KR20130019956A - Light emitting device package and lighting system including the same - Google Patents

Abstract

PURPOSE: A light emitting device package and a lighting system including the same are provided to deposit and coat a parylene layer between a package body and a lead frame and to prevent the penetration of defects. CONSTITUTION: A package body includes a cavity. A light emitting device is arranged in the bottom surface of the cavity. A first lead frame(221) and a second lead frame(222) are respectively connected to the light emitting device. The first lead frame and the second lead frame are combined with the package body. A parylene layer(270b) is arranged between the package bodies.

Description

Light emitting device package and lighting system including the same

The embodiment relates to a light emitting device package and improves durability of the light emitting device package.

Light-emitting devices such as light-emitting diodes (LEDs) or laser diodes (LDs) using semiconductors of Group 3-5 or 2-6 compound semiconductor materials of semiconductors have been developed through the development of thin film growth technology and device materials. Various colors such as green, blue, and ultraviolet light can be realized, and efficient white light can be realized by using fluorescent materials or combining colors, and low power consumption, semi-permanent life, and quicker than conventional light sources such as fluorescent and incandescent lamps can be realized. It has the advantages of response speed, safety and environmental friendliness.

Therefore, the light emitting diode can replace a light emitting diode backlight, a fluorescent lamp or an incandescent bulb which replaces a cold cathode fluorescent lamp (CCFL) constituting a backlight module of an optical communication means, a backlight of a liquid crystal display (LCD) display device. Applications are expanding to white light emitting diode lighting devices, automotive headlights and traffic lights.

1 is a cross-sectional view of a conventional light emitting device package.

The light emitting device package 200 is formed by injection molding the package body 210, and first and second lead frames 221 and 222 are fixed to the package body 210. On the inner side surface A and the outer side surface B of the package body 210, the first and second lead frames 221 and 222 are coupled to the package body 210, respectively.

In the 'A' region and the 'B' region, the package body 210 and the first and second lead frames 221 and 222 may not be in close contact with each other, and a gap may occur due to a composition difference between them. Can penetrate into the light emitting device package.

The embodiment is intended to improve durability by preventing penetration of foreign matter between the package body of the light emitting device package and the lead frame.

Embodiments include a package body having a cavity; A light emitting element disposed on the bottom surface of the cavity; First and second lead frames electrically connected to the light emitting devices, respectively, and coupled to the package body; And a paraline layer disposed between at least one of the first lead frame and the second lead frame and the package body.

The paraline layer may be disposed between at least one of the first lead frame and the second lead frame and an inner wall of the package body.

The parallel layer may be disposed between at least one of the first lead frame and the second lead frame and an outer wall of the package body.

The light emitting device may contact the first lead frame, and the parallel layer may not be disposed in a contact area between the light emitting device and the first lead frame.

The light emitting device may be wire bonded to the second lead frame, and the paraline layer may not be disposed in the wire bonding region of the second lead frame.

The paraline layer may be deposited by masking a portion of the package body.

The package body may be formed by inserting and injecting the first lead frame and the second lead frame, and the paraline layer may be disposed on an interface at which at least one of the first lead frame and the second lead frame is inserted into the package body. have.

The parallel layer may surround an interface where at least one of a first lead frame and a second lead frame is inserted into the package body.

The paraline layer may be coated with a poly-para-xylyene polymer.

Another embodiment provides an illumination system including the light emitting device package described above.

In the light emitting device package according to the embodiment, the paraline layer is deposited or coated between the package body and the lead frame, thereby preventing the intrusion of foreign matter such as air or moisture from the outside, thereby improving durability of the light emitting device package.

1 is a cross-sectional view of a conventional light emitting device package,
2 is a cross-sectional view of an embodiment of a light emitting device package,
3 is a cross-sectional view of an embodiment of a light emitting device in the light emitting device package of FIG.
4 is a top view of the light emitting device package of FIG.
5 is a view showing a manufacturing process of a light emitting device package,
6 is a cross-sectional view of another embodiment of a light emitting device package;
7 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to the embodiments,
8 is a diagram illustrating an example of a display device including a light emitting device package according to embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, when described as being formed on the "on or under" of each element, the (up) or down (on) or under) includes both two elements being directly contacted with each other or one or more other elements are formed indirectly between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

2 is a cross-sectional view of an embodiment of a light emitting device package, FIG. 3 is a cross-sectional view of an embodiment of a light emitting device in the light emitting device package of FIG. 2, and FIG. 4 is a top view of the light emitting device package of FIG. 2.

The light emitting device package 200 according to the embodiment includes a package body 210, a first lead frame 221 and a second lead frame 222 installed on the package body 210, and the package body ( The light emitting device 100 according to the exemplary embodiment installed in the 210 and electrically connected to the first lead frame 221 and the second lead frame 222, and the side and / or the top of the light emitting device 100. The enclosing molding part 250 is included.

The package body 210 may include a polyphthalamide (PPA) resin, a silicon material, a synthetic resin material, or a metal material. If the package body 210 is made of a conductive material such as a metal material, although not shown, an insulating layer is coated on the surface of the package body 210 to short-circuit an electrical short circuit between the first and second lead frames 221 and 222. Can be prevented.

The first lead frame 221 and the second lead frame 222 are electrically separated from each other, and supplies a current to the light emitting device 100. In addition, the first lead frame 221 and the second lead frame 222 may be made of a conductive material such as copper (Cu) and reflect light generated by the light emitting device 100 to increase light efficiency. In addition, heat generated from the light emitting device 100 may be discharged to the outside.

The light emitting device 100 may be a horizontal light emitting device, a vertical light emitting device, or a flip light emitting device, and may be installed on the bottom surface 210c of the cavity formed in the package body 210 or the first lead frame 221. Alternatively, the second lead frame 222 may be installed.

3 illustrates a vertical light emitting device 100, and the light emitting device 100 includes a bonding layer 150, a reflective layer 140, and an ohmic layer on a conductive support substrate 160. And a light emitting structure 120 and a low temperature oxide film 180.

Since the conductive support substrate 160 may serve as a second electrode, a metal having excellent electrical conductivity may be used, and a metal having high thermal conductivity may be used because it must be able to sufficiently dissipate heat generated when the light emitting device is operated.

The conductive support substrate 160 may be made of a material selected from the group consisting of molybdenum (Mo), silicon (Si), tungsten (W), copper (Cu), and aluminum (Al) or an alloy thereof. , Gold (Au), copper alloy (Cu Alloy), nickel (Ni), copper-tungsten (Cu-W), carrier wafers (e.g. GaN, Si, Ge, GaAs, ZnO, SiGe, SiC, SiGe, Ga ₂ O _3, etc.) may be optionally included.

The conductive support substrate 160 may have a mechanical strength enough to be separated into a separate chip through a scribing process and a breaking process without causing warping of the entire nitride semiconductor.

The bonding layer 150 may combine the reflective layer 140 and the conductive support substrate 160, and the reflective layer 140 may function as an adhesion layer. The bonding layer (150) is composed of gold (Au), tin (Sn), indium (In), aluminum (Al), silicon (Si), silver (Ag), nickel (Ni) and copper (Cu) It may be formed of a material selected from or alloys thereof.

The reflective layer 140 may be about 2500 angstroms thick. The reflective layer 140 may be formed of a metal layer including aluminum (Al), silver (Ag), nickel (Ni), platinum (Pt), rhodium (Rh), or an alloy containing Al, Ag, Pt, or Rh. have. Aluminum or silver may effectively reflect light generated from the active layer 124 to greatly improve the light extraction efficiency of the light emitting device.

Since the light emitting structure 120, in particular, the second conductive semiconductor layer 126 has a low impurity doping concentration and a high contact resistance, and thus may not have good ohmic characteristics, the ohmic layer 130 may be improved. Transparent electrodes and the like can be formed.

The ohmic layer 130 may be about 200 angstroms thick. The ohmic layer 130 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and indium gallium tin (IGTO). oxide), aluminum zinc oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO), IZO (IZO Nitride), AGZO (Al-Ga ZnO), IGZO (In-Ga ZnO), ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, and Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Sn, In, Ru, Mg, Zn, Pt At least one of Au, Hf, and the like may be formed, and the material is not limited thereto.

The light emitting structure 120 is formed on the first conductivity type semiconductor layer 122 and the first conductivity type semiconductor layer 122 and the active layer 124 for emitting light and the second layer formed on the active layer 124. And a conductive semiconductor layer 126.

The first conductivity type semiconductor layer 122 may be implemented as a group III-V compound semiconductor doped with a first conductivity type dopant, and when the first conductivity type semiconductor layer 122 is an N-type semiconductor layer, The first conductive dopant may be an N-type dopant and may include Si, Ge, Sn, Se, or Te, but is not limited thereto.

The first conductive semiconductor layer 122 may be formed of a semiconductor material having a composition formula of Al _x In _y Ga _(1-xy) N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). It may include. The first conductive semiconductor layer 122 may be formed of any one or more of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, InGaAs, AlInGaAs, GaP, AlGaP, InGaP, AlInGaP, InP.

In the active layer 124, electrons injected through the first conductive semiconductor layer 122 and holes injected through the second conductive semiconductor layer 126 formed thereafter meet each other to form an energy band unique to the active layer (light emitting layer) material. The layer may emit light having energy determined by the light, and the light emitted from the active layer 124 may emit light in the ultraviolet region in addition to the visible region.

The active layer 124 may be formed of at least one of a single quantum well structure, a multi quantum well structure (MQW), a quantum-wire structure, or a quantum dot structure. For example, the active layer 124 may be formed by injecting trimethyl gallium gas (TMGa), ammonia gas (NH ₃ ), nitrogen gas (N ₂ ), and trimethyl indium gas (TMIn) to form a multi-quantum well structure. It is not limited to this.

The well layer / barrier layer of the active layer 124 is formed of one or more pair structures of InGaN / GaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / GaN, GaAs (InGaAs) / AlGaAs, GaP (InGaP) / AlGaP. But it is not limited thereto. The well layer may be formed of a material having a lower band gap than the band gap of the barrier layer.

A conductive cladding layer (not shown) may be formed on or under the active layer 124. The conductive clad layer may be formed of an AlGaN-based semiconductor, and may have a higher band gap than the band gap of the active layer 164.

The second conductivity-type semiconductor layer 126 may be a Group III-V compound semiconductor doped with a second conductivity type dopant, for example, In _x Al _y Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, Semiconductor material having a composition formula of 0 ≦ x + y ≦ 1). When the second conductive semiconductor layer 126 is a P-type semiconductor layer, the second conductive dopant may include Mg, Zn, Ca, Sr, Ba, and the like as a P-type dopant.

Meanwhile, the first conductive semiconductor layer 122 may include a p-type semiconductor layer, and the second conductive semiconductor layer 126 may include an n-type semiconductor layer.

A low temperature oxide layer 170 may be formed on the light emitting structure 120, that is, on the surface of the first conductivity type semiconductor layer 122. The low temperature oxide film 170 may be formed of a light transmissive material. The low temperature oxide film 170 may include ITO or silicon oxide (SiO ₂ ), and irregularities may be formed on a surface thereof to adjust a directing angle of light emitted from the light emitting structure 120.

In addition, the first electrode 190 may be formed on the surface of the low temperature oxide layer 170, and may include aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). It may be formed in a single layer or a multi-layer structure, including at least one.

A passivation layer 180 may be formed on the side surface of the light emitting structure 120, and may also be formed on the side surface of the low temperature oxide layer 170.

The passivation layer 180 may be made of an insulating material, and the insulating material may be made of an oxide or nitride which is non-conductive. As an example, the passivation layer 180 may be formed of a silicon oxide (SiO ₂ ) layer, an oxynitride layer, and an aluminum oxide layer.

In the present embodiment, the first lead frame 221 and the light emitting device 100 are electrically connected through the conductive adhesive layer 230, and the second lead frame 122 and the light emitting device 100 connect the wire 240. It is connected through. The light emitting device 100 may be connected to the first and second lead frames 221 and 222 by a flip chip method or a die bonding method in addition to the wire bonding method.

The molding part 250 may surround and protect the light emitting device 100. In addition, the molding part 250 may include a phosphor 260 to change the wavelength of light emitted from the light emitting device 100. The molding part 250 may be formed to cover at least the light emitting device 100 and the wire 240.

In addition, the light of the first wavelength region emitted from the light emitting device 100 is excited by the phosphor 260 and converted into the light of the second wavelength region, and the light of the second wavelength region is a lens (not shown). The light path may be changed while passing through the light path conversion unit.

A lens (not shown) may be disposed on the molding unit 250 and the package body 210, and may convert an optical path of light emitted from the light emitting device 100 to convert wavelengths from the phosphor, in particular, a backlight unit. When the light emitting device package is used within the direction angle can be adjusted.

The lens (not shown) is made of a material having good light transmittance, and for example, may be made of PolyMethylMethAcrylate (PMMA), Polycarbonate (PC), PolyEthylene (PE) or resin injection molding. .

In FIG. 1, parallel layers 270a and 270b are disposed between the first lead frame 221, the second lead frame 222, and the package body 210.

The paraline layer 270a is formed between the first lead frame 221 and the second lead frame 222 and the outer wall of the package body 210, and the first lead frame 221 and the second lead frame 222 are formed. The parallel layer 270b is disposed between the inner wall of the package body 210 and the package body 210.

The paraline layer 270a formed on the outer wall of the package body 210 is the 'B' region of FIG. 1, and the paraline layer 270b formed on the inner wall of the package body 210 is the 'A' region of FIG. 1. Each of the seals prevents foreign matter such as moisture or air from penetrating between the package body 210 and the first and second lead frames 221 and 222.

The paraline layer 270b disposed on the inner wall of the package body 210, ie, inside the cavity, may be disposed covering the edges of the first and second lead frames 221 and 222. The first and second lead frames 221 and 222 may be disposed to cover the whole.

Since the paraline layer 270b may lower the brightness of the light emitting device package 200, the paraline layer 270b may not be disposed in most areas of the bottom surface 210c and the sidewall 210b of the cavity. It can be used, but the specific method will be described later.

The paraline layer 270b may not be formed in a region on the first lead frame 221 where the light emitting device 100 is disposed, and the wire 240 may be formed in the cavity on the second lead frame 222. The paraline layer 270b may not be disposed even in the region to which the paraffin is bonded.

2 and 4, the paraline layers 270a and 270b are coated to surround the interface between the package body 210 and the first and second lead frames 221 and 222, so that the package body 210 and the first, 2 It is possible to prevent foreign matter such as moisture or air from penetrating into the interface between the lead frames 221 and 222.

The package body 210 is formed by injection, and the first lead frame 221 and the second lead frame 222 may be inserted into the package body 210 to be injected, and the paraline layers 270a and 270b may be injected. At least one of the first lead frame 221 and the second lead frame 222 may be disposed on an interface inserted into the package body 210. The paraline layers 270a and 270b may include a poly-para-xylyene polymer.

5 is a view illustrating a manufacturing process of a light emitting device package.

The paraline layers 270a and 270b are formed only in a portion of the package body 210, and may cover the mask 300 on a portion of the package body 210 and deposit the paraline layers 270a and 270b.

In FIG. 5, the first and second lead frames 221 and 222 are inserted to eject the package body 210, and the mask 300 includes the bottom surface 210c and sidewalls 210b and the package body 210 of the cavity. It is disposed on a part of the upper surface 210a of the.

The first and second lead frames 221 and 222 protruding from the outside of the package body 210 and the boundary surface of the package body 210 may not use a mask when the paraline layer 270a is disposed. This is because even if the paraline layer 270a is deposited or coated on the outside of the package body 210, it may be irrelevant to optical properties.

In the cavity of the package body 210, when the paraline layer 270b is coated or deposited, the optical property may be degraded. Thus, the mask 300 is used. The mask 300 may be disposed from a portion of the upper surface 210a of the package body 210 to the side wall 210b of the cavity and the bottom surface 210c of the cavity. The first and second lead frames 221 and 222 are partially exposed from the bottom surface 210c of the cavity, and the mask 300 may not be disposed in the area including the exposed area, and the mask 300 is not exposed. In the region, the paraline layer 270b may be deposited or coated. The mask 300 is disposed in the region D on which the light emitting device is to be disposed later and the region C in which the wire is to be bonded among the regions on the first and second lead frames 221 and 222 to prevent the deposition of the paraline layer 270b. can do.

6 is a cross-sectional view of another embodiment of a light emitting device package.

The light emitting device package 200 according to the present embodiment is similar to the embodiment shown in FIG. 2, but the phosphor forms a conformal coating layer 265. The molding part 250 is made of a silicone resin and seals the light emitting device 100 and the wire 240, and a phosphor forms a conformal coating layer 265 separately on the molding part 250.

The light emitting device package 200 according to the present exemplary embodiment has an excellent sealing effect between the package body 210 and the first and second lead frames 221 and 222, and the phosphors are uniformly distributed in the conformal coating layer 265 so that the light emitting device ( 100 can evenly change the wavelength of light emitted from.

A plurality of light emitting device packages according to the embodiment may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, or the like, which is an optical member, may be disposed on an optical path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Another embodiment may be implemented as a display device, an indicator device, or a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, and for example, the lighting system may include a lamp or a street lamp. .

Hereinafter, an illumination device and a backlight unit will be described as an embodiment of a lighting system in which the above-described light emitting device package is disposed.

7 is a diagram illustrating an embodiment of a lighting apparatus in which a light emitting device package is disposed.

The lighting apparatus according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation part 500 for dissipating heat from the light source 600, and the light source 600. And a holder 700 for coupling the heat dissipation part 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. One air flow port 430 may be formed in the body portion 420.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of light emitting device packages 650 on the circuit board 610. The light emitting device package 650 is according to the above-described embodiment, and the paraline layer surrounds the interface between the package body and the first and second lead frames, thereby providing excellent durability and airtightness. Here, the circuit board 610 may have a shape that can be inserted into the opening of the housing 400.

A holder 700 is provided below the light source, and the holder 700 may include a frame and another air flow port. In addition, although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

8 is a diagram illustrating an embodiment of a display device in which a light emitting device package is disposed.

As shown, the display device 800 according to the present exemplary embodiment is disposed in front of the light source modules 830 and 835, the reflector 820 on the bottom cover 820, and the reflector 820. The light guide plate 840 for guiding light emitted from the front of the display device, the first prism sheet 850 and the second prism sheet 860 disposed in front of the light guide plate 840, and the second prism sheet ( And a color filter 880 disposed in front of the panel 870 disposed in front of the panel 870.

The light source module includes the above-described light emitting device package 835 on the circuit board 830. Here, the circuit board 830 may be used, such as a PCB, the light emitting device package 835 according to the above-described embodiment, the paraline layer is surrounded by the interface between the package body and the first and second lead frame, excellent durability and airtightness Do.

The bottom cover 810 may accommodate components in the display device 800. The reflective plate 820 may be provided as a separate component as shown in the drawing, or may be disposed on the rear surface of the light guide plate 840, or The bottom cover 810 may be provided in the form of a coating with a highly reflective material.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance. The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). In addition, the light guide plate may be omitted, and thus an air guide method in which light is transmitted in the space on the reflective sheet 820 may be possible.

The first prism sheet 850 is formed of a translucent and elastic polymer material on one surface of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, the plurality of patterns may be provided in the stripe type and the valley repeatedly as shown.

In the second prism sheet 860, the direction of the floor and the valley of one surface of the support film may be perpendicular to the direction of the floor and the valley of one surface of the support film in the first prism sheet 850. This is to evenly distribute the light transmitted from the light source module and the reflective sheet in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which is composed of another combination, for example, a micro lens array or a diffusion sheet and a micro lens array. Or a combination of one prism sheet and a micro lens array.

The liquid crystal display panel (Liquid Crystal Display) may be disposed on the panel 870, in addition to the liquid crystal display panel 860 may be provided with other types of display devices that require a light source.

The panel 870 is a state in which the liquid crystal is located between the glass body and the polarizing plate is placed on both glass bodies in order to use the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

The front surface of the panel 870 is provided with a color filter 880 to transmit the light projected from the panel 870, only the red, green and blue light for each pixel can represent an image.

Since the display device described above has improved durability of the light emitting device package disposed therein, it is possible to prevent prolongation of life of the display device and reduction of color.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100 light emitting device 120 light emitting structure
122 and 126: first and second conductivity type semiconductor layers 124: active layer
130: ohmic layer 140: reflective layer
150: bonding layer 160: conductive support substrate
170: low temperature oxide film 180: passivation layer
190: first electrode 200: light emitting device package
210: package body 221, 222: first and second lead frame
230: conductive adhesive layer 240: wire
250 molding unit 260 phosphor
300: mask 400: housing
500: radiator 600: light source
700: holder 800: display device
810: bottom cover 820: reflector
830: circuit board module 840: light guide plate
850, 860: first and second prism sheet 870: panel
880 color filter

Claims (10)

A package body having a cavity;
A light emitting element disposed on the bottom surface of the cavity;
First and second lead frames electrically connected to the light emitting devices, respectively, and coupled to the package body; And
A light emitting device package comprising a paraline layer disposed between at least one of the first lead frame and the second lead frame and the package body. The method of claim 1,
And the paraline layer is disposed between at least one of the first lead frame and the second lead frame and an inner wall of the package body. The method of claim 1,
And the paraline layer is disposed between at least one of the first lead frame and the second lead frame and an outer wall of the package body. The method of claim 1,
The light emitting device is in contact with the first lead frame, the light emitting device package in which the parallel layer is not disposed in the contact region of the light emitting device and the first lead frame. The method of claim 1,
The light emitting device is wire-bonded with the second lead frame, the light emitting device package is not disposed in the wire bonding region of the second lead frame. The method of claim 1,
The paraline layer is a light emitting device package deposited on a mask covering a portion of the package body. The method of claim 1,
The package body is formed by inserting and injecting the first lead frame and the second lead frame, and the paraline layer is disposed on an interface where at least one of the first lead frame and the second lead frame is inserted into the package body. Light emitting device package. The method of claim 7, wherein
And a light emitting device package surrounding the interface between at least one of the first lead frame and the second lead frame inserted into the package body. The method of claim 1,
The paraline layer is a light emitting device package coated with a poly-para-xylyene polymer. 10. An illumination system comprising the light emitting device package of any one of claims 1-9.

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