KR20120127864A - Curl cutting device - Google Patents
Curl cutting device Download PDFInfo
- Publication number
- KR20120127864A KR20120127864A KR1020110045614A KR20110045614A KR20120127864A KR 20120127864 A KR20120127864 A KR 20120127864A KR 1020110045614 A KR1020110045614 A KR 1020110045614A KR 20110045614 A KR20110045614 A KR 20110045614A KR 20120127864 A KR20120127864 A KR 20120127864A
- Authority
- KR
- South Korea
- Prior art keywords
- curl
- lead frame
- curl removing
- cutting
- pair
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims description 53
- 238000003825 pressing Methods 0.000 claims description 49
- 238000001721 transfer moulding Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 description 36
- 229920005989 resin Polymers 0.000 description 36
- 238000000465 moulding Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
The present invention relates to a curl removing device having a cutting function for removing curls generated when molding a semiconductor package. More specifically, the present invention, in addition to the cavity in the molding process of the transfer molding apparatus, the resin remains in the receiver on the resin supply passage for temporarily receiving the molten resin to supply the resin or to distribute the resin to supply the molten resin into the cavity It relates to a curl removing device for removing the cured curl.
In general, a semiconductor package process for manufacturing a fine semiconductor chip (for example, an LED semiconductor chip) forms a package mold for a plurality of semiconductor chips disposed adjacent to a grid in a lead frame, and a semiconductor device (LED) is formed on the package mold. Device) and then a wire bonding process and an encapsulation molding process using an encapsulant are performed.
In this case, in the case of a molding process for forming a package mold, a transfer molding method may be used. That is, a molding process for forming a package mold in lead frame units may be performed by arranging a mold in which a resin supply passage and each package mold are partitioned on the lead frame, and then supplying molten resin into the resin supply passage. .
After the molding process for forming the package mold is completed, the molten resin is cured in the resin material supply passage to form unnecessary curl. Unnecessary curl serves as an obstacle in the subsequent process, there is a problem to lower the precision of the process.
In the molding process of the transfer molding apparatus, in addition to the cavity, the curled cured resin remains in the receiver on the resin supply flow path which temporarily receives the molten resin to supply the resin or flows the molten resin into the cavity to distribute the resin. An object of the present invention is to provide a curl removal device that can be easily removed.
In order to solve the above problems, the present invention provides a table on which a lead frame on which a package mold is formed by a transfer molding process is seated, heating means for heating the lead frame on which the package mold is formed, and a lead frame heated by the heating means. It provides a curl removing device comprising a curl removing means for removing the curl formed at one end, and a conveying means for conveying the curl removing means.
In addition, the table is provided with a pair in parallel, a pair of curl removal means may be installed so as to face opposite curl to remove the curl formed on the opposite side end of the pair of lead frames seated on the pair of tables.
In this case, it may further include a lead frame support means provided in the table to support at least one side of the lead frame.
The lead frame support means may be provided to support three side surfaces of the lead frame except the edge of the lead frame.
Here, the lead frame support means may be composed of at least one support block to prevent the lead frame from being separated.
In addition, the heating means may be provided in the table or the curl removing means.
In addition, the heating means may be selected from a hot wire, a hot plate or a hot air supply device embedded or mounted in the table or the curl removing means.
In this case, the curl removing means may include a pressing portion for pressing the upper surface of the edge of the lead frame seated on the table and a cutting portion for removing the curl.
The vertical thickness of the front end of the pressing unit may be smaller than the thickness of the rear end.
The cutting part may be branched at a rear end of the pressing part to be provided in parallel with the pressing part, and the cutting part may cut a curl formed at one end of the lead frame pressed by the pressing part.
In addition, the height of the lower surface of the pressing portion may be higher than the height of the lower surface of the cutting portion.
In addition, the heating means may be a heating wire embedded or mounted in at least one of the pressing portion and the cutting portion constituting the curl removing means.
In this case, the conveying means may convey a plurality of curl curl removing means together.
The conveying means may include an LM guide provided outside the table in parallel with the table, an LM block sliding on the LM guide, and a mounting member fixed to the LM block and mounted with the curl removing means.
Here, the driving means for driving the LM block may be any one of a ball screw, a conveyor belt, a cylinder or a linear motor.
The curl removing device according to the present invention can quickly remove curls that may be generated during a transfer molding process by an automated curl removing device.
In addition, the curl removal device according to the present invention can facilitate the cutting process of the curl by lowering the hardness of the curl by preheating the curl before the curl removal process.
In addition, the curl removing device according to the present invention may be provided with a plurality of curl removing means can maximize the efficiency of the curl cutting process.
In addition, the curl removing means constituting the curl removing device according to the present invention can remove the curl formed on one end of the lead frame pressed by the pressing portion and the pressing portion for pressing the lead frame, thereby ensuring the stability of the curl cutting process can do.
1 illustrates a plan view of a general lead frame and a state in which a package mold is formed on the lead frame.
2 is a plan view and a front view of a curl removing device according to an embodiment of the present invention.
Figure 3 shows an embodiment of a curl removing means provided in the curl removing device of the present invention.
Figure 4 shows another embodiment of the curl removing means provided in the curl removing device of the present invention.
5 is a plan view and a front view of a state in which a lead frame with a package mold is mounted on a curl removing device according to the present invention.
6 is a front view of a process of removing curl in a state in which a lead frame having a package mold is mounted on the curl removing device according to the present invention.
7 is a plan view of a curl removing device according to another embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
1 illustrates a plan view of a lead frame LF of a semiconductor package and a state in which a package mold pm is formed on the lead frame LF.
Specifically, FIG. 1A illustrates a plan view of a lead frame LF included in a semiconductor package, and FIG. 1B illustrates a state in which a package mold pm is formed on a lead frame LF of a semiconductor package. do.
In order to produce a fine semiconductor chip, a transfer molding process may be used. In addition, when the semiconductor chip is an LED chip, a primary molding process for mounting the LED elements constituting the LED chip and configuring a package mold (pm) for a wire bonding process may be performed.
The lead frame LF may be formed of a flat metal material, and may form a step, unevenness, or opening (h) by punching or etching on the surface thereof. That is, the step formed in the lead frame LF, the unevenness or the opening (h) is for the purpose of improving the adhesiveness with the resin and the like to be impregnated with the molding target resin.
As shown in FIG. 1A, a plurality of molding regions may be provided on a single lead frame LF. A total of four molding regions ma1 to ma4 may be provided in the lead frame LF illustrated in FIG. 1A.
Each molding region may be processed into a plurality of semiconductor chips in a lattice shape. That is, a large amount of fine semiconductor chips can be obtained by a dicing process after each process.
As shown in FIG. 1B, a plurality of package molds pm may be formed adjacent to each other in a lattice form after the molding process.
In addition, since the size of the package mold pm is small and the number is large, the process of forming the package mold pm may be a transfer molding process.
In the transfer molding process, in order to supply the resin uniformly to the entire molding region in the resin supply passage through which the resin is supplied, a receiver C1 may be provided to temporarily store the supplied resin, subdivide it, and distribute the resin.
The receiver C1 temporarily stores molten resin supplied through a resin supply passage (not shown) and supplies the granular resin through a detailed resin supply passage C2.
After the molding process for forming the package mold (pm) is completed, the molten resin is cured in the detailed resin supply passage C2 connecting the molding region in the receiver C1 and the receiver to form curls and the like. . The curls are preferably removed in a subsequent process because they cause deterioration of the precision of the process.
Conventionally, without separate preliminary work for removing curls, curls are removed from the lead frame LF by hand, but the cured resin is not cut well by the cutter, so the efficiency of the cutting process is reduced and the quality of the removed state is also reduced. The problem of not being constant may be solved through the
2 is a plan view and a front view of the
The
The table 100 is a mounting means on which the curl removal target lead frame LF is seated. In the embodiment shown in FIG. 2, two tables 100 are provided in parallel.
Therefore, after the pair of lead frames (LF) are mounted together, curls can be removed at the same time. The table 100 may be provided in a spaced apart state, and the curl removing means 130 is transferred between the spaced tables 100 by a transfer means 150 to be described later, and at one end of the lead frame LF. The formed curls will be removed. This will be explained later.
A lead frame LF supporting means 110 provided on the table 100 may be further included to support at least one side of the lead frame LF seated on the table 100. The lead frame
Therefore, in the process of removing the curl of the lead frame LF, the side of the lead frame LF exposed to the side except for one side of the edge of the lead frame LF exposed to the side, during the curl removal process The lead frame LF is prevented from being separated or shifted in position to enable accurate curl cutting.
As shown in FIG. 2, the table 100 is provided with a pair of parallel spaced apart, and each of the table 100 has a
In the embodiment illustrated in FIG. 2A, since the molding region (see FIG. 1) is continuously provided in the lead frame LF in the same direction, the table 100 may have a long rectangular shape.
One support block for supporting one side of each lead frame LF may be configured as one, but as shown in FIG. 2 (a), when the length of one side of the lead frame LF is long, 2 The support blocks may be provided in the table 100 in a state of being spaced apart.
As shown in FIG. 2A, the first table 100a and the second table 100b for seating the lead frame LF are first and fourth supports for supporting side surfaces of both ends in the longitudinal direction, respectively. Blocks 110 (1) and 110 (4) are provided, and the second side and the second support block having a long side opposite to the side opposite to the side opened to remove the curl by the curl removing means 130 are long. (110 (2), 110 (3)) is designed to be provided, but may be designed with only one support block in the center of the side (not shown).
According to the size and length of the lead frame LF, the number of support blocks 110 constituting the lead frame LF support means 110 may be flexibly applied.
The table 100 may be provided in pairs in parallel, and heating means (hot wire, hot plate, hot air supply, etc.) may be embedded or mounted in each table 100 at one end of the lead frame LF. .
2 (a) and 2 (b), the heating means 120 is embedded along the inner edge of the upper surface of the table 100 in the longitudinal direction of the table 100 As shown.
Specifically, the heating means 120 may be mounted along the longitudinal direction of the table 100 at one end of the upper surface of the table 100 in which the
The heating means 120 serves to heat the edge of the lead frame LF so that the curl formed at one end of the lead frame LF is easily cut by the curl removing means 130 to be described later.
That is, the heating means 120 is a curl removal means 130 to be described later to preheat the curl formed at one end of the lateral direction of each lead frame (LF) to lower the hardness of the curl by the curl removal means 130 Can be easily cut or removed.
The molding material of the resin material is partially melted by the heating means 120 to lower the hardness, so that the curling by the curl removing means 130 may be easily removed.
Of course, since the curl is not heated and completely melted, but the temperature is preheated to alleviate the hardness of the curl, not only the edge of the lead frame but also the entire lead frame may be heated, but considering work efficiency and cost. It is more preferable to heat only one end of the lead frame in which the curl to be removed is formed.
The
The curl removing means 130 cuts and removes the curl formed at one end of the lead frame LF. In the embodiment shown in Figure 2, the table 100 for mounting the lead frame (LF) is provided in two parallel, each of the curls formed at one end near the opposite side of the lead frame (LF) to be seated can be removed Can be.
The curl removing means 130 is transported along the longitudinal direction of the table 100 in a state of being mounted on the conveying means 150, and may remove curls. The conveying means 150 may be a mounting
The mounting
The pair of LM guides 151 are provided parallel to each table 100 on the outside of the pair of tables 100. The mounting
The driving means for sliding the LM block 153 on the
Therefore, when the LM block 153 is propelled and slidably displaced on the
That is, a pair of curl removal means 130 mounted on the mounting
3 shows an embodiment of the curl removing means 130 provided in the
The curl removing means 130 is a means for removing the curl of the lead frame is lowered by the heating means. The curl removing means 130 may include a
The
The vertical thickness of the front end of the
The vertical thickness of the front end of the
The vertical thickness of the rear end of the
The
The
Lengths of the
The
As shown in FIG. 3B, the height h2 of the
The
4 shows another embodiment of the curl removing means 130 provided in the
Unlike the curl removing means 130 shown in FIG. 3, the
Meanwhile, the hot wire may be embedded to be parallel to the
In FIG. 2, although the heating wire is mounted on the table 100 on which the lead frame LF is seated, the heating wire as the heating means is a
5 is a plan view and a front view of a state in which the lead frame LF in which the package mold PM is formed is mounted on the
Specifically, Figure 5 (a) shows a state in which the lead frame (LF) is mounted on the
As described above, the first table 100a and the second table 100b for seating the lead frame LF are first and fourth support blocks 110 (1) for supporting side surfaces at both ends in the longitudinal direction, respectively. 110 (4) is provided, and the opposite side surface parallel to the side open to remove the curl by the curl removing means 130 has a long length so that the two second and third support blocks 110 (2), 110 (3)) is designed to be provided, but may be designed with only one support block in the center of the side (not shown).
Therefore, even when the curl removing means is transported by the curl transfer means 150, the horizontal movement of the lead frame LF is limited by the respective support blocks in the process of removing the curl.
Then, the curl removing means 130 is to remove the curl (C) is lowered by the heating means in the state mounted on the conveying means 150 for conveying the
In the embodiment shown in FIG. 5, the table 100 on which the lead frame LF is mounted is provided with a pair in parallel, and curls when the curl removing means 130 is transferred to the space between the spaced tables 100. Will be removed.
Since the pair of curl removal means 130 is mounted in the opposite direction to the mounting
The cutting surface of the
In this case, the cutting surface 135s of the
And, as shown in Figure 6, the transfer means 150 is a pair of LM block 153 and a mounting
In addition, in addition to the
For example, the driving means for driving the LM block may be a ball screw, a conveyor belt, a cylinder or a linear motor.
7 shows a plan view of another embodiment of a
Description overlapping with the description with reference to FIGS. 1 to 6 will be omitted. In the above-described embodiment, the conveying means 150 for conveying the mounting
However, in the embodiment shown in Figure 7, the driving force for the transfer of the conveying means 150 may be by the
On the other hand, in the embodiments and drawings of the present invention, in consideration of the processing speed and efficiency, a pair of tables have been described as having a pair of curl removal means, but it is also possible to be provided with one table and one curl removal means, respectively. Do. Except for this configuration, all the constructions such as the removal means and the transfer means are the same as or correspond to the above-described embodiments.
However, by occupying only one table and one curl removal means, not a pair, the occupied area can be reduced, which is efficient for space utilization.
While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.
1000: curl remover 100: table
110: support means 120: heating means
130: curl removal means 131: pressure unit
135: cutting portion 137: fastening member
139: heating wire 150: transfer means
151: LM Guide 153: LM Block
155: mounting member 157: driving member
C: Curl C1: Receiver
C2: Supply Channel LF: Leadframe
PM: package mold
Claims (15)
Heating means for heating a lead frame on which the package mold is formed;
Curl removal means for removing curl formed at one end of the lead frame heated by the heating means; And,
And a conveying means for conveying the curl removing means.
The table is provided with a pair in parallel, a pair of curl removal means characterized in that the pair of curl removal means is installed to face opposite to remove the curl formed at the opposite side end of the pair of lead frames seated on the pair of tables Removal device.
And a leadframe support means provided on the table to support at least one side of the leadframe.
The lead frame support means has one end formed with curl of the lead frame Curl removal device, characterized in that provided to support the three sides.
The lead frame support means is curl removal device, characterized in that composed of at least one or more support blocks to prevent the lead frame from being separated.
The heating means is a curl removing device, characterized in that provided in the table or the curl removing means.
And the heating means is any one of a hot wire, a hot plate, and a hot air supply device embedded or mounted in the table or the curl removing means.
The curl removing device includes a curling unit for pressing the upper surface of the edge of the lead frame seated on the table and a cutting unit for removing the curl.
Curing removal device, characterized in that the vertical thickness of the front end of the pressing portion is smaller than the thickness of the rear end.
The cutting portion is branched at the rear end of the pressing portion is provided in parallel with the pressing portion, the cutting portion is curl removal device, characterized in that for cutting the curl formed on one end of the lead frame pressed by the pressing portion.
The height of the lower surface of the pressing portion is curl removal device, characterized in that higher than the height of the lower surface of the cutting portion.
The heating means is a curl removing device, characterized in that any one of a hot wire, a hot plate and a hot air supply device embedded or mounted in at least one of the pressing portion and the cutting portion.
The conveying means is a curl removing device, characterized in that for conveying a plurality of curl curl removing means together.
The conveying means includes an LM guide provided on the outside of the table in parallel with the table, an LM block that slides on the LM guide and a mounting member fixed to the LM block and mounted with the curl removing means. Device.
The driving means for driving the LM block is a curl removing device, characterized in that any one of a ball screw, a conveyor belt, a cylinder or a linear motor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110045614A KR20120127864A (en) | 2011-05-16 | 2011-05-16 | Curl cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110045614A KR20120127864A (en) | 2011-05-16 | 2011-05-16 | Curl cutting device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20120127864A true KR20120127864A (en) | 2012-11-26 |
Family
ID=47512730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110045614A KR20120127864A (en) | 2011-05-16 | 2011-05-16 | Curl cutting device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20120127864A (en) |
-
2011
- 2011-05-16 KR KR1020110045614A patent/KR20120127864A/en not_active Application Discontinuation
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