KR20130037044A - Light emitting device package and light unit having the same - Google Patents

Abstract

PURPOSE: A light emitting device package and a light unit including the same are provided to control a color distribution by controlling an insertion position and a size of a fluorescent film. CONSTITUTION: A support member(12) includes a first metal layer(12-1) and a second metal layer(12-2). A light emitting chip(18) is electrically connected to the first metal layer and the second metal layer of the support member. A molding member(21) covers the light emitting chip. A first groove(22-1) is arranged in a region between the side of the molding member and the light emitting chip. A reflection layer(25) is arranged on the side of the molding member. A fluorescent film(23,24) is arranged in the first groove.

Description

LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME}

The embodiment relates to a light emitting device and a light unit having the same.

 A light emitting device, such as a light emitting device, is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing a conventional fluorescent lamp and an incandescent lamp.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode is increasingly used as a light source for various lamps used for indoor and outdoor use, lighting devices such as a liquid crystal display, an electric signboard, and a streetlight.

The embodiment provides a light emitting device package having a new structure.

The embodiment provides a light emitting device package including a light emitting chip disposed on a support member and a phosphor film and a reflective layer disposed around a molding member covering the light emitting chip, and a light unit having the same.

The embodiment provides a light emitting device package and a light unit having the same, in which the phosphor film in the molding member is vertically or inclined with respect to the upper surface of the support member.

The embodiment provides a light emitting device package and a light unit having the same, in which a reflective layer disposed on the side or inside of the molding member is disposed outside the phosphor film.

The light emitting device package according to the embodiment includes a support member having a first metal layer and a second metal layer; A light emitting chip electrically connected to the first metal layer and the second metal layer of the support member and disposed on at least one of the first metal layer and the second metal layer; A molding member formed on the support member and covering the light emitting chip; A first groove formed in the molding member and disposed in an area between the side surface of the molding member and the light emitting chip; A reflective layer disposed outside the phosphor film; And a phosphor film disposed in the first groove.

The embodiment provides a light emitting device package having a new structure.

The embodiment provides a light emitting device package including a phosphor film inserted around a light emitting chip disposed on a support member.

The embodiment can improve the manufacturing process of the light emitting device package.

The embodiment can adjust the insertion position or size of the phosphor film, thereby providing a light emitting device package capable of adjusting the color distribution.

The embodiment may improve the reliability of the light emitting device package and the light unit having the same.

1 is a side cross-sectional view illustrating a light emitting device package according to a first embodiment.
FIG. 2 is a plan view of the light emitting device package of FIG. 1.
3 is a plan view illustrating another example of a phosphor film of the light emitting device package of FIG. 1.
4 is a plan view illustrating still another example of the phosphor film of the light emitting device package of FIG. 1.
5 is a side cross-sectional view illustrating a light emitting device package according to a second embodiment.
6 is a side cross-sectional view illustrating a light emitting device package according to a third embodiment.
7 is a side cross-sectional view illustrating a light emitting device package according to a fourth embodiment.
8 is a side cross-sectional view illustrating a light emitting device package according to a fifth embodiment.
9 is a side cross-sectional view illustrating a light emitting device package according to a sixth embodiment.
10 is a side cross-sectional view illustrating a light emitting device package according to a seventh embodiment.
11 is a view illustrating a light emitting chip according to an embodiment.
12 is a diagram illustrating another example of a light emitting chip according to one embodiment.
FIG. 13 is a diagram illustrating a display device having the light emitting device package of FIG. 1.
14 is a diagram illustrating another example of a display device having the light emitting device package of FIG. 1.
FIG. 15 is a view illustrating a lighting device having the light emitting device package of FIG. 1.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under"Quot; on "and" under "as used herein are intended to refer to all that is" directly "or" indirectly " . In addition, the criteria for up / down or down / down each layer will be described with reference to the drawings. In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not entirely reflect the actual size. Like reference numerals denote like elements throughout the description of the drawings.

Hereinafter, a light emitting device package according to embodiments will be described with reference to the accompanying drawings.

1 is a side cross-sectional view illustrating a light emitting device package according to a first embodiment, and FIG. 2 is a plan view of the light emitting device package of FIG. 1.

Referring to FIG. 1, the light emitting device package 11 may include a support member 12; A light emitting chip 18 disposed on the support member 12; A molding member 21 disposed on the support member 12; Phosphor films 23 and 24 disposed in the molding member 21; And a reflective layer 25 disposed on the side of the molding member 21.

The support member 12 may be a resin based printed circuit board (PCB), silicon based on silicon or silicon carbide (SiC), ceramic based on aluminum nitride (AlN), or polyphthal It may be formed of at least one of a resin series such as amide (polyphthalamide (PPA)), a liquid crystal polymer (PCB), and a metal core PCB (MCPCB) having a metal layer on the bottom thereof, but is not limited thereto.

The support member 12 may include a first metal layer 12-1, a second metal layer 12-2, a first connection member 12-3, a second connection member 12-4, and a first lead portion ( 12-5) and the second lead portion 12-6. The first metal layer 12-1 and the second metal layer 12-2 are spaced apart from each other on the support member 12. The first lead part 12-5 and the second lead part 12-6 are disposed to be spaced apart from each other under the support member 12. The first connection member 12-3 may be disposed inside or on the first side surface of the support member 12, and the first metal layer 12-1 and the first lead portion 12-5 may be disposed. Connect each other. The second connection member 12-4 may be disposed inside or on the second side surface of the support member 12, and the second metal layer 12-2 and the second lead part 12-6 may be disposed. Connect each other.

The first metal layer 12-1, the second metal layer 12-2, the first lead part 12-5, and the second lead part 12-6 are made of a metal material, for example, titanium (Ti). At least one of copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), or It may be formed of these optional alloys, and may be formed of a single metal layer or a multilayer metal layer.

The first connection member 12-3 and the second connection member 12-4 may be formed of at least one of a via, a via hole, and a through hole using a conductive material, for example, a metal.

The light emitting chip 18 is disposed on the first metal layer 12-1 of the support member 12 and electrically connected to the first metal layer 12-1 and the second metal layer 12-2. do. The light emitting chip 18 may be bonded on the first metal layer 12-1 and connected to the second metal layer 12-2 by a wire 19. As another example, the light emitting chip 18 may be connected to the first metal layer 12-1 and the second metal layer 12-2 by a wire 19 or bonded in a flip manner. One or more light emitting chips 18 may be disposed on the support member 12.

The light emitting chip 18 may selectively emit light in a range of visible light to ultraviolet light, for example, UV (Ultraviolet) LED chip, red LED chip, blue LED chip, green LED chip, yellow green LED It may optionally include a colored LED chip such as a chip. The light emitting chip 18 may be in contact with an upper surface of the support member 12, but is not limited thereto. Heat generated from the light emitting chip 18 may be conducted through the support member 12. Phosphor may be coated on the surface of the light emitting chip 18, but is not limited thereto.

The molding member 21 may be formed to have a first thickness D1 set in advance on the support member 12. The molding member 21 may have a polygonal shape as shown in FIG. 2, or may include a circular or elliptical shape. The molding member 21 may be manufactured by a transfer molding method using a preset mold.

The molding member 21 may be made of a light transmissive material, and its refractive index may be formed of a material of less than two. The molding member 21 may be formed of a translucent resin, for example, a resin such as silicon or epoxy.

The upper surface of the molding member 21 may be a flat surface, a central portion may be formed more concave than the outside, or the central portion may be formed more convex than the outside. In addition, the upper surface of the molding member 21 may be formed in a rough concave-convex structure, but is not limited thereto. A lens may be further disposed on the molding member 21, and the lens may be selectively included among a convex lens, a convex lens having a concave portion at a central portion thereof, and a concave lens.

The width of the molding member 21 may be the same as or more narrow than the width of the support member 12, but is not limited thereto.

At least one groove 22-1 and 22-2 may be formed in the molding member 21. The grooves 22-1 and 22-2 may be formed to be inclined with respect to an axis perpendicular to the upper surface of the support member 12, and a depth thereof is formed at a predetermined depth from an upper surface of the molding member 21. Can be. The depths of the grooves 22-1 and 22-2 may be formed to be spaced apart from the top surface of the support member 12 or to expose the top surface of the support member 12. The grooves 22-1 and 22-2 may be recesses or holes. The grooves 22-1 and 22-2 may include a first groove 22-1 disposed between the light emitting chip 18 and the first side surface S1 of the molding member 21, and the light emitting chip ( 18 and a second groove 22-2 disposed between the second side surface S2 of the molding member 21.

The phosphor films 23 and 24 are inserted into the grooves 22-1 and 22-2. At least one side surface of the inserted phosphor films 23 and 34 may be adhered to an inner surface of the molding member 21, but is not limited thereto.

Lower surfaces of the phosphor films 23 and 24 may contact or be spaced apart from the upper surface of the support member 12. Upper surfaces of the phosphor films 23 and 24 may be disposed on the same plane as the upper surface of the molding member 21 or may be disposed to have a lower or more protruding shape than the upper surface of the molding member 21.

The phosphor films 23 and 24 include a first phosphor film 23 disposed in the first groove 22-1 and a second phosphor film 24 disposed in the second groove 22-2. The first phosphor film 23 and the second phosphor film 24 are spaced apart from the light emitting chip 18 and disposed to face each other as shown in FIG. 2. The first phosphor film 23 may be disposed to be inclined along the inclined structure of the first groove 22-1, and the second phosphor film 24 may have the inclined structure of the second groove 22-2. It may be disposed obliquely along. The inclination angle θ1 of the second phosphor film 24 is greater than 90 degrees and less than 180 degrees with respect to the upper surface of the support member 12, for example, may be formed in the range of 91 ° to 150 °. The inclination angle of the first phosphor film 23 may also be formed in the range of the inclination angle of the second phosphor film 24. The phosphor films 23 and 24 may be disposed closer to the side surfaces S1 and S2 of the molding member 21 than to the light emitting chip 28.

The first phosphor film 23 is disposed between the light emitting chip 18 and the first side surface S1 of the molding member 21, and the second phosphor film 24 is connected to the light emitting chip 18. It may be disposed between the second side surface (S2) of the molding member (21).

The thickness of the first phosphor film 23 and the second phosphor film 24 may be the same, but is not limited thereto. The length L1 of the first phosphor film 23 and the second phosphor film 24 is the width between the third side surface S3 and the fourth side surface S4 of the molding member 21 as shown in FIG. 2. And may be the same or different from each other.

The first phosphor film 23 and the second phosphor film 24 may be the same kind of phosphors, or different kinds of phosphors may be added. The yellow phosphor may be added to the first phosphor film 23, and the blue phosphor or / and the red phosphor may be added to the second phosphor film 24. In addition, at least one kind of phosphor may be added to the first phosphor film 23 and the second phosphor film 24, but is not limited thereto. The phosphor may include at least one of a red phosphor, a green phosphor, a blue phosphor, and a yellow phosphor. The phosphor may be selectively formed among, for example, YAG, TAG, Silicate, Nitride, and Oxy-nitride-based materials.

The first phosphor film 23 and the second phosphor film 24 may be prepared by being added to a light transmitting resin layer such as silicon or epoxy, and then cut to a predetermined film thickness. The first phosphor film 23 and the second phosphor film 24 are slidably inserted into the first grooves 22-1 and the second grooves 22-2 of the molding member 21, and are required. Can be replaced. Since the first phosphor film 23 and the second phosphor film 24 can be combined or separated, a film having a different phosphor content or a film having a different phosphor type can be replaced. This may be achieved by molding the light emitting chip 18 with the molding member 21 and then replacing the first and second phosphor films 23 and 24 in the final package stage to adjust the color coordinate distribution.

The first phosphor film 23 and the second phosphor film 24 are spaced apart from the light emitting chip 18 as a heating source, so that the first phosphor film 23 and the second phosphor film 24 are discolored, It is possible to solve the problem that the phosphor sinks to the bottom surface of the molding member 21.

The molding member 21 may include a phosphor of the same kind as the first phosphor film 23 and the second phosphor film 24 or a different kind of phosphor. For example, the phosphor of the molding member 21 may be a yellow phosphor, and the first and second phosphor films 23 and 24 may include at least one of a blue phosphor and a red phosphor. In the phosphor content, more yellow phosphors may be added than blue phosphors or red phosphors.

A reflective layer 25 may be formed on at least one side surface S1-S4 of the molding member 21. The reflective layer 25 may be formed on two sides or all sides of the molding member 21. The reflective layers 25 formed on two sides of the molding member 21 may be disposed opposite to each other or adjacent to each other. Reflective layer 25 formed on the front side (S1-S4) of the molding member 21, as shown in FIG. 2 includes a frame shape, a ring shape, a polygonal cylinder shape.

The minimum distance T1 between the reflective layer 25 and the phosphor films 23 and 24 may be spaced at least 10 μm or more, and the gap T1 may transmit light passing through the phosphor films 23 and 24. Can be reflected. The phosphor films 23 and 24 may be disposed closer to the reflective layer 25 than to the light emitting chip 18. The reflective layer 25 and the phosphor films 23 and 24 may be formed to have a depth greater than or equal to the thickness D1 of the molding member 21.

The reflective layer 25 may be made of a reflective sheet or a metal layer. The reflective layer 25 may include at least one of Ag, Ag alloy, Ni, Al, Al alloy, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf.

The height of the reflective layer 25 may be equal to, lower, or higher than the first thickness D1 of the molding member 21. Since the light reflectance may vary depending on the height of the reflective layer 25, the height may be adjusted in consideration of the light distribution.

An upper surface of the molding member 21, an upper surface of the first phosphor film 23, an upper surface of the second phosphor film 24, and an upper surface of the reflective layer 25 may be disposed on the same plane. At least one of an upper surface of the first phosphor film 23 and an upper surface of the second phosphor film 24 may protrude more than an upper surface of the molding member 21, and may facilitate replacement of the phosphor film. .

3 is an example in which the phosphor film of FIG. 1 is modified.

Referring to FIG. 3, the phosphor film disposed in the molding member 21 includes first to fourth phosphor films 23, 24, 23A, and 24A. The first phosphor film 23 is disposed between the light emitting chip 18 and the first side surface S1 of the molding member 21, and the second phosphor film 24 is the light emitting chip 18 and the molding member 21. Disposed between the second side surface S2 of the third phosphor film 23A is disposed between the light emitting chip 18 and the third side surface S3 of the molding member 21, and the fourth phosphor film 24A. Is disposed between the light emitting chip 18 and the fourth side surface S4 of the molding member 21.

The first to fourth phosphor films 23, 24, 23A, and 24A may be physically separated from each other, and may be individually inserted into the grooves 22-3. The groove 22-3 may be a polygonal or circular hole, but is not limited thereto. The first phosphor film 23 and the second phosphor film 24 face each other, and the third phosphor film 23A and the fourth phosphor film 24A are disposed to face each other.

The first to fourth phosphor films 23, 24, 23A, and 24A cover side surfaces of the light emitting chip 18, and the reflective layer 25 includes the first to fourth phosphor films 23, 24, and 23A. , 24A) to cover the outside.

An interval between the first to fourth phosphor films 23, 24, 23A, and 24A and the reflective layer 25 may be the same on the upper surface of the molding member 21.

4 is another example of the phosphor film of FIG. 1.

Referring to FIG. 4, the phosphor film is a third phosphor film 23A inserted into grooves 22-4 and 22-5 disposed between the light emitting chip 18 and the third side surface S3 of the molding member 21. ) And a fourth phosphor film S4 inserted into a groove 22-5 formed between the light emitting chip 18 and the fourth side surface S4 of the molding member 21. The length of the third side surface S3 and the fourth side surface S4 of the molding member 21 may be longer than that of the first side surface S1 and the second side surface S2.

The third phosphor film 23A and the fourth phosphor film 24A are disposed to face each other, and are spaced apart from each other by a width T2 equal to or wider than the width of the first electrode layer 21-1 of the support member 12. Can be spaced apart. The length L2 of the third phosphor film 23A and the fourth phosphor film 24A may be the same or different from each other, and the center between the third phosphor film 23A and the fourth phosphor film 24A may be different. The light emitting chip 18 may be disposed.

5 is a light emitting device package according to a second embodiment.

Referring to FIG. 5, the light emitting device package 11A includes a plurality of grooves 32-1 and 32-2 and a plurality of phosphor films 33 in the support member 12, the light emitting chip 18, and the molding member 21. , 34). The plurality of grooves 32-1 and 32-2 include a first groove 32-1 and a second groove 32-2, and the plurality of phosphor films 33 and 34 have the first grooves. The first phosphor film 33 disposed at 32-1 and the second phosphor film 34 disposed at the second groove 32-2 are included. The first groove 32-1 is formed in a curved structure when viewed from the side cross section, and the second groove 32-2 is formed in a curved structure when viewed from the side cross section. An interval between the first groove 32-1 and the second groove 32-2 is disposed to be spaced apart from the upper portion more than the lower portion. The curved structure may be defined as a structure in which the centers of the grooves 32-1 and 32-2 are convex in the lateral direction of the molding member 21, but are not limited thereto. When viewed from the top of the first groove 32-1 and the second groove 32-2, it may be formed in a curved structure. Since the first groove 32-1 and the second groove 32-2 have a curved structure, the depth of the first groove 32-1 and the second groove 32-2 may be greater than or equal to the thickness of the molding member 21.

The first phosphor film 33 inserted into the first groove 32-1 is disposed in a curved shape, and the second phosphor film 34 inserted into the second groove 32-2 is in a curved shape. Is placed. Since the outer side surfaces of the first and second phosphor films 33 and 34 have a larger area than the inner side surface and are disposed in a curved surface, the first and second phosphor films 33 and 34 may be refracted to incident or transmitted light.

The phosphor films 33 and 34 may be disposed in both side directions or all side directions of the light emitting chip 18, but are not limited thereto.

The reflective layer 35 reflects the light transmitted through the phosphor films 33 and 34 from the outside of the phosphor films 33 and 34.

6 is a side cross-sectional view illustrating a light emitting device package according to a third embodiment.

Referring to FIG. 6, the light emitting device package includes a support member 12, a light emitting chip 18, and a plurality of phosphor films 43 and 44 and reflective layers 45 and 46 in the molding member 21.

The plurality of phosphor films 43 and 44 may include a first phosphor film 43 disposed between the light emitting chip 18 and the first side surface S1 of the molding member 21, and the light emitting chip 18. And a second phosphor film 44 disposed between the second side surface S2 of the molding member 21. The first phosphor film 43 and the second phosphor film 44 are arranged in a structure perpendicular to the upper surface of the support member 12.

Here, the first groove 42-1 on which the first phosphor film 43 is disposed is formed in a vertical shape, and the second groove 42-2 on which the second phosphor film 44 is disposed is vertical. It is formed in one form.

The reflective layers 45 and 46 may be spaced apart from the side surfaces S1 and S2 of the molding member 21 at predetermined intervals T3, and may be inclined. The reflective layers 45 and 46 may include a first reflection layer 45 and a second phosphor film 44 disposed between the first phosphor film 43 and the first side surface S1 of the molding member 21. The second reflective layer 46 is disposed between the second side surface S2 of the molding member 21.

The first reflection layer 45 is formed in the inclined third groove 42-3, and the second reflection layer 46 is formed in the inclined fourth groove 42-4. The third groove 42-3 and the fourth groove 42-4 may be formed to have an inclined structure, and a depth of the third groove 42-3 and the fourth groove 42-4 may be formed to be greater than or equal to the thickness of the molding member 21.

The interval between the first reflecting layer 45 and the first phosphor film 43 is a lower region is disposed narrower than the upper region, the interval between the second reflecting layer 46 and the second phosphor film 44 The lower region may be arranged narrower than the upper region. Since the first reflection layer 45 and the second reflection layer 46 are disposed in an inclined structure, the light reflection efficiency and the directivity angle may be improved. The inclination angle θ2 of the first and second reflection layers 46 may be formed at an angle of 30 degrees or more and less than 90 degrees with respect to the upper surface of the support member 12.

Here, the phosphor films 43 and 44 may be disposed around the light emitting chip 18, and the reflective layers 45 and 46 may be disposed around the light emitting chip 18. It may be arranged in an inclined structure to cover the outside of the).

7 is a side cross-sectional view of a light emitting device package according to a fourth embodiment.

Referring to FIG. 7, the light emitting device package includes a support member 12, a light emitting chip 18, a plurality of phosphor films 43 and 44, and reflective layers 45A and 46A in the molding member 21.

The plurality of phosphor films 43 and 44 include a first phosphor film 43 and a second phosphor film 44 disposed in vertical grooves 42-1 and 42-2. Looking at the interval between the first phosphor film 43 and the second phosphor film 44, the interval between the upper region and the lower region may be equal to each other.

The reflective layers 45A and 46A include a first reflective layer 45A and a second reflective layer 46A disposed in the grooves 42-5 and 42-6 having a curved structure. An interval between the first reflective layer 45A and the second reflective layer 46A may be lower than that of the upper region.

8 is a side cross-sectional view of a light emitting device package according to a fifth embodiment.

Referring to FIG. 8, the light emitting device package may include at least one groove 52-1 and 52-2 and the groove 52-1 and 52 in the support member 13, the light emitting chip 18, and the molding member 21. -2) phosphor films 53 and 54 and reflective layers 55 and 56 superposed in the horizontal direction.

The grooves 52-1 and 52-2 may be spaced apart from each other as shown in FIG. 2, or may be formed in a structure connected to each other as shown in FIG. 3.

The reflective layers 55 and 56 are in contact with the outer side surfaces of the phosphor films 53 and 54.

The heights of the phosphor films 53 and 54 and the reflective layers 55 and 56 may be the same height, or the reflective layers 55 and 56 may be higher than the heights of the phosphor films 53 and 54.

The phosphor films 53 and 54 and the reflecting layers 55 and 56 overlap the grooves 52-1 and 52-2 in the horizontal direction, respectively, so that the reflecting layers 55 and 56 are separately inserted. I can solve it. Since the phosphor films 53 and 54 and the reflective layers 55 and 56 are integrally manufactured in advance, the phosphor films 53 and 54 may be inserted into or removed from the grooves 52-1 and 52-2, thereby simplifying replacement.

The reflective layers 55 and 56 may be provided as separate sheets or may be reflective coating layers coated on the phosphor films 53 and 54.

Here, the support member 13 is a resin-based printed circuit board (PCB), silicon (silicon) or silicon carbide (silicon carbide (SiC)), such as silicon-based, ceramic nitride such as aluminum nitride (Aluminum nitride (AlN)), poly It may be formed of at least one of a resin series such as phthalamide (polyphthalamide (PPA)), a liquid crystal polymer (PCB), and a metal core PCB (MCPCB) having a metal layer on the bottom thereof, but is not limited thereto.

The support member 13 may have a first metal layer 13-1 and a second lead portion 13-3 connected to each other through a first side surface of the support member 13, and a second metal layer 13-2. ) And the second lead portion 13-4 may be connected to each other through the second side surface of the support member 13.

9 is a side cross-sectional view of a light emitting device package according to a sixth embodiment.

Referring to FIG. 9, the light emitting device package includes phosphor films 63 and 64 and reflective layers 65 and 66 in a molding member 21 disposed on the support member 13, the light emitting chip 18, and the support member 12. It includes. The phosphor films 63 and 64 and the reflective layers 65 and 66 are arranged in close contact with each other in a pair structure, and the grooves 62 inclined the structures of the phosphor films 63 and 64 and the reflective layers 65 and 66. -1,62-2). Accordingly, the phosphor films 63 and 64 and the reflective layers 65 and 66 may be provided in an inclined structure, thereby improving light reflection efficiency.

In addition, since the phosphor films 63 and 64 are disposed on one surface of the reflective layers 65 and 66, the wavelength-converted light may be effectively reflected.

The phosphor films 63 and 64 and the reflective layers 65 and 66 may be formed in a curved structure when viewed from a side cross section or as viewed from an upper surface as shown in FIG. 5.

10 is a side cross-sectional view of a light emitting device package according to a seventh embodiment.

Referring to FIG. 10, the light emitting device package includes a support member 12, a light emitting chip 18, and a first molding member 21-1 and a second molding member 21-2 on the support member 12. And a molding member 21 and reflective layers 75 and 76.

After the first molding member 21-1 is formed on the support member 12, a first groove 72-1 and a second groove 72-1 are formed, and the first groove 72-is formed. 1) and the first phosphor film 73 and the second phosphor film 74 are respectively inserted into the second grooves 72-1. The second molding member 22-2 is formed on the first molding member 21-1, and then a third groove 72-3 and a fourth groove 72-4 are formed, respectively. Reflective layers 75 and 76 are formed in the third and fourth grooves 72-3 and 72-4, respectively. The depths of the first grooves 72-1 and the second grooves 72-1 have a depth that is at least thicker than that of the light emitting chip 18, and is equal to or greater than the thickness of the first molding member 21-1. The first molding member 21-1 may have a depth greater than or equal to the thickness thereof.

In each of the first and second grooves 72-1 and 72-2 in the first molding member 21-1, phosphor films 73 and 74 are disposed to correspond to at least both sides of the light emitting chip 18. The reflective layers 75 and 76 cover outer sides of the phosphor films 73 and 74 in the first and second molding members 21-1 and 21-2.

The heights of the phosphor films 73 and 74 may be lower than the first thickness of the molding member 21 and have the same thickness as the thickness T4 of the first molding member 21-1. The phosphor films 73 and 74 may be vertically or inclined, and the reflective layers 75 and 76 may be inclined or curved.

As another example, the reflective layer may be formed on at least two sides or all sides of the molding member 21 to cover the outer side surfaces of the phosphor films 73 and 74.

A scattering agent may be disposed in the molding member according to the embodiment (s), and the scattering oxide material may include a material having a refractive index higher than that of the molding member. In addition, the phosphor layer may be further applied to the surface of the molding member, but is not limited thereto.

 <Light Emitting Chip>

A light emitting chip according to an embodiment will be described with reference to FIGS. 11 and 12.

Referring to FIG. 11, in the light emitting chip 18, an ohmic layer 121 is formed below the light emitting structure 110, a reflective layer 124 is formed below the ohmic layer 121, and below the reflective layer 124. The support member 125 may be formed on the passivation layer, and a protective layer 123 may be formed around the reflective layer 124 and the light emitting structure 110.

The light emitting chip 18 forms an ohmic layer 121, a channel layer 123, a reflective layer 125, and a support member 125 under the second conductive semiconductor layer 115, and then removes the growth substrate. Can be formed.

The ohmic layer 121 is in ohmic contact with the lower layer of the light emitting structure 110, for example, the second conductive semiconductor layer 115, and the material may be selected from a metal oxide, a metal nitride, an insulating material, and a conductive material. Indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide), antimony tin oxide (ATO), gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and any combination of these Can be formed. In addition, the metal material and the light transmitting conductive material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, and ATO can be used in a multilayer structure. For example, IZO / Ni, AZO / Ag, IZO / / Ag / Ni or the like. An inside of the ohmic layer 121 may further include a layer blocking current so as to correspond to the electrode 116.

The protective layer 123 may be selected from a metal oxide or an insulating material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IZAO), or IGZO. (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ . The protective layer 123 may be formed using a sputtering method or a deposition method, and may prevent a metal such as the reflective layer 124 from shorting the layers of the light emitting structure 110.

The reflective layer 124 may be formed of a material including metals such as Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and optional combinations thereof. The reflective layer 124 may be formed larger than the width of the light emitting structure 110, which may improve the light reflection efficiency.

The support member 125 is a base substrate and is a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W) or a carrier wafer (eg, Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the support member 125 and the reflective layer 124, and the bonding layer may bond the two layers to each other. The disclosed light emitting chip is one example and is not limited to the features disclosed above. The light emitting chip may be selectively applied to the above embodiment of the light emitting device, but is not limited thereto.

The light emitting chip of FIG. 12 has a structure different from that of FIG.

Referring to FIG. 12, the light emitting chip 28 may include a substrate 111, a buffer layer 112, a first conductive semiconductor layer 113, an active layer 114, a second conductive semiconductor layer 115, and a first electrode. 116, and a second electrode 117. The first conductive semiconductor layer 113, the active layer 114, and the second conductive semiconductor layer 115 may be defined as the light emitting structure 110.

The substrate 111 may be a light transmissive, insulating substrate, or a conductive substrate, for example, a sapphire substrate (Al ₂ O ₃ ), GaN, SiC, ZnO, Si, GaP, InP, Ga ₂ O ₃ , and GaAs Can be selected from. The substrate 111 may be a growth substrate, and has a composition formula of In _x Al _y Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1) on the growth substrate. It can be grown into a semiconductor.

The buffer layer 112 is a layer for alleviating the difference in lattice constant between the substrate 111 and the semiconductor, and may be formed of a group 2 to group 6 compound semiconductor. An undoped group III-V compound semiconductor layer may be further formed on the buffer layer 112, but is not limited thereto.

A first conductive semiconductor layer 113 is formed on the buffer layer 112, an active layer 124 is formed on the first conductive semiconductor layer 113, and a second conductive semiconductor layer is formed on the active layer 124. 115 is formed.

The first conductive semiconductor layer 113 is a compound semiconductor of Group III-V elements doped with a first conductive dopant, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP and the like can be selected. When the first conductive type is an N type semiconductor, the first conductive type dopant includes an N type dopant such as Si, Ge, Sn, Se, Te, or the like. The first conductive semiconductor layer 114 may be formed as a single layer or a multilayer, but is not limited thereto.

The active layer 114 may be formed of a single quantum well structure, a multiple quantum well structure, a quantum line structure, or a quantum dot structure. The active layer 114 may be formed with a period of a well layer and a barrier layer, for example, an InGaN well layer / GaN barrier layer or an InGaN well layer / AlGaN barrier layer, using a compound semiconductor material of Group III-V group elements. have.

A conductive clad layer may be formed on or under the active layer 114, and the conductive clad layer may be formed of an AlGaN-based semiconductor.

The second conductive semiconductor layer 115 is formed on the active layer 114, and the second conductive semiconductor layer 115 is a compound semiconductor of a group III-V group element doped with a second conductive dopant. GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP and the like. When the second conductive type is a P type semiconductor, the second conductive type dopant includes a P type dopant such as Mg and Ze. The second conductive semiconductor layer 115 may be formed as a single layer or a multilayer, but is not limited thereto.

In addition, a third conductive semiconductor layer, for example, an N-type semiconductor layer, may be formed on the second conductive semiconductor layer 115. The light emitting structure 135 may have at least one of an N-P junction, a P-N junction, an N-P-N junction, and a P-N-P junction structure.

A current spreading layer may be formed on the second conductive semiconductor layer 115, and the current spreading layer may be a transparent conductive layer, for example, indium tin oxide (ITO), indium zinc oxide (IZO), and indium zinc tin oxide (IZTO). ), Selectively formed from indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO) Can be.

The first electrode 116 may be formed on the first conductive semiconductor layer 113, and the second electrode 117 may be formed on the second conductive semiconductor layer 115. The first electrode 116 and the second electrode 117 may be connected to a metal layer of another support member through a wire.

<Lighting system>

The light emitting device of the embodiment (s) disclosed above is a structure in which a light emitting chip is packaged, and a plurality of light emitting devices may be disposed on a board and provided to a lighting system such as a light emitting module or a light unit. The light emitting device selected from the above embodiments may be applied to a lighting system.

The light emitting device according to the embodiment may be applied to the light unit. The light unit includes a structure in which a plurality of light emitting elements are arranged, and includes a display device as shown in FIGS. 13 and 14 and a lighting device as shown in FIG. have.

13 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 13, the display apparatus 1000 according to the exemplary embodiment includes a light guide plate 1041, a light emitting module 1031 that provides light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light emitting module 1031, and a reflective member 1022 on the optical sheet 1051. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective member 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

At least one light emitting module 1031 may be disposed in the bottom cover 1011, and may provide light directly or indirectly at one side of the light guide plate 1041. The light emitting module 1031 may include a substrate 1033 and a light emitting device package 11 according to the exemplary embodiment disclosed above, and the light emitting device package 11 may be arranged on the substrate 1033 at predetermined intervals. have.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device package 11 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

In addition, the plurality of light emitting device packages 11 may be mounted on the substrate 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device package 11 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflection 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light emitting module 1031, but are not limited thereto.

14 is a diagram illustrating a display device according to an exemplary embodiment.

Referring to FIG. 14, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting device package 11 disclosed above is arranged, an optical member 1154, and a display panel 1155. .

The substrate 1120 and the light emitting device package 11 may be defined as a light emitting module 1060. The bottom cover 1152, at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit.

The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methy methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets focus the incident light onto the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness.

The optical member 1154 is disposed on the light emitting module 1060, and performs surface light source, diffusion, condensing, etc. of the light emitted from the light emitting module 1060.

15 is a perspective view of a lighting apparatus according to an embodiment.

Referring to FIG. 15, the lighting device 1500 may include a case 1510, a light emitting module 1530 installed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520).

The case 1510 may be formed of a material having good heat dissipation, for example, may be formed of a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device package 11 according to an embodiment mounted on the substrate 1532. The plurality of light emitting device packages 11 may be arranged in a matrix form or spaced apart at predetermined intervals.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrates and the like.

In addition, the substrate 1532 may be formed of a material that reflects light efficiently, or a surface may be coated with a color, for example, white or silver, in which the light is efficiently reflected.

At least one light emitting device package 11 may be mounted on the substrate 1532. Each of the light emitting device packages 11 may include at least one light emitting diode (LED) chip. The LED chip may include a colored light emitting diode emitting red, green, blue or white colored light, and a UV emitting diode emitting ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 11 to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

11, 11A: light emitting device package 12, 13: support member
21: molding member 18: light emitting chip
23,23A, 24,24A, 33,34,43,44,53,54,63,64,73,74: phosphor film
25,35,45,45A, 46A, 55,56,65,66,75,76: reflective layer

Claims (18)

A support member having a first metal layer and a second metal layer;
A light emitting chip electrically connected to the first metal layer and the second metal layer of the support member and disposed on at least one of the first metal layer and the second metal layer;
A molding member formed on the support member and covering the light emitting chip;
A first groove formed in the molding member and disposed in an area between the side surface of the molding member and the light emitting chip;
A reflective layer disposed outside the phosphor film; And
A light emitting device package comprising a phosphor film disposed in the first groove. The method of claim 1, further comprising a second groove disposed between the first groove and at least one of the side surfaces of the molding member,
The reflective layer is a light emitting device package disposed in the second groove. The light emitting device package of claim 1, wherein the reflective layer is disposed on both or all sides of the molding member. The light emitting device package according to claim 1 or 2, wherein the first groove is disposed between both side surfaces of the light emitting chip and the first side surface and the second side surface of the molding member. The light emitting device package according to claim 1 or 2, wherein the first groove is disposed between all the side surfaces of the light emitting chip and the molding member. The light emitting device package of claim 1, wherein the first groove is vertically or inclined with respect to an upper surface of the support member. The light emitting device package of claim 2, wherein at least one of the first and second grooves is disposed perpendicularly or inclined with respect to an upper surface of the support member. The light emitting device package of claim 1, wherein the first groove has a curved structure when viewed from a side cross section. The light emitting device package of claim 2, wherein at least one of the first groove and the second groove is formed in a curved structure when viewed in a side cross section. The light emitting device package according to claim 6 or 8, wherein the reflective layer is disposed outside the phosphor film in the first groove. The light emitting device package of claim 2, wherein one of the first and second grooves is disposed perpendicularly or inclined with respect to an upper surface of the support member, and the other has a side cross section having a curved structure. The light emitting device package of claim 1, wherein the first groove is formed to have a depth greater than or equal to the thickness of the molding member from an upper surface of the molding member. The light emitting device package of claim 2, wherein at least one of the first groove and the second groove is formed to have a depth greater than or equal to the thickness of the molding member from an upper surface of the molding member. The method of claim 2, wherein the molding member comprises: a first molding member disposed on the support member; And a second molding member disposed on the first molding member,
The first groove is formed in the first molding member,
The second groove is a light emitting device package formed in the first molding member and the second molding member. The light emitting device package of claim 1, wherein the phosphor film is disposed closer to the side surface of the molding member than to the light emitting chip. The display apparatus of claim 1, further comprising: a first lead portion and a second lead portion disposed on a bottom of the support member;
The first metal layer and the first lead portion are connected to each other through the inside or side of the support member,
The second metal layer and the second lead portion is a light emitting device package connected to each other through the inside or side of the support member. The light emitting device package according to any one of claims 1 to 3, wherein the phosphor film is closer to the reflective layer than to the light emitting chip. The light emitting device package according to any one of claims 1 to 3, wherein the phosphor film and the reflective layer are each disposed at a height equal to or greater than a thickness of the molding member.

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