KR20130039890A

KR20130039890A - Nozzle

Info

Publication number: KR20130039890A
Application number: KR1020110104540A
Authority: KR
Inventors: 노환익
Original assignee: 세메스 주식회사
Priority date: 2011-10-13
Filing date: 2011-10-13
Publication date: 2013-04-23

Abstract

PURPOSE: A nozzle and a substrate processing apparatus having the same are provided to improve washing efficiency during a washing process by providing a liquid chemical on a substrate and to spray the liquid chemical into the same area when multiple nozzles are mounted on one support stand, thereby reducing costs and improving spatial efficiency in case of using the multiple nozzles. CONSTITUTION: A nozzle(400) includes a main body(410) having a first passage(420) through which a first liquid chemical is supplied and a second passage(430) through which a second liquid chemical is supplied inside. One of the first passage and the second passage covers the other. A first outlet(422) connected with the first passage is formed in a central area of the lower surface of the main body. The main body sprays the first liquid chemical in a mist form. The first passage functions as a passage through which the first liquid chemical is supplied. An upper area(420a) of the first passage has a wider width than a lower area(420b). The upper area of the first passage is connected with a gas inlet passage(440). A second outlet(432) connected with the second passage is formed at the edge of a lower surface of the main body. The second passage having a ring shape covers the first passage and sprays the second liquid chemical in a dropping manner. The second outlet sprays the second liquid chemical into a substrate(W) in order not to be overlapped with a substrate area in which the first liquid chemical is sprayed.

Description

Nozzle

The present invention relates to a nozzle for injecting a chemical liquid and a substrate processing apparatus having the same.

In order to manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition are performed on the substrate. A cleaning process is performed to clean the substrate before or after each process to remove contaminants and particles generated in each process.

In general, according to the object to be cleaned, the cleaning process uses a nozzle for spraying the chemical liquid in a dropping manner or an air flow nozzle for spraying gas into the chemical liquid and spraying the mist into the mist. It is advantageous for the advective nozzle to weaken the adherence of contaminants and particles on the substrate, and the dropping nozzle is advantageous for removing contaminants and particles with reduced adhesion on the substrate.

Further, two dropping nozzles for supplying different chemical solutions to one support can be installed. In such a case, the respective nozzles are disposed adjacent to each other, and the chemical liquid ejected from one of the nozzles bounces off the substrate and contaminates another nozzle. In addition, it is disadvantageous to remove contaminants and particles as the amount of the chemical solution splashing from the substrate increases. Each nozzle is also located along the longitudinal direction of the support. Therefore, when the support is swinging, each of the nozzles is not moved to the same movement locus, and the chemical solution is sprayed to different areas. Also, the number of increased nozzles increases the assembly and disassembly time of the device and increases the cost of maintaining it.

The present invention is intended to improve cleaning efficiency in a cleaning process by supplying a chemical solution on a substrate.

In addition, in the present invention, when a plurality of nozzles are mounted on one support and the process proceeds, each nozzle tries to inject the chemical solution into the same area.

Also, when the plurality of nozzles are used, the space efficiency is lowered and the cost is increased to be minimized.

The present invention provides a nozzle for injecting a chemical liquid and a substrate processing apparatus having the same. The nozzle includes a body provided with a first passage through which the first chemical liquid is supplied and a second passage through which the second chemical liquid is supplied, wherein one of the first passage and the second passage is provided to surround the other one. .

The body may be provided to spray the first chemical in the form of a mist, and may be provided to spray the second chemical in a dropping manner. The first passage is in communication with the first discharge port formed in the central region of the bottom surface of the body, The second passage is in communication with a second discharge port formed in the bottom edge region of the body, the second discharge port may be provided in a ring shape surrounding the first discharge port. The second discharge port may be inclined in a direction away from the first discharge port.

The substrate treating apparatus includes a housing providing a space in which the substrate is processed, a spin head disposed in the housing to support the substrate, and a spraying unit spraying the first chemical and the second chemical onto the substrate. ,

The injection unit includes a nozzle having a body provided with a first passage through which the first chemical is supplied and a second passage through which the second chemical is supplied, and a chemical supply member supplying the first and second chemicals to the nozzle. Including, but one of the first passage and the second passage is provided to surround the other.

The body may be provided to spray the first chemical in the form of a mist, and may be provided to spray the second chemical in a dropwise manner. The first passage communicates with a first discharge port formed in a central area of the bottom surface of the body, and the second passage communicates with a second discharge port formed in a bottom edge area of the body, and the second discharge port communicates with the first discharge port. It may be provided in a shape surrounding the discharge port. The injection unit may further include a support for supporting the nozzle and a support shaft coupled to the support for swinging the nozzle. The chemical liquid supply member includes a first chemical liquid supply line for supplying a first chemical liquid to the first passage and a second chemical liquid supply line for supplying a second chemical liquid to the second passage, wherein the second chemical liquid supply line includes the first chemical liquid supply line. It may be branched from the first chemical supply line.

According to the embodiment of the present invention, the cleaning efficiency can be improved in the cleaning process by supplying the chemical liquid onto the substrate.

Further, according to the embodiment of the present invention, one nozzle can jet the first chemical liquid and the second chemical liquid in different ways.

In addition, according to the embodiment of the present invention, the first chemical liquid and the second chemical liquid, which are injected into different discharge ports from one body when swinging the support, can maintain the same discharge path.

In addition, according to the embodiment of the present invention, the second chemical liquid is sprayed in the shape of wrapping the first chemical liquid, so that the splashing of the first chemical liquid can be minimized.

According to the embodiment of the present invention, the first discharge port and the second discharge port are provided so as to face in different directions, so that overlapping areas of the first chemical liquid and the second chemical liquid can be minimized.

1 is a plan view schematically showing a substrate processing facility.
2 is a cross-sectional view schematically showing the substrate processing apparatus of FIG.
3 is a cross-sectional view showing a nozzle of the injection unit of FIG.
Fig. 4 is a cross-sectional view showing another embodiment of the nozzle of Fig. 3;
Fig. 5 is a view showing the chemical liquid supply member of the injection unit of Fig. 2;
Fig. 6 is a view showing another embodiment of the chemical liquid supply member of Fig. 5;
FIG. 7 is a view showing a process of spraying the first chemical solution and the second chemical solution through the nozzle of FIG. 3;
FIG. 8 is a plan view showing a region where the first chemical solution and the second chemical solution are injected through the nozzle of FIG. 7; FIG.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 to 8. FIG.

1 is a plan view schematically showing a substrate processing facility of the present invention. Referring to FIG. 1, the substrate processing apparatus 1 has an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is seated in the load port 140. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the process chambers 260 are provided to be symmetrical with respect to the transfer chamber 240. A plurality of process chambers 260 are provided on one side of the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B. Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked to be spaced apart from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). &Lt; / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

In the process chamber 260, a substrate processing apparatus 300 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 300 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups such that the substrate processing apparatuses 300 in the process chambers 260 belonging to the same group are identical to one another, (300) may be provided differently from each other.

2 is a sectional view showing the substrate processing apparatus of FIG. 2, the substrate processing apparatus 300 has a housing 320, a spin head 340, a lift unit 360, a spray unit 380, and a cleaning member 400. The housing 320 has a space in which a substrate processing process is performed, and the upper portion thereof is opened. The housing 320 has an inner recovery cylinder 322 and an outer recovery cylinder 326. [ Each of the recovery cylinders 322 and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 340 and the outer recovery cylinder 326 is provided in an annular ring shape surrounding the inner recovery cylinder 322. The inner space 322a of the inner recovery cylinder 322 and the space 326a between the inner recovery cylinder 322 and the outer recovery cylinder 326 are connected to each other by the inner recovery cylinder 322 and the outer recovery cylinder 326, And serves as an inflow port. Recovery passages 322b and 326b extending perpendicularly to the bottom of the recovery passages 322 and 326 are connected to the recovery passages 322 and 326, respectively. Each of the recovery lines 322b and 326b discharges the processing liquid introduced through each of the recovery cylinders 322 and 326. [ The discharged treatment liquid can be reused through an external treatment liquid recovery system (not shown).

The spin head 340 supports the substrate W and rotates the substrate W during the process. The spin head 340 has a body 342, a support pin 344, a chuck pin 346, and a support shaft 348. The body 342 has a top surface that is generally circular when viewed from the top. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom surface of the body 342.

A plurality of support pins 344 are provided. The support pins 344 are spaced apart from the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 344 support the rear edge of the substrate W such that the substrate W is spaced from the upper surface of the body 342 by a predetermined distance.

A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the spin head 340 is rotated. The chuck pin 346 is provided to allow linear movement between the standby position and the support position along the radial direction of the body 342. The standby position is a distance from the center of the body 342 relative to the support position. The chuck pin 346 is positioned in the standby position when the substrate W is loaded or unloaded onto the spin head 340 and the chuck pin 346 is positioned in the supporting position when the substrate W is being processed. At the support position, the chuck pin 346 contacts the side of the substrate W.

The lifting unit 360 moves the housing 320 linearly in the vertical direction. The relative height of the housing 320 with respect to the spin head 340 is changed as the housing 320 is moved up and down. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly installed on the outer wall of the housing 320, and the movement shaft 364 which is moved in the vertical direction by the driver 366 is fixedly coupled to the bracket 362. The housing 320 is lowered so that the spin head 340 protrudes to the upper portion of the housing 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. In addition, when the process is in progress, the height of the housing 320 is adjusted to allow the chemical liquid to flow into the predetermined recovery container 360 according to the type of the processing liquid supplied to the substrate W. Alternatively, the lifting unit 360 can move the spin head 340 in the vertical direction.

The ejection unit 380 ejects the chemical liquid onto the substrate W. [ The injection unit 380 has a support shaft 386, a support base 392, a nozzle 400, and a chemical liquid supply member 450. The support shaft 386 is disposed on one side of the housing 320. The support shaft 386 has a rod shape whose longitudinal direction is provided in a vertical direction. The support shaft 386 is rotatable and liftable by the drive member 388. Alternatively, the support shaft 386 can be linearly moved and elevated in the horizontal direction by the driving member 388. [ Support base 392 supports nozzle 400. The support base 392 is coupled to the support shaft 386, and the nozzle 400 is fixedly coupled to the bottom end surface. By the rotation of the driving member 388, the nozzle 400 is swingable.

The nozzle 400 injects the first chemical liquid and the second chemical liquid in different ways from each other. According to an example, the nozzle 400 injects the first chemical liquid in the form of mist on the substrate W to weaken the adherence of contaminants and particles adhering to the substrate W. The nozzle 400 ejects the second chemical liquid in a dropping manner to remove contaminants and particles with weak adhesion on the substrate W. [

3 is a cross-sectional view showing a nozzle of the injection unit of FIG. Referring to FIG. 3, the nozzle 400 has a body 410 in which a first passage 420 and a second passage 430 are provided. The first passage 420 is provided in the inner central region of the body 410. When seen from the front, the first passage 420 is provided in the vertical direction. The first passage 420 and the second passage 430 are provided independently of each other. The first passage 420 functions as a passage through which the first chemical liquid is supplied. The upper region 420a of the first passage 420 is provided with a larger width than the lower region 420b. A first discharge port 422 communicating with the first passage 420 is formed in the central area of the bottom of the body 410. The first discharge port 422 is provided so as to face downward. The first passage 420 has its upper region 420a communicated with the gas inflow passage 440. The gas inlet passage 440 functions as a passage through which gas is supplied. The gas supplied to the gas inflow passage 440 injects the first chemical liquid supplied through the first passage 420 in the form of mist.

The second passage 430 is provided in an annular ring shape surrounding the first passage 420. The second passage 430 functions as a passage through which the second chemical solution is supplied. The second chemical liquid is sprayed in a dropping manner. A second discharge port 432 communicating with the second passage 430 is formed in the bottom edge region of the body 410. The second discharge port 432 is provided in a ring shape. The second discharge port 432 is provided obliquely with respect to the ground. The second discharge port 432 is provided so as to be directed away from the first discharge port 422 as it goes downward. According to one example, the bottom edge region of the body 410 may be formed to be upward sloped away from the central region. The second discharge port 432 injects the second chemical liquid onto the substrate W so that the second chemical liquid does not overlap the area of the substrate W onto which the first chemical liquid is ejected. The second chemical liquid is sprayed in the form of wrapping the first chemical liquid to prevent the first chemical liquid from splashing and scattering from the substrate W. [

The second ejection openings 432 are provided in plural and can be arranged to surround the first ejection openings 422. The second discharge ports 432 may be provided apart from each other along the circumferential direction of the body 410.

Unlike the above-described embodiment, the first passage 420 and the second passage 430 may be provided so that their positions are changed from each other as shown in FIG. The gas inlet passage 440 can be changed in position together with the first passage 420. [ In this case, the first chemical liquid may be sprayed in the form of mist in the bottom edge region of the body 410, and the second chemical liquid may be sprayed in the dropping manner in the central region of the bottom surface of the body 410.

Alternatively, the gas inflow passage 440 may communicate with the second passage 430 to supply the gas to the second passage 430. The gas supplied to the second passage 430 can be sprayed in the form of mist by pressurizing the second chemical liquid.

Fig. 5 is a view showing the chemical liquid supply member of the injection unit of Fig. 2; Referring to FIG. 5, the chemical liquid supply member 450 supplies the first chemical liquid and the second chemical liquid to the nozzle 400. The chemical liquid supply member 450 has a first chemical liquid supply line 452 and a second chemical liquid supply line 454. The first chemical liquid supply line 452 supplies the first chemical liquid to the first passage 420. The second chemical solution supply line 454 supplies the second chemical solution to the second passage 430. The second chemical supply line 454 may branch from the first chemical supply line 452 and supply the same chemical solution to the first passage 420 and the second passage 430, respectively. In this case, the cleaning process of the substrate W can have both of the advantages of the dropping method and the mist-type chemical liquid spraying method.

6, the first chemical solution supply line 452 and the second chemical solution supply line 454 are connected to the first chemical solution storage part 425a and the second chemical solution storage part 425b, respectively, 2 < / RTI > The first chemical solution and the second chemical solution stored in the first chemical solution storage part 425a and the second chemical solution storage part 425b may be the same chemical solution or different chemical solutions.

For example, the first chemical liquid and the second chemical liquid may be an organic solvent such as a chemical such as hydrofluoric acid, deionized water, or isopropyl alcohol.

Unlike the above, the nozzle 400 can inject the first chemical solution and the second chemical solution in the same injection manner. For example, the nozzle 400 may have a structure in which both the first chemical liquid and the second chemical liquid are sprayed in a dropping manner, or may have a structure in which all of them spray mist.

Next, a method of processing the substrate W using the above-described substrate processing apparatus 1 will be described.

The FOUP housing the plurality of substrates W is seated on the load port. The index robot 144 takes out the substrate W accommodated in the FOUP and transfers it to the buffer unit 220. The main transfer robot 244 transfers the substrate W loaded on the buffer unit 220 to the process chamber 260. When the substrate W is loaded into the spin head 342 disposed in the processing chamber 260, the housing 320 adjusts the height so that the inlet 322a of the inner recovery cylinder 322 corresponds to the substrate W .

The spin head 342 supporting the substrate W rotates and the nozzle 400 is positioned above the central region of the substrate W in the process position. The nozzle 400 simultaneously discharges the first chemical liquid and the second chemical liquid and swings between the center region and the edge region of the substrate W. FIG. FIG. 7 is a view showing a process of spraying the first chemical liquid and the second chemical liquid through the nozzle of FIG. 3, and FIG. 8 is a plan view showing a region where the first chemical liquid and the second chemical liquid are injected through the nozzle of FIG. Referring to FIGS. 7 and 8, as the nozzle 400 is swung, the substrate W is cleaned by the first chemical liquid to weaken the adherence of contaminants and particles. The second chemical liquid is supplied to the region (A) where the first chemical liquid is injected to remove contaminants and particles. For example, the region A in which the first chemical liquid is injected may have a circular shape, and the region B in which the second chemical liquid is injected may be provided in a ring shape surrounding the region A in which the first chemical liquid is injected.

When the first cleaning process is completed, the nozzle 400 is moved to the standby position, and the second cleaning process proceeds. The height of the housing 320 is adjusted so that the inlet 326a of the external recovery cylinder 326 corresponds to the substrate W. [ The nozzle 400, which is not used in the first cleaning step, secondarily measures the substrate W by supplying the rinse liquid onto the substrate W. Subsequently, the substrate W having been subjected to the second-leveling process is unloaded and transferred to the buffer unit 220 by the main transfer robot 244. The index robot 144 transfers the substrate W loaded on the buffer unit 220 to a FOUP.

Unlike the above, the nozzle 400 can sequentially spray the first chemical solution and the second chemical solution. In this case, the nozzle 400 swings the substrate W to spray the first chemical liquid, and when the cleaning of the first chemical liquid is completed, the second chemical liquid can be sprayed.

400: nozzle 410: body
420: first passage 422: first discharge port
430: second passage 432: second outlet
452: first chemical liquid supply line 454: second chemical liquid supply line

Claims

It includes a body provided therein the first passage is supplied with the first chemical liquid and the second passage is supplied with the second chemical liquid;
The nozzle of any one of the first passage and the second passage is provided to surround the other.

The method of claim 1,
The body is provided to spray the first chemical in the form of a mist, characterized in that the nozzle is provided to spray the second chemical in a dropping manner.