KR20130076497A - Printed circuit board including metal pattern including a seed layer and a plating layer, and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A printed circuit board (PCB) including a metal pattern including a seed layer and a plating layer and a manufacturing method thereof are provided to reduce manufacturing costs by minimizing the usage rate of metal constructing a metal pattern. CONSTITUTION: A bonding layer (130) is included between a first circuit board (110) and a second circuit board (120). One or more metal patterns (140) are buried in the bonding layer. The metal pattern includes a first metal layer (142) and a second metal layer (144). The first metal layer is formed with an ink-jet method. The second metal layer is formed by a plating process. [Reference numerals] (AA) First direction

Description

Printed circuit board comprising a metal pattern comprising a seed layer and a plating layer and a method for manufacturing the same.

The present invention relates to a printed circuit board including a metal pattern including a seed layer and a plating layer, and is formed by transferring the metal pattern onto a substrate to improve adhesion between the seed pattern and the metal pattern including the plating layer and the substrate. A printed circuit board comprising a circuit pattern and a method of manufacturing the same.

In general, in the case of manufacturing a semiconductor circuit, a metal pattern forming method is a thin film deposition technique for implementing a metal pattern using a thin film deposition facility on a substrate, a wafer or a portion of a thin film deposited on the wafer by selectively removing the An etching technique used to form a fine metal pattern, a screen printing technique using a conductive paste on a substrate for pattern printing and heat treatment to implement a metal pattern, and a pattern printing using nanoparticle ink to heat treatment after a pattern printing to implement a metal pattern Inkjet printing techniques and the like are optionally used.

The thin film deposition technique requires expensive manufacturing equipment, which increases the manufacturing cost, and the etching technique is not only complicated in the manufacturing process, but also a waste of materials, and expensive.

In the case of screen printing technology, since paste is usually used, a material selection has been limited because a substrate that withstands high heat treatment temperature must be selected. In addition, the screen printing technology requires a separate screen-making cost, and when using the silver (Ag) electrode as a paste, the adhesiveness is good, but a large amount of silver must be used to increase the manufacturing cost.

Therefore, recently, the most popular nano inkjet printing technology is widely used, and such technology is disclosed in Republic of Korea Patent Publication No. 2009-76176, Publication No. 2010-110982, Publication No. 2006-102450, Publication No. 2008-13207 And Patent No. 720940.

In particular, the method of forming a metal pattern proposed by the present applicant and disclosed in Patent Registration No. 720940 will be described below with reference to FIGS. 1 to 3.

The conventional metal pattern forming method is a print head 41 having a nozzle (not shown) having an opening having a predetermined size on a transparent glass substrate, a flexible plastic substrate, or an opaque insulating substrate 40, as shown in FIG. ).

Although not shown in the figure, the print head 41 is connected with a supply means filled with a predetermined electronic ink 42, and the electronic ink 42 is supplied inside the print head 41. As shown in FIG. In addition, although not shown in the drawing, the print head 41 is provided with a valve for adjusting the amount of the electronic ink 42 to be ejected.

The electronic ink 42 supplied to the print head 41 is ejected from the nozzle and laminated on the substrate 40 in a predetermined pattern. At this time, the stacking thickness of the electronic ink 42 (that is, the thickness of the first metal layer 43 to be a seed metal layer later) is determined by the size of the opening of the nozzle, the opening and closing degree of the valve, the viscosity of the electronic ink 42, and the printing. It is determined by the traveling speed of the head 41 and the like. By appropriately controlling these elements, a first metal layer 43 of desired thickness or size is formed. In this case, the first metal layer 43 may be a seed for plating in the future, so that the thickness of the first metal layer 43 may be as small as nano 1 μm.

Thereafter, as shown in FIG. 2, curing is performed to remove the solvent component in the first metal layer 43. Curing is typically accomplished by heating the patterned first metal layer 43 or by irradiating light at less than 200 ° C., wherein the amount of heat or light applied is the viscosity or lamination of the electronic ink in the first metal layer 43. The thickness of the first metal layer 43 is determined. By the curing, the first metal layer 43 is fixed on the substrate 40 with the solvent component removed, and the fixed first metal layer 43 becomes a seed metal layer for plating.

Then, the second metal layer 44 made of any one of Au, Ag, Cu, Ni, Al, and Sn conductive metal is plated on the seed metal layer 43 as shown in FIG. At this time, the plating adopts a wet plating method and grows the second metal layer 44 to a desired thickness and size in the upward direction of the seed metal layer 43 by the wet plating.

According to the prior art, before plating the second metal layer, the adhesion of the first metal layer is good, but as the plating of the second metal layer proceeds, for example, the adhesive strength due to stress caused by copper plating and erosion of the plating solution is weakened. There was.

In addition, the wiring portion is protected by the cover film on the top, but the adhesive force of the terminal exposed portion is very weak, which may cause a defect of the printed circuit board.

KR 2009-76176 A KR 2010-110982 A KR 2006-102450 A KR 2008-13207 A KR 720940 B

Accordingly, the present invention is to solve the above problems, by providing a circuit pattern by transferring a metal pattern including a seed layer and a plating layer on a substrate, thereby providing a printed circuit board with improved adhesion between the circuit pattern and the substrate The purpose is.

Another object of the present invention is to provide a method of manufacturing a printed circuit board having improved adhesion between a circuit pattern and a substrate by transferring a metal pattern including a seed layer and a plating layer onto a substrate to form a circuit pattern.

The present invention also provides a multilayer printed circuit board formed by laminating a plurality of printed circuit boards having improved adhesion between the circuit pattern and the substrate by transferring a metal pattern including a seed layer and a plating layer onto a substrate to form a circuit pattern. Its purpose is to.

In order to achieve the above object, in the present invention:

A first substrate;

A second substrate facing the first substrate;

An adhesive layer provided between the first substrate and the second substrate; And

One or more metal patterns embedded in the adhesive layer;

The metal pattern includes a first metal layer formed by an inkjet method and a second metal layer formed by plating, wherein the first metal layer is formed by an inkjet method, and the second metal layer is formed by plating, and the metal pattern A surface of the surface of the first metal layer facing the second substrate, the first facing surface facing the second substrate of the surface of the first metal layer and the second facing surface of the surface of the second metal layer facing the second substrate It provides a printed circuit board comprising a.

The area of the first facing surface may be 1.5 times or more and 1000 times smaller than the area of the second facing surface.

The first substrate and the second substrate may each be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate.

The first substrate and the second substrate may be a polyimide film.

The second substrate may include a non-photosensitive polyimide.

The surface of the metal pattern facing the first substrate may be a roughened surface.

At least one of the first substrate and the second substrate may be a metal substrate.

The metal substrate may include aluminum, copper, silver, titanium, niobium, stainless steel, zinc, beryllium or magnesium.

The adhesive layer may be a dielectric layer.

The dielectric layer may include at least one of a prepreg, a heat resistant resin including thermally conductive particles, and a ceramic material.

The heat resistant resin may be at least one of an epoxy resin, an unsaturated polyester, an acrylic modified resin, a urea resin, and a polyimide resin.

The first metal layer may include silver (Ag) or copper (Cu), and the second metal layer may include a conductive metal.

The conductive metal may include copper, silver, gold, aluminum, nickel or tin.

A contact hole exposing the metal pattern may be formed in at least one of the first substrate and the second substrate and the adhesive layer.

In order to achieve the above another object, in the present invention:

Forming at least one first metal layer on an upper surface of the carrier substrate by an inkjet method;

Plating a second metal layer using the first metal layer as a seed layer to form a metal pattern;

Bonding the first substrate having an adhesive layer formed on a lower surface thereof to the carrier substrate such that the adhesive layer and the metal pattern come into contact with each other;

Separating the first substrate and the adhesive layer from the carrier substrate, and transferring the metal pattern to the adhesive layer; And

Coupling a second substrate to the first substrate such that the adhesive layer, the metal pattern, and an upper surface of the second substrate are in contact with each other;

The surface of the metal pattern, which faces the second substrate, may include a first facing surface facing the second substrate among the surfaces of the first metal layer and a second facing surface of the second metal layer. Provided is a method for producing a printed circuit board comprising two opposing surfaces.

The area of the first facing surface may be 1.5 times or more and 1000 times smaller than the area of the second facing surface.

The method may further include performing a roughening process on a surface of the surface of the metal pattern facing the first substrate before the bonding of the first substrate and the carrier substrate.

Coupling the second substrate with the first substrate,

Forming a non-photosensitive polyimide resin layer to cover the adhesive layer and the metal pattern formed on the lower surface of the first substrate;

Forming a photoresist film on the non-photosensitive polyimide resin layer;

Partially exposing and developing the photoresist film to form a photoresist pattern;

Etching the non-photosensitive polyimide resin layer using the photoresist pattern as a mask to form a contact hole exposing the metal pattern; And

It may include removing the photoresist pattern.

In order to achieve the above another object, in the present invention:

A first substrate;

A second substrate facing the first substrate;

An adhesive layer provided between the first substrate and the second substrate; And

One or more metal patterns embedded in the adhesive layer;

The metal pattern includes a first metal layer and a second metal layer, the table of the metal pattern

The surface facing the second substrate includes a first facing surface facing the second substrate among the surfaces of the first metal layer and a second facing surface facing the second substrate among the surfaces of the second metal layer. Provided is a multilayer printed circuit board having a structure in which a plurality of printed circuit boards are laminated.

The printed circuit board of the present invention uses an inkjet method instead of an etching method or a screen printing method when forming a metal pattern including a plating seed layer and a plating layer, thereby minimizing the amount of metal used in the metal pattern, thereby reducing manufacturing costs. It is possible to lower and simplify the process, and the metal pattern including the seed layer and the plating layer is transferred to the adhesive layer on the substrate through the transfer process, so that the metal pattern can be compressed and completely buried by the adhesive layer on the upper substrate and the lower substrate. Therefore, the adhesion between the metal pattern constituting the circuit pattern and the substrate can be improved to have excellent stability and reliability. In addition, the surface of the metal pattern that is in contact with and separated from the carrier substrate may have almost no bend, and thus may have better adhesion when bonding to the lower substrate.

1 to 3 are cross-sectional views illustrating a metal pattern forming method disclosed in Patent Registration No. 720940.
4 is a cross-sectional view for describing a printed circuit board according to an exemplary embodiment of the present invention.
5 is a cross-sectional view for describing a printed circuit board according to another exemplary embodiment of the present invention.
6 is a cross-sectional view for describing a printed circuit board according to another exemplary embodiment of the present invention.
7 is a cross-sectional view for describing a printed circuit board according to another exemplary embodiment of the present invention.
8 to 14 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
15 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.

Hereinafter, a printed circuit board and a manufacturing method of a printed circuit board according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited by the following embodiments, and Those skilled in the art may implement the present invention in various other forms without departing from the technical spirit of the present invention.

In this specification, specific structural and functional descriptions are merely illustrative and are for the purpose of describing the embodiments of the present invention only, and embodiments of the present invention may be embodied in various forms and are limited to the embodiments described herein And all changes, equivalents, and alternatives falling within the spirit and scope of the invention are to be understood as being included therein. When a component is described as being "connected" or "contacted" to another component, it is to be understood that it may be directly connected to or in contact with another component, but there may be another component in between. something to do. In addition, when a component is described as being "directly connected" or "directly contacted" with another component, it may be understood that there is no other component in between. Other expressions that describe the relationship between components, for example, "between" and "directly between" or "adjacent to" and "directly adjacent to", and the like may also be interpreted.

The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise", "comprise" or "have" are intended to designate that there is a feature, number, step, action, component, part, or combination thereof that is practiced, and that one or the same. It is to be understood that the present invention does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Does not.

Terms such as first, second and third may be used to describe various components, but such components are not limited by the terms. The terms are used to distinguish one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second or third component, and similarly, the second or third component may be alternatively named.

4 is a cross-sectional view illustrating a printed circuit board 100 according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the printed circuit board 100 includes a first substrate 110, a second substrate 120, an adhesive layer 130, and one or more metal patterns 140.

The first substrate 110 and the second substrate 120 may each be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate. Preferably, the first substrate 110 and the second substrate 120 may be polyimide films. have. In one embodiment of the present invention, the first surface of the first substrate 110 and the first surface of the second substrate 120 may be disposed to face each other, and the second surface of the first substrate 110 and The second surface of the second substrate 120 may correspond to an opposite face of the first surface of the first substrate 110 and the first surface of the second substrate 120, respectively.

An adhesive layer 130 may be disposed between the first substrate 110 and the second substrate 120, and the adhesive layer 130 may be formed on the first surface of the first substrate 110 and the second substrate 120. It may be placed in contact with the first surface.

The adhesive layer 130 may have a thickness of about 10 μm to 80 μm, and either an acrylic type or an epoxy type may be used, and a mixture thereof may be used. On the other hand, the adhesive layer 130 may include a component having an adhesive force at room temperature, or may include a component that generates adhesive strength by heating.

The metal pattern 140 may be located in the adhesive layer 130. The metal pattern 140 may have a shape embedded in the adhesive layer 130, may have a shape extending in the first direction, and the first metal layer 142 formed by the inkjet method and the second metal layer formed by plating. 144 may include. The first metal layer 142 may have a thickness of about 1 nm to 1 μm, include a conductive metal, and preferably include silver (Ag) or copper (Cu). The second metal layer 144 may include a conductive metal, and may include gold (Au), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), or tin (Sn). .

The surface of the metal pattern 140 that faces the first surface of the second substrate 120 is the first surface of the surface of the first metal layer 142 that faces the first surface of the second substrate 120. It may include a second opposing surface 148 facing the first surface of the second substrate 120 of the opposing surface 146 and the surface of the second metal layer 144. An area of the first opposing surface 146 may be about 1.5 times or more and 1000 times less than an area of the second opposing surface 148, and an area ratio of the first opposing surface 146 and the second opposing surface 148 may be printed. It may vary depending on the characteristics and use of the circuit board 100.

5 is a cross-sectional view illustrating a printed circuit board 200 according to another exemplary embodiment of the present invention.

Referring to FIG. 5, the printed circuit board 200 includes a first substrate 210, a second substrate 220, an adhesive layer 230, and one or more metal patterns 240. The printed circuit board 200 is substantially the same as the printed circuit board 100 described with reference to FIG. 4 except for materials of the first substrate 210 and the second substrate 220 and components included in the adhesive layer 230. Repeated descriptions are omitted since they have the same or similar structure and dimensions.

At least one of the first substrate 210 and the second substrate 220 may be a metal substrate having excellent thermal conductivity. Preferably, aluminum (Al), copper (Cu), silver (Ag), titanium (Ti), niobium (Nb), stainless steel, zinc (Zn), beryllium (Be) or magnesium (Mg), etc. A metal substrate may be used, and more preferably, a metal substrate including aluminum may be used. When the metal substrate is used in only one of the first substrate 210 and the second substrate 220, the other one in which the metal substrate is not used is the case of the substrates 110 and 120 described with reference to FIG. 4. Similarly, it can be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate, and preferably a polyimide film.

The adhesive layer 230 may be a dielectric layer that may be thermally conductive to transfer heat to the first substrate 210 or the second substrate 220. The dielectric layer may be an epoxy resin including thermally conductive particles. . The material of the dielectric layer may be a ceramic material such as prepreg, heat resistant resin, or alumina, and the heat resistant resin may be epoxy resin, unsaturated polyester, acrylic modified resin, urea resin, polyimide resin, or the like. . When prepreg is used as the material of the dielectric layer, the thermal conductivity of the dielectric layer is 0.3 W / m · K, and the dielectric layer in which the ceramic material and the resin are mixed has a thermal conductivity of 1.5 to 2 W / m · K. Here, the thinner the dielectric layer, the better the heat dissipation, but the lower the voltage resistance, so that a thickness of at least 80 to 100 μm is required to exhibit a thermal conductivity of 1.5 to 2 W / m · K.

The printed circuit board 200 described with reference to FIG. 5 is a metal core printed circuit board (MCPCB) for LEDs for a backlight unit for display due to the thermal conductivity of the dielectric layer used as the adhesive layer 230 as described above. Core Printed Circuit Board).

6 is a cross-sectional view illustrating a printed circuit board 300 according to still another embodiment of the present invention.

Referring to FIG. 6, the printed circuit board 300 includes a first substrate 310, a second substrate 320, an adhesive layer 330, and one or more metal patterns 340. The printed circuit board 300 has a structure and dimensions substantially the same as or similar to those of the printed circuit board 100 described with reference to FIG. 4 except that the rough surface 349 is formed on the metal pattern 340. Therefore, repeated description is omitted.

The surface of the metal pattern 340 facing the first substrate 310 may be a roughened surface 349. The roughened surface 349 may be formed by chemically or physically etching a surface of the metal pattern 340 facing the first substrate 310. The roughened surface 349 may be formed by the unevenness of the roughened surface 349. And the contact area between the adhesive layer 330 can be widened and an anchoring effect can be obtained. Therefore, when performing the transfer process included in the method of manufacturing the printed circuit board, which will be described later, the metal pattern 340 may be well transferred from the carrier substrate to the adhesive layer 330 on the first substrate 310 to increase the transfer success rate. In addition, the first substrate 310 and the metal pattern 340 are not easily separated from the physical impact such as tension, stress, or bending, thereby increasing the reliability of the printed circuit board 300.

7 is a cross-sectional view for describing a printed circuit board 400 according to still another embodiment of the present invention.

Referring to FIG. 7, the printed circuit board 400 includes a first substrate 410, a second substrate 420, an adhesive layer 430, and one or more metal patterns 440. The printed circuit board 400 is described with reference to FIG. 4 except that at least one of the first substrate 410 and the second substrate 420 and at least one contact hole 450 are formed in the adhesive layer 430. Since the printed circuit board 100 has substantially the same or similar structure and dimensions, repeated descriptions thereof will be omitted.

The contact hole 450 formed between the first substrate 410 and the second substrate 420 may include a non-photosensitive polyimide, and the contact hole 450 may expose the metal pattern 440 to the outside. As intended, the metal pattern 440 may be exposed to the outside through the contact hole 450 and may be electrically grounded with an external conductive member.

8 to 14 are cross-sectional views illustrating a method of manufacturing a printed circuit board 100 according to an embodiment of the present invention.

Referring to FIG. 8, the first metal layer 142 is formed by performing inkjet patterning on the carrier substrate 10 in a predetermined pattern using an electronic ink including metal nanoparticles. The carrier substrate 10 may be a transparent glass substrate, a flexible plastic substrate, an opaque insulating substrate, or the like, and preferably, a polyimide film.

The metal nanoparticles may be nanoparticles of silver (Ag) or copper (Cu), preferably silver nanoparticles.

The stacking thickness of the electronic ink, that is, the thickness of the first metal layer 142 may be determined by the size of the opening of the inkjet apparatus nozzle, the opening and closing degree of the valve, the viscosity of the electronic ink, the traveling speed of the print head, and the like. ) May vary depending on the nature and use of the device. However, since the first metal layer 142 performs only a seed role for plating the second metal layer, as described below, the first metal layer 142 may be formed to a thin thickness of about 1 μm or less.

After the first metal layer 142 is formed, curing may be performed to remove the solvent component in the first metal layer 142 and to sinter the metal nanoparticles. Curing is typically accomplished by heating the patterned first metal layer 142 or by irradiating light at less than 200 ° C., wherein the amount of heat or light applied is determined by the viscosity or lamination of the electronic ink in the first metal layer 142. It is determined by the thickness of the first metal layer 2 and the like. By the curing, the first metal layer 142 is fixed on the carrier substrate 10 with the solvent component removed, and the fixed first metal layer 142 becomes a seed layer for plating.

Referring to FIG. 9, after the first metal layer 142 having a desired pattern is formed on the carrier substrate 10, the first metal layer 142 is formed by performing a plating process using the first metal layer 142 as a seed layer. A second metal layer 144 including a conductive metal is formed on the top.

The conductive metal may include copper, silver, gold, aluminum, nickel or tin, and the plating process may be a wet plating process.

By forming the first metal layer 142 and the second metal layer 144 on the carrier substrate 10, the metal pattern 140 including the first metal layer 142 and the second metal layer 144 is formed. The metal pattern 140 may have a shape extending in the first direction.

10 to 14, after the metal pattern 140 is formed on the carrier substrate 10, the first adhesive layer 133 having the first substrate 110 formed on the first surface of the first substrate 110 is formed. The carrier substrate 10 is bonded to the metal pattern 140. At this time, the first surface of the first substrate 110 of the surface of the metal pattern 140 in order to widen the contact surface of the first adhesive layer 133 and the metal pattern 140 and to give an anchoring effect to improve the adhesive force. It is also possible to perform a roughening treatment on the surface opposite to.

Meanwhile, the second surface of the first substrate 110 may correspond to an opposite face of the first surface of the first substrate 110.

The first adhesive layer 133 may have a thickness of about 10 to 40 μm, and either an acrylic type or an epoxy type may be used, and a mixture thereof may be used. On the other hand, the first adhesive layer 133 may include a component having an adhesive force at room temperature, or may include a component that generates adhesive strength through heating.

After the carrier substrate 10 and the first substrate 110 are combined, the carrier substrate 10 is separated from the first substrate 110 as shown in FIG. 12. In this case, since the metal pattern 140 has a relatively higher adhesive force with the first adhesive layer 133 than with the carrier substrate 10, the metal pattern 140 is separated from the carrier substrate 10 to be separated from the carrier substrate 10. Transfer is performed to the first adhesive layer 133 on the first surface of the 110.

After transferring the metal pattern 140 to the first adhesive layer 133 on the first surface of the first substrate 110, the second adhesive layer formed on the first surface of the second substrate 120. 136 is coupled to the first substrate 110 to contact the metal pattern 140.

The second adhesive layer 136 may have a thickness of about 10 to 40 μm, and either an acrylic type or an epoxy type may be used, and a mixture thereof may be used. On the other hand, the second adhesive layer 136 may include a component having an adhesive force at room temperature, or may include a component that generates adhesive strength through heating.

By combining the first substrate 110 and the second substrate 120, a printed circuit board 100 as shown in FIG. 14 is completed, and the printed circuit board includes the first metal layer 142 and the second metal layer 144. One or more metal patterns 140 may be included, and the metal patterns 140 may be embedded in the adhesive layer 130 including the first adhesive layer 133 and the second adhesive layer 136. The surface of the metal pattern 140 that faces the first surface of the second substrate 120 is the first surface of the surface of the first metal layer 142 that faces the first surface of the second substrate 120. It may include a second opposing surface 148 facing the first surface of the second substrate 120 of the opposing surface 146 and the surface of the second metal layer 144. An area of the first opposing surface 146 may be about 1.5 times or more and 1000 times less than an area of the second opposing surface 148, and an area ratio of the first opposing surface 146 and the second opposing surface 148 may be printed. It may vary depending on the characteristics and use of the circuit board 100.

Meanwhile, in another embodiment, a non-photosensitive polyimide resin layer is formed to cover the first adhesive layer 133 and the metal pattern 140 formed on the first surface of the first substrate 110, and the non-photosensitive polyimide number A photoresist film was formed on the layer, the photoresist film was partially exposed and developed to form a predetermined photoresist pattern, and then the non-photosensitive polyimide resin layer was etched using the photoresist pattern as a mask to form a metal pattern ( The printed circuit board 100 including the second substrate 120 having the contact holes exposing the 140 may be formed.

Meanwhile, in another embodiment, the second substrate 120 having the second adhesive layer 136 formed on the first surface facing the first surface of the first substrate 110 may be formed of a non-photosensitive polyimide. The first substrate 110 such that the second adhesive layer 136 covers the first adhesive layer 133 and the metal pattern 140 formed on the first substrate 110 and the first surface of the first substrate 110. And a photoresist film are formed on the second surface of the first substrate 110, the photoresist film is partially exposed and developed to form a predetermined photoresist pattern, and then the photoresist pattern is used as a mask. The first printed circuit board 100 and the first adhesive layer 133 may be etched to form a printed circuit board 100 having contact holes for exposing the metal pattern 140.

15 is a cross-sectional view illustrating a multilayer printed circuit board 500 according to still another embodiment of the present invention.

Referring to FIG. 15, the multilayer printed circuit board 500 may include a first layer portion 550 and a second layer portion 590. The first layer portion 550 includes a first substrate 510, a second substrate 520, a first layer adhesion layer 530, and one or more first metal patterns 540. The first metal layer 542 and the second metal layer 544 may be formed to extend in the first direction. The second layer portion 590 includes a second substrate 520, a third substrate 560, one or more second metal patterns 570, and a second layer adhesion layer 580. The first metal layer 572 and the second metal layer 574 may be formed to extend in the first direction. The first surface of the first substrate 510 and the first surface of the second substrate 520 may be disposed to face each other, the second surface of the first substrate 510 and the second surface of the second substrate 520. Surfaces may correspond to opposite faces of the first surface of the first substrate 510 and the first surface of the second substrate 520, respectively. The first layer portion 550 and the second layer portion 590 of the multilayered printed circuit board 500 each have a structure and dimensions substantially the same as or similar to those of the printed circuit board 100 described with reference to FIG. Is omitted.

The second layer portion 590 of the multilayer printed circuit board 500 forms a second layer adhesive layer 580 on the second surface of the second substrate 520 and is described with reference to FIGS. 8 to 9. To form a carrier substrate (not shown) and the second metal pattern 570, and the second layer adhesion layer 580 contacts the second metal pattern 570 by the method described with reference to FIGS. 10 to 12. After the carrier substrate (not shown) is bonded to and separated from the second substrate 520 to transfer the second metal pattern 570, a third substrate having an adhesive layer formed on an upper surface thereof by the method described with reference to FIG. 13. 560 may be formed by bonding the second substrate 520 such that the adhesive layer contacts the second layer adhesive layer 580 and the second metal pattern 570.

Meanwhile, in the present exemplary embodiment, the multilayer printed circuit board 500 including the first layer part 550 and the second layer part 590 has been described. However, this is merely illustrative, and the second layer part described above with reference to FIG. 15 is described. It is apparent that the multilayer printed circuit board including three or more layers may be formed by repeating the formation process (590).

The printed circuit board according to the embodiments may use an inkjet method instead of an etching method or a screen printing method when forming a metal pattern including a plating seed layer and a plating layer, thereby minimizing the amount of metal used to form the metal pattern. The manufacturing cost can be lowered and the process can be simplified, and the metal pattern including the seed layer and the plating layer is transferred to the adhesive layer on the substrate through a transfer process, whereby the metal pattern is pressed by the adhesive layer on the upper substrate and the lower substrate to be completely. Since it may be embedded, it can have excellent stability and reliability by improving the adhesion between the metal pattern constituting the circuit pattern and the substrate. In addition, the surface of the metal pattern that is in contact with and separated from the carrier substrate may have almost no bend, and thus may have better adhesion when bonding to the lower substrate.

10: carrier substrate
100, 200, 300, 400: printed circuit board
500: multilayer printed circuit board
560: third substrate
130, 230, 330, 430: adhesive layer
133: first adhesive layer
136: second adhesive layer
140, 240, 340, 440: Metal Pattern
540: first metal pattern
570: second metal pattern
146: first facing surface
148: second facing surface
550: first floor
590: second layer
530: first layer adhesive layer
580: second layer adhesive layer
349: landscape
450: contact hole
40: substrate
41: print head
42: electronic ink
110, 210, 310, 410, 510: first substrate
43, 142, 542, 572: first metal layer
120, 220, 320, 420, 520: second substrate
44, 144, 544, 574: second metal layer

Claims (21)

A first substrate;
A second substrate facing the first substrate;
An adhesive layer provided between the first substrate and the second substrate; And
One or more metal patterns embedded in the adhesive layer;
The metal pattern includes a first metal layer formed by an inkjet method and a second metal layer formed by plating, and a surface of the metal pattern facing the second substrate is the second of the surfaces of the first metal layer. And a second facing surface facing the second substrate among the first facing surface facing the substrate and the surface of the second metal layer. The method according to claim 1,
The area of the said 1st opposing surface is 1.5 to 1000 times of the area of the said 2nd opposing surface, The printed circuit board characterized by the above-mentioned. The method according to claim 1,
And the first substrate and the second substrate are each one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate. The method according to claim 3,
The first substrate and the second substrate is a printed circuit board, characterized in that the polyimide film (polyimide film). The method according to claim 3,
At least one of the first substrate and the second substrate is a printed circuit board, characterized in that the non-photosensitive polyimide. The method according to claim 1,
The printed circuit board of claim 1, wherein the surface of the metal pattern facing the first substrate is a roughened surface. The method according to claim 1,
At least one of the first substrate and the second substrate is a printed circuit board, characterized in that the metal substrate. The method of claim 7,
The metal substrate includes aluminum, copper, silver, titanium, niobium, stainless steel, zinc, beryllium or magnesium. The method of claim 7,
The adhesive layer is a dielectric layer. The method according to claim 9,
Wherein said dielectric layer comprises at least one of prepreg, a heat resistant resin comprising thermally conductive particles, and a ceramic material. The method of claim 10,
The heat resistant resin is at least one of an epoxy resin, unsaturated polyester, acrylic modified resin, urea resin and polyimide resin. The method according to claim 1,
The first metal layer includes silver (Ag) or copper (Cu), and the second metal layer comprises a conductive metal. The method of claim 12,
The conductive metal includes copper, silver, gold, aluminum, nickel or tin. The method according to claim 1,
At least one of the first substrate and the second substrate and the adhesive layer
A printed circuit board comprising a contact hole exposing a metal pattern. Forming at least one first metal layer on an upper surface of the carrier substrate by an inkjet method;
Plating a second metal layer using the first metal layer as a seed layer to form a metal pattern;
Bonding the first substrate having an adhesive layer formed on a lower surface thereof to the carrier substrate such that the adhesive layer is in contact with the metal pattern;
Separating the first substrate and the adhesive layer from the carrier substrate, and transferring the metal pattern to the adhesive layer; And
Coupling a second substrate to the first substrate such that the adhesive layer, the metal pattern, and an upper surface of the second substrate are in contact with each other;
The surface of the metal pattern, which faces the second substrate, may include a first facing surface facing the second substrate among the surfaces of the first metal layer and a second facing surface of the second metal layer. A manufacturing method of a printed circuit board comprising two opposing surfaces. The method according to claim 15,
The area of the said 1st opposing surface is 1.5 to 1000 times of the area of the said 2nd opposing surface, The manufacturing method of the printed circuit board characterized by the above-mentioned. The method according to claim 15,
And performing a roughening treatment on a surface of the metal pattern facing the first substrate before joining the first substrate and the carrier substrate. The method according to claim 15,
Coupling the second substrate with the first substrate,
Forming a non-photosensitive polyimide resin layer to cover the adhesive layer and the metal pattern formed on the lower surface of the first substrate;
Forming a photoresist film on the non-photosensitive polyimide resin layer;
Partially exposing and developing the photoresist film to form a photoresist pattern;
Etching the non-photosensitive polyimide resin layer using the photoresist pattern as a mask to form a contact hole exposing the metal pattern; And
Removing the photoresist pattern. The method according to claim 15,
The first substrate is a manufacturing method of a printed circuit board, characterized in that it comprises a non-photosensitive polyimide. The method of claim 19,
After combining the second substrate with the first substrate,
Forming a photoresist film on an upper surface of the first substrate;
Partially exposing and developing the photoresist film to form a photoresist pattern;
Etching the first substrate and the adhesive layer using the photoresist pattern as a mask to form a contact hole exposing the metal pattern; And
The method of manufacturing a printed circuit board further comprising the step of removing the photoresist pattern. The multilayer printed circuit board which has a structure in which the printed circuit board of any one of Claims 1-14 is laminated | stacked.

Images