KR102509208B1 - Manufacturing method of Printed circuit board - Google Patents

Abstract

The present invention relates to a method for manufacturing a printed circuit board. The method comprises: a step of providing through holes by stacking a plurality of disks, which are used as materials for printed circuit boards and performing pretreatment such as chamfering and deburring; a step of primarily plating the pretreated substrate with a material that conducts power; a step of installing a photosensitive film on the primarily-plated substrate, exposing the substrate to light, and applying a developer to the substrate to develop the substrate so that the substrate is primarily printed; a step of primarily washing and drying the substrate to remove the residual developer on the primarily printed substrate; a step of secondarily plating the primarily dried and washed substrate with a material that conducts power; a step of installing a secondary photosensitive film on the secondarily plated substrate, exposing the substrate to light, and applying a developer to the substrate to develop the substrate so that the substrate is secondarily printed; a step of secondarily washing and drying the substrate to remove the residual developer on the secondarily printed substrate; a step of printing markings on the secondarily dried and washed substrate and performing surface treatment on the substrate so that the external appearance of the substrate is processed; and a manufacturing completion step of finishing manufacturing by conducting an inspection on the substrate the external appearance of which has been processed. According to the present invention, drying and washing processes are conducted to prevent a developer applied to a substrate from remaining thereof, and thus, the number of defects in printed circuit boards can be minimized.

Description

Manufacturing method of printed circuit board {Manufacturing method of Printed circuit board}

The present invention relates to a method for manufacturing a printed circuit board to improve quality by improving the adhesion of a developing solution.

In general, printed circuit boards are the most basic parts of electrical and electronic products in many fields currently being manufactured, and are widely used in household appliances such as TVs, VTRs, microwave ovens, desk computers, notebook PCs, and portable electronic products such as smartphones. is being applied

In addition, due to the rapid development of the digital method in electrical and electronic devices and the advancement of semiconductor development, miniaturized, high-density and high-function printed circuit boards have become digital satellite products, DVR monitoring devices, palm-top computers, semiconductor modules, digital cameras, and semiconductor inspection devices. The use of printed circuit boards is gradually expanding to devices, automotive electronic parts, as well as missile warheads, fighter jets and satellites, which are state-of-the-art weapons in the defense industry.

On the other hand, recently, due to the miniaturization of smartphones and tablet PCs and the development of Iot (Internet of Things) and wearable electronic devices, circuits on printed circuit boards are miniaturized and integrated, resulting in complex circuits and narrowing of the gap between circuits. Due to this residual, there was a problem that defects caused by stains occurred in later work.

The present invention has been made to solve the above-described problems, and an object of the present invention is to minimize defects of a printed circuit board by performing drying and cleaning to prevent remaining of the developer applied to print on the circuit board. It is to provide a manufacturing method for.

The objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood from the description below.

In order to achieve the above object, a method for manufacturing a printed circuit board according to an embodiment of the present invention includes the steps of performing a pretreatment such as chamfering and deburring while having a through hole by laminating a plurality of discs to be a material of the printed circuit board; firstly performing plating to impart conductivity to the pretreated substrate; Installing a photosensitive film on the primary plated substrate, performing exposure, and then applying a developing solution to perform development to perform primary printing; firstly cleaning and drying to remove residual developer from the printed substrate; secondarily plating the firstly dried and cleaned substrate with a material through which power is applied; Installing a secondly photosensitive film on the secondarily plated substrate, performing exposure, and then applying a developing solution to perform development and secondarily printing; secondarily washing and drying to remove residual developer from the secondly printed substrate; Secondarily printing a marking on the dried and cleaned substrate and processing the outer shape after surface treatment; and a manufacturing completion step of inspecting the substrate having the outer shape processed and completing the manufacturing process.

In addition, in the step of firstly cleaning and drying, the firstly printed substrate is bubble-cleaned in a primary bubble cleaning unit to remove the developing solution, washed with cleaning water in the primary cleaning unit, and the cleaned substrate is washed at 90° C. It can be dried by heating in the primary drying unit for 9 to 11 minutes at ~110 ° C.

In addition, the primary bubble cleaning unit includes a primary bubble tank in the form of a water tank, in which the substrate printed on the substrate is accommodated and bubble-cleaned, and having a primary bubble space in which the substrate is bubble-cleaned while the substrate is installed therein; a primary bubble generator disposed inside the primary bubble tank and installed to generate fine bubbles supplied into the primary bubble space containing the substrate; A primary flotation processing unit disposed above the primary bubble tank and installed so that the fine bubbles generated by the primary bubble generator in the primary bubble space come into contact with the substrate to be adsorbed and floated on impurities, and to remove the floating impurities. ; and a primary substrate transporter installed to move the substrate from one side of the primary bubble tank to the other side after being positioned inside the primary bubble tank.

In addition, the primary cleaning unit is disposed between the primary bubble cleaning unit and the primary drying unit, and has a water tank-type primary cleaning space for cleaning by spraying washing water while the substrate is located therein. water tank; a primary washing water jet disposed inside the primary washing tank and configured to spray washing water while the substrate is located in the primary washing space; and a primary washing transfer member installed to move the substrate from one side of the primary washing tank to the other side after being positioned inside the primary washing tank.

In addition, the primary drying unit includes a primary drying body disposed at a position where the cleaned substrate moves and having a primary drying space so that when the cleaned substrate is supplied therein, drying is performed in a state in which heat is cut off; a primary drying nozzle disposed inside the primary drying body and spraying hot air to dry the cleaned substrate at 90 to 110° C. for 9 to 11 minutes in a state in which the substrate is located in the primary drying space; and a primary drying carrier installed to move the substrate from one side of the primary drying body to the inside and then to the other side of the primary drying body.

In addition, in the step of performing the second cleaning and drying, the secondly printed substrate is subjected to bubble cleaning in the second bubble cleaning unit to remove the developing solution, and the second cleaning unit is cleaned with cleaning water, and the cleaned substrate is 120 It can be dried by heating in the secondary drying unit for 9 to 11 minutes at ~ 140 ° C.

The secondary bubble cleaning unit may include a secondary bubble tank in the form of a water tank, in which the secondly printed substrate is accommodated and arranged to perform bubble cleaning, and has a secondary bubble space in which the substrate is placed so as to be bubble cleaned while the substrate is installed therein; a secondary bubble generator disposed inside the secondary bubble tank and installed to generate fine bubbles supplied into the secondary bubble space containing the substrate; A secondary flotation processing unit disposed above the secondary bubble tank and installed so that the fine bubbles generated by the secondary bubble generator in the secondary bubble space come into contact with the substrate to be adsorbed and floated on impurities, and to remove the floating impurities. ; and a secondary substrate transporter installed to move the substrate from one side of the secondary bubble tank to the other side after being positioned inside the tank.

In addition, the secondary washing unit is disposed between the secondary bubble washing unit and the secondary drying unit, and has a water tank-type secondary cleaning space for cleaning by spraying washing water while the substrate is located therein. water tank; a secondary washing water sprayer disposed inside the secondary washing water tank and configured to spray washing water while the substrate is located in the secondary washing space; and a secondary washing conveyor installed to move the substrate from one side of the secondary washing tub to the other side after being positioned inside the secondary washing tank.

In addition, the secondary drying unit is disposed at a position where the cleaned substrate moves, and has a secondary drying space having a secondary drying space to perform drying in a state in which heat is cut off when the cleaned substrate is supplied therein; a secondary drying nozzle disposed inside the secondary drying body and spraying hot air to dry the cleaned substrate at 120 to 140° C. for 9 to 11 minutes while the substrate is located in the secondary drying space; and a secondary drying transport member installed to move the substrate from one side of the secondary drying body to the inside and then move it to the other side.

Specific details for achieving the above object will become clear with reference to the embodiments described later in detail in conjunction with the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but may be configured in a variety of different forms, and the present embodiments make the disclosure of the present invention complete and allow common knowledge in the art to which the present invention belongs. It is provided to fully inform the possessor of the scope of the invention.

According to one of the above-described problem solving means of the present invention, the effect of minimizing defects of the printed circuit board is provided by performing drying and cleaning to prevent the developer applied to print on the circuit board from remaining.

1 is a process chart showing a method for manufacturing a printed circuit board according to an embodiment of the present invention.
FIG. 2 is a block diagram showing a primary bubble cleaning unit performing primary bubble cleaning in primary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .
FIG. 3 is a block diagram showing a primary cleaning unit performing bubble cleaning as a primary primary cleaning and drying step in the manufacturing method of the printed circuit board of FIG. 1 .
FIG. 4 is a block diagram showing a primary drying unit performing bubble cleaning as a primary step of primary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .
FIG. 5 is a block diagram showing a secondary bubble cleaning unit performing primary bubble cleaning in secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .
FIG. 6 is a block diagram showing a secondary cleaning unit that performs bubble cleaning as a primary step of secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .
FIG. 7 is a block diagram showing a secondary drying unit performing bubble cleaning as a primary step of secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Since the present invention can have various changes and various embodiments, specific embodiments are illustrated in the drawings and will be described in detail through detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, numbers (eg, first, second, etc.) used in the description process of this specification are only identifiers for distinguishing one component from another component.

In addition, in this specification, when one component is referred to as “connected” or “connected” to another component, the one component may be directly connected or directly connected to the other component, but in particular Unless otherwise described, it should be understood that they may be connected or connected via another component in the middle.

The suffixes "module" and "unit" for components used in the following description are given or used together in consideration of ease of writing the specification, and do not have meanings or roles that are distinct from each other by themselves. In addition, in order to clearly explain the present invention, parts irrelevant to the description are omitted from the drawings, and the width, length, thickness, etc. of components in the drawings may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

Hereinafter, specific details for the practice of the present invention will be described with reference to the accompanying drawings.

1 is a process chart showing a method for manufacturing a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 1 , in the method of manufacturing a printed circuit board according to an embodiment of the present invention, in manufacturing a printed circuit board 10 , cleaning and drying are performed to remove the developing solution after printing, resulting in defects caused by the remaining developer solution. can be minimized.

This printed circuit board manufacturing method includes a pretreatment step (S10), a primary plating step (S20), a primary printing step (S30), a primary cleaning and drying step (S40), a secondary plating step (S50), and a secondary printing step (S60). , It includes a secondary drying and cleaning step (S70), an external processing step (S80), and a manufacturing completion step (S90).

The preprocessing step (S10) is a step of performing preprocessing such as chamfering and deburring while a plurality of discs, which are the material of the printed circuit board 10, are stacked and provided with through holes.

In this pre-processing step (S10), the original plate used as the material of the printed circuit board 10 is cut, and the outer edges are chamfered in a state in which a plurality of the cut original plates are stacked, and pins are driven into the plurality of laminated original plates. Stacking is performed, drilling is performed to form through holes, and pretreatment is performed with burrs removed from the machined surface.

The primary plating step (S20) is a step of firstly plating the pretreated substrate 10 with a material through which power is applied.

In this plating step (S20), plating is primarily performed to have conductivity inside the through hole formed of a conductive material so as to impart conductivity to the pretreated substrate 10 .

The primary printing step (S30) is a step of installing a photosensitive film on the primarily plated substrate 10, performing exposure, applying a developing solution, and performing development to perform primary printing.

In the first printing step (S30), a lamination operation is performed in which a photosensitive film is pressure-applied after removing foreign substances on the copper foil on the primarily plated substrate 10, an exposure operation in which a monomer is reacted with a polymer, and a shape liquid is applied. Developing is carried out in the applied state.

The primary cleaning and drying step (S40) is a step of primarily cleaning and drying to remove the developer remaining on the printed substrate 10.

In the primary cleaning and drying step (S40), the printed substrate 10 is primarily bubble-cleaned in the primary bubble cleaning unit 110 to remove the developer, and the primary cleaning unit 120 is cleaned with cleaning water. , The cleaned substrate is heated and dried in the primary drying unit 130 at 90 to 110° C. for 9 to 11 minutes.

FIG. 2 is a block diagram showing a primary bubble cleaning unit performing primary bubble cleaning in primary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 2 , the primary bubble cleaning unit 110 includes a primary bubble tank 111 , a primary bubble generator 113 , a primary wound treatment unit 114 , and a primary substrate transporter 115 .

The primary bubble tank 111 is in the form of a tank having a primary bubble space 112 in which the printed substrate 10 is accommodated and arranged to perform bubble cleaning, and is contained therein to perform bubble cleaning with the substrate 10 installed therein. is provided with

The primary bubble generator 113 is disposed inside the primary bubble tank 111 and is installed to generate fine bubbles supplied into the primary bubble space 112 containing the substrate.

The primary flotation processing unit 114 is disposed above the primary bubble tank 111, and in the primary bubble space 112, the micro bubbles generated by the primary bubble generator 113 come into contact with the substrate and are adsorbed and floated by impurities. and installed to remove floating impurities.

The primary substrate transporter 115 is installed to move the substrate from one side of the primary bubble tank 111 to the inside and then to the other side.

Here, the primary substrate transporter 115 may include all means for supplying and discharging the substrate 10 to and from the primary bubble water tank 111, and detailed description thereof will be omitted.

That is, the primary printed substrate 10 is moved to the primary bubble space 112 in the primary bubble tank 111 by driving the primary substrate transporter 115, and after the movement, in the primary bubble space 112. Fine bubbles generated by the primary bubble generator 113 contact the substrate 10 and float impurities upward.

Bubbles containing impurities are floated to the top, and when located above the primary bubble space 112, the primary floating processing unit 114 collects impurities and supplies the substrate 10 to the primary cleaning unit 120 after cleaning is completed. It is transferred to the substrate transfer body 115.

FIG. 3 is a block diagram showing a primary cleaning unit performing bubble cleaning as a primary primary cleaning and drying step in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 3 , the primary washing unit 120 includes a primary washing tank 121 , a primary washing water jet 123 , and a primary washing conveyor 124 .

The primary washing tank 121 is disposed between the primary bubble washing unit 110 and the primary drying unit 130, and the primary washing space 122 is cleaned by spraying washing water while the substrate 10 is located therein. ) is provided in the form of a water tank with

The primary washing water jet 123 is disposed inside the primary washing water tank 121 and is provided to spray washing water while the substrate is located in the primary washing space 122 .

The primary washing transfer member 124 is installed to move the substrate 10 from one side of the primary washing tank 121 to the other side after being positioned inside.

Here, the primary cleaning transporter 124 may include all means for supplying and discharging substrates to and from the primary cleaning water tank 121, and detailed description thereof will be omitted.

That is, when the primarily bubble-cleaned substrate 10 is moved from the primary cleaning transporter 124 to the inside of the primary cleaning space 122, the primary cleaning water jet 123 sprays cleaning water onto the substrate to perform cleaning, After cleaning, it is transported to the primary drying unit 130 by the primary cleaning transporter 124.

FIG. 4 is a block diagram showing a primary drying unit performing bubble cleaning as a primary step of primary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 4 , the primary drying unit 130 includes a primary drying body 131 , a primary drying nozzle 133 , and a primary drying transport member 134 .

The primary drying body 131 is disposed at a position where the cleaned substrate 10 moves, and has a primary drying space 132 so that drying is performed while blocking heat when the cleaned substrate 10 is supplied therein. .

The primary drying nozzle 133 is disposed inside the primary drying body 131, and is provided to spray hot air to dry the cleaned substrate at 90 to 110 ° C for 9 to 11 minutes in a state in which it is located in the primary drying space 132. do.

Preferably, in the primary washing and drying step (S40), drying is performed while heating at a temperature of 100° C. for about 10 minutes.

The primary drying carrier 134 is installed to move the substrate 10 from one side of the primary drying body 131 to the inside and then move it to the other side.

That is, when the substrate 10 cleaned in the primary cleaning unit 120 is introduced into the primary cleaning space 122 by the operation of the primary drying transport member 134, the primary drying nozzle 133 cools the substrate 9 to 11 at 90 to 110 ° C. Spray hot air to dry for a minute. After drying, it is provided to be transported from the primary drying transporter 134 to the primary plating device.

The second plating step (S50) is a step of secondarily plating the firstly dried and cleaned substrate 10 with a material through which power is applied.

In the secondary plating step (S50), etching is performed by selectively plating a conductive material on the firstly cleaned and dried substrate 10 according to patterns and positions of holes.

The secondary printing step (S60) is a step of installing a secondly photosensitive film on the secondarily plated substrate 10, performing exposure, applying a developing solution, and performing development to perform secondary printing.

In this secondary printing step (S60), secondary printing is performed through exposure and development processes in a state in which ink is applied to the secondary plated substrate.

The secondary drying and cleaning step (S70) is a step of performing secondary cleaning and drying to remove the developer remaining on the secondly printed substrate 10.

In this secondary drying and cleaning step (S70), bubble cleaning is performed in the secondary bubble cleaning unit 140 to remove the developer from the secondary printed substrate 10, and cleaning with cleaning water in the secondary cleaning unit 150 is carried out. , The washed substrate is heated in the secondary drying unit 160 at 120 to 140 ° C. for 9 to 11 minutes and dried.

FIG. 5 is a block diagram showing a secondary bubble cleaning unit performing primary bubble cleaning in secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 5 , the secondary bubble cleaning unit 140 includes a secondary bubble tank 141 , a secondary bubble generator 143 , a secondary wound treatment unit 144 , and a secondary substrate transporter 145 .

The secondary bubble tank 141 is in the form of a water tank having a secondary bubble space 142 in which the printed substrate 10 is accommodated and disposed for bubble cleaning, and the substrate 10 is installed therein to perform bubble cleaning. is provided with

The secondary bubble generator 143 is disposed inside the secondary bubble tank 141 and is installed to generate fine bubbles supplied into the secondary bubble space 142 in which the substrate 10 is contained.

The secondary image processing unit 144 is disposed above the secondary bubble tank 141, and fine bubbles generated from the secondary bubble generator 143 in the secondary bubble space 142 come into contact with the substrate 10 to absorb impurities. It is installed to adsorb, float, and remove floating impurities.

The secondary substrate carrier 145 is installed to move the substrate from one side of the secondary bubble water tank 141 to the inside and then to the other side.

Here, the secondary substrate transporter 145 may include all means for supplying and discharging substrates to and from the secondary bubble tank 141, and detailed description thereof will be omitted.

That is, the secondly printed substrate 10 is moved to the secondary bubble space 142 in the secondary bubble tank 141 by driving the secondary substrate transporter 145, and after the movement, inside the secondary bubble space 142. Fine bubbles generated by the secondary bubble generator 143 contact the substrate 10 to float impurities upward.

Bubbles containing impurities are floated to the top and placed on the upper part of the secondary bubble space 142, the secondary floating processing unit 144 collects impurities and when cleaning is completed, the substrate 10 is supplied to the secondary cleaning unit 150. It is transferred to the substrate transfer body 145.

FIG. 6 is a block diagram showing a secondary cleaning unit that performs bubble cleaning as a primary step of secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 6 , the secondary washing unit 150 includes a secondary washing tank 151 , a secondary washing water jet 153 , and a secondary washing conveyor 154 .

The secondary washing tank 151 is disposed between the secondary bubble washing unit 140 and the secondary drying unit 160, and has a secondary washing space 152 for cleaning by spraying washing water while a substrate is located therein. It is provided in the form of a water tank.

The secondary washing water jet 153 is disposed inside the secondary washing water tank 151 and is provided to spray washing water while the substrate 10 is located in the secondary washing space 152 .

The secondary washing conveyor 154 is installed to move the substrate 10 from one side of the secondary washing tank 151 to the other side after being positioned inside.

Here, the secondary washing transporter 154 may include all means for supplying and discharging substrates to and from the secondary washing tank 151, and detailed description thereof will be omitted.

That is, when the secondarily bubble-cleaned substrate is moved from the secondary cleaning transporter 154 to the inside of the secondary cleaning space 152, the secondary cleaning water sprayer 153 sprays cleaning water to the substrate to perform cleaning, and after cleaning, the secondary cleaning water is sprayed onto the substrate. It is transferred to the secondary drying unit 160 by the washing transfer member 154.

FIG. 7 is a block diagram showing a secondary drying unit performing bubble cleaning as a primary step of secondary cleaning and drying steps in the manufacturing method of the printed circuit board of FIG. 1 .

Referring to FIG. 7 , the secondary drying unit 160 includes a secondary drying body 161, a secondary drying nozzle 163, and a secondary drying conveyor 164.

The secondary drying body 161 is disposed at a position where the cleaned substrate 10 moves, and when the cleaned substrate 10 is supplied to the inside, the secondary drying space 162 is provided to perform drying while blocking heat. ) has

The secondary drying nozzle 163 is disposed inside the secondary drying body 161, and is provided to spray hot air so that the cleaned substrate is dried at 120 to 140 ° C for 9 to 11 minutes in a state in which it is located in the secondary drying space 162. do.

Preferably, in the secondary drying and washing step (S70), drying is performed while heating at 130° C. for about 10 minutes.

The secondary drying carrier 164 is installed to move the substrate 10 from one side of the secondary drying body 161 to the inside and then to the other side.

That is, when the substrate 10 cleaned in the secondary washing unit 150 is introduced into the secondary washing space 152 by the operation of the secondary drying conveyor 164, the secondary drying nozzle 163 cools the substrate 10 at 120 to 140 ° C and 9 to 11 ° C. Spray hot air to dry for a minute. After drying, it is provided to be transferred from the secondary drying transporter 164 to the primary plating device.

The external processing step (S80) is a step of printing a marking on the secondly dried and cleaned substrate 10 and processing the external shape after surface treatment.

In this external processing step (S80), the surface of the secondly cleaned and dried substrate is treated, and post-processing is performed according to the use, size, and shape of the substrate.

The manufacturing completion step (S90) includes a manufacturing completion step of inspecting the substrate 10 having an outer shape processed and completing manufacturing.

In the manufacturing completion step (S90), the substrate 10 whose outer shape has been processed is electrically inspected, visually inspected, and after packaging, manufacturing is completed.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments.

The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

<Description of symbols for main parts of drawings>
10: substrate 110: primary bubble cleaning unit
111: primary bubble tank 112: primary bubble space
113: primary bubble generator 114: primary injury treatment unit
115: primary substrate transporter 120: primary cleaning unit
121: primary washing tank 122: primary washing space
123: primary cleaning water spray body 124: primary cleaning transport body
130: primary drying unit 131: primary drying body
132: primary drying space 133: primary drying nozzle
134: primary dry transfer unit 140: secondary bubble cleaning unit
141: secondary bubble tank 142: secondary bubble space
143: secondary bubble generator 144: secondary injury treatment unit
145: secondary substrate transporter 150: secondary cleaning unit
151: secondary washing tank 152: secondary washing space
153: secondary washing water jet 154: secondary washing transfer body
160: secondary drying unit 161: secondary drying body
162: secondary drying space 163: secondary drying nozzle
164: secondary dry conveyor

Claims (9)

Performing a pretreatment such as chamfering and deburring while a plurality of original plates, which are materials of the printed circuit board, are laminated and provided with through holes;
firstly performing plating to impart conductivity to the pretreated substrate;
Installing a photosensitive film on the primary plated substrate, performing exposure, and then applying a developing solution to perform development to perform primary printing;
firstly cleaning and drying to remove residual developer from the printed substrate;
secondarily plating the firstly dried and cleaned substrate with a material through which power is applied;
Installing a secondly photosensitive film on the secondarily plated substrate, performing exposure, and then applying a developing solution to perform development and secondarily printing;
secondarily washing and drying to remove residual developer from the secondly printed substrate;
Secondarily printing a marking on the dried and cleaned substrate and processing the outer shape after surface treatment; and
Including, a manufacturing completion step of inspecting the board having the outer shape processed and completing manufacturing;
In the first step of washing and drying,
Firstly, bubble cleaning is performed in the primary bubble cleaning unit to remove the developer from the printed substrate, and the primary cleaning unit is cleaned with washing water, and the cleaned substrate is heated at 90~110℃ for 9~11 minutes in the primary drying unit. dry,
The primary bubble cleaning unit,
a primary bubble tank in the form of a water tank, in which the primarily printed substrate is accommodated and arranged to perform bubble cleaning, and has a primary bubble space in which the substrate is placed so as to be bubble cleaned while the substrate is installed therein;
a primary bubble generator disposed inside the primary bubble tank and installed to generate fine bubbles supplied into the primary bubble space containing the substrate;
A primary flotation processing unit disposed above the primary bubble tank and installed so that the fine bubbles generated by the primary bubble generator in the primary bubble space come into contact with the substrate to be adsorbed and floated on impurities, and to remove the floating impurities. ; and
A primary substrate transporter installed to move the substrate from one side of the primary bubble tank to the other side after being positioned inside the tank;
Method for manufacturing a printed circuit board.
delete delete According to claim 1,
The primary tax department,
a primary washing tank disposed between the primary bubble washing unit and the primary drying unit and having a primary washing space in which the substrate is disposed and cleaned by spraying washing water;
a primary washing water jet disposed inside the primary washing tank and configured to spray washing water while the substrate is located in the primary washing space; and
A primary washing transfer member installed to move the substrate from one side of the primary washing tank to the other side after being placed inside the primary washing tank;
Method for manufacturing a printed circuit board.
According to claim 1,
The primary drying unit,
a primary drying body disposed at a position where the cleaned substrate moves, and having a primary drying space to perform drying while blocking heat when the cleaned substrate is supplied therein;
a primary drying nozzle disposed inside the primary drying body and spraying hot air to dry the cleaned substrate at 90 to 110° C. for 9 to 11 minutes in a state in which the substrate is located in the primary drying space; and
A primary drying carrier installed to move the substrate from one side of the primary drying body to the other side after being located inside the primary drying body;
Method for manufacturing a printed circuit board.
According to claim 1,
In the second washing and drying step,
To remove the developer from the secondly printed substrate, bubble cleaning is performed in the secondary bubble cleaning unit, followed by cleaning with washing water in the secondary cleaning unit, and heating the cleaned substrate at 120 to 140 ° C for 9 to 11 minutes in the secondary drying unit. to dry
Method for manufacturing a printed circuit board.
According to claim 6,
The secondary bubble cleaning unit,
a secondary bubble tank in the form of a water tank, in which the secondly printed substrate is accommodated and arranged to perform bubble cleaning, and has a secondary bubble space in which the substrate is placed so as to be bubble cleaned while the substrate is installed therein;
a secondary bubble generator disposed inside the secondary bubble tank and installed to generate fine bubbles supplied into the secondary bubble space containing the substrate;
A secondary flotation processing unit disposed above the secondary bubble tank and installed so that the fine bubbles generated by the secondary bubble generator in the secondary bubble space come into contact with the substrate to be adsorbed and floated on impurities, and to remove the floating impurities. ; and
A secondary substrate transporter installed to move the substrate from one side of the secondary bubble tank to the other side after being positioned inside the tank;
Method for manufacturing a printed circuit board.
According to claim 6,
The secondary tax department,
a secondary washing tank in the form of a water tank disposed between the secondary bubble washing unit and the secondary drying unit and having a secondary washing space for cleaning by spraying washing water while the substrate is located therein;
a secondary washing water sprayer disposed inside the secondary washing water tank and configured to spray washing water while the substrate is located in the secondary washing space; and
A secondary washing transfer member installed to move the substrate from one side of the secondary washing tank to the other side after being positioned inside the tank;
Method for manufacturing a printed circuit board.
According to claim 6,
The secondary drying unit,
a secondary drying body disposed at a position where the cleaned substrate moves, and having a secondary drying space so that drying is performed while blocking heat when the cleaned substrate is supplied therein;
a secondary drying nozzle disposed inside the secondary drying body and spraying hot air to dry the cleaned substrate at 120 to 140° C. for 9 to 11 minutes while the substrate is located in the secondary drying space; and
A secondary drying conveyor installed to move the substrate from one side of the secondary drying body to the other side after being located inside;
Method for manufacturing a printed circuit board.

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