KR20120096391A - Apparatus of determining normal/defective condition of electrode chip - Google Patents

Abstract

PURPOSE: A quality judging apparatus for electrode chips is provided to remove a maintenance work for a light transmitting unit and a light receiving unit of an optical sensor because dust or water drops attached on a front section of an upper electrode chip are not attached to the light transmitting unit and the light receiving unit of upper and lower optical sensors. CONSTITUTION: A quality judging apparatus for electrode chips(M) irradiates the light, emitted from light transmitting units(26,36) of optical sensors(23,33), on a front section(11b). The apparatus judges the quality of the front section of upper and lower electrode chips(11U,11B) with the strength of reflected light receiving from light receiving units(27,37) of the optical sensors. An inspection unit(S) is installed around the upper and lower electrode chips and comprises the light transmitting units and the light receiving units of the optical sensors and a holder(40) for fixing the light transmitting units and the light receiving units of the optical sensors.

Description

Acceptance determination apparatus of electrode chip {APPARATUS OF DETERMINING NORMAL / DEFECTIVE CONDITION OF ELECTRODE CHIP}

This invention irradiates the light from the light-transmitting part of an optical sensor to the front-end surface of an electrode chip with both parts of the front end surface of a pair of electrode chips hold | maintained by a welding gun, and the light receiving part of an optical sensor The present invention relates to a device for determining the quality of an electrode chip to be determined by the strength and weakness of reflected light received by.

Conventionally, a pair of electrode chips held in a welding gun is cut by a chip dresser when the spot welding is performed several times, and the tip end surface is abraded and contaminants such as an oxide film are also attached. However, if contaminants or small irregularities were not removed at that time, welding failure would be caused. Therefore, the quality of the tip surface of the electrode chip was determined by the quality determining device.

In the conventional good and bad judgment device, the light from the light transmitting part of the optical sensor is irradiated to the distal end surface of the electrode chip, and it is judged by the strength of the reflected light received by the light receiving part of the optical sensor (for example, a patent document) 1, 2). In this determination, if the reflected light is weak light and the amount of the reflected light is lower than the predetermined threshold, the result is a defect, the reflected light is the strong light, and if the amount of the reflected light is higher than the predetermined threshold, it is said to be good.

Japanese Patent Laid-Open No. 4-118179 Japanese Patent Laid-Open No. 3-297584

However, in the pass / fail determination device described in Patent Literature 1, a pair of electrode chips are disposed so as to face up and down, and are used between an upper electrode chip and a lower electrode chip in which the light transmitting portion and the light receiving portion of the optical sensor face up and down. It was arrange | positioned just under the front end surface of the upper electrode chip of (circle). Therefore, when dust or water droplets from the upper electrode chip fall and stick to the light-transmitting part or the light-receiving part of the optical sensor, subsequent determination may not be performed, and maintenance such as cleaning the light-transmitting part or the light-receiving part is necessary, There was room for improvement in the point of use for a long time without costing.

In addition, the water droplets were caused to cause cooling water to flow inside the welding gun, and the water vapor in the atmosphere solidified and adhered to the electrode chips.

In addition, in the quality determining device described in Patent Literature 2, the light transmitting portion and the light receiving portion of the optical sensor are disposed far left and right on both sides of the upper electrode chip, and the above problem is unlikely to occur. However, in the quality determining device of Patent Document 2, the light transmitting part and the light receiving part of the optical sensor are mounted on the mounting table while being separated from each other on both sides of the electrode chip. The addition was enlarged. Moreover, only the quality of the lower electrode chip was determined, and the quality of the upper electrode chip was estimated by the quality. Therefore, when the front end surface of an upper electrode chip is bad, there exists a possibility of generating a welding defect after that. Of course, it is also conceivable to determine whether the front end surface of the upper electrode chip is provided by providing an additional optical sensor so that the front end surface of the upper electrode chip can also be determined, but this further increases the size of the inspection unit.

MEANS TO SOLVE THE PROBLEM This invention solves the subject mentioned above, and can provide it without using effort, and also provides the electrode chip | tip determination apparatus of the electrode chip which can be comprised compactly by the light-transmitting part of an optical sensor, and the inspection part which provides a light-receiving part. For the purpose of

<Description of Claim 1>

The quality determining apparatus according to the present invention is formed such that a pair of electrode chips held in the welding gun expands in diameter from the distal end face in contact with the work, from the distal end side,

In the electrode chip goodness-and-determination apparatus which judges by the intensity | strength of the reflected light received by the light-receiving part of the optical sensor, and irradiating the light from the light-transmitting part of an optical sensor to the front-end surface of both parts of an electrode tip,

When the optical sensor is arranged so that the front end faces of the pair of electrode chips face up and down, the upper end optical sensor for determining the quality of the front end face of the upper electrode chip and the lower end chip of the lower electrode chip Two sets of lower side optical sensors for quality judgment are used,

A holder for holding the light emitting portion and the light receiving portion of the upper and lower optical sensors, and the light emitting portion and the light receiving portion of the upper and lower optical sensors, is provided around the upper electrode chip and the lower electrode chip to approach each other at the time of determination. It is set as the structure which installs the inspection part which consists of

The light projecting portion and the light receiving portion of the upper optical sensor do not penetrate into the opposing spaces between the front end faces of the upper electrode chip and the lower electrode chip facing up and down, and the electrodes with respect to the front end surface of the upper electrode chip around the opposing space. It is held in the holder with the arrangement toward the lens portion of the tip symmetrically upwardly and mutually symmetrically with the center line of the chip as the center line,

The light projecting portion and the light receiving portion of the lower optical sensor do not penetrate into the opposing space, and the front end face of the lower electrode chip is obliquely downward in a line symmetry with respect to the distal end surface of the lower electrode chip at the periphery of the opposing space. Is placed in the holder toward the lens portion of the

A through hole is provided so that the holder may have at least an opposing space, and the light-transmitting part and the light-receiving part of the upper and lower optical sensors are held at a portion surrounding the periphery of the through hole. .

In the pass / fail determination device according to the present invention, when the top electrode chip and the bottom electrode chip at the time of pass / fail determination are approached and face each other up and down, the top and bottom optical sensors respectively correspond to a front end surface from the light transmitting portion. The light is irradiated onto the light and the light reflected by the light receiving portion is received. And if the intensity | strength of such reflected light is higher than a predetermined threshold, it is determined as good, and when it is low, it is determined as bad.

Each of the upper and lower optical sensors is held in the holder around the opposing space without intruding the light transmitting portion and the light receiving portion of the inspection portion into the opposing space, respectively. In addition, the holder is also provided with a through hole so as to have opposing spaces between at least the front end faces facing up and down, and to hold the light-transmitting portion and the light-receiving portion of the upper and lower optical sensors at a portion surrounding the periphery of the through hole. I make it a constitution.

Therefore, even if dust or water droplets adhering to the tip end side of the upper electrode chip fall, such dust and water droplets fall from the portion of the tip end surface having the enlarged diameter portion and pass through the through hole. As a result, such dust and water droplets are less likely to adhere to the light transmitting portion and the light receiving portion of the upper and lower optical sensors, so that maintenance such as cleaning the light and the light receiving portions of the upper and lower optical sensors is unnecessary. It is possible to use a pass / fail determination device over a long period of time without incurring trouble.

In addition, the light transmitting portion and the light receiving portion of the upper and lower optical sensors are held around the opposing spaces between the front end faces of the upper and lower electrode chips facing up and down, that is, around the through holes of the holder. have. In other words, the light-transmitting portion and the light-receiving portion of the upper and lower optical sensors are held in one annular holder so that the holding portions can be shared, so that the inspection portion can be simply and compactly constructed. Further, when the inner peripheral surface of the through hole is disposed with the inner peripheral surface of the through hole exposed, the holder itself can be further compacted if the inner peripheral surface of the through hole is arranged to approach the facing space without penetrating into the extreme force and the facing space. The inspection section can be arranged compactly around the front end surfaces of the electrode chips facing up and down.

Therefore, in the positive / non-defective determination device of the electrode chip according to the present invention, it can be used without any effort, and the inspection portion for providing the light transmitting portion and the light receiving portion of the optical sensor can be compactly configured.

<Explanation of claim 2>

In addition, the light-transmitting portion and the light-receiving portion of the upper and lower optical sensors are disposed so as to overlap in the up-down direction while arranging the light-transmitting portion and the light-receiving portion of the upper optical sensor below the light-transmitting portion and the light-receiving portion of the lower optical sensor. It is preferable to keep at.

In such a configuration, first, the light transmitting portion of the upper optical sensor, the light receiving portion of the upper optical sensor and the light receiving portion of the lower optical sensor are disposed so as to overlap each other up and down, so that the upper side and the lower side are used in the horizontal direction perpendicular to the overlapping surface. The light transmitting portion and the light receiving portion of the optical sensor are not arranged, and the depth of the dimension of the holder of the portion can be made small and compact.

In this configuration, the light transmitting portion and the light receiving portion of the upper optical sensor are disposed below the light transmitting portion and the light receiving portion of the lower optical sensor. The light projection part of the light sensor and the light receiving part are in a state of crossing each other when viewed in a horizontal direction orthogonal to the surfaces of the light projection part of the upper optical sensor, the light projection part of the light reception part and the lower light sensor, and the surfaces overlapping the top and bottom of the light reception part. In other words, in the case of reversing the above and the above, in other words, in the above-described configuration, the cross section of the light beam is cross-linked in comparison with the case in which the light transmitting portion and the light receiving portion of the upper optical sensor are disposed above the light transmitting portion and the light receiving portion of the lower optical sensor. By this, the thickness of the holder in the vertical direction can be reduced, and the dimensions of the holder in the vertical direction can be made compact.

Therefore, in the said structure, the thickness dimension of the up-down direction of a holder, and the depth dimension of the holder orthogonal to the mutually overlapping direction of a sensor can be made small, and a test | inspection part can be comprised compactly.

<Explanation of claim 3>

Further, each lens portion at each tip of the light transmitting portion and the light receiving portion of the upper optical sensor, and the light transmitting portion and the light receiving portion of the lower optical sensor, is located at the periphery of the opposing space and from the front end surface of the opposing electrode chips. It is preferable to arrange | position so that it may invade into space between mutually expanding diameter parts which expand diameter over the side.

In such a configuration, the light transmitting portion and the light receiving portion of the upper optical sensor and the lower optical sensor can be provided in a compact manner without distant from the radial direction around the axis of the pair of electrode chips.

<Explanation of claim 4>

Further, the holder is provided with respective enlarged diameter portions of the upper electrode chip and the lower electrode chip so that the respective enlarged diameter portions can be received when the front end surfaces of the upper electrode chip and the lower electrode chip approach each other at the time of determining the tip surface of the upper electrode chip and the lower electrode chip. It is preferable to make the support seat which made the corresponding recessed shape, and to provide a through-hole in the center of a support seat.

In such a configuration, when the top electrode chip and the bottom electrode chip are brought close to each other and the holder reaches each of the enlarged diameter portions at the corresponding support seat, the front end surface of the top electrode chip and the bottom electrode chip is formed in the through hole. It is arrange | positioned stably in the upper and lower opening vicinity. That is, the arrangement position of each tip surface of the upper and lower electrode chips of the upper and lower light sensors of the upper and lower light sensors can be stabilized for each judgment, and as a result, the accuracy of the good judgment can be improved.

<Explanation of claim 5>

In addition, when determining the quality of the front end face of the upper electrode chip and the lower electrode chip by touching the support seat of the holder, the light transmitting part and the light receiving part of the upper side optical sensor have the center of the front end face of the upper electrode chip at the time of the quality judgment. It is provided so as to cross each other at right angles to each other, and the light transmitting portion and the light receiving portion of the lower optical sensor are positioned at the centers of the front end faces of the lower electrode chips at the time of quality determination. It is preferable to install so as to cross each other at right angles.

In such a configuration, the centers of the front end faces of the electrode chips to be determined as the respective intersections, and the axis of the light transmitting part and the light receiving part of the upper optical sensor or the lower optical sensor intersect at an inclination of 45 ° with respect to the axis of the electrode chip. It becomes a state. Therefore, the transmissive part and the light receiving part of the upper optical sensor and the lower optical sensor have the same length dimension in the direction orthogonal to the axis center of the electrode chip and the height dimension in the direction along the axis center of the electrode chip, respectively. can do. That is, with respect to the arrangement space of the light transmitting part and the light receiving part of the upper optical sensor or the lower optical sensor, the radial length dimension centering on the axis of the electrode chip and the height dimension along the axis of the electrode chip are equalized to each other. It becomes possible to make all small. As a result, the holder holding the light-transmitting part and the light-receiving part of the upper optical sensor or the lower optical sensor has a height dimension (thickness dimension) and an outer diameter dimension (a radial dimension from the axis of the electrode chip, in other words, a width dimension). It is possible to make the compact.

<Explanation of claim 6>

In addition, it is preferable that the light-transmitting part and the light-receiving part of the upper and lower optical sensors are each made of glass. That is, the lens portion at the tip of the light transmitting portion and the light receiving portion may be made of synthetic resin such as polycarbonate, but if made of glass such as boron silica glass, it is excellent in oil resistance and also damaged during cleaning to wipe off contaminants. Since it is hard to occur, the durability of the upper and lower optical sensors can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic plan view which shows the welding spot which arrange | positioned the pass / fail determination apparatus of one Embodiment of this invention.
2 is a schematic side view illustrating the vicinity of an inspection unit in the pass / fail determination device of the embodiment.
3 is a schematic plan view of the vicinity of an inspection unit in the pass / fail determination device of the embodiment.
4 is a perspective view of the inspection portion of the embodiment.
5 is a plan view of the inspection section of the embodiment.
FIG. 6 is a cross-sectional view of the inspection section of the embodiment, corresponding to a VI-VI site in FIG. 5. FIG.
7 is a plan view of the holder alone in the embodiment.
8 is a cross-sectional view of the holder alone of the embodiment, and corresponds to the VIII-VIII site in FIG. 7.

EMBODIMENT OF THE INVENTION Hereinafter, if one Embodiment of this invention is described based on drawing, as shown in FIG. 1, the acceptance determination apparatus M spot-welds the workpiece | work W1, W2 which is sequentially sent, as shown in FIG. It is arrange | positioned in the vicinity of the welding robot 1 of a joint, and is provided so that the quality of the front end surface after cutting of the worn electrode chip may be determined. And in the case of embodiment, the quality determining apparatus M is equipped with the inspection part S provided in the chip dresser 18 which cuts an electrode chip, and the control apparatus 3 which controls the operation of the welding robot 1. It is comprised including the determination part J provided.

In addition, as shown in FIGS. 1 and 2, the tip of the arm 2 of the welding robot 1 is mounted with a servo gun 5 as a welding gun, and the servo gun 5 includes a pair of electrode chips ( 11) 11U and 11B are inserted into shanks 7 and 8 facing each other. The servo gun 5 is a general-purpose one, and the shanks 7 and 8 holding the pair of electrode chips 11 are connected to the shanks 7 and 8 by the servomotor 6 at the time of welding or the like. It can be moved along the opposite direction of. The movement of the electrode chip 11 operates not only the servomotor 6 but also the servomotor (not shown) which moves the arm 2, and moves the shanks 7 and 8, respectively. In addition, the servo gun 5 has an encoder built in the servomotor 6 or a servomotor not shown, and can detect the arrangement positions of the shanks 7, 8 and the electrode chips 11, and Position control of the chip | tip 11, pressure control, etc. can be performed.

In addition, in the movement area of the welding robot 1, the figure which separates the electrode chip 11 which was used at the time of the exchange of the electrode chip 11 besides the quality determination apparatus M from each shank 7 and 8 is shown. A chip supply device (not shown) for attaching the omitted chip removing device, a new electrode chip 11 to each shank 7 and 8, and cutting the electrode chip 11 at the time of worn out or dirty consumption before replacement. The chip dresser 18 is provided.

Moreover, as shown in FIG. 1, the control apparatus 3 is provided in the vicinity of the movement area of the welding robot 1, This control apparatus 3 adjusts the electric current which flows to the electrode chip 11 Welding control for adjusting a cycle for causing a current to flow, or operation control of a welding robot 1, a servo gun 5, a chip dresser 18, and a chip removing device not shown, In the case of embodiment, as already mentioned, the determination part J of the quality determination apparatus M is also comprised.

In addition, the chip dresser 18 accommodates the cutter 20 which rotates by the operation of the servomotor 21 in the housing 19, and the electrode chip in a welding operation | work as shown in FIGS. It is set so that the front-end | tip 11a of the spent electrode tip 11 (11U, 11B) in the state before exchange of (11) can be cut | disconnected. When the chip dresser 18 is used, in the state where each electrode chip 11 is attached to each tip of the shanks 7 and 8, the chip dresser 18 is pressed from the top and the bottom of the chip dresser 18 to the top and bottom of the cutter 20, and the servo is turned on. Cutting is performed by the rotation of the cutter 20 by the operation of the motor 21.

In the case of the embodiment, as shown in FIG. 6, when the electrode chip 11 is cut appropriately by cutting by the rotation of the cutter 20 with the diameter D0 as 16 mm, the tip 11a. As a shape of, a circular substantially flat surface having a diameter D1 of 6 mm is formed on the front end surface 11b, and the radius R is extended from the front end surface 11b to the cylindrical portion 11d side. ) Is set so that the enlarged diameter part 11c which enlarges diameter in the curved shape which made 8 mm) is formed. In addition, in the electrode chip 11 at the time of abrasion, the enlarged diameter part 11c shortens the length along the axial direction of the electrode chip 11, and the front end surface 11b becomes large. And when it is cut by the rotating cutter 20, the electrode tip 11 will form the enlarged diameter part 11c and the front end surface 11b in the front end 11a as shown in FIG.

1 and 2, the housing 19 of the chip dresser 18 holds the inspection portion S by the mounting plate 65, and the support plate 14 fixed and installed in the vertical direction. It is supported by the spring 17 etc. so that up-and-down movement is possible. The support plate 14 is separated by a predetermined distance up and down, and the support brackets 15 and 15 are provided in two rows, and the support rods 16 are connected to the pair of support brackets 15 and 15 so as to connect with each other. It is installed in the up and down direction, and two springs (compression coil springs) 17 are provided on each support rod 16, and a bracket 19a of the housing 19 is provided between the two upper and lower springs 17, 17. ) Is installed. Therefore, the chip dresser 18 is supported by the springs 17 and 17 together with the test | inspection part S, and is provided so that it may move up and down so that restoration may be possible.

1, 3, and 6, the upper and upper part at the time of making the paired electrode chips 11 and 11 approach and arrange | position so that the front end surface 11b of each other may face up and down, as shown in FIG. The upper optical sensor 23 for determining the quality of the front end surface 11b of the electrode chip 11U, and the lower optical sensor 33 for determining the quality of the front end surface 11b of the lower lower electrode chip 11B. Are configured to be used. As described above, the quality determining device M is configured to include the inspection unit S provided in the chip dresser 18 and the determination unit J provided in the control device 3.

The inspection part S uses the mounting plate 65 to install around the upper electrode chip 11U and the lower electrode chip 11B, which are brought closer to each other at the time of the determination of the quality of the housing of the chip dresser 18. It is attached and fixed to 19. And the inspection part S, as shown to FIG. 3-6, the light transmission part 26 and 36 and the light receiving part 27 and 37 of the upper side optical sensor 23 and the lower side optical sensor 33, The holder 40 which hold | maintains the light part 26 and 36 and the light receiving part 27 and 37 is comprised. In addition, the inspection unit S is a cover 50 covering the front side from both left and right edges of the holder 40, a neck 52 connected to the rear of the holder 40 to hold the holder 40, The body 54 which is connected to the back of the neck 52 and hold | maintains the neck 52, and the mounting plate 65 which mounts and fixes the body 54 to the housing 19 are comprised. The holder 40, the cover 50, the neck 52, the body 54, and the mounting plate 65 are connected to each other by screw fixing means. In the case of the embodiment, the mounting plate 65 is formed integrally with the housing 19.

In the case of the embodiment, the upper optical sensor 23 and the lower optical sensor 33 are each configured by using an optical fiber sensor using LED as a light source, and the determination unit J includes an LED and an amplifier. Furthermore, further, a comparison circuit for comparing whether the received light amount is higher or lower than a predetermined threshold value and an output circuit for displaying the comparison result are provided. In embodiment, what emits infrared rays is used as LED. In addition, as shown in FIG. 1, the output circuit is comprised so that the determination display part 72 may display both parts. The determination display unit 72 has an OK lamp 72a that lights up when the front end surface 11b of the upper electrode chip 11U is suitable for welding (when the amount of light received by the light receiving unit 27 is higher than a predetermined threshold value). ), The NG lamp 72b which lights up when the amount of light received by the light receiving portion 27 is lower than a predetermined threshold value and the front end surface 11b of the lower electrode chip 11B are suitable for welding (in the light receiving portion 37). OK lamp 72c, which illuminates when the amount of light received is higher than the predetermined threshold value; and NG lamp 72d, which illuminates when the amount of light received by the light receiving portion 37 is lower than the predetermined threshold value are provided. have.

In addition, in embodiment, even if it determines with the defect in the quality determination, the control apparatus 3 inputs the signal of the defect from the output circuit of the determination part J, and at least 1 time is an electrode to the chip dresser 18. When the chip 11 is cut again, it is determined again whether it is good or bad, and when it is determined that it is defective again, the servo gun 5 is moved to a chip removing device or a chip supply device (not shown), whereby the upper electrode chip Both 11U and the lower electrode chip 11B are replaced, and it is comprised so that it may move to the next welding operation.

In addition, the amplifier section of the judging section J prevents mutual interference between the two light transmitting sections 26 and 33 and the light receiving sections 27 and 37, that is, the upper optical sensor 23 and the lower optical sensor 33. In order to prevent a malfunction, the light emission periods of the upper optical sensor 23 and the lower optical sensor 33 are staggered from each other.

In addition, in the case of embodiment, during the operation of the welding robot 1, the upper side optical sensor 23 and the lower side optical sensor 33 irradiate light from the light transmission parts 26 and 33 all the time, The light receiving sections 27 and 37 are set to receive light. Of course, you may comprise so that light may be irradiated from the light transmissive parts 26 and 33 for every quality determination after cutting by the chip dresser 18 differently from embodiment.

In addition, the structure of the upper optical sensor 23 and the lower optical sensor 33 in this determination part J is well-known including an amplifier part etc., and abbreviate | omits their description, and features of this application The arrangement structure of the light transmitting units 26 and 33 and the light receiving units 27 and 37 in the phosphorus inspection unit S will be described in detail (see FIGS. 4 to 8).

First, as shown in Figs. 6-8, the light transmitting portion 26 and the light receiving portion 27 of the upper side optical sensor 23 are placed on the upper and lower sides of the upper electrode chip 11U and the lower electrode chip 11B at the time of the quality determination. Diagonally upward with respect to the tip end surface 11b of the upper electrode chip 11U around the opposing space H0 without intruding into the opposing space H0 opposed to each other. It is arrange | positioned so that it may face, and is accommodated in the mounting holes 45 and 46 of the holder 40. As shown in FIG. In the case of the embodiment, the light transmitting part 26 and the light receiving part 27 have a substantially cylindrical shape, so that the light emitted from the light transmitting part 26 is reflected at the tip end face 11b so that the light receiving part 27 can receive the light. The lens portions 26a and 27a are directed toward the center 11bu of the front end surface 11b of the upper electrode chip 11U. In detail, the light transmitting part 26 and the light receiving part 27 have the centers U1 and U2 of each other as the intersection of the center 11bu, and the upper electrode chip 11U and the lower electrode chip ( It is provided so that it may become line symmetry, centering on the axis center X of 11B). In the case of the embodiment, the light transmitting portion 26 and the light receiving portion 27 are provided so as to cross the axis centers U1 and U2 at right angles to each other.

In addition, the opposing space H0 is a space between the top electrode chips 11U and 11B, 11b facing up and down of the lower electrode chips 11B, which are approached at the time of the quality judgment, and are the front end surfaces 11b. It is a cylindrical space up to the shoulder 11be of the outer periphery which becomes the boundary with the enlarged diameter part 11c in the inside.

In addition, as shown in FIGS. 6 to 8, the light projecting portion 36 and the light receiving portion 37 of the lower optical sensor 33 do not penetrate into the opposing space H0, but around the opposing space H0. It is arrange | positioned so that it may face obliquely downward with respect to the front end surface 11b of the lower electrode chip 11B, and is accommodated and hold | maintained in the mounting holes 47 and 48 of the holder 40. FIG. In the case of the embodiment, the light transmitting portion 36 and the light receiving portion 37 have a substantially cylindrical shape, so that the light emitted from the light transmitting portion 36 is reflected at the front end surface 11b so that the light receiving portion 37 can receive the light. The lens sections 36a and 37a face the center 11bb of the front end surface 11b of the lower electrode chip 11B. In detail, the light transmitting portion 36 and the light receiving portion 37 each have their centers B1 and B2 with the center 11 bb as the intersection with each other, and the upper electrode chip 11U and the lower electrode chip ( It is provided so that it may become line symmetry, centering on the axis center X of 11B). In the case of the embodiment, the light transmitting portion 36 and the light receiving portion 37 are provided so as to cross the axis centers B1 and B2 at right angles.

In addition, the lens part 26a, 27a, 36a, 37a of embodiment is comprised by the ball lens made from glass, such as boron silica glass.

The holder 40 is provided with a through hole 41 opened in a circular shape so as to have at least the opposing space H0, and also surrounds the periphery of the through hole 41 (circumferential wall portion). 42, the light transmitting portions 26 and 36 and the light receiving portions 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 are connected to the mounting holes 45, 46, 47 and 48. It is set as the structure to hold and use.

In the case of the embodiment, the mounting holes 45 and 46 are located below the mounting holes 47 and 48 in the longitudinal cross section passing through the center O of the through hole 41 along the left and right directions of the holder 40. It is arrange | positioned so that it may overlap up and down. That is, the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 are formed by the light transmitting part 26 and the light receiving part of the upper optical sensor 23. 27 is disposed below the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33 so as to overlap in the vertical direction (to overlap in a plan view), and is held in the holder 40. .

In addition, the holder 40 has each enlarged diameter portion (11B) and 11b, 11b at the time of determining whether the tip surface 11b of the upper electrode chip 11U and the lower electrode chip 11B are judged to pass. In order to receive 11c, 11c, the recessed support 43 and 44 which corresponded to each diameter part 11c, 11c of the upper electrode chip 11U and the lower electrode chip 11B are provided, The through hole 41 is provided in the center of the supporting seats 43 and 44.

)보다 큰 8

로 하고, 관통구멍(41)의 길이 치수(L)를 약 11㎜로 하고 있다. 또한, 실시형태의 경우, 받침 자리(43, 44)에서 받아들인 상부 전극 칩(11U)과 하부 전극 칩(11B)의 선단면(11b) 서로의 이격거리(SL)를, 길이 치수(L)보다 작은 약 10㎜(상세하게는 9.89㎜)로 하고 있다. 바꾸어 말하면, 양부 판정시에, 상부 전극 칩(11U)과 하부 전극 칩(11B)의 선단면(11b) 서로가, 확실하게, 관통구멍(41) 내에 침입하여, 대향하도록, 받침 자리(43, 44)의 중앙의 관통구멍(41)의 내경(d)을, 선단면(11b)의 직경(D1)보다 크게 하고 있고, 그 결과, 받침 자리(43, 44)에서 받아들인 상부 전극 칩(11U)과 하부 전극 칩(11B)의 선단면(11b) 서로의 이격거리(SL)가, 길이 치수(L)보다 작은 치수가 된다. In the case of the embodiment, the through-hole 41 has the inner diameter d as shown in FIG. 7, 8, and diameter D1 (6) of the front end surface 11b.

Greater than 8)

The length dimension L of the through hole 41 is set to about 11 mm. In the case of the embodiment, the distance SL between the upper electrode chip 11U and the front end surface 11b of the lower electrode chip 11B received at the support seats 43 and 44 is the length dimension L. It is set to smaller 10 mm (more specifically, 9.89 mm). In other words, at the time of pass / failure determination, the support seat 43 is formed such that the front end surface 11b of the upper electrode chip 11U and the lower electrode chip 11B reliably penetrate into the through-hole 41 and face each other. The inner diameter d of the through hole 41 in the center of 44 is made larger than the diameter D1 of the front end surface 11b, and as a result, the upper electrode chip 11U received at the support seats 43 and 44 is formed. ) And the separation distance SL between the front end surface 11b of the lower electrode chip 11B become smaller than the length dimension L. FIG.

The cover 50 provided in the test | inspection part S hides the optical fiber 25, 28, 35, 38 extended from the light transmission part 26, 36 or the light receiving part 27, 37, and is attached to the holder 40. As shown in FIG. .

And the optical fiber 25, 28, 35, 38 passes through the insertion hole 52 of the neck 52 and the body 54, is covered by the flexible tubes 62 and 63, and the determination part J Extends to).

Moreover, the inspection part S arrange | positions the nipple 60 which can use factory air in the rear end surface of the body 54, and also the air hole 58 extended from the nipple 60 to the through-hole 41. It penetrates and is comprised so that the dust in the through-hole 41 may be removed suitably using factory air.

Referring to the use state of the quality determining device M of the embodiment, first, when the welding robot 1 performs spot welding a predetermined number of times, the control device 3 moves the servo gun 5 to move the upper electrode. The chip 11U and the lower electrode chip 11B are cut using the chip dresser 18. Then, the control device 3 operates the predetermined servomotor 6 or a servomotor not shown in the drawing while moving the servo gun 5 so as to determine whether the front end surface 11b is cut after the upper electrode. The chip 11U and the lower electrode chip 11B face each other up and down, and while the shaft center X of the electrode chip 11 coincides with the center O of the through hole 41, the chip 11U is brought close to each other. Each enlarged-diameter part 11c is made to contact the up-and-down support seats 43 and 44 of the holder 40 in the inspection part S of the acceptance determination apparatus M. As shown in FIG.

At this time, in the pass / fail determination device M, the upper optical sensor 23 and the lower optical sensor 33 irradiate light to the corresponding front end surfaces 11b and 11b from the light transmitting units 26 and 36, respectively. Then, the light reflected by the light receiving parts 27 and 37 is received. And when the intensity | strength of such reflected light is higher than a predetermined threshold, it is determined by the determination part J as good, and when it is low, it is determined as bad. Specifically, when the front end surface 11b of the upper electrode chip 11U or the lower electrode chip 11B is suitable for welding, since the amount of light received by the light receiving portions 27 and 37 is higher than a predetermined threshold, When the OK lamps 72a and 72c light up, and conversely, when the amount of light received by the light receiving units 27 and 37 is lower than the predetermined threshold value, the NG lamps 72b and 72d light up.

In addition, in the case of embodiment, light is always irradiated from the light transmission parts 26 and 36, and normally, NG lamp 72b, 72d is already lighted, and the servo gun 5 is an upper part. Between a predetermined time (about 0.3 to 0.5 seconds) when the enlarged portion 11c of the electrode chip 11U and the lower electrode chip 11B is pressed against the support seats 43 and 44 of the holder 40. If the front end surface 11b is satisfactory, the OK lamps 72a and 72c light up.

And if the front end surface 11b of the upper electrode chip 11U and the lower electrode chip 11B is suitable for welding, the control apparatus 3 will operate the welding robot 1 to perform the next welding operation, If at least one of the upper electrode chip 11U and the lower electrode chip 11B is determined to be defective, the control device 3 inputs a signal of failure from the output circuit of the determining unit J, at least once. Cuts the upper electrode chip 11U and the lower electrode chip 11B with the chip dresser 18 again, and determines whether or not it is good again. If it is determined to be defective, the servo gun 5 is moved to a chip removing device or a chip supply device (not shown), and both the upper electrode chip 11U and the lower electrode chip 11B are replaced, and the process proceeds to the next welding operation. do.

And in the inspection part S of the quality determining apparatus M of embodiment, as shown in FIG. 6, the light transmission parts 26 and 36 and the light receiving part of the upper side optical sensor 23 and the lower side optical sensor 33 are shown. (27, 37) is held by the holder 40 in the periphery of the opposing space H0, without invading into the opposing space H0. In addition, the holder 40 is also provided with a through hole 41 so as to have opposing spaces H0 between the front end surfaces 11b and 11b facing at least up and down, and a peripheral wall surrounding the periphery of the through hole 41. In the section 42, the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the upper optical sensor 23, the lower optical sensor 33 are held.

Therefore, even when the dust and water droplets DW (see FIG. 6) adhered to the tip 11a side of the upper electrode chip 11U fall, the dust and water droplets DW ride on the enlarged diameter portion 11c. It falls from the site | part of the tip surface 11b which has a thin tip, and passes through the through-hole 41. As shown in FIG. As a result, such dust and water droplets (DW) are less likely to adhere to the light transmitting portions 26 and 36 and the light receiving portions 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33. Maintenance such as cleaning of the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the optical sensor 23 and the lower optical sensor 33 is not necessary, and it is necessary to determine the quality of the product over a long period of time without any trouble. It is possible to use the device M.

In addition, the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 are faced with the upper electrode chip 11U and the lower electrode chip 11B facing up and down. ) Are held in the circumferential wall portion 42 around the opposing space H0 between the front end faces 11b and 11b of each other, that is, around the through hole 41 of the holder 40. In other words, the light transmitting portions 26 and 36 and the light receiving portions 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 are held in one annular holder 40 to hold the holding portion. Since it can be shared, the inspection part S can comprise the structure simple and compact. In addition, when the lens sections 26a, 27a, 36a, 37a at the tip are exposed and disposed on the inner circumferential surface 42a of the through hole 41, the inner circumferential surface 42a of the through hole 41 has a maximum force and an opposing space. When the arrangement is made to approach the opposing space H0 in a state of not penetrating into H0, the holder 40 itself can be compactly configured, and the inspection unit S faces the electrode chip facing up and down. The front end faces 11b and 11b of (11, 11) can be arranged compactly around each other.

In particular, in the case of the embodiment, the tip of the light transmitting parts 26 and 36 and the light receiving parts 27 and 37, that is, the electrode chips 11 and 11 that the lens parts 26a, 27a, 36a, 37a face up and down. Space (H1) of the enlarged diameter portions (11c, 11c) of the electrode chips (11, 11) facing up and down without accessing the pole force and the opposing space (H0) without being located outward from the outer portion (11d) of It is arrange | positioned so that it may invade). In addition, this space H1 is a cylindrical space surrounding the periphery of cylindrical opposing space H0.

Therefore, the inspection part S which provides the light-transmitting parts 26 and 36 and the light-receiving parts 27 and 37 of an optical sensor while being able to use it without effort in the positive / non-decision apparatus M of the electrode chip of embodiment. Can be configured compactly.

Moreover, in embodiment, the light projection part 26 and 36 and the light reception part 27 and 37 of the upper side optical sensor 23 and the lower side optical sensor 33 are the projection part 26 of the upper side optical sensor 23. ), The light receiving portion 27 is disposed below the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33 so as to overlap in the vertical direction, and is held in the holder 40.

In such a configuration, first, the light transmitting portion 26, the light receiving portion 27 of the upper optical sensor 23, and the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33 overlap each other vertically. Since it is arranged, in the horizontal direction orthogonal to the overlapping surface (in the embodiment, it becomes a longitudinal cross section along the left and right directions), the light transmitting portions 26 and 36 and the light receiving portion of the upper optical sensor 23 and the lower optical sensor 33 are arranged. (27, 37) is not arrange | positioned, and the depth dimension BL (it becomes a dimension of the front-back direction in embodiment. FIG. 7) of the holder 40 of the part can be made compact and compact.

In this configuration, the light transmitting portion 26 and the light receiving portion 27 of the upper optical sensor 23 are disposed below the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33. Therefore, as shown in FIG. 6, it irradiates from the light transmission part 26 of the upper side optical sensor 23, reflects in the front end surface 11b of the upper electrode chip 11U, and receives light in the light reception part 27 Irradiated from the stem (optical) BLU of the light to be emitted and the light-transmitting portion 36 of the lower optical sensor 33 and reflected from the front end surface 11b of the lower electrode chip 11B, and then the light-receiving portion 37 The stem (light) BLB of the light received by the light emitter is a light emitter 26 of the upper optical sensor 23, a light receiver 36 of the light receiver 27 and a lower light sensor 33, and a light receiver 37. In the horizontal direction orthogonal to the surface overlapping the upper and lower sides of the cross-sectional view), crosses each other in the vicinity of the lens sections 26a and 36a and the vicinity of the lens sections 27a and 37a. That is, in the case where the above and the upside down are reversed, in other words, the light transmitting portion 26 and the light receiving portion 27 of the upper optical sensor 23 are connected to the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33. In the above structure, the thickness dimension T in the vertical direction of the holder 40 holding the light-transmitting part and the light-receiving part is determined by the above-described configuration CL crossing the light spots BLU and BLB. It can be made as small as possible, and the dimension of the up-down direction of the holder 40 can be made compact.

Therefore, in embodiment, the thickness dimension T of the up-down direction of the holder 40, and the depth dimension BL of the holder 40 orthogonal to the mutually overlapping surface of a sensor can be made small, and the inspection part S Can be configured more compactly.

Moreover, in embodiment, each of the front end of the light projection part 26 and the light receiving part 27 of the upper side optical sensor 23, and the light projection part 36 and the light receiving part 37 of the lower side optical sensor 33 is carried out. Each lens portion 26a, 27a, 36a, 37a is enlarged in diameter around the opposing space H0 and from the distal end surface 11b of the opposing electrode chips 11 to each other over the original 11d side. The enlarged diameter part 11c is arrange | positioned so that it may invade space H1 between each other.

Therefore, in the embodiment, the upper optical sensor 23 and the lower optical sensor 33 are compactly separated from the radial direction around the axis center X of the pair of electrode chips 11U and 11B without being radially separated. ), The light transmitting parts 26 and 36 and the light receiving parts 27 and 37 can be provided.

In addition, in embodiment, the holder 40 approaches each other with the front end surface 11b, 11b at the time of the quality determination of the front end surface 11b, 11b of the upper electrode chip 11U and the lower electrode chip 11B. Supporting positions 43 and 44 having a concave shape corresponding to each of the enlarged diameter portions 11c of the upper electrode chip 11U and the lower electrode chip 11B so as to receive the respective enlarged diameter portions 11c and 11c at the time. Is provided, and the through hole 41 is provided in the center of the support seat 43 and 44. As shown in FIG.

Therefore, in the embodiment, at the time of the determination of quality, the upper electrode chip 11U and the lower electrode chip 11B are brought close to each other, and each of the enlarged diameter portions 11c is provided at the corresponding support positions 43 and 44 of the holder 40. When it touches, the front end surfaces 11b of the upper electrode chip 11U and the lower electrode chip 11B are stably disposed in the vicinity of the upper and lower openings of the through hole 41. That is, each line of the upper electrode chip 11U and the lower electrode chip 11B with respect to the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33. The arrangement position of the end face 11b can be stabilized for each determination, and the accuracy of the acceptance determination can be improved. In other words, for each determination, the intersections of the shaft centers U1 and U2 of the light transmitting portion 26 and the light receiving portion 27 can coincide with the center 11bu of the front end surface 11b, and the light transmitting portion 36 And the intersections of the centers B1 and B2 of the light-receiving portion 37 with each other at the center 11bb of the front end surface 11b, and each of the light-receiving portions 27, 38 can receive the reflected light accurately, The accuracy of the determination can be improved.

In particular, in the embodiment, when it is determined whether the front end surface 11b of the upper electrode chip 11U and the lower electrode chip 11B is brought into contact with the support positions 43 and 44 of the holder 40, The light projecting section 26 and the light receiving section 27 of the optical sensor 23 use the centers U1, the centers 11bu of the front end surfaces 11b of the upper electrode chips 11U at the time of the pass / fail determination. U2) The light-transmitting portion 36 and the light-receiving portion 37 of the lower optical sensor 33 are provided so as to cross each other at right angles to each other. With the center 11bb as the intersection of each other, the shaft centers B1 and B2 are provided so as to cross each other at right angles.

That is, in embodiment, the upper optical sensor with respect to the axial center X of the electrode chip 11 is made into the intersection of the center 11bu, 11bb of the front end surface 11b of the electrode chip 11 to determine, respectively. 23, the light transmission parts 26 and 36 of the lower side optical sensor 33, and the axis centers U1, U2, B1, B2 of the light reception parts 27 and 37 cross | intersect at 45 degrees of inclination. Therefore, the light transmitting parts 26 and 36 and the light receiving parts 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 are orthogonal to the axis X of the electrode chip 11, respectively. The length dimension in the direction and the height dimension in the direction along the axis center X of the electrode tip 11 can be made substantially the same. That is, the center of the axis X of the electrode chip 11 with respect to the arrangement space of the light transmitting portions 26 and 36 and the light receiving portions 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33. It is possible to equalize each other in the lengthwise dimension in the radial direction and the height dimension along the axis center X of the electrode chip 11 to make them all smaller. As a result, the holder 40 holding the light transmitting portions 26 and 36 and the light receiving portions 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33 has a height dimension (thickness dimension) ( It is possible to make T) and the outer diameter dimension (the radial dimension from the axial center X of the electrode chip 11, ie, the width dimension) WL compact (refer to FIG. 7, 8).

Of course, without considering the above point, the upper optical sensor 23 or the lower optical sensor 33 can receive the reflected light reflected by the front end surface 11b of the electrode chip 11 without any problem. The shaft centers U1, U2, B1, and B2 of the light-transmitting sections 26 and 36 and the light-receiving sections 27 and 37 are inclined less than 45 ° or inclined 45 with respect to the axis center X of the electrode chip 11. You may provide so that it may cross at the crossing angle exceeding °.

Moreover, in embodiment, the light transmission part 26, 36 and the light reception part 27, 37 of the upper side optical sensor 23 and the lower side optical sensor 33 are the lens part 26a, 27a, 36a of the front end, respectively. , 37a) is made of glass such as boron silica glass. That is, the lens sections 26a, 27a, 36a, 37a at the tip may be made of synthetic resin such as polycarbonate, but when made of glass such as boron silica glass, it has excellent oil resistance and at the time of cleaning to wipe off contaminants. Since scratches are less likely to occur on the back, the durability of the upper optical sensor 23 and the lower optical sensor 33 can be improved.

Moreover, in embodiment, the light transmission part 26, 36 of the upper side optical sensor 23 and the lower side optical sensor 33 is arrange | positioned on the same side, centering on the center O of the through-hole 41 as a center line. I was. That is, in embodiment, the light transmission part 26 is arrange | positioned under the light transmission part 36, and the light reception part 27 is arrange | positioned below the light reception part 37, and the light transmission parts 26 and 36 mutually and the light reception part (27, 37) Each was placed so as to overlap each other up and down. However, the light transmitting parts 26 and 36 may be arranged on opposite sides. That is, the light receiving portion 27 is disposed below the light transmitting portion 36, and the light transmitting portion 26 is disposed below the light receiving portion 37, and the light transmitting portion 36 and the light receiving portion 27 each other and the light receiving portion. (37)? The light transmitting portions 26 may be disposed so as to overlap each other vertically. Also in this case, the holder 40 can make the front and back depth dimensions and thickness dimensions compact.

Of course, without considering the above points, the light transmitting portion 26, the light receiving portion 27 of the upper optical sensor 23, the light transmitting portion 36 and the light receiving portion 37 of the lower optical sensor 33 are the upper and lower sides. It may be arrange | positioned so that it may shift to the circumferential direction centering on the axial center X of the electrode tip 11, without overlapping.

In the embodiment, the upper light sensor 23 and the lower light sensor 33 use LEDs for irradiating infrared light, but irradiating other visible light or the like, or irradiating laser light. You may also

5: (welding gun) servo gun 11: electrode chip
11U: upper electrode chip 11B: lower electrode chip
11b: end surface (of electrode chip) 11c: enlarged portion (of electrode chip)
11d: part 23 (upper electrode chip)
26: light transmitting portion (of the upper optical sensor) 26a: lens portion
27: light receiving portion (of the upper optical sensor) 27a: lens portion
33: Light sensor for the lower side 36: Light transmitting part (of the light sensor for the lower side)
36a: lens portion 37: light receiving portion (of the lower optical sensor)
37a: lens portion 40: holder
41: through hole
42: (part around the through hole) main wall
42a: inner circumference 43, 44: seat
M: Delivery judgment device S: Inspection part
J: determination unit X: shaft center (of electrode chip)
H0: Opposite space [between front end surface 11b]

Claims (6)

A pair of electrode chips held by the welding gun is formed so as to expand in diameter from the distal end face in contact with the work to the original side,
Both parts of the electrode tip to be determined by the strength of the reflected light received from the light-receiving part of the optical sensor by irradiating light from the light-transmitting part of the optical sensor to both parts of the tip surface of the electrode chip. In the judging device,
When the optical sensor is arranged so that the front end faces of the pair of the electrode chips face each other up and down, an upper side optical sensor for determining the quality of the front end face of the upper electrode chip of the upper side and the lower electrode chip of the lower side Two sets of lower side optical sensors for quality determination of tip end surface are used,
The light projecting portion and the light receiving portion of the upper and lower optical sensors, and the light projecting portion of the upper and lower optical sensors, around the upper electrode chip and the lower electrode chip approaching each other at the time of the quality determination. It is set as the structure which equips the inspection part which comprises the holder which hold | maintains the said light receiving part,
The light-transmitting portion and the light-receiving portion of the upper side optical sensor do not intrude into the opposing spaces between the front end surfaces facing up and down of the upper electrode chip and the lower electrode chip, and the upper electrode around the opposing space. With respect to the tip end surface of the chip, it is held in the holder with the arrangement toward the lens part of the tip end diagonally upward with respect to each other with the axis center of the electrode chip as the center line.
The light projecting portion and the light receiving portion of the lower optical sensor do not penetrate into the opposing space, and are linearly symmetrical with respect to the front end surface of the lower electrode chip with respect to the front end surface of the lower electrode chip around the opposing space. Obliquely downward, in an arrangement toward the lens portion of the tip, held in the holder,
The holder is provided with a through hole so that at least the opposing space is provided, and the light transmitting part and the light receiving part of the upper and lower optical sensors are held at a portion surrounding the periphery of the through hole. An electrode chip pass / failure determination device, characterized by the above-mentioned. The method of claim 1,
The light transmitting portion and the light receiving portion of the upper and lower optical sensors overlap the up and down direction while arranging the light transmitting portion and the light receiving portion of the upper optical sensor below the light transmitting portion and the light receiving portion of the lower optical sensor. It is arrange | positioned so that it may be hold | maintained in the said holder, The quality determination apparatus of the electrode chip characterized by the above-mentioned. The method of claim 1,
The line of the light emitting portion of the upper side optical sensor, the light receiving portion and each of the lens portions of the tip of each of the light receiving portion and the light receiving portion of the lower side optical sensor, in the periphery of the opposing space, and the opposing electrode chips; It is arrange | positioned so that it may invade into the space | interval of the enlarged diameter part mutually expanded from a cross section to a base part side, The quality determination apparatus of the electrode chip characterized by the above-mentioned. The method of claim 1,
The holder of the upper electrode chip and the lower electrode chip can receive the respective enlarged diameter portions when the tip faces approach each other at the time of determining whether the upper end surface of the upper electrode chip and the lower electrode chip is positive or not. The recessed part corresponding to each said enlarged diameter part is provided, and the said through-hole is provided in the center of the said support seat, The quality determination apparatus of the electrode chip characterized by the above-mentioned. The method of claim 4, wherein
The light transmitting portion and the light receiving portion of the upper side optical sensor are provided so as to cross each other at right angles with the centers of the front end surfaces of the upper electrode chips at the time of the determination of the quality as the intersections with each other.
The light transmitting portion and the light receiving portion of the lower optical sensor are provided so as to cross each other at right angles with each other at the centers of the front end faces of the lower electrode chips at the time of the determination of the quality. Chip quality determination device. The method of claim 1,
The said light-transmitting part and the light-receiving part of the said upper side and the lower side optical sensor respectively make the said lens part of the front end made from glass, The positive electrode quality determination apparatus of the electrode chip characterized by the above-mentioned.

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