KR101272664B1 - Multilayer printed circuit board including metal pattern including a seed layer and a plating layer, and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A multilayer printed circuit board with a metal pattern which includes a seed layer and a plating layer and a manufacturing method thereof are provided to use an inkjet method, thereby reducing the use amount of metal. CONSTITUTION: A first adhesive layer(125) is equipped between a first substrate and a second substrate. At least one first metal pattern(140) is located on the upper surface of the first substrate. A third substrate(130) is faced with the lower surface of the first substrate. A second adhesive layer is equipped between the first substrate and the third substrate. At least one second metal pattern(150) is located on the lower surface of the first substrate. [Reference numerals] (AA) First direction

Description

MULTILAYER PRINTED CIRCUIT BOARD INCLUDING METAL PATTERN INCLUDING A SEED LAYER AND A PLATING LAYER, AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a multi-sided circuit board including a metal pattern including a seed layer and a plating layer, and in order to improve adhesion between the metal pattern including the seed layer and the plating layer and the substrate, both sides of the metal pattern have adhesive strength. The present invention relates to a multi-sided circuit board and a method for manufacturing the same, including a circuit pattern formed on each of both surfaces of the substrate by transferring.

In general, in the case of manufacturing a semiconductor circuit, a metal pattern forming method is a thin film deposition technique for implementing a metal pattern using a thin film deposition facility on a substrate, a wafer or a portion of a thin film deposited on the wafer by selectively removing the An etching technique used to form a fine metal pattern, a screen printing technique using a conductive paste on a substrate for pattern printing and heat treatment to implement a metal pattern, and a pattern printing using nanoparticle ink to heat treatment after a pattern printing to implement a metal pattern Inkjet printing techniques and the like are optionally used.

The thin film deposition technique requires expensive manufacturing equipment, which increases the manufacturing cost, and the etching technique is not only complicated in the manufacturing process, but also a waste of materials, and expensive.

In the case of screen printing technology, since paste is usually used, a material selection has been limited because a substrate that withstands high heat treatment temperature must be selected. In addition, the screen printing technology requires a separate screen-making cost, and when using the silver (Ag) electrode as a paste, the adhesiveness is good, but a large amount of silver must be used to increase the manufacturing cost.

Therefore, recently, the most popular nano inkjet printing technology is widely used, and such technology is disclosed in Republic of Korea Patent Publication No. 2009-76176, Publication No. 2010-110982, Publication No. 2006-102450, Publication No. 2008-13207 And Patent No. 720940.

In particular, the method of forming a metal pattern proposed by the present applicant and disclosed in Patent Registration No. 720940 will be described below with reference to FIGS. 1 to 3.

The conventional metal pattern forming method is a print head 41 having a nozzle (not shown) having an opening having a predetermined size on a transparent glass substrate, a flexible plastic substrate, or an opaque insulating substrate 40, as shown in FIG. ).

Although not shown in the figure, the print head 41 is connected with a supply means filled with a predetermined electronic ink 42, and the electronic ink 42 is supplied inside the print head 41. As shown in FIG. In addition, although not shown in the drawing, the print head 41 is provided with a valve for adjusting the amount of the electronic ink 42 to be ejected.

The electronic ink 42 supplied to the print head 41 is ejected from the nozzle and laminated on the substrate 40 in a predetermined pattern. At this time, the stacking thickness of the electronic ink 42 (that is, the thickness of the first metal layer 43 to be a seed metal layer later) is determined by the size of the opening of the nozzle, the opening and closing degree of the valve, the viscosity of the electronic ink 42, and the printing. It is determined by the traveling speed of the head 41 and the like. By appropriately controlling these elements, a first metal layer 43 of desired thickness or size is formed. In this case, the first metal layer 43 may be a seed for plating in the future, so that the thickness of the first metal layer 43 may be as small as nano 1 μm.

Thereafter, as shown in FIG. 2, curing is performed to remove the solvent component in the first metal layer 43. Curing is typically accomplished by heating the patterned first metal layer 43 or by irradiating light at less than 200 ° C., wherein the amount of heat or light applied is the viscosity or lamination of the electronic ink in the first metal layer 43. The thickness of the first metal layer 43 is determined. By the curing, the first metal layer 43 is fixed on the substrate 40 with the solvent component removed, and the fixed first metal layer 43 becomes a seed metal layer for plating.

Then, the second metal layer 44 made of any one of Au, Ag, Cu, Ni, Al, and Sn conductive metal is plated on the seed metal layer 43 as shown in FIG. At this time, the plating adopts a wet plating method and grows the second metal layer 44 to a desired thickness and size in the upward direction of the seed metal layer 43 by the wet plating.

According to the prior art, before plating the second metal layer, the adhesion of the first metal layer is good, but as the plating of the second metal layer proceeds, for example, the adhesive strength due to stress caused by copper plating and erosion of the plating solution is weakened. Although the wiring portion is protected by the cover film on the upper side, the adhesive force of the exposed portion of the terminal is very weak, which may cause a defect of the printed circuit board.

In addition, when a multilayer printed circuit board is formed by stacking circuit boards formed by using the metal pattern forming method according to the prior art, there is a problem in that the thickness of the multilayer printed circuit board becomes thick due to overlapping of the substrates.

KR 2009-76176 A KR 2010-110982 A KR 2006-102450 A KR 2008-13207 A KR 720940 B

Therefore, the present invention is to solve the above problems, by transferring the metal pattern including the seed layer and the plating layer on both sides of the substrate having the adhesive force on both sides to form a circuit pattern, the adhesion between the circuit pattern and the substrate Its purpose is to provide an improved, thinner multilayer printed circuit board.

In addition, the present invention transfers the metal pattern including the seed layer and the plating layer on the substrate having the adhesive strength on both sides to form a circuit pattern to improve the adhesion between the circuit pattern and the substrate and to manufacture a thin multilayer printed circuit board The purpose is to provide a method.

In addition, the present invention transfers a metal pattern comprising a seed layer and a plating layer onto a substrate having adhesive strength on both sides to form a circuit pattern, thereby improving the adhesion between the circuit pattern and the substrate and a plurality of thin-layered printed circuit boards. It is an object to provide a multilayered multilayer printed circuit board formed by stacking pieces.

In order to achieve the above object, in the present invention:

A first substrate;

A second substrate facing the upper surface of the first substrate;

A first adhesive layer provided between the first substrate and the second substrate;

At least one first metal pattern covered by the first adhesive layer and positioned on an upper surface of the first substrate;

A third substrate facing the lower surface of the first substrate;

A second adhesive layer provided between the first substrate and the third substrate; And

At least one second metal pattern covered by the second adhesive layer and positioned on the bottom surface of the first substrate,

Each of the first metal pattern and the second metal pattern includes a first metal layer formed by an inkjet method and a second metal layer formed by plating, and a surface facing the second substrate among the surfaces of the first metal pattern; The surface of the second metal pattern, which faces the third substrate, may include the first facing surface facing the second substrate or the third substrate of the surface of the first metal layer and the surface of the second metal layer. Provided is a multi-layer printed circuit board comprising a second opposing surface opposing a second substrate or a third substrate.

The area of the first facing surface may be 1.5 times or more and 1000 times smaller than the area of the second facing surface.

The second substrate and the third substrate may each be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate.

The second substrate and the third substrate may be a polyimide film.

At least one of the second substrate and the third substrate may include a non-photosensitive polyimide.

An upper surface and a lower surface of the first substrate may have adhesive strength.

The first substrate may be a double-sided tape.

The first substrate may include a base substrate and adhesive layers formed on upper and lower surfaces of the base substrate.

The base substrate may be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate.

The base substrate may be a polyimide film.

The base substrate may be a metal substrate.

The metal substrate may include aluminum, copper, silver, titanium, niobium, stainless steel, zinc, beryllium or magnesium.

The adhesive layer may be a dielectric layer.

The dielectric layer may include at least one of a prepreg, a heat resistant resin including thermally conductive particles, and a ceramic material.

The heat resistant resin may be at least one of an epoxy resin, an unsaturated polyester, an acrylic modified resin, a urea resin, and a polyimide resin.

The first metal layer may include silver (Ag) or copper (Cu), and the second metal layer may include a conductive metal.

The conductive metal may include copper, silver, gold, aluminum, nickel or tin.

At least one contact hole exposing the first metal pattern may be formed in the second substrate and the first adhesive layer.

At least one contact hole exposing the second metal pattern may be formed in the third substrate and the second adhesive layer.

The surface of the first metal pattern facing the second substrate and the surface of the second metal pattern facing the third substrate may be roughened surfaces.

The first substrate may include one or more vias penetrating through the first substrate.

The via may be in electrical contact with one of the first metal pattern and one of the second metal patterns.

The via may be filled with conductive nanoparticles.

The conductive nanoparticles may be conductive metal particles having a nano-size diameter.

The conductive metal particles may be silver nanoparticles or a mixture of silver nanoparticles and tin nanoparticles.

At least one of the first metal pattern and the second metal pattern in contact with the via may have a roughened surface in contact with the via.

The roughness of the roughened surface may have a thickness of less than 5 μm, respectively.

At least one of the first metal pattern and the second metal pattern in contact with the via may have an opening that exposes the conductive nanoparticles filling the via, and the opening is formed with the opening. It may be formed in the region located on the via of the entire region of the metal pattern.

The opening may be any one of a grid-shaped mesh pattern, a plurality of small holes, a plurality of narrow slits, and a plurality of concentric circles having different diameters.

The opening may be in the form of a grid mesh pattern.

In order to achieve the above another object, in the present invention:

Forming at least one first metal layer on an upper surface of the carrier substrate by an inkjet method;

Plating at least one second metal layer using the first metal layer as a seed layer, thereby forming at least one transfer carrier substrate including a metal pattern including the first metal layer and the second metal layer;

Coupling the first substrate and the transfer carrier substrate by contacting the both sides with the transfer carrier substrate, respectively, such that both sides of the first substrate having both sides adhere to the metal pattern;

By separating the transfer carrier substrate from both sides of the first substrate and transferring the metal pattern on both sides of the first substrate, a first metal pattern is formed on the top surface of the first substrate, the first Forming a second metal pattern on the bottom surface of the substrate;

A first insulating layer is formed on the top surface of the first substrate to cover the first metal pattern and the top surface of the first substrate, and covers the bottom surface of the second metal pattern and the first substrate. Forming a second insulating layer on the bottom surface of the first substrate; And

Forming a second substrate on the first insulating layer to face the upper surface of the first substrate, and forming a third substrate on the second insulating layer to face the lower surface of the first substrate. ,

The first metal pattern and the second metal pattern may include a first metal layer formed by an inkjet method and a second metal layer formed by plating, and a surface of the surface of the first metal pattern facing the second substrate and the The surface of the second metal pattern, which faces the third substrate, is respectively opposed to the second substrate among the surfaces of the first metal layer and the first facing surface that faces the second substrate, and the surface of the second metal layer. It provides a manufacturing method of a multilayer printed circuit board comprising a second opposing surface.

The area of the first facing surface may be 1.5 times or more and 1000 times smaller than the area of the second facing surface.

The method may further include performing a roughening treatment on a surface of the metal pattern facing the first substrate before the transfer carrier substrate is bonded to both surfaces of the first substrate.

The roughness of the roughened surface formed on the surface of the metal pattern by the roughening treatment may have a thickness of less than 5 μm, respectively.

The first substrate may be a double-sided tape.

The first substrate may include a base substrate and adhesive layers formed on upper and lower surfaces of the base substrate.

The second substrate may include a non-photosensitive polyimide.

Forming the second substrate on the first insulating layer,

Forming a non-photosensitive polyimide resin layer to cover the first insulating layer and the first metal pattern formed on the upper surface of the first substrate;

Forming a photoresist film on the non-photosensitive polyimide resin layer;

Partially exposing and developing the photoresist film to form a photoresist pattern;

Etching the non-photosensitive polyimide resin layer and the first insulating layer using the photoresist pattern as a mask to form a contact hole exposing the first metal pattern; And

It may include removing the photoresist pattern.

Joining the first substrate and the transfer carrier substrate,

Forming a via hole penetrating the first substrate;

Contacting and coupling any one of the transfer carrier substrates with the first substrate so that the metal pattern may block the lower opening of the via hole;

Filling the via holes with conductive nanoparticles to form vias; And

And contacting one of the transfer carrier substrates with the first substrate so that the metal pattern blocks the upper opening of the via hole.

The conductive metal particles may be silver nanoparticles or a mixture of silver nanoparticles and tin nanoparticles.

In order to achieve the above another object, in the present invention:

A first substrate;

A second substrate facing the upper surface of the first substrate;

A first adhesive layer provided between the first substrate and the second substrate;

At least one first metal pattern covered by the first adhesive layer and positioned on an upper surface of the first substrate;

A third substrate facing the lower surface of the first substrate;

A second adhesive layer provided between the first substrate and the third substrate; And

At least one second metal pattern covered by the second adhesive layer and positioned on the bottom surface of the first substrate,

Each of the first metal pattern and the second metal pattern includes a first metal layer formed by an inkjet method and a second metal layer formed by plating, and a surface facing the second substrate among the surfaces of the first metal pattern; The surface of the second metal pattern, which faces the third substrate, may include the first facing surface facing the second substrate or the third substrate of the surface of the first metal layer and the surface of the second metal layer. Provided is a multilayer printed circuit board having a structure in which a plurality of multilayer printed circuit boards are stacked, the second facing surface facing the second substrate or the third substrate.

In the multilayer printed circuit board of the present invention, when the metal pattern including the plating seed layer and the plating layer is formed, the inkjet method is used instead of the etching method or the screen printing method, thereby minimizing the amount of the metal forming the metal pattern. The metal pattern including the seed layer and the plating layer is transferred onto both sides of the substrate having the adhesive force on both sides through a transfer process, and the metal pattern is pressed by the adhesive layer and completely buried. It is possible to improve the adhesion between the metal pattern constituting the circuit pattern and the substrate can have excellent stability and reliability. In addition, the surface of the metal pattern that is in contact with and separated from the carrier substrate may have almost no bending, and thus may have better adhesive strength when bonding to the substrate. By manufacturing a circuit board, a multilayered multilayer printed circuit board having a thin thickness can be produced.

1 to 3 are cross-sectional views illustrating a metal pattern forming method disclosed in Patent Registration No. 720940.
4 is a cross-sectional view illustrating a multilayer printed circuit board according to an exemplary embodiment of the present invention.
5 is a cross-sectional view illustrating a multilayer printed circuit board according to another exemplary embodiment of the present invention.
6 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.
7 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.
8 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.
9 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.
10 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.
11 is a cross-sectional view illustrating a multilayer printed circuit board according to still another exemplary embodiment of the present invention.
12 to 17 are cross-sectional views illustrating a method of manufacturing a multilayer printed circuit board according to an exemplary embodiment of the present invention.
18 is a cross-sectional view illustrating a multilayer printed circuit board according to still another embodiment of the present invention.

Hereinafter, a circuit board and a method of manufacturing a circuit board according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited by the following embodiments, and Those skilled in the art will be able to implement the present invention in various other forms without departing from the spirit of the present invention.

In this specification, specific structural and functional descriptions are merely illustrative and are for the purpose of describing the embodiments of the present invention only, and embodiments of the present invention may be embodied in various forms and are limited to the embodiments described herein And all changes, equivalents, and alternatives falling within the spirit and scope of the invention are to be understood as being included therein. When a component is described as being "connected" or "contacted" to another component, it is to be understood that it may be directly connected to or in contact with another component, but there may be another component in between. something to do. In addition, when a component is described as being "directly connected" or "directly contacted" with another component, it may be understood that there is no other component in between. Other expressions that describe the relationship between components, for example, "between" and "directly between" or "adjacent to" and "directly adjacent to", and the like may also be interpreted.

The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise", "comprise" or "have" are intended to designate that there is a feature, number, step, action, component, part, or combination thereof that is practiced, and that one or the same. It is to be understood that the present invention does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Does not.

Terms such as first, second and third may be used to describe various components, but such components are not limited by the terms. The terms are used to distinguish one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second or third component, and similarly, the second or third component may be alternatively named.

4 is a cross-sectional view illustrating a multilayer printed circuit board 100 according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the multilayer printed circuit board 100 includes a first substrate 110, a second substrate 120, a third substrate 130, a first adhesive layer 125, and a second adhesive layer 135. The first metal pattern 140 and one or more second metal patterns 150 are included.

The first substrate 110 may be any one of a flexible plastic substrate having adhesive strength on both sides and an insulating substrate having adhesive strength on both sides, and preferably, the double substrate tape. In one embodiment of the present invention, the first surface of the first substrate 110 and the first surface of the second substrate 120 may be disposed to face each other, and the second surface of the first substrate 110 and The second surface of the second substrate 120 may correspond to an opposite face of the first surface of the first substrate 110 and the first surface of the second substrate 120, respectively. The second surface of the first substrate 110 and the first surface of the third substrate 130 may be disposed to face each other, and the second surface of the third substrate 130 may be the second surface of the third substrate 130. It may correspond to an opposite face of one side.

The second substrate 120 and the third substrate 130 may each be any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate. Preferably, the second substrate 120 and the third substrate 130 may be polyimide films. have.

The first adhesive layer 125 may be disposed between the first substrate 110 and the second substrate 120, and the first adhesive layer 125 may be formed on the first surface and the second substrate of the first substrate 110. It may be disposed while contacting the first surface of the 120. The second adhesive layer 135 may be disposed between the first substrate 110 and the third substrate 130, and the second adhesive layer 125 may be formed on the first surface and the third substrate of the first substrate 110. And in contact with the first surface of the 130.

Each of the first adhesive layer 125 and the second adhesive layer 135 may have a thickness of about 10 to 80 μm, and may be used in both an acrylic type and an epoxy type, and may be used by mixing them. have. On the other hand, the first adhesive layer 125 and the second adhesive layer 135 may include a component having an adhesive force at room temperature, or may include a component that generates adhesive strength through heating.

The first metal pattern 140 may be positioned on the first surface of the first substrate 110, and may contact the first surface of the first substrate 110 among the surfaces of the first metal pattern 140. The remaining surface except for the present surface may have a structure buried by the first adhesive layer 125, and the second metal pattern 150 may be located on the second surface of the first substrate 110. The second surface of the metal pattern 150 except for the surface in contact with the second surface of the first substrate 110 may have a structure buried by the second adhesive layer 135. Each of the first metal pattern 140 and the second metal pattern 150 may have a shape extending in the first direction, and the first metal pattern 140 may be formed of the first metal layer 142 and the plating by an inkjet method. It may include a second metal layer 144 formed by, the second metal pattern 150 may include a first metal layer 152 formed by the inkjet method and the second metal layer 154 formed by plating. . The first metal layers 142 and 152 may have a thickness of about 1 nm to 1 μm, include a conductive metal, and preferably include silver (Ag) or copper (Cu). The second metal layers 144 and 154 include a conductive metal, and preferably include gold (Au), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), or tin (Sn). Can be.

The surface of the first metal pattern 140 that faces the first surface of the second substrate 120 faces the first surface of the second substrate 120 of the surface of the first metal layer 142. One of the surfaces of the first opposing surface 146 and the second metal layer 144 may include a second opposing surface 148 facing the first surface of the second substrate 120. The surface of the second metal pattern 150 that faces the first surface of the third substrate 130 may face the first surface of the third substrate 130 that faces the first metal layer 152. One of the surfaces of the first opposing surface 156 and the second metal layer 154 may include a second opposing surface 158 facing the first surface of the third substrate 130. An area of the first facing surfaces 146 and 156 may be about 1.5 times or more and 1000 times smaller than the areas of the second facing surfaces 148 and 158, and the first facing surfaces 146 and 156 and the second facing surfaces 148. , The area ratio of 158 may vary depending on the characteristics and use of the circuit board 100.

5 is a cross-sectional view illustrating a multilayer printed circuit board 200 according to another exemplary embodiment of the present invention.

The multilayer printed circuit board 200 may include a first substrate 210, a second substrate 220, a third substrate 230, a first adhesive layer 225, a second adhesive layer 235, and one or more first metal patterns ( 240 and one or more second metal patterns 250. The multilayer printed circuit board 200 may include a material of the first substrate 210 and a first metal pattern 240 and a second metal pattern 250 embedded in the first adhesive layer 225 and the second adhesive layer 235, respectively. Except for the structure, since the structure and dimensions are substantially the same as or similar to those of the multilayer printed circuit board 100 described with reference to FIG. 4, repeated descriptions thereof will be omitted.

The first substrate 210 may include a base substrate 212 and a third adhesive layer 214 formed on both sides of the base substrate 212.

The base substrate 212 may be any one of a transparent glass substrate, a flexible plastic substrate, and a flexible insulating substrate. Preferably, the base substrate 212 may be a polyimide film.

The third adhesive layer 214 may be positioned on the top and bottom surfaces of the base substrate 212 and include substantially the same components as the first adhesive layer 225 and the second adhesive layer 235.

The first metal pattern 240 may be located in the first adhesive layer 225 and may have a structure in which an entire surface of the first metal pattern 240 is filled by the first adhesive layer 225. The second metal pattern 250 may be located in the second adhesive layer 235, and the entire surface of the second metal pattern 250 may be buried by the second adhesive layer 235.

6 is a cross-sectional view illustrating a multilayer printed circuit board 300 according to still another embodiment of the present invention.

The multilayer printed circuit board 300 may include a first substrate 310, a second substrate 320, a third substrate 330, a first adhesive layer 325, a second adhesive layer 335, and one or more first metal patterns ( 340 and one or more second metal patterns 350. The multilayer printed circuit board 300 excludes materials included in the first substrate 210, the second substrate 220, and the third substrate 330, and the components included in the first adhesive layer 325 and the second adhesive layer 335. Since the structure and dimensions are substantially the same as or similar to the multilayer printed circuit board 200 described with reference to FIG. 5, repeated descriptions thereof will be omitted.

At least one of the first substrate 310, the second substrate 320, and the third substrate 330 may be a metal substrate having excellent thermal conductivity. Preferably, aluminum (Al), copper (Cu), silver (Ag), titanium (Ti), niobium (Nb), stainless steel, zinc (Zn), beryllium (Be) or magnesium (Mg), etc. A metal substrate may be used, and more preferably, a metal substrate including aluminum may be used. When there is a substrate in which the metal substrate is not used among the first substrate 310, the second substrate 320, and the third substrate 330, the other one in which the metal substrate is not used is the multilayer described with reference to FIG. 5. As in the case of the printed circuit board 200, it may be any one of a transparent glass substrate, a flexible plastic substrate, and a flexible insulating substrate, preferably a polyimide film.

The first adhesive layer 325 and the second adhesive layer 335 may be dielectric layers which may be thermally conductive to transfer heat to the first substrate 310, the second substrate 320, or the third substrate 330. The dielectric layer may be an epoxy resin including thermally conductive particles. The material of the dielectric layer may be a ceramic material such as prepreg, heat resistant resin, or alumina, and the heat resistant resin may be epoxy resin, unsaturated polyester, acrylic modified resin, urea resin, polyimide resin, or the like. . When prepreg is used as the material of the dielectric layer, the thermal conductivity of the dielectric layer is 0.3 W / m · K, and the dielectric layer in which the ceramic material and the resin are mixed has a thermal conductivity of 1.5 to 2 W / m · K. Here, the thinner the dielectric layer, the better the heat dissipation, but the lower the voltage resistance, so that a thickness of at least 80 to 100 μm is required to exhibit a thermal conductivity of 1.5 to 2 W / m · K.

The multilayer printed circuit board 300 described with reference to FIG. 6 has a thermal conductivity of the dielectric layer used as the first adhesive layer 325 and the second adhesive layer 335 as described above. It can be used as a metal core printed circuit board (MCPCB).

7 is a cross-sectional view illustrating a multilayer printed circuit board 400 according to still another embodiment of the present invention.

Referring to FIG. 7, the multilayered printed circuit board 400 includes a first substrate 410, a second substrate 420, a third substrate 430, a first adhesive layer 425, and a second adhesive layer 435. The first metal pattern 440 and one or more second metal patterns 450 are included. The multilayered printed circuit board 400 is illustrated in FIG. 4 except that a rough surface 449 is formed at an interface between the first metal pattern 440, the second metal pattern 450, and the first substrate 410. Since the multilayer printed circuit board 400 has the same structure and dimensions as those of the multilayer printed circuit board 400 described with reference, repeated descriptions thereof will be omitted.

The surface of the first metal pattern 440 and the surface of the second metal pattern 450 which contacts the first substrate 410 may be a roughened surface 449. The rough surface 449 may be formed by chemically or physically etching a surface of the first metal pattern 440 and the surface of the second metal pattern 450 that contacts the first substrate 410. Due to the unevenness, the contact area between the first metal pattern 440, the second metal pattern 450, and the first substrate 410 can be widened, and an anchoring effect can be obtained. Therefore, when performing the transfer process included in the method of manufacturing the multilayer printed circuit board, which will be described later, the first metal pattern 440 or the second metal pattern 450 is well transferred from the carrier substrate onto the first substrate 410. The transfer success rate can be increased, and the first substrate 410, the first metal pattern 440, and the second metal pattern 450 are not easily separated from the physical impact such as tension, stress, or bending, so that the multilayered printing can be performed. There is an effect that can increase the reliability of the circuit board 400.

8 is a cross-sectional view illustrating a multilayer printed circuit board 500 according to another exemplary embodiment of the present invention.

Referring to FIG. 8, the multilayer printed circuit board 500 may include a first substrate 510, a second substrate 520, a third substrate 530, a first adhesive layer 525, and a second adhesive layer 535. The first metal pattern 540 and one or more second metal patterns 550 are included. The multilayer printed circuit board 500 may have one or more contact holes 560 formed in the second substrate 520 and the first adhesive layer 525 or the third substrate 530 and the second adhesive layer 535. Has a structure and dimensions substantially the same as or similar to those of the circuit board 100 described with reference to FIG. 4, and thus repeated descriptions thereof will be omitted.

Where the contact hole 560 is formed among the second substrate 520 and the third substrate 530 may include a non-photosensitive polyimide, and the contact hole 560 may include the first metal pattern 540 or the second. In order to expose the metal pattern 550 to the outside, the first metal pattern 540 or the second metal pattern 550 is exposed to the outside through the contact hole 560 and is electrically grounded with an external conductive member. Can be.

9 is a cross-sectional view illustrating a multilayer printed circuit board 600 according to still another embodiment of the present invention.

Referring to FIG. 9, the multilayer printed circuit board 600 may include a first substrate 610, a second substrate 620, a third substrate 630, a first adhesive layer 625, and a second adhesive layer 635. One or more first metal patterns 640, one or more second metal patterns 650, and one or more vias 660. The multilayer printed circuit board 600 has a structure and dimensions substantially the same as or similar to those of the circuit board 100 described with reference to FIG. 4 except that the multilayer printed circuit board 600 includes one or more vias 660. .

The via 660 may have a shape penetrating through the first substrate 610 and may be filled with conductive nanoparticles. Due to the conductive nanoparticles, the via 660 may electrically connect the first metal pattern 640 on the via 660 and the second metal pattern 650 on the lower portion.

The conductive nanoparticles may be conductive metal particles having a diameter of a nano size, preferably silver nanoparticles or a mixture of silver nanoparticles and tin nanoparticles.

10 is a cross-sectional view illustrating a multilayer printed circuit board 700 according to still another embodiment of the present invention.

Referring to FIG. 10, a multilayer printed circuit board 700 includes a first substrate 710, a second substrate 720, a third substrate 730, a first adhesive layer 725, a second adhesive layer 735, and one. At least one first metal pattern 740, at least one second metal pattern 750, and at least one via 760, wherein the multilayer printed circuit board 700 is formed on a surface of the metal pattern in contact with the vias 760. Except that the screen 770 is formed, since the screen 770 has a structure and dimensions substantially the same as or similar to those of the circuit board 600 described with reference to FIG. 9, repeated descriptions thereof will be omitted.

The surface of the first metal pattern 740 or the second metal pattern 750 that contacts the via 760 may be a roughened surface 770. The unevenness of the roughened surface 770 may each have a thickness of less than 5 μm. The roughened surface 770 may be formed by chemically or physically etching a surface of the first metal pattern 740 and the second metal pattern 750 that contacts the via 760.

Due to the unevenness of the roughened surface 770, the contact area between the first metal pattern 740, the second metal pattern 750, and the conductive nanoparticles filling the via 760 is increased, and the anchoring effect is achieved. Can be obtained. Accordingly, the adhesive force between the first metal pattern 740 or the second metal pattern 750 and the via 760 may be increased, so that the first metal pattern 740 or the second metal may be subjected to physical impact such as tension, stress, or bending. The metal pattern 750 and the via 760 are not easily separated, thereby increasing the reliability of the multilayer printed circuit board 700.

11 is a cross-sectional view illustrating a multilayer printed circuit board 800 according to still another embodiment of the present invention.

Referring to FIG. 11, a multilayer printed circuit board 800 may include a first substrate 810, a second substrate 820, a third substrate 830, a first adhesive layer 825, and a second adhesive layer 835. At least one first metal pattern 840, at least one second metal pattern 850, and at least one via 860, wherein the multilayer printed circuit board 800 has openings 880 in the metal pattern in contact with the vias 860. ) Is substantially the same as or similar to the circuit board 600 described with reference to FIG. 9 except that the repeated description is omitted.

An opening 880 may be formed in the metal pattern in contact with the via 860 of the first metal pattern 840 or the second metal pattern 850. The opening 880 may be formed in a portion of the metal pattern in contact with the via 860, and may be formed in an area located on the via 860 among the entire areas of the metal pattern in contact with the via 860. have. The shape of the openings 880 is not particularly limited as long as it can expose the conductive nanoparticles filled in the vias 860. For example, the shape of the openings 880 may include a lattice mesh pattern, a plurality of small holes, and It may be in the form of a narrow slit or a plurality of concentric circles of different diameters.

The conductive nanoparticles filled in the via 860 may be exposed by the opening 880, and the gas generated when the conductive nanoparticles are cured may be discharged and removed through the opening 880. Thus, by reducing the formation of pores due to the gas, it is possible to reduce the disturbance of the contact between the via 860 and the metal pattern, the surface area due to the opening 880 increases the contact surface area between the conductive nanoparticles and the metal pattern. It can be widened so that the first metal pattern 840 or the second metal pattern 850 and the via 860 are not easily separated even by a physical impact such as tension, stress or bending, thereby increasing the reliability of the multilayer printed circuit board 800. It can increase the effect.

12 to 14 are cross-sectional views illustrating a method of manufacturing a multilayer printed circuit board 100 according to an exemplary embodiment of the present invention.

Referring to FIG. 12, the first metal layer 142 is formed by performing inkjet patterning on the carrier substrate 10 in a predetermined pattern using an electronic ink including metal nanoparticles. The carrier substrate 10 may be a transparent glass substrate, a flexible plastic substrate, an opaque insulating substrate, or the like, and preferably, a polyimide film.

The metal nanoparticles may be nanoparticles of silver (Ag) or copper (Cu), preferably silver nanoparticles.

The stacking thickness of the electronic ink, that is, the thickness of the first metal layer 142 may be determined by the size of the opening of the inkjet device nozzle, the opening and closing degree of the valve, the viscosity of the electronic ink, the traveling speed of the print head, and the like. 100), and may vary depending on the application and the like. However, since the first metal layer 142 performs only a seed role for plating the second metal layer, as described below, the first metal layer 142 may be formed to a thin thickness of about 1 μm or less.

After the first metal layer 142 is formed, curing may be performed to remove the solvent component in the first metal layer 142 and to sinter the metal nanoparticles. Curing is typically accomplished by heating the patterned first metal layer 142 or by irradiating light at less than 200 ° C., wherein the amount of heat or light applied is determined by the viscosity or lamination of the electronic ink in the first metal layer 142. It is determined by the thickness of the first metal layer 2 and the like. By the curing, the first metal layer 142 is fixed on the carrier substrate 10 with the solvent component removed, and the fixed first metal layer 142 becomes a seed layer for plating.

Referring to FIG. 13, after the first metal layer 142 having a desired pattern is formed on the carrier substrate 10, the first metal layer 142 is formed by performing a plating process using the first metal layer 142 as a seed layer. A second metal layer 144 including a conductive metal is formed on the top.

The conductive metal may include copper, silver, gold, aluminum, nickel or tin, and the plating process may be a wet plating process.

By forming the first metal layer 142 and the second metal layer 144 on the carrier substrate 10, the metal pattern 140 including the first metal layer 142 and the second metal layer 144 is formed. The metal pattern 140 may have a shape extending in the first direction.

12 and 13, a plurality of transfer carrier substrates 10 on which the metal patterns 140 are formed may be formed by performing the same process as described above with reference to FIGS. Can be different.

Referring to FIGS. 14 to 15, a first substrate 110 having an adhesive force on both surfaces thereof is provided. The first substrate 110 may be any one of a flexible plastic substrate having adhesive strength on both sides and an insulating substrate having adhesive strength on both sides, and preferably, the double substrate tape.

The first substrate 110 and the carrier substrate 10 are bonded to each other so that the first surface of the first substrate 110 contacts the metal pattern 140, and the second surface of the first substrate 110 is different from the metal pattern 140. The first substrate 110 and the other carrier substrate 10 are bonded to the 140. The second surface of the first substrate 110 may correspond to an opposite face of the first surface of the first substrate 110.

After coupling the carrier substrate 10 to the first and second surfaces of the first substrate 110, the carrier substrate 10 is separated from the first substrate 110 as shown in FIG. 15. At this time, since the metal pattern 140 has a relatively higher adhesive force with the first substrate 110 than with the carrier substrate 10, the metal pattern 140 is separated from the carrier substrate 10 to be separated from the carrier substrate 10. Transfer is performed on the first surface and the second surface of 110. Hereinafter, the metal pattern 140 transferred onto the first surface of the first substrate 110 is the first metal pattern 140, and the metal pattern transferred onto the second surface of the first substrate 110 ( 140 is referred to as a second metal pattern 150.

Meanwhile, in another exemplary embodiment, in the process of transferring the metal pattern 140 on the first and second surfaces of the first substrate 110, the metal pattern may be formed on the first substrate 110 having the via hole. After transferring onto one or the second surface and filling the via hole with conductive nanoparticles to form a via, the metal pattern is formed on the first and second surfaces of the first substrate 110. This can be done by transferring onto the other side that is not formed.

16 and 17, after forming a first metal pattern 140 and a second metal pattern 150 on the first and second surfaces of the first substrate 110, respectively, The second substrate 120 having the first adhesive layer 125 formed thereon and the third substrate 130 having the second adhesive layer 135 formed thereon are coupled to the first substrate 110.

In an embodiment of the present invention, the first substrate 110 and the second substrate 120 are disposed such that the first surface of the first substrate 110 and the first surface of the second substrate 120 face each other. The first substrate 110 and the third substrate 130 are coupled to each other so that the first surface of the first substrate 110 and the first surface of the third substrate 130 face each other.

In this case, the second surface of the second substrate 120 and the second surface of the third substrate 130 are respectively formed of the first surface of the second substrate 120 and the first surface of the third substrate 130. It may correspond to an opposite face, and the second substrate 120 and the third substrate 130 may each be any one of a transparent glass substrate, a flexible plastic substrate, a metal substrate, and an opaque insulating substrate. It may be, preferably a polyimide film (polyimide film).

By combining the first substrate 110 with the second substrate 120 and the third substrate 130, the circuit board 100 as shown in FIG. 17 is completed, and the circuit board includes the first metal layer 142 and the second substrate. One or more first metal patterns 140 including the metal layer 144 and one or more second metal patterns 150 including the first metal layer 152 and the second metal layer 154, and the first metal pattern 140 may be embedded in the first adhesive layer 125, and the second metal pattern 150 may be embedded in the second adhesive layer 135.

The surface of the first metal pattern 140 that faces the first surface of the second substrate 120 faces the first surface of the second substrate 120 of the surface of the first metal layer 142. One of the surfaces of the first opposing surface 146 and the second metal layer 144 may include a second opposing surface 148 facing the first surface of the second substrate 120. The area of the first facing surface 146 may be about 1.5 times or more and 1000 times or less of the area of the second facing surface 148, and the area ratio of the first facing surface 146 and the second facing surface 148 is a circuit. It may vary depending on the characteristics, uses, and the like of the substrate 100.

Similarly, the surface of the second metal pattern 150 that faces the first surface of the third substrate 130 is the first surface of the third substrate 130 of the surface of the first metal layer 152. The first opposing surface 156 and the second metal surface 154 may include a second opposing surface 158 facing the first surface of the third substrate 130. The area of the first facing surface 156 may be about 1.5 times or more than 1000 times the area of the second facing surface 158, and the area ratio of the first facing surface 156 and the second facing surface 158 is a circuit. It may vary depending on the characteristics and uses of the substrate 100.

Meanwhile, in another embodiment, a non-photosensitive polyimide resin layer is formed to cover the first metal pattern 140 formed on the first surface of the first substrate 110, and a photoresist is formed on the non-photosensitive polyimide resin layer. A film is formed, the photoresist film is partially exposed and developed to form a predetermined photoresist pattern, and then the non-photosensitive polyimide resin layer is etched using the photoresist pattern as a mask to form the first metal pattern 140. The multilayer printed circuit board 100 may be formed to include contact holes to be exposed. Meanwhile, an adhesive layer may be positioned between the non-photosensitive polyimide resin layer and the first substrate 110. In this case, the non-photosensitive polyimide resin layer and the adhesive layer are etched together using the photoresist pattern as a mask. As a result, the multilayer printed circuit board 100 including the contact hole exposing the first metal pattern 140 may be formed.

18 is a cross-sectional view illustrating a multilayer printed circuit board 900 according to still another embodiment of the present invention.

Referring to FIG. 18, the multilayer printed circuit board 900 may include a first layer portion 903 and a second layer portion 906. The first layer portion 903 includes a first substrate 910, a second substrate 920, a first adhesive layer 930, a second adhesive layer 932, one or more first metal patterns 940, and one or more second metals. The pattern 950, and the first metal pattern 940 may include a first metal layer 942 and a second metal layer 944, may have a shape extending in a first direction, and include a second metal pattern ( The 950 may include a first metal layer 952 and a second metal layer 954, and may have a shape extending in a first direction.

The second layer portion 906 may include a third substrate 960, a fourth substrate 970, one or more third metal patterns 980, one or more fourth metal patterns 990, a first adhesive layer 930, and a third substrate. The third metal pattern 980 may include an adhesive layer 934, and may include a first metal layer 982 and a second metal layer 984. The third metal pattern 980 may have a shape extending in a first direction. 990 may include a first metal layer 992 and a second metal layer 994, and may have a shape extending in a first direction.

Since the first layer portion 903 and the second layer portion 906 of the multilayered printed circuit board 900 each have a structure and dimensions substantially the same as or similar to those of the circuit board 100 described with reference to FIG. Omit.

Meanwhile, in the present exemplary embodiment, the multilayer printed circuit board 900 including the first layer portion 903 and the second layer portion 906 has been described, but this is merely illustrative, and the structure described above with reference to FIG. 18 is described. It is apparent that a multilayer printed circuit board including three or more layers can be formed by stacking a plurality of layers.

The circuit board according to the embodiments may be manufactured by using an inkjet method instead of an etching method or a screen printing method when forming a metal pattern including a plating seed layer and a plating layer, thereby minimizing the amount of metal used to form the metal pattern. The cost can be reduced and the process can be simplified, and the metal pattern including the seed layer and the plating layer is transferred onto the adhesive substrate through the transfer process, thereby improving the adhesion between the metal pattern and the substrate forming the circuit pattern, thereby providing excellent stability. And reliability. In addition, the surface of the metal pattern that is in contact with and separated from the carrier substrate may have almost no bend, and thus may have better adhesion when bonding to the lower substrate. The multilayer printed circuit board may be formed by a simple process by transferring the metal pattern to both sides of the substrate. In forming the multilayer printed circuit board having the vias, the vias are first formed on the substrate and then the metal patterns. By transferring the, smear can be minimized.

10: carrier substrate
40: substrate
41: print head
42: electronic ink
449, 770: landscape
880 opening
560 contact hole
660, 760: Via
903: first layer
906: second floor
142 and 152: first metal layer
144 and 154: second metal layer
146, 156: first facing surface
148, 158: second facing surface
43, 140, 240, 340, 440, 540, 640, 740, 840, 940: First metal pattern
Second metal pattern: 44, 150, 250, 350, 450, 550, 650, 750, 850, 950
980: third metal pattern
990: fourth metal pattern
110, 210, 310, 410, 510, 610, 710, 810, 910: first substrate
120, 220, 320, 420, 520, 620, 720, 820, 920: second substrate
130, 230, 330, 430, 530, 630, 730, 830, 960: 3rd board
970: fourth substrate
212: base substrate
125, 225, 325, 425, 525, 625, 725, 825, 930: first adhesive layer
135, 235, 335, 435, 535, 635, 735, 835, 932: second adhesive layer
214, 934: third adhesive layer

Claims (41)

A first substrate;
A second substrate facing the upper surface of the first substrate;
A first adhesive layer provided between the first substrate and the second substrate;
At least one first metal pattern covered by the first adhesive layer and positioned on an upper surface of the first substrate;
A third substrate facing the lower surface of the first substrate;
A second adhesive layer provided between the first substrate and the third substrate; And
At least one second metal pattern covered by the second adhesive layer and positioned on the bottom surface of the first substrate,
The first metal pattern and the second metal pattern are each A first metal layer formed by an inkjet method and a second metal layer formed by plating, wherein a surface of the first metal pattern facing the second substrate and a surface of the second metal pattern; The opposing surface may include a first opposing surface facing the second substrate or the third substrate among the surfaces of the first metal layer, and a second opposing surface facing the second or third substrate among the surfaces of the second metal layer. A multilayer printed circuit board comprising a face. The method according to claim 1,
And the area of the first facing surface is 1.5 times or more and 1000 times smaller than the area of the second facing surface. The method according to claim 1,
And the second substrate and the third substrate are each one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate. The method according to claim 3,
The second substrate and the third substrate is a multi-layer printed circuit board, characterized in that the polyimide film (polyimide film). The method according to claim 3,
At least one of the second substrate and the third substrate comprises a non-photosensitive polyimide. The method according to claim 1,
The first substrate has a multilayer printed circuit board, characterized in that the upper and lower surfaces have an adhesive force. The method of claim 6,
The first substrate is a multilayer printed circuit board, characterized in that the double-sided tape. The multilayer printed circuit board of claim 6, wherein the first substrate comprises a base substrate and adhesive layers formed on upper and lower surfaces of the base substrate. The multilayer printed circuit board of claim 8, wherein the base substrate is any one of a transparent glass substrate, a flexible plastic substrate, and an opaque insulating substrate. The multilayer printed circuit board of claim 9, wherein the base substrate is a polyimide film. The multilayer printed circuit board of claim 8, wherein the base substrate is a metal substrate. The method of claim 11,
And the metal substrate comprises aluminum, copper, silver, titanium, niobium, stainless steel, zinc, beryllium or magnesium. The method according to claim 8,
And the adhesive layer is a dielectric layer. The method according to claim 13,
Wherein said dielectric layer comprises at least one of prepreg, a heat resistant resin comprising thermally conductive particles, and a ceramic material. The method according to claim 14,
The heat resistant resin is at least one of an epoxy resin, unsaturated polyester, acrylic modified resin, urea resin and polyimide resin. The method according to claim 1,
The first metal layer includes silver (Ag) or copper (Cu), and the second metal layer comprises a conductive metal. 18. The method of claim 16,
And said conductive metal comprises copper, silver, gold, aluminum, nickel or tin. The method according to claim 1,
At least one contact hole exposing the first metal pattern is formed in the second substrate and the first adhesive layer. The method according to claim 1,
The at least one contact hole exposing the second metal pattern is formed in the third substrate and the second adhesive layer. The method according to claim 1,
And a surface of the first metal pattern which faces the second substrate and a surface of the second metal pattern which faces the third substrate are roughened surfaces. The method according to claim 1,
And wherein the first substrate includes one or more vias through the first substrate. 23. The method of claim 21,
And the via is in electrical contact with one of the first metal pattern and one of the second metal patterns. 23. The method of claim 21,
The vias are filled with conductive nanoparticles, characterized in that the multilayer printed circuit board. 24. The method of claim 23,
The conductive nanoparticles are multilayer printed circuit board, characterized in that the conductive metal particles having a diameter of a nano size. 27. The method of claim 24,
The conductive metal particle is a multi-layer printed circuit board, characterized in that the silver nanoparticles or a mixture of silver nanoparticles and tin nanoparticles. 23. The method of claim 22,
And at least one of the first metal pattern and the second metal pattern in contact with the via is a roughened surface in contact with the via. 27. The method of claim 26,
The roughness of the roughened surface has a thickness of less than 5 µm, respectively. 24. The method of claim 23,
At least one of the first metal pattern and the second metal pattern in contact with the via is provided with an opening for exposing the conductive nanoparticles filling the via, and the opening is formed of a metal having the opening formed therein. A multilayer printed circuit board, which is formed in a region located on the via of the entire region of the pattern. 29. The method of claim 28,
The opening may be any one of a grid-like mesh pattern, a plurality of small holes, a plurality of narrow slits, and a plurality of concentric circles having different diameters. 29. The method of claim 28,
The opening is a multilayer printed circuit board, characterized in that the grid pattern form. Forming at least one first metal layer on an upper surface of the carrier substrate by an inkjet method;
Plating at least one second metal layer using the first metal layer as a seed layer, thereby forming at least one transfer carrier substrate including a metal pattern including the first metal layer and the second metal layer;
Coupling the first substrate and the transfer carrier substrate by contacting the both sides with the transfer carrier substrate, respectively, such that both sides of the first substrate having both sides adhere to the metal pattern;
By separating the transfer carrier substrate from both sides of the first substrate and transferring the metal pattern on both sides of the first substrate, a first metal pattern is formed on the top surface of the first substrate, the first Forming a second metal pattern on the bottom surface of the substrate;
A first insulating layer is formed on the top surface of the first substrate to cover the first metal pattern and the top surface of the first substrate, and covers the bottom surface of the second metal pattern and the first substrate. Forming a second insulating layer on the bottom surface of the first substrate; And
Forming a second substrate on the first insulating layer to face the upper surface of the first substrate, and forming a third substrate on the second insulating layer to face the lower surface of the first substrate. ,
The first metal pattern and the second metal pattern may include a first metal layer formed by an inkjet method and a second metal layer formed by plating, and a surface of the surface of the first metal pattern facing the second substrate and the The surface of the second metal pattern, which faces the third substrate, is respectively opposed to the second substrate among the surfaces of the first metal layer and the first facing surface that faces the second substrate, and the surface of the second metal layer. A manufacturing method of a multilayer printed circuit board comprising a second opposing surface. 32. The method of claim 31,
The area of the said 1st opposing surface is 1.5 to 1000 times of the area of the said 2nd opposing surface, The manufacturing method of the multilayer printed circuit board characterized by the above-mentioned. 32. The method of claim 31,
Before coupling the transfer carrier substrate to both surfaces of the first substrate, roughening the surface of the metal pattern on a surface of the metal pattern facing the first substrate. Manufacturing method. The method according to claim 33,
The unevenness | corrugation of the roughening surface formed in the surface of the said metal pattern by the said roughening process has a thickness of less than 5 micrometers, respectively, The manufacturing method of the multilayer printed circuit board. 32. The method of claim 31,
And said first substrate is a double-sided tape. 32. The method of claim 31,
And the first substrate comprises a base substrate and an adhesive layer formed on upper and lower surfaces of the base substrate. 32. The method of claim 31,
The second substrate is a method of manufacturing a multilayer printed circuit board, characterized in that it comprises a non-photosensitive polyimide. 37. The method of claim 37,
Forming the second substrate on the first insulating layer,
Forming a non-photosensitive polyimide resin layer to cover the first insulating layer and the first metal pattern formed on the upper surface of the first substrate;
Forming a photoresist film on the non-photosensitive polyimide resin layer;
Partially exposing and developing the photoresist film to form a photoresist pattern;
Etching the non-photosensitive polyimide resin layer and the first insulating layer using the photoresist pattern as a mask to form a contact hole exposing the first metal pattern; And
Removing the photoresist pattern. 32. The method of claim 31,
Joining the first substrate and the transfer carrier substrate,
Forming a via hole penetrating the first substrate;
Contacting and coupling any one of the transfer carrier substrates with the first substrate so that the metal pattern may block the lower opening of the via hole;
Filling the via holes with conductive nanoparticles to form vias; And
And contacting and bonding any one of the transfer carrier substrates with the first substrate so that the metal pattern can block the upper opening of the via hole. 42. The method of claim 39,
The conductive metal particles are silver nanoparticles or a mixture of silver nanoparticles and tin nanoparticles manufacturing method of a multilayer printed circuit board. A multilayer printed circuit board having a structure in which a plurality of multilayer printed circuit boards according to any one of claims 1 to 30 are laminated.

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