KR20200118733A - Lighting module and lighting device - Google Patents

Abstract

Provided are a lighting module capable of reducing light loss in an area between a light source and a light guide member, and a lighting device having the same. The lighting device disclosed in an embodiment of the present invention comprises: a support member; a light source disposed on the support member; a resin member covering the light source; a light guide member spaced apart from the light source; and an adhesive member bonded between the light guide member and the resin member, wherein the thickness of the light guide member is smaller than the thickness of the light source, the light source includes an exit surface corresponding to an incident surface of the light guide member, and the resin member and the adhesive member can include a transparent material.

Description

Lighting module and lighting device equipped with it {LIGHTING MODULE AND LIGHTING DEVICE}

An embodiment of the invention relates to a lighting device having a light source and a light guide member.

Embodiments of the invention relate to a light unit, a display device, or a vehicle lamp having a lighting module.

Typical lighting applications include vehicle lights as well as backlights for displays and signs.

Light-emitting diodes (LEDs), for example, have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Such light sources are applied to various display devices, various lighting devices such as indoor or outdoor lights.

Recently, as a vehicle light source, a lamp employing a light emitting device has been proposed. Compared with an incandescent lamp, the light emitting device is advantageous in that power consumption is small. However, since the emission angle of light emitted from the light emitting device is small, there is a need to increase the light emitting area of the lamp using the light emitting device.

Since the light emitting device is small, it can increase the design freedom of the lamp, and it is economical due to its semi-permanent life.

An embodiment of the invention can provide a lighting module capable of reducing light loss in a region between a light source and a light guide member, and a lighting device having the same.

An embodiment of the invention can provide a lighting module in which a transparent adhesive member is disposed between a light source and a light guide member, and a lighting device having the same.

An embodiment of the present invention may provide a lighting module having a light-transmitting resin member between a light source and a light guide member, and a lighting device having the same.

An embodiment of the invention can provide a lighting module in which a transparent resin member and an adhesive member are disposed between a light source and a light guide member, and a lighting device having the same.

An embodiment of the present invention may provide a lighting module in which a reflective member is disposed on a surface of a light-transmitting member disposed between a light source and a light guide member, and a lighting device having the same.

An embodiment of the present invention can provide a lighting module in which a member that minimizes a difference in refractive index between an emission surface of a light source and an incident surface of a light guide member that emits light in a direction of an incident surface of the light guide member, and a lighting device having the same.

An embodiment of the present invention may provide a light unit having a lighting module, a display device, and a vehicle lamp.

A lighting device according to an embodiment of the present invention includes a support member; A light source disposed on the intellectual material member; A resin member covering the light source; A light guide member spaced apart from the light source; And an adhesive member bonded between the light guide member and the resin member, wherein a thickness of the light guide member is smaller than a thickness of the light source, and the light source includes an exit surface corresponding to an incident surface of the light guide member, The resin member and the adhesive member may include a transparent material.

A lighting device according to an embodiment of the present invention includes a support member; A light source disposed on the support member; And a light guide member spaced apart from the light source, wherein a thickness of the light guide member is less than a thickness of the light source, the light source includes an exit surface corresponding to an incident surface of the light guide member, and a part of the resin member It is in contact with the exit surface of the light source and the incident surface of the light guide member, and the resin member may include a transparent material.

According to an embodiment of the present invention, the light guide member is disposed on the support member, and an upper portion of the support member may include a reflective layer or a protective layer made of a reflective material.

According to an embodiment of the present invention, the support member includes a substrate electrically connected to the light source, and the resin member is disposed on the substrate, and the support portion overlaps the light guide member in a vertical direction, and the support portion and the light guide member It may include a reflective layer between.

According to an embodiment of the present invention, a reflective member is included on an upper surface of the resin member, and the reflective member may extend onto the light guide member.

According to an embodiment of the present invention, an adhesive member disposed on an upper portion adjacent to the incident surface of the light guide member and in contact with the inner surface of the resin member, and a reflective member on the adhesive member may be included.

According to an embodiment of the present invention, at least one of an adhesive layer and a reflective member may be included in a lower portion adjacent to the incident surface of the light guide member.

According to an embodiment of the invention, a part of the resin member may extend above the light guide member.

According to an embodiment of the present invention, the resin member may include a reflective surface having a convex upper surface between the light guide member and the light source.

According to an embodiment of the present invention, the light source is a side type package that is bonded on the support member and emits light in the direction of the light guide member, and a plurality of the light sources may be arranged on the incident surface of the light guide member.

According to an embodiment of the invention, the light guide member may be of the same material as the resin member.

According to an embodiment of the present invention, light loss may be reduced by removing an air gap between the light source and the light guide member.

According to an embodiment of the present invention, by disposing at least one of a resin member and an adhesive member between the light source and the light guide member, it is possible to reduce the loss of light incident on the light guide member.

According to an embodiment of the present invention, light loss may be reduced by covering one surface of the light guide member and the surface of the light source with a light-transmitting member.

According to an embodiment of the present invention, hot spots may be prevented by covering the light-transmitting member covering one surface of the light guide member and the surface of the light source with a reflective member or/and a light blocking member.

According to an embodiment of the invention, it is possible to improve the light incidence efficiency of the light guide member, thereby improving the illumination distribution of the surface light source.

According to an exemplary embodiment of the present invention, it is possible to improve the light incidence efficiency of the light guide member, thereby providing reliability of a module or/and device having a surface light source.

It is possible to improve the optical reliability of the lighting module and the lighting device having the same according to an embodiment of the present invention. It is possible to improve the reliability of a vehicle lighting device having a lighting module according to an embodiment of the present invention. Embodiments of the invention may be applied to a light unit having a lighting module, various types of display devices, surface light source lighting devices, and vehicle lamps.

1 is an example of a side cross-sectional view showing a lighting device according to a first embodiment of the present invention.
2 is a partially enlarged view of the lighting device of FIG. 1.
3 is a first modified example of the lighting device of FIG. 1.
4 is a second modified example of the lighting device of FIG. 1.
5 is a third modified example of the lighting device of FIG. 1.
6 is a fourth modified example having a reflective member in the lighting device of FIG. 1.
7 is a fifth modified example having a reflective layer in the lighting device of FIG. 1.
8 is a sixth modified example having a reflective layer in the lighting device of FIG. 1.
9 is a seventh modified example having a reflective layer of the lighting device of FIG. 1.
10 is another example of a support member in the lighting device of FIG. 1.
11 and 12 are examples in which a substrate is disposed in the lighting device of FIG. 1.
13 is a side cross-sectional view showing an example of a lighting device according to a second embodiment of the present invention.
14 to 19 are modified examples of the lighting device of FIG. 13.
20 is a side cross-sectional view showing a lighting device according to a third embodiment of the present invention.
21 to 31 are modified examples of the lighting device of FIG. 20.
32 to 36 are examples of arranging a light blocking member in the lighting device according to the embodiment(s) of the present invention.
37 to 39 are examples in which the center of the light source is aligned with the center of the light guide member in the lighting device according to the embodiment(s) of the present invention.
40 and 41 are examples of plan views of a lighting device according to the embodiment(s) of the present invention.
42 is an example in which an optical sheet is disposed on a lighting device according to the embodiment(s) of the present invention.
43 is an example in which a reflective sheet is disposed on a lighting device according to the embodiment(s) of the present invention.
44 is an example of a light source according to the embodiment(s) of the present invention.
45 is an example in which the light source of FIG. 44 is disposed on a substrate.
46 is another example of a light source according to the embodiment(s) of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the embodiments described in the present specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and there may be various equivalents and modified examples that can replace them at the time of application.

When it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention in describing the operating principle of the preferred embodiment of the present invention in detail, the detailed description thereof will be omitted. The terms described below are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the contents throughout the present specification. The same reference numerals are used for parts having similar functions and functions throughout the drawings.

The lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, lighting devices for mobile devices, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, headlamps, sidelights, side mirrors, fog lights, tail lamps, brake lights, auxiliary brake lights, turn signals, position lamps, daytime running lights, vehicle interior lighting, door scarf (door scar), rear combination lamp, backup lamp, room lamp, instrument panel lighting, etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, mobile devices, and various electric vehicle fields, as well as all lighting-related fields or advertisement-related fields that are currently developed and commercialized or that can be implemented according to future technological developments. I would say that it is applicable.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and descriptions of the embodiments. In the description of the embodiments, each layer (film), region, pattern, or structure is formed "on" or "under" of the substrate, each layer (film), region, pad, or patterns. When described as "on" and "under", both "directly" or "indirectly" are formed. In addition, standards for the top or bottom of each layer will be described based on the drawings.

<First embodiment>

1 is an example of a side cross-sectional view illustrating a lighting device according to a first embodiment of the present invention, FIG. 2 is a partial enlarged view of the lighting device of FIG. 1, and FIGS. 3 to 9 are modified examples of the lighting device of the present invention.

1 and 2, a lighting device according to an embodiment of the present invention may include a light source 100, a resin member 220, and a light guide member 250. The lighting device may include a support member 210. The support member 210 may include a member or a substrate electrically connected to the light source 100. The lighting device may include a light-transmitting member or/and an adhesive member 230 facing the incident direction of the light guide member 250.

The lighting device may provide a point light source generated from the light source 100 as a surface light source. The light irradiated by the surface light source may include at least one of blue, green, red, yellow, or white, and may be white or red. When the lighting device emits white light, it may be applied to a lamp having a red lens, for example, a vehicle lamp.

The lighting device may be a flexible module or a rigid module. The lighting device may be flat or bent in at least one of the first and second directions Y and X. The thickness of the lighting device may have a maximum thickness of 3 mm or less in a vertical direction (Z), and a minimum thickness of 0.2 mm or more. An area having the maximum thickness in the lighting device may be an area in which a light source is disposed. The area having the minimum thickness in the lighting device may be an area in which the light guide member 250 is disposed.

The light source 100 and the light guide member 250 may be disposed one or more in a first direction or/and a second direction. For example, the module including the light source 100 and the light guide member 250 may be disposed one or more in a first direction or a second direction. As another example, the module including the light source 100 and the light guide member 250 may be disposed one or more in the first and second directions. The light source 100 may be disposed in a plurality in a second direction orthogonal to the first direction. The light guide member 250 may correspond to a plurality of light sources on one side or at least two sides.

<Light source (100)>

The light source 100 may have a bonding portion disposed on another side, eg, a lower surface or/and a rear surface on which the emission surface S1 is disposed. The light source 100 may be disposed on the support member 210. For example, when the support member 210 includes a substrate having a circuit pattern, the light source 100 may be electrically connected to the support member 210.

When a plurality of the light sources 100 are disposed on the support member 210, they may be connected in series with each other, in series-parallel, in parallel-series, or in parallel. As another example, the light source 100 may be arranged in various connection groups according to the circuit pattern of the support member 210, and may include, for example, a group connected in series and a group connected in parallel. The light source 100 may be arranged in one column or/and row with respect to the incident surface of one light guide member, or may be arranged in at least two columns or/and rows. Here, the incident surface may be surface(s) corresponding to the light source 100.

The light source 100 may be a light emitting device, for example, a device having a light emitting chip or a package packaged with an LED chip. The light source 100 may include a single chip or a plurality of LED chips. The light source 100 may include LED chips emitting the same color or the same peak wavelength, or LED chips emitting different colors or different peak wavelengths. The light emitting chip may include at least one or two or more of a blue LED chip, a red LED chip, a green LED chip, and an ultraviolet (UV) LED chip. The light source 100 may emit at least one of white, blue, red, green, and yellow. The light source 100 emits light in a lateral direction, and a bottom portion of the light source 100 may be connected to the support member 210. The light source 100 may be a side view type package. As another example, the light source 100 may be an LED chip or a top-view type package. When the light source 100 is disposed as an LED chip(s), a reflective member may be disposed in an area other than the emission surface S1. The light source 100 may include a phosphor. The light source 100 may include a phosphor layer or a molding member covering the surface of the light emitting chip(s). The phosphor layer may be a layer to which a phosphor is added, and the molding member may be a transparent resin member having a phosphor or a transparent resin member having no impurities such as a phosphor. Here, the emission surface S1 of the light source 100 may be part or all of one side of the light source 100. The emission surface S1 of the light source 100 may be provided with a reflective portion such as a body made of a reflective material.

The emission surface S1 of the light source 100 may correspond to the light guide member 250. The light source 100 or the light emitting chip may correspond to an incident surface of the light guide member 250. The light emitted from the light source 100 may travel in the direction of the light guide member 250, and the light incident on the light guide member 250 is guided inside the light guide member 250, and a surface through the outer surface It can emit light as a light source. The outer surface of the light guide member 250 may be an opposite surface on which the support member 210 is disposed, for example, an upper surface.

As shown in FIG. 2, the height or thickness T1 of the top surface of the light source 100 may be 2 mm or less, for example, in the range of 0.6 mm to 1.5 mm. When the thickness T1 or the height of the top surface of the light source 100 is larger than the above range, light loss may increase due to a difference in thickness from the light guide member 250, and when it is smaller than the above range, the luminous intensity decreases or ) On the light uniformity may be deteriorated. In this case, the thickness T2 of the light guide member 250 may be smaller than the thickness T1 of the light source 100. The thickness T2 of the light guide member 250 may be smaller than the thickness T1 of the light source 100 by 0.2 mm or more. The thickness T2 of the light guide member 250 may be 0.4mm or less, for example, 0.4mm to 0.2mm, or 0.3mm to 0.21mm. Since the thickness T2 of the light guide member 250 is 0.4 mm or less, a structure for minimizing light loss between the light source 100 and the light guide member 250 may be provided. For example, when an air gap exists between the light source 100 and the light guide member 250, light emitted from the light source 100 diffuses in the air region, so that the amount of light incident into the light guide member 250 is reduced. I can. In addition, when a member provided between the light source 100 and the light guide member 250 has a large difference in refractive index from the material of the light guide member 250, it may hinder the progress of light and light into the light guide member 250 Incidence efficiency may decrease. A member made of a transparent material is closely attached between the light source 100 and the light guide member 250, thereby reducing light loss and improving the distribution of the surface light source of the light guide member 250.

In the light source 100, the emission surface S1 may be provided with a flat, convex, or concave curved surface. A lens unit 155 having a curved surface convex outwardly may be disposed on the exit surface S1. The shape of the emission surface S1 or/and the lens unit may change the light path to be emitted.

<Support member 210>

The support member 210 may include a substrate. The substrate includes a printed circuit board (PCB), for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or a FR It may contain -4 substrates. The support member 210 may be a substrate made of a flexible or non-flexible material. The support member 210 may be an insulating or non-insulating material, or a thermally conductive or electrically conductive material. The support member 210 may have a circuit pattern disposed above or/or below it, and the circuit pattern may include a plurality of pads disposed in a region corresponding to the light source 100. The circuit pattern on the substrate may be disposed on an upper portion, or may be disposed above and below.

A protective layer made of a reflective material may be disposed on the upper portion 210A of the support member 210. The protective layer may be disposed in a region overlapping the light guide member 250 on the upper surface of the support member 210. The protective layer may be made of a solder resist material or an insulating material, and may be a photo solder resist (PSR) material. The protective layer may be a layer protecting the circuit pattern. The protective layer and the circuit pattern may be provided on the support member 210, for example, a substrate.

When the support member 210 is made of a soft material, the support member 210 may include a curved region. Areas of an upper surface or/and a lower surface of the support member 210 may be larger than an area of the lower surface of the light guide member 250. Accordingly, the support member 210 may reflect light leaked through the lower surface of the light guide member 250 toward the upper surface of the light guide member 250. A reflective layer 260 may be disposed on the upper surface of the support member 210 as shown in FIG. 7. The reflective layer 260 may include a metal material or/and a non-metal material layer to reflect incident light. The protective layer and/or the reflective layer 260 disposed in an area overlapping the light guide member 250 may include an uneven pattern or a rough pattern on the surface. Since the protective layer and/or the reflective layer 260 may contain particles or air particles having a high refractive index therein, light reflection may be effectively performed.

<Resin member 220>

The resin member 220 may be disposed on one or more light sources 100 or may cover the light sources 100. Each of the resin members 220 may be disposed on side surfaces of the light source 100 or may be disposed above the light source 100. When a plurality of light sources 100 are disposed, the resin member 220 may be disposed between a plurality of light sources. The resin member 220 may be disposed on the support member 210. The resin member 220 may be disposed on the support member 210 in a region spaced apart from the light guide member 250.

The resin member 220 may be disposed on the top and side surfaces of the light source 100. A part of the resin member 220 may be disposed between the emission surface S1 of the light source 100 and the light guide member 250. Here, the resin member 220 may contact the exit surface S1 of the light source 100. The resin member 220 may be disposed on a rear surface opposite to the emission surface S1 of the light source 100 or may be removed. That is, the rear surface of the light source 100 may be in contact with or non-contact with the resin member 220. When the rear surface of the light source 100 is exposed, heat dissipation efficiency may be improved.

The thickness of the resin member 220 (eg, T2+B1) may be 3 mm or less, or may be twice or less than the thickness T1 of the light source 100. The minimum thickness of the resin member 220 may be greater than or equal to the thickness of the light source 100 or greater than or equal to the thickness of the light guide member 250. The thickness of the resin member 220 may be, for example, 0.1 mm or more based on the top surface of the light source 100 or may be provided with a thickness that can further cover 1/2 or more of the thickness T1 of the light source 100. . The thickness of the resin member 220 may be provided at a height capable of refracting light traveling to the outermost side of the light source 100 in consideration of the distribution of the beam angle of the light source 100.

The thickness of the resin member 220 may be at least three times the thickness T2 of the light guide member 250. The uppermost surface of the resin member 220 may have a distance B1 between the upper surface of the light guide member 250 of 1 mm or more, for example, in a range of 1 mm to 2.5 mm. The distance (B3) between the upper surface of the resin member 220 and the upper surface of the light source 100 should be smaller than the distance (B1) between the upper surface of the resin member 220 and the upper surface of the light guide member 250. I can. The distance (B3) between the upper surface of the light source 100 and the upper surface of the resin member 220 may be equal to or greater than the distance (B2) between the upper surface of the light source 100 and the upper surface of the light guide member 250 have. The difference between the distance B2 or the thickness T1 of the light source 100 and the thickness T2 of the light guide member 250 may be 0.5mm or more, for example, in the range of 0.5mm to 1.2mm. Due to such a difference in thickness, a member for guiding light may be provided so that light from the light source 100 may be incident on the incident surface of the light guide member 250.

The resin member 220 is in contact with the light source 100 and seals the circumference of the light source 100, so that moisture penetration can be prevented and light loss can be minimized. The material of the resin member 220 may be the same material as the material of the molding member in the light source 100, or a material having a refractive index difference of 0.5 or less from the molding member. The refractive index of the resin member 220 may be 1.70 or less, for example, in the range of 1.25 to 1.70.

The resin member 220 can guide or diffuse the light emitted from the light source 100 without loss by embedding the light source 100 therein. A member disposed between the light source 100 and the light guide member 250 may be a resin material or a glass material. The upper surface of the resin member 220 may include an area having a flat surface, an inclined surface, or a curved surface. The resin member 220 may be injection-molded or dispensed on the support member 210 on which the light source 100 is disposed.

The resin member 220 may be a transparent material. The resin member 220 may include at least one of silicon, silicon molding compound (SMC), epoxy, or epoxy molding compound (EMC). The resin member 220 may include an ultra violet (UV) curable resin or a thermosetting resin material, and may selectively include, for example, PC, OPS, PMMA, PVC, or the like. For example, as the main material of the resin member 220, a resin material containing urethane acrylate oligomer as a main material may be used. For example, a mixture of a synthetic oligomer, urethane acrylate oligomer, and a polyacrylic polymer type may be used. Of course, it may further include a monomer in which a low-boiling-point dilution-type reactive monomer such as IBOA (isobornyl acrylate), HPA (Hydroxylpropyl acrylate, 2-HEA (2-hydroxyethyl acrylate), etc.) may be further included, and as an additive, a photoinitiator (such as 1 -hydroxycyclohexyl phenyl-ketone, etc.) or antioxidants can be mixed.

A bead (not shown) may be included in an upper or lower region of the resin member 220, and the bead diffuses and reflects incident light, thereby increasing an amount of light. The resin member 220 may include a phosphor, and the phosphor may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. The resin member 220 is formed of a transparent material having no impurities, so that incident light may be guided to the light guide member 250 without loss.

A bracket or a housing may be disposed on the resin member 220 to prevent hot spots. The resin member 220 may be used as a resin part or a sealing part sealing the light source 100, or as a guide part or a transparent guide part for guiding the light emitted through the light source 100.

<Light guide member 250>

The light guide member 250 may guide the light emitted from the light source 100 and provide it as a surface light source through an upper surface or/and a side surface excluding an incident surface. The light guide member 250 may be a member that guides light, or may be a light guide sheet or a light guide film.

The light guide member 250 may guide and diffuse light incident through an incident surface facing the light source 100 in a center region or in a direction opposite to the incident side. The material of the light guide member 250 may include at least one of silicone, epoxy, or ultraviolet curable resin. The material of the light guide member 250 may be the same material as the resin member 220. When the light guide member 250 and the resin member 220 are made of the same material, light loss due to a difference in refractive index may be minimized.

The material of the light guide member 250 may include polycarbonate (PC), polymethyl methacrylate (PMMA), methyl methacrylate, styrene, acrylic polymer resin, glass, or other light guide materials. Suitable methods of manufacturing the light guide member 250 include injection molding, extrusion, or other manufacturing forms. In exemplary embodiments, the light guide member 250 may provide uniform primary light emission through the top surface.

The thickness T2 of the light guide member 250 may be 0.4 mm or less or smaller than the thickness T1 of the light source 100. Since the thickness T2 of the light guide member 250 is provided to be thinner than the thickness T1 of the light source 100, loss of light is reduced through a transparent member disposed between the light guide member 250 and the light source 100. I can.

The thickness T2 of the light guide member 250 may have the same thickness in each side surface and a center region. The thickness T2 of the light guide member 250 may be thicker than the thickness of other regions, or the edge region may be thinner than the center region, in which a region in which the incident surface (for example, J2) is disposed. Since the light guide member 250 has a thin thickness, it may be made of a soft material. Accordingly, the light guide member 250 may be disposed in close contact with the concave or convex region on the housing or bracket.

Here, the upper surface of the light guide member 250 may be disposed equal to or lower than the center of the light source 100. Since the light guide member 250 is provided with a relatively thin thickness, the center of the light source 100 may be provided equal to or higher than the upper surface of the light guide member 250.

The light guide member 250 may be adhered to the support member 210 or may be adhered to the protective layer. The light guide member 250 may be adhered to the reflective layer 260 when the reflective layer 260 (refer to FIG. 7) is disposed on the support member 210. The light guide member 250 may have a reflective pattern disposed on its lower surface to reflect incident light.

<Adhesive member 230>

The adhesive member 230 may or may not be used in a lighting device. The adhesive member 230 may be disposed between the resin member 220 and the light guide member 250. The adhesive member 230 may be adhered or closely adhered between the resin member 220 and the light guide member 250. The adhesive member 230 may remove an air gap at the interface J2 between the resin member 220 and the light guide member 250. The interface J1 between the adhesive member 230 and the resin member 220 may be adhered to be provided as an adhesive surface for removing an air gap. The interface (J2) between the adhesive member 230 and the light guide member 250 may be adhered to be provided as an adhesive surface for removing an air gap.

The thickness of the adhesive member 230 in the vertical direction may be equal to the thickness of the resin member 220 or may be at least the thickness of the light guide member 250. For example, the thickness of the adhesive member 230 may be the same as the height of one surface of the resin member 220. One surface of the resin member 220 may be an extraction surface corresponding to the emission surface S1 of the light source 100. The adhesive member 230 may be adhered to the upper surface of the support member 210.

As shown in Figure 2, the width (C2) of the adhesive member 230 is the length in the first direction, the distance between the resin member 220 and the light guide member 250, 1.5mm or less, for example, 0.2mm to It can be in the range of 1.5 mm. When the width C2 of the adhesive member 230 is larger than the above range, the light incident efficiency to the light guide member 250 may be reduced, and when it is smaller than the above range, the adhesive strength may decrease.

Here, the distance C1 between the emission surface S1 of the light source 100 and the light guide member 250 may be 2.5 mm or less, for example, in the range of 0.3 mm to 2 mm. When the adhesive member 230 is removed, there cannot be a gap between the resin member 220 and the light guide member 250. The distance C2 between the resin member 220 and the light guide member 250 may be provided as a distance at which light emitted from adjacent light sources can be mixed in consideration of the distribution of the beam angle of the light source 100. have. That is, the interval may be set in consideration of the distance to adjacent light sources and the distribution of the directivity angle of the light source so that there is no occurrence of a dark part in the light incident part of the light guide member 250.

The adhesive member 230 may include a transparent material. The adhesive member 230 may include a transparent adhesive or an adhesive. The adhesive member 230 may include at least one of silicone, epoxy, or ultraviolet curable resin. The material of the adhesive member 230 may include at least one of polymers, epoxys, urethanes, polyphenylmethylsiloxanes, polyphenylalkylsiloxanes, polydiphenylsiloxanes, fluorinated silicones, silicone derivatives, and polymers. .

The adhesive member 230 may be of the same material as the resin member 220 or the same material as the material of the light guide member 250. The difference in refractive index between the adhesive member 230, the resin member 220, and the light guide member 250 may be 0.2 or less. The resin member 220, the light guide member 250, and the adhesive member 230 may be made of the same material. When the resin member 220, the light guide member 250, and the adhesive member 230 have a low difference in refractive index or are of the same material, light loss in the adhesive member 230 may be minimized.

For the incidence efficiency of light, a reflective member or/and a light blocking member may be disposed on the upper surface of the resin member 220 or/and the adhesive member 230. In addition, a reflective member or/and an optical member may be disposed on the upper surface of the light-incident portion of the adhesive member 230 or/and the light guide member 250. The light-incident portion of the light guide member 250 may be an area to which light is incident, or may be an area adjacent to an incident surface of the light guide member 250.

Here, as shown in FIGS. 40 and 41, when a plurality of light sources 100 and 100A are disposed on one or both sides of the light guide member 250 in the lighting device according to an embodiment of the present invention, light incident to the plurality of light sources is It is guided through the light guide member 250 and may be discharged upward. At this time, the light source(s) are sealed to the resin member 220, and the resin member 220 and the light guide member 250 are bonded to each other by an adhesive member 230, so that the light guide member ( 250) can completely eliminate the air gap on the path to the incident surface. Accordingly, light loss in the light path from the light source 100 to the light guide member 250 can be minimized, and light can be transmitted to the center region or the opposite edge of the light guide member 250, so that each light source 100 The size of the light guide area that can be covered may be increased. Accordingly, the length of the light guide member 250 in the first direction may be increased.

As another example, an area in which the light source 100 is disposed above the support member 210 may be recessed. Accordingly, the center of the light source 100 may be moved to a position close to the center of the light guide member 250. As another example, the incident portion of the light guide member 250 may be spaced apart or bent upward from the upper surface of the support member 210. Accordingly, the center of the incident surface of the light guide member 250 may be moved in a direction close to the center of the light source 100.

The lighting device is a configuration in which a resin member 220 or/and an adhesive member 230 is disposed between the light source 100 and the light guide member 250, and other modified examples will be described later, and modified example(s) Can be selectively applied to the above configuration or description.

Referring to FIG. 3, the adhesive member 230 may be disposed between the resin member 220 and the light guide member 250. The upper surface of the adhesive member 230 may be the same as the upper surface of the light guide member 250, or the thickness of the adhesive member 230 may be the same as the thickness of the light guide member 250. The thickness of the adhesive member 230 is lower than the upper surface of the resin member 220 and is disposed equal to or higher than the upper surface of the light guide member 250, so that it is in a region between the resin member 220 and the light guide member 250. It can eliminate air gaps and reduce light loss. The adhesive member 230 may be adhered to the upper surface of the support member 210. A reflective member or/and a light blocking member may be disposed on an upper surface of the resin member 220 or/and the adhesive member 230.

4 and 3, the reflective member 240 may be disposed on the adhesive member 230. A portion 241 of the reflective member 240 may extend above the light guide member 250. The reflective member 240 may extend from one surface of the resin member 220 to an upper surface of the light guide member 250. The reflective member 240 may be adhered to the upper surfaces of the adhesive member 230, the resin member 220, and the light guide member 250. The reflective member 240 is formed of a reflective resin material, so that the members are in close contact with each other and reflect light.

Referring to FIG. 5, the adhesive member 230 may be disposed between the resin member 220 and the light guide member 250 filling the light source 100. The upper surface 232 of the adhesive member 230 may include a concave curved surface, and may extend from the upper surface of the resin member 220 to the upper surface of the light guide member 250. The width of the adhesive member 230 may gradually decrease from the upper surface of the light guide member 250 toward the upper surface of the resin member 220. One surface of the adhesive member 230 may be adhered to the same or smaller area as the extraction surface of the resin member 220, and the other surface may be provided in a larger area than the incident surface of the light guide member 250. A portion 231 of the adhesive member 230 may extend on an upper surface of the light incident portion of the light guide member 250. A portion 231 of the adhesive member 230 may be defined as a protrusion protruding in the center direction of the light guide member 250. A portion 231 of the adhesive member 230 is adhered to the incident surface and the upper surface of the light guide member 250, so that light traveling upward of the light guide member 250 can be reflected in the direction of the light guide member. That is, light incident on the concave curved surface provided on the upper surface of the adhesive member 230 may be reflected or refracted toward the light guide member 250. A portion of the adhesive member 230 has a width smaller than that of the adhesive member 230 and is disposed on the light guide member 250 to reduce light loss and increase an adhesive area.

6 will be described with reference to the lighting device of FIG. 5. 6 and 5, the reflective member 240 may be disposed on the resin member 220 and/or the adhesive member 230. The reflective member 240 may include a first reflective portion R1 disposed on the adhesive member 230. The first reflecting part R1 may be disposed to extend on an upper surface of the adhesive member 230 having a concave curved surface and an upper surface of the light guide member 250. The first reflecting part R1 may reflect incident light to block light leakage. The first reflecting part R1 is provided in a concave curved surface, so that reflection efficiency of incident light may be improved.

The reflective member 240 may include a second reflective portion R2. The second reflecting part R2 may be disposed on the upper surface of the resin member 220. The second reflecting part R2 may be connected to the first reflecting part R1. The second reflecting part R2 may reflect or block light that proceeds above the light source 100 on the resin member 220. The second reflecting unit R2 may reflect or/or block light, thereby preventing hot spots.

The reflective member 240 may include a third reflective portion R3. The third reflecting part R3 may be disposed on the outer surface of the resin member 220 to block light leaking to the rear. The third reflecting part R3 may extend from the second reflecting part R2. The third reflective portion R3 may not be formed or may be removed, and the light incident on the third reflecting portion R3 is leaked light rather than the main light of the light source 100, and does not affect the main light. Otherwise, the third reflective portion R3 may be removed. When the third reflecting part R3 is disposed on the other outer surface of the resin member 220, it may be connected to the first and second reflecting parts R2.

The reflective member 240 is disposed on the upper surface of the resin member 220 or/and the upper surface of the adhesive member 230 to reflect incident light in the direction of the light guide member 250, and the light guide member 250 The amount of light incident on the furnace can be improved. The reflective member may be formed of a metal or non-metal material.

The reflective member 240 may be formed in a single layer or multilayer structure. The reflective member 240 may include a metal layer such as stainless steel, aluminum (Al), and silver (Ag) in the case of metal, and may include a white resin material or a plastic material in the case of a non-metal material. The reflective member 240 may include a white resin material or a polyester (PET) material. The reflective member 240 may include at least one of a low reflection film, a high reflection film, a diffuse reflection film, and a regular reflection film.

Referring to FIG. 7, the reflective layer 260 may be disposed between the support member 210 and the light guide member 250. When the support member 210 is a substrate, the reflective layer 260 may be disposed between the substrate and the light guide member 250. When a protective layer is disposed on the substrate, the reflective layer 260 may be disposed between the substrate and the light guide member 250. The reflective layer 260 may be formed of a soft or non-soft material.

The reflective layer 260 refracts or reflects light traveling to the lower surface of the light guide member 250 and may be re-incident through the light guide member 250. The reflective layer 260 may be provided with a thickness thinner than that of the light guide member 250. The reflective layer 260 may be disposed in a range of 0.2 mm or less, for example, 0.1 mm to 0.2 mm. When the reflective layer 260 is larger than the above range, light absorption or improvement in reflection efficiency may be insignificant, and when the reflection layer 260 is smaller than the above range, a reflection distribution may be irregular or reflection efficiency due to light transmission may decrease.

The reflective layer 260 may be equal to or larger than the lower surface area of the light guide member 250. Accordingly, light traveling through the lower surface of the light guide member 250 can be effectively reflected. As another example, an optical member may be disposed on the light guide member 250, and the optical member may include a reflective material or a diffusing material.

The reflective layer 260 may be adhered or adhered between the light guide member 250 and the support member 210. The reflective layer 260 may be adhered to the adhesive member 230. That is, the adhesive member 230 adheres to the reflective layer 260 and the light guide member 250 on the upper surface of the support member 210, so that the adhesive member 230, the reflective layer 260, and the light guide member ( 250) between the air gap can be eliminated. Accordingly, a problem due to light loss or an air gap between the adhesive member 230 and the reflective layer 260 can be blocked.

The reflective layer 260 may be provided as a film made of any one of a resin material, transparent PET, white polyethylen terephthalate (PET), and Ag sheet. The reflective layer 260 may include any one of TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and PS on the inside or/and the surface.

As shown in FIG. 8, the reflective layer 260 may include an extension 261 extending from a lower surface of the light guide member 250 to a lower surface of the adhesive member 230. Since the extended portion 261 of the reflective layer 260 extends to the lower surface of the adhesive member 230, the extended portion 261 of the reflective layer 260 disposed under the adhesive member 230 is prevented from being lifted. can do. The extended portion 261 of the reflective layer 260 may contact the lower end of the resin member 220. The extension part 261 of the reflective layer 260 may overlap the adhesive member 230 in a vertical direction. At this time, the reflective member 240 may be disposed on the adhesive member 230 or/and the resin member 220, and the configurations of the above-described embodiments or/and modifications may be selectively applied to this structure.

As shown in FIG. 9, the reflective layer 260 may include an extension 261 extending from the lower surface of the light guide member 250 to the lower surface of the resin member 220. Since the extended portion 261 of the reflective layer 260 extends to the lower surface of the resin member 220, the extended portion 261 of the reflective layer 260 disposed under the resin member 220 is prevented from being lifted. can do. The extended portion 261 of the reflective layer 260 may be in contact between the lower surface of the resin member 220 and the support member 210 or the substrate. The extension part 261 of the reflective layer 260 may overlap the adhesive member 230 and the resin member 220 in a vertical direction. The extended portion 261 of the reflective layer 260 may include an open area 262, and the light source 100 may be disposed in the open area 262. Here, when the light source 100 is disposed in plural in one direction, the open area 262 may be disposed in plural so as to correspond to the light source 100. The lower portion of the resin member 220 is extended in the open area 262 to be adhered to the support member 210 or/and the substrate. The outer end of the extension part 261 is spaced apart from the outer surface of the resin member 220 to prevent a problem from being raised or a problem due to external exposure of the resin member 220. The reflective member 240 may be disposed on the adhesive member 230 or/and the resin member 220, and the configurations of the above-described embodiments or/and modifications may be selectively applied to this structure.

Referring to FIG. 10, the support member 210 disclosed above or the support member 210 to be described later may include a substrate 211 and a support part 213. The substrate 211 may overlap the light source 100 and the resin member 220 in a vertical direction. When the substrate 211 has the adhesive member 230, the substrate 211 may be vertically overlapped with the adhesive member 230. The substrate 211 may be electrically connected to the light source 100. The support part 213 may be disposed under the light guide member 250 or under the reflective layer 260 disclosed above. The support part 213 is a member that supports the light guide member 250 and may be a housing or a bracket structure or a bottom cover.

Here, the adhesive member 230 may be adhered to the substrate 211 and the support part 213. The upper surface of the substrate 211 may be disposed on the same horizontal line as the upper surface of the support part 213 or may be disposed lower. In this structure, after the light source 100 is disposed on the substrate 211, the light source 100 is molded with a resin member 220, and the resin member 220 and the light guide member 250 are used as an adhesive member 230. It can be formed by bonding between. At this time, the adhesive member 230 may selectively include the structure disclosed above. The reflective member 240 may be disposed on the adhesive member 230 or/and the resin member 220, and the configurations of the above-described embodiments or/and modifications may be selectively applied to this structure.

The outer side of the resin member 220 may be spaced apart from the outer edge of the substrate 211 to prevent a problem in which the lower end of the resin member 220 is lifted at the edge of the substrate 211. The support part 213 may be made of a resin material or a plastic material.

Referring to FIG. 11, the substrate 211 may be disposed under the resin member 220, the light source 100, or/and the adhesive member 230. The light guide member 250 may be disposed on one side of the substrate 211. The adhesive member 230 may be adhered to the light guide member 250 on the substrate 211. The light incident part of the light guide member 250 and the adhesive member 230 may overlap the substrate 211 in a vertical direction. As shown in FIG. 12, the light guide member 250 and the reflective layer 260 may be disposed on one side of the substrate. The substrate may be vertically overlapped with the light incident portion and the reflective layer 260 of the light guide member 250. Here, the reflective layer 260 may extend to the lower surface of the adhesive member 230 or/and the lower surface of the resin member 220.

<Second Example>

13 is a side cross-sectional view showing an example of a lighting device according to a second embodiment of the present invention, and FIGS. 14 to 19 are modified examples of the lighting device of FIG. 13.

Referring to FIG. 13, a substrate 211A may be disposed on the support member 210. The substrate 211A may be disposed vertically with respect to a horizontal straight line of the support member 210. The substrate 211A and the light source 101 may overlap in a horizontal direction. Here, the light source 101 may include a top view type package. The light source 101 may include a light emitting chip therein, or may have a structure in which a light emitting chip is disposed in a reflective sidewall. The light source 101 may include a molding member covering the light emitting chip, and the molding member may be made of a resin material such as the resin member 220 or a material having a refractive index difference of 0.2 or less.

A resin member 220 covering the light source 101 disposed on one surface of the substrate 211A, and a light guide member 250 facing a side surface of the resin member 220 may be included. The adhesive member 230 disclosed above may be disposed between the light guide member 250 and the resin member 220. The adhesive member 230 is adhered to the resin member 220 and the light guide member 250, and seals between the resin member 220 and the light guide member 250. Accordingly, the air gap can be removed on the light path from the light source 101 or the light emitting chip to the light guide member 250, thereby reducing light loss.

A portion 231 of the adhesive member 230 may be disposed on the upper surface of the light guide member 250 or on the light incident part. The adhesive member 230 is adhered to a portion of the side surface and the upper surface of the light guide member 250, so that adhesion to the light guide member 250 may be improved.

The support member 210 may support the lower surfaces of the substrate 211A, the resin member 220, the adhesive member 230, and the light guide member 250. The support member 210 may function as a support part. A protective layer or a layer of a reflective material is disposed on the upper portion 210A of the support member 210 or the lower surface of the light guide member 250 to effectively reflect light.

The reflective member 240 may be disposed on an upper surface of the resin member 220 or/and an upper surface of the adhesive member 230. The upper surface of the resin member 220 may be a flat surface or a concave or convex surface. The upper surface of the adhesive member 230 may be an inclined surface, or may be provided as a concave or convex surface. Since the reflective member 240 is formed on the resin member 220 or/and the adhesive member 230, the light emitted through the emission surface S1 of the light source 101 is reflected in the direction of the light guide member 250. You can guide. In this structure, since the position of the light source 101 on the substrate 211A can be changed in a vertical direction, the center of the light source 101 can be aligned with the center of the light guide member 250 to be close to the center of the light guide member 250. Accordingly, the incident light amount of light may be increased on the incident surface of the light guide member 250.

One end of the reflective member 240 may be in contact or non-contact with the substrate on the resin member 220. The lower portion of the reflective member 240 may be in contact with the light guide member 250. The material of the reflective member 240 will be referred to the description disclosed above.

Referring to FIG. 14, a light source 101 disposed on a substrate 211A is sealed with a resin member 220, and an adhesive member 230 is disposed between the resin member 220 and the light guide member 250. I can. The light source 101 may correspond to or be disposed to face the incident surface of the light guide member 250. Accordingly, light emitted from the light source 101 may be efficiently incident through the light guide member 250. The reflective layer 260 described above is disposed under the light guide member 250, and the reflective layer 260 may reflect light leaking from the lower portion of the light guide member 250.

A reflective member 240 and/or a light blocking member may be disposed on a circumferential surface having upper and lower surfaces of the resin member 220 and/or a circumferential surface having an upper and lower surface of the adhesive member 230. Accordingly, light loss can be minimized.

15 and 14, an adhesive member 230 may be disposed between the resin member 220 and the light guide member 250. When the adhesive member 230 is not present, the resin member 220 may be disposed on the incident surface of the light guide member. The reflective member 240 may be disposed on the light incident part of the light guide member 250. The reflective member 240 may be disposed between the adhesive member 230 and the upper surface of the light guide member 250 and may be disposed along one surface of the adhesive member 230 protruding on the light guide member 250. have. The upper surface of the reflective member 240 may be an inclined surface or may include a curved surface. The material of the reflective member 240 may be formed of a reflective material made of a resin material. The width of the lower surface of the reflective member 240 may be less than or equal to the width of the lower surface of the resin member 220 and greater than or equal to the width of the adhesive member 230. If the width of the reflective member 240 is larger than the above range, the size of the light guide member 250 may be increased, and if it is smaller than the above range, the adhesive strength may decrease.

Referring to FIG. 16, the adhesive member 230 may be disposed between the resin member 220 and the light guide member 250. The height or thickness of the adhesive member 230 in the vertical direction may be smaller than the thickness or height of the resin member 220. Accordingly, the upper surface of the adhesive member 230 may be disposed lower than the upper surface of the resin member 220, and the lower surface may be disposed higher than the lower surface of the resin member 220. The thickness of the adhesive member 230 may be less than the thickness of the resin member 220 and greater than the thickness of the light guide member 250. One surface of the adhesive member 240 is a surface in contact with the resin member 220 and is provided in an area smaller than the extraction surface of the resin member 220, thereby improving light condensing efficiency. The distance from the center of the light guide member 250 to the upper or lower surface of the adhesive member 240 is greater than the distance to the upper or lower surface of the light guide member 250, and the upper or lower surface of the resin member 220 May be less than the distance to. Accordingly, the light emitted through the light source 100 may proceed along the members 220, 230, and 250 whose extraction areas are gradually smaller.

The reflective member 240 may extend on one surface of the adhesive member 230 and an upper surface of the light guide member 250. The reflective member 240 may contact an upper surface of the adhesive member 230 and an upper surface of the resin member 220. The reflective member 240 may extend above the adhesive member 230 and contact the resin member 220. Accordingly, since the reflective member 240 is disposed closer to the light source 101, the reflective member 240 transmits the light emitted from the light source 101 in the direction of the adhesive member 230 and the light guide member 250. Can be reflected by

The adhesive layer 235 may be adhered to the adhesive member 230 and the lower surface of the light guide member 250 or the reflective layer 260. The adhesive layer 235 may be attached to the adhesive member 230 and to the light guide member 250 or the reflective layer 260. A portion of the adhesive layer 235 may be adhered to the lower surface of the adhesive member 230 and may be adhered to the lower side of the resin member 220. The material of the adhesive layer 235 may be a resin material, or may be an adhesive or adhesive material. The adhesive layer 235 may include a reflective resin material. The adhesive layer 235 may be a metal or non-metal material. The reflective resin material may include a resin material to which a reflective material, for example, a metal oxide is added in the resin material, and the metal oxide may include at least one of TiO ₂ , SiO ₂ , and Al ₂ O ₃ . Through the adhesive layer 235, the shape or structure of the resin member 220, the adhesive member 230, the light guide member 250, and the reflective layer 260 can be maintained without a separate support having rigidity.

In addition, since the light guide member 250 or the reflective layer 260 is supported by the adhesive member 230 and the adhesive layer 235, a flow problem in the light incident part of the light guide member 250 can be suppressed.

Here, the adhesive member 230 may be disposed between the reflective member 240 and the adhesive layer 235 in a vertical direction. The upper portion of the adhesive member 230 may be disposed between the resin member 220 and the reflective member 240 in a horizontal direction, or the lower portion may be disposed between the adhesive layer 235 and the resin member 220. By embedding the adhesive member 230 in the reflective member 240 and the adhesive layer 235, the reliability of the adhesive member 230 may be improved.

17 is a structure in which the adhesive member 230 is removed from the structure of FIG. 16, and a reflective member 240 on the upper surface of the light guide member 250 and an adhesive layer 235 may be disposed on the lower surface of the light guide member 250. The reflective layer 260 may be disposed between the light guide member 250 and the adhesive layer 235 on the lower surface of the light guide member 250. The resin member 220 may be in contact with or adhered to the incident surface of the light guide member 250. The resin member 220 may contact or adhere to the reflective member 240 and the reflective layer 260. Accordingly, the resin member 220, the reflective member 240 and the adhesive layer 235 may be adhered and supported at one end of the light guide member 250 or the light guide member 250 and the reflective layer 260.

The emission surface S1 of the light source 101 is a vertical plane and may correspond to the incident surface of the light guide member 250. Alternatively, as shown in FIG. 18, the light source 101 may correspond to the incident surface of the light guide member 250 by disposing a hemispherical lens unit 155 on the emission side. The lens unit 155 may condense the emitted light in the direction of the incident surface of the light guide member 250, thereby increasing the amount of incident light and reducing light loss.

The lens unit 155 may be integrally formed with or spaced apart from the light source 101. For example, the lens unit 155 may be provided on one surface of the resin member 220, that is, a region corresponding to the light guide member 250 or the adhesive member 230. A resin member 220 may be disposed around the lens unit 155. The center of the lens unit 155 may be disposed close to a straight line extending from the center of the incident surface of the light guide member 250. A reflective member 240 or/and an adhesive layer 235 may be disposed around the incident surface of the light guide member 250 or the light guide member 250 and the reflective layer 260.

19 and 18, the reflective member may include first and second reflective members 240A and 240B, and the first reflective member 240A is disposed on the upper surface of the resin member 220, and 2 The reflective member 240B may be disposed on the lower surface of the resin member 220. The first reflective member 240A may extend to the upper surface of the adhesive member 230A. The first reflective member 240A may extend from an upper surface of the adhesive member 230A to an upper surface of the light guide member 250. Here, the resin member 220 may be adhered to or contact with the incident surface of the light guide member 250, and the adhesive member 230A is disposed on one surface of the resin member 220 and the upper surface of the light guide member 250. I can. The upper surface of the adhesive member 230A may include an inclined plane, a concave curved surface, or a convex curved surface.

The second reflective member 240B may be disposed on the lower surface of the resin member 220 and may extend on the lower surface of the adhesive layer 230A. The second reflective member 240B may be adhered to the lower surface of the light guide member 250 or the reflective layer 260. The first and second reflective members 240A and 240B may be disposed on an upper surface/lower surface of the resin member 220 or/or an upper surface of the adhesive member 230A or/or a lower surface of the adhesive layer 230B. Accordingly, by forming the first and second reflecting members 240A and 240B on the surface of the exposed member between the substrate and the light guide member 250, the amount of incident light to the light guide member 250 can be maximized. In this case, when the first and second reflective members are made of metal, heat dissipation efficiency may be improved. The first reflective member 240A may be made of metal or a non-metallic material, and the second reflective member 240B may be made of a metal or non-metallic material.

In the second embodiment disclosed above, a light source 101 having a top-view package is sealed with a resin member 220 and a resin member 220 or a resin member 220 is provided between the light guide member 250 and the light source 101. By removing the air gap with the adhesive member 230, it is possible to reduce light loss and provide a longer optical path to the inside of the light guide member 250.

<Third Example>

The third embodiment is a structure in which the resin member 220 and the light guide member 250 are in close contact or adhered without an adhesive member. 20 is a side cross-sectional view illustrating a lighting device according to a third embodiment of the present invention, and FIGS. 21 to 31 are modified examples of the lighting device of FIG. 20.

Referring to FIG. 20, the lighting device includes a light source 100 on a support member 210, a resin member 220 covering the light source 100, and a light guide member 250 on one surface of the resin member 220. Can include. The resin member 220 and the light guide member 250 may be disposed on the support member 210. A reflective layer 260 may be disposed between the light guide member 250 and the support member 210. The reflective layer 260 may reflect light leaking under the light guide member 250. The description of the first embodiment may be applied to the light guide member 250 and the resin member 220. The reflective layer 260 may contact the resin member 220 or may extend to a lower surface of the resin member 220. The support member 210 may include a substrate or may include a separate circuit pattern, and may be electrically connected to the light source 100.

The thickness (T1, see FIG. 2) of the light source 100 may be greater than the thickness of the light guide member 250, and the resin member 220 is light emitted through the exit surface S1 of the light source 100. May be guided to the light guide member 250. The resin member 220 may be injection-molded after the light source 100 is mounted on the support member 210, and before the resin member 220 is cured, the light guide member 250 or/and the reflective layer By arranging 260, it may be adhered to the resin member 220. As another example, the light source 100 and the light guide member 250 are disposed on the support member 210, and then the resin member 220 is injection-molded on the light source 100, and at this time, the resin member 220 One surface of may be adhered to the light guide member 250 or the reflective layer 260. Accordingly, the resin member 220 is injection-molded as described above, thereby preventing an air gap from being generated at the interface with the light guide member 250.

As shown in FIG. 21, a reflective member 240 may be disposed between the light guide member 250 and one surface of the resin member 220. The reflective member 240 may be disposed on an upper surface of the light guide member or an upper surface of the light incident part and may contact one surface of the resin member 220 exposed on the incident surface of the light guide member 250. The reflective member 240 may be made of a reflective resin material or a metal material.

Here, in order to reinforce the coupling structure between the reflective member 240 and the resin member 220 in the first to third embodiments, when one surface of the resin member 220 has an uneven structure, the reflective member 240 is It may be disposed within the uneven structure.

As shown in FIG. 22, the adhesive member 230A may be adhered or contacted between the upper surface of the light guide member 250 and one surface of the resin member 220. The upper end of the adhesive member 230A may be disposed equal to or lower than the upper surface of the resin member 220. The adhesive member 230A closely couples the resin member 220 and the light guide member 250 to prevent a problem in that the adhesive strength between the resin member 220 and the light guide member 250 is reduced or separated from each other. have. A reflective member 240 may be disposed outside the resin member 220. The reflective member 240 may be made of a reflective resin material or a metal material. The outer surface of the adhesive member 230A may include an inclined plane, a concave or convex curved surface, and thus a light reflection path by the reflective member 240 may be adjusted.

23, the reflective layer 260 disposed between the support member 210 and the light guide member 250 may include an extension portion 261 extending below the resin member 220. Accordingly, the extended portion 261 of the reflective layer 260 is disposed under the resin member 220 to prevent a problem of being lifted on the support member 210. Since the extension part 261 is disposed adjacent to the emission surface S1 of the light source 100, light traveling with a light directivity distribution can travel to the upper surface of the reflective member 240, so that the side surface of the reflective layer 260 This can reduce the problem of light bounce.

Referring to FIG. 24, the resin member 220 may be provided in a later process. Accordingly, the resin member 220 may extend to the incident surface of the light guide member 250 and a part of the upper surface of the light guide member 250. The resin member 220 may reduce a problem in which the incident side end of the light guide member 250 is lifted. The resin member 220 may include a reflective surface Ra having a convex curved surface from an upper surface of the light guide member 250 to a region disposed on the light source 100. Accordingly, light emitted from the light source 100 may be reflected or refracted by the reflective surface Ra to proceed toward the light guide member 250. A portion where the reflective surface Ra starts may be disposed on a region between the light source 100 and the light guide member 250, and an end portion may be an upper surface of the light guide member 250. Since the reflective surface Ra extends from the upper surface of the resin member 220 to the upper surface of the light guide member 250, the light reflection efficiency on the emission surface S1 of the light source 100 may be improved.

As shown in FIG. 25, a reflective member 240 may be disposed on a surface or an upper surface of the resin member 220. The reflective member 240 may be a metal or non-metal material. Since the curved portion of the reflective member 240 is disposed along the reflective surface Ra of the resin member 220, light can be effectively reflected. Since a part of the resin member 220 extends on the light guide member 250, the reflective member 240 and the light guide member 250 may overlap a part of the resin member 220 in a vertical direction.

As shown in FIG. 26, the adhesive member 230 may be disposed between the resin member 220 and the light guide member 250 in the embodiment or/or modified example disclosed above. The adhesive member 230 may be formed in a line process and then the resin member 220 may be formed in a post process. Accordingly, the adhesive member 230 may be disposed between the resin member 220 and the light guide member 250, and a part 222 of the resin member 220 may extend above the adhesive member 230. have. A portion 222 of the resin member 220 may extend from an upper portion of the adhesive member 230 to an upper portion or/and lower portion of the light guide member 250. Since a portion 222 of the resin member 220 is disposed on the upper surface or/and lower surface of the adhesive member 230 or/and the light guide member 250, the light guide member 250 or/and the adhesive member 230 Can prevent the problem of being excited. A portion 222 of the resin member 220 may be defined as a protrusion protruding in a center direction or a light exit direction of the light guide member 250. In addition, the resin member 220 and the adhesive member 230 may be double overlapped on the incident side of the light guide member 250, and the resin member 220 may be adhered to the upper surface of the light guide member 250. Accordingly, the light guide member 250 can be in close contact with the resin member 220 from the upper surface close to the incident surface to the upper surface and side surfaces of the incident surface or the adhesive member 230, thereby eliminating air gaps and improving light extraction efficiency. I can.

Referring to FIGS. 27 and 26, a portion 222 of the resin member 220 may be disposed on an upper portion close to the incident surface of the light guide member 250. A portion 222 of the resin member 220 may be disposed on the upper portion of the light guide member 250, and a reflective member on the light guide member 250 on the front surface of the portion 222 of the resin member 220 ( 245) can be deployed. The reflective member 245 may be formed of a reflective resin or metal material disclosed above, or an adhesive resin material. The reflective member 245 may closely contact one end of the light guide member 250 with the resin member 220 to the support member 210. A light blocking member may be disposed on a part or all of the upper surface of the resin member 220 or the reflective member 245 may be extended, thereby preventing a problem of light leakage or a hot spot.

28 will be described with reference to FIGS. 25 to 27, a reflective member 240 may be disposed on the surface of the resin member 220. The reflective member 240 may be disposed on an upper surface, an inner side, and an outer side of the resin member 220. The inner surface may be a surface facing the exit surface S1 of the light source 100, and the outer side surface may be a surface facing the opposite side (eg, rear) of the exit surface S1 of the light source 100. The reflective member 240 may be disposed on the upper surface or/and the inner surface of the resin member 220 to improve light reflection efficiency.

A portion 222 of the resin member 220 at this time may be disposed on the light guide member 250. When the reflective member 245 of FIG. 27 is an adhesive resin, the reflective member 240 may extend outside the reflective member 245 having adhesive properties.

As shown in FIG. 29, a reflective member 240 is disposed on the surface of the resin member 220, and the reflective member 240 is disposed on the surface of the resin member 220, and the upper surface of the support member 210 and the light guide member ( 250) can be disposed on the top surface. In this case, the inner surface (or one surface) of the resin member 220 may be disposed in a direction perpendicular to the incident surface of the light guide member 250. In this case, a structure in which the resin member 220 covers the light guide member 250 may be prevented.

As shown in FIG. 30, the resin member 220 may be provided as a reflective surface Rb having an inclined outer surface between the light source 100 and the light guide member 250. The inclined reflective surface Rb may be provided with a gradually thicker thickness as a part of the resin member 220 moves away from an upper end of the incident surface of the light guide member 250. One end of the resin member 220 is provided at the same height as the top of the incident surface of the light guide member 250, so that the amount of light to the incident surface of the light guide member 250 may be increased.

As shown in FIG. 31, the resin member 220 may include a reflective surface Ra having a convex curved surface from an upper surface to an incident surface of the light guide member. A reflective member 240 may be disposed on the reflective surface Ra. The reflective member 240 may be disposed on an upper surface and an inner surface of the resin member 220. Since the reflective member 240 is provided along the surface of the resin member 220 to the top of the incident surface of the light guide member 250, the light emitted through the light source 100 can be reflected in the direction of the light guide member 250. have.

The embodiment(s) or/and modified examples disclosed above may include the configurations described below, or examples to be described later may include the configurations disclosed above.

As shown in FIGS. 32 and 35, the light blocking member 270 may be disposed on the resin member 220 and the adhesive member 230 disposed between the light source 100 and the light guide member 250. The light blocking member 270 may extend from the resin member 220 and the adhesive member 230 to the light incident portion of the light guide member 250. The light blocking member 270 diffuses the light generated by the light source 100 to block a problem of being exposed as a hot spot from the outside. A reflective member 240 may be partially disposed in a region between the light blocking member 270 and the resin member 220 or/and the adhesive member 230. The light blocking member 270 blocks the light incident on the light incident portion of the light guide member 250 from traveling to the outside, thereby preventing hot spots on the light incident portion of the light guide member 250.

As shown in FIG. 33, the light blocking member 270 may be disposed on the resin member 220 disposed between the light source 100 and the light guide member 250 and may extend onto the light guide member 250. The light blocking member 270 blocks the light incident on the light incident portion of the light guide member 250 from traveling to the outside, thereby preventing hot spots on the light incident portion of the light guide member 250. The adhesive member 230 is disposed under the resin member 220 and may be adhered between the resin member 220 and the light guide member 250. As shown in FIG. 34, when there is no adhesive member 230, a light blocking member may be disposed on the resin member 220 and may extend onto the light guide member 250. In addition, by disposing a reflective layer 260 between the support member 210 and the light guide member 250, the light reflected from the light blocking member 270 or the light emitted from the light source 100 through the resin member 220 is reflected. Can be guided to the top.

As shown in FIG. 35, the light blocking member 270 may contact the substrate 211A when the substrate 211A is disposed perpendicular to the support member 210. Also, in this case, the support member 210 and the light blocking member 270 may be disposed parallel to each other. As shown in FIG. 36, the adhesive member 230 may be disposed on the light guide member 250 on one surface of the resin member 220. The light blocking member 270 may be disposed on the upper surface of the resin member 220 and on the adhesive member 230 disposed on the light guide member 250. The light blocking member 270 may extend onto the light guide member 250. The lower surface length or area of the light blocking member 270 disclosed in FIGS. 31 to 36 is disposed larger than the upper surface length or the upper surface area of the resin member 220 so that the resin member 220 on the area of the light blocking member 270 It is possible to minimize the occurrence of hot spots caused by. The light blocking member 270 may be adhered to or contact with the resin member 220.

Referring to FIG. 37, a light source 100 may be bonded with a bonding unit 129 on a substrate 211 as a support member and molded with a resin member 220. An adhesive member 230 may be disposed between the resin member 220 and the light guide member 250. The reflective member 240 may be disposed on a portion of the upper surface of the light guide member 250 or an adhesive layer 235A may be disposed on a portion of the lower portion. The adhesive layer 235A may separate the light guide member 250 from the upper surface of the substrate 211. The adhesive layer 235A may be spaced apart from one end portion of the light guide member 250 in the direction of the upper surface of the resin member 220.

A resin member 220, an adhesive member 230, or/and an adhesive layer 235A may be disposed on the substrate 211. The adhesive member 230 and the adhesive layer 235A may seal the incident surface or the incident portion region of the light guide member 250. Accordingly, light loss at the interface J2 between the adhesive member 230 and the incident surface of the light guide member 250 can be reduced.

The light source 100 may be bonded to the substrate 211 with a bonding unit 129, and may include a light emitting chip 123 and a molding member 125 in the body 121. The body 121 may be made of a non-metallic material or a reflective resin material, which will be described later. The molding member 125 may be made of a transparent resin material. The light-emitting chip 123 may be located at the center of the light source 100, and the light-emitting chip 123 may be horizontally overlapped with the center of the light guide member 250 or disposed on the same center line. . The width of the light emitting chip 123 in the vertical direction may be smaller than the thickness of the light guide member 250 and may correspond to the center of the incident surface of the light guide member 250. Accordingly, the light emitted through the light emitting chip 123 may travel to the center of the incident surface of the light guide member 250, thereby improving the incident efficiency of light. In this case, the refractive index of the molding member 125 and the resin member 220 may be the same.

38 is a reference to the description of FIG. 14, wherein the light source 101 is disposed on a substrate 211A disposed in a vertical direction, and the light source 101 is a light emitting chip 123 disposed in the body 121 ) And a molding member 125. The light emitting chip 123 may correspond to the center of the incident surface of the light guide member 250. A resin member 220 or/and an adhesive member 230 may be disposed between the light source 101 and the light guide member 250.

39 is a structure in which an adhesive member is not provided in FIG. 37, and an interface in which the resin member 220 and the light guide member 250 are bonded or contacted may be formed. The resin member 220 seals the light source 100, and a reflective member, an adhesive member, and/or an adhesive layer disclosed above may be disposed on the upper surface or/and the lower surface of the light guide member 250. The light emitting chip 123 of the light source 100 disposed in the resin member 220 may be disposed on the same line as the center of the incident surface of the light guide member 250 or may be disposed correspondingly. Accordingly, light generated from the side view type light source 100 can be effectively incident on the incident surface of the light guide member 250. Here, the light guide member 250 and the reflective layer 260 may include regions that are separated from the substrate or partially bent.

As shown in FIG. 40, a plurality of light sources 100 may be arranged on one surface of the light guide member 250, that is, the incident surface. The plurality of light sources 100 may be disposed on the support member 210 or/and the substrate. An adhesive member 230 may be disposed between the resin member 220 and the light guide member 250 or may be provided without an adhesive member. The central axis Y0 of the light source 100 may be a direction orthogonal to the incident surface of the light guide member 250.

A distance between the plurality of light sources 100 may be greater than a distance between the light source 100 and the light guide member 250. At this time, the distance (D2) to the incident surface of the light guide member 250 on a straight line connecting the center of the light source 100 may be a region in which light(s) emitted from the plurality of light sources 100 can be mixed. have. The distance (D2) is a straight line connecting the centers of the plurality of light sources 100 and the point of the light guide member 250 perpendicular to the center of the straight line with respect to the straight line based on the center of the light source 100 It can be found through the angle between the extended straight lines. Here, the inner angle of a straight line extending from the light source 100 to the point of the light guide member 250 may range from 20 degrees to 30 degrees when the directivity angle of the light source 100 is 120 degrees to 140 degrees. Therefore, the square root of the distance D2 is equal to the distance between the light sources 100, or the distance is D1/2, and since the inner angle is 20 degrees to 30 degrees, the distance D2 is D1/2× It can be obtained as (tan θ), where θ is the inner angle. The distance D2 may be a section in which light can be mixed, and may be 2 mm or less.

As shown in FIG. 41, resin members 220 may be disposed on both surfaces of the light guide member 250, and first and second light sources 100 and 100A may be disposed in each resin member 220. An adhesive member may be disposed between the resin member 220 and the light guide member 250 or may be provided without an adhesive member. As shown in FIGS. 40 and 41, the light sources 100 and 100A may be provided in a length direction longer than a width direction. Here, the length direction may be a direction in which light sources are arranged, and the width direction may be a direction opposite to the light guide member 250.

42 may include a lighting device having an optical member. The optical member 290 may be applied to the embodiment(s) or/and the modified example(s) disclosed above. The optical member 290 may include at least one of a prism sheet or a diffusion sheet. The optical member may be removed. Convex hemispherical convex portions may be arranged on an upper surface or/and a lower surface of the optical member 290. The optical member 290 may include a lens cover, and the lens cover may be formed of a transparent plastic material or a resin material to diffuse or refract incident light.

The optical member 290 may be disposed to extend from the resin member 220 to the other end of the light guide member 250. As another example, the optical member 290 may be disposed from one end to the other end of the light guide member 250 to emit a surface light source of the light guide member 250.

43 illustrates another example, a reflective sheet 280 may be disposed on the light guide member 250. A light guide member 250 may be disposed between the reflective sheet 280 and the reflective layer 260. Accordingly, the light emitted from the light source 100 disposed in the resin member 220 is guided along the light guide member 250 through the resin member 220, or/and the adhesive member 230, and the reflective sheet ( It may be re-reflected by 280 and the reflective layer 260. In this case, the light guide member 250 may provide a line light source through the other side of the incident surface. That is, a surface light source having a line width equal to the thickness of the light guide member 250 may be provided.

A portion of the adhesive member 230 disclosed above may extend on an upper surface or a lower surface of the reflective sheet 280, or/and an upper surface or a lower surface of the light guide member 250. In the absence of the adhesive member 230, a part of the resin member 220 may extend to an upper surface or a lower surface of the reflective sheet 280, or/and an upper surface or a lower surface of the light guide member 250. As another example, a reflective member may be further disposed on an upper surface of the adhesive member 230 or/and the resin member 220 or on one surface in a direction in which light is emitted. The adhesive member 230 or/and the resin member 220 may include the reflective surface disclosed above.

44 is a plan view showing an example of a light source applied to a lighting device according to an embodiment of the present invention, and FIG. 45 is an example of a device in which the light source of FIG. 25 is disposed on a substrate.

44 and 45, the light source 100 includes a body 10 having a cavity 20, a plurality of lead frames 30 and 40 in the cavity 20, and the plurality of lead frames 30, It includes one or a plurality of light emitting chips 71 disposed on at least one of 40). This light source 100 is an example of the light source disclosed in the above embodiment, and may be implemented as a side-emitting type package.

The light source 100 may have a length in the second direction X (or a length of a long side) that is 3 times or more, for example, 4 times or more than a width of the first direction Y. The length in the second direction may be 2.5mm or more, for example, 2.7mm to 6mm or 2.5mm to 3.2mm. The light source 100 may reduce the number of the light sources 100 in the second direction by providing a length in the second direction X. Since the light source 100 may provide a relatively thin thickness T1, the thickness of the lighting device having the light source 100 may be reduced. The thickness of the light source 100 may be 2 mm or less, for example, 1.5 mm or less, or in the range of 0.6 mm to 1 mm. The body 10 has a cavity 20 and the length of the second direction X may be three times or more than the thickness of the body 10 (eg, T1), You can widen the directing angle.

At least one or a plurality of lead frames 30 and 40 are disposed on the body 10. At least one or a plurality of lead frames 30 and 40 are disposed on the bottom of the cavity 20. For example, a first lead frame 30 and a second lead frame 40 are coupled to the body 10.

The body 10 may be formed of an insulating material. The body 10 may be formed of a reflective material. The body 10 may be formed of a material having a reflectance higher than transmittance, for example, a material having a reflectance of 70% or more with respect to the wavelength emitted from the light emitting chip. When the reflectance of the body 10 is 70% or more, the body 10 may be defined as a non-transmissive material or a reflective material. The body 10 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA). The body 10 may be formed of a silicone-based, epoxy-based, or thermosetting resin including a plastic material, or a material having high heat resistance and high light resistance. The body 10 includes a white resin. In the body 10, an acid anhydride, an antioxidant, a release material, a light reflecting material, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added. Contains. The body 10 may be molded by at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an acid composed of hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride 4-methylhexahydro phthalic anhydride, etc. Anhydride was added DBU (1,8-Diazabicyclo(5,4,0)undecene-7) as a curing accelerator to the epoxy resin, ethylene glycol, titanium oxide pigment, and glass fiber as a cocatalyst, and partially by heating. A solid epoxy resin composition obtained by curing and forming a B-stage may be used, but is not limited thereto. The body 10 may be suitably mixed with at least one selected from the group consisting of a diffusing agent, a pigment, a fluorescent material, a reflective material, a light-shielding material, a light stabilizer, and a lubricant with a thermosetting resin.

The body 10 may include a reflective material, for example, a resin material to which a metal oxide is added, and the metal oxide may include at least one of TiO ₂ , SiO ₂ , and Al ₂ O ₃ . The body 10 can effectively reflect incident light. As another example, the body 10 may be formed of a light-transmitting resin material or a resin material having a phosphor that converts the wavelength of incident light.

The first surface portion 15 of the body 10 may be a surface on which the cavity 20 is disposed, and may be a surface from which light is emitted. The second surface portion of the body 10 may be a surface opposite or a rear surface of the first surface portion 15.

The first lead frame 30 includes a first lead part 31 disposed on the bottom of the cavity 20, and a first bonding disposed in a first outer area of the third surface part 11 of the body 10 It includes a part 32 and a first heat dissipation part 33 disposed on the third side part 13 of the body 10. The first bonding part 32 is bent from the first lead part 31 in the body 10 and protruded to the third surface part 11, and the first heat dissipating part 33 is the first It can be bent from the bonding part 32. The first outer region of the third surface portion 11 may be a region adjacent to the third side surface portion 13 of the body 10.

The second lead frame 40 includes a second lead part 41 disposed on the bottom of the cavity 20, and a second bonding disposed in a second outer area of the third surface part 11 of the body 10 It includes a part 42 and a second heat dissipation part 43 disposed on the fourth side part 14 of the body 10. The second bonding part 42 may be bent from the second lead part 41 within the body 10, and the second heat dissipating part 43 may be bent from the second bonding part 42. . The second outer region of the third surface portion 11 may be a region adjacent to the fourth side surface portion 14 of the body 10.

The gap 17 between the first and second lead portions 31 and 41 may be formed of the material of the body 10, and may be the same horizontal surface as the bottom of the cavity 20 or protrude, However, it is not limited thereto. As another example, two or more lead frames may be disposed in the body 10, for example, three lead frames are disposed, one of which may be a heat dissipation frame or a positive polarity frame, and the other two It can be of other negative polarity.

Here, the light emitting chip 71 may be disposed on, for example, the first lead portion 31 of the first lead frame 30, and the wire 72, the first and second lead portions 31 and 41 73), or may be connected to the first lead part 31 with an adhesive and connected to the second lead part 41 with a wire. The light emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light emitting chip 71 may be mounted in a flip chip method. The light emitting chip 71 may selectively emit light within a wavelength range of ultraviolet to visible light. The light emitting chip 71 may emit light with an ultraviolet or blue peak wavelength, for example. The light emitting chip 71 may include at least one of a group II-VI compound and a group III-V compound. The light emitting chip 71 may be formed of, for example, a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof. A plurality of light emitting chips 71 may be connected in series, or a plurality of light emitting chips 71 may be connected in parallel. One or a plurality of light emitting chips 71 disposed in the cavity 20 of the light source 100 according to the embodiment may be disposed. The light emitting chip 71 may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip.

Looking at the inner side of the cavity 20, the inner side disposed around the cavity 20 may be inclined with respect to a horizontal straight line of the upper surfaces of the lead frames 30 and 40. The inner side of the cavity 20 may have a vertically stepped area from the first surface 15 of the body 10. The stepped region may be disposed to be stepped between the first surface portion 15 and the inner surface of the body 10. The stepped region may control a directivity characteristic of light emitted through the cavity 20.

A molding member 81 is disposed in the cavity 20 of the body 11, and the molding member 81 includes a light-transmitting resin such as silicone or epoxy, and may be formed in a single layer or multiple layers. A phosphor for changing a wavelength of light emitted from the molding member 81 or the light emitting chip 71 may be included, and the phosphor excites a part of light emitted from the light emitting chip 71 to have a different wavelength. It is emitted as light. The phosphor may be selectively formed from quantum dots, YAG, TAG, Silicate, Nitride, and Oxy-nitride-based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding member 81 may be formed in a flat shape, a concave shape, a convex shape, or the like, but is not limited thereto. As another example, a translucent film having a phosphor may be disposed on the cavity 20, but the embodiment is not limited thereto.

A lens may be further formed on the upper portion of the body 10, and the lens may include a concave or/and convex lens structure, and a light distribution of light emitted from the light source 100 may be adjusted. have.

A semiconductor device such as a light-receiving device and a protection device may be mounted on the body 10 or any one lead frame, and the protection device may be implemented as a thyristor, a Zener diode, or a TVS (transient voltage suppression), The Zener diode protects the light emitting chip from electro static discharge (ESD).

Referring to FIG. 45, at least one or a plurality of light sources 100 are disposed on the support member 210, and a protective layer or/and a reflective layer 260 is disposed around the lower circumference of the light source 100. The light source 100 is an example of the light source disclosed in the embodiment, and emits light in the direction of the central axis Y0, and may be applied to the lighting device disclosed above. The first and second lead portions 33 and 43 of the light source 100 are bonded to the electrode patterns 213 and 215 of the substrate 210 with solder or conductive tape, which are conductive adhesive members 217 and 219.

46, a plurality of lead frames 51, 52, 53, 54, 55, 56 are disposed on the body 10 or the bottom of the cavity, and the plurality of lead frames 51, 52, 53, 54, Among 55 and 56, the first to third light emitting chips 72, 73 and 74 are disposed on the second, third, and fifth frames 52, 53 and 55, respectively, and the first light emitting chip 72 is And the second frame (51, 52) is connected to the wire (W1) or / and a bonding material, the second light emitting chip 74 is a wire (W1) or / and the third and fourth frames (53, 54) It is connected by a bonding material, and the third light emitting chip 74 may be connected to the fifth and sixth frames 55 and 56 by a wire W1 or/and a bonding material.

A plurality of lead portions 61,62,63,64,65,66 are disposed on the lower surface of the body 10, for example, on the first surface portion, and each of the lead portions 61,62,63,64,65, 66) may be connected to the first to sixth frames 51, 52, 53, 54, 55, and 56, respectively. Accordingly, the first to third light emitting chips 72, 73, and 74 may emit different colors, for example, red, blue, and red light, and may be individually driven. The length L2 of the cavity may be smaller than the length L1 of the body 10. Since these light-emitting chips 72, 73, 74 emit light of different colors or different peak wavelengths, the distance to the light guide member is separated by a resin member or/and an adhesive member to provide a mixed color area of light, By removing the air gap, it is possible to improve light extraction efficiency.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, etc. illustrated in each embodiment may be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

Claims (11)

Support member;
A light source disposed on the intellectual material member;
A resin member covering the light source;
A light guide member spaced apart from the light source; And
Including an adhesive member bonded between the light guide member and the resin member,
The thickness of the light guide member is smaller than the thickness of the light source,
The light source includes an exit surface corresponding to the incident surface of the light guide member,
The resin member and the adhesive member is a lighting device comprising a transparent material. Support member;
A light source disposed on the support member; And
It includes a light guide member spaced apart from the light source,
The thickness of the light guide member is smaller than the thickness of the light source,
The light source includes an exit surface corresponding to the incident surface of the light guide member,
Part of the resin member is in contact with the exit surface of the light source and the incident surface of the light guide member,
The resin member is a lighting device comprising a transparent material. The method according to claim 1 or 2,
The light guide member is disposed on the support member,
An upper part of the support member includes a reflective layer or a protective layer made of a reflective material. The method according to claim 1 or 2,
The support member includes a substrate electrically connected to the light source,
The resin member is disposed on the substrate,
A lighting device comprising a support portion overlapping the light guide member in a vertical direction and a reflective layer between the support portion and the light guide member. The method according to claim 1 or 2,
It includes a reflective member on the upper surface of the resin member,
The reflective member is a lighting device extending over the light guide member. The method of claim 2,
A lighting device comprising an adhesive member disposed on an upper portion adjacent to the incident surface of the light guide member and in contact with the inner surface of the resin member, and a reflective member on the adhesive member. The method according to claim 1 or 2,
A lighting device comprising at least one of an adhesive layer and a reflective member at a lower portion adjacent to the incident surface of the light guide member. The method according to claim 1 or 2,
A lighting device in which a part of the resin member extends above the light guide member. The method of claim 2,
The resin member is a lighting device including a reflective surface having a convex upper surface between the light guide member and the light source. The method according to claim 1 or 2,
The light source is a side type package that is bonded on the support member and emits light in the direction of the light guide member,
A lighting device in which a plurality of light sources are arranged on an incident surface of the light guide member. The method according to claim 1 or 2,
The light guide member is a lighting device of the same material as the resin member.

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