KR20120108722A - Ir dryer, and the method for psr(photo solder resist) of printed circuit boards using the same - Google Patents

Abstract

PURPOSE: An IR(Infrared Ray) dryer and a PSR(Photo Solder Resist) process method of a printed circuit board using the same are provided to increase the productivity of expensive devices more than twice because the exposure degree of the previous process is reduced less than 50%. CONSTITUTION: An IR dryer(10) comprises a substrate conveyor(100), a chamber unit, a drying unit(300), a vertical operating unit, and a substrate transferring unit(500). The substrate conveyor inserts substrates(20) and discharges the dried substrates from the IR dryer. The chamber unit dries the substrates. The drying unit dries the substrate with infrared rays at the front and rear sides of the chamber unit. The vertical operating unit sets the substrates up on the substrate conveyor and lays the erected substrates on the substrate conveyor. The substrate transferring unit transfers the substrates between the chamber unit and the vertical operating unit. [Reference numerals] (20) Substrate; (210) Chamber #1; (220) Chamber #2

Description

IR dryer, and the method for PSR (Photo Solder Resist) of printed circuit boards using the same}

The present invention relates to an IR dryer and a PSR process method of a printed circuit board using the same, and more particularly, an IR dryer for non-contact IR drying after exposure of a substrate standing vertically and entering into a chamber, and after exposure using the same. The present invention relates to a PSR process method of a printed circuit board that undergoes a far infrared ray (IR) drying process.

PSR (Photo Solder Resist) process is to remove oxide film, rust preventive agent, oil, etc. which adversely affect the adhesion between substrate surface and ink, and to give proper roughness to copper surface. Exposure, development and final drying. 1 shows a flowchart of a conventional PSR process method.

On the other hand, in recent years in electronic products including portable electronic devices, various needs of consumers are increasing. In particular, the demand for small size, light weight, thin film is increasing rapidly. However, as PCBs (Printed Circuit Boards) are thinned, ink residue defects in the PSR process become a problem.

FIG. 2 illustrates an embodiment of poor ink residue in the PSR process, and the ink residue problem prevents gold plating of the bond finger and solder ball pads as the ink remains in the bond finger and solder ball pads in the PSR process. Refers to appearance defects that occur.

The problem of ink residue defects has long been the number one problem of appearance defects of all companies producing PCBs, and it is getting worse as the thickness of PCBs progresses.

However, one of the causes of the ink residue defect is contamination by a roll that develops when developing due to a lack of hardening of the surface of the PSR during PSR development, and FIG. 3 shows contamination of a roll by PSR ink. An example is shown.

Therefore, there is a need for a process that can improve the degree of curing of the SR surface from the current PSR manufacturing process (PSR pretreatment-PSR printing-PSR exposure-PSR development and drying) to improve the ink residue problem. Accordingly, a process in which a process of heat drying after PSR exposure and before PSR development was added was considered. FIG. 4 is a flowchart illustrating a PSR process method of thermally drying after exposure, in which an operation of thermally drying using an existing post-exposure heat dryer is added to improve the degree of curing of the SR surface.

However, when using a heat dryer, the substrate must be manually moved from the substrate processing line to the heat dryer in order to dry with heat, and the product must be manually received from the heat dryer to the substrate processing line. Therefore, there is a problem that the time is delayed until the final completion time of the product.

The present invention has been made to solve the above-mentioned problems, by in-line the far-infrared (IR) drying process at the development stage to reduce the final completion time of the product, improve the degree of hardening of the SR surface ink residue An object of the present invention is to provide an IR dryer and a PSR process method of a printed circuit board using the same.

An IR dryer according to the present invention for achieving the above object comprises a substrate conveyor for introducing a substrate into an IR dryer and discharging the dried substrate from the IR dryer, a chamber portion for drying the substrate, and the chamber. Drying unit for drying the substrate in the far infrared (IR) in the front and rear of the unit, the vertical operation unit to vertically erect the substrate on the substrate conveyor, or to vertically lay the substrate on the substrate conveyor and the chamber and the vertical operation unit It includes a substrate transfer unit for transferring the substrate between.

In this case, the chamber part may include at least two chambers.

In addition, the drying unit may dry the substrate in a non-contact manner.

The vertical manipulation unit may further include a cooling unit for cooling the substrate before the substrate contacts the substrate conveyor when the vertically placed substrate is laid down on the substrate conveyor.

The substrate transfer part may transfer the substrate by clamping a dummy part of the substrate standing vertically.

On the other hand, in the PSR (Photo Solder Resist) processing method of the printed circuit board according to the present invention for achieving the above object, the step of pre-processing, printing the substrate, exposing the substrate and And drying the substrate using an IR dryer and developing and drying the substrate.

In this case, the IR dryer is a substrate conveyor for injecting a substrate into the IR dryer, and discharges the dried substrate from the IR dryer, a chamber unit for drying the substrate, and the far-infrared (IR) in front of and behind the chamber unit. A drying unit for drying the substrate, a vertical operation unit for vertically standing the substrate on the substrate conveyor, or a substrate operation unit for transferring the substrate between the chamber unit and the vertical operation unit to vertically lay the substrate on the substrate conveyor. It may include drying the substrate.

In this case, the chamber part may include at least two chambers, and the drying part may dry the substrate in a non-contact manner.

The vertical manipulation unit may further include a cooling unit to cool the substrate before the substrate contacts the substrate conveyor when the vertically placed substrate is laid down on the substrate conveyor.

The substrate transfer part may transfer the substrate by clamping a dummy part of the substrate standing vertically.

According to the IR dryer of the present invention and a PSR process method of a printed circuit board using the same,

First, the ink residue defect rate decreases.

Second, the cleaning cycle of the roll developed in the PSR (Photo Solder Resist) process is reduced.

Third, by using an IR dryer after exposure of SR (Solder Resist), the productivity of expensive equipment can be increased more than twice by reducing the exposure amount of the previous process to 50% or less.

Fourth, the time to wait for the substrate to be received and dried, thereby reducing product productivity.

Fifth, there is no manpower consumption, so a large quantity can be produced.

1 shows a flowchart of a conventional PSR process method.
2 illustrates an embodiment of a defective ink residue in a PSR process.
3 shows an embodiment of contamination of a roll by PSR ink.
4 illustrates a flowchart of a PSR process method of thermal drying after exposure.
5 is a flowchart illustrating a PSR process method of a printed circuit board using an IR dryer according to the present invention.
6 shows a plan view of an IR dryer according to the present invention.
Figure 7 shows a side view of an IR dryer according to the present invention.
8 shows the principle of heating of far-infrared (IR).
9 is a table comparing the thermal dryer and the IR dryer according to the present invention.
10 is a view illustrating a moving direction of the substrate according to the vertical manipulation unit of the present invention.
11A shows an embodiment of a PSR surface after PSR exposure and before IR drying in accordance with the present invention.
11B illustrates an embodiment of a PSR surface after IR drying after PSR exposure in accordance with the present invention.
12 illustrates a PSR ink residue defect trend before and after IR drying application after PSR exposure according to the present invention.
FIG. 13 compares the effect on developer roll contamination after PSR exposure according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately The present invention should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

The present invention relates to an IR dryer and a PSR process method of a printed circuit board using the same, wherein the substrate is placed vertically, enters into a chamber, and is irradiated with an infrared dryer (IR) in a non-contact manner. The present invention relates to a PSR process method of a printed circuit board undergoing a drying process.

FIG. 5 is a flowchart illustrating a PSR process method of a printed circuit board using an IR dryer according to the present invention. Referring to FIG. 5, a PSR process method of a printed circuit board using an IR dryer will be described.

UV (ultraviolet) light after drying after removing the solvent from the ink applied to the substrate to remove the adhesive, and pre-processing the substrate, and coating the surface of the substrate after the pre-treatment with S / R ink Irradiate to expose. After the exposure process, the substrate is dried with far infrared rays (IR) using an IR dryer, and after the developing process of removing uncured portions not exposed to UV light with respect to the dried substrate using a developer, the final drying is performed. Process. That is, it is a feature of the present invention to include a process of drying through far-infrared (IR) before the post-exposure developing process in the PSR process.

6 is a plan view of the IR dryer according to the present invention, Figure 7 is a side view of the IR dryer according to the present invention, as shown in Figures 6 and 7 IR dryer 10 according to the present invention is a substrate The conveyor 100, the chamber part 200, the drying part 300, the vertical manipulation part 400, the substrate transfer part 500, and the cooling part 410 may be included. Hereinafter, the IR dryer 10 according to the present invention will be described in detail.

The substrate conveyor 100 discharges the substrate 20 introduced into the IR dryer 10 from the IR dryer 10 using a conveyor. The substrate 20 is dried through the far infrared (IR) in the process of being injected and discharged.

 The substrate 20 is dried in the chamber part 200, and a drying part 300 is provided to dry the substrate 20 in far-infrared rays (IR) at the front and rear of the chamber part 200. However, in this case, the substrate 20 may be dried in a non-contact manner in a vertically erect state, and may be transferred in a non-contact manner in the process of being transported for drying, thereby reducing the defective rate due to contact.

As such, in order to vertically dry the substrate 20 vertically, the vertical manipulation unit 400 vertically aligns the substrate 10 on the substrate conveyor 100 or vertically aligns the substrate 10. Lie down on the substrate conveyor 100. In addition, the substrate transfer part 500 transfers the substrate 20 standing vertically by the vertical operation part 400 between the chamber part 200 and the vertical operation part 400. At this time, the substrate transfer part 500 is a non-contact transfer by transferring the substrate to the chamber part 200 by clamping a dummy part, for example, an edge of the vertically placed substrate 20. And to allow drying.

In addition, as shown in FIG. 7, when the chamber part 200 is located above the substrate conveyor 100, the substrate transfer part 500 transfers the substrate 20 in the vertical upward direction. When the substrate 20 is transferred to the chamber 200, the drying unit 300 may dry the substrate 20 in a non-contact manner using far infrared rays (IR), and may be vertically downward through the substrate transfer unit 500. The substrate 20 is transferred in the direction.

As such, by placing the chamber 200 and the drying unit 300 above the substrate conveyor 100, it is easy to change the structure in the existing IR dryer, using the substrate conveyor 100 from input to discharge as needed It can be used efficiently because it can pass just without the IR drying process.

Meanwhile, the chamber part 200 may include at least two chambers as shown in FIG. 6. While the substrate 20 enters into the first chamber 210 and is dried out, the next substrate 20 enters into the second chamber 220 and is dried, thereby reducing the interval at which one substrate enters and dries out. This has the effect of improving the productivity. The substrate entering the first chamber 210 and the substrate entering the second chamber 220 are illustrated by the arrows of FIG. 6. In addition, although the IR dryer 10 including two chambers is illustrated in FIG. 6, it is a matter of course that the chambers may include several chambers within an appropriate range for improving product productivity.

In addition, the drying unit 300 to dry the substrate 20 using far-infrared (IR). FIG. 8 illustrates a principle of heating of far infrared rays (IR). When the far infrared rays (IR) are radiated onto an object, the molecules of the object collide with their own wavelengths, and the molecules vibrate by the electromagnetic wave energy. These molecular vibrations are converted into thermal energy and heat is generated by the vibrations. Accordingly, when the drying unit 300 emits far infrared rays IR to the substrate 20, the molecular vibration of the substrate 20 is converted into thermal energy and dried.

In addition, Figure 9 is a table comparing the heat dryer and the IR dryer according to the present invention, the heat dryer needs to be moved by the heat dryer in the substrate processing line to dry the separate manual work. In addition, it takes a long time to receive and dry, and the lead time, which is the time until the finished product is long, is long. On the other hand, in the case of the IR dryer, it stays in the chamber part 200 for a while through the vertical operation part 400 and the substrate transfer part 500 on the substrate processing line, which is introduced for the development process, and then goes through only the far infrared (IR) drying and then goes back to the line. As it can go back, the lead time is not only shortened and no manual labor is required, thus eliminating manpower consumption. Thus, by drying the infrared (IR) through the drying unit 300, the lead time is reduced, there is no manpower consumption and efficient production is possible.

In addition, the drying unit 300 preferably controls the drying temperature and time, including a control unit for efficient drying. For example, the influence of the surface temperature is greatly changed according to the thickness of the substrate 20, and the influence of the cooling time or the gloss effect is changed according to the surface temperature of each drying condition.

FIG. 10 is a view illustrating a moving direction of a substrate according to the vertical manipulation unit of the present invention, with reference to FIG. 10.

When the substrate 20 is inserted through the substrate conveyor 100, the substrate 20 is placed horizontally on the substrate conveyor 100. Therefore, when the vertical manipulation unit 400 erects the substrate 20 on the substrate conveyor 100 vertically, the substrate transfer part 500 moves to the chamber part 200. At this time, the vertical operation unit 400 is vertically oriented the substrate 20 is shown by the arrow in FIG.

On the other hand, the substrate 20 dried by the drying unit 300 in the chamber 200 is lowered back to the substrate conveyor 100 by the substrate transfer unit 500. At this time, since the substrate 20 and the substrate conveyor 100 are in a vertical relationship, the substrate 20 is laid horizontally on the substrate conveyor 100 again by the vertical manipulation unit 400. However, at this time, the substrate 20 dried by the drying unit 300 has a very high surface temperature of 140 ° C or higher. In this state, when the substrate conveyor 100 and the substrate 20 are in close contact with each other, a sticky phenomenon occurs in which the surface of the substrate 20 is pressed. Accordingly, the vertical manipulation unit 400 cools the substrate before the substrate 20 touches the substrate conveyor 100 when the substrate 20 vertically lies on the substrate conveyor. 410 may be further included. In this case, the cooling unit 410 is a blowing form in the lower portion of the substrate, that is, the lower portion where the substrate 20 and the substrate conveyor 100 is in contact when the substrate 20 is laid down by 45 ° with respect to the substrate conveyor 100. It is desirable to cool by blowing cold wind.

Since the cooling time in the cooling unit 410 depends on the thickness, surface temperature, etc. of the substrate 20, the cooling unit 410 preferably includes a separate control unit, and generally 16 seconds to 20 seconds. It will cool down.

As described above, according to the present invention, by drying by using infrared rays (IR) after exposure of the SR, it is possible to improve the degree of curing of the surface of the SR to reduce the ink residue defect rate, and to reduce the cleaning cycle of the developing roll during PSR development. There is an effect that can be reduced.

FIG. 11A shows an embodiment of a PSR surface after IR drying after PSR exposure according to the present invention, and FIG. 11B shows an embodiment of a PSR surface after IR drying after PSR exposure according to the present invention, FIGS. 11A and FIG. Comparing the PSR surfaces before and after IR drying, as shown in 11b, it can be seen that ink residue defects are improved when IR drying is performed.

In addition, Figure 12 shows the PSR ink residue defect trend before and after the PSR exposure, before and after the IR drying application, it can be seen that the ink residue defect rate is reduced by 75% by applying IR drying.

In addition, FIG. 13 compares the effect on the application of IR drying after PSR exposure according to the present invention to a degree of contamination of the developer roll. After IR drying, although the roll is contaminated after 2 LOT before IR drying, It can be seen that the roll is not contaminated even after 20 LOT. Thus, if the cleaning cycle of the developing roll was 10 times / day, the cleaning cycle is reduced to 0 times / day after IR drying.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

10 IR Dryer 100 Substrate Conveyor
200 Chamber 210 First Chamber
220 Second Chamber 300 Drying Unit
400 Vertical Control Unit 410 Cooling Unit
500 Board Transfer Unit
20 substrate

Claims (11)

A substrate conveyor for feeding a substrate into an IR dryer and discharging the dried substrate from the IR dryer;
A chamber unit for drying the substrate;
Drying unit for drying the substrate in the far infrared (IR) in front and rear of the chamber portion;
A vertical manipulation unit which vertically stands the substrate on the substrate conveyor or lays the substrate standing vertically on the substrate conveyor; And
And a substrate transfer unit configured to transfer the substrate between the chamber unit and the vertical manipulation unit. The method of claim 1,
The chamber portion
An IR dryer comprising at least two chambers. The method of claim 1,
The drying unit,
An IR dryer for drying the substrate in a non-contact manner. The method of claim 3, wherein
The vertical operation unit,
In the case of laying the substrate upright on the substrate conveyor,
And a cooling unit for cooling the substrate before the substrate contacts the substrate conveyor. The method of claim 3, wherein
The substrate transfer unit,
An IR dryer for transferring the substrate by clamping a dummy portion of the substrate standing vertically. In the PSR (Photo Solder Resist) process method of a printed circuit board,
Pretreating the substrate;
Printing the substrate;
Exposing the substrate;
Drying the substrate using an IR dryer; And
Developing and drying the substrate; PSR process method of a printed circuit board using an IR dryer comprising a. The method according to claim 6,
The IR dryer,
A substrate conveyor for feeding a substrate into an IR dryer and discharging the dried substrate from the IR dryer;
A chamber unit for drying the substrate;
Drying unit for drying the substrate in the far infrared (IR) in front and rear of the chamber portion;
A vertical manipulation unit which vertically stands the substrate on the substrate conveyor or lays the substrate standing vertically on the substrate conveyor; And
And a substrate transfer part for transferring the substrate between the chamber part and the vertical manipulation part. The method of claim 1, wherein the substrate is dried. The method of claim 7, wherein
Wherein the chamber portion includes:
PSR process method of a printed circuit board using an IR dryer, comprising at least two chambers. The method of claim 7, wherein
The drying unit,
PSR process method of a printed circuit board using an IR dryer, the substrate is dried in a non-contact manner. The method of claim 9,
The vertical operation unit,
And a cooling unit, wherein the substrate is cooled before the substrate reaches the substrate conveyor when the substrate is placed vertically on the substrate conveyor. The method of claim 9,
The substrate transfer unit,
A method of PSR processing of a printed circuit board using an IR dryer, for transferring the substrate by clamping a dummy part of the substrate standing vertically.

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