KR20130046365A - Organic el device manufacturing apparatus - Google Patents

Abstract

PURPOSE: An apparatus for manufacturing an organic EL device is provided to improve process accuracy by accurately controlling the distance between a substrate and a mask. CONSTITUTION: A shadow mask is installed in a vacuum chamber. A substrate holder(91) includes a substrate holding region. A transparent glass plate(65) is installed on the first surface of the substrate holder. A distance measuring part(67) is arranged on the second surface of the substrate holder. A transparent glass window is installed in a part of a distance housing.

Description

Organic EL device manufacturing apparatus {ORGANIC EL DEVICE MANUFACTURING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic EL (Electro-Luminescence) device manufacturing apparatus, and more particularly, to an organic EL device manufacturing apparatus capable of controlling the gap between a substrate and a mask with high precision during film formation or the like.

A viable method for producing an organic EL device is the vacuum deposition method. In the vacuum vapor deposition method, a vapor deposition process is performed by exposing to a processing gas in a state where a mask such as a glass substrate and a mask are overlapped in a vacuum processing chamber. Moreover, in recent years, a process board | substrate has enlarged and the board | substrate size of G6 generation becomes 1500 mm x 1800 mm. In order to cope with such a large substrate, it is performed by exposing to a process gas and performing a vapor deposition process in the state which hold | maintained the board | substrate surface vertically. Patent Literature 1 below discloses a technique in which a mask is brought close to a substrate while the substrate surface is held vertically, and a vapor deposition treatment is performed in a state where the substrate and the mask are overlapped.

As described above, when the substrate surface of the large substrate is held vertically in the vacuum processing chamber and the vapor deposition treatment is performed in a state where the masks are overlapped, in order to reduce the blur in the vapor deposition and to perform high precision vapor deposition, It is necessary to control the clearance gap between a board | substrate and a mask with high precision, for example, several tens of micrometers or less. Conventionally, while machining the flatness of the surface of the board | substrate holder which mounts a board | substrate with the precision of about 20 micrometers or less, for example, while raising the machining precision of the movement guide mechanism which moves a board | substrate holder, Although the clearance gap was controlled, it was not easy to control the clearance gap with a mask with high precision over the board | substrate whole surface especially when a large substrate is made vertical.

Japanese Patent Laid-Open No. 2010-086956

An object of the present invention is to provide an organic EL device manufacturing apparatus capable of controlling the gap between a substrate and a mask with a high precision of, for example, several tens of m or less.

In order to achieve the said objective, in the organic electroluminescent device manufacturing apparatus which concerns on this invention, the shadow mask provided in the vacuum processing chamber,

A substrate holder having a rectangular first surface disposed in the vacuum processing chamber and including a substrate placing region for placing the substrate thereon;

Substrate adhesion means for accessing or spaced between the substrate placed on the substrate holder and the shadow mask;

In the said substrate holder, the distance measuring mechanism provided in four corners other than a board | substrate mounting area is provided,

The distance measuring instrument,

A distance measuring space provided at four corners of the substrate holder outside of the substrate placing region and provided to penetrate the first surface of the substrate holder and the second surface opposite to the first surface;

A transparent glass plate provided on the first surface of the substrate holder in the distance measuring space;

A distance measuring unit disposed on a second surface of the substrate holder in the distance measuring space;

The distance measuring unit,

A distance meter which emits light to the object, receives the reflected light reflected from the object, and measures the distance between the object and the object;

A range finder housing that isolates the range finder from the atmosphere in the vacuum processing chamber;

It is provided with a transparent glass window provided in a part of the rangefinder housing,

The rangefinder receives the reflected light reflected from the transparent glass plate through the transparent glass window and the reflected light reflected from the shadow mask through the transparent glass window, and based on the received result, the transparent glass plate and the shadow mask. It is characterized by measuring the distance between them.

According to the present invention, it is possible to provide an organic EL device manufacturing apparatus capable of controlling the gap between the substrate and the mask with a high precision of, for example, several tens of m or less.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the organic electroluminescent device manufacturing apparatus in embodiment of this invention.
It is a figure which shows the outline | summary of the structure of the conveyance chamber and a processing chamber in embodiment of this invention.
It is a schematic diagram and operation explanatory drawing of the structure of a conveyance chamber and a processing chamber in embodiment of this invention.
It is a figure which shows the operation flow in embodiment of this invention.
It is a figure which shows the board | substrate turning means and board | substrate adhesion means in embodiment of this invention.
It is a figure which shows the structure of the board | substrate holder in embodiment of this invention, and the attitude | position of the board | substrate at the time of alignment.
It is a figure which shows the structure of the alignment part in embodiment of this invention.
It is a figure which shows the distance measuring mechanism in embodiment of this invention.
It is a figure which shows the Example of the board | substrate mask fixing means in embodiment of this invention, and is a figure which added the said Example to FIG.

An embodiment of the present invention will be described with reference to FIGS. 1 to 9. The organic EL device manufacturing apparatus is not merely a structure in which a light emitting material layer (EL layer) is formed to be sandwiched by an electrode, but a variety of materials such as forming a hole injection layer or a transport layer on an anode and an electron injection layer or a transport layer on a cathode. A multi-layered structure made of a thin film is formed or the substrate is cleaned. 1 is a horizontal sectional view showing an example of the manufacturing apparatus.

The organic electroluminescent device manufacturing apparatus 100 in this embodiment processes the load cluster 3 and the said board | substrate 6 which carry in largely and carry in the board | substrate 6 (Hereinafter, also called a board | substrate) of a process object. It consists of four clusters A thru | or D, five transfer chambers 4: 4a-4e provided between each cluster or between the cluster and the load cluster 3, or the next process (sealing process). In the organic electroluminescent device manufacturing apparatus 100 of this embodiment, the vapor deposition surface of a board | substrate is conveyed as an upper surface, and a vapor deposition is carried out by standing a board | substrate at the time of vapor deposition.

The load cluster 3 receives the substrate 6 from the load lock chamber 31 having the gate valve 10 and the load lock chamber 31 so as to maintain the vacuum back and forth, and pivots the transfer chamber 4a. It consists of the conveyance robot 5R which carries in a board | substrate to. Each load lock chamber 31 and each transmission chamber 4 have a gate valve 10 before and after, and control the opening and closing of the gate valve 10 to maintain a vacuum while the load cluster 3 or the next cluster. Transfer the substrate to the back.

Each of the clusters A to D receives a substrate from the transfer chamber 2 having one transfer robot 5 and the transfer robot 5, respectively, and is arranged up and down on a drawing to perform a predetermined process. It has a processing chamber (1: first subscripts a to d represent clusters, and second subscripts u and d represent upper and lower sides). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

2 is a perspective view illustrating an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the processing contents, the vacuum deposition chamber 1bu, which is a vacuum processing chamber in which an EL layer is formed by depositing a light emitting material which is a deposition material in vacuum, will be described as an example. FIG. 3: is a schematic diagram and operation | movement explanatory drawing of the structure of the conveyance chamber 2b and the vacuum deposition chamber 1bu. The conveyance robot 5 in FIG. 2 has the arm 57 of the 3-link structure which can move the whole vertically up and down (refer the arrow 59 of FIG. 3), and can rotate left and right, and the board | substrate conveys at the front-end | tip. The dragon comb-shaped hand 58 has two at the upper and lower two stages.

In the case of one hand, the rotation operation for transferring the substrate to the next process, the rotation operation for receiving the substrate from the previous process, and the opening / closing operation of the gate valve accompanying this are required during the carrying out process, but the upper and lower stages are After carrying out the carrying-out operation of the board | substrate from the vacuum deposition chamber in the hand which does not hold | maintain a board | substrate, the board | substrate carried in one hand can carry out carrying out operation continuously. Whether to use two hands or one hand is determined by the required production capacity. In the following description, for the sake of simplicity, one hand will be described.

On the other hand, the vacuum deposition chamber 1bu is largely divided into a vapor deposition unit 7 for subliming the light emitting material and depositing it on the substrate 6, and the substrate 6 and the shadow for depositing the required portion of the substrate 6. The processing part 9 which transfers the alignment part 8 which performs position alignment of the mask 81, the transfer robot 5, and the board | substrate 6, and moves the board | substrate 6 to the vapor deposition part 7. Is made of.

The alignment unit 8 and the process delivery unit 9 provide two systems, a right R line and a left L line. The basic idea of the processing in the present embodiment is to carry out the substrate 6 in the other L line while the vapor deposition is carried out on one line (for example, the R line), and the substrate 6 and the shadow mask. (81) is aligned to complete the preparation for vapor deposition. By alternately performing this process, it is possible to reduce the time during which evaporation is unnecessary without depositing the vapor deposition material on the substrate 6.

In this embodiment, as shown in FIG. 4, first, [1] the substrate 6 is loaded into the process delivery unit 9, and then [2] the substrate is placed almost vertically, and then [ 3] The substrate 6 is brought close to the position spaced apart from the shadow mask 81 by a certain distance, for example, 0.5 mm, and alignment is performed in that state. After completion of the alignment, [5] the substrate 6 and the shadow mask 81 are brought into close contact with each other so that the gap between the substrate 6 and the shadow mask 81 becomes several tens of micrometers or less, and the substrate 6 is contacted with a magnet [6]. ) And the shadow mask 81 are adsorbed and fixed to deposit the vapor deposition material on the substrate 6. After the completion of the deposition, the [6] magnet is released from the shadow of the substrate 6 and the shadow mask 81, and [9] the substrate 6 is spaced apart from the shadow mask 81 by a certain distance, and the substrate [10] (6) is made horizontal, [11] and the board | substrate 6 is carried out from the process delivery part 9.

First, the board turning means 92 which implements [2] and [10] is demonstrated among the said steps using FIG. FIG. 5 shows a process delivery unit including substrate turning means 92 for implementing [2] and [10] and substrate adhesion means 93 for implementing [3], [5], and [9] during the above steps. (9: FIG. 3) is shown, and also the application of the in-vacuum wiring link mechanism which solves the problem of outgas from the wiring covering material is shown.

The board | substrate turning means 92 integrates the board | substrate holder 91 and board | substrate 6 which mount and hold | maintain and hold | maintain the board | substrate carried in the process delivery part 9, and stands substantially vertically before alignment, and after completion | finish of alignment Has the function to return to the horizontal state.

In FIG. 5, the board | substrate turning means 92 is distinguished largely, The vacuum wiring link mechanism 92L which rotates turning parts, such as the board | substrate 6 and board | substrate holder 91, etc. which are turning objects, and the said turning part is arrow A Direction and a swing drive section 92B for pivoting through the mechanism.

The in-vacuum wiring link mechanism 92L is composed of a seal portion 92S that isolates the first link 92L1 and the second link 92L2 from the vacuum side and sets the inside thereof as an atmospheric atmosphere. One end of the first link 92L1 is supported by the rotation support 92k, and the other end thereof is connected to the telemeter housing 62 described later to have a hollow portion. The second link 92L2 is provided on the side opposite to the first link 92L1 with respect to the rangefinder housing 62, and the one end portion has the hollow portion similarly to the first link 92L1, so that the rangefinder housing 62 is provided. The other end is connected to 11 A of support parts provided in the partition part 11 shown in FIG.

The seal portion 92S includes a first seal portion 92S1, one end of which is connected to a sidewall of the vacuum deposition chamber 1bu, one end of which is connected to the side wall of the vacuum deposition chamber 1bu, and one end of the sealer 62. The other end part consists of the 2nd seal part 92S2 in which the other end was connected to the support part 11A. Each of the seal portions 92S1 and 92S2 has bellows 92V1 and 92V2 connecting the both ends thereof, and the connecting portion on the side of the rangefinder housing 62 of each of the seal portions 92S1 and 92S2, The first link 92L1 and the second link 92L2 are rotatably supported. In the said embodiment, although the inside of the link was made hollow in order to install the wiring 94f in a link, since the sealing part 92S is comprised so that each link may be included, you may provide wiring between a link and a vacuum seal part. . In this case, the link does not necessarily have to be hollow.

On the other hand, the turning drive part 92B is a gear 92h1 and 92h2 which transmits the turning motion of the turning motor 92m and the turning motor 92m to the said 1st link 92L1 provided in the atmospheric side, It has a rotation support 92k for supporting one end of one link L1. Moreover, the turning motor 92m is controlled by the control apparatus 60 provided in the atmosphere side.

5 shows the R line of the vacuum vapor deposition chamber 1bu, and makes the division part 11 shown in FIG. 1 the center of a surface object, and the same structure also exists in the L line of the vacuum vapor deposition chamber 1bu. Is placed. Thus, each hollow of the first link 92L1, the rangefinder housing 62, the second link 92L2 of the R line, and the first link 92L1, the rangefinder housing 62, the second link 92L2 of the L line. The part becomes a structure connected to air | atmosphere through 11 A of support parts provided in the partition part 11. As shown in FIG. Although the 2nd link 92L2 does not necessarily need to be hollow, as mentioned later, since the 2nd link 92L2 needs to move to the B direction shown in FIG. 5 from the hollow part of the partition part 11, it is a moving part. There was a possibility that dust could escape, and it was connected to the hollow part of 11 A of support parts, and it was set as the structure connected to air | atmosphere.

In the above description, if the substrate 6 is placed vertically, a small gap may occur between the substrate 6 and the substrate holder 91, so as shown in FIG. 6, the substrate on which the substrate 6 is placed is placed. The holder 91 is slightly inclined, for example, about one degree. In this manner, if the angle is slightly inclined, a gap cannot be formed between the substrate 6 and the substrate holder 91, so that the gap can be stably placed, and the warpage of the substrate 6 can be reliably caused by the weight of the substrate 6. I can eliminate it. Moreover, the board | substrate support protrusion 91t which has a height about the thickness of the board | substrate 6 is provided in the lower part of the board | substrate holder 91. Even if a substrate holding means such as electrostatic adsorption or a mechanical clamp is not used on the substrate holder 91, the substrate 6 does not slip due to the friction with the substrate holder 91 due to the inclination. Found to be held by. In addition, since the height of the projection 91 is about the thickness of the substrate 6, it is not necessary to provide an unnecessary shape in the shadow mask 81, so that stable high-definition deposition is possible.

As mentioned above, when the board | substrate turning means 92 which concerns on this embodiment is used, since the board | substrate vapor deposition surface is conveyed as an upper surface, the above-mentioned alignment is possible as it is when the board | substrate 6 is raised.

Moreover, it is a simple mechanism which uses the board | substrate holding protrusion 91t for the board | substrate holder 91, and can hold | maintain the board | substrate 6, and does not disturb the tension of the shadow mask 81, and has high reliability. Vapor deposition is possible.

Next, the structure and operation | movement which achieve the alignment of step 4 are demonstrated using FIG. 7 shows the alignment portion 8 according to the present embodiment. In this embodiment, as shown in FIG. 7, the board | substrate 6 and the shadow mask 81 are made to stand substantially vertically, and alignment is performed. The alignment portion 8 holds the shadow mask 81, the alignment base 82 holding the shadow mask 81, and the alignment base 82, and the XZ of the alignment base 82, that is, the shadow mask 81. Alignment follower 84 which supports the alignment drive part 83 and the alignment base 82 which define the attitude | position in a plane from the bottom, and coordinates the movement of the alignment drive part 83, and defines the attitude | position of the shadow mask 81 And an alignment optical system 85 provided at four positions for detecting the alignment marks provided on the substrate 6 and the shadow mask 81, and an image of the alignment marks. The control controls the alignment driver 83 to obtain the alignment amount. Device 60 (see FIG. 5).

Using this configuration, alignment is performed as follows. The alignment base 82 is rotatably supported by four rotational support portions of two places 81a and 81b and reference numerals 81c and 81d provided below each of the two locations, respectively, near the four corners. .

By the alignment optical system 85 provided in the said four places, the position shift ((DELTA) X, (DELTA) Y, (theta)) of the board | substrate 6 and the shadow mask 81 is detected. (theta) is the inclination in the XZ plane of FIG. Based on this result, the rotary support part 81a provided in the upper part of the alignment base 82 is moved to the X direction and Z direction shown in FIG. 7, and the rotary support part 81b installed in the upper part similarly to the Z direction, The position shift is eliminated and aligned. At this time, with the movement of the alignment base 82, the rotary support 81b moves in the X direction, and the rotary support portions 81c and 81d provided below the alignment base 82 move in the X and Z directions. . The driving of the rotary support 81a is an alignment driver 83L having a drive motor provided on the upper wall 1T of the vacuum deposition chamber 1bu, the driving and manual operation of the rotary support 81b and an alignment driver 83R. The follower of the rotation support parts 81c and 81d is performed by the alignment follower parts 84L and 84R provided under the lower wall 1Y of the vacuum deposition chamber 1bu.

The mechanism part for alignment is provided in the air | atmosphere side through a seal part, and does not bring in the dust etc. which adversely affect vacuum deposition in a vacuum, and also it can improve water retention. Moreover, also about the alignment optical system 85, the camera, the light source, etc. are accommodated in the storage container in which the inside which protruded to the vacuum side is waiting, and the same effect is exhibited.

Next, the structure and operation | movement of the board | substrate adhesion | attachment means 93 which make the board | substrate 6 and the shadow mask 81 of step [3], [5], and [9] adhere | attach are demonstrated using FIG. The board | substrate adhesion means 93 moves the board | substrate turning means 92 to the arrow B direction as a whole, and moves the board | substrate 6 first to the shadow mask 81 to a fixed distance, performs alignment, and it adheres after that After vapor deposition, it is a means for returning to the original position. Therefore, the board | substrate adhesion | attachment means 93 is the turning drive part mounting stand 93t which mounts the board | substrate turning means 92, the running rail 93r of the turning drive part mounting stand 93t, and the turning drive part mounting stand ( It has the access motor 93m which drives 93t through the ball screw 93n. The hollow part of the partition part 11 also has the rail (not shown) which follows the movement of the turning drive part mounting stand 93t, and moves the 2nd link 92L2 of the board | substrate turning means 92 to B direction. . Even as a rail, the movable length is about 2 mm at most.

By measuring the distance between the board | substrate 6 and the shadow mask 81 by the distance measuring mechanism demonstrated below, based on the said measurement result, the board | substrate sticking means 93 is controlled by the control apparatus 60 by The distance between the substrate 6 and the shadow mask 81 can be controlled with high precision, and the substrate 6 can be brought into close contact with the shadow mask 81.

The distance measuring mechanism will be described using FIG. 8. As shown in FIG. 8, outside the substrate placing region of the substrate holder 91, the first surface 91h of the substrate holder 91 and the second surface 91j opposite to the first surface 91h are provided. The distance measuring space 91k is provided so as to penetrate. The 1st surface 91h is a surface containing the board | substrate mounting area | region for mounting the board | substrate 6, and surface shape is rectangular.

The transparent glass plate 65 is provided on the 1st surface 91h in the distance measuring space 91k. The surface of the shadow mask 81 side in the transparent glass plate 65 is coplanar with the 1st surface 91h. The distance measurement part 67 is provided in the 2nd surface 91j of the distance measurement space 91k. The distance measuring mechanism is comprised by the distance measuring space 91k, the transparent glass plate 65, and the distance measuring part 67. As shown in FIG.

The distance measuring part 67 is provided with the rangefinder 61, the rangefinder housing 62, the transparent glass window 63, and O-rings 64a and 64b. The distance meter 61 is a laser displacement meter in this example, emits light with respect to an object, receives the reflected light reflected from the object, and measures the distance between the object and the object. The rangefinder housing 62 is for isolating the rangefinder 61 from the atmosphere in the vacuum processing chamber. It is preferable to set the inside of the rangefinder housing 62 to an atmospheric atmosphere. The rangefinder 61 is provided in the rangefinder housing 62 by the fixed metal member 66, and is connected to the control part 60 by the cable. The transparent glass window 63 is provided in a part of the telemeter housing 62, specifically, the position where the transparent glass plate 65 can be viewed from the telemeter 61. O-rings 64a and 64b are inserted between the transparent glass window 63 and the rangefinder housing 62 to hermetically separate the vacuum atmosphere outside the rangefinder housing 62 and the atmosphere within the rangefinder housing 62.

Thus, the rangefinder 61 is arrange | positioned so that the shadow mask 81 can be viewed from the distance measuring space 91k through the transparent glass plate 65. FIG.

A method of measuring the distance between the substrate 6 and the shadow mask 81 will be described.

As shown in FIG. 8, the laser light emitted from the rangefinder 61 is reflected on the surface of the transparent glass plate 65 and returned to the rangefinder 61. The rangefinder 61 receives this reflected light and measures the distance between the surface and the surface of the transparent glass plate 65. The laser light emitted from the rangefinder 61 is reflected by the surface 81h of the shadow mask 81 and returned to the rangefinder 61. The rangefinder 61 receives the reflected light and measures the distance between the shadow mask 81 and the surface 81h. Since the thickness of the transparent glass plate 65 and the thickness of the board | substrate 6 are known, the distance t between the surface 6h of the board | substrate 6 and the surface 81h of the shadow mask 81 based on the above measurement result. Is calculated.

The above-described distance measuring mechanism is provided at four corners outside the substrate placing region in the substrate holder 91, and the surface 6h of the substrate 6 and the surface 81h of the shadow mask 81 at the four corners. The distance t between them is calculated, and the substrate adhesion means 93 is controlled based on the calculation result.

According to the said embodiment, the curvature of the board | substrate 6 at the time of vapor deposition can be eliminated. In addition, the substrate 6 and the shadow mask 81 can be aligned while maintaining the distance at which the shadow mask 81 does not contact, for example, about 0.5 mm, and then the substrate 6 is brought into close contact with the shadow mask 81 to deposit the vapor. It is possible to reduce the blur in the process, and to enable high precision deposition.

Subsequently, in step [6], [8], i.e., the substrate mask fixing means which fixes the substrate 6 and the shadow mask 81 at the time of deposition, enables to deposit stably, and releases the fixing after the deposition is completed. The Example in this embodiment of 20) is demonstrated using FIG. FIG. 9 is a diagram in which the substrate mask fixing means 20 is added to FIG. 5. In view of the complexity of the drawings, reference numerals not directly related to the description are omitted.

The substrate mask fixing means 20 in the present embodiment includes a substrate mask adsorber 21 holding a permanent magnet 21J for adsorption-fixing the substrate 6 and the shadow mask 81, and the substrate mask. Adsorbent swinging means, which is an adsorbent moving means for pivoting the adsorbent 21 from the upper portion of the process delivery unit 9 as shown by arrow C to move the substrate mask adsorbent 21 to the position of the substrate holder 91. It consists of 22.

When the substrate mask adsorbent 21 pivots and approaches the substrate holder 91, the substrate mask adsorbent 21 sandwiches the substrate 6 made of nonmagnetic material and starts to adsorb the shadow mask 81 made of magnetic material. Therefore, the adsorption force is strengthened and adsorption is fixed when contacted. Under the present circumstances, when the shadow mask 81 deform | transforms because the adsorption force is too strong, you may make it adsorb | suck and fix by turning to the position from which an appropriate adsorption force is obtained, without making contact. As a result, the substrate 6 and the shadow mask 81 are integrated and can be deposited stably and reliably by being deposited in the integrated state.

In Fig. 9, the adsorbent swinging means 22 is divided largely into a link mechanism 22L for swinging the substrate mask adsorbent 21 to be swinged, and the swinging object is pivoted through the mechanism in the direction of arrow C. In Figs. It consists of the adsorbent swing drive part 22B to drive.

The link mechanism 22L includes the first link 22L1 and the second link 22L2 and a seal portion 22S that isolates them from the vacuum side. Although the basic structure of the link mechanism 22L is the same as that of the in-vacuum wiring link mechanism 92L of the substrate adhesion means 93, the following points differ.

First, in the present embodiment, the step [6] is performed after the step [5] of adhering the substrate 6 to the shadow mask by the substrate adhering means 93 illustrated in FIG. 4, so that the substrate mask fixing means 20 is provided. There is no need to move it back and forth. Therefore, the bellows for moving the link back and forth becomes unnecessary, and the seal portion 22S also has the first seal portion 22s1 on the side wall of the vacuum deposition chamber 1bu and the second seal portion 22s2 on the support portion 11A. ) May be provided so that the link mechanism 22 can rotate. Conversely, if it is performed before the said operation flow [5], it is necessary to make it the same structure as the wiring link mechanism 92L in a vacuum, and to move the adsorbent turning means 22 whole back and forth similarly to the board turning means 92. .

Second, although the link of the wiring link mechanism 92L in the vacuum was hollow for wiring, the link mechanism 22L does not necessarily have to be hollow because there is no wiring.

In addition, in the rotary support (not shown) in the support part 11A of the 2nd link 22L2, even if dust generate | occur | produces, it has the same space as the support of the 2nd link of the wiring link mechanism 92L in vacuum. It is possible to exhaust the dust to the atmosphere via the vacuum wiring link mechanism 92L.

On the other hand, although the adsorbent swing drive part 22B differs in power from the swing drive part 92B mentioned above, it has basically the same structure as the swing drive part 92B. Therefore, since the code | symbol number in the board | substrate turning means 92 can be substituted from 92 to 22, description is abbreviate | omitted here. The standby position of the substrate mask adsorbent 21 may be provided above the swing area of the substrate swing means 92 so as not to interfere with the swing of the substrate swing means 92.

According to the present embodiment of the substrate mask fixing means 20, the substrate mask adsorbent 21 can be formed separately from the process delivery unit 9 or in a separate structure, so that the substrate mask adsorbent 21 or Even if it is necessary to replace the structural mechanism of the process delivery unit 9 due to a failure or the like, the substrate mask adsorbent 21 is replaced only with the substrate mask adsorbent 21 regardless of the process delivery unit 9. What is necessary is just to replace the process delivery part 9 only the process delivery part 9 regardless of the board | substrate mask adsorption body 21. In addition, especially with respect to the process delivery unit 9, its structure is simplified and easy to maintain. Therefore, it is possible to provide a substrate mask adsorbent or a process delivery part having high water retention.

According to this embodiment of the board | substrate mask fixing means 20, it is not necessary to use holding means, such as a mechanical clamp, on the board | substrate holder 91, Therefore, the said mechanical clamp is attached to the shadow mask part corresponding to the said mechanical clamp. Since there is no need to provide the mechanical deformation | transformation part for accommodating, there is no deformation | transformation of the mask part by the disturbance, such as a magnetic field, and can deposit with high precision.

Finally, the Example in this embodiment is demonstrated using FIG. 3 about the vapor deposition process of step 7. As shown in FIG. As illustrated in FIG. 3, the vapor deposition unit 7 moves up and down drive means 72 and evaporation source 71 to move the vapor deposition source 71 in the vertical direction along the rail 76. It has the left-right drive base 74 which moves between right and left alignment parts along an image. The vapor deposition source 71 has a light emitting material which is a vapor deposition material therein, and a stable evaporation rate is obtained by heating control (not shown) of the vapor deposition material, and as shown in the drawing figure of FIG. It has a structure which sprays 73 from the several injection nozzle which arrange | positioned. If necessary, the additive is also heated and deposited at the same time so as to obtain a stable vapor deposition film.

In addition, in the above description, the organic EL device has been described as an example, but the present invention can also be applied to a film forming apparatus for performing vapor deposition on the same background as the organic EL device.

1: treatment chamber
1bu: vacuum deposition chamber
2: conveying chamber
3: load cluster
6: substrate
6h: substrate surface
7: deposition unit
8: alignment
9: processing delivery department
11: compartment
20: substrate mask fixing means
21: substrate mask adsorbent holding permanent magnet
21J: permanent magnet
22: adsorbent turning means
22B: Adsorbent swing drive
23: substrate mask adsorber holding electromagnet
23d: electromagnet
23 H: 23 storage cases
60: control unit
61: rangefinder
62: odometer housing
63: clear glass window
64a: o-ring
64b: O-ring
65: transparent glass plate
66: fixed metal member
67: distance measurement unit
71: evaporation source
81: shadow mask
81a to d: rotational support
81h: surface
82: alignment base
83: alignment drive unit
84: alignment follower
85: alignment optical system
91: substrate holder
91h: page 1
91j: page 2
91k: space for distance measurement
92: substrate turning means
93: substrate adhesion means
100: manufacturing apparatus for organic EL device
A to D: cluster

Claims (3)

A shadow mask installed in the vacuum processing chamber,
A substrate holder having a rectangular first surface disposed in the vacuum processing chamber and including a substrate placing region for placing the substrate thereon;
Substrate adhesion means for accessing or spaced between the substrate placed on the substrate holder and the shadow mask;
In the organic EL device manufacturing apparatus provided with the distance measuring mechanism provided in four corners other than a board | substrate mounting area | region in the said substrate holder,
The distance measuring instrument,
A distance measuring space provided at four corners of the substrate holder outside of the substrate placing region and provided to penetrate the first surface of the substrate holder and the second surface opposite to the first surface;
A transparent glass plate provided on the first surface of the substrate holder in the distance measuring space;
A distance measuring unit disposed on the second surface of the substrate holder in the distance measuring space;
The distance measuring unit,
A distance meter which emits light to the object, receives the reflected light reflected from the object, and measures the distance between the object and the object;
A range finder housing that isolates the range finder from the atmosphere in the vacuum processing chamber;
It is provided with a transparent glass window provided in a part of the rangefinder housing,
The rangefinder receives the reflected light reflected from the transparent glass plate through the transparent glass window and the reflected light reflected from the shadow mask through the transparent glass window, and based on the light reception result, the transparent glass plate and the shadow mask. The organic EL device manufacturing apparatus characterized by measuring the distance between them. The organic EL device manufacturing apparatus according to claim 1, wherein the rangefinder housing is an atmospheric atmosphere, and the rangefinder is disposed in an atmospheric atmosphere. The organic EL device manufacturing apparatus according to claim 1 or 2, wherein the rangefinder is a laser displacement meter.

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