KR20130068957A - Light emitting package - Google Patents

Light emitting package Download PDF

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Publication number
KR20130068957A
KR20130068957A KR1020110136441A KR20110136441A KR20130068957A KR 20130068957 A KR20130068957 A KR 20130068957A KR 1020110136441 A KR1020110136441 A KR 1020110136441A KR 20110136441 A KR20110136441 A KR 20110136441A KR 20130068957 A KR20130068957 A KR 20130068957A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
package
light
lens unit
Prior art date
Application number
KR1020110136441A
Other languages
Korean (ko)
Inventor
남경필
이승우
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020110136441A priority Critical patent/KR20130068957A/en
Publication of KR20130068957A publication Critical patent/KR20130068957A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting device package, comprising a substrate including a circuit layer, a light emitting device mounted on the substrate, and a lens unit formed on the light emitting device to protect the light emitting device from the outside, wherein the lens unit At least one of silicon and epoxy may be coated and formed to block light emitted from the light emitting device.

Description

Light emitting device package {LIGHT EMITTING PACKAGE}

The present invention relates to a light emitting device package in which at least one light emitting device package including a dummy package is formed in an array form.

A light emitting device is a device that converts electricity into light. Typical light emitting devices include a light emitting diode (LED), a semiconductor laser, and the like, and are implemented in a package form.

The Light Emitting Device package was initially used for signal display, but recently, the light source of a large display device such as a back light unit (BLU) or a liquid crystal display (LCD) for a mobile phone and It is widely used for lighting. In addition, since the light emitting device consumes less power and has a longer lifetime than a light bulb or a fluorescent lamp, its demand is increasing.

The array element is a regular arrangement of the same element in one or two dimensions, it can be used when the light emitting element package is arranged in the form of an array to increase the detection sensitivity of the sensor or to have a scanning function.

The light emitting element arrays may be connected in series or in parallel.

When the number of light emitting devices in the light emitting device array does not match according to the array configuration, as shown in FIG. 1, the LED characteristics 110 and the specific current value of the IV CURVE characteristic graph 100 of the resistance and the LEDs may be different from each other. A method of applying a resistor having the same resistance value as that of the resistor 120 may be used. In addition, a diode and a resistor are connected in series as shown by reference numeral 210 of FIG. 2, or only a resistor is connected as shown by reference numeral 220, or an extra LED is added as shown by reference numeral 230 and the LED is not visible from the outside. The processing method is used.

However, in the method of inserting an equivalent load, the method used at 210 is a balance of load when the current flowing through the LED deviates from the current value calculated at the time of setting, as shown at 310 and 320 in FIG. 3. If it doesn't fit, current draws.

Similarly, among the methods of inserting an equivalent load, the method used in reference numeral 220 is a balance of load when the current flowing in the LED is out of the calculated current value at the setting as shown by reference numerals 330 and 340 of FIG. If it doesn't fit, current draws.

For reference, reference numeral 310 denotes a light emitting device array operating with a current of 100 mA by adding a resistor instead of LED, and reference numeral 320 denotes a light emitting device array operating with a current of 10 mA.

Reference numeral 330 denotes a light emitting device array operating at a current of 100 mA by connecting a diode and a resistor in series instead of an LED, and reference numeral 340 denotes a light emitting device array operating at a current of 10 mA.

In addition, the method 230 of treating the LEDs from the outside is difficult to arrange the LEDs so that light leakage does not occur.

A light emitting device device according to an embodiment of the present invention includes a light emitting device array including at least one light emitting device package electrically connected to the light emitting device, and a power supply unit supplying a current selected by the light emitting device array. At least one light emitting device package of the one or more light emitting device package is characterized in that the dummy package is blocked the light emission.

The dummy package according to an aspect of the present invention includes a substrate including a circuit layer, a light emitting device mounted on the substrate, and a lens unit formed on the light emitting device to protect the light emitting device from the outside, wherein the lens The part may be formed by applying an opaque resin and block light emitted from the light emitting device.

The opaque resin according to one aspect of the present invention is characterized in that at least one of silicon (Silicon) and epoxy (Epoxy).

The dummy package according to an embodiment of the present invention includes a substrate including a circuit layer, a light emitting device mounted on the substrate, and a lens unit formed on the light emitting device to protect the light emitting device from the outside, wherein the lens The part is formed by coating at least one of silicon and epoxy and blocking light emitted from the light emitting device.

A method of manufacturing a light emitting device according to an embodiment of the present invention includes forming a dummy package in which light emission is blocked, and including the formed dummy package to electrically connect a plurality of light emitting device packages to the light emitting device array. It may comprise the step of forming.

The forming of the dummy package according to an embodiment of the present invention may include providing a substrate including a circuit layer, forming a light emitting device mounting region on the substrate, and forming the light emitting device on the formed mounting region; And forming a lens unit to block light emitted from the light emitting device by applying an opaque resin on the formed light emitting device.

Forming a lens unit to block the light emitted from the light emitting device by applying an opaque resin on the formed light emitting device according to one side of the present invention, from the silicon (Silicon) and epoxy (Epoxy) on the formed light emitting device It may include the step of forming at least one lens unit for blocking the light emitted from the light emitting device.

According to an embodiment of the present invention, due to the application of the dummy package, when the number of LEDs arranged in series at the time of LED arrangement is not the same, the same effect as applying the LED by applying a dummy package can be seen.

According to one embodiment of the present invention, in the LED manufacturing process, if only the VF RANK SPEC IN, chips FULX RANK, COLOR RANK SPEC OUT can be produced in a dummy package, thereby reducing the loss of the process.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram for explaining a graph of a current-voltage curve (IV CURVE) of a resistor and an LED.
2 is a view for explaining a light emitting element array.
3 is a circuit diagram illustrating a current draw phenomenon that occurs when an equivalent load element is used for a light emitting element array.
4 is a view illustrating a light emitting device package used in a light emitting device device according to an embodiment of the present invention.
FIG. 5 is a diagram illustrating an appearance of a dummy package generated in FIG. 4.
FIG. 6 is a diagram illustrating that current draw does not occur even when a light emitting device package according to an embodiment of the present invention is different from a current value set in a used light emitting device array.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The terminologies used herein are terms used to properly represent preferred embodiments of the present invention, which may vary depending on the user, the intent of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of the terms should be made based on the contents throughout the specification. Like reference symbols in the drawings denote like elements.

The present invention proposes a light emitting device package which does not emit light by blocking the light emitting part with a resin material.

In the present specification, the resin material is described by using silicon (Silcon) or epoxy (Epoxy) as an example. Various kinds of resins such as PS: Polystyrene), polypropylene (PP: Polypropylene), and SAN (AS) resin (SAN: Styrene Acrylonitrile Copolymer) may be used.

Such a light emitting device package may be defined as a dummy package, and may be used when the number of light emitting devices arranged in series in a light emitting device array is not the same.

4 is a view illustrating a dummy package 400 used in a light emitting device according to an embodiment of the present invention.

Referring to FIG. 4, the light emitting device package 400 may include a circuit board 410, a first metal wiring layer 431, a second metal wiring layer 432, a thin film substrate 440, a light emitting device 450, and light reflecting filling. The unit 460 includes an opening 470 and a lens unit 480.

The circuit board 410 is a kind of package substrate including a circuit layer for mounting and packaging the light emitting device 450. The circuit board 410 includes circuit patterns 411 and 112 for supplying external power to the light emitting device 450.

The first metal wiring layer 431 and the second metal wiring layer 432 are bonded to the circuit board 410 by the metal bonding layer 420 to be connected to the circuit patterns 411 and 112. The first metal wiring layer 431 and the second metal wiring layer 432 may be spaced apart from each other at regular intervals on the entire surface of the circuit board 410. In addition, the first metal wiring layer 431 and the second metal wiring layer 432 may have the same or different areas.

The thin film substrate 440 is mounted on the first metal wiring layer 431 and the second metal wiring layer 432 by a bonding material. In addition, the thin film substrate 440 may include an opening 470 exposing the first metal wiring layer 431 and the second metal wiring layer 432. The thin film substrate 440 may include only one opening 470 or may include a plurality of thin film substrates 440.

When the thin film substrate 440 is mounted on the circuit board 410, the first metal wiring layer 431 and the second metal wiring layer 432 are exposed through the opening 470 of the thin film substrate 440. The first metal wiring layer 431 and the second metal wiring layer 432 are bonded on the circuit board 410.

The thin film substrate 440 may be formed of any one of polyimide, epoxy resin, silicone resin, polyethylene terephthalate (PET), polyester resin, and ceramic. The thin film substrate 440 formed of such a material may have a higher hardness or may further include glass fiber or ceramic powder to compensate for mechanical properties. In addition, when the thin film substrate 440 is formed of ceramic, it may include alumina (Al 2 O 3) or aluminum nitride (AlN). In addition, the thin film substrate 440 may further include titanium dioxide (TiO 2) to have reflective properties with respect to light.

Since the opening 470 is an area for mounting the light emitting device 450, the opening 470 preferably has a second area larger than the first area of the light emitting device 450. As such, when the opening 470 has the second area, a gap is formed between the light emitting element 450 and the opening 470. The light reflective filler 460 may be filled in this gap.

The light reflective filler 460 may include an organic or inorganic polymer, a light reflective material, a reinforcing material, an adhesive, and an antioxidant.

The lens unit 480 is formed on the light emitting device 450 to protect the light emitting device 450 from the outside, and is formed on the thin film substrate 440 to cover the light emitting device 450.

In this case, the lens unit 480 may be formed of an opaque resin or may be coated by the opaque resin. That is, the opaque resin may be coated on the formed light emitting device to form the lens unit 480, and the light emitted from the light emitting device may be blocked by using the lens unit 480.

The dummy package thus produced has the same device characteristics as a general light emitting device package, but does not emit any light and thus does not affect the light emitting characteristics of the overall light emitting device.

As a result, according to the present invention, when the number of LEDs arranged in series is not the same due to the application of the dummy package, the same effect as applying the LED by applying the dummy package can be seen.

In addition, according to an embodiment of the present invention, in the LED manufacturing process, if only the VF RANK SPEC IN, chips FULX RANK, COLOR RANK SPEC OUT can be produced in a dummy package, thereby reducing the loss of the process .

In the present specification, the lens unit 480 is described in the form of a hemisphere, but this is only an embodiment and may be implemented in various forms such as a flat type.

FIG. 5 is a view illustrating the external appearance of the dummy package 520 and the general light emitting device package 510 generated in FIG. 4.

The dummy package 520 inserted into the light emitting device array may block the light emitting part of the existing light emitting device package 510 with an opaque resin such as silicon or epoxy to form a dummy package 520 that does not emit light to the outside.

In the present specification, an embodiment in which the existing light emitting device package 510 and the dummy package 520 are implemented in the same shape will be described. However, the existing light emitting device package 510 and the dummy package 520 may be implemented in different shapes. Self-explanatory

FIG. 6 is a diagram illustrating that current draw does not occur even when a light emitting device package according to an embodiment of the present invention is different from a current value set in a used light emitting device array.

Reference numerals 610 and 620 illustrate a light emitting device array by connecting a plurality of light emitting device packages and a dummy package in series and in parallel.

The light emitting device according to the exemplary embodiment of the present invention may generate the light emitting device array by inserting the dummy package without inserting an equivalent load at the position of D4.

That is, the dummy package has the same electrical characteristics as other light emitting device packages, so that current deflection does not occur as shown by reference numerals 610 and 620.

Reference numeral 610 may be interpreted as a light emitting device array operating with a current of 100mA by adding a resistor instead of an LED, and reference numeral 620 may be interpreted as a light emitting device array operating with a current of 10mA.

The method of manufacturing a light emitting device according to an embodiment of the present invention may be implemented in the form of program instructions that can be executed by various computer means and recorded in a computer readable medium. The computer readable medium may include program instructions, data files, data structures, etc. alone or in combination. The program instructions recorded on the medium may be those specially designed and constructed for the present invention or may be available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tape, optical media such as CD-ROMs, DVDs, and magnetic disks, such as floppy disks. Magneto-optical media, and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, flash memory, and the like. Examples of program instructions include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter or the like. The hardware device described above may be configured to operate as one or more software modules to perform the operations of the present invention, and vice versa.

According to an embodiment of the present invention, due to the application of the dummy package, when the number of LEDs arranged in series at the time of LED arrangement is not the same, the same effect as applying the LED by applying a dummy package can be seen.

According to one embodiment of the present invention, in the LED manufacturing process, if only the VF RANK SPEC IN, chips FULX RANK, COLOR RANK SPEC OUT can be produced in a dummy package, thereby reducing the loss of the process.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

400: dummy package
410: circuit board
411, 412: circuit pattern
420: metal bonding layer
431: first metal wiring layer
432: second metal wiring layer
440: thin film substrate
450: light emitting device
460: light reflective filler
470: opening
480: lens unit

Claims (7)

A light emitting device array including at least one light emitting device package electrically connected thereto; And
A power supply unit supplying a current selected to the light emitting device array
Lt; / RTI >
At least one light emitting device package of the at least one light emitting device package is electrically connected to the light emitting device, characterized in that the dummy package to block the light emission.
The method of claim 1,
The dummy package,
A substrate comprising a circuit layer;
A light emitting element mounted on the substrate; And
A lens unit formed on the light emitting element to protect the light emitting element from the outside
Lt; / RTI >
The lens unit is formed by coating an opaque resin, the light emitting device device, characterized in that to block the light emitted from the light emitting device.
The method of claim 2,
The opaque resin is at least one of silicon (Silicon) and epoxy (Epoxy).
A substrate comprising a circuit layer;
A light emitting element mounted on the substrate; And
A lens unit formed on the light emitting element to protect the light emitting element from the outside
Lt; / RTI >
The lens unit is formed by coating at least one of silicon (Silicon) and epoxy (Epoxy), the dummy package, characterized in that for blocking the light emitted from the light emitting device.
Forming a dummy package from which light emission is blocked; And
Including the formed dummy package, electrically connecting a plurality of light emitting device packages to form a light emitting device array
Method of manufacturing a light emitting device device comprising a.
The method of claim 5,
Forming the dummy package,
Providing a substrate comprising a circuit layer;
Forming a light emitting device mounting region on the substrate, and forming the light emitting device on the formed mounting region; And
Forming a lens unit to block light emitted from the light emitting device by coating an opaque resin on the formed light emitting device;
Method of manufacturing a dummy package comprising a.
The method according to claim 6,
Forming a lens unit for blocking the light emitted from the light emitting device by applying an opaque resin on the formed light emitting device,
Forming a lens unit to block light emitted from the light emitting device by applying at least one of silicon and epoxy on the formed light emitting device;
Method of manufacturing a dummy package comprising a.
KR1020110136441A 2011-12-16 2011-12-16 Light emitting package KR20130068957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110136441A KR20130068957A (en) 2011-12-16 2011-12-16 Light emitting package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110136441A KR20130068957A (en) 2011-12-16 2011-12-16 Light emitting package

Publications (1)

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KR20130068957A true KR20130068957A (en) 2013-06-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD811627S1 (en) 2016-06-16 2018-02-27 Curtis Alan Roys LED lamp
USD851816S1 (en) 2017-04-14 2019-06-18 Curtis A. Roys Lamp support
USD901754S1 (en) 2017-04-14 2020-11-10 RetroLED Components, LLC Lamp support
US11002438B2 (en) 2019-04-03 2021-05-11 Sidney Howard Norton Adjustable clip-on base for LED assembly

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10222005B2 (en) 2015-07-24 2019-03-05 Sidney Howard Norton Method and assembly for replacing fluorescent lights
USD811627S1 (en) 2016-06-16 2018-02-27 Curtis Alan Roys LED lamp
USD893092S1 (en) 2016-06-16 2020-08-11 Curtis Alan Roys End cap for an LED stick
USD917776S1 (en) 2016-06-16 2021-04-27 Curtis Alan Roys End cap for an LED stick
USD851816S1 (en) 2017-04-14 2019-06-18 Curtis A. Roys Lamp support
USD901754S1 (en) 2017-04-14 2020-11-10 RetroLED Components, LLC Lamp support
US11002438B2 (en) 2019-04-03 2021-05-11 Sidney Howard Norton Adjustable clip-on base for LED assembly

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