like. Therefore, the washing tanks 16 and 17 and the drying tank 18 may be installed in plural, and may be installed in the housing of the washing apparatus, but are separately installed to wash and dry the washing objects washed in the powder washing tank. Go through the process.

2, a flowchart of a cleaning method using a cleaning device for a semiconductor and display panel manufacturing process according to the present invention will be described.

First, the inorganic powder 13 of a predetermined amount is thrown into the powder washing tank 12 installed in the washing | cleaning apparatus 10 (S1). Then, the inorganic powder 13 introduced into the powder washing tank 12 is heated by the heating device 14 for a predetermined time and heated to a set temperature (S2).

Then, one or more cleaning objects 1 to be cleaned are put into the powder cleaning tank 12 to be submerged (S3). At this time, if necessary, the convection device 40 may be used to maintain an even temperature in the inorganic powder 13 heated to a predetermined temperature in the powder cleaning tank 12. In addition, by introducing a gas from the blower 50, it is possible to improve the convection action.

Under the above conditions, the washing object 1 submerged in the powder washing tank 12 is taken out and separated after a predetermined time, that is, approximately 0.5 to 25 minutes (S4). Since the washing object 1 separated from the powder washing tank 12 is a high temperature, it is cooled and washed at room temperature (S5). The cleaning object or the cooling object (1) cooled at room temperature is added to ultrapure water or additionally sprayed by spraying ultrapure water or air, oxygen, nitrogen, argon, etc. Masks or process related tools can be cleaned.

An example of the actual experiment through the powder cleaning tank of the cleaning device using the cleaning method is shown in Table 1 below.

division Object to be removed Powder time Temperature result Experimental Example Polyacryl Film (200μm) Silica 5 minutes 510 ℃ Complete removal Experimental Example Polypropylene membrane (150 μm) Sodium carbonate 10 minutes 470 ℃ Complete removal Experimental Example Polyimide Film (120μm) Alumina 15 minutes 600 ℃ Complete removal Experimental Example 4 Polyethylene Tereph
Tally (PET) (170 μm)
Calcium nitrate 20 minutes 450 ℃ Complete removal

In Table 1, in the first experimental example, the powder cleaning tank 12 is filled with silica (SiO 2) powder in a predetermined amount, and then heated to 510 ° C. by the heating device 14. And the inorganic powder 13 of the powder washing tank 12 is stirred by the convection apparatus 40, and the metal plate of SUS420 material in which the 200 micrometer polyacryl film was fixed is thrown into the powder washing tank 12, and it is submerged. Thereafter, it is confirmed that the combustion gas generated from the powder cleaning tank 12 escapes through the exhaust facility 15, and after about 5 minutes, the cleaning object 1 is taken out and washed with ultrapure water at 80 ° C. to check the surface of the metal plate. It could be confirmed that the acrylic film was completely removed.

In the second experimental example, the powder washing tank 12 is filled with sodium carbonate (Na 2 CO 3) powder in a predetermined amount, and then heated to 470 ° C. by the heating device 14. And the inorganic powder 13 of the powder washing tank 12 is stirred by the convection apparatus 40, the metal plate of the SUS316 material which 150 micrometers polypropylene film fixed was thrown into the powder washing tank 12, and it was submerged. Thereafter, it is confirmed that the combustion gas generated from the powder cleaning tank 12 escapes through the exhaust facility 15, and after about 10 minutes, the cleaning object 1 is taken out and washed with ultrapure water at 80 ° C. to check the surface of the metal plate. It could be confirmed that the acrylic film was completely removed.

In the third experimental example, the powder cleaning tank 12 is filled with alumina (Al 2 O 3) powder in a predetermined amount, and then heated to 600 ° C. by the heating device 14. And the inorganic powder 13 of the powder washing tank 12 is stirred by the convection apparatus 40, and the metal plate of SUS420 material in which the 120 micrometers polyimide film was fixed is thrown into the powder washing tank 12, and it is submerged. Thereafter, it is confirmed that the combustion gas generated from the powder cleaning tank 12 escapes through the exhaust facility 15, and after about 15 minutes, the cleaning object 1 is taken out, blown with air, and further washed with ultrapure water at 80 ° C. Checking the surface of the metal plate was confirmed that the polyacryl film was completely removed.

In the fourth experimental example, the powder cleaning tank 12 is filled with calcium nitrate (Ca (NO 3) 2) powder in a predetermined amount, and then heated to 450 ° C. by the heating device 14. And the inorganic powder 13 of the powder washing tank 12 is stirred by the convection apparatus 40, and the metal plate of the SUS316 material which 170 micrometers PET film adhered is thrown into the powder washing tank 12, and submerged. Thereafter, it is confirmed that the combustion gas generated from the powder cleaning tank 12 escapes through the exhaust facility 15, and after about 20 minutes, the cleaning object 1 is taken out and washed with ultrapure water at 80 ° C. to check the surface of the metal plate. It could be confirmed that the acrylic film was completely removed.

On the other hand, for comparison with the first embodiment of the present invention it can be confirmed through the experiment the results appearing in the apparatus for cleaning with a melt in the molten bath as shown in Table 2.

division Object to be removed Minerals / reaction conditions Reaction time result Comparative Example 1 Polyacryl Film (200μm) NaOH melt 5 minutes remove Comparative Example 2 Polyacryl Film (200μm) KOH Melt 3 minutes remove

In Table 2, in Comparative Example 1, a 200 μm polyacryl film was immersed in a sodium hydroxide (NaOH) melt for about 5 minutes as a cleaning object fixed on a metal plate, but the removal effect was good, but the NaOH and N2 atmosphere gases were excessive. Was exhausted.

Also in the case of the second comparative example, the same results as in the first comparative example were obtained.

Accordingly, the present invention has an excellent effect of removing polymerized and fixed impurities that are difficult to remove with mixed acid, organic and inorganic materials by using inorganic materials such as semiconductors and display panels and / or heating devices.

While the invention has been shown and described in connection with specific embodiments thereof, it is well known in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as indicated by the claims. Anyone who has a can easily know.

DESCRIPTION OF SYMBOLS 10 Cleaning device 11 Housing 12 Powder cleaning tank 13: Inorganic powder 14, 32, 63, 75 Heating device 15 Single sheet powder cleaning tank 16, 17 Cleaning tank 18 Drying tank 20 Exhaust facility 21 Duct 22 Exhaust Fan 23 Air Shower 24 Dust Collector Filter 30 Powder Circulation Device 31, 71 Circulation Pipe 40 Convection Device 41 Rotator 43 Blowing Pipe 44 Blower Hole 45 Perforated Plate 50, Blower 51 Blower Tube 54: heating member 60: powder heating supply device 61: powder supply device 62: supply pipe 64: supply control device 70: circulating purification device 80: carrier 81: hook portion 82: strainer 85: frame 86: support 87: scattering prevention member

Claims (17)

In the cleaning method for semiconductor and display panel manufacturing process,
(a) filling a predetermined amount of inorganic powder into a powder cleaning tank installed in a housing equipped with exhaust facilities;
(b) injecting and loading one or more cleaning objects into the powder cleaning tank;
(c) heating the powder washing tank by direct heating or indirect heating with a constant temperature using a heating device to clean and burn the organic and inorganic substances adhered to the object to be cleaned using inorganic powder at a predetermined temperature. Cleaning method for semiconductor and display panel manufacturing process.
The cleaning method of claim 1, wherein the cleaning object is placed in a powder cleaning tank filled with inorganic powder in a temperature range of 50 ° C. to 900 ° C. 7.
The method of claim 1, wherein the inorganic powder is a metal oxide (MxOy), or a composite metal oxide (M1xM2yOz) including silica (SiO2), alumina (Al2O3), titanium oxide (TiO2), sodium carbonate, sodium bicarbonate, potassium carbonate Or any one or more of carbonate metal (MxCOy) or metal nitrate (MxNOy) or metal hydroxide (Mx (OH) y) including calcium nitrate, sodium nitrate, potassium nitrate, sodium hydroxide, potassium hydroxide, potassium oxide A cleaning method for a semiconductor and display panel manufacturing process comprising a composite.
The method of claim 1, wherein the inorganic powder has a particle size in a range of 0.1 μm to 500 μm, and the dispersion of particles in the range is within 3 sigma.
In the cleaning device for semiconductor and display panel manufacturing process,
A powder cleaning tank installed in the housing, filled with a predetermined amount of inorganic powder, and loaded with a plurality of cleaning objects;
A first heating device applying heat of a predetermined temperature to the inorganic powder filled in the powder washing tank;
A convection device that stirs the inorganic powder filled in the powder cleaning tank or causes convection by using ultrasonic waves or gas; And
It is installed in the housing and includes an exhaust facility for collecting and filtering the fine dust and exhaust gas generated in the powder cleaning tank,
A cleaning apparatus for a semiconductor and display panel manufacturing process for cleaning by burning or peeling off organic or inorganic substances adhered to a cleaning object put into the powder cleaning tank.
The method of claim 5, wherein the first heating device is a method of heating directly inside the powder cleaning tank or indirect heating is applied outside the powder cleaning tank, the first heating device is heated by electricity, gas burner or far infrared rays The first heating device is a semiconductor and display panel manufacturing process for heating inorganic powder that has already been heated from the outside, raising or lowering the inorganic powder to reach a predetermined temperature, or maintaining the inorganic powder at a constant temperature. Cleaning device.
The method of claim 5, wherein the convection device includes a mechanical rotating body or a rotating plate, a blower for supplying a gas through a blower pipe to the powder cleaning tank, the supplied gas is a semiconductor containing air, oxygen, nitrogen or argon and Cleaner for display panel manufacturing process.
According to claim 5, The exhaust facility is provided with a duct for guiding and discharging the air inside the housing, the duct is provided with an exhaust fan for sucking and discharging the fine dust and exhaust gas generated in the powder cleaning tank, Cleaner for semiconductor and display panel manufacturing process with an air shower or dust filter that collects and filters fine dust and exhaust gas in the duct.
The method according to claim 5, wherein the first circulating pipe connected from the upper side to the lower side to the side of the powder washing tank and the inorganic powder introduced from the lower portion of the powder washing tank are heated to a predetermined temperature to the upper portion of the powder washing tank. A powder circulating device including a second heating device to be introduced, and a cleaning device for a semiconductor and display panel manufacturing process provided with a porous plate for filtering foreign matter contained in inorganic powder into the powder cleaning tank.
6. The apparatus of claim 5, further comprising: a supply device for supplying the inorganic powder to the powder cleaning tank through the supply pipe, a third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a predetermined temperature, and the supply pipe through the supply pipe; Cleaning apparatus for a semiconductor and display panel manufacturing process further comprising a powder heating supply comprising a feed control device for adjusting the amount of inorganic powder to be.
12. The method of claim 10, wherein a second circulation pipe for purifying and circulating inorganic powder is provided between the powder cleaning tank and the supply device, and the second circulation pipe is used to burn unburned substances contained in the inorganic powder or to treat aggregates. Cleaning device for semiconductor and display panel manufacturing process equipped with a purification device.
In the cleaning device for semiconductor and display panel manufacturing process,
A plurality of single-leaf powder cleaning tanks installed in the housing to fill a predetermined amount of inorganic powder and to put the cleaning objects in;
A fourth heating device for applying heat of a predetermined temperature to the inorganic powder filled in the sheet type powder cleaning tank;
A carrier supported by a support provided outside the sheet-type powder cleaning tank and held by a frame fixed to the frame to move up and down by the sheet-type powder cleaning tank;
A filtering net installed on the carrier side to filter the decomposition residue contained in the inorganic powder;
When the object to be cleaned is separated from the sheet-type powder cleaning tank by the carrier and separated from the sheet-type powder cleaning tank, the cleaning object and the carrier are sealed and accommodated on both sides of the upper part of the sheet-type powder cleaning tank so as to be contained in the carrier and the cleaning object. A pair of scattering preventing members for preventing the powder from scattering;
At least one convection device that stirs the inorganic powder filled in the sheet type powder cleaning tank or generates convection using ultrasonic waves or gas; And
It is installed in the housing includes an exhaust facility for collecting and filtering the fine dust and exhaust gas generated in the single-leaf powder washing tank,
A cleaning apparatus for a semiconductor and display panel manufacturing process for cleaning by burning or peeling off organic or inorganic substances adhered to a cleaning object put into the sheet-type powder cleaning tank.
The method of claim 12, wherein the single-leaf powder cleaning tank is a supply device for supplying the inorganic powder through the supply pipe, a third heating device for heating the inorganic powder supplied from the supply device through the supply pipe to a constant temperature, supply pipe Cleaning device for semiconductor and display panel manufacturing process further comprising a powder heating supply device comprising a supply control device for controlling the amount of the inorganic powder supplied through.
The convection device of claim 12, wherein the convection device includes a blower pipe that is mechanically rotated, and includes a blower that blows gas through an air hole of the blower pipe in the upper and lower parts or the upper part or the lower part of the convection device. The heat generating member is generated, the gas cleaning device for a semiconductor and display panel manufacturing process containing air, oxygen, nitrogen or argon.
The method according to claim 12, wherein any one of the plurality of single-leaf powder cleaning tanks maintains an idle state while a cleaning object is added and cleans, and heats the inside of the single-leaf powder cleaning tank to a predetermined temperature in the idle state. Cleaner for semiconductor and display panel manufacturing process.
The semiconductor and display according to claim 12, further comprising a plurality of washing tanks for washing the object to be cleaned in the sheet-type powder washing tank with pure water or gas, and further comprising a drying tank for drying the washing object washed in the washing tank. Cleaner for panel manufacturing process.
The sieve of claim 12, wherein the sieve is folded when the carrier is introduced into the single-leaf powder cleaning tank, and is folded at an angle when the carrier is raised to fold to filter the decomposition residue contained in the inorganic powder, and the sieve is inorganic powder. Cleaning device for semiconductor and display panel manufacturing process consisting of a mesh larger than the diameter of.
KR1020120007672A 2012-01-26 2012-01-26 Method for cleaning semiconductor and display panel during manufacturing process of semiconductor and display panel and apparatus thereof KR20130086754A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170001058U (en) 2015-09-14 2017-03-22 주식회사 신성이앤드지 Hand axe for fire fighting
KR20200032791A (en) * 2018-09-18 2020-03-27 주식회사 삼에스코리아 Apparatus and method for impurity removal of silica-based powder
KR102109158B1 (en) * 2020-03-17 2020-05-11 전홍규 Air filter for manufacturing device of semiconductor and display panel, and air filter manufacturing apparatus for manufacturing the air filter for manufacturing device of semiconductor and display panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170001058U (en) 2015-09-14 2017-03-22 주식회사 신성이앤드지 Hand axe for fire fighting
KR20200032791A (en) * 2018-09-18 2020-03-27 주식회사 삼에스코리아 Apparatus and method for impurity removal of silica-based powder
KR102109158B1 (en) * 2020-03-17 2020-05-11 전홍규 Air filter for manufacturing device of semiconductor and display panel, and air filter manufacturing apparatus for manufacturing the air filter for manufacturing device of semiconductor and display panel

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