KR20130005624A - Conductive contactor for testing semiconductor and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A conductive contactor for a semiconductor test and a manufacturing method thereof are provided to stably implement an electric contact between a semiconductor element and a test circuit substrate. CONSTITUTION: A conductive contactor(100) for a semiconductor test includes an insulating main body(110), a plurality of base sheets(130), and a plurality of conductive lines(140). The insulating main body hardens a mixed insulating base material. The base sheets are separated from each other in the insulating main body along a depth direction. The conductive lines are insulated to each other on each base sheet along a widthwise direction.

Description

CONDUCTIVE CONTACTOR FOR TESTING SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive contactor for a semiconductor test and a method of manufacturing the same, and more particularly to a semiconductor test conductive contactor capable of realizing a fine pitch and realizing stable conductive characteristics in a vertical direction. It is about a method.

The semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. In the positive test of the semiconductor device, the test is performed while a semiconductor test socket formed to be in electrical contact with a terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board. Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals, i.e. leads, of semiconductor devices are also miniaturized. Accordingly, the spacing between conductive patterns of conductive contactors applied to test sockets is also minute. A method of forming is required. Therefore, the existing Pogo-pin type conductive contactor has a limitation in manufacturing a semiconductor test socket for testing the integrated semiconductor device.

The proposed technique to meet the integration of the semiconductor device, the perforated pattern is formed in the vertical direction on the silicon body made of an elastic silicon material, and then filled with conductive powder inside the perforated pattern to form a conductive pattern PCR type is widely used.

1 is a cross-sectional view of a conductive contactor of PCR type. As shown in FIG. 1, in the conductive contactor of the PCR type, a perforated pattern is formed in an insulating silicon body 10, and conductive patterns are formed in the vertical direction by the conductive powder 11 filled in the perforated pattern.

Such a PCR-type conductive contactor has an advantage of enabling fine pitch, but the conductive powder 11 filled in the perforated pattern is generated when the semiconductor element 3 and the test circuit board 5 come into contact with each other. In the way that the conductivity is formed by the pressure, there is a disadvantage in that the thickness is formed in the vertical direction.

That is, although the conductive powders 11 are brought into contact with each other by the pressure in the vertical direction, the conductivity is formed. When the thickness increases, the pressure transmitted to the inside of the conductive powder 11 is weakened, so that the conductivity may not be formed. Therefore, the PCR-type conductive contactor has a disadvantage of being limited in thickness in the height direction.

In addition, a conductive pattern is formed by filling the conductive powder 11 in the space perforated in the silicon main body 10 so that the balls and the leads of the semiconductor element 3 or the test circuit board 4 are in continuous contact with each other. In this case, the conductive powder 11 may be separated and a problem of contact failure may occur.

Accordingly, the present invention has been made to solve the above problems, the disadvantages of the pogo-pin-type conductive contactor, and the disadvantages of the PCR-type conductive contactor is complemented, it is possible to implement a fine pattern while in the height direction SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive contactor for semiconductor test and a method of manufacturing the same that can overcome the thickness constraint.

Another object of the present invention is to provide a conductive contactor for a semiconductor test and a method of manufacturing the same, which can more stably form electrical contact between a semiconductor device and an inspection circuit board.

According to the present invention, in the conductive contactor for a semiconductor test, an insulating main body formed by curing an insulating base material mixed with conductive powder and a plurality of bases disposed in the insulating main body spaced apart from each other along a depth direction. A sheet and a plurality of conductive lines formed on each of the base sheets in an insulated state in a transverse direction and formed on the base sheets in a vertical direction; The conductive powder is agglomerated in a vertical direction with respect to each of the conductive lines, and is achieved by a conductive contactor for semiconductor testing, wherein the conductive lines are agglomerated to be electrically insulated from each other.

Here, the aggregation radius of the conductive powder may be wider from the center in the vertical direction of the conductive line to the upper and lower edge regions.

The apparatus may further include a plurality of isolation sheets disposed in the insulating body between the base sheets adjacent to each other, and electrically insulating the conductive lines formed on the base sheets adjacent to each other.

And upper and lower ends of the respective conductive lines are respectively located inside the insulating body; The conductive powder may be agglomerated in the upper region of the upper end of each conductive line and the lower region of the lower end of each conductive line so that a conductive pattern is formed in the vertical direction of the insulating body through the conductive lines.

The conductive line may include a magnetic part having magnetic properties; It may include a conductive portion for applying the outer surface of the magnetic portion.

The magnetic part is formed through plating of a metal material having magnetic properties; The conductive part may be formed by plating a metal material having conductivity on the surface of the magnetic part.

Here, the magnetic portion is formed through nickel plating; The conductive part may be formed through gold plating.

In addition, the base sheet may be provided in the form of an insulating mesh, an insulating film, or a printed circuit board of an insulating material.

On the other hand, the above object is, according to another embodiment of the present invention, a method for manufacturing a conductive contactor for semiconductor testing, comprising the steps of: (a) providing a base sheet of insulating material; (b) forming a plurality of conductive lines arranged on the base sheet in a state insulated from each other in a horizontal direction and provided in the vertical direction of the base sheet; (c) placing the plurality of base sheets through the steps (a) and (b) in a mold so as to be spaced apart from each other; (d) injecting an insulating base material mixed with conductive powder into the mold; (e) providing magnetic force through the upper and lower portions of the plurality of base sheets to form magnetism in each of the conductive lines formed in the plurality of base sheets; (f) aggregating the conductive powder in an up and down direction with respect to the respective conductive lines according to the magnets formed in the respective conductive lines, and aggregating the conductive lines such that the conductive lines are electrically insulated from each other.

Here, the step (b) is a step of forming a plurality of magnetic parts in the position corresponding to each of the conductive lines in the base sheet of the metal material (b1) magnetic material, and (b2) the conductivity of the surface of each magnetic part Applying a metal material to form the plurality of conductive lines; In the step (e), the magnets formed in the conductive lines may be formed by the magnetic part.

In the step (b1), the magnetic part is formed through plating of a metal material having magnetic properties; In the step (b2), the conductive part may be formed by plating a metallic material having conductivity on the surface of the magnetic part.

Here, the magnetic portion is formed through nickel plating; The conductive part may be formed through gold plating.

In addition, in step (f), the aggregation radius of the conductive powder may increase from the center in the vertical direction of the conductive line to the upper and lower edge regions.

And (c) further comprises disposing a plurality of base sheets between the adjacent base sheets; The conductive lines formed in the base sheets adjacent to each other and facing each other may be electrically isolated by the base sheet.

In the step (d), the insulating base material is injected into the mold such that upper and lower ends of the respective conductive lines are positioned inside the insulating base material; In the step (f), the conductive powder may be aggregated in the upper region of the upper end of each conductive line and the lower region of the lower end of each conductive line.

The base sheet may be provided in the form of an insulating mesh, an insulating film, or a printed circuit board of an insulating material.

According to the present invention according to the configuration as described above, the disadvantages of the pogo-pin type conductive contactor and the disadvantages of the PCR type conductive contactor is compensated, it is possible to implement a fine pattern while overcoming the thickness constraint in the height direction Will be.

In addition, the electrical contact between the semiconductor element and the test circuit board can be formed more stably.

FIG. 1 is a view showing a configuration of a conventional PCR type conductive contactor for semiconductor test,
2 is a perspective view of a conductive contactor for a semiconductor test according to the present invention;
FIG. 3 is a view of the upper portion of the conductive contactor for semiconductor test of FIG. 2;
4 is a cross-sectional view taken along line IV-IV of FIG. 2,
5 is a view showing an example of the base sheet of the conductive contactor for a semiconductor test according to the present invention,
6 is a view for explaining a method for manufacturing a conductive contactor for a semiconductor test according to the present invention,
7 is a perspective view of a conductive contactor for semiconductor test according to another embodiment of the present invention;
FIG. 8 is a view of the upper portion of the conductive contactor for semiconductor test of FIG. 7.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

2 is a perspective view of the conductive contactor 100 for semiconductor test according to the present invention, Figure 3 is a view of the upper portion of the conductive contactor 100 for semiconductor test according to the present invention, Figure 4 is a IV- of FIG. It is a figure which shows the cross section along line IV. 2 to 4, the conductive tester 100 for semiconductor testing according to the present invention includes an insulating body 110, a plurality of base sheets 130, and a plurality of conductive lines 140.

The insulating main body 110 is formed by curing the insulating base material mixed with the conductive powder 120. The conductive powder 120 applied to the insulating body 110 according to the present invention is applied to the metal powder which is an electrical conductor, the insulating base material is an electrical insulator is an example that is provided with a silicon material having elasticity when cured.

As illustrated in FIGS. 2 and 3, the base sheet 130 is disposed in the insulating body 110 in a state in which the base sheets 130 are spaced apart from each other along the depth direction D. FIG. Here, the separation distance between the base sheets 130 is determined according to the pitch of the conductive pattern in the depth direction D of the conductive contactor 100 for semiconductor test according to the present invention.

The conductive lines 140 are formed to be electrically insulated from each other along the horizontal direction W in the base sheets 130. 5 illustrates a conductive line 140 formed on one base sheet 130. Here, each conductive line 140 is formed in the base sheet 130 in the vertical direction (H), so that each conductive line 140 electrically connects the upper and lower portions of the base sheet 130. To form.

Here, the conductive powder 120 mixed in the insulating base material is aggregated along the vertical direction H around each conductive line 140, as shown in FIG. 4, before curing of the insulating base material. At this time, the conductive powder 120 aggregates around each conductive line 140 so that each conductive line 140 is electrically insulated from each other.

According to the configuration as described above, each conductive line 140 and the conductive powder 120 aggregated around each conductive line 140 is the vertical direction of the conductive contactor 100 for semiconductor test according to the present invention ( A conductive pattern for electrically connecting H) is formed.

Accordingly, the conductive line 140 formed on the base sheet 130 forms a conductive pattern, thereby overcoming the limitation of thickness, which is a disadvantage of the conventional PCR-type conductive contactor 100. In addition, the conductive powder 120 cured in the state mixed with the insulating base material elastically contacts the semiconductor element and the test circuit board to remove the damage of the leads of the semiconductor element and the test circuit board, and to be mixed with the insulating base material. Cured to minimize the detachment of the conductive powder 120 in contact.

In addition, the pitch between the conductive patterns of the conductive contactor 100 for semiconductor test according to the present invention can be adjusted by adjusting the gap between the conductive lines 140 formed on the base sheet 130 and the gap between the base sheets 130. Thus, the fine pitch can be implemented.

On the other hand, the conductive powder 120 of the conductive contactor 100 for semiconductor test according to the present invention, as shown in Figure 4, the upper edge region and the lower portion from the center in the vertical direction (H) of the conductive line 140 The cohesion radius widens toward the edge region. This is formed in the aggregation process of the conductive powder 120, a detailed description thereof will be described later.

In addition, the upper end and the lower end of each conductive line 140, as shown in Figure 4, it is an example that is located inside the insulating main body 110, respectively. That is, the length of the insulating main body 110 in the vertical direction H is formed longer than the length of the base sheet 130 in the vertical direction H.

Then, the conductive powder 120 is agglomerated in the upper region H1 at the upper end of each conductive line 140 and the lower region H2 at the lower end of each conductive line 140, and the aggregation of the upper region H1 is performed. Through the conductive powder 120, the conductive line 140, and the conductive powder aggregated in the lower region H2, a conductive pattern in the vertical direction H of the insulating body 110 may be formed.

On the other hand, the base sheet 130 according to the present invention may be provided in the form of a mesh having a mesh structure of an insulating material. The conductive line 140 formed on the mesh-based base sheet 130 may include a magnetic part having magnetic properties and a conductive part applying an outer surface of the magnetic part.

Here, the magnetic part may be formed through plating of a metal material having magnetic properties, for example nickel. In addition, the conductive portion may be formed by plating a conductive metal material, for example, gold on the surface of the magnetic portion. Accordingly, the conductive line 140 formed on the base sheet 130 may have conductivity through gold plating, and may have magnetism upon application of magnetic force through the magnetic portion. Here, a detailed description of the magnetism of the magnetic portion will be described later.

As described above, the base sheet 130 and the conductive line 140 of the conductive contactor 100 for semiconductor test according to the present invention has been described as an example that is formed through nickel plating and gold plating in the mesh form. In addition, another method in which the conductive line 140 may be formed in the insulating material in the form of a sheet, for example, the conductive line 140 having conductivity and magnetism in the film form of the insulating material may be formed, and the conductive line 140 may be formed. May be applied to a printed circuit board such as a flexible printed circuit board (FPCB).

Hereinafter, a method of manufacturing the conductive contactor 100 for a semiconductor test according to the present invention will be described in detail with reference to FIG. 6.

First, an insulating base sheet 130 is provided, and the base sheet 130, as shown in FIG. 5, forms a plurality of conductive lines 140. Here, the method of forming the base sheet 130 and the plurality of conductive lines 140 is as described above.

As described above, the base sheet 130 having the plurality of conductive lines 140 formed thereon is disposed in the mold M such that the base sheets 130 are positioned to face each other and are spaced apart from each other. 6 (a) to 6 (c) are cross-sectional views of the mold M and the base sheet 130 disposed in the mold M in a cross section in the depth direction D shown in FIG. A conductive line 140 formed at 130 is shown.

As described above, when the base sheet 130 is disposed in the mold M spaced apart from each other, as shown in FIG. 6B, the insulating powder in which the conductive powder 120 is mixed with the cavity in the mold M is mixed. Inject the base material. At this time, the insulating base material is injected into the mold M such that the upper end and the lower end of each conductive line 140 are positioned inside the insulating base material.

When the injection of the insulating base material is completed, as shown in FIG. When the magnetic force is provided through the upper and lower portions of the base sheet 130 as described above, the magnetic portion is generated in the magnetic portion of each conductive line 140, the conductive powder 120 according to the magnetic formed on the conductive line 140 Aggregate in the up-and-down direction H around each of the conductive lines 140, and the conductive lines 140 are electrically insulated from each other.

At this time, by the magnetic field formed by each conductive line 140, as shown in Fig. 6 (c), from the center in the vertical direction (H) of the conductive line 140 to the upper and lower edge regions Increasingly, the aggregation radius of the conductive powder 120 becomes wider.

6C is shown in the upper region H1 (see FIG. 4) of the upper end of each conductive line 140 and the lower region H2 (see FIG. 4) of the lower end of each conductive line 140. As shown in FIG. 1, the conductive powder 120 is agglomerated, so that each conductive pattern of the conductive contactor 100 for semiconductor test according to the present invention is agglomerated at the top of the conductive powder 120, the conductive line 140, and the bottom. It is formed by the conductive powder 120 aggregated to.

Hereinafter, a conductive tester 100a for a semiconductor test according to another exemplary embodiment of the present invention will be described in detail with reference to FIGS. 7 and 8. Here, in the conductive tester 100a of the semiconductor test illustrated in FIGS. 7 and 8, the isolation sheet 150 is disposed between the base sheets 130 adjacent to each other, and the isolation sheet 150 is adjacent to the base sheet 130. Is electrically isolated between the conductive lines 140 formed on the substrate. Accordingly, even if the interval between the base sheets 130 is narrowed, the conductive powder 120 aggregated on the conductive lines 140 of the adjacent base sheets 130 may be electrically insulated, thereby further reducing the pitch interval.

Other components of the semiconductor test conductive contactor 100a shown in FIGS. 7 and 8 correspond to those of the semiconductor test conductive contactor 100 shown in FIGS. 2 and 3, and a detailed description thereof will be omitted. .

In the above-described embodiment, as shown in FIG. 4, the upper and lower ends of the conductive line 140 formed in the base sheet 130 are disposed inside the insulating body 110 to form the insulating body ( It is taken as an example located inside the 110). In addition, the length in the vertical direction H of the base sheet 130 and the thickness in the vertical direction H of the insulating main body 110 are the same, and both ends of the vertical direction H of the conductive line 140 are insulative. Of course, it can be provided to be exposed to the outside of the top and bottom of the sheet.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

100: conductive contactor for semiconductor test
110: insulating body 120: conductive powder
130: base sheet 140: conductive line
150: insulating sheet

Claims (16)

In the conductive contactor for semiconductor testing,
An insulating main body formed by curing an insulating base material mixed with conductive powder,
A plurality of base sheets disposed in the insulating body and spaced apart from each other along a depth direction;
A plurality of conductive lines formed on the respective base sheets in an insulated state along the transverse direction and formed on the respective base sheets in the vertical direction;
The conductive powder is agglomerated in the vertical direction around each of the conductive lines, the conductive contactor for a semiconductor test, characterized in that the conductive lines are agglomerated to be electrically insulated from each other. The method of claim 1,
The conductive contactor for the semiconductor test, characterized in that the aggregation radius of the conductive powder is wider from the center in the vertical direction of the conductive line to the upper and lower edge regions. The method of claim 1,
And a plurality of isolation sheets disposed in the insulating body between the adjacent base sheets, and electrically insulating the conductive lines formed in the adjacent base sheets. The method of claim 1,
Upper and lower ends of each of the conductive lines are respectively located inside the insulating body;
The conductive powder is agglomerated in the upper region of the upper end of each conductive line and the lower region of the lower end of each conductive line to form a conductive pattern in the vertical direction of the insulating body through the conductive lines. Conductive contactor for semiconductor test. 5. The method according to any one of claims 1 to 4,
The conductive line,
A magnetic part having magnetic properties;
And a conductive portion for coating the outer surface of the magnetic portion. The method of claim 5,
The magnetic part is formed through plating of a metal material having magnetic properties;
And the conductive portion is formed on the surface of the magnetic portion by plating of a conductive metal material. The method according to claim 6,
The magnetic portion is formed through nickel plating;
And the conductive portion is formed by gold plating. 5. The method according to any one of claims 1 to 4,
The base sheet is a conductive contactor for the semiconductor test, characterized in that provided in the form of an insulating mesh, an insulating film, or a printed circuit board of the insulating material. In the manufacturing method of the conductive contactor for semiconductor testing,
(a) providing a base sheet of insulating material;
(b) forming a plurality of conductive lines arranged on the base sheet in a state insulated from each other in a horizontal direction and provided in the vertical direction of the base sheet;
(c) placing the plurality of base sheets through the steps (a) and (b) in a mold so as to be spaced apart from each other;
(d) injecting an insulating base material mixed with conductive powder into the mold;
(e) providing magnetic force through the upper and lower portions of the plurality of base sheets to form magnetism in each of the conductive lines formed in the plurality of base sheets;
(f) aggregating the conductive powder in an up and down direction about each of the conductive lines according to the magnets formed in the respective conductive lines, and aggregating the conductive lines such that the conductive lines are electrically insulated from each other. Method for manufacturing a conductive contactor for semiconductor testing. 10. The method of claim 9,
The step (b)
(b1) forming a plurality of magnetic portions at positions corresponding to the respective conductive lines on the base sheet using a magnetic metal material;
(b2) forming a plurality of conductive lines by applying a conductive metal material to the surface of each magnetic part;
The method of manufacturing a conductive contactor for a semiconductor test, characterized in that the magnetic formed in each conductive line in the step (e) is formed by the magnetic portion. The method of claim 10,
In the step (b1), the magnetic part is formed through plating of a metal material having magnetic properties;
In the step (b2), the conductive portion is a method of manufacturing a conductive contactor for a semiconductor test, characterized in that formed on the surface of the magnetic portion by plating of a conductive metal material. The method of claim 11,
The magnetic portion is formed through nickel plating;
The conductive part is a method of manufacturing a conductive contactor for a semiconductor test, characterized in that formed through gold plating. 10. The method of claim 9,
The method of manufacturing a conductive contactor for a semiconductor test, characterized in that the agglomeration radius of the conductive powder is wider from the center in the vertical direction of the conductive line to the upper and lower edge regions in the step (f). 10. The method of claim 9,
Step (c) further comprises disposing a plurality of base sheets between the adjacent base sheets;
A method of manufacturing a conductive contactor for semiconductor test, characterized in that between the conductive lines formed in the adjacent base sheets and facing each other are electrically isolated by the base sheet. 10. The method of claim 9,
In the step (d), the insulating base material is injected into the mold such that upper and lower ends of the respective conductive lines are located inside the insulating base material;
And in the step (f), the conductive powder is agglomerated in an upper region of an upper end of each conductive line and a lower region of a lower end of each conductive line. 16. The method according to any one of claims 9 to 15,
The base sheet is a method of manufacturing a conductive contactor for a semiconductor test, characterized in that provided in the form of an insulating mesh, an insulating film, or a printed circuit board of an insulating material.

Images