KR20130076014A - Apparatus and method of suppling trays - Google Patents
Apparatus and method of suppling trays Download PDFInfo
- Publication number
- KR20130076014A KR20130076014A KR1020110144394A KR20110144394A KR20130076014A KR 20130076014 A KR20130076014 A KR 20130076014A KR 1020110144394 A KR1020110144394 A KR 1020110144394A KR 20110144394 A KR20110144394 A KR 20110144394A KR 20130076014 A KR20130076014 A KR 20130076014A
- Authority
- KR
- South Korea
- Prior art keywords
- trays
- unit
- tray
- front surface
- picker
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
Abstract
The tray feeding device has an internal space for accommodating a plurality of trays and includes a receiving portion having an opened upper surface and a receiving surface, a tray supporting portion for receiving the trays of the receiving portion, And a buffer portion for supporting the trays so that the picker can pick up the trays without waiting time while the lifting portion descends to accommodate new trays into the receiving portion. Therefore, the picker can continuously pick up the trays, so that the productivity of the tray feeding apparatus can be improved.
Description
The present invention relates to a tray feeding apparatus and method, and more particularly, to a tray feeding apparatus and method for feeding a tray for receiving a sown semiconductor package.
Generally, a semiconductor package is manufactured by attaching a semiconductor chip on a semiconductor substrate so as to be electrically connected to each other, and molding the semiconductor substrate with an epoxy resin on the upper surface.
The semiconductor package manufactured as described above is subjected to a singulation process in which the packages connected to each other are cut by the lead frame and the single package cut out after the singulation process is processed according to a preset quality standard Loaded on a tray and moved for the next process.
The trays for loading the single package are supplied by a tray feeder. The tray supply device accommodates the trays and raises them so that the pickers can sequentially transport the trays. However, when the pickers all carry the trays stored in the tray supply device, new trays are supplied to the tray supply device. While the new trays are being supplied, the pickers can not transport the trays and thus remain in a standby state. Further, since the worker manually supplies the trays to the tray supply device, it takes a lot of time to supply the tray. Therefore, the waiting time of the picker is prolonged, so that the productivity of the tray feeding process may be reduced.
The present invention provides a tray feeding apparatus for feeding a tray so that a picker can transport the tray without waiting time.
The present invention provides a tray feeding method using the tray feeding apparatus.
The tray supply device according to the present invention includes an accommodating portion having an inner space for accommodating a plurality of trays and having an upper surface and a front surface opened, a support portion for supporting the trays of the accommodating portion, and a picker for picking up the trays through the upper surface A buffer for supporting the trays so that the picker can pick up the trays without waiting time while the lifting unit descends to accommodate new trays into the storage unit Section.
According to an embodiment of the present invention, the tray supply device may further include a transfer unit for transferring the trays to the inside of the storage unit through the front surface of the storage unit.
According to one embodiment of the present invention, the tray supply device is disposed on both sides of the storage part, and while the trays are supplied into the storage part, the front surface is opened and the supply of the trays into the storage part Closing the front surface to prevent the tray from being detached from the inside when the tray is completed.
According to an embodiment of the present invention, the tray supply device may further include a sensing unit connected to the storage unit and sensing a height of the elevating unit.
The tray supplying method according to the present invention includes the steps of feeding trays through the front surface to the inside of a receiving portion having an open top and a top surface, and raising and lowering the tray so that the picker can pick up the trays through the top surface. Supporting the trays with the buffer unit so that the picker can pick up the trays without waiting time when the ascending / descending unit reaches a predetermined height; and raising / lowering the elevating / lowering unit to accommodate new trays into the receiving unit .
According to an embodiment of the present invention, the upper limit and the lower limit of the lifting unit can be sensed using the sensing unit.
According to an embodiment of the present invention, in the step of supplying the trays to the inside of the receiving part, the opening and closing part opens the front surface, the elevating part raises the trays, supporting the trays with the buffer part, In the descending step, the opening / closing part may block the front surface to prevent the trays from being separated from the inside of the storage part.
The tray feeding apparatus and method according to the present invention can support existing trays while the new trays are being fed to the receiving section. Therefore, the picker can continuously transport the tray without waiting time.
In addition, since the conveying section supplies the trays to the receiving section, the trays can be supplied quickly and stably.
1 is a front view for explaining a tray feeding apparatus according to an embodiment of the present invention.
2 is a side view for explaining the tray feeding apparatus shown in FIG.
3 to 6 are front views for explaining a tray feeding method using the tray feeding apparatus shown in FIG.
Hereinafter, with reference to the accompanying drawings will be described in detail a tray supply apparatus and method according to an embodiment of the present invention. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.
The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
FIG. 1 is a front view for explaining a tray feeding apparatus according to an embodiment of the present invention, and FIG. 2 is a side view for explaining the tray feeding apparatus shown in FIG.
1 and 2, the
The
The
The
The
The
The
The supporting
The
The connecting
The
As described above, the elevating
The
The
As another example, the
The
The
The
The
The
The opening and closing
The
The
Therefore, the opening /
The
The fixing
The
Therefore, the ascending and descending range of the
The
3 to 6 are front views for explaining a tray feeding method using the tray feeding apparatus shown in FIG.
Referring to FIG. 3, the
Further, the
The trays stacked in the vertical direction are transported from the outside of the
4, when the trays are transported to the inside of the
Then, the
Referring to FIG. 5, the
The
Referring to FIG. 6, the
3 to 6 are fed into the receiving
The picker picks up the trays held in the
As described above, the tray feeding apparatus and method according to the present invention can support existing trays while the new trays are being fed to the receiving section. Therefore, the picker can continuously transport the tray without waiting time.
In addition, since the conveying section supplies the trays to the receiving section, the trays can be supplied quickly and stably.
Therefore, productivity and reliability of the tray feeding process can be improved.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
100: tray feeder 110:
120: elevating part 130: buffer part
140: transfer part 150: opening /
160; Sensing unit 10: tray
Claims (7)
A lifting unit supporting the trays of the storage unit and raising the trays inside the storage unit so that the picker can pick up the trays through the top surface; And
And a buffer portion for supporting the trays so that the picker can pick up the trays without waiting time while the elevator descends to receive new trays into the receiving portion.
A lifter raising the trays inside the housing so that a picker can pick up the trays through the top surface;
Supporting the trays with a buffer unit so that the picker can pick up the trays without waiting time when the elevator unit has a constant height; And
And the elevating part descends to receive new trays into the accommodating part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110144394A KR101411163B1 (en) | 2011-12-28 | 2011-12-28 | Apparatus and method of suppling trays |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110144394A KR101411163B1 (en) | 2011-12-28 | 2011-12-28 | Apparatus and method of suppling trays |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130076014A true KR20130076014A (en) | 2013-07-08 |
KR101411163B1 KR101411163B1 (en) | 2014-06-24 |
Family
ID=48989703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110144394A KR101411163B1 (en) | 2011-12-28 | 2011-12-28 | Apparatus and method of suppling trays |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101411163B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190047899A (en) * | 2017-10-30 | 2019-05-09 | 세메스 주식회사 | Tray storage buffer and apparatus for transferring trays having the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01281220A (en) * | 1988-05-07 | 1989-11-13 | Sanyo Electric Co Ltd | Tray accommodating device |
KR100392389B1 (en) * | 2001-08-10 | 2003-07-23 | 삼성전자주식회사 | User-tray stacker for test handler of semiconductor device |
KR20050095014A (en) * | 2004-03-24 | 2005-09-29 | 삼성전자주식회사 | Tray loading/unloading appar atus for semiconductor package |
KR100718847B1 (en) * | 2006-06-15 | 2007-05-18 | 세크론 주식회사 | Tray supply device for semiconductor package |
-
2011
- 2011-12-28 KR KR1020110144394A patent/KR101411163B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190047899A (en) * | 2017-10-30 | 2019-05-09 | 세메스 주식회사 | Tray storage buffer and apparatus for transferring trays having the same |
Also Published As
Publication number | Publication date |
---|---|
KR101411163B1 (en) | 2014-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101677291B1 (en) | Tray supply apparatus | |
CN109230321B (en) | Material conveying system, conveying method and storage device | |
KR101306259B1 (en) | Apparatus for supplying insert and packing injection molding product and fabrication method thereof | |
TWI449116B (en) | Container exchange system, container exchange method and substrate processing system | |
KR20130129123A (en) | Receiving device | |
KR20160056826A (en) | Article transport facility | |
CN113211034B (en) | Vibration module visor assembly system | |
KR101110172B1 (en) | Component transfer apparatus and method | |
KR20210058682A (en) | Container supply device and container supply method | |
JP5228504B2 (en) | Storage and entry / exit methods | |
KR101411163B1 (en) | Apparatus and method of suppling trays | |
CN210167341U (en) | Silicon wafer transmission device | |
KR20190085230A (en) | Automatic pcb loading apparatus and loading method using the same | |
KR101100656B1 (en) | Various Component Insert Mechine with Guide Zig | |
KR20090030743A (en) | Handler, method of manufacturing semiconductor using the same, and method of transferring test-tray | |
KR101842002B1 (en) | Solder preform cutting apparatus | |
KR101876315B1 (en) | Apparatus for assembling cosmetic containers | |
KR101338211B1 (en) | Led lens supply apparatus | |
CN110642003B (en) | Storage bin structure and full-automatic LED packaging machine thereof | |
CN113501336A (en) | Material conveying device, automatic equipment and feeding and discharging method | |
KR101389571B1 (en) | A insertplate supply apparatus for a case of mobile phone | |
JP2010137961A (en) | Storage and inlet-outlet method | |
KR20080055312A (en) | Device for transfer a magazine | |
KR20160066210A (en) | Unit for buffering a carrier and apparatus for transferring a carrier having the unit | |
KR20050095014A (en) | Tray loading/unloading appar atus for semiconductor package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20170530 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20180530 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20190528 Year of fee payment: 6 |