JP6471200B1 - Mask plate and film forming method - Google Patents

Mask plate and film forming method Download PDF

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Publication number
JP6471200B1
JP6471200B1 JP2017168211A JP2017168211A JP6471200B1 JP 6471200 B1 JP6471200 B1 JP 6471200B1 JP 2017168211 A JP2017168211 A JP 2017168211A JP 2017168211 A JP2017168211 A JP 2017168211A JP 6471200 B1 JP6471200 B1 JP 6471200B1
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mask
substrate
plate
portion
pattern
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JP2019044228A (en
Inventor
瞬 三上
瞬 三上
裕利 中尾
裕利 中尾
慎太郎 田宮
慎太郎 田宮
伸一 朝比奈
伸一 朝比奈
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株式会社アルバック
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Abstract

When a mask plate is brought into close contact with a lower surface of a substrate by a magnet array so that the substrate is sandwiched between the touch plate and the mask plate, the peripheral edge of the through hole of the pattern mask portion is lifted as much as possible. Provided is a mask plate that can suppress the occurrence of mask blur in the formed thin film.
A mask plate MP has a pattern mask portion 1 in which a plurality of through holes 11 penetrating in the plate thickness direction are opened in a predetermined pattern, and a shielding portion 2 positioned around the pattern mask portion 1. . A mask pot MP in which at least a portion 21 of the shielding portion 2 adjacent to the pattern mask portion 1 in the direction in which the magnets are arranged is equal to the magnetic permeability of the pattern mask portion 1.
[Selection] Figure 1

Description

  The present invention has a pattern mask portion in which a plurality of through holes penetrating in the thickness direction are opened in a predetermined pattern, and a shielding portion located around the pattern mask portion, and is provided on one surface of the substrate. The present invention relates to a mask plate that is closely or closely arranged to define a processing range on a substrate, and a film forming method using the mask plate.

  For example, it is known that a predetermined thin film is formed by a vacuum deposition method as one of steps for manufacturing an organic EL device. In this case, in a vacuum chamber in which a vacuum atmosphere can be formed, a pattern mask portion and a pattern mask portion in which a substrate such as glass or polyimide and a plurality of through holes penetrating in the thickness direction are opened in a predetermined pattern. The substrate has a surrounding shielding portion to define the processing range to the substrate, for example, an Invar mask plate is placed on top of each other, and the vapor deposition material is sublimated or vaporized from the vapor deposition source. Various thin films are formed in a predetermined pattern on a predetermined range of the substrate by adhering and depositing the vapor deposition material on one surface (that is, a film formation surface) of the substrate through the mask plate (for example, Patent Document 1). reference). Usually, a deposition source (film formation source) is disposed below the mask plate, and the film is formed by a so-called deposition method.

  Here, when the film is formed by vacuum deposition, a so-called mask blur (that is, a predetermined thin film is formed over the mask plate with a predetermined reference film thickness on the thin film formed in a predetermined pattern, for example, a thin film along one direction. When the film thickness distribution is observed, the film formation range with the reference film thickness is narrower than the opening width in one direction of the mask plate, and the film is formed up to a predetermined range exceeding the opening width). In order to suppress this, it is more preferable that the substrate and the mask plate are in close contact over the entire surface. Therefore, with the direction from the mask plate toward the substrate as the top, a plurality of rod-shaped magnets magnetized in the vertical direction on the substrate via the touch plate are arranged so that the lower magnetic poles of the magnets adjacent to each other are different. In addition, by arranging the magnet array arranged in parallel in the direction orthogonal to the longitudinal direction of the magnet, the mask plate is moved by the attractive force of the magnet array so that the substrate is sandwiched between the touch plate and the mask plate. Generally, it is made to adhere to the lower surface of the substrate.

  By the way, in recent years, a substrate having a large thickness and a small thickness (for example, 1500 mm × 1800 mm × 0.5 mm thickness) has been used as a substrate to be processed. In order to form a film with high accuracy so that the film passing through and formed on the substrate has a substantially rectangular outline, a foil plate having a thickness of several μm to several hundred μm is used as the mask plate. It is supposed to be. However, when such a mask plate is attracted to the touch plate so as to sandwich the substrate using the magnet array, a portion that floats downward is generated locally in the pattern mask portion of the mask plate. There was found. When local lifting occurs in the pattern mask portion, so-called mask blur occurs in a thin film formed in a predetermined pattern, and it is necessary to suppress this as much as possible.

  Therefore, the inventors of the present application have conducted extensive research and, due to repulsive force acting for some reason, out of each through hole forming the pattern mask portion, the peripheral edge of the one adjacent to the shielding portion in the magnet parallel direction is lifted. I came to know. This is because the density of magnetic flux passing therethrough is different between the shielding part and the pattern mask part having a plurality of through holes (that is, the magnetic flux density changes significantly at the boundary between the shielding part and the pattern mask part). Due to this, it is considered that the repulsive force is acting because the magnetic flux crossing the shielding portion interferes with the magnetic flux passing through the pattern mask portion.

JP 2013-93278 A

  The present invention has been made based on the above knowledge, and when the mask plate is brought into close contact with the lower surface of the substrate by the attractive force of the magnet array so as to sandwich the substrate between the touch plate and the mask plate, A mask plate having a structure capable of suppressing the occurrence of local lift in the pattern mask portion as much as possible and preventing the occurrence of mask blur in the formed thin film, and a film forming method using the mask plate The issue is to provide.

  In order to solve the above-described problem, the substrate has a pattern mask portion in which a plurality of through holes penetrating in the plate thickness direction are opened in a predetermined pattern, and a shielding portion positioned around the pattern mask portion. The mask plate of the present invention, which is placed in close contact with or close to one surface and defines the processing range to the substrate, is magnetized in the vertical direction via the touch plate on the substrate with the direction from the mask plate toward the substrate as the top. By arranging a magnet array in which a plurality of magnets arranged in parallel so that the lower magnetic poles of the magnets adjacent to each other are different, the magnet array is sandwiched between the touch plate and the mask plate. In such a manner that the portion of the shielding portion that is in close contact with the lower surface of the substrate by the attraction force and is adjacent to the pattern mask portion in the parallel direction of the magnet is equivalent to the magnetic permeability of the pattern mask portion. Characterized in that it is.

  According to the present invention, since the change of the magnetic flux density at the boundary between the shield part and the pattern mask part in the direction in which the magnets are arranged side by side is reduced and the repulsive force is suppressed, the pattern mask part of the mask plate is moved downward. It is suppressed as much as possible that the part which floats upwards generate | occur | produces locally. As a result, it is possible to prevent mask blur from occurring in the formed thin film. In the present invention, when “the portion of the shielding portion is equivalent to the magnetic permeability of the pattern mask portion”, the magnetic permeability of the portion of the shielding portion and the magnetic permeability of the pattern mask portion (for example, the parallelism of magnets) Not only when the average permeability along the installation direction) is consistent, but also when the repulsive force can be suppressed by reducing the change in magnetic flux density at the boundary between the shielding part and the pattern mask part. including.

  In the present invention, as described above, in order to make the portion of the shielding portion equal to the magnetic permeability of the pattern mask portion, for example, the portion of the shielding portion is matched with the pattern of each through hole formed in the pattern mask portion. In addition, a plurality of through holes penetrating in the thickness direction may be formed in a predetermined pattern. However, when such a configuration is adopted, the film is originally formed on a portion where deposition on the substrate is to be regulated. For this reason, if the through-hole is filled with a non-magnetic material or a sheet material made of a non-magnetic material is pasted so as to cover a region where a plurality of through-holes are formed, the magnetic permeability of the pattern mask portion Can be prevented from being deposited on the portion of the substrate that should be regulated. In this case, for example, polyimide can be used as the nonmagnetic material.

In order to solve the above problems, the film forming method of the present invention for forming a thin film with a predetermined pattern on one surface of a substrate using the mask plate includes the mask plate and one surface of the substrate. And the direction from the mask plate toward the substrate is the top, and after placing the touch plate on the other side of the substrate from above, it is magnetized vertically on the touch plate. A magnet array in which a plurality of magnets are arranged side by side so that the magnetic poles on the lower side of the magnets are different from each other, and the arrangement direction of each magnet is between the portion of the shielding portion adjacent to the pattern mask portion and the pattern mask portion. by arranging in an orientation that matches the direction which is equal to the magnetic permeability, Masukupu on one surface of the substrate by the suction force of the magnet array so as to sandwich the substrate between the touch plate and the mask plate Characterized in that it comprises a step of adhering the over bets, and a step of operating the deposition sources to deposit the mask plate over the one surface of the substrate.


The top view which expands and shows a part of mask plate of this embodiment. The figure which shows the partially expanded cross section along II-II of FIG. 1 in the use condition of the mask plate of this embodiment. The partial expanded sectional view explaining the floating in the peripheral part of opening in the mask plate of a prior art example. Sectional drawing which expands and shows a part of mask plate which concerns on the modification of this embodiment.

  Hereinafter, with reference to the drawings, the present invention is such that the substrate is a rectangular glass substrate (hereinafter simply referred to as “substrate Sw”) and is in close contact (or as close as possible) to one surface (lower surface) of the substrate Sw. An embodiment of the mask plate MP and a film forming method using the mask plate MP will be described. In the following description, the direction from the mask plate MP toward the substrate Sw will be described.

  Referring to FIG. 1 and FIG. 2, mask plate MP is a foil having a plate thickness in the range of several μm to several hundred μm, has a low coefficient of thermal expansion near room temperature and is relatively strong. Made of high metal material, for example Invar. The mask plate MP is positioned around the pattern mask portion 1 and the pattern mask portion 1 in which a plurality of through holes 11 penetrating in the thickness direction are formed according to a pattern to be formed on the substrate Sw. It is comprised with the shielding part 2 which regulates the film-forming to Sw. The outline of each through hole 11 in plan view is appropriately set to a rectangle, a circle, an ellipse, or the like according to the outline of the film to be deposited on the substrate Sw (in the present embodiment, a rectangle). Moreover, the inner wall surface of each through-hole 11 is formed in a mortar shape that spreads downward toward the bottom so that mask blur does not occur (see FIG. 2). Although not specifically illustrated and described, a support frame (not shown) having a thicker thickness may be provided on the outer periphery of the mask plate MP so that the mask plate MP is held by the support frame.

  When the mask plate MP is brought into close contact with the lower surface of the substrate Sw and a predetermined thin film is formed on the lower surface of the substrate Sw by a vacuum deposition method, for example, with a predetermined pattern over the mask plate, the touch plate Tp and the magnet array Ma are used. Is used to attach the mask plate MP to the lower surface of the substrate Sw. As shown in FIG. 2, the touch plate Tp is selected from a metal material having a low magnetic permeability, and for example, austenitic stainless steel is used. The lower surface of the touch plate Tp with which the substrate Sw is in close contact is processed to have a predetermined flatness, and when the substrate Sw is in close contact with the entire surface of the touch plate Tp, the substrate Sw is held flat. I have to. On the other hand, the magnet array Ma includes a plate-like yoke Yo and rod-like magnets Bm arranged in parallel on the lower surface of the yoke Yo at equal intervals. The magnets Bm are magnetized in the vertical direction, and are arranged in parallel in a direction perpendicular to the longitudinal direction of the magnets Bm (the left-right direction in FIG. 2) so that the lower magnetic poles of the magnets Bm adjacent to each other are different. ing.

  In the following, the film forming method is also described as an example in which the film forming method is a vacuum deposition method and a predetermined thin film is formed on the lower surface of the substrate Sw through a mask plate with a predetermined pattern. Note that the film formation method is not limited to the vacuum evaporation method, and a sputtering method or a CVD method can be used. Although not specifically illustrated and described, an evaporation source as a film forming source is provided on the bottom surface of a vacuum chamber of a vacuum vapor deposition apparatus that performs the film forming method, and a support frame is disposed vertically above the evaporation source. The mask plate MP is installed in a horizontal posture on the support frame. First, the substrate Sw is superimposed on the mask plate MP. In this case, an alignment mark (not shown) is provided at a predetermined position between the mask plate MP and the substrate Sw, and the position of the substrate Sw with respect to the mask plate MP is adjusted while imaging the alignment mark with a CCD camera or the like. Then, after the touch plate Tp is placed on the substrate Sw by being lowered from above, the magnet array Ma is placed on the touch plate Tp by being lowered from above. Thus, the mask plate MP is brought into close contact with the lower surface of the substrate Sw by the attractive force of the magnet array Ma so as to sandwich the substrate Sw between the touch plate Tp and the mask plate MP (state shown in FIG. 2).

  Here, when the mask plate MP is brought into close contact with the lower surface of the substrate Sw by the attractive force of the magnet array Ma as described above, the through hole adjacent to the shielding portion 2 in the direction in which the pattern mask portion 1, in particular, the magnet Bm is juxtaposed. 11, the peripheral edge 11 a on the shielding part 2 side is lifted downward. When the local lift occurs in the mask plate MP in this way, so-called mask blur occurs in the thin film formed in a predetermined pattern, and it is necessary to suppress this as much as possible. Note that the local lift of the mask plate MP is confirmed by the blurring condition of the film when the film is actually formed on the substrate Sw because it is difficult to confirm the cross section by an optical method or the like. Therefore, the figure is an assumed conceptual diagram.

  In this embodiment, as shown in FIG. 1, the portion 21 of the shielding portion 2 surrounding the pattern mask portion 1 is made to match the pattern of each through hole 11 formed in the pattern mask portion 1 and penetrates in the plate thickness direction. A plurality of through holes 22 are formed in a predetermined pattern, and the portion 21 of the shielding portion 2 adjacent to the pattern mask portion 1 in the direction in which the magnets Bm are arranged in one direction is equivalent to the permeability of the pattern mask portion 1. It was made to become. In this case, the outline and the opening area of the through-hole 22 are made to correspond to each through-hole 11, and the pitch between the through-holes 22 is also made to correspond to the thing between each through-hole 11 (namely,). The through holes 11 are formed in a predetermined pattern with an area slightly larger than the original pattern mask portion 1). The area of the portion 21 of the shielding portion 2 where the through hole 22 is formed is not particularly limited, and the magnetic permeability can be made equal (in other words, the shielding portion 2 and the pattern mask portion in the direction in which the magnets Bm are arranged in parallel). As long as the change in magnetic flux density at the boundary with 1 can be made small), the outline and pitch of the through holes 22 formed in the portion 21 of the shielding part 2 are not limited to the above. Each through hole 22 is filled with the nonmagnetic material 3 by a so-called sealing process.

  The nonmagnetic material 3 filled in each through hole 22 is not particularly limited, and a resin such as polyimide can be used. As a sealing process for filling each through-hole 22 with the nonmagnetic material 3, spin coating, vapor deposition polymerization, or the like is used. In this case, a nonmagnetic material film is formed on the upper surface of the mask plate MP. It can also be used. In the above embodiment, in consideration of workability, each through hole 11 is formed in a predetermined pattern with an area slightly larger than the original pattern mask portion 1 and is located outside the original pattern mask portion 1. However, it is only necessary that the through hole 22 is formed only in the portion 21 of the shielding part 2 adjacent to the pattern mask part 1 in the direction in which the magnets Bm are arranged side by side.

  When the magnet array Ma is installed on the substrate Sw via the touch plate Tp, the magnet array Ma has a direction in which the magnetic permeability of the portion 21 of the shielding portion 2 adjacent to the pattern mask portion 1 and the pattern mask portion 1 are equal. And a direction in which the magnets Bm are arranged side by side. Thus, in a state where the mask plate MP is brought into close contact with the lower surface of the substrate Sw by the attractive force of the magnet array Ma so as to sandwich the substrate Sw between the touch plate Tp and the mask plate MP, the magnets Bm are arranged in the parallel direction. The change in magnetic flux density at the boundary between the shielding part 2 and the pattern mask part 1 is reduced, and the repulsive force is suppressed from acting. For this reason, it can suppress as much as possible that the part which floats toward the downward direction in the pattern mask part 1 of the mask plate MP generate | occur | produces locally. Then, the evaporation source disposed opposite to the mask plate MP is operated in a vacuum chamber in a vacuum atmosphere to sublimate or vaporize the vapor deposition material, and the sublimated or vaporized vapor deposition material adheres to the lower surface of the substrate Sw through the mask plate. By depositing, a thin film is formed in a predetermined pattern. Thereby, it is possible to prevent the occurrence of mask blur in the formed thin film. Further, since the through-hole 22 is filled with the nonmagnetic material 3, the film deposition on the portion of the substrate Sw to be originally regulated is surely prevented without impairing the function of equalizing the magnetic permeability of the pattern mask portion 1. Can do.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and the present invention can be modified without departing from the scope of the technical idea of the present invention. In the above embodiment, the case where the through-hole 22 is filled with the nonmagnetic material 3 has been described as an example. However, the present invention is not limited to this. For example, as illustrated in FIG. 4, a plurality of through-holes 22 are formed. The sheet material 4 made of a non-magnetic material and having a predetermined thickness may be attached to the portion 21 of the shielding portion 2. As such a sheet | seat material 4, the thing made from a polyimide can be used, for example.

  MP ... Mask plate, Sw ... Substrate, Tp ... Touch plate, Ma ... Magnet array, Bm ... Magnet, 1 ... Pattern mask part, 11 ... Through-hole, 2 ... Shielding part, 22 ... Through-hole, 3 ... Non-magnetic material, 4 ... Sheet material.

Claims (2)

  1. A pattern mask portion in which a plurality of through holes penetrating in the plate thickness direction are formed in a predetermined pattern, and a shielding portion positioned around the pattern mask portion, and are closely attached to one surface of the substrate. A mask plate that defines a processing range for the substrate,
    With the direction from the mask plate to the substrate facing up, a plurality of magnets magnetized in the vertical direction are arranged on the substrate in parallel so that the lower magnetic poles of the magnets adjacent to each other are different via the touch plate. By arranging the magnet array, the substrate is sandwiched between the touch plate and the mask plate so that it is in close contact with the lower surface of the substrate by the attractive force of the magnet array.
    At least the portion of the shielding portion adjacent to the pattern mask portion in the direction in which the magnets are arranged is formed to be equivalent to the magnetic permeability of the pattern mask portion,
    A mask plate, wherein a plurality of through holes penetrating in the plate thickness direction are formed in a predetermined pattern in the shielding portion, and the through holes are filled with a nonmagnetic material.
  2. Using the mask plate of claim 1 Symbol placement, in the film forming method for forming a thin film in a predetermined pattern on one surface of the substrate,
    Aligning and overlaying the mask plate and one side of the substrate;
    The direction from the mask plate toward the substrate is the top, and after placing the touch plate on the other surface of the substrate from above, a plurality of magnets magnetized in the vertical direction on the touch plate are adjacent to each other. A magnet array that is arranged side by side so that the lower magnetic poles are different, and the direction in which the magnets are arranged in parallel matches the direction in which the magnetic permeability of the pattern mask part is equal to the part of the shield part adjacent to the pattern mask part. By placing the mask plate on one surface of the substrate by the attractive force of the magnet array so that the substrate is sandwiched between the touch plate and the mask plate,
    And a step of forming a film on one surface of the substrate through a mask plate by operating a film forming source.
JP2017168211A 2017-09-01 2017-09-01 Mask plate and film forming method Active JP6471200B1 (en)

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JP2017168211A JP6471200B1 (en) 2017-09-01 2017-09-01 Mask plate and film forming method
TW107118376A TW201912817A (en) 2017-09-01 2018-05-30 The method of forming the mask plate and
CN201810788659.6A CN109423602A (en) 2017-09-01 2018-07-18 Mask plate and film build method
KR1020180102540A KR20190025510A (en) 2017-09-01 2018-08-30 Mask plate and film formation method

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075639A (en) * 2000-08-29 2002-03-15 Sony Corp Pattern forming device, pattern forming method, manufacturing device and manufacturing method of organic electric field light emitting element display
JP2004296436A (en) * 2003-03-13 2004-10-21 Toray Ind Inc Organic electroluminescent device, and manufacturing method of the same
JP2005302457A (en) * 2004-04-09 2005-10-27 Toray Ind Inc Deposited mask and its forming method, and manufacturing method for organic electroluminescent equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101015234B (en) * 2004-09-08 2010-10-13 东丽株式会社 Organic electroluminescent device and fabricating method thereof
JP4428285B2 (en) * 2005-05-16 2010-03-10 セイコーエプソン株式会社 Mask holding structure, a film forming method, and a method of manufacturing an electro-optical device
JP2010085588A (en) * 2008-09-30 2010-04-15 Sony Corp Manufacturing method of optical component, and optical component, and manufacturing method of display device, and display device
WO2013039019A1 (en) * 2011-09-14 2013-03-21 トヨタ自動車東日本株式会社 Electrode for photoelectric conversion device, and photoelectric conversion device
JP2013093278A (en) 2011-10-27 2013-05-16 Hitachi High-Technologies Corp Organic el device manufacturing apparatus
JP5825139B2 (en) * 2012-02-21 2015-12-02 大日本印刷株式会社 Method of manufacturing a deposition mask
JP5516816B1 (en) * 2013-10-15 2014-06-11 大日本印刷株式会社 Method of manufacturing an evaporation mask using a metal plate, a method of manufacturing a metal plate, and the metal plate
CN103695842B (en) * 2013-12-31 2015-12-09 信利半导体有限公司 Applying a masking plate and its manufacturing method
CN106884139A (en) * 2017-03-20 2017-06-23 京东方科技集团股份有限公司 Evaporation deposition film mask plate, manufacturing method thereof, electromagnetic evaporation deposition device and evaporation deposition method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075639A (en) * 2000-08-29 2002-03-15 Sony Corp Pattern forming device, pattern forming method, manufacturing device and manufacturing method of organic electric field light emitting element display
JP2004296436A (en) * 2003-03-13 2004-10-21 Toray Ind Inc Organic electroluminescent device, and manufacturing method of the same
JP2005302457A (en) * 2004-04-09 2005-10-27 Toray Ind Inc Deposited mask and its forming method, and manufacturing method for organic electroluminescent equipment

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KR20190025510A (en) 2019-03-11
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TW201912817A (en) 2019-04-01

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