KR20130053108A - Apparatus and method for treating substrate - Google Patents

Abstract

PURPOSE: A substrate processing apparatus and a substrate processing method are provided to reduce processing time by moving a door through a guide rail and a pressurizing member. CONSTITUTION: A housing(3100) includes an opening part and provides a processing space. A guide rail is vertically arranged on a surface with the opening part. A door(3200) is installed in the guide rail to face the opening part and opens or closes the housing. A door driving unit moves the door along the guide rail. A support member(3300) is installed on the surface of the door facing the opening part and receives a substrate. [Reference numerals] (3220) Holder driver; (3420) Door driver

Description

Substrate processing apparatus and substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus for performing a supercritical process and a substrate processing method using the same.

Semiconductor devices are manufactured by forming circuit patterns on a substrate through various processes including photolithography. Particles (particles), organic contaminants, metal impurities, etc. are generated during the manufacturing process, and these foreign substances cause defects on the substrate, which directly affects the yield of semiconductor devices. Therefore, the semiconductor manufacturing process necessarily involves a cleaning process for removing foreign matter from the substrate.

In general, the cleaning process removes foreign substances on the substrate with a detergent, washes the substrate with DI-water (deionized water), and then removes the pure water with an organic solvent such as isopropyl alcohol (IPA) having a low surface tension. Subsequent to evaporation, the substrate is dried in order. However, such a conventional drying method has a low drying efficiency in the case of a semiconductor device having a fine circuit pattern, and a pattern collapse that frequently damages the circuit pattern is caused by surface tension of a relatively weak organic solvent during the drying process. I have a problem.

Accordingly, the supercritical drying process for drying the substrate using a supercritical fluid for semiconductor devices having a line width of 30 nm or less is gradually replacing the existing drying process. Supercritical fluid is a fluid having the properties of gas and liquid at the same time above the critical temperature and the critical pressure, excellent diffusion and penetration, high dissolving power, almost no surface tension can be very useful for drying the substrate. However, such a supercritical process requires a high-temperature, high-pressure supercritical environment, and recently, studies on the structure of a chamber capable of providing such an environment have been actively conducted.

One object of the present invention is to provide a substrate processing apparatus and a substrate processing method for performing a supercritical process.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method for improving space efficiency.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method, which shorten the process time.

The problem to be solved by the present invention is not limited to the above-described problem, and the problems not mentioned may be clearly understood by those skilled in the art from the present specification and the accompanying drawings. will be.

The present invention provides a substrate processing apparatus.

One aspect of the substrate processing apparatus according to the present invention, the opening is formed on one side, the housing providing a space in which the process is performed; A guide rail disposed in a direction perpendicular to a surface on which the opening is formed; A door disposed on the guide rail to face the opening and opening and closing the housing; And a door driver for moving the door along the guide rail.

The substrate processing apparatus may further include a support member installed on a surface facing the opening of the door and on which the substrate is seated.

The support member may be located inside or outside the housing as the door moves.

The substrate processing apparatus may further include a pressing member coupled to the housing and configured to apply pressure to the door to seal the housing.

The pressing member, the cylinder coupled to the housing; A rod moving in parallel with a moving direction of the door by the cylinder; And a head formed at one end of the rod, wherein the first head hole corresponding to the shape of the head is formed in the door, and the head is connected to the door through the first head hole in a direction thereof. Pressure may be applied to the opposite side of the face passing through or facing the opening of the door.

The door further includes a head holder installed on the opposite surface, wherein the head holder is formed with a second head hole into which the head is inserted, and may rotate the head inserted into the second head hole. .

The head holder may rotate the head 90 degrees.

The substrate processing apparatus includes a heating member for heating the inside of the housing; A supply line for supplying a supercritical fluid to the housing; And an exhaust line for exhausting the supercritical fluid from the housing.

Another aspect of the substrate processing apparatus according to the present invention, the transfer chamber for transferring the substrate; And a process chamber disposed on the side of the transfer chamber, wherein the process chamber comprises: a guide rail disposed parallel to the side of the transfer chamber; A housing having an opening formed at one side perpendicular to an arrangement direction of the guide rail and providing a space in which a process is performed; A door disposed on the guide rail to face the opening and opening and closing the housing; And a door driver for moving the door along the guide rail.

The substrate processing apparatus may include a plurality of the process chambers stacked on each other.

The process chamber may include a heating member for heating the inside of the housing; A supply line for supplying a supercritical fluid to the housing; And an exhaust line for exhausting the supercritical fluid from the housing. The supercritical process may be performed on the substrate.

The process chamber may further include a support member installed on a surface facing the opening of the door and on which the substrate is seated.

The pressing member, the cylinder coupled to the housing; A rod moving in parallel with a moving direction of the door by the cylinder; And a head formed at one end of the rod, wherein the first head hole corresponding to the shape of the head is formed in the door, and the head is connected to the door through the first head hole in a direction thereof. Pressure may be applied to the opposite side of the face passing through or facing the opening of the door.

The door further includes a head holder installed on the opposite surface, wherein the head holder is formed with a second head hole into which the head is inserted, and may rotate the head inserted into the second head hole. .

The present invention provides a substrate processing method.

One aspect of the substrate processing method according to the invention, the step of mounting the substrate on the support member provided on the surface facing the opening formed on one side of the housing of the door; A door driver moving the door according to a guide rail disposed perpendicular to one side of the housing such that the substrate is located inside the housing; And closing the housing by applying pressure to an opposite surface of the pressing member coupled to the housing to face the opening of the door.

The pressing member, the cylinder coupled to the housing; A rod moving in parallel with a moving direction of the door by the cylinder; And a head formed at one end of the rod, wherein in the step of moving the door by the door driver, the head passes through the door through a head hole formed in the door, and on the opposite side of the door. And rotating the head passing through the door by an installed head holder, wherein the pressing member seals the housing, and in contact with the opposite surface of the door as the head rotates to apply pressure. have.

According to the present invention, the area of the opening is small, so that the housing is sealed with a relatively small force in a high pressure environment.

According to the present invention, the housing occupies little space up and down, thereby maximizing space efficiency.

According to the present invention, by moving the door in parallel with the guide rail and the pressing member, the loading of the substrate is faster, and the processing time is shortened.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a graph of the phase change of carbon dioxide.]
2 is a plan view of an embodiment of a substrate processing apparatus.
3 is a cross-sectional view of the substrate treating apparatus of FIG. 2.
4 is a cross-sectional view of the first process chamber of FIG. 2.
5 is a perspective view of the second process chamber of FIG. 2.
6 is a cross-sectional view of the second process chamber of FIG. 2.
7 is a flowchart of an embodiment of a substrate processing method.
8 is a flowchart of another embodiment of a substrate processing method.
9 to 12 are operation diagrams according to the substrate processing method of FIG.

The terms and accompanying drawings used herein are for the purpose of illustrating the present invention easily, and the present invention is not limited by the terms and drawings.

The detailed description of known techniques which are not closely related to the idea of the present invention among the techniques used in the present invention will be omitted.

Hereinafter, the substrate processing apparatus 100 according to the present invention will be described.

The substrate treating apparatus 100 may perform a supercritical process of treating the substrate S using a supercritical fluid.

Here, the substrate S is a comprehensive concept including both a semiconductor device, a flat panel display (FPD), and other substrates used for manufacturing an article having a circuit pattern formed on a thin film. Examples of such a substrate S include various wafers including silicon wafers, glass substrates, organic substrates, and the like.

Supercritical fluid refers to a phase having both the properties of a gas and a liquid that are formed when a critical temperature and a critical pressure exceeding a critical pressure are reached. Supercritical fluids have molecular densities close to liquids and viscosities close to gases, which is very effective in chemical reactions due to their excellent diffusivity, penetration, and solubility, and do not apply interfacial tension to microstructures because they have little surface tension. Has characteristics.

Supercritical processes are carried out using the characteristics of these supercritical fluids. Representative examples include supercritical drying processes and supercritical etching processes. Hereinafter, the supercritical process will be described based on the supercritical drying process. However, since this is only for ease of description, the substrate processing apparatus 100 may perform other supercritical processes other than the supercritical drying process. Further, the substrate processing apparatus 100 may be used for other processes besides the supercritical process.

The supercritical drying process may be performed by dissolving the organic solvent remaining in the circuit pattern of the substrate S as a supercritical fluid to dry the substrate S. It is excellent in drying efficiency and prevents collapse. There are advantages to it. As the supercritical fluid used in the supercritical drying process, a material miscible with an organic solvent may be used. For example, supercritical carbon dioxide (scCO2) can be used as the supercritical fluid.

1 is a graph relating to the phase change of carbon dioxide.

Carbon dioxide has a critical temperature of 31.1 ℃, the critical pressure of 7.38Mpa is relatively low, making it easy to supercritical state, easy to control the phase change by adjusting the temperature and pressure, and has the advantage of low cost. In addition, carbon dioxide is harmless to humans due to its nontoxicity, nonflammability, and inertness. Supercritical carbon dioxide has a diffusion coefficient of 10 to 100 times higher than water or other organic solvents, resulting in rapid penetration. The substitution of the solvent is quick, and there is little surface tension, which has advantageous properties for use in drying the substrate S having a fine circuit pattern. In addition, carbon dioxide can be recycled as a by-product of various chemical reactions, and can be used in a supercritical drying process, and then converted into a gas to separate and reuse organic solvents, which is less burdensome in terms of environmental pollution.

Hereinafter, an embodiment of the substrate processing apparatus 100 according to the present invention will be described. The substrate processing apparatus 100 according to an embodiment of the present invention may perform a cleaning process including a supercritical drying process.

2 is a plan view of an embodiment of the substrate processing apparatus 100, and FIG. 3 is a cross-sectional view of the substrate processing apparatus 100 of FIG.

The substrate processing apparatus 100 includes an index module 1000 and a process module 2000.

The index module 1000 may receive the substrate S from the outside and convey the substrate S to the process module 2000, and the process module 2000 may perform a supercritical drying process.

The index module 1000 is an equipment front end module (EFEM) and includes a load port 1100 and a transfer frame 1200.

In the load port 1100, a container C in which the substrate S is accommodated is placed. As the container C, a front opening unified pod (FOUP) may be used. The container C may be brought into or out of the load port 1100 from the outside by an overhead transfer (OHT).

The transfer frame 1200 conveys the substrate S between the container C placed on the load port 1100 and the process module 2000. The transport frame 1200 includes an index robot 1210 and an index rail 1220. The index robot 1210 may move on the index rail 1220 and carry the substrate S.

The process module 2000 is a module that actually performs a process and includes a buffer chamber 2100, a transfer chamber 2200, a first process chamber 2300, and a second process chamber 3000.

The buffer chamber 2100 provides a space in which the substrate S to be temporarily transported between the index module 1000 and the process module 2000 temporarily stays. The buffer chamber 2100 may be provided with a buffer slot 2110 on which the substrate S is placed. For example, the index robot 1210 may withdraw the substrate S from the container C and place it in the buffer slot 2110, and the transfer robot 2210 of the transfer chamber 2200 may be placed in the buffer slot 2110. The laid substrate S may be taken out and conveyed to the first process chamber 2300 or the second process chamber 3000. A plurality of buffer slots 2110 may be provided in the buffer chamber 2100.

The transfer chamber 2200 conveys the substrate S between the buffer chamber 2100, the first process chamber 2300, and the second process chamber 3000 arranged around the periphery. The transfer chamber 2200 may include a transfer robot 2210 and a transfer rail 2220. The transfer robot 2210 may move on the transfer rail 2220 and carry the substrate S.

The first process chamber 2300 and the second process chamber 3000 may perform a cleaning process. In this case, the cleaning process may be sequentially performed in the first process chamber 2300 and the second process chamber 3000. For example, a chemical process, a rinse process, and an organic solvent process may be performed during the cleaning process in the first process chamber 2300, and then a supercritical drying process may be performed in the second process chamber 3000.

The first process chamber 2300 and the second process chamber 3000 are disposed on the side of the transfer chamber 2200. For example, the first process chamber 2300 and the second process chamber 3000 may be disposed to face each other on the other side of the transfer chamber 2200.

In addition, a plurality of first process chambers 2300 and second process chambers 3000 may be provided in the process module 2000. The plurality of process chambers 2300 and 3000 may be arranged in a row on the side of the transfer chamber 2200, stacked up and down, or a combination thereof.

Of course, the arrangement of the first process chamber 2300 and the second process chamber 3000 is not limited to the above-described example, in consideration of various factors such as a foot print and process efficiency of the substrate processing apparatus 100. May be changed as appropriate.

Hereinafter, the first process chamber 2300 will be described.

4 is a cross-sectional view of the first process chamber 2300 of FIG. 2.

The first process chamber 2300 may perform a chemical process, a rinse process, and an organic solvent process. Of course, the first process chamber 2300 may selectively perform only some of them. Here, the chemical process is a process of removing foreign substances on the substrate S by providing a cleaner to the substrate S, and the rinsing process is a process of washing the detergent remaining on the substrate S by providing a rinse agent to the substrate. The organic solvent step is a step of providing an organic solvent to the substrate S to replace the rinse agent remaining between the circuit patterns of the substrate S with an organic solvent having a low surface tension.

The first process chamber 2300 includes a support member 2310, a nozzle member 2320, and a recovery member 2330.

The support member 2310 may support the substrate S and rotate the supported substrate S. FIG. The support member 2310 may include a support plate 2311, a support pin 2312, a chucking pin 2313, a rotation shaft 2314, and a rotation driver 2315.

The support plate 2311 has an upper surface of the same or similar shape as the substrate S, and a support pin 2312 and a chucking pin 2313 are formed on the upper surface of the support plate 2311. The support pin 2312 may support the substrate S, and the chucking pin 2313 may fix the supported substrate S.

The rotating shaft 2314 is connected to the lower portion of the support plate 2311. The rotary shaft 2314 rotates the support plate 2311 by receiving a rotational force from the rotary driver. Accordingly, the substrate S mounted on the support plate 2311 may rotate. In this case, the chucking pin 2313 may prevent the substrate S from leaving the correct position.

The nozzle member 2320 injects a medicament to the substrate (S). The nozzle member 2320 includes a nozzle 2321, a nozzle bar 2232, a nozzle shaft 2323, and a nozzle shaft driver 2324.

The nozzle 2321 injects a medicament onto the substrate S mounted on the support plate 2311. The agent may be a detergent, a rinse agent or an organic solvent. Here, the cleaning agent may be a solution in which ammonia (NH 4 OH), hydrochloric acid (HCl) or sulfuric acid (H 2 SO 4) is mixed with hydrogen peroxide (H 2 O 2) solution or hydrogen peroxide solution, or a hydrofluoric acid (HF) solution. In addition, pure water may be used as a rinse agent. As the organic solvent, isopropyl alcohol, ethyl glycol, 1-propanol, tetra hydraulic franc, 4-hydroxyl, 4-methyl, 2-pentanone, 1-butanol, 2-butanol, methanol, ethanol, n-propyl alcohol or dimethylether Steam can be used.

Such a nozzle 2321 is formed at the bottom of one end of the nozzle bar 2232. The nozzle bar 2232 is coupled to the nozzle shaft 2323, and the nozzle shaft 2323 is provided to be able to lift or rotate. The nozzle shaft driver 2324 may adjust the position of the nozzle 2321 by lifting or rotating the nozzle shaft 2323.

The recovery member 2330 recovers the medicine supplied to the substrate S. When the medicine is supplied to the substrate S by the nozzle member 2320, the support member 2310 may rotate the substrate S to uniformly supply the medicine to the entire area of the substrate S. When the substrate S rotates, the medicament scatters from the substrate S, and the medicament scattering may be recovered by the recovery member 2330.

The recovery member 2330 may include a recovery container 2331, a recovery line 2333, a lifting bar 2334, and a lifting driver 2335.

The recovery container 2331 is provided in an annular ring shape surrounding the support plate 2311. The recovery container 2331 may be a plurality, and the recovery container 2331 may be provided in a ring shape away from the support plate 2311 in order when viewed from the top, and may be provided at a distance from the support plate 2311. 2331), the higher the height is provided. As a result, a recovery port 2332 through which the chemicals scattered from the substrate S flows into the space between the recovery containers 2331 is formed.

A recovery line 2333 is formed on the bottom surface of the recovery container 2331. The recovery line 2333 supplies a medicine regeneration system (not shown) for regenerating the medicine recovered in the recovery container 2331.

The lifting bar 2334 is connected to the recovery container 2331 to receive power from the lifting driver 2335 to move the recovery container 2331 up and down. The lifting bar 2334 may be connected to the recovery container 2331 disposed at the outermost part when the recovery container 2331 is plural. The elevator driver 2335 may adjust the recovery port 2332 through which the chemicals scattered among the plurality of recovery ports 2332 are lifted by elevating the recovery container 2331 through the lifting bar 2334.

Hereinafter, the second process chamber 3000 will be described.

5 is a perspective view of the second process chamber 3000 of FIG. 2, and FIG. 6 is a cross-sectional view of the second process chamber 3000 of FIG. 2.

The second process chamber 3000 may perform a supercritical drying process. The second process chamber 3000 includes a housing 3100, a door 3200, a support member 3300, a door driving member 3400, a pressing member 3500, a heating member 3110, a supply line 3120, and an exhaust. Line 3130.

The housing 3100 provides a space in which the supercritical drying process is performed. The housing 3100 is provided of a material that can withstand high pressures above a critical pressure. An opening 3101 is formed at one side of the housing 3100. The opening 3101 may be formed at one side of the housing 3100 perpendicular to one side where the second process chamber 3000 of the transfer chamber 2200 is disposed.

The substrate S may be carried into or out of the housing 3100 through the opening 3101. Here, the substrate S may be carried in the substrate S in the state in which the organic solvent remains after the organic solvent process in the first process chamber 2300.

The door 3200 is disposed to face the opening 3101. The door 3200 may move to be spaced or in close contact with the opening 3101 to open and close the housing 3100.

The support member 3300 supports the substrate S. The support member 3300 may support the edge region of the substrate S. For example, a groove having the same or similar shape as that of the substrate S is formed in the support member 3300, and a hole is formed inside the groove. The substrate S is placed and supported in the groove, and both the top and bottom surfaces of the substrate S are exposed to the outside through holes in the grooves, so that the entire area of the substrate S may be dried during the supercritical drying process.

The support member 3300 may be installed on a surface of the door 3200 facing the opening 3101. The support member 3300 installed in the door 3200 may be carried into the housing 3100 by sliding through the opening 3101 according to the movement of the door 3200, or may be located outside the housing 3100. At this time, the support member 3300 may be provided in the shape of a plate, one side of which is fixed to a surface facing the opening 3101 of the door 3200 and extending in a vertical direction from the surface. However, since the position at which the support member 3300 is installed is not limited to the door 3200, the support member 3300 may be installed inside the housing 3100.

The opening 3101 may be provided to have an area equal to or slightly larger than the side shape of the supporting member 3300 so that the supporting member 3300 is carried into the housing 3100. Since the interior of the housing 3100 is maintained at a high pressure above the critical pressure during the supercritical drying process, the larger the area of the opening 3101 is, the greater the force is required for the door 3200 to seal the housing 3100. If the 3101 is provided in the size of the area of the side surface of the support member 3300, the housing 3100 can be sealed with a relatively small force.

The door driving member 3400 moves the door 3200. The door driving member 3400 includes a guide rail 3410 and a door driver 3420. The guide rail 3410 is disposed in a direction perpendicular to a surface on which the opening 3101 of the housing 3100 is formed. In this case, the guide rail 3410 may be disposed in a direction parallel to the side surface at which the second process chamber 3000 of the transfer chamber 2200 is disposed.

The door 3200 is installed at the guide rail 3410 so as to face the opening 3101. The door driver 3420 transmits power to the guide rail 3410 to move the door 3200 in a direction perpendicular to a surface on which the opening 3101 is formed along the guide rail 3410.

The pressing member 3500 may be coupled to the housing 3100 and may apply pressure to the door 3200 to seal the housing 3100. The pressing member 3500 may include a cylinder 3510, a rod 3520, and a head 3530. The cylinder 3510 may be coupled to both sides of the housing 3100. The rod 3520 is provided to penetrate both sides of the opening 3101 of the side surface in which the opening 3101 of the housing 3100 is formed, and may move in a direction parallel to the moving direction of the door 3200 by the cylinder 3510. The head 3530 is formed at one end of the rod 3520.

The head 3530 may pass through the door 3200 by the movement of the rod 3520 or may apply pressure or a force to an opposite surface on which the support member 3300 of the door 3200 is installed.

A first head hole 3201 corresponding to the shape of the head 3530 is formed in the door 3200. When the head 3530 is disposed in a direction that matches the first head hole 3201, the rod 3520 is headed. The 3530 may be moved away from the opening 3101, and the head 3530 may pass through the door 3200 through the first head hole 3201.

The head 3530 passing through the first head hole 3201 is rotated in a direction that is not matched with the first head hole 3201, and the rod 3520 moves the head 3530 closer to the opening 3101. And the head 3530 apply pressure or a force to an opposite surface of the door 3200 facing the opening 3101 to close the door 3200 to the opening 3101 so that the housing 3100 is sealed. Can be. The cylinder 3510 may generate a sufficient force to prevent the door 3200 from being pushed out and the housing 3100 from being opened due to the area of the opening 3101 and the supercritical pressure.

Here, the door 3200 may include a head holder 3210 and a holder driver 3220 for rotating the head 3530 passing through the door 3200. The head holder 3210 is provided on the opposite surface facing the opening 3101 of the door 3200 and has a second head hole 3211 into which the head 3530 passing through the door 3200 is inserted. The second head hole 3211 is formed to communicate with the first head hole 3201 so that the head 3530 passing through the door 3200 is inserted. When the head 3530 is inserted into the head holder 3210, the holder driver 3220 generates a driving force to rotate the head holder 3210, thereby rotating the head 3530.

The heating member 3110 heats the inside of the housing 3100. The heating member 3110 may be embedded in the wall of the housing 3100. For example, the heating member 3110 may be implemented as a heater that generates heat with an external power source.

The supply line 3120 supplies the supercritical fluid to the housing 3100. The supply line 3120 may spray a supercritical fluid toward the center area of the substrate S. When the supercritical fluid is supplied, the substrate S may be dried while the organic solvent remaining in the substrate S is dissolved by the supercritical fluid. The supply line 3120 may be provided in plurality. For example, the supply line 3120 may include a first supply line 3121 connected to an upper portion of the housing 3100 and a second supply line 3122 connected to a lower portion of the housing 3100. The supercritical fluid supplied to the first supply line 3121 may be injected onto the upper surface of the substrate S, and the supercritical fluid supplied to the second supply line 3122 may be injected onto the lower surface of the substrate S. Here, the upper surface of the substrate S may be a pattern surface.

The exhaust line 3130 exhausts the supercritical fluid from the housing 3100. The exhaust line 3130 may provide a supercritical fluid that is exhausted to a supercritical fluid regeneration system (not shown) for regenerating it. The exhaust line 3130 may be connected to the lower portion of the housing 3100. When the supercritical fluid is exhausted, the supercritical fluid may be liquefied. The liquefied supercritical fluid may be discharged to the outside of the housing 3100 through an exhaust line 3130 connected to the lower portion by gravity.

On the other hand, the substrate processing apparatus 100 may further include a controller for controlling the component. For example, the controller may control the heating member 3110 to adjust the internal temperature of the housing 3100. As another example, the controller may control the valve installed in the injection member, the supply line 3120 or the exhaust line 3130 to adjust the flow rate of the drug or supercritical fluid. For another example, the controller may control the movement of the door 3200 or the rotation of the head holder 3210 by controlling the power of the door driving member 3400, the pressing member 3500, and the holder driving unit 3220. have.

Such a controller may be implemented in a computer or similar device using hardware, software or a combination thereof.

In terms of hardware, controllers include application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, and microcontrollers. It can be implemented as micro-controllers, microprocessors or electrical devices that perform similar control functions.

In software, the controller may be implemented by software code or software application written in one or more programming languages. The software is executed by a hardware-implemented control unit. The software may be installed by being transmitted from an external device such as a server in the hardware configuration described above.

Hereinafter, the substrate processing method according to the present invention will be described using the substrate processing apparatus 100 described above. However, since this is only for ease of description, the substrate processing method may be performed using the same or similar other device in addition to the substrate processing apparatus 100 described above. In addition, the substrate processing method according to the present invention may be stored in a computer-readable recording medium in the form of a code or a program for performing the same.

Hereinafter, one embodiment of the substrate processing method will be described.

7 is a flowchart of an embodiment of a substrate processing method.

One embodiment of the substrate processing method relates to the overall cleaning process, the step (S110) of carrying the substrate (S) into the first process chamber 2300, performing the chemical process (S120), performing a rinse process Step S130, performing the organic solvent process (S140), importing the substrate S into the second process chamber 3000 (S150), performing the supercritical drying process (S160), and the load port In operation S170, the substrate S is accommodated in the container C placed in the 1100. On the other hand, the above-described steps are not necessarily executed in the order described, the steps described later may be performed before the steps described first. The same holds true for other embodiments of the substrate processing method described later. Each step will be described below.

The substrate S is loaded into the first process chamber 2300 (S110). First, a conveying device such as an overhead transferr or the like places the container C in which the substrate S is stored in the load port 1100. When the container C is placed, the index robot 1210 extracts the substrate S from the container C and loads the substrate S in the buffer slot 2110. The substrate S loaded in the buffer slot 2110 is taken out by the transfer robot 2210 and brought into the first process chamber 2300 and seated on the support plate 2311.

Perform the chemical process (S120). When the substrate S is placed on the support plate 2311, the nozzle shaft 2323 is moved by the nozzle 2321 driver so that the nozzle 2321 is positioned above the substrate S. The nozzle 2321 sprays a cleaning agent on the upper surface of the substrate S. FIG. When the cleaning agent is sprayed, the foreign matter is removed from the substrate (S). In this case, the rotation driver 2315 may rotate the rotation shaft 2314 to rotate the substrate S. FIG. When the substrate S is rotated, the cleaning agent is uniformly supplied to the substrate S and scattered from the substrate S. FIG. The scattering detergent flows into the recovery container 2331 and is sent to the fluid regeneration system (not shown) through the recovery line 2333. At this time, the lifting and lowering driver 2335 raises and lowers the recovery container 2331 so that the cleaning agent scattered into one of the plurality of recovery containers 2331 is introduced through the lifting bar 2334.

A rinse process is performed (S130). When the chemical process is completed, foreign matter is removed from the substrate S, and the cleaning agent remains. Of the plurality of nozzles 2321, the nozzles 2321 sprayed with the cleaner are separated from the upper part of the substrate S, and another nozzle 2321 moves to the upper part of the substrate S, and rinses the upper surface of the substrate S. Spray it. When the rinse agent is supplied to the substrate S, the cleaning agent remaining on the substrate S is washed. Even during the rinse process, the substrate S may be rotated and the drug may be recovered. The lifting and lowering driver 2335 adjusts the height of the recovery container 2331 so that the rinsing agent flows into the recovery container 2331 and the recovery container 2331 that collects the cleaning agent.

Perform the organic solvent process (S140). When the rinsing step is completed, another nozzle 2321 moves to the upper portion of the substrate S to spray the organic solvent. When the organic solvent is supplied, the rinse agent on the substrate S is replaced with the organic solvent. On the other hand, during the organic solvent process, the substrate S may not be rotated or may be rotated at a low speed. This is because when the organic solvent is directly evaporated on the substrate S, the interfacial tension acts on the circuit pattern by the surface tension of the organic solvent, thereby causing the circuit pattern to collapse.

The substrate S is loaded into the second process chamber 3000 (S150). When the organic solvent process is completed, the transfer robot 2210 pulls out the substrate S from the first process chamber 2300. The substrate S is taken out in a state in which the organic solvent remains. The transfer robot 2210 conveys this to the second process chamber 3000. The substrate S is mounted on the support member 3300 of the second process chamber 3000 and then moved into the housing 3100 as the door 3200 moves. A detailed description of the process of loading the substrate S into the second process chamber 3000 will be described later in another embodiment of the substrate processing apparatus 100.

Perform the supercritical drying process (S160). The door 3200 seals the inside of the housing 3100. When the housing 3100 is sealed, the supply line 3120 supplies the supercritical fluid. When the supercritical fluid is introduced for the first time, since the pressure inside the housing 3100 is still below the critical pressure, the supercritical fluid may be liquefied. When the supercritical fluid is supplied to the upper portion of the substrate S, the supercritical fluid may be liquefied and fall to the upper portion of the substrate S by gravity, thereby causing damage to the substrate S. Accordingly, the supercritical fluid may be first supplied to the lower region of the housing 3100 through the second supply line 3122 and the supercritical fluid may be supplied to the upper region of the housing 3100 through the first supply line 3121. Can be. In this process, the heating member 3110 may heat the inside of the housing 3100. When the supercritical fluid continuously flows through the second supply line 3122, the internal pressure of the housing 3100 rises above the critical pressure, and when the inside of the housing 3100 is heated by the heating member 3110, the housing ( 3100, the internal temperature is raised above the critical temperature, a supercritical atmosphere may be formed inside the housing 3100. The second supply line 3122 may start supplying the supercritical fluid when the inside of the housing 3100 becomes the supercritical state.

When the supercritical fluid is supplied, the organic solvent remaining between the circuit patterns of the substrate S is dissolved in the supercritical fluid and the substrate S is dried. When the substrate S is sufficiently dried, the exhaust line 3130 exhausts the supercritical fluid from the housing 3100. When the exhaust is performed, the internal pressure of the housing 3100 is lowered, and when the atmospheric pressure is reached, the door 3200 is opened and the substrate S moves to the outside of the housing 3100 with the substrate S seated on the support member 3300.

The substrate S is stored in the container C placed on the load port 1100 (S170). The transfer robot 2210 loads the substrate S, which has been dried, and loads the substrate S in the buffer slot 2110 of the buffer chamber 2100. The index robot 1210 extracts the loaded substrate S and stores the loaded substrate S in a container C placed in the load port 1100.

Hereinafter, another embodiment of the substrate processing method will be described.

8 is a flowchart of another embodiment of a substrate processing method.

Another embodiment of the substrate processing method relates to a supercritical drying process, the step of mounting the substrate (S) on the support member 3300 (S210), the step of moving the door 3200 by the door driving member 3400 (S220), rotating the head 3530 (S230), sealing the housing 3100 by the pressing member 3500 (S240), performing a supercritical drying process (S250), door driving member Opening the housing 3100 by the (3400) (S260) and the step of taking out the substrate (S) from the support member 3300 (S270). Each step will be described below.

9 to 12 are operation diagrams according to the substrate processing method of FIG.

Referring to FIG. 9, the substrate S is seated on the support member 3300 (S210). The transfer robot 2210 places the substrate S on the support member 3300. This process is performed in the second process chamber 3000 in a state in which the housing 3100 and the door 3200 are spaced apart from each other so that the supporting member 3300 installed in the door 3200 is located outside the housing 3100. The substrate S may be placed in the groove of the support member 3300.

Referring to FIG. 10, the door 3200 is moved by the door driving member 3400 (S220). The door driving member 3400 moves the door 3200 toward the opening 3101. Accordingly, the door 3200 moves along the guide rail 3410. When the door 3200 is moved, the head 3530 passes through the door 3200 through the first head hole 3201 and the head holder 3210 of the head holder 3210 installed on the opposite side facing the opening 3101 of the door 3200. It is inserted into the second head hole 3211.

Referring to FIG. 11, the head 3530 is rotated (S230). The holder driver 3220 rotates the head holder 3210 such that the head 3530 and the first head hole 3201 are not matched.

Referring to FIG. 12, the housing 3100 is sealed by the pressing member 3500 (S240). When the head 3530 is rotated by the head holder 3210 and is not aligned with the first head hole 3201, the cylinder 3510 is formed on the opposite side of the rod 3520 and the opening 3101 of the housing 3100. Direction, the head 3530 moves the door 3200 toward the opening 3101, and finally the door 3200 is in close contact with the opening 3101 to seal the housing 3100.

Here, since the moving speed of the door 3200 by the pressing member 3500 is slower than the moving speed of the cylinder 3510 by the door driving member 3400, a large part of the moving path of the door 3200 is the door driving member. When the door 3200 is moved by the 3400 and a smaller portion causes the door 3200 to be moved by the pressing member 3500, the door 3200 is moved with only the pressing member 3500. The time taken to open and close the 3200 may be shortened.

Perform the supercritical drying process (S250). When the door 3200 is sealed, a supercritical drying process is performed. This has been described in detail in step S160. The internal pressure of the housing 3100 exceeds the critical pressure during the supercritical drying process, and the pressing member 3500 withstands the pressure so that the door 3200 seals the opening 3101. To exert strength. Meanwhile, the area of the opening 3101 may be minimized to the extent that the substrate S and the side surface of the support member 3300 on which the substrate S is seated may be provided in substantially the same manner. Since the force required to seal the door 3200 is proportional to the area of the opening 3101, the force of the door 3200 can be closed by using as little force as possible.

The housing 3100 is opened by the door driving member 3400 (S260). When the supercritical drying process ends, the cylinder 3510 stops applying pressure to the rod 3520 and the door driver 3420 moves the door 3200 away from the opening 3101 along the guide rail 3410. Move it.

The substrate S is withdrawn from the support member 3300 (S270). When the support member 3300 is positioned outside the housing 3100 according to the movement of the door 3200, the transfer robot 2210 pulls out the substrate S from the support member 3300.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. The present invention is not limited to the drawings.

Therefore, the present invention is not limited to the above-described embodiments, and may be implemented by selectively combining the respective embodiments, selectively combining the components of the embodiments, or further combining known techniques.

100: substrate processing apparatus
1000: index module
2000: process module
3000: second process chamber
3100: housing
3200: door
3210: head holder
3300: support member
3410: guide rail
3500: pressure member
C: container
S: substrate

Claims (2)

An opening formed at one side and providing a space in which the process is performed;
A guide rail disposed in a direction perpendicular to a surface on which the opening is formed;
A door disposed on the guide rail to face the opening and opening and closing the housing; And
It includes; Door driver for moving the door according to the guide rail
Substrate processing apparatus. The method of claim 1,
A support member installed on a surface facing the opening of the door and on which a substrate is seated;
Substrate processing apparatus.

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