KR20240012590A - Lighting module and lighting apparatus - Google Patents

Abstract

The lighting module disclosed in the embodiment includes: a substrate; a plurality of light emitting devices disposed on the substrate and having a light emitting surface adjacent to the substrate; It is disposed on the substrate and the light emitting device and includes a resin layer having a light extraction structure on an upper surface, and the light extraction structure includes a pattern arranged in the optical axis direction of the plurality of light emitting devices.

Description

Lighting module and lighting device having the same {LIGHTING MODULE AND LIGHTING APPARATUS}

Embodiments relate to a lighting module having a plurality of light emitting diodes and providing a planar light source.

The embodiment relates to a lighting device having a lighting module.

The embodiment relates to a backlight unit having a lighting module, a liquid crystal display, and a vehicle lamp.

Typical lighting applications include backlights for displays and signage, as well as automotive lights.

Light-emitting devices, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. These light emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

Recently, lamps employing light-emitting diodes have been proposed as light sources for vehicles. Compared to incandescent lamps, light emitting diodes have an advantage in that they consume less power. However, because the emission angle of light emitted from a light emitting diode is small, when a light emitting diode is used as a vehicle lamp, there is a need to increase the light emitting area of the lamp using the light emitting diode.

Because light emitting diodes are small in size, they can increase the design freedom of lamps and are economical due to their semi-permanent lifespan.

An embodiment provides a lighting module having a plurality of light emitting elements and a resin layer having a light extraction structure.

An embodiment provides a lighting module including a reflective film that reflects light emitted from a plurality of light emitting devices and a resin layer having a light extraction structure on the reflective film.

An embodiment provides a lighting module having a resin layer in which the pattern of the light extraction structure is arranged in a direction perpendicular to or in the same direction as the arrangement direction of the plurality of light emitting elements.

The embodiment provides a lighting module in which a resin layer having a light extraction structure is disposed at the same thickness on a substrate.

An embodiment provides a lighting module in which a resin layer having a light extraction structure has a first region of the same thickness on a substrate and a second region having a thickness that gradually becomes thinner as the distance from the light emitting device increases.

An embodiment provides a lighting module in which a resin layer having a light extraction structure has a thickness that gradually becomes thinner as the distance from each of the plurality of light emitting devices increases.

An embodiment provides a lighting module that irradiates a surface light source and a lighting device having the same.

Embodiments may provide a backlight unit with a lighting module, a liquid crystal display device, and a vehicle lamp.

A lighting module according to an embodiment includes: a substrate; a plurality of light emitting devices disposed on the substrate and having a light emitting surface adjacent to the substrate; It is disposed on the substrate and the light emitting device and includes a resin layer having a light extraction structure on an upper surface, and the light extraction structure includes a pattern arranged in the optical axis direction of the plurality of light emitting devices.

A lighting module according to an embodiment includes: a substrate; a plurality of light emitting devices disposed on the substrate and having a light emitting surface adjacent to the substrate; It includes a resin layer disposed on the substrate and the light emitting device and having a light extraction structure on an upper surface, wherein the plurality of light emitting devices are disposed adjacent to one edge of the substrate, and the light extraction structure is disposed on the plurality of light emitting devices. It includes a pattern arranged in a direction perpendicular to the arrangement direction of the elements.

According to the lighting module according to the embodiment, the luminous intensity of the planar light source can be improved.

According to the lighting module according to the embodiment, the light uniformity of the planar light source can be improved.

The embodiment can reduce light loss and disperse light by using a resin layer having a light extraction structure on the light emitting device and the substrate.

The optical reliability of the lighting module according to the embodiment and the lighting device having the same can be improved.

The reliability of a vehicle lighting device having a lighting module according to an embodiment can be improved.

Embodiments may be applied to backlight units with lighting modules, various display devices, surface light source lighting devices, and vehicle lamps.

1 is a side cross-sectional view showing a lighting module according to a first embodiment.
Figure 2 is an example of a top view of the lighting module of Figure 1.
Figure 3 is a perspective view showing an example of a light extraction structure of a resin layer in a lighting module according to an embodiment.
Figure 4 is a perspective view showing another example of a light extraction structure of a resin layer in a lighting module according to an embodiment.
Figure 5 is a first modified example of the light extraction structure of the resin layer according to the embodiment.
Figure 6 is a second modified example of the light extraction structure of the resin layer according to the embodiment.
7 is a side cross-sectional view of a reflective film in a lighting module according to an embodiment.
Figure 8 is an example of a reflection pattern in the reflective film of Figure 7.
Figure 9 is a side cross-sectional view of a lighting module according to a second embodiment.
Figure 10 is a diagram showing the light extraction structure of the resin layer of the lighting module of Figure 9.
Figure 11 is a perspective view of a lighting module according to a third embodiment.
Figure 12 is a partial side cross-sectional view of the lighting module of Figure 11;
FIG. 13 is a diagram for explaining the light extraction structure of the resin layer in the lighting module of FIG. 12.
Figure 14 is an example of a partial plan view of the lighting module of Figure 12.
Figure 15 is another example of a light extraction structure of a resin layer of a lighting module according to an embodiment.
16 to 18 show modified examples of lighting modules according to embodiments.
Figure 19 is a perspective view of a lighting module according to a fourth embodiment.
Figure 20 is a partial side cross-sectional view of the lighting module of Figure 19;
Figure 21 is a plan view of a lighting module according to a fifth embodiment.
22 is a side cross-sectional view of a lighting device having a lighting module according to an embodiment.
FIG. 23 is a cross-sectional view from another side of the lighting device of FIG. 22.
Figure 24 is a front view showing a light-emitting element of a lighting module according to an embodiment.
FIG. 25 is a cross-sectional view along the AA side of the light emitting device of FIG. 24.
FIG. 26 is a front view of the light emitting device of FIG. 27 disposed on a substrate.
FIG. 27 is a side view of the light emitting device of FIG. 26 disposed on a substrate.
Figure 28 is a diagram showing a lamp having a lighting device according to an embodiment.
Figure 29 is a plan view of a vehicle to which the vehicle lamp of Figure 28 is applied.
Figure 30 is a diagram showing the luminous intensity by a lighting device according to an embodiment.
31 is a diagram showing light distribution by a lighting device according to an embodiment.

Hereinafter, with reference to the attached drawings, preferred embodiments that allow those skilled in the art to easily practice the present invention will be described in detail. However, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and that there may be various equivalents and modifications that can replace them at the time of filing the present application.

In explaining in detail the operating principle of a preferred embodiment of the present invention, if a detailed description of a related known function or configuration is judged to unnecessarily obscure the gist of the present invention, the detailed description will be omitted. The terms described below are terms defined in consideration of their functions in the present invention, and the meaning of each term should be interpreted based on the content throughout the present specification. The same reference numerals are used for parts with similar functions and actions throughout the drawings.

The lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, head lamps, side lights, side mirror lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, backup lamps Applicable to etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric train fields. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or can be implemented in the future according to technological development. It will be said that it is.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and descriptions of the embodiments. In the description of the embodiments, each layer (film), region, pattern or structure is formed “on” or “under” the substrate, each layer (film), region, pad or pattern. In the case where it is described, “on” and “under” include both being formed “directly” or “indirectly” through another layer. Additionally, the standards for the top or bottom of each floor are explained based on the drawing.

Figure 1 is a side cross-sectional view showing a lighting module according to a first embodiment, and Figure 2 is another example of the lighting module of Figure 1.

1 and 2, the lighting module 200 according to the embodiment includes a substrate 201, a plurality of light emitting devices 100 disposed on the substrate 201, and the substrate 201 and the It includes a resin layer 150 covering the light emitting device 100, and a reflective film 110 disposed between the resin layer 150 and the substrate 201.

The substrate 201 includes a printed circuit board (PCB), for example, a resin-based printed circuit board (PCB), metal core PCB, flexible PCB, ceramic May include PCB and FR-4 board. When the substrate 201 is arranged as a metal core PCB with a metal layer disposed on the bottom, the heat dissipation efficiency of the light emitting device 100 can be improved.

*The substrate 201 includes a wiring layer (not shown) on the top, and the wiring layer can electrically connect the plurality of light emitting devices 100. The plurality of light emitting devices 100 may be connected in series, parallel, or series-parallel by the wiring layer, but are not limited thereto. The substrate 201 may function as a base member located at the base of the light emitting device 100 and the reflective film 110.

The light emitting device 100 may be disposed on the substrate 201, as shown in FIGS. 26 and 27. A plurality of light emitting devices 100 may be arranged on the substrate 201 at regular intervals B5, or may be arranged at different intervals from each other. The light-emitting devices 100 may be arranged in at least one row, two rows, or more on the substrate 201, and the light-emitting devices 100 in one or more rows may be arranged on the substrate 201. It may be arranged in the longitudinal direction, that is, the first axis direction (Y). For convenience of explanation, the embodiment will be described as an example in which a plurality of light emitting devices 100 are arranged in one row in the longitudinal direction (Y). The spacing between the light emitting devices 100 may be 100 mm or less, for example, in the range of 5 mm to 100 mm, or in the range of 10 mm to 40 mm. If the spacing between the light emitting devices 100 exceeds the above range, it is difficult to control the desired amount of light or uniformity of light.

The light-emitting device 100 is a device having a light-emitting diode and includes a package in which an LED chip is packaged. The light-emitting device 100 is capable of emitting at least one of blue, red, green, and ultraviolet rays (UV), and the light-emitting device 100 is a device having a light-emitting diode. The device may emit at least one of white, blue, red, and green. The light emitting device 100 may be a side view type whose bottom portion is electrically connected to the substrate 201, but is not limited thereto. As another example, the light emitting device 100 may be an LED chip, but is not limited thereto.

The light emission surface 101 of the light emitting device 100 may be disposed on a side adjacent to the substrate 201, for example, on a side adjacent to the top surface of the substrate 201. The light emission surface 101 is disposed on a side surface between the bottom and top surfaces of the light emitting device 100, and emits light in the first axis direction (Y). The light emission surface 101 of the light emitting device 100 may be a surface adjacent to the reflective film 110 or a surface perpendicular to the upper surface of the substrate 201 and the upper surface of the reflective film 110.

The optical axis Y0 of the light emitted from the light emitting surface 101 of the light emitting device 100 is an axis direction parallel to the upper surface of the substrate 201, or relative to an axis horizontal to the upper surface of the substrate 201. It can be tilted within 30 degrees. The optical axis Y0 may be horizontal light emitted from the light-emitting device 100, or may be an axial direction perpendicular to the top surface of the LED chip within the light-emitting device 100. The thickness T1 of the light emitting device 100 may be smaller than the length in the second axis direction (X), for example, 3 mm or less, for example, 2 mm or less. The length of the light emitting device 100 in the second axis direction may be 1.5 times or more than the thickness T1 of the light emitting device 100, but is not limited thereto. The light emitting device 100 may have a light emission angle in the longitudinal direction that is wider than the light emission angle in the thickness direction (Z). The light emission angle of the light emitting device 100 in the longitudinal direction (X) may range from 110 degrees to 160 degrees.

The reflective film 110 may be disposed on the substrate 201 . The reflective film 110 may have an area equal to or smaller than the top surface area of the substrate 201. The reflective film 110 is spaced apart from the edge of the substrate 201, so that the resin layer 150 can contact the upper surface of the substrate 201 on the edge side. When the resin layer 150 is in contact with the edge of the substrate 201, moisture penetration can be suppressed.

A hole 118 into which a portion of the light emitting device 100 is inserted may be disposed in the reflective film 110 . The upper surface of the substrate 201 is exposed through the hole 118 of the reflective film 110 and may be a portion where the lower portion of the light emitting device 100 is bonded. The size of the hole 118 may be the same as or larger than the size of the light emitting device 100, but is not limited thereto. The reflective film 110 may have a plurality of holes 118 disposed at positions corresponding to each light emitting device 100 . The reflective film 110 may be in contact with the upper surface of the substrate 201 or may be adhered to the resin layer 150, but is not limited thereto.

The reflective film 110 may be formed to have a thickness thinner than the thickness T1 of the light emitting device 100. The thickness of the reflective film 110 may range from 0.2 mm ± 0.02 mm. The lower portion of the light emitting device 100 may pass through the hole 118 of the reflective film 110 and the upper portion of the light emitting device 100 may protrude. The optical axis Y0 of the light emitting device 100 may be disposed above the top surface of the reflective film 110.

As shown in FIG. 7, the reflective film 110 may be formed in a multi-layer structure made of different materials, and includes a reflective layer 111 disposed on the substrate 201, a light-transmitting layer disposed on the reflective layer 111, and (112), and a reflective pattern 113 disposed between the reflective layer 111 and the light-transmitting layer 112.

The reflective layer 111 includes a material that reflects light, such as a metal or non-metallic material. If it is a metal, a metal layer such as Ag may be disposed, and if it is a non-metallic material, it may include a plastic material. The light-transmitting layer 112 is a transparent film and may include at least one of a resin material such as silicone or epoxy, or a transparent plastic material such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), or urethane.

7 and 8, the reflective pattern 113 may be disposed between the reflective layer 111 and the light-transmissive layer 112. The reflective layer 111 and the light-transmissive layer 112 may be spaced apart from each other by a predetermined gap without contacting each other. An air gap 113B may be included between the reflective layer 111 and the light-transmissive layer 112. The air gap 113B may be disposed in an area between the reflective patterns 113. An air gap 113B or a reflective pattern 113 may be disposed on the outer circumference between the reflective layer 111 and the light-transmissive layer 112. The reflective pattern 113 may be adhered to the reflective layer 111 and the light-transmissive layer 112. As another example, the light-transmissive layer 112 may contact the reflective layer 111 through an area between the reflective patterns 113.

The reflective layer 111 and the reflective pattern 113 reflect light incident through the light-transmissive layer 112, and the reflected light can be extracted through the resin layer 150. The reflective pattern 113 may be formed on the surface of the reflective layer 111 through white printing or silk screen printing. The reflection pattern 113 can disperse the incident light and improve luminance in the entire area. The reflective pattern 113 may include a metal oxide, for example, a material such as TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ or may be made using an ink containing at least one of silicon and polysilicon (PS). You can print. For example, the reflective pattern 113 may be formed of a material in which metal oxide is added to silicon or epoxy. The density of the reflective pattern 113 may gradually increase as the distance from the light emitting device 100 increases. The unit structure 113A of the reflection pattern 113 may have a polygonal shape, a circular shape, an elliptical shape, a regular shape, or an irregular shape, and may be formed in two or three dimensions. The unit structure of the reflective pattern 113 may be formed in a dense hexagonal shape with an air gap 113B therein. The reflective patterns 113 may be arranged so that the unit structures 113A are closely spaced together, or an air gap 113C may be disposed in an area where groups of the reflective patterns 113 are spaced apart from each other. By reflecting light using the reflective pattern 113 and the reflective layer 111, the number of light emitting devices 100 can be reduced and light uniformity in the entire area can be improved. Since the reflective film 110 is disposed on the bottom of the resin layer 150, the thickness (T2 in FIG. 1) of the resin layer 150 can be reduced. The reflective film may be removed from the lighting module according to the embodiment.

A resin layer 150 may be disposed on the substrate 201. The resin layer 150 may be disposed on the entire upper surface of the substrate 201. The top surface area of the resin layer 150 may be the same as or different from the top surface area of the substrate 201. The resin layer 150 may be formed of a transparent material having a thickness T2 greater than the thickness T1 of the light emitting device 100. The resin layer 150 may include a resin material such as silicone or epoxy. The resin layer 150 may include a thermosetting resin material, for example, PC, OPS, PMMA, PVC, etc. The resin layer 150 may be formed of glass, but is not limited thereto. For example, the main material of the resin layer 150 may be a resin material mainly made of urethane acrylate oligomer. For example, a synthetic oligomer, urethane acrylate oligomer, mixed with a polyacrylic polymer type can be used. Of course, it may further include monomers mixed with low boiling point diluted reactive monomers such as isobornyl acrylate (IBOA), hydroxylpropyl acrylate (HPA), and 2-hydroxyethyl acrylate (2-HEA), and as an additive, a photoinitiator (such as 1 -hydroxycyclohexyl phenyl-ketone, etc.) or antioxidants can be mixed.

The resin layer 150 may include beads (not shown), and the beads may diffuse and reflect incident light, thereby increasing the amount of light. The beads may be arranged in an amount ranging from 0.01 to 0.3% based on the weight of the resin layer 150.

Since the resin layer 150 is disposed on the light-emitting device 100, it can protect the light-emitting device 100 and reduce loss of light emitted from the light-emitting device 100. The resin layer 150 may cover the plurality of light emitting devices 100 and may contact the light emitting surface 101 of the light emitting devices 100. A portion of the resin layer 150 may be disposed in the hole 118 of the reflective film 110. A portion of the resin layer 150 may contact the upper surface of the substrate 201 through the hole 118 of the reflective film 110. Accordingly, a portion of the resin layer 150 is in contact with the substrate 201, thereby fixing the reflective film 110 between the resin layer 150 and the substrate 201. In an embodiment, in order to fix the reflective film 110, the hole 118 of the reflective film 110 may be provided with other holes in areas other than those where the light emitting device 100 is disposed. It is not limited.

The thickness T2 of the resin layer 150 may be greater than or equal to the thickness T1 of the light emitting device 100 or less than 20 mm. The thickness T2 of the resin layer 150 may range from, for example, 2 mm to 20 mm. If the thickness T1 of the resin layer 150 is greater than the above range, light efficiency may decrease, and if the thickness T1 of the resin layer 150 is greater than the above range, the light efficiency may decrease. Otherwise, light uniformity may deteriorate. As shown in FIG. 2, the resin layer 150 may be arranged so that the length (Y1) in the first axis direction (Y) is greater than the width (X1) in the second axis direction (X), and The length Y1 may vary depending on the number of light emitting devices 100. The width (X1) may be 50 mm or less, for example, in the range of 10 mm to 30 mm or 15 mm to 23 mm. If the width (X1) exceeds the above range, the area outside the beam angle of light increases, and light uniformity may deteriorate. You can.

The surface of the resin layer 150 may be coated with a metal material such as aluminum, chromium, or barium sulfate, but is not limited thereto. Here, the surface of the resin layer 150 may be a side other than the surface on which the light extraction structure 152 is formed, but is not limited thereto.

The resin layer 150 may include a light extraction structure 152 on its upper surface. The light extraction structure 152 is an optical pattern and can change the critical angle of incident light. The light extraction structure 152 may be formed integrally with the resin layer 150. The resin layer 150 and the light extraction structure 152 may be formed of the same material. The light extraction structure 152 may be formed in a pattern with a width that gradually narrows as it goes up in the upward direction (Z0). The light extraction structure 152 may include a pattern with a wide lower width and a narrow upper width. The light extraction structure 152 may have a side cross-section that is hemispherical, polygonal, or may include at least one or two of the following shapes: a polygonal pyramid, or a cone.

The light extraction structure 152 may be arranged in a prism-shaped pattern with a triangular side cross-section. The patterns may be arranged continuously in a triangular prism shape as shown in FIG. 3, or may be arranged with a predetermined gap B6 in the area 152A between the patterns as shown in FIG. 5. The pattern 154 may be formed in a polygonal pyramid shape, for example, or a hemispherical shape, as shown in FIG. 4 . The triangular prism pattern shown in FIG. 3 may have a long length in a direction perpendicular to the optical axis Y0 and may be arranged along the optical axis Y0. The longitudinal direction of the prism pattern may be perpendicular to the arrangement direction of the light emitting elements. The length of the prism pattern may be equal to or smaller than the length of the second axis direction (X) of the resin layer 150.

1 and 3, when the unit pattern of the light extraction structure 152 is, for example, a triangular prism pattern, the bottom width B2 and the height B1 may be the same or different from each other, and the bottom width of the pattern (B2) may be 0.2 mm or more, for example, in the range of 0.2 mm to 3 mm. If the bottom width (B2) of the pattern is smaller than the above range, the improvement in light extraction efficiency is minimal, and if it is larger than the above range, the light uniformity is poor. may deteriorate. The height (B1) of the pattern may be 0.2 mm or more, for example, in the range of 0.2 mm to 3 mm. If the height (B1) of the pattern is less than the above range, there is difficulty in forming the pattern, and the improvement in light extraction is minimal. , if it is greater than the above range, there is a problem in that the thickness T2 of the resin layer 150 increases. The spacing (B3) between the patterns is the spacing between the high points (P0) of the patterns, and may range from 0.2 mm or more, for example, 0.2 mm to 3 mm. If it is smaller than the above range, the improvement in light efficiency is minimal, and if it is larger than the above range, the improvement in light efficiency is minimal. In this case, light uniformity may deteriorate. Here, the spacing B3 between patterns of the light extraction structure 152 or the bottom width B2 of the patterns may be the same.

The light extraction structure 152 changes the critical angle of the light by both sides of the pattern, that is, the inclined side, when the light emitted from the light emitting device 100 or the light reflected by the reflective film 110 is incident. Given this, light can be extracted to the outside. The light emitted from the resin layer 150 by this light extraction structure 152 can be a surface light source.

As another example, the gap B3 between patterns of the light extraction structure 152 or the bottom width B2 of the pattern may gradually become narrower as the distance from the light emission surface 101 of each light emitting device 100 increases. there is. The light extraction structure 152 may be disposed in an area that overlaps the light emitting device 100 in the vertical direction. Accordingly, the resin layer 150 arranges the spacing (B3) or bottom width (B2) of the pattern differently depending on the amount of incident light, thereby improving the uniformity of light by the light extraction structure 152 in the entire area. By doing so, a surface light source can be provided.

Referring to FIG. 5 , when the patterns of the light extraction structure 152 are spaced apart from each other, the area 152A between the patterns may be spaced apart by 0.01 mm or more, for example, in the range of 0.01 mm to 3 mm. The width B6 of the area 152A between the patterns may be equal to or smaller than the pattern bottom width B2. The area 152A between these patterns may be a horizontal surface, an inclined surface, or a concave curved surface.

Referring to FIG. 6 , the light extraction structure 152 may have a curved surface where the high points (P0) of the patterns are convex. The light extraction structure 152 may have a curved surface where the low point P1 between the patterns is concave. Since the high points (P0) and low points (P1) of the patterns are arranged as curved surfaces, they can reflect or transmit incident light. Since the high points (P0) and low points (P1) of the patterns are arranged on a curved surface, light loss or damage to the pattern due to shape deformation during injection can be prevented. For the height, bottom width, and spacing of these patterns, refer to the descriptions of FIGS. 2 and 3.

As another example, the patterns of the light extraction structure 152 may be further disposed on the upper surface of the resin layer 150 and inside the resin layer 110. The light extraction structure 152 may be disposed on the top and inside of the resin layer 150, respectively. The light extraction structure disposed inside the resin layer 152 may be the structure of FIG. 1, may include a light extraction structure described later, or may be disposed on an inclined or concave area inside. In this case, the resin layer 150 may be provided in a multi-layer structure, and may have a first light extraction structure on the top surface of the lower layer and a second light extraction structure on the top surface of the upper layer.

As another example, the patterns of the light extraction structure 152 may be disposed on the upper and lower surfaces of the resin layer 150, respectively. The light extraction structure 152 is disposed on the lower surface of the resin layer 150, thereby changing the path of light traveling to the lower surface of the resin layer 150. In this case, the lower light extraction structure can function as a reflective film.

FIG. 9 is a side cross-sectional view of a lighting module according to a second embodiment, and FIG. 10 is a partially enlarged view of the light extraction structure of FIG. 9. In describing the second embodiment, the description disclosed above will be referred to for the same configuration as the configuration disclosed above.

Referring to FIGS. 9 and 10 , the lighting module 200A includes a substrate 201, a plurality of light emitting devices 100, a reflective film 110, and a resin layer 160.

The resin layer 160 may include a plurality of light-emitting cells 160A having a light extraction structure 162. Each of the light emitting cells 160A includes a first area C2 with a horizontal upper surface and a second area C2 with an inclined upper surface. The light emitting cells 160A of the resin layer 160 may be disposed on each light emitting device 100. The light-emitting cell 160A is disposed on the light emission side of each light-emitting device 100, and may be a unit area where light emitted from each light-emitting device 100 is emitted. Each of the light emitting cells 160A may be an area disposed on the light emission side of each light emitting device 100.

The first area C2 may overlap the light emitting device 100 in a vertical direction. The width of the first area C2 may be equal to or 1.5 times greater than the width A1 of the light emitting device 100. The first area C2 may be located higher than the rear surface of the light-emitting device 100, thereby protecting the rear surface of the light-emitting device 100. The second area C3 may extend further toward the light emission side than the light emission surface 101 of the light emitting device 100. The second area C3 is an inclined area and may be an area that overlaps the area between adjacent light emitting devices 100. The first area C2 may be disposed within 50% or less of the width C1 or period of the light emitting cell 160A, for example, in the range of 5% to 30%. The first area C2 may be arranged in a range of 1/9.5 to 1/7 of the size of the second area C3. The patterns of the light extraction structures 162 disposed on the first area C2 may have the same spacing and the same bottom width.

The second area C3 may be an area inclined with respect to the top surface of the substrate 201 or the top surface of the reflective film 110. The patterns of the light extraction structure 162 on the second region C3 may have the same shape or the distance between the patterns may be the same as they are adjacent to the substrate 201 or the reflective film 110 .

As shown in FIG. 10 , the light extraction structure 162 may include a pattern having a polygon or curved surface as disclosed in the embodiment. When the unit pattern of the light extraction structure 162 is, for example, a triangular prism pattern, the bottom width (B2) and the height (B1) may be the same or different from each other, and the bottom width (B2) of the pattern may be 0.2 mm or more, for example. , may range from 0.2 mm to 3 mm. If the bottom width (B2) of the pattern is smaller than the above range, the improvement in light extraction efficiency is minimal, and if it is larger than the above range, light uniformity may be reduced. The height (B1) of the pattern may be 0.2 mm or more, for example, in the range of 0.2 mm to 3 mm. If the height (B1) of the pattern is less than the above range, there is difficulty in forming the pattern, and the improvement in light extraction is minimal. , if it is greater than the above range, there is a problem in that the thickness of the resin layer 160 increases. The spacing (B3) between the patterns is the spacing between the high points (P0) of the patterns, and may range from 0.2 mm or more, for example, 0.2 mm to 3 mm. If it is smaller than the above range, the improvement in light efficiency is minimal, and if it is larger than the above range, the improvement in light efficiency is minimal. In this case, light uniformity may be reduced.

*In the unit pattern, both inclined sides include inclined first and second sides S1 and S2, and the first side S1 is more perpendicular to the light emitting device 100 than the second side S2. It may be a side adjacent to the axis (Z0). When the angle R4 of the second side S2 of the patterns is the same, the inclination angle R3 of the first side S1 may gradually decrease. As the light extraction structure 162 of the second region C3 is closer to the substrate 201 or the reflective film 110, the inner angle R1 of the pattern may gradually become smaller.

In the light extraction structure 162, the inner angle R1 of the pattern may gradually become narrower as it approaches the substrate 201 or the reflective film 110, and for example, may become smaller in proportion to the distance from the light emitting device 100. You can. When the angle R4 of the second side S2 of the pattern is the same angle, the angle R3 of the first side S1 may change depending on the distance. The angle R3 of the first side S1 is 60 degrees or less, for example, in the range of 50 to 60 degrees, assuming that the slope start point is distance 0, and decreases by more than 1 degree every time the distance increases by 1 mm. You can. The angle (R3) includes θ1 - (α×β), where θ1 is the angle when the distance is 0 and has a range of 50 degrees to 60 degrees, and the distance (α) is in the range from 0 to C3, The weight β is a weight of the angle increased per 1 mm, and may range from more than 1 to 1.1 or less, for example, 1.06 to 1.09. For example, if the weight (β) value is 1.08 and the angle R3 is 55 degrees at point 0, R3 at a position where the point is moved 10 mm can be obtained as 55-(10×1.08)=44.92.

The inclination angle (R4) of the second side (S2) of the pattern is an angle based on the horizontal straight line (L2) connecting the low points of the patterns, and may be smaller than R3. The angle R4 is an inclined angle of the second region C3 and may be disposed at 1 degree or more, for example, in the range of 1 degree to 50 degrees or in the range of 30 degrees to 50 degrees. Here, the second side S2 is disposed at an angle of 50 to 70 degrees with respect to the horizontal axis L1, thereby providing the second area C3 with an inclined structure. The above condition of R2>R4 can be satisfied.

The thickness T2 of the first region C2 in the resin layer 160 may range from 2 mm to 50 mm, for example, 2 mm to 10 mm. The thickness of the second area C3 may be smaller than the thickness T2 of the first area C2. The minimum thickness T3 of the resin layer 160 or the second region C3 may be equal to, smaller than, or greater than the thickness T1 of the light emitting device 100. The upper surface of the resin layer 160 or the low point P4 of the second region C3 may be disposed on the same line or lower than the optical axis Y0 of the light emitting device 100. The minimum thickness (T3) of the resin layer 160 may be 0.5 mm or more from the upper surface of the reflective film 110, for example, in the range of 0.5 mm to 5 mm. If it is thinner than this range, the connected portion may become weak. If it is thicker than the above range, it may cause light interference to other light emitting cells (150A). Additionally, since the second area C3 is provided as an inclined area, the light guiding distance along which light travels can be reduced.

The resin layer 150 may be disposed on the back of the light emitting device 100 in a boundary area C4 between light emitting cells 150A. The outer side surface 161 between the light emitting cells 150A may be a vertical surface or an inclined surface, and may connect adjacent light emitting cells 150A to each other. The boundary area C4 is disposed at a distance of 3 mm or less from the light emitting device 100, for example, in the range of 0.5 mm to 2 mm, and can protect the rear portion of the light emitting device 100.

FIG. 11 is a perspective view showing a lighting module according to a third embodiment, FIG. 12 is a partial enlarged view of the lighting module of FIG. 11, FIG. 13 shows the light extraction structure of the resin layer of FIG. 12, and FIG. 14 shows a light extraction structure of the resin layer of FIG. 12. This is a top view of the lighting module.

11 to 14, the lighting module 200B includes a substrate 201, a light emitting device 100, a resin layer 170, and a reflective film 110. The light emitting cells 170A of the resin layer 170 may be disposed on each light emitting device 100, respectively. The light-emitting cell 170A is disposed on the light emission side of each light-emitting device 100 and may be an area where light emitted from each light-emitting device 100 is emitted.

The resin layer 170 includes an inclined area, and the inclined area may be formed as the entire upper surface of the resin layer 170. The maximum thickness T2 of the resin layer 170 may be 50 mm or less, for example, in the range of 2 mm to 10 mm. By providing the resin layer 170 in an inclined area, the light guiding distance along which light travels can be reduced.

The region with the thickest thickness T2 of the resin layer 170 may extend outward, for example, in the rear direction, beyond the rear surface of the light-emitting element 100, thereby protecting the rear surface of the light-emitting element 100. . Among the resin layer 170, the area with the thinnest thickness T3 may be an area adjacent to another light emitting device 100. The minimum thickness T3 of the resin layer 170 may be the same as or smaller than the thickness of the light emitting device 100. The low point P4 on the upper surface of the resin layer 170 may be disposed on the same line as the optical axis Y0 of the light emitting device 100 or may be disposed low. The minimum thickness (T3) of the resin layer 170 may be 0.5 mm or more from the upper surface of the reflective film 110, for example, in the range of 0.5 mm to 5 mm. If it is thinner than the above range, problems may occur in the connected portion. If it is thicker than the above range, it may cause light interference to other light-emitting cells.

The side surfaces 171A and 171B of the resin layer 170, excluding the top surface, may be inclined or vertical, and the light extraction structure 172 may not be formed. These side surfaces of the resin layer 170 can prevent light from leaking. The side surface 171 disposed at the boundary area between the light emitting cells 170A of the resin layer 170 may be a vertical surface or an inclined surface.

The pattern of the light extraction structure 172 may be disposed along an area inclined with respect to the top surface of the substrate 201 or the top surface of the reflective film 110 . The light extraction structure 172 may have the same shape or the spacing between the patterns may be the same or different as the patterns are adjacent to the substrate 201 or the reflective film 110.

For the light extraction structure 172 of the resin layer 170, refer to the description of the patterns disclosed in the embodiment. As shown in FIG. 13, when the unit pattern of the light extraction structure 172 is, for example, a triangular prism pattern, the bottom width (B2) and the height (B1) may be the same or different from each other, and the bottom width (B2) of the pattern May be 0.2 mm or more, for example, in the range of 0.2 mm to 3 mm. If the bottom width (B2) of the pattern is smaller than the above range, the improvement in light extraction efficiency is minimal, and if it is larger than the above range, light uniformity may be reduced. there is. The height (B1) of the pattern may be 0.2 mm or more, for example, in the range of 0.2 mm to 3 mm. If the height (B1) of the pattern is less than the above range, there is difficulty in forming the pattern, and the improvement in light extraction is minimal. , if it is greater than the above range, there is a problem in that the thickness of the resin layer 170 increases. The spacing (B3) between the patterns is the spacing between the high points of the patterns, and may range from 0.2 mm or more, for example, 0.2 mm to 3 mm. If it is smaller than the above range, the improvement in light efficiency is minimal, and if it is larger than the above range, the light uniformity can deteriorate.

As the light extraction structure 172 approaches the substrate 201 or the reflective film 110, the inner angle R1 of the pattern may gradually become narrower. For example, when the angle R4 of the second side S1 of the pattern is the same, the inclination angle R3 of the first side S1 may gradually decrease. Accordingly, the inner angle R1 of the pattern may gradually become smaller as it approaches the substrate 201 or the reflective film 110. For example, it may become smaller in proportion to the distance from the light emitting device 100. The angle R4 of the second side S2 of the pattern is the same, and the angle R3 of the first side S1 may change depending on the distance. The angle R3 of the first side is 60 degrees or less, for example, in the range of 50 to 60 degrees, assuming the inclination start point is distance 0, and may decrease by more than 1 degree every time the distance increases by 1 mm. The R3 includes θ1 - (α×β), where θ1 is the angle when the distance is 0 and ranges from 50 degrees to 60 degrees, the distance α is in the range from 0 to C3, and the weight β is 1 mm. The weight of the angle increased per angle may range from 1 to 1.1, for example, 1.06 to 1.09. For example, if the weight β value is 1.08 and the angle R3 is 55 degrees at point 0, R3 at a position where the point is moved 10 mm can be obtained as 55-(10×1.08)=44.92. In this case, compared to the second embodiment, if the starting angle, that is, the angle at the point where the distance is 0, is lowered, the inclination angle of the entire upper surface is lowered, or the maximum thickness of the resin layer 170 is low, the angle (R3 ) may vary.

In FIG. 13, the inclination angle R4 of the second side S2 of the pattern is an angle based on the horizontal straight line L2 connecting the low points of the patterns, and may be smaller than R3. The angle R5 is an inclined angle of the upper surface of the resin layer 170 and may be disposed at 1 degree or more, for example, in the range of 1 degree to 10 degrees or in the range of 6 degrees to 10 degrees.

The pattern of the light extraction structure 172 of the resin layer 170 may include at least one of the high and low points being an angled surface or a curved surface, and may be selected from, for example, shapes such as those shown in FIGS. 3, 4, and 6. As another example, the patterns of the light extraction structure 172 may be spaced apart without contacting each other, as shown in FIG. 5, and the spaced areas may be inclined or curved surfaces. Alternatively, the patterns of the light extraction structure 172A of FIG. 15 may have at least one or both of the high point (P0) and the low point (P1) having a curved surface and may be arranged along an inclined area. Here, the widths (E3, E4) of both sides based on the high point (P0) can satisfy the condition of E4>E3 as they are farther from the light emitting surface of the light emitting device. The condition E4>E3 can be applied to the pattern of FIG. 13, and as the distance from the light emitting device increases, E4 can gradually become larger than E3.

The high point of the pattern of the light extraction structure 172 according to the embodiment may have a gradually lower height as it moves away from the light emission surface 101 of the light emitting device 100.

Here, the spacing between the light emitting devices 100 disposed in the resin layer 170 may be 100 mm or less, for example, in the range of 5 mm to 100 mm. If it is smaller than the above range, the distance between the lights emitted from different light emitting devices 100 may be Interference may occur, and if it is larger than the above range, it is difficult to secure light quantity or light uniformity.

The resin layer 170 may have a light extraction structure 172 on the substrate 201 or the reflective film 110 and may be disposed with a thickness that gradually becomes thinner as it moves away from the light emitting device 100. Light emitted from the reflective film 110 or the light emitting device 100 may be emitted upward. The light extraction structure 172 is disposed closer to the optical axis Y0 as the distance from the light emitting device 100 increases, thereby reducing the difference in the amount of light incident on the light extraction structure 172. Accordingly, the uniformity of light extracted through the light extraction structure 172 can be improved. Here, FIG. 30 shows the luminous intensity on the individual light emitting device 100 in FIG. 11, and the luminous intensity shows a cantella (cd) of 50 or more. Figure 31 shows the light uniformity measured according to Figure 11, (A) is the light uniformity in the plane (H-V), (B) (C) represents the light uniformity viewed from the left and right at 30 degrees based on the plane, there is. In an embodiment, as shown in FIG. 31, a surface light source of a certain width or more can be provided with the above-described luminous intensity and in a uniform distribution, thereby providing luminous intensity within the safety standard range of the vehicle.

Figures 16 to 18 are modified examples of the lighting module of Figure 11.

As shown in FIG. 16 , the low point of the light extraction structure 172 of the resin layer 170 is disposed lower than the optical axis Y0 of the light emitting device 100 and is spaced apart from the upper surface of the reflective film 110. The minimum thickness (T3) of the resin layer 170 is smaller than the thickness (T1) of the light emitting device 100. In this case, light leaks through the thinnest area of the resin layer 170 and proceeds to another light emitting cell. can be suppressed from doing so.

As shown in FIG. 17 , the resin layer 170 may be in contact with the low-point reflective film 110 on the upper surface. By contacting the upper surface low point of the resin layer 170 with the reflective film 110, light interference between the light emitting cells 170A can be reduced. Here, the low point P4 on the upper surface of the resin layer 170 may be formed long in the width of the second axis direction (X) as shown in FIG. 14, or may be formed only in the center area. The resin layer 170 is disposed with an inclined side surface 171 between adjacent light emitting cells 170A, so that injection molding can be easily separated.

As shown in FIG. 18, the resin layer 170 may be connected to the light extraction structure 172 with a concave curved surface at the low point P4 connected to the side surface 171 between adjacent light emitting cells 170A, and a curved surface with a high point to extract light. Can be connected to extraction structure 172. This resin layer 170 can be easily separated during injection molding, and the low point P4 of the concave curved surface effectively blocks light traveling in the direction of the optical axis Y0, preventing optical interference from occurring in other light-emitting cells. can be prevented.

Figure 19 is a perspective view showing a lighting module according to a fourth embodiment, and Figure 20 is a partial cross-sectional view of the lighting module of Figure 19.

19 and 20, the lighting module includes a substrate 201, a plurality of light-emitting devices 100, a reflective film 110 on the substrate 201, the substrate 201, and a light-emitting device 100. It includes a resin layer 180 having a light extraction structure 182 thereon.

The light emitting device 100 may be arranged along the second axis direction (Y) of the substrate 201. The light emitting device 100 may be arranged along at least one edge of the substrate 201, for example, along an edge in the longitudinal direction of the substrate 201.

The light emitting device 100 may be arranged along a thicker region of the resin layer 180. The thickness of the resin layer 180 may be thick in the area where the light-emitting device 100 is disposed, and may become thinner as the distance from the light-emitting device 100 increases. The patterns of the light extraction structures 182 of the resin layer 180 may be alternately arranged in the direction of the optical axis Y0 and arranged in a length perpendicular to the optical axis Y0. The length of each pattern may be the same as the length (Y2) of the resin layer 180. The longitudinal direction of the prism pattern may be the same as the arrangement direction of the light emitting elements. The prism patterns may be arranged in a direction perpendicular to the arrangement direction of the light emitting elements.

The length (X2) of the resin layer 170 in the first axis direction may be smaller than the length (Y2) in the second axis direction, for example, 1/2 or less. The spacing B5 between the light emitting devices 100 may be 100 mm or less, for example, in the range of 1 mm to 30 mm or 15 mm to 25 mm. If the spacing B5 between the light emitting devices 100 is smaller than the above range, the number of light emitting devices 100 may be increased, and if it is larger than the above range, a dark portion may be generated.

As another example, the light-emitting device 100 may be arranged in a zigzag manner on the substrate 201, and the thickness of the resin layer 170 is thick in the area where the light-emitting device 100 is disposed, and the light-emitting device ( The further away you are from 100), the thinner it can be. Each light emitting cell 170A of the resin layer 170 is an area disposed on each light emitting device 100, and may be disposed with a width of 100 mm or less, for example, in the range of 1 mm to 30 mm or 15 mm to 25 mm. . Although the thickness of the resin layer 170 according to the embodiment has been described as having a gradually thinner structure, the structure of the resin layer 170 according to the first and second embodiments may also be included.

Figure 21 is a diagram showing a light-emitting cell in a lighting module according to an embodiment.

Referring to FIG. 21, the lighting module arranges the light emitting element 100 in the corner area when the light emitting cell of the resin layer 190 has a polygonal shape, and the light extraction structure 192 of the resin layer 190 has patterns. It may be arranged in a direction perpendicular to the optical axis Y0 of the light emitting device 100. For detailed configuration of this pattern, refer to the description of the embodiment disclosed above.

The resin layers (150, 160, 170, 180, 190) according to the embodiment have a straight bar shape with a predetermined width, a curved bar shape with a predetermined curvature, a bent bar shape bent more than once, or two of the straight, curved, and bent shapes. It may be a mixture of more than one. This shape may vary depending on the type or structure of vehicle lamps such as head lamps, side lights, side mirror lights, fog lights, tail lamps, stop lamps, side lights, and daytime running lights. . Alternatively, it may be applied to other display devices or lighting devices such as indoor lights and outdoor lights.

23 and 24 are diagrams showing a lighting device having a lighting module according to an embodiment. For the lighting module in the lighting device according to the embodiment, refer to the above description. The lighting module 200B includes the module disclosed in the embodiment, for example, a substrate 201, a plurality of light emitting elements 100 on the substrate 201, and a resin layer 170 and a reflective film 110. has

An optical member 230 may be disposed on the lighting module 200B, and the optical member 230 may diffuse and transmit incident light. The optical member 230 uniformly diffuses and emits the surface light source emitted through the resin layer 170. The optical member 230 may include an optical lens or an inner lens, and the optical lens may converge light in a target direction or change the path of light. The optical member 230 includes a plurality of lens units 231 on at least one of the upper and lower surfaces, and the lens units 231 have a shape that protrudes downward from the optical member 230 or extends upward. It may be a protruding shape. This optical member 230 can adjust the light distribution characteristics of the lighting device.

The optical member 230 may include a material with a refractive index of 2.0 or less, for example, 1.7 or less. The optical member 230 may be made of a transparent resin material such as acrylic, polymethyl methacrylate (PMMA), polycarbonate (PC), or epoxy resin (EP) or transparent glass.

The optical member 230 may have a distance from the lighting module 200B, for example, the substrate 201, in the range of 10 mm or more, for example, 15 mm to 100 mm, and if the spacing is outside the range, the luminous intensity may be reduced. , if it is smaller than the above range, the uniformity of light may be reduced.

The lighting module 200 may include a heat dissipation plate (not shown) on its bottom surface. The heat dissipation plate may be provided with a plurality of heat dissipation fins and may dissipate heat conducted to the substrate 201. The heat dissipation plate may include at least one metal such as aluminum, copper, magnesium, and nickel, or an optional alloy thereof.

The lighting device includes a housing 300 having a storage space 305, a lighting module according to an embodiment disposed on the bottom of the storage space of the housing 300, and an optical member 230 disposed on the lighting module. Includes.

The housing 300 may be provided with an outer side 303 of the storage space 305 that is inclined with respect to the bottom surface of the housing 300, and this inclined surface improves light extraction efficiency. I can give it. The surface of the storage space 305 of the housing 300 may be formed of a reflective metal material, and light extraction efficiency within the storage space 305 may be improved by this metal material. The depth of the storage space 305 may be greater than the high point of the resin layer 170, and light emitted through the resin layer 170 may be emitted.

The housing 300 includes a bottom 301 and a reflection part 302, where the bottom 301 is disposed below the substrate 201, and the reflection part 302 is located below the bottom 301. It protrudes upward from the outer circumference of and may be disposed around the resin layer 170. The housing 300 may include a metal or plastic material, but is not limited thereto.

A hole (not shown) through which a cable connected to the substrate 201 passes may be formed in the bottom 301 or the reflection part 302 of the housing 300, but the present invention is not limited thereto. The substrate 201 may be attached to the bottom 301 of the housing 300 using a fastening means such as a screw or an adhesive member, or may be coupled to the bottom 301 of the housing 300 using a hook-like structure. Accordingly, the substrate 201 can be fixed to the bottom of the housing 300.

Lighting devices according to embodiments include various vehicle lighting devices and display devices such as head lamps, side lights, side mirror lights, fog lights, tail lights, stop lights, side lights, and daytime running lights. , can be applied to traffic lights.

FIG. 24 is a plan view showing a light-emitting device according to an embodiment, FIG. 25 is a cross-sectional view along the A-A side of the light-emitting device of FIG. 24, FIG. 26 is a front view of the light-emitting device of FIG. 24 arranged, and FIG. 27 is a light-emitting device of FIG. 26. The other side is shaving.

24 and 25, the light emitting device 100 includes a body 10 having a cavity 20, a plurality of lead frames 30 and 40 within the cavity 20, and a plurality of lead frames 30. , 40) and includes a light emitting chip 101 disposed on at least one of the above. This light emitting device 100 may be implemented as a side emitting type package.

The length D1 of the light emitting device 100 in the second axis (X) direction may be three or more times, for example, four or more times the thickness T1 in the first axis (Y) direction. The length D1 in the second axis (X) direction may be 2.5 mm or more, for example, in the range of 2.7 mm to 4.5 mm. The light emitting device 100 provides a long length D1 in the second axis (X) direction, so that when the light emitting devices 100 are arranged in the second axis (X) direction, the light emitting device package 100 The number can be reduced. The light emitting device 100 can provide a relatively thin thickness T1, thereby reducing the thickness of the lighting module including the light emitting device 100. The thickness T1 of the light emitting device 100 may be 2 mm or less.

The length D1 of the light emitting device 100 in the second axis (X) direction may be greater than the length D2 of the body 10, and the thickness T1 may be the thickness of the body 10, for example, It may be the same as the thickness in the second axis direction of (10). The length D2 of the body 10 may be three times or more than the thickness of the body 10.

As shown in Figure 25, the body 10 includes a first body 10A having a cavity 20 with lead frames 30 and 40 exposed at the bottom, and a second body supporting the first body 10A ( 10B). The first body 10A may be an upper body or a front body, and the second body 10B may be a lower body or a rear body. The first body 10A may be in the front area based on the lead frames 30 and 40, and the second body 10B may be in the rear area based on the lead frames 30 and 40. The first and second bodies 10A and 10B may be formed as one body. A plurality of lead frames 30 and 40, for example, a first lead frame 30 and a second lead frame 40, are coupled to the body 10.

The body 10 may be formed of an insulating material. The body 10 may be formed of a reflective material. The body 10 may be formed of a material having a reflectance higher than the transmittance for the wavelength emitted from the light emitting chip, for example, a material having a reflectance of 70% or more. If the body 10 has a reflectivity of 70% or more, it may be defined as a non-transmissive material or a reflective material. The body 10 may be made of a resin-based insulating material, such as polyphthalamide (PPA). The body 10 may be made of a silicone-based, epoxy-based, thermosetting resin containing a plastic material, or a high heat resistance and high light resistance material. The body 10 includes white resin. In the body 10, acid anhydrides, antioxidants, release materials, light reflectors, inorganic fillers, curing catalysts, light stabilizers, lubricants, and titanium dioxide may be selectively added. It contains. The body 10 may be molded from at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylic resin, and urethane resin. For example, epoxy resins made of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and acids made of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc. The anhydride was added to the epoxy resin with DBU (1,8-Diazabicyclo(5,4,0)undecene-7) as a curing accelerator, ethylene glycol, titanium oxide pigment, and glass fiber as cocatalysts, and partially heated. A solid epoxy resin composition that has been B-staged through a curing reaction can be used, but is not limited thereto. The body 10 may be formed by appropriately mixing a thermosetting resin with at least one selected from the group consisting of a diffusion agent, pigment, fluorescent material, reflective material, light-shielding material, light stabilizer, and lubricant.

The body 10 may include a reflective material, such as a resin material to which metal oxide is added, and the metal oxide may include at least one of TiO ₂ , SiO ₂ , and Al ₂ O ₃ . This body 10 can effectively reflect incident light. As another example, the body 10 may be formed of a light-transmitting resin material or a resin material having a phosphor that converts the wavelength of incident light.

Looking at the side surfaces of the body 10, the first side portion 11 and the second side portion 12 on the opposite side of the first side portion 11 are adjacent to the first and second side portions 11 and 12 and are on opposite sides of each other. It may include disposed third and fourth side portions 13 and 14. The first and second side parts 11 and 12 may correspond to each other in the first axis (Y) direction, and the third and fourth side parts 13 and 14 may correspond to each other in the second axis (X) direction. . The first side portion 11 may be the bottom of the body 10, the second side portion 12 may be the top surface of the body 10, and the first and second side portions 11 and 12 may be the body ( It may be a long side having a length D2 of 10), and the third and fourth side portions 13 and 14 may be a short side having a thickness thinner than the thickness T1 of the body 10. The first side portion 11 of the body 10 may be a side corresponding to the substrate 201.

The body 10 may have a front portion 15 and a rear portion 16, and the front portion 15 and the rear portion 16 may be surfaces on which the cavity 20 is disposed, from which light is emitted. It could be cotton. The rear portion may be the opposite side of the front portion (15). The rear portion 16 includes a first rear portion 16A and a second rear portion 16B, and may include a gate portion 16C between the first rear portion 16A and the second rear portion 16B. You can. The gate portion 16C may be recessed between the first and second rear portions 16A and 16B in the cavity direction rather than the first and second rear portions 16A and 16B.

The first lead frame 30 includes a first lead portion 31 disposed at the bottom of the cavity 20 and a first outer region 11A, 11C of the first side portion 11 of the body 10. It includes a first bonding portion 32 disposed, and a first heat dissipation portion 33 disposed on the third side portion 13 of the body 10. The first bonding portion 32 is bent from the first lead portion 31 within the body 10 and protrudes toward the first side portion 11, and the first heat dissipation portion 33 is the first heat dissipation portion 33. It can be bent from the bonding portion 32. The first outer regions 11A and 11C of the first side portion 11 may be adjacent to the third side portion 13 of the body 10.

The second lead frame 40 includes a second lead portion 41 disposed at the bottom of the cavity 20 and a second outer region 11B, 11D of the first side portion 11 of the body 10. It includes a second bonding portion 42 disposed, and a second heat dissipation portion 43 disposed on the fourth side portion 14 of the body 10. The second bonding portion 42 may be bent from the second lead portion 41 within the body 10, and the second heat dissipation portion 43 may be bent from the second bonding portion 42. . The second outer regions 11B and 11D of the first side portion 11 may be adjacent to the fourth side portion 14 of the body 10.

The gap portion 17 between the first and second lead portions 31 and 41 may be formed of the material of the body 10, and may be on the same horizontal surface as the bottom of the cavity 20 or may protrude, There is no limitation to this. The first outer areas (11A, 11C) and the second outer areas (11B, 11D) may have inclined areas (11A, 11B) and flat areas (11C, 11D), and the inclined areas (11A, 11B) ), the first and second bonding portions 32 and 42 of the first and second lead frames 30 and 40 may protrude, but are not limited thereto.

Here, the light emitting chip 71 may be placed, for example, on the first lead portion 31 of the first lead frame 30, and the wires 72 and 73 may be connected to the first and second lead portions 31 and 41. ), or it can be connected to the first lead part 31 with an adhesive and to the second lead part 41 with a wire. This light emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light emitting chip 71 may be mounted using a flip chip method. The light emitting chip 71 can selectively emit light within a wavelength range of ultraviolet rays to visible rays. The light emitting chip 71 may emit, for example, ultraviolet rays or blue peak wavelengths. The light emitting chip 71 may include at least one of a group II-VI compound and a group III-V compound. For example, the light emitting chip 71 may be formed of a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof.

Looking at the inner side of the cavity 20, the first, second, third, and fourth inner surfaces 21, 22, 23, and 24 disposed around the cavity 20 are the upper surfaces of the lead frames 30 and 40. can be inclined to a horizontal straight line. The first inner side 21 adjacent to the first side portion 11 and the second inner side 22 adjacent to the second side portion 12 are inclined at an angle with respect to the bottom of the cavity 20, and The third inner side 23 adjacent to the third side portion 13 and the fourth inner side 14 adjacent to the fourth side portion 14 are inclined, and the inclination angle of the first and second inner sides 21 and 22 is It can be inclined at a smaller angle. Accordingly, the first and second inner sides 21 and 22 reflect the incident light traveling in the first axis direction, and the third and fourth inner sides 23 and 24 reflect the incident light along the second axis. It can be spread in the (X) direction.

The inner side surfaces 21, 22, 23, and 24 of the cavity 20 may have a vertically stepped area 25 from the front portion 15 of the body 10. The stepped area 25 may be arranged in a stepped manner between the front part 15 and the inner surface 21, 22, 23, and 24 of the body 10. The stepped area 25 can control the directivity characteristics of light emitted through the cavity 20.

As shown in FIG. 25, the depth H2 of the cavity 20 may be less than 1/3 of the width H1 of the body 10, for example, in the range of 0.3 mm ± 0.05 mm. If the depth H2 of the cavity 20 is less than the above range, it is difficult to control the beam angle of light, and if it exceeds the range, there is a problem in that the width H1 of the body 10 increases or the light beam angle narrows.

Here, the width H1 of the body 10 may be the gap between the front part 15 and the rear part 16 of the body 10. Here, the width (H2) of the body 10 may be greater than the thickness (T1) of the body 10, and the difference between the width (H2) and the thickness (T1) of the body 10 is 0.05 mm or more, for example. , may range from 0.05 mm to 0.5 mm, and if the thickness T1 of the body 10 is relatively thick, the thickness of the light unit can be increased, and if it is thin, the heat dissipation area of the lead frames 30 and 40 is can be reduced.

The third and fourth side portions 13 and 14 of the body 10 may have inward recessed portions 35 and 45, and the recessed portions 35 and 45 are used during the injection process of the body 10. Fingers supporting the body 10 may be inserted. The concave portions 35 and 45 may be disposed on an extension line in which the first and second lead portions 31 and 41 of the first and second lead frames 30 and 40 extend horizontally. The concave portions 35 and 45 may be arranged to be spaced apart from the first and second lead portions 31 and 41. The depth of the concave portions 35 and 45 may be formed to a depth such that a portion of the concave portions 35 and 45 may overlap the cavity 20, for example, a portion of the cavity 20 in the vertical direction. There is no limitation to this.

Looking at the rear storage areas of the third and fourth side parts 13 and 14 of the body 10, first areas 13A and 14A are inclined from the third side parts 13 and fourth side parts 14, It includes second areas 13B and 14B inclined from the first areas 13A and 14A.

The light emitting chip 101 disposed in the cavity 20 of the light emitting device 100 according to the embodiment may be disposed one or more. The light emitting chip 101 may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, or a yellow green LED chip.

A molding member 81 is disposed in the cavity 20 of the body 11. The molding member 81 includes a light-transmitting resin such as silicone or epoxy, and may be formed as a single layer or multiple layers. A phosphor may be included on the molding member 81 or the light emitting chip 71 to change the wavelength of the light emitted, and the phosphor excites a part of the light emitted from the light emitting chip 71 to change the wavelength of light to a different wavelength. It is emitted as light. The phosphor can be selectively formed from quantum dots, YAG, TAG, silicate, nitride, and oxy-nitride-based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding member 61 may be formed in a flat shape, a concave shape, a convex shape, etc., but is not limited thereto. As another example, a translucent film 110 containing a phosphor may be disposed on the cavity 20, but the present invention is not limited thereto.

A lens may be further formed on the upper part of the body 10, and the lens may include a concave and/or convex lens structure, and may adjust the light distribution of the light emitted by the light emitting device 100. You can.

Semiconductor elements such as light receiving elements and protection elements may be mounted on the body 10 or any lead frame, and the protection elements may be implemented as thyristors, Zener diodes, or transient voltage suppression (TVS), The Zener diode protects the light emitting chip from electro static discharge (ESD).

Referring to FIGS. 26 and 27 , at least one or a plurality of light emitting devices 100 are disposed on a substrate 201, and a reflective film 110 is disposed around the lower portion of the light emitting devices 100. The board 201 includes a board with a circuit pattern printed on an insulating layer, for example, a resin-based printed circuit board (PCB), a metal core PCB, or a flexible board. It may include PCB, ceramic PCB, and FR-4 board.

The first and second lead portions 33 and 43 of the light emitting device 100 are bonded to the electrode patterns 213 and 215 of the substrate 201 using solder or conductive tape, which are conductive adhesive members 203 and 205.

Figures 27 and 28 are diagrams showing vehicle lamps.

27 and 28, in the vehicle 900, the tail light 800 includes a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. can do. Here, the first lamp unit 812 may be a light source to serve as a turn signal, the second lamp unit 814 may be a light source to serve as a sidelight, and the third lamp unit 816 may serve as a brake light. It may be a light source for, but is not limited to, this.

The housing 810 accommodates the first to third lamp units 812, 814, and 816, and may be made of a light-transmitting material. At this time, the housing 810 may have a curve depending on the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may implement a surface light source that may have a curved surface depending on the shape of the housing 810. You can. As shown in Figure 28, when the lamp unit is applied to the vehicle's tail light, brake light, or turn signal lamp, it can be applied to the vehicle's turn signal lamp.

Here, in terms of safety standards for vehicle lamps, when measured based on front light, the light distribution standard for tail lights is in the range of 4 to 5 cantella (cd), and the light distribution standard for brake lights is in the range of 60 to 80 cantella (cd). It's a range. As shown in FIGS. 30 and 31, the lighting module according to the embodiment distributes light with a luminous intensity of 50 or more cantella, and thus can provide a luminous intensity within the vehicle safety standards for lamps such as the brake light or tail light.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the above description has been made focusing on the examples, this is only an example and does not limit the present invention, and those skilled in the art will understand the above examples without departing from the essential characteristics of the present embodiment. You will be able to see that various modifications and applications are possible. For example, each component specifically shown in the examples can be modified and implemented. And these variations and differences in application should be construed as being included in the scope of the present invention as defined in the appended claims.

110: reflective film
150,160,170,180,190: Resin layer
152,162,172,182,192: Light extraction structure
201: substrate
230: Optical member
300: housing

Claims (11)

A substrate having a long length in a first direction;
a plurality of light emitting devices disposed on the substrate;
a resin layer disposed on the substrate and sealing the plurality of light emitting devices; and
It includes a reflective film disposed between the substrate and the resin layer,
The reflective film includes a plurality of holes into which lower portions of each of the plurality of light emitting devices are respectively inserted,
The resin layer includes a plurality of first regions having a first thickness, and a plurality of second regions having a thickness lower than the upper surface of the plurality of first regions and less than the first thickness,
Each of the plurality of holes of the reflective film overlaps the plurality of first regions in a vertical direction,
The lighting module wherein the vertical direction is a direction from the lower surface of the substrate to the upper surface of the resin layer. According to claim 1,
The plurality of light emitting elements are arranged in a first direction,
Each of the plurality of light emitting devices overlaps the plurality of first regions in the vertical direction,
The lighting module, wherein the plurality of holes are arranged in the first direction. According to clause 2,
Each of the plurality of light emitting devices emits light of highest intensity in the first direction,
A lighting module, wherein each of the plurality of first regions has a larger vertical overlap area with each hole than a vertical overlap area with each light emitting element. According to any one of claims 1 to 3,
At least one of the plurality of second regions is disposed between adjacent first regions, and has regions where the second thicknesses are different from each other toward the first direction of the resin layer. According to clause 4,
The lighting module wherein the second thickness of the plurality of second regions gradually becomes thinner toward the first direction of the resin layer. According to any one of claims 1 to 3,
A first thickness of each of the plurality of first regions is greater than the thickness of the light emitting device,
A lighting module wherein the width of each of the plurality of first areas in the first direction is 1.5 times or more than the width of each light emitting element in the first direction. According to clause 6,
Each of the plurality of first regions has the same thickness within the width in the first direction. According to any one of claims 1 to 3,
The first region of the resin layer includes a pattern disposed on the upper surface of the resin layer. According to any one of claims 1 to 3,
The second region of the resin layer includes a pattern having a light extraction structure disposed on the upper surface of the resin layer. According to any one of claims 1 to 3,
A lighting module wherein the minimum thickness of the resin layer is disposed in the range of 0.5mm to 5mm from the upper surface of the reflective film. According to any one of claims 1 to 3,
A lighting module wherein the distance between a light emitting element adjacent to one side of the resin layer and one side of the resin layer is in the range of 0.5 mm to 2 mm.