KR20130020172A - The light emitting device package and the light emitting system - Google Patents

Abstract

PURPOSE: A light emitting device package and a lighting device are provided to improve luminous efficiency by using resins with higher reflective power than the lead frame. CONSTITUTION: A body(110) includes a cavity. A lead frame is arranged in the cavity and includes a lead groove. A light emitting device(120) is arranged in the lead groove of the lead frame. The side of the lead groove is composed of a plurality of legs which are separated. The lead frame includes a bottom part which is exposed to the rear of the body and a side part which is extended from the bottom part to form the side of the lead groove.

Description

Light emitting device package and the light emitting device

The present invention relates to a light emitting device package.

A light emitting diode (LED) may form a light emitting source using compound semiconductor materials such as GaAs series, AlGaAs series, GaN series, InGaN series, and InGaAlP series.

Such a light emitting diode is packaged and used as a light emitting device package that emits various colors, and the light emitting device package is used as a light source in various fields such as a lighting indicator, a color display, and an image display for displaying a color.

The embodiment provides a light emitting device package having a new structure.

The embodiment provides a light emitting device package in which the coupling force between the lead frame and the body is enhanced.

An embodiment includes a body including a cavity, at least one lead frame disposed in the cavity, and including at least one lead frame, and at least one light emitting element disposed in the lead groove of the lead frame. The side of the lead groove provides a light emitting device package formed of a plurality of legs separated from each other.

According to the present invention, in the light emitting device package, by forming a plurality of holes on the side of the lead frame and filling the holes with a resin forming the body, it is possible to enhance the adhesive strength by widening the adhesive area between the body and the lead frame. In addition, by using a resin having better reflectivity than the lead frame, the area for reflecting light from the light emitting element in the body is expanded, and the light efficiency is improved.

1 is a top view of a light emitting device package according to a first embodiment of the present invention.
2 is a perspective view of the light emitting device package of FIG. 1.
3 is a cross-sectional view taken along the line II ′ of the light emitting device package of FIG. 1.
4 is a cross-sectional view of the light emitting diode of FIG. 1.
5 is an enlarged view of the inclination part of FIG. 1.
6 is a top view of a light emitting device package according to a second embodiment of the present invention.
7 is a cross-sectional view taken along the line II ′ of the light emitting device package of FIG. 6.
8 is a top view of a light emitting device package according to a third embodiment of the present invention.
9 is a top view of a light emitting device package according to a fourth embodiment of the present invention.
10 is a top view of a light emitting device package according to a fourth embodiment of the present invention.
FIG. 11 is a cross-sectional view taken along the line II ′ of the light emitting device package of FIG. 10.
12 illustrates a display device including the light emitting device package of the present invention.
13 is a view showing an example of a lighting device including a light emitting device package of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

In the description of the embodiments, each layer, region, pattern, or structure is formed “on” or “under” of a substrate, each layer (film), region, pad, or pattern. When described as "on" and "under" include both "directly" or "indirectly through" another layer. In addition, the criteria for above or below each layer will be described with reference to the drawings.

Hereinafter, a light emitting device package according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4.

1 is a top view of a light emitting device package according to a first embodiment of the present invention, FIG. 2 is a perspective view of the light emitting device package of FIG. 1, and FIG. 3 is a cutaway view of the light emitting device package of FIG. 4 is a cross-sectional view of the light emitting diode of FIG. 1, and FIG. 5 is an enlarged view of the inclined portion of FIG. 1.

1 to 5, the light emitting device package 100 is disposed on the body 110, at least one light emitting device 120 disposed on the body 110, and the body 110. The first lead frame 130 and the second lead frame 140 are electrically connected to the light emitting device 120.

In addition, the light emitting device package 100 includes a resin material 170 for protecting the light emitting device 120.

The body 110 may be formed of at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al 2 O 3), and a printed circuit board (PCB). Can be. Preferably, the body 110 may be made of a resin material such as polyphthalamide (PPA).

The body 110 may be formed of a conductive material. When the body 110 is a material having electrical conductivity, an insulating film (not shown) is formed on the surface of the body 110 so that the body 110 is electrically shorted with the first lead frame and the second lead frame. Can be configured to prevent. The circumferential shape of the body 110 viewed from above may have various shapes such as triangle, rectangle, polygon, and circle depending on the use and design of the light emitting device package 100.

A cavity 115 may be formed in the body 110 to open the upper part 112. The cavity 115 may be formed by, for example, injection molding, or may be formed by etching.

The cavity 115 may be formed in a cup shape, a concave container shape, or the like, and an inner side surface thereof may be a vertical side surface or an inclined side surface with respect to the bottom surface. When the inclined side is formed by performing wet etching on the body 110, the inclined side may have a slope of 50 ° to 60 °.

In addition, the shape of the cavity 115 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like.

The first lead frame 130 and the second lead frame 140 may be formed on the body 110. The first lead frame 130 and the second lead frame 140 may be electrically separated into an anode and a cathode to provide power to the light emitting device 120. Meanwhile, depending on the design of the light emitting device 120, a plurality of lead frames may be formed in addition to the first and second lead frames 130 and 140, but embodiments are not limited thereto.

Meanwhile, the first and second lead frames 130 and 140 are separated from each other in the cavity 115 and are exposed to each other. The first and second lead frames 130 and 140 may be formed to surround side surfaces of the body 110 and extend to the rear surface thereof, but are not limited thereto. Do not.

The first and second lead frames 130 and 140 may have a multilayer structure. For example, the first and second lead frames 130 and 140 may be a Ti / Cu / Ni / Au layer in which titanium (Ti), copper (Cu), nickel (Ni), and gold (Au) are sequentially stacked. It is not limited to this.

That is, a material having excellent adhesion to the body, such as titanium (Ti), chromium (Cr), and tantalum (Ta), is laminated on the lowermost layers of the first and second lead frames 130 and 140, and the first and second leads Wires, such as gold, are easily attached to the top layers of the frames 130 and 140, and materials having excellent electrical conductivity are laminated, and platinum is formed between the top and bottom layers of the first and second lead frames 130 and 140. A diffusion barrier layer formed of (Pt), nickel (Ni), copper (Cu), or the like may be stacked, but is not limited thereto.

In addition, the first and second lead frames 130 and 140 may be attached with a wire 122, which is a conductive connecting member, to electrically connect the first and second lead frames 130 and 140 to the light emitting device 120.

The first lead frame 130 occupies most of the area of the cavity 115, and preferably occupies an area of 70% or more.

The first lead frame 130 includes a lead groove 135 recessed toward the bottom surface of the body 110 in the cavity 115.

The lead groove 135 may be disposed in the central region of the cavity 115 of the body 110.

The first lead frame 130 extends from the bottom portion 131, which forms the bottom surface of the lead groove 135, and the bottom portion 131, and forms a side surface of the lead groove 135 ( 133, which is formed in parallel with the bottom 131, and includes an upper surface 134 extending from the side surface 133.

The bottom surface of the bottom portion 131 is exposed to the bottom surface of the body 110 to form a pad.

The upper surface part 134 may cross the central area of the body 110 and may protrude out of the body 110 to form a terminal.

In addition, a wire 122 that electrically connects the light emitting device 120 to the upper surface portion 134 is connected.

The side surface portion 133 is inclined according to the area difference between the upper and lower portions of the lead groove 135, and is formed of a plurality of legs separated from each other on the interface.

The plurality of legs may be reduced in area toward the lower side, and may be formed to have a uniform thickness.

The plurality of legs may be formed in the corner region of the rectangle when the shape of the lead groove 135, as shown in Figure 1, and may have a shape bent at a predetermined angle when formed in the corner region. have.

However, the legs may alternatively be formed on a portion of the surface to form a flat surface.

The side portion 133 includes a hole between the leg and the neighboring leg.

The hole is formed by the body 110 is protruded to form a side projection 113, thereby improving the coupling area between the body 110 and the lead frame.

In addition, as shown in FIG. 4, each leg of the side portion 133 may include a plurality of protrusions 132 on the side surface.

The protrusion 132 is not formed in the central region (d) through which the resin constituting the body 110 can rapidly penetrate, and is formed at an end thereof and contacts the lead frame 130 with the resin constituting the body 110. Increase the area

Meanwhile, unlike the first lead frame 130, the second lead frame 140 does not include the lead groove 135 and is formed in a planar shape, and corresponds to the top surface 134 of the first lead frame 130. Formed on a plane to which the wire 122 is contacted.

A reflective layer (not shown) may be formed on the first lead frame 130 and the second lead frame 140 of the body 110.

The light emitting device 120 may be mounted on the body 110. When the body 110 includes the cavity 115, the light emitting device 120 may be mounted in the cavity 115.

At least one light emitting device 120 may be mounted on the body 110 according to the design of the light emitting device package 100. When a plurality of light emitting device packages 100 are mounted, a plurality of lead frames and a plurality of reflective layers for supplying power to the plurality of light emitting device packages 100 may be formed, but are not limited thereto.

The light emitting device 120 may be directly mounted on the body 110 or electrically bonded to the first or second lead frames 130 and 140.

The light emitting device 120 may be mounted using a wire bonding, die bonding, or flip bonding method. The bonding method may be changed according to a chip type and a lead frame position of the chip.

 The light emitting device 120 may selectively include a semiconductor light emitting device manufactured using a compound semiconductor of Group III and Group V elements, such as AlInGaN, InGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs, and the like. have.

As illustrated in FIG. 2, the light emitting device 120 may be attached to the second lead frame 140 with a conductive adhesive, and may be electrically connected to the first lead frame 130 with a wire 122.

The light emitting device 120 is referred to as a vertical light emitting device, and as illustrated in FIG. 3, the conductive support substrate 21, the bonding layer 23, the second conductive semiconductor layer 25, the active layer 27, and the first layer are illustrated in FIG. 3. And a conductive semiconductor layer 29.

 The conductive support substrate 21 may be formed of a metal or an electrically conductive semiconductor substrate.

 A group III-V nitride semiconductor layer is formed on the substrate 21. The semiconductor growth equipment includes an electron beam evaporator, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma laser deposition (PLD), and dual heat. It can be formed by a dual-type thermal evaporator sputtering, metal organic chemical vapor deposition (MOCVD), etc., but is not limited to such equipment.

 The bonding layer 23 may be formed on the conductive support substrate 21. The bonding layer 23 bonds the conductive support substrate 21 to the nitride semiconductor layer. In addition, the conductive support substrate 21 may be formed by a plating method rather than a bonding method, and in this case, the bonding layer 23 may not be formed.

 A second conductive semiconductor layer 25 is formed on the bonding layer 23, and the second conductive semiconductor layer 25 is electrically connected to the first lead frame 31.

 The second conductivity-type semiconductor layer 25 may be formed of at least one of a group III-V group compound semiconductor, for example, GaN, InN, AlN, InGaN, AlGaN, InAlGaN, or AlInN. The second conductive semiconductor layer 25 may be doped with a second conductive dopant, and the second conductive dopant may be a p-type dopant, and may include Mg, Zn, Ca, Sr, and Ba.

 The second conductive semiconductor layer 25 may be formed of a p-type GaN layer having a predetermined thickness by supplying a gas including a p-type dopant such as NH 3, TMGa (or TEGa), and Mg.

 The second conductivity type semiconductor layer 25 includes a current spreading structure in a predetermined region. The current spreading structure includes semiconductor layers in which the current spreading speed in the horizontal direction is higher than the current spreading speed in the vertical direction.

 The current spreading structure can include, for example, semiconductor layers having a difference in concentration or conductivity of the dopant.

 The second conductivity-type semiconductor layer 25 may supply a carrier diffused in a uniform distribution to another layer thereon, for example, the active layer 27.

 The active layer 27 is formed on the second conductive semiconductor layer 25. The active layer 27 may be formed in a single quantum well or multiple quantum well (MQW) structure. One period of the active layer 27 may optionally include a period of InGaN / GaN, a period of AlGaN / InGaN, a period of InGaN / InGaN, or a period of AlGaN / GaN.

 A second conductive cladding layer (not shown) may be formed between the second conductive semiconductor layer 25 and the active layer 27. The second conductive cladding layer may be formed of a p-type GaN-based semiconductor. The second conductivity type clad layer may be formed of a material having a band gap higher than that of the well layer.

 The first conductive semiconductor layer 29 is formed on the active layer 27. The first conductive semiconductor layer 29 may be implemented as an n-type semiconductor layer doped with a first conductive dopant. The n-type semiconductor layer may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, and the like. The first conductivity type dopant is an n-type dopant, and at least one of Si, Ge, Sn, Se, Te, and the like may be added.

 For example, the first conductive semiconductor layer 29 may supply a gas including an n-type dopant such as NH 3, TMGa (or TEGa), and Si to form an n-type GaN layer having a predetermined thickness.

In addition, the second conductive semiconductor layer 25 may be a p-type semiconductor layer, and the first conductive semiconductor layer 29 may be implemented as an n-type semiconductor layer. The light emitting structure may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. In the following description, the first conductive semiconductor layer 29 is described as an example of the uppermost layer of the semiconductor layer.

A first electrode or / and an electrode layer (not shown) may be formed on the first conductive semiconductor layer 29. The electrode layer may be an oxide or nitride-based light-transmitting layer such as indium tin oxide (ITO), indium tin oxide nitride (ITON), indium zinc oxide (IZO), indium zinc oxide nitride (IZON), indium zinc tin oxide (IZTO), or IAZO. (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), antimony tin oxide (ATO), gallium zinc oxide (GZO), IrO _x , RuO _x , It can be selected and formed from materials of NiO. The electrode layer may function as a current spreading layer capable of diffusing current.

In addition, the electrode layer may be a reflective electrode layer, and the reflective electrode layer may be formed from a material consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and optional combinations thereof. . The first electrode may include a metal layer of a single layer or a multilayer structure, for example, the metal layer may be formed of at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf or an alloy. Can be.

A plurality of light emitting devices 120 may be mounted on the body 110.

The molding member 170 includes a molding member 170 filling the cavity 115.

The molding material 170 is formed of a light transmissive material and is formed up to an upper portion of the body 110.

The molding material 170 may include a phosphor. For example, when the light emitting device 120 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to generate white light. When the light emitting device 120 emits ultraviolet (UV) light, phosphors of red, green, and blue colors may be added to the phosphor sheet 180 to implement white light.

Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 6 to 9.

6 is a top view of a light emitting device package according to a second embodiment of the present invention.

Since the configuration of the body 110 and the light emitting device 120 of FIGS. 6 and 7 is the same as in the first embodiment, description thereof will be omitted.

The first lead frame 130 occupies most of the area of the cavity 115, and preferably occupies an area of 70% or more.

The first lead frame 130 includes a lead groove 135 recessed toward the bottom surface of the body 110 in the cavity 115.

The lead groove 135 has a two-stage structure and includes a first lead groove 135a recessed toward the bottom surface of the body 110 and a second lead groove 135b formed on the first lead groove 135a. ).

The lead groove 135 has an inclination by an area difference between an upper portion and a lower portion, and the area of the first lead groove 135a is smaller than the area of the second lead groove 135b due to the inclination.

The lead groove 135 may be disposed in the central region of the cavity 115 of the body 110.

The first lead frame 130 extends from the bottom portion 131 and the bottom portion 131, which form a bottom surface of the first lead groove 135, and has a side surface of the first lead groove 135. A first side portion 133a to be formed, a second side portion 133b to form a side surface of the second lead groove 135b, and formed in parallel with the bottom portion 131 and extending from the first side portion 133a The intermediate portion 136 is formed in parallel with the bottom portion 131, and includes an upper surface portion 134 extending from the second side portion 133b.

The bottom surface of the bottom portion 131 is exposed to the bottom surface of the body 110 to form a pad.

The upper surface part 134 may cross the central area of the body 110 and may protrude out of the body 110 to form a terminal.

The intermediate portion 136 may be connected to a wire 122 that electrically connects the light emitting device 120.

The first and second side parts 133a and 133b have an inclination according to the area difference between the top and the bottom of the lead groove 135 and are formed of a plurality of legs separated from each other on the interface.

The plurality of legs may be reduced in area toward the lower side, and may be formed to have a uniform thickness.

6, when the shape of the lead groove 135 is a quadrangle as illustrated in FIG. 6, the plurality of legs may be formed in a corner region of the quadrangle. have.

However, the legs may alternatively be formed on a portion of the surface to form a flat surface.

The first and second side parts 133a and 133b include holes between the legs and the adjacent legs.

The hole has a protruding area between the body 110 and the lead frame 130 by forming the side protrusions 113a and 113b by protruding the body 110.

In this case, the legs of the first and second side parts 133a and 133b may be disposed in a straight line with each other, or may be disposed to be offset from each other.

At this time, it is apparent that the protrusions 132 of FIG. 5 may be applied to the side parts 133a and 133b.

As such, while forming a multi-layered layered structure on the side portions 133a and 133b, holes may be formed in each layered structure to increase the adhesion area between the body 110 and the lead frame 130. In addition, the length of the wire can be reduced by bonding the wire to the intermediate portion.

8 is a top view of a light emitting device package according to a third embodiment of the present invention, and FIG. 9 is a top view of a light emitting device package according to a fourth embodiment of the present invention.

Since the configuration of the body 110 and the light emitting device 120 of FIGS. 8 and 9 is the same as in the first embodiment, description thereof will be omitted.

The first lead frame 130 occupies most of the area of the cavity 115, and preferably occupies an area of 70% or more.

The first lead frame 130 includes a lead groove 135 recessed toward the bottom surface of the body 110 in the cavity 115.

The lead groove 135 has a two-stage structure and includes a first lead groove 135a recessed toward the bottom surface of the body 110 and a second lead groove 135b formed on the first lead groove 135a. ).

The lead groove 135 has an inclination by an area difference between an upper portion and a lower portion, and the area of the first lead groove 135a is smaller than the area of the second lead groove 135b due to the inclination.

The lead groove 135 may be disposed in the central region of the cavity 115 of the body 110.

In this case, the light emitting device package 100B of FIG. 8 extends from the bottom part 131 and the bottom part 131 to form a bottom surface of the first lead groove 135 in the first lead frame 130. A first side portion 137 forming a side surface of the first lead groove 135, a second side portion 133 forming a side surface of the second lead groove 135b, and parallel to the bottom portion 131. And a middle portion 136 extending from the first side portion 137, and formed in parallel with the bottom portion 131, and an upper surface portion 134 extending from the second side portion 133. .

The bottom surface of the bottom portion 131 is exposed to the bottom surface of the body 110 to form a pad.

The upper surface part 134 may cross the central area of the body 110 and may protrude out of the body 110 to form a terminal.

The intermediate portion 136 may be connected to a wire 122 that electrically connects the light emitting device 120.

The first and second side parts 137 and 133 have an inclination according to the area difference between the top and the bottom of the lead groove 135, and the first side part 137 is formed as a surface connecting neighboring sides. The second side portion 133 is formed of a plurality of legs separated from each other.

The plurality of legs may be reduced in area toward the lower side, and may be formed to have a uniform thickness.

7, when the shape of the lead groove 135 is a quadrangle as illustrated in FIG. 7, the plurality of legs may be formed in a corner region of the quadrangle. have.

However, the legs may alternatively be formed on a portion of the surface to form a flat surface.

The second side portion 133 includes a hole between the leg and the adjacent leg.

The hole is formed by the body 110 is protruded to form a side protrusion 113, the coupling area between the body 110 and the lead frame 130 is improved.

In this case, the legs of the first and second side parts 133a and 133b may be disposed in a straight line with each other, or may be disposed to be offset from each other.

Meanwhile, the light emitting device package 100C of FIG. 9 extends from the bottom part 131 and the bottom part 131 to form a bottom surface of the first lead groove 135 in the first lead frame 130. And a first side portion 133 forming a side surface of the first lead groove 135, a second side portion 138 forming a side surface of the second lead groove 135b, and parallel to the bottom portion 131. And a middle portion 136 extending from the first side portion 133, and formed in parallel with the bottom portion 131, and an upper surface portion 134 extending from the second side portion 138. .

The bottom surface of the bottom portion 131 is exposed to the bottom surface of the body 110 to form a pad.

The upper surface part 134 may cross the central area of the body 110 and may protrude out of the body 110 to form a terminal.

The intermediate portion 136 may be connected to a wire 122 that electrically connects the light emitting device 120.

The first and second side parts 133 and 138 have an inclination according to the area difference between the top and the bottom of the lead groove 135, and the first side parts 133 are formed of a plurality of legs separated from each other. The second side portion 138 may have a shape in which neighboring sides are connected to each other.

The plurality of legs may be reduced in area toward the lower side, and may be formed to have a uniform thickness.

9, when the shape of the lead groove 135 is a quadrangle as shown in FIG. 9, the plurality of legs may be formed in a corner area of the quadrangle. When the plurality of legs are formed in the corner area, the plurality of legs may have a shape bent at a predetermined angle. have.

However, the legs may alternatively be formed on a portion of the surface to form a flat surface.

The first side portion 138 includes a hole between the leg and the adjacent leg.

The hole is formed by the body 110 is protruded to form a side protrusion 113, the coupling area between the body 110 and the lead frame 130 is improved.

As shown in FIGS. 8 and 9, holes may be selectively formed in some layers with respect to the lead groove of the multilayer structure to improve rigidity while maintaining rigidity.

Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 10 and 11.

10 and 11, the light emitting device package 200 includes a body 220, a first lead frame 230 and a second lead frame 240 having a cavity 240, and a plurality of light emitting devices 220. , And wires 222.

The body 210 may be formed of at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al 2 O 3), and a printed circuit board (PCB). Can be. Preferably, the body 210 may be made of a resin material such as polyphthalamide (PPA).

The body 210 may be formed of a conductive material. When the body 210 is formed of an electrically conductive material, an insulating film (not shown) is formed on the surface of the body 210 so that the body 210 may be formed of the first lead frame 230 and the second lead frame 240. It may be configured to prevent the electrical short. The circumferential shape of the body 210 as viewed from above may have various shapes such as triangle, rectangle, polygon, and circle depending on the use and design of the light emitting device package 200.

The upper portion of the body 220 includes an open area 215 and is an area where light is emitted.

The first lead frame 230 includes a cavity 235, and the cavity 235 is concave from an upper surface of the first lead frame 230, for example, a cup structure or a recess. Include shape. Side surfaces of the cavity 235 may be inclined or vertically bent from the bottom surface of the cavity 235.

The second lead frame 240 includes a cavity 245, and the configuration is the same as that of the first lead frame 230.

The cavity 225 of the first lead frame 230 and the cavity 245 of the second lead frame 240 are disposed below the open area 215.

The first and second lead frames 230 and 240 extend from the bottom portions 231 and 241 and the bottom portions 231 and 241 which form bottom surfaces of the cavities 135 and 145, respectively. Side portions 233 and 243 forming side surfaces of the 235 and 245, and upper surfaces 234 and 244 formed in parallel with the bottom portions 231 and 241 and extending from the side portions 233 and 243. .

Back surfaces of the bottom parts 231 and 241 are exposed to the bottom surface of the body 210 to form pads.

The upper surface portions 234 and 244 may cross the central region of the body 110 and may protrude out of the body 110 to form a terminal.

In addition, a wire 222 for electrically connecting the light emitting device 220 to the upper surface portions 234 and 244 is connected.

The side parts 233 and 243 are inclined according to the area difference between the upper and lower portions of the cavities 235 and 245, and are formed of a plurality of legs separated from each other on the interface.

The plurality of legs may be reduced in area toward the lower side, and may be formed to have a uniform thickness.

The plurality of legs may be formed in the corners of the rectangle when the shape of the cavity (235, 245) is a quadrangle, as shown in FIG. 10, and have a shape that is bent at a predetermined angle when formed in the corner area Can be.

However, the legs may alternatively be formed on a portion of the surface to form a flat surface.

The side parts 233 and 243 include holes between the legs and the adjacent legs.

The hole is the body 110 is protruded to form a side projection 212, thereby improving the coupling area between the body 110 and the lead frame.

At least one light emitting device 220 is disposed in the cavities 235 and 245, and the light emitting device 220 is attached to the bottom portions 231 and 241 of the cavity 240, respectively, by wires 222. It is connected to the first and second lead frames 230 and 240. The light emitting device 220 may selectively emit light in the wavelength range of the ultraviolet band to the visible light band, may emit light of the same peak wavelength, or may emit light of different peak wavelengths. The light emitting device 220 may include at least one of an LED chip using a Group III-V compound semiconductor, for example, an ultraviolet (Ultraviolet) LED chip, a blue LED chip, a green LED chip, a white LED chip, and a red LED chip. .

A lower surface of the first lead frame 230 and a lower surface of the second lead frame 240 are disposed on the lower surface of the body 220, and the lower surface is connected to a pad on the board by a connection member such as solder, and a heat dissipation plate Used as

The resin material 270 is formed covering the open area 215.

The resin material 270 may be dispensed with a light transmitting material, but is not limited thereto.

As described above, the cavities 235 and 245 are formed in one end, but may be formed in multiple stages as shown in FIGS. 6 to 8, and it is obvious that holes may be formed in each layer.

The light emitting device package according to the embodiment may be applied to the light unit. The light unit includes a structure in which a plurality of light emitting device packages are arranged, and includes a display device as shown in FIG. 9 and a lighting device as shown in FIG. 10. Can be applied.

12 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 12, the display device 1000 includes a light guide plate 1041, a light emitting module 1031 providing light to the light guide plate 1041, a reflective member 1022 under the light guide plate 1041, and the light guide plate 1041. A bottom cover 1011 that houses an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light emitting module 1031, and a reflective member 1022. ), But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse the light provided from the light emitting module 1031 to make a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light emitting module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light emitting module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041. The light emitting module 1031 may include a substrate 1033 and a light emitting device package 100 according to the above-described embodiment, and the light emitting device package 100 may be arrayed on the substrate 1033 at predetermined intervals. have. The substrate may be a printed circuit board, but is not limited thereto. In addition, the substrate 1033 may include a metal core PCB (MCPCB, Metal Core PCB), flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device package 100 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the substrate 1033 may be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Therefore, heat generated in the light emitting device package 100 may be discharged to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting device packages 100 may be mounted on the substrate 1033 such that an emission surface on which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device package 100 may directly or indirectly provide light to a light incident portion that is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by transmitting or blocking light provided from the light emitting module 1031. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light emitting module 1031, but are not limited thereto.

13 is a perspective view of a lighting apparatus according to an embodiment.

Referring to FIG. 13, the lighting device 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520).

The case 1510 may be formed of a material having good heat dissipation, for example, may be formed of a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device package 100 according to an embodiment mounted on the substrate 1532. The plurality of light emitting device packages 100 may be arranged in a matrix form or spaced apart at predetermined intervals.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrates and the like.

In addition, the substrate 1532 may be formed of a material that reflects light efficiently, or a surface may be coated with a color, for example, white or silver, in which the light is efficiently reflected.

At least one light emitting device package 100 may be mounted on the substrate 1532. Each of the light emitting device packages 100 may include at least one light emitting diode (LED) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue, or white, or a UV light emitting diode emitting ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 100 to obtain color and luminance. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

Light emitting device package 100, 100A, 100B, 100C, 200
Light emitting element 120, 220
Body 110, 210

Claims (14)

A body containing a cavity,
At least one lead frame disposed in the cavity and including a lead groove;
At least one light emitting element disposed in a lead groove of the lead frame
Including;
Side of the lead groove is a light emitting device package formed of a plurality of legs separated from each other. The method of claim 1,
The lead frame
A bottom surface exposed to the back of the body, and
Side portion extending from the bottom surface to form a side of the lead groove
Light emitting device package comprising a. The method of claim 2,
When the lead groove is formed to have a rectangular shape,
The side surface portion light emitting device package including a plurality of legs formed in the corner area. The method of claim 3,
The leg is bent light emitting device package is formed. The method of claim 2,
The leg is a light emitting device package including a projection protruding on the side. The method of claim 5,
The protrusion is a light emitting device package is distributed at the end of the side portion. The method of claim 2,
The lead groove
A first lead groove having a first side portion extending from the bottom surface, and
A light emitting device package comprising a second lead groove formed on the first lead groove. The method of claim 7, wherein
A light emitting device package having an intermediate portion formed in parallel with the bottom surface between the first lead groove and the second lead groove. 9. The method of claim 8,
The light emitting device package of claim 1, wherein the first side surface portion of the first lead groove and the second side surface portion of the second lead groove include a plurality of legs separated from each other. 10. The method of claim 9,
The leg of the first side portion and the leg of the second side portion is a light emitting device package is formed in a straight line. 9. The method of claim 8,
The first side portion has a surface structure that is connected to each other with a neighboring side,
The second side surface portion of the second lead groove light emitting device package comprising a plurality of legs. 9. The method of claim 8,
The first side portion includes a plurality of legs,
The second side surface portion of the second lead groove light emitting device package having a surface structure is connected to each other and the adjacent side. 9. The method of claim 8,
The middle portion of the light emitting device package is attached to the wire to electrically connect the light emitting device and the lead frame. Substrate, and
The light emitting device package of any one of claims 1 to 13 on the substrate
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