JP2012170983A - Quality determination device of electrode chip - Google Patents

Quality determination device of electrode chip Download PDF

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JP2012170983A
JP2012170983A JP2011035478A JP2011035478A JP2012170983A JP 2012170983 A JP2012170983 A JP 2012170983A JP 2011035478 A JP2011035478 A JP 2011035478A JP 2011035478 A JP2011035478 A JP 2011035478A JP 2012170983 A JP2012170983 A JP 2012170983A
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light
tip
electrode
light receiving
light projecting
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JP5216882B2 (en
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Kotaro Nakajima
弘太郎 中嶋
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Kyokutoh Co Ltd
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Kyokutoh Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/3063—Electrode maintenance, e.g. cleaning, grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/24—Electric supply or control circuits therefor
    • B23K11/25—Monitoring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/31—Electrode holders and actuating devices therefor
    • B23K11/314—Spot welding guns, e.g. mounted on robots
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a quality determination device of an electrode chip which can be used without trouble and of which an inspection portion where a light projecting part and a light receiving part of light sensors are arranged, is structured compactly.SOLUTION: The quality determination device M determines quality of tip end surfaces 11b of upper and lower electrode chips 11U, 11B by irradiating light from the light projecting parts 26, 36 of the respective light sensors 23, 33 on the tip end surfaces 11b, and determining intensity of reflected light received by the light receiving parts 27, 37 of the respective light sensors. The device M includes the inspection portion S, arranged in peripheries of the upper electrode chip 11U and the lower electrode chip 11B which are relatively approached in determining quality, wherein the inspection portion S includes the light projecting parts 26, 36 and the light receiving parts 27, 37 of the light sensors, and a holder 40 for holding the light projecting parts and light receiving parts of the light sensors. The holder 40 includes a through hole 41 for making, at least, a space H0 across which the tip end surfaces 11b, 11b face each other, and a part 42 surrounding the periphery of the through hole holds the light projecting parts 26, 36 and the light receiving parts 27, 37 of the light sensors.

Description

本発明は、溶接ガンに保持される一対の電極チップの先端面の良否を、光センサの投光部からの光を電極チップの先端面に照射して、光センサの受光部で受光した反射光の強弱により、判定する電極チップの良否判定装置に関する。   According to the present invention, whether the tip surfaces of the pair of electrode tips held by the welding gun are good or bad is reflected by irradiating the tip surface of the electrode tip with light from the light projecting portion of the photosensor and receiving the light by the light receiving portion of the photosensor. The present invention relates to a quality determination device for an electrode tip that is determined based on the intensity of light.

従来、溶接ガンに保持される一対の電極チップは、スポット溶接を何回も行えば、先端面が磨耗し、酸化皮膜等の汚れも付着することから、チップドレッサにより、切削される。しかし、その際、汚れや細かい凹凸が奇麗に除去されていなければ、溶接不良を招くことから、良否判定装置により、電極チップの先端面の良否が判定されていた。   Conventionally, a pair of electrode tips held by a welding gun is cut by a tip dresser because spot surfaces are worn and dirt such as an oxide film adheres if spot welding is performed many times. However, at that time, if the dirt and fine irregularities are not removed cleanly, welding failure is caused. Therefore, the quality of the tip surface of the electrode tip is judged by the quality judgment device.

そして、従来の良否判定装置では、光センサの投光部からの光を電極チップの先端面に照射して、光センサの受光部で受光した反射光の強弱により、判定していた（例えば、特許文献１，２参照）。なお、この判定では、反射光が弱い光であって、反射光の光量が所定の閾値より低ければ、不良となり、反射光が強い光であって、反射光の光量が所定の閾値より高ければ、良としていた。   And in the conventional pass / fail judgment device, the tip surface of the electrode chip is irradiated with the light from the light projecting portion of the photosensor, and the judgment is made based on the intensity of the reflected light received by the light receiving portion of the photosensor (for example, (See Patent Documents 1 and 2). In this determination, if the reflected light is weak and the amount of reflected light is lower than a predetermined threshold, the result is defective, and if the reflected light is strong and the amount of reflected light is higher than a predetermined threshold. Was good.

特開平４−１１８１７９号公報Japanese Patent Laid-Open No. 4-118179 特開平３−２９７５８４号公報JP-A-3-297484

しかし、特許文献１に記載の良否判定装置では、一対の電極チップを上下で対向させるように配置させて使用され、そして、光センサの投光部と受光部とが、上下方向で対向する上電極チップと下電極チップとの間の、上電極チップの先端面の直下に配置されていた。そのため、上電極チップからのゴミや水滴が落下して光センサの投光部や受光部に付けば、その後の判定が行えなくなる場合があり、投光部や受光部を清掃する等のメンテナンスが必要となって、手間無く長期間にわたって使用する点に、改善の余地があった。   However, in the quality determination device described in Patent Document 1, the pair of electrode chips are used so as to be opposed to each other in the vertical direction, and the light projecting unit and the light receiving unit of the photosensor are opposed in the vertical direction. It was arrange | positioned just under the front end surface of the upper electrode tip between the electrode tip and the lower electrode tip. For this reason, if dust or water droplets from the upper electrode tip fall and attach to the light projecting part or light receiving part of the optical sensor, subsequent determination may not be possible. Maintenance such as cleaning the light projecting part or light receiving part may not be possible. There was room for improvement in that it was necessary and used over a long period of time.

なお、水滴は、溶接ガンの内部に冷却水を流しており、大気中の水蒸気が凝固して電極チップに付着する等により、発生していた。   Water droplets were generated by flowing cooling water through the inside of the welding gun, and water vapor in the atmosphere solidified and adhered to the electrode tips.

また、特許文献２に記載の良否判定装置では、光センサの投光部と受光部とが、上電極チップの左右両側に離れて配置されており、上記の不具合は発生し難い。しかし、特許文献２の良否判定装置では、光センサの投光部と受光部とが、電極チップの両側で相互に離れるとともにそれぞれ据付台に取り付けられており、良否判定装置における投光部と受光部とを配設する検査部が、大型化していた。また、下電極チップの良否だけを判定して、その良否により、上電極チップの良否を推定していた。そのため、上電極チップの先端面が不良であれば、その後に溶接不良を生じさせてしまう虞れがある。勿論、上電極チップの先端面も判定できるように、もう一つ、光センサを設けて、上電極チップの先端面の良否を判定することも考えられるが、一層、検査部の大型化を招いてしまう。   Moreover, in the quality determination apparatus described in Patent Document 2, the light projecting unit and the light receiving unit of the optical sensor are disposed apart from each other on the left and right sides of the upper electrode chip, and the above-described problems are unlikely to occur. However, in the pass / fail judgment device of Patent Document 2, the light projecting portion and the light receiving portion of the optical sensor are separated from each other on both sides of the electrode chip and attached to the mounting base, respectively. The inspection part for arranging the parts has been enlarged. Further, only the quality of the lower electrode tip is determined, and the quality of the upper electrode tip is estimated based on the quality. For this reason, if the tip surface of the upper electrode tip is defective, there is a possibility that a welding failure will occur after that. Of course, it may be possible to determine the quality of the tip surface of the upper electrode chip by providing another optical sensor so that the tip surface of the upper electrode chip can also be determined, but this further increases the size of the inspection section. I will.

本発明は、上述の課題を解決するものであり、手間無く使用できるとともに、光センサの投，受光部を配設させる検査部をコンパクトに構成できる電極チップの良否判定装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide an electrode chip pass / fail judgment device that can be used without any trouble and that can be configured compactly with an inspection part for arranging a light-projecting and light-receiving part of an optical sensor. And

＜請求項１の説明＞
本発明に係る良否判定装置は、溶接ガンに保持される一対の電極チップが、ワークに当接する先端面から元部側にかけて拡径するように、形成され、
電極チップの先端面の良否を、光センサの投光部からの光を先端面に照射して、光センサの受光部で受光した反射光の強弱により、判定する電極チップの良否判定装置であって、
光センサが、一対の電極チップ相互の先端面を上下で対向するように配置させた際の上側の上電極チップの先端面の良否判定用の上側用光センサと、下側の下電極チップの先端面の良否判定用の下側用光センサと、の二組使用され、
良否判定時に相互に接近させる上電極チップと下電極チップとの周囲に、上側用，下側用光センサの投光部及び受光部と、上側用，下側用光センサの投光部及び受光部を保持するホルダと、を備えてなる検査部、を配設させる構成として、
上側用光センサの投光部と受光部とが、上電極チップと下電極チップとの上下で対向する先端面相互間の対向スペース内に侵入させずに、対向スペースの周りで、上電極チップの先端面に対し、電極チップの軸心を中心線として相互に線対称の斜め上向きに、先端のレンズ部を向けた配置として、ホルダに保持され、
下側用光センサの投光部と受光部とが、対向スペース内に侵入させずに、対向スペースの周りで、下電極チップの先端面に対し、電極チップの軸心を中心線として相互に線対称の斜め下向きに、先端のレンズ部を向けた配置として、ホルダに保持され、
ホルダが、少なくとも対向スペースを空けるように、貫通孔を設け、かつ、貫通孔の周囲を囲む部位で、上側用，下側用光センサの投光部及び受光部を、保持する構成としていることを特徴とする。 <Explanation of Claim 1>
The quality determination device according to the present invention is formed such that the pair of electrode tips held by the welding gun expands from the front end surface contacting the workpiece to the base portion side,
The quality of the electrode tip is determined by irradiating the tip surface with light from the light projecting portion of the photosensor and determining the strength of the reflected light received by the light receiving portion of the photosensor. And
When the optical sensor is disposed so that the tip surfaces of the pair of electrode chips face each other vertically, the upper photosensor for determining the quality of the tip surface of the upper electrode tip on the upper side and the lower electrode chip on the lower side Two sets of optical sensors for the lower side for determining the quality of the tip surface are used,
Around the upper electrode chip and the lower electrode chip that are brought close to each other at the time of pass / fail judgment, the light projecting unit and the light receiving unit of the upper and lower photosensors, and the light projecting unit and the light receiving unit of the upper and lower photosensors As a configuration for disposing an inspection unit comprising a holder for holding the unit,
The upper electrode chip around the facing space without causing the light projecting portion and the light receiving portion of the upper photosensor to enter the facing space between the upper and lower tip surfaces facing each other vertically. The tip end surface of the electrode tip is held in the holder as an arrangement in which the lens portion at the tip is directed obliquely upward and symmetrically about the axis of the electrode tip as a center line,
The light projecting portion and the light receiving portion of the lower photosensor are not intruded into the facing space, but are mutually centered around the facing space with respect to the tip surface of the lower electrode tip, with the axis of the electrode tip as the center line. It is held in the holder as an arrangement with the lens part at the tip facing the line-symmetrical diagonally downward,
The holder is configured to hold the light projecting portion and the light receiving portion of the upper side and lower side photosensors at a site surrounding the through hole so as to provide at least an opposing space. It is characterized by.

本発明に係る良否判定装置では、良否判定時における上電極チップと下電極チップとが接近して上下で対向する際、上側用，下側用光センサが、それぞれ、投光部から対応する先端面に光を照射して、受光部で反射した光を受光する。そして、それらの反射光の強弱が、所定の閾値より上であれば、良と判定し、下であれば不良と判定する。   In the pass / fail determination apparatus according to the present invention, when the upper electrode chip and the lower electrode chip approach each other at the time of pass / fail determination, the upper and lower photosensors respectively correspond to the tips corresponding from the light projecting unit. The surface is irradiated with light, and the light reflected by the light receiving unit is received. If the intensity of the reflected light is above a predetermined threshold, it is determined as good, and if it is below, it is determined as defective.

そして、これらの上側用，下側用光センサは、それぞれ、検査部の投光部と受光部とを、対向スペース内に侵入させずに、対向スペースの周りで、ホルダに保持させている。さらに、ホルダも、少なくとも上下で対向する先端面相互間に対向スペースを空けるように、貫通孔を設けて、貫通孔の周囲を囲む部位で、上側用，下側用光センサの投光部及び受光部を保持する構成としている。   And these optical sensors for upper side and lower side respectively hold | maintain the light projection part and light-receiving part of a test | inspection part in the holder around opposing space, without making it penetrate | invade in opposing space. Further, the holder is also provided with a through hole so as to provide a space between the tip surfaces opposed at the top and bottom, and surrounds the periphery of the through hole. The light receiving unit is held.

そのため、上電極チップの先端側に付着しているゴミや水滴が落下しても、それらのゴミや水滴は、拡径部を伝って、先細りの先端面の部位から落下することとなり、貫通孔を通過する。その結果、上側用，下側用光センサの投光部及び受光部には、それらのゴミや水滴が付着し難くなって、上側用，下側用光センサの投光部及び受光部を清掃する等のメンテナンスが不要となり、手間無く、長期間にわたって、良否判定装置を使用することが可能となる。   Therefore, even if dust and water droplets adhering to the tip side of the upper electrode tip fall, the dust and water droplets will fall from the tapered tip surface portion through the enlarged diameter portion, and the through hole Pass through. As a result, the dust and water droplets are less likely to adhere to the light projecting portion and the light receiving portion of the upper and lower photosensors, and the light projecting portion and the light receiving portion of the upper and lower photosensors are cleaned. This eliminates the need for maintenance and the like, and makes it possible to use the pass / fail judgment device over a long period of time.

また、上側用，下側用光センサの投光部及び受光部は、上下で対向する上電極チップと下電極チップとの先端面相互の間の対向スペースの周囲、すなわち、ホルダの貫通孔の周囲の部位に、保持されている。換言すれば、上側用，下側用光センサの投光部及び受光部が、一つの環状のホルダに保持されて、保持部位を共用できることから、検査部は、その構造をシンプルでコンパクトに構成できる。また、貫通孔の内周面に先端のレンズ部を露出させて配置させる際、その貫通孔の内周面を、極力、対向スペースに侵入しない状態で、対向スペースに接近させる配置とすれば、一層、ホルダ自体をコンパクトに構成できて、検査部は、上下で対向している電極チップの先端面相互の周囲で、コンパクトに配置できることとなる。   Further, the light projecting portion and the light receiving portion of the upper and lower photosensors are arranged around the opposing space between the tip surfaces of the upper electrode chip and the lower electrode chip, which are vertically opposed to each other, that is, the through hole of the holder. It is held in the surrounding area. In other words, the light projecting part and the light receiving part of the upper and lower photosensors are held by a single annular holder, and the holding part can be shared, so the inspection part has a simple and compact structure. it can. Also, when the lens portion at the tip is exposed and arranged on the inner peripheral surface of the through hole, the inner peripheral surface of the through hole is arranged as close to the opposing space as possible without entering the opposing space. In addition, the holder itself can be made compact, and the inspection section can be arranged compactly around the tip surfaces of the electrode chips facing vertically.

したがって、本発明に係る電極チップの良否判定装置では、手間無く使用できるとともに、光センサの投，受光部を配設させる検査部をコンパクトに構成できる。   Therefore, in the electrode chip quality determination device according to the present invention, it can be used without any trouble, and the inspection unit in which the projection and the light receiving unit of the optical sensor are arranged can be made compact.

＜請求項２の説明＞
また、上側用，下側用光センサの投光部及び受光部は、上側用光センサの投，受光部を下側用光センサの投，受光部より下方に配置させつつ、上下方向で重なるように配置させて、ホルダに保持させることが望ましい。 <Explanation of Claim 2>
In addition, the light projecting unit and the light receiving unit of the upper and lower photosensors overlap in the vertical direction while the light projecting unit and the light receiving unit of the upper photosensor are disposed below the light projecting and receiving unit of the lower photosensor. It is desirable that the holder is arranged and held by the holder.

このような構成では、まず、上側用光センサの投，受光部と下側用光センサの投，受光部が、相互に、上下で重なって配置されることから、重なった面と直交する水平方向には、上側用，下側用光センサの投，受光部が配置されず、その部分のホルダの奥行き寸法を小さくコンパクトにできる。   In such a configuration, since the light projecting / receiving unit of the upper photosensor and the light projecting / receiving unit of the lower photosensor are disposed so as to overlap each other, the horizontal direction orthogonal to the overlapping surface In the direction, the projecting and receiving portions of the upper and lower photosensors are not arranged, and the depth of the holder at that portion can be made small and compact.

さらに、このような構成では、上側用光センサの投，受光部が下側用光センサの投，受光部より下方に配置されており、上側用光センサの投，受光部の光跡と下側用光センサの投，受光部の光跡とが、上側用光センサの投，受光部と下側用光センサの投，受光部との上下で重なった面と直交する水平方向から見て、相互にクロスする状態となる。すなわち、上記と上下を逆にする場合、換言すれば、上側用光センサの投，受光部を下側用光センサの投，受光部より上方に配置させる場合、に比べて、上記の構成では、光跡のクロスする分、ホルダの上下方向の厚さ寸法を小さくできて、ホルダの上下方向の寸法をコンパクトできる。   Furthermore, in such a configuration, the light projecting and receiving portions of the upper photosensor are disposed below the light projecting and receiving portions of the lower photosensor, and the light traces and lower light of the upper photosensor are projected and received. Seen from the horizontal direction where the light traces of the light sensor for the side and the light trace of the light receiving part are perpendicular to the surfaces of the light sensor for the upper side, the light projecting part and the light sensor for the lower side, , They will cross each other. That is, when the above is reversed upside down, in other words, in the above configuration, compared to the case where the upper optical sensor throwing and receiving unit is disposed above the lower photosensor throwing and receiving unit. The thickness dimension in the vertical direction of the holder can be reduced by the amount of crossing of the light trace, and the vertical dimension of the holder can be made compact.

したがって、上記の構成では、ホルダの上下方向の厚さ寸法や、センサ相互の重なった方向と直交するホルダの奥行き寸法を小さくすることができて、一層、検査部をコンパクトに構成できる。   Therefore, in the above configuration, the thickness dimension in the vertical direction of the holder and the depth dimension of the holder perpendicular to the direction in which the sensors overlap each other can be reduced, and the inspection section can be further compactly configured.

＜請求項３の説明＞
さらに、ホルダには、上電極チップと下電極チップとの先端面の良否判定時における先端面相互の接近時、各拡径部を受け止め可能に、上電極チップと下電極チップとの各拡径部に対応した凹形状とした受け座、を設け、受け座の中央に、貫通孔を配設することが望ましい。 <Explanation of Claim 3>
In addition, the holder can receive the respective enlarged diameter portions when the tip surfaces approach each other when determining whether the tip surfaces of the upper electrode tip and the lower electrode tip are good or bad. It is desirable to provide a receiving seat having a concave shape corresponding to the portion, and to provide a through hole in the center of the receiving seat.

このような構成では、良否判定時、上電極チップと下電極チップとを相互に接近させて、ホルダの対応する受け座に各拡径部を当てれば、上電極チップと下電極チップとの各先端面が、貫通孔の上下の開口付近に、安定して配置される。すなわち、上側用，下側用光センサの投光部，受光部に対する上，下電極チップの各先端面の配置位置を、判定毎に安定させることができ、その結果、良否判定の精度を向上させることができる。   In such a configuration, when determining the quality, the upper electrode tip and the lower electrode tip are brought close to each other, and each enlarged diameter portion is applied to the corresponding receiving seat of the holder. The front end surface is stably disposed in the vicinity of the upper and lower openings of the through hole. That is, it is possible to stabilize the arrangement positions of the tip surfaces of the upper and lower electrode tips with respect to the light projecting portion and the light receiving portion of the upper and lower photosensors for each determination, and as a result, the accuracy of the quality determination is improved. Can be made.

＜請求項４の説明＞
さらにまた、上側用，下側用光センサの投，受光部は、それぞれ、先端のレンズ部を、ガラス製とすることが望ましい。すなわち、投，受光部の先端のレンズ部は、ポリカーボネイト等の合成樹脂製とすることもできるが、ホウ素シリカガラス等のガラス製とすれば、耐油性に優れ、また、汚れを拭き取る清掃時等に傷付き難いことから、上側用，下側用光センサの耐久性を向上させることができる。 <Explanation of Claim 4>
Furthermore, it is desirable that the projection and light receiving portions of the upper and lower photosensors are made of glass at the tip lens portion. That is, the lens part at the tip of the light emitting / receiving part can be made of synthetic resin such as polycarbonate, but if it is made of glass such as boron silica glass, it is excellent in oil resistance and is used for cleaning to remove dirt. Therefore, the durability of the upper and lower photosensors can be improved.

本発明の一実施形態の良否判定装置を配置させた溶接現場を示す概略平面図である。It is a schematic plan view which shows the welding field where the quality determination apparatus of one Embodiment of this invention was arrange | positioned. 同実施形態の良否判定装置における検査部付近を示す概略側面図である。It is a schematic side view which shows the vicinity of the test | inspection part in the quality determination apparatus of the embodiment. 同実施形態の良否判定装置における検査部付近の概略平面図である。It is a schematic plan view of the inspection part vicinity in the quality determination apparatus of the embodiment. 同実施形態の検査部の斜視図である。It is a perspective view of the test | inspection part of the embodiment. 同実施形態の検査部の平面図である。It is a top view of the inspection part of the embodiment. 同実施形態の検査部の断面図であり、図５のVI−VI部位に対応する。It is sectional drawing of the test | inspection part of the embodiment, and respond | corresponds to the VI-VI site | part of FIG. 同実施形態のホルダ単体の平面図である。It is a top view of the holder simple substance of the embodiment. 同実施形態のホルダ単体の断面図であり、図７のVIII−VIII部位に対応する。It is sectional drawing of the holder single-piece | unit of the embodiment, and respond | corresponds to the VIII-VIII site | part of FIG.

以下、本発明の一実施形態を図面に基づいて説明すると、実施形態の良否判定装置Ｍは、図１に示すように、順次送られてくるワークＷ１，Ｗ２…をスポット溶接する多関節の溶接ロボット１の近傍に配置されて、磨耗した電極チップの切削後における先端面の良否を判定するように、配設されている。そして、実施形態の場合、良否判定装置Ｍは、電極チップを切削するチップドレッサ１８に配設される検査部Ｓと、溶接ロボット１の動作を制御する制御装置３に配設される判定部Ｊと、を備えて構成されている。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the quality determination device M of the embodiment performs multi-joint welding for spot welding workpieces W1, W2,. It arrange | positions in the vicinity of the robot 1, and is arrange | positioned so that the quality of the front end surface after cutting of the worn electrode tip may be determined. In the case of the embodiment, the quality determination device M includes an inspection unit S disposed in the tip dresser 18 that cuts the electrode tip, and a determination unit J disposed in the control device 3 that controls the operation of the welding robot 1. And is configured.

なお、溶接ロボット１のアーム２の先端には、図１，２に示すように、溶接ガンとしてのサーボガン５が取り付けられて、サーボガン５は、一対の電極チップ１１（１１Ｕ，１１Ｂ）を相互に対向するシャンク７，８に嵌め込んでいる。このサーボガン５は、汎用のものであり、一対の電極チップ１１を保持したシャンク７，８相互を、溶接時等に、サーボモータ６によって、シャンク７，８の対向方向に沿って移動可能としている。電極チップ１１の移動は、サーボモータ６のみならず、アーム２を移動させるサーボモータ（図符号省略）も作動させて、各シャンク７，８を移動させることとなる。また、サーボガン５は、サーボモータ６や図示しないサーボモータに、エンコーダが内蔵されており、シャンク７，８や電極チップ１１の配置位置を検知できて、電極チップ１１の位置制御や加圧力制御等を行なうことができる。   As shown in FIGS. 1 and 2, a servo gun 5 as a welding gun is attached to the tip of the arm 2 of the welding robot 1, and the servo gun 5 attaches a pair of electrode tips 11 (11U, 11B) to each other. It fits into the opposite shanks 7,8. The servo gun 5 is a general-purpose one and can move between the shanks 7 and 8 holding a pair of electrode tips 11 along the opposing direction of the shanks 7 and 8 by the servo motor 6 during welding or the like. . The movement of the electrode tip 11 moves not only the servo motor 6 but also the servo motor (not shown) that moves the arm 2 to move the shanks 7 and 8. The servo gun 5 has a built-in encoder in the servo motor 6 or a servo motor (not shown), and can detect the arrangement positions of the shanks 7 and 8 and the electrode tip 11 to control the position of the electrode tip 11 and the pressure control. Can be performed.

そして、溶接ロボット１の移動区域内には、良否判定装置Ｍの他に、電極チップ１１の交換時に使用済みの電極チップ１１を各シャンク７，８から取り外す図示しないチップ抜き装置、新たな電極チップ１１を各シャンク７，８に取り付ける図示しないチップ供給装置、及び、交換前における磨耗したり汚れたりした消耗時に電極チップ１１を切削するチップドレッサ１８、が配設されている。   Further, in the moving area of the welding robot 1, in addition to the pass / fail judgment device M, a tip removal device (not shown) for removing the used electrode tip 11 from each shank 7, 8 when replacing the electrode tip 11, a new electrode tip A chip supply device (not shown) for attaching 11 to the shanks 7 and 8 and a chip dresser 18 for cutting the electrode chip 11 when worn or soiled before replacement are disposed.

さらに、溶接ロボット１の移動区域の近傍には、図１に示すように、制御装置３が配設されており、この制御装置３は、電極チップ１１へ流す電流を調整したり、電流を流すサイクル等を調整する溶接制御、あるいは、溶接ロボット１、サーボガン５、チップドレッサ１８、図示しないチップ抜き装置等の動作制御も行っており、さらに、実施形態の場合、既述したように、良否判定装置Ｍの判定部Ｊも、構成している。   Further, as shown in FIG. 1, a control device 3 is disposed in the vicinity of the moving area of the welding robot 1, and the control device 3 adjusts a current flowing to the electrode tip 11 or allows a current to flow. Welding control that adjusts the cycle or the like, or operation control of the welding robot 1, servo gun 5, tip dresser 18, tip removal device (not shown), etc. is also performed. The determination unit J of the device M is also configured.

なお、チップドレッサ１８は、図１〜３に示すように、ハウジング１９内に、サーボモータ２１の作動により回転するカッタ２０を収納させて、溶接作業中における電極チップ１１の交換前の状態での消耗した電極チップ１１（１１Ｕ，１１Ｂ）の先端１１ａを切削できるように、設定されている。チップドレッサ１８の使用時には、各電極チップ１１を、シャンク７，８の各先端に取り付けた状態で、チップドレッサ１８の上下からカッタ２０の上下面に押し付けて、サーボモータ２１の作動によるカッタ２０の回転により、切削することとなる。   As shown in FIGS. 1 to 3, the tip dresser 18 accommodates a cutter 20 that is rotated by the operation of the servo motor 21 in the housing 19, so that the electrode tip 11 is not replaced during welding work. It is set so that the tip 11a of the consumed electrode tip 11 (11U, 11B) can be cut. When the chip dresser 18 is used, each electrode chip 11 is pressed against the upper and lower surfaces of the cutter 20 from the top and bottom of the chip dresser 18 with the electrode chips 11 attached to the tips of the shanks 7 and 8, and the cutter 20 is operated by the servo motor 21. Cutting is performed by the rotation.

実施形態の場合、電極チップ１１は、図６に示すように、直径Ｄ０を１６ｍｍとして、カッタ２０の回転による切削によって適正に切削された際には、先端１１ａの形状として、先端面１１ｂに直径Ｄ１を６ｍｍとする円形の略平坦面が形成され、かつ、先端面１１ｂから円柱状の元部１１ｄ側にかけて、半径Ｒを８ｍｍとした曲線状に拡径する拡径部１１ｃが形成されるように、設定されている。ちなみに、磨耗時の電極チップ１１は、拡径部１１ｃが電極チップ１１の軸方向に沿う長さを短くさせて、先端面１１ｂが広がるようになる。そして、回転するカッタ２０により切削されれば、電極チップ１１は、先端１１ａに、図６に示すような拡径部１１ｃと先端面１１ｂとが形成されることとなる。   In the case of the embodiment, as shown in FIG. 6, the electrode tip 11 has a diameter D0 of 16 mm, and when properly cut by cutting by rotation of the cutter 20, the tip 11a has a diameter on the tip surface 11b. A circular substantially flat surface with D1 of 6 mm is formed, and a diameter-enlarged portion 11c that expands in a curved shape with a radius R of 8 mm is formed from the tip surface 11b to the columnar base portion 11d side. Is set. By the way, the electrode tip 11 at the time of wear is such that the enlarged diameter portion 11c shortens the length along the axial direction of the electrode tip 11, and the tip end surface 11b becomes wider. And if it cuts with the cutter 20 which rotates, the electrode tip 11 will form the enlarged diameter part 11c and the front end surface 11b as shown in FIG. 6 in the front end 11a.

また、図１，２に示すように、チップドレッサ１８のハウジング１９は、取付プレート６５によって検査部Ｓを保持し、そして、上下方向に配設固定された支持板１４に、ばね１７等を介在させて、上下移動可能に支持されている。支持板１４には、上下に所定距離離隔されて、支持ブラケット１５，１５が、二列並設され、上下一対の支持ブラケット１５，１５には、相互を連結するように支持ロッド１６が上下方向に配設され、各支持ロッド１６に二つずつのばね（圧縮コイルばね）１７が外装されて、さらに、上下二つのばね１７，１７間にハウジング１９のブラケット１９ａが配設されている。そのため、チップドレッサ１８は、検査部Ｓとともに、ばね１７，１７に支持されて、復元可能に上下に移動するように、配設されている。   As shown in FIGS. 1 and 2, the housing 19 of the chip dresser 18 holds the inspection portion S by a mounting plate 65, and a spring 17 or the like is interposed on a support plate 14 arranged and fixed in the vertical direction. It is supported so that it can move up and down. The support plate 14 is provided with two rows of support brackets 15 and 15 that are spaced apart from each other by a predetermined distance in the vertical direction, and the support rod 16 is vertically connected to the pair of upper and lower support brackets 15 and 15 so as to be connected to each other. Two springs (compression coil springs) 17 are packaged on each support rod 16, and a bracket 19 a of the housing 19 is disposed between the upper and lower springs 17 and 17. Therefore, the tip dresser 18 is supported by the springs 17 and 17 together with the inspection unit S, and is disposed so as to move up and down in a recoverable manner.

良否判定装置Ｍは、図１，３，６に示すように、一対の電極チップ１１，１１相互の先端面１１ｂを上下で対向するように接近させて配置させた際の上側の上電極チップ１１Ｕの先端面１１ｂの良否判定用の上側用光センサ２３と、下側の下電極チップ１１Ｂの先端面１１ｂの良否判定用の下側用光センサ３３と、の二組使用されるように、構成されている。そして、良否判定装置Ｍは、既述したように、チップドレッサ１８に配設される検査部Ｓと、制御装置３に配設される判定部Ｊと、を備えて構成されている。   As shown in FIGS. 1, 3, and 6, the pass / fail judgment device M has an upper electrode chip 11 </ b> U on the upper side when the tip surfaces 11 b of the pair of electrode chips 11, 11 are placed close to each other so as to face each other. The upper optical sensor 23 for pass / fail judgment of the front end surface 11b and the lower optical sensor 33 for pass / fail judgment of the front end surface 11b of the lower lower electrode chip 11B are configured to be used in two sets. Has been. As described above, the pass / fail determination device M includes the inspection unit S disposed in the chip dresser 18 and the determination unit J disposed in the control device 3.

検査部Ｓは、良否判定時に相互に接近させる上電極チップ１１Ｕと下電極チップ１１Ｂとの周囲に、配設可能に、取付プレート６５を利用して、チップドレッサ１８のハウジング１９に取付固定されている。そして、検査部Ｓは、図３〜６に示すように、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７と、投光部２６，３６及び受光部２７，３７を保持するホルダ４０と、を備えて構成されている。さらに、検査部Ｓは、ホルダ４０の左右両縁から前面側を覆うカバー５０、ホルダ４０の後方に連なってホルダ４０を保持するネック５２、ネック５２の後方に連なってネック５２を保持するボディ５４、及び、ボディ５４をハウジング１９に取付固定する取付プレート６５、を備えて構成されている。ホルダ４０、カバー５０、ネック５２、ボディ５４、及び、取付プレート６５は、ねじ止め手段により、相互に連結されている。なお、実施形態の場合、取付プレート６５は、ハウジング１９と一体的に形成されている。   The inspection unit S is mounted and fixed to the housing 19 of the chip dresser 18 by using the mounting plate 65 so as to be disposed around the upper electrode chip 11U and the lower electrode chip 11B which are brought close to each other when determining pass / fail. Yes. 3 to 6, the inspection unit S includes the light projecting units 26 and 36 and the light receiving units 27 and 37 of the upper photosensor 23 and the lower photosensor 33, and the light projecting units 26 and 36 and And a holder 40 that holds the light receiving portions 27 and 37. Further, the inspection unit S includes a cover 50 that covers the front side from the left and right edges of the holder 40, a neck 52 that continues to the rear of the holder 40 and holds the holder 40, and a body 54 that continues to the rear of the neck 52 and holds the neck 52. And an attachment plate 65 for attaching and fixing the body 54 to the housing 19. The holder 40, the cover 50, the neck 52, the body 54, and the mounting plate 65 are connected to each other by screwing means. In the case of the embodiment, the mounting plate 65 is formed integrally with the housing 19.

また、実施形態の場合、上側用光センサ２３と下側用光センサ３３とは、それぞれ、ＬＥＤを光源とした光ファイバセンサを利用して構成されており、判定部Ｊに、ＬＥＤ、アンプ部、さらには、受光した光量が所定の閾値より高いか低いかを比較する比較回路、比較した結果を表示する出力回路、を配設させている。実施形態では、ＬＥＤとして赤外線を発光するものを使用している。また、出力回路は、図１に示すように、判定表示部７２で良否を表示するように構成されている。この判定表示部７２には、上電極チップ１１Ｕの先端面１１ｂが溶接に好適である場合（受光部２７で受光する光量が所定の閾値より高い場合）に点灯するＯＫランプ７２ａ、受光部２７で受光する光量が所定の閾値より低い場合に点灯するＮＧランプ７２ｂ、下電極チップ１１Ｂの先端面１１ｂが溶接に好適である場合（受光部３７で受光する光量が所定の閾値より高い場合）に点灯するＯＫランプ７２ｃ、及び、受光部３７で受光する光量が所定の閾値より低い場合に点灯するＮＧランプ７２ｄ、が配設されている。   In the case of the embodiment, each of the upper side optical sensor 23 and the lower side optical sensor 33 is configured by using an optical fiber sensor using an LED as a light source, and the determination unit J includes an LED and an amplifier unit. Furthermore, a comparison circuit that compares whether the amount of received light is higher or lower than a predetermined threshold and an output circuit that displays the comparison result are provided. In the embodiment, an LED that emits infrared light is used. Further, as shown in FIG. 1, the output circuit is configured to display pass / fail on the determination display unit 72. The determination display unit 72 includes an OK lamp 72a that is turned on when the tip surface 11b of the upper electrode tip 11U is suitable for welding (when the amount of light received by the light receiving unit 27 is higher than a predetermined threshold), and the light receiving unit 27. NG lamp 72b that is turned on when the amount of received light is lower than a predetermined threshold, and lighted when the tip surface 11b of the lower electrode tip 11B is suitable for welding (when the amount of light received by the light receiving unit 37 is higher than the predetermined threshold). An OK lamp 72c that performs light emission and an NG lamp 72d that is turned on when the amount of light received by the light receiving unit 37 is lower than a predetermined threshold are disposed.

また、実施形態では、良否判定において不良と判定されても、制御装置３が、判定部Ｊの出力回路からの不良の信号を入力して、少なくとも１回はチップドレッサ１８で電極チップ１１を切削し直して、再度、良否を判定し、その判定時、再度、不良と判定されれば、図示しないチップ抜き装置やチップ供給装置にサーボガン５を移動させて、上電極チップ１１Ｕと下電極チップ１１Ｂとを共に交換し、次の溶接作業に移行するように構成されている。   In the embodiment, even if it is determined to be defective in the pass / fail determination, the control device 3 inputs a failure signal from the output circuit of the determination unit J and cuts the electrode tip 11 with the tip dresser 18 at least once. Then, the quality is judged again, and if it is judged as defective again at the time of the judgment, the servo gun 5 is moved to a chip removal device or chip supply device (not shown), and the upper electrode chip 11U and the lower electrode chip 11B. Are exchanged together to shift to the next welding operation.

なお、判定部Ｊのアンプ部では、上側用光センサ２３と下側用光センサ３３との二つずつの投光部２６，３３と受光部２７，３７との相互干渉を防いで、誤作動を防止するように、上側用光センサ２３と下側用光センサ３３との発光周期を相互にずらすように構成されている。   Note that the amplifier unit of the determination unit J malfunctions by preventing mutual interference between the two light projecting units 26 and 33 and the light receiving units 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33. In order to prevent this, the light emission periods of the upper photosensor 23 and the lower photosensor 33 are shifted from each other.

また、実施形態の場合、溶接ロボット１の動作中では、上側用光センサ２３と下側用光センサ３３とは、常時、投光部２６，３３から光を照射し、かつ、受光部２７，３７で、受光できるように設定されている。勿論、実施形態と相違して、チップドレッサ１８による切削後の良否判定毎に、投光部２６，３３から光を照射するように構成してもよい。   In the case of the embodiment, during the operation of the welding robot 1, the upper optical sensor 23 and the lower optical sensor 33 always irradiate light from the light projecting units 26, 33, and the light receiving unit 27, 37 is set to receive light. Of course, unlike the embodiment, the light projecting units 26 and 33 may irradiate light each time the chip dresser 18 performs a quality determination after cutting.

そして、これらの判定部Ｊでの上側用光センサ２３と下側用光センサ３３との構成は、アンプ部等を含めて、公知のものであり、それらの説明を省き、本願の特徴である検査部Ｓでの投光部２６，３３と受光部２７，３７との配置構造について、詳しく説明する（図４〜８参照）。   And the structure of the upper side optical sensor 23 and the lower side optical sensor 33 in these determination parts J is a well-known thing including an amplifier part etc., The description is abbreviate | omitted and it is the characteristics of this application. The arrangement structure of the light projecting units 26 and 33 and the light receiving units 27 and 37 in the inspection unit S will be described in detail (see FIGS. 4 to 8).

まず、上側用光センサ２３の投光部２６と受光部２７とは、図６〜８に示すように、良否判定時の上電極チップ１１Ｕと下電極チップ１１Ｂとの上下で対向する先端面１１ｂ，１１ｂ相互間の対向スペースＨ０内に侵入させずに、対向スペースＨ０の周りで、上電極チップ１１Ｕの先端面１１ｂに対し、斜め上向きに向けるように配置されて、ホルダ４０の取付孔４５，４６に収納保持されている。実施形態の場合、投光部２６と受光部２７とは、略円柱状として、投光部２６で照射した光を先端面１１ｂで反射させて受光部２７で受光できるように、先端のレンズ部２６ａ，２７ａを、上電極チップ１１Ｕの先端面１１ｂの中央１１ｂｕに向けている。詳しくは、投光部２６と受光部２７とは、相互の軸心Ｕ１，Ｕ２が、中央１１ｂｕを相互の交点とし、かつ、上電極チップ１１Ｕと下電極チップ１１Ｂとの軸心Ｘを中心線として、線対称となるように、配設されている。さらに、実施形態の場合、投光部２６と受光部２７とは、軸心Ｕ１，Ｕ２相互を直交交差させるように、配設されている。   First, as shown in FIGS. 6 to 8, the light projecting unit 26 and the light receiving unit 27 of the upper optical sensor 23 are vertically opposed tip surfaces 11b of the upper electrode chip 11U and the lower electrode chip 11B at the time of pass / fail determination. , 11b is arranged so as to be obliquely upward with respect to the tip surface 11b of the upper electrode chip 11U around the facing space H0 without entering the facing space H0 between the mounting holes 45, 46 is stored and held. In the case of the embodiment, the light projecting unit 26 and the light receiving unit 27 have a substantially cylindrical shape so that the light irradiated by the light projecting unit 26 is reflected by the front end surface 11 b and can be received by the light receiving unit 27. 26a and 27a are directed toward the center 11bu of the tip surface 11b of the upper electrode tip 11U. In detail, the light projecting unit 26 and the light receiving unit 27 have the mutual axis centers U1 and U2 having the center 11bu at the intersection and the axis X between the upper electrode chip 11U and the lower electrode chip 11B as the center line. As shown in FIG. Furthermore, in the case of the embodiment, the light projecting unit 26 and the light receiving unit 27 are arranged so that the axial centers U1 and U2 intersect each other at right angles.

なお、対向スペースＨ０は、良否判定時の接近した上電極チップ１１Ｕと下電極チップ１１Ｂとの上下で対向する先端面１１ｂ，１１ｂ相互間のスペースであり、先端面１１ｂにおける拡径部１１ｃとの境界となる外周縁の肩部１１ｂｅまでの円柱状のスペースである。   The facing space H0 is a space between the upper and lower tip surfaces 11b and 11b facing each other in the vertical direction of the upper electrode chip 11U and the lower electrode chip 11B that are close to each other at the time of pass / fail judgment. It is a cylindrical space up to the shoulder 11be of the outer peripheral edge that becomes the boundary.

また、下側用光センサ３３の投光部３６と受光部３７とは、図６〜８に示すように、対向スペースＨ０内に侵入させずに、対向スペースＨ０の周りで、下電極チップ１１Ｂの先端面１１ｂに対し、斜め下向きに向けるように配置されて、ホルダ４０の取付孔４７，４８に収納保持されている。実施形態の場合、投光部３６と受光部３７とは、略円柱状として、投光部３６で照射した光を先端面１１ｂで反射させて受光部３７で受光できるように、先端のレンズ部３６ａ，３７ａを、下電極チップ１１Ｂの先端面１１ｂの中央１１ｂｂに向けている。詳しくは、投光部３６と受光部３７とは、相互の軸心Ｂ１，Ｂ２が、中央１１ｂｂを相互の交点とし、かつ、上電極チップ１１Ｕと下電極チップ１１Ｂとの軸心Ｘを中心線として、線対称となるように、配設されている。さらに、実施形態の場合、投光部３６と受光部３７とは、軸心Ｂ１，Ｂ２相互を直交交差させるように、配設されている。   Further, as shown in FIGS. 6 to 8, the light projecting unit 36 and the light receiving unit 37 of the lower optical sensor 33 do not enter the facing space H <b> 0 and around the facing space H <b> 0, the lower electrode chip 11 </ b> B. It is arranged so as to be directed obliquely downward with respect to the front end surface 11 b of the, and is stored and held in the mounting holes 47 and 48 of the holder 40. In the case of the embodiment, the light projecting unit 36 and the light receiving unit 37 are substantially cylindrical, and the front lens unit is configured so that the light irradiated by the light projecting unit 36 is reflected by the front end surface 11 b and can be received by the light receiving unit 37. 36a and 37a are directed toward the center 11bb of the tip surface 11b of the lower electrode chip 11B. More specifically, the light projecting unit 36 and the light receiving unit 37 are configured such that the mutual axis centers B1 and B2 have the center 11bb as a crossing point and the axis X between the upper electrode chip 11U and the lower electrode chip 11B is the center line. As shown in FIG. Further, in the case of the embodiment, the light projecting unit 36 and the light receiving unit 37 are arranged so that the axis centers B1 and B2 intersect each other at right angles.

なお、実施形態のレンズ部２６ａ，２７ａ，３６ａ，３７ａは、ホウ素シリカガラス等のガラス製としたボールレンズから構成されている。   In addition, the lens parts 26a, 27a, 36a, and 37a of the embodiment are configured by ball lenses made of glass such as boron silica glass.

そして、ホルダ４０は、少なくとも対向スペースＨ０を空けるように、円形に開口させた貫通孔４１を設け、かつ、貫通孔４１の周囲を囲む部位（周壁部）４２で、上側用光センサ２３と下側用光センサ３３との投光部２６，３６及び受光部２７，３７を、取付孔４５，４６，４７，４８を利用して、保持する構成としている。   The holder 40 is provided with a through-hole 41 that is opened in a circular shape so as to open at least the facing space H0, and at a portion (peripheral wall portion) 42 that surrounds the periphery of the through-hole 41, The light projecting portions 26 and 36 and the light receiving portions 27 and 37 with the side optical sensor 33 are configured to be held using the mounting holes 45, 46, 47 and 48.

さらに、実施形態の場合、取付孔４５，４６が、取付孔４７，４８の下方で、ホルダ４０の左右方向に沿った貫通孔４１の中心Ｏを通る縦断面で、上下で重なるように配置されている。すなわち、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７が、上側用光センサ２３の投光部２６，受光部２７を下側用光センサ３３の投光部３６，受光部３７より下方に配置させつつ、上下方向で重なるように（平面視で重なるように）配置されて、ホルダ４０に保持されている。   Further, in the case of the embodiment, the mounting holes 45 and 46 are arranged below the mounting holes 47 and 48 so as to overlap vertically in a vertical cross section passing through the center O of the through hole 41 along the horizontal direction of the holder 40. ing. That is, the light projecting portions 26 and 36 and the light receiving portions 27 and 37 of the upper light sensor 23 and the lower light sensor 33 are used as the light projecting portion 26 and the light receiving portion 27 of the upper light sensor 23. The light emitting unit 36 and the light receiving unit 37 are arranged below the light projecting unit 36 and the light receiving unit 37 so as to overlap in the vertical direction (so as to overlap in a plan view) and are held by the holder 40.

さらにまた、ホルダ４０は、上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂの良否判定時における先端面１１ｂ，１１ｂ相互の接近時、各拡径部１１ｃ，１１ｃを受け止め可能に、上電極チップ１１Ｕと下電極チップ１１Ｂとの各拡径部１１ｃ，１１ｃに対応した凹形状とした受け座４３，４４、を備え、受け座４３，４４の中央に、貫通孔４１を配設している。   Furthermore, the holder 40 can receive the enlarged diameter portions 11c and 11c when the tip surfaces 11b and 11b approach each other when the tip surfaces 11b of the upper electrode tip 11U and the lower electrode tip 11B are judged good or bad. Recessed receiving seats 43 and 44 corresponding to the enlarged diameter portions 11c and 11c of the tip 11U and the lower electrode tip 11B are provided, and the through hole 41 is disposed in the center of the receiving seats 43 and 44. .

実施形態の場合、貫通孔４１は、図７，８に示すように、内径ｄを、先端面１１ｂの直径Ｄ１（６φ）より大きな８φとし、貫通孔４１の長さ寸法Ｌを約１１ｍｍとしている。なお、実施形態の場合、受け座４３，４４で受け止めた上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂ相互の離隔距離ＳＬが、長さ寸法Ｌより小さな約１０ｍｍ（詳しくは９．８９ｍｍ）としている。換言すれば、良否判定時に、上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂ相互が、確実に、貫通孔４１内に侵入して、対向するように、受け座４３，４４の中央の貫通孔４１の内径ｄを、先端面１１ｂの直径Ｄ１より大きくしており、その結果、受け座４３，４４で受け止めた上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂ相互の離隔距離ＳＬが、長さ寸法Ｌより小さな寸法となる。   In the case of the embodiment, as shown in FIGS. 7 and 8, in the through hole 41, the inner diameter d is 8φ larger than the diameter D1 (6φ) of the tip surface 11b, and the length dimension L of the through hole 41 is about 11 mm. . In the case of the embodiment, the separation distance SL between the tip surfaces 11b of the upper electrode tip 11U and the lower electrode tip 11B received by the receiving seats 43 and 44 is about 10 mm (more specifically, 9.89 mm, which is smaller than the length L). ). In other words, at the time of pass / fail judgment, the front end surfaces 11b of the upper electrode tip 11U and the lower electrode tip 11B surely enter the through-hole 41 and face each other so as to face each other. The inner diameter d of the through hole 41 is larger than the diameter D1 of the front end surface 11b. As a result, the separation distance SL between the front end surface 11b of the upper electrode tip 11U and the lower electrode tip 11B received by the receiving seats 43 and 44. Is smaller than the length L.

検査部Ｓに設けられたカバー５０は、投光部２６，３６や受光部２７，３７から延びる光ファイバー２５，２８，３５，３８を隠して、ホルダ４０に取り付けらている。   The cover 50 provided in the inspection unit S is attached to the holder 40 while hiding the optical fibers 25, 28, 35, 38 extending from the light projecting units 26, 36 and the light receiving units 27, 37.

そして、光ファイバー２５，２８，３５，３８は、ネック５２、ボディ５４の挿通孔５６を通り、可撓性を有したチューブ６２，６３に覆われて、判定部Ｊまで延びている。   The optical fibers 25, 28, 35, and 38 pass through the neck 52 and the insertion hole 56 of the body 54, are covered with flexible tubes 62 and 63, and extend to the determination unit J.

また、検査部Ｓは、工場エアを利用可能なニップル６０をボディ５４の後端面に配置させ、さらに、ニップル６０から貫通孔４１まで延びるエア孔５８を貫通させており、適宜、貫通孔４１内のゴミを、工場エアを利用して、除去できるように構成されている。   Further, the inspection unit S arranges a nipple 60 that can use factory air on the rear end surface of the body 54 and further passes an air hole 58 extending from the nipple 60 to the through hole 41. It is configured to be able to remove the garbage using factory air.

実施形態の良否判定装置Ｍの使用状態を説明すると、まず、溶接ロボット１が所定回数のスポット溶接を行えば、制御装置３が、サーボガン５を移動させて、上電極チップ１１Ｕと下電極チップ１１Ｂとを、チップドレッサ１８を利用して切削する。そして、切削後の先端面１１ｂの良否を判定するように、制御装置３が、サーボガン５を移動させつつ、所定のサーボモータ６や図示しないサーボモータを作動させて、上電極チップ１１Ｕと下電極チップ１１Ｂとを、上下で対向させ、さらに、電極チップ１１の軸心Ｘを貫通孔４１との中心Ｏに一致させつつ、相互に接近させて、良否判定装置Ｍの検査部Ｓにおけるホルダ４０の上下の受け座４３，４４に、各拡径部１１ｃを当てる。   The usage state of the quality determination device M of the embodiment will be described. First, when the welding robot 1 performs spot welding a predetermined number of times, the control device 3 moves the servo gun 5 to move the upper electrode tip 11U and the lower electrode tip 11B. Are cut using the tip dresser 18. Then, the control device 3 operates the predetermined servo motor 6 or a servo motor (not shown) while moving the servo gun 5 so as to determine the quality of the tip end surface 11b after cutting, so that the upper electrode tip 11U and the lower electrode The tip 11B is vertically opposed to each other, and further, the axis X of the electrode tip 11 is brought close to each other while being aligned with the center O of the through-hole 41, and the holder 40 in the inspection section S of the pass / fail judgment device M is moved. Each enlarged diameter portion 11c is applied to the upper and lower receiving seats 43, 44.

この時、良否判定装置Ｍでは、上側用光センサ２３，下側用光センサ３３が、それぞれ、投光部２６，３６から対応する先端面１１ｂ，１１ｂに光を照射して、受光部２７，３７で反射した光を受光する。そして、それらの反射光の強弱が、所定の閾値より上であれば、判定部Ｊで良と判定し、下であれば不良と判定する。具体的に述べれば、上電極チップ１１Ｕや下電極チップ１１Ｂの先端面１１ｂが溶接に好適である場合には、受光部２７，３７で受光する光量が所定の閾値より高いことから、ＯＫランプ７２ａ，７２ｃが点灯し、逆に、受光部２７，３７で受光する光量が所定の閾値より低い場合には、ＮＧランプ７２ｂ，７２ｄが点灯する。   At this time, in the pass / fail determination apparatus M, the upper optical sensor 23 and the lower optical sensor 33 irradiate the corresponding front end surfaces 11b and 11b from the light projecting units 26 and 36, respectively. The light reflected at 37 is received. Then, if the intensity of the reflected light is above a predetermined threshold value, the determination unit J determines that it is good, and if it is lower, it determines that it is defective. More specifically, when the tip surface 11b of the upper electrode tip 11U or the lower electrode tip 11B is suitable for welding, the amount of light received by the light receiving portions 27 and 37 is higher than a predetermined threshold value, so the OK lamp 72a , 72c is lit, and conversely, when the light quantity received by the light receiving units 27, 37 is lower than a predetermined threshold, the NG lamps 72b, 72d are lit.

なお、実施形態の場合には、常時、投光部２６，３６から光が照射されており、通常時に、既に、ＮＧランプ７２ｂ，７２ｄが点灯しており、サーボガン５が、上電極チップ１１Ｕと下電極チップ１１Ｂとの拡径部１１ｃをホルダ４０の受け座４３，４４に押し付けた際の所定時間（約０．３〜０．５秒程度）の間で、先端面１１ｂが良好であれば、ＯＫランプ７２ａ，７２ｃが点灯することとなる。   In the case of the embodiment, light is always emitted from the light projecting units 26 and 36, and the NG lamps 72b and 72d are already lit in the normal state, and the servo gun 5 is connected to the upper electrode chip 11U. If the distal end surface 11b is good for a predetermined time (about 0.3 to 0.5 seconds) when the diameter-enlarged portion 11c with the lower electrode tip 11B is pressed against the receiving seats 43 and 44 of the holder 40 OK lamps 72a and 72c are turned on.

そして、上電極チップ１１Ｕと下電極チップ１１Ｂの先端面１１ｂが溶接に適すれば、制御装置３は、溶接ロボット１を次の溶接作業を行うように動作させ、上電極チップ１１Ｕと下電極チップ１１Ｂとの少なくとも一方が、不良と判定されれば、制御装置３が、判定部Ｊの出力回路からの不良の信号を入力して、少なくとも１回はチップドレッサ１８で上電極チップ１１Ｕと下電極チップ１１Ｂとを切削し直して、再度、良否を判定し、その判定時、良と判定されれば、次の溶接作業に移行し、再度、不良と判定されれば、図示しないチップ抜き装置やチップ供給装置にサーボガン５を移動させて、上電極チップ１１Ｕと下電極チップ１１Ｂとを共に交換し、次の溶接作業に移行する。   If the tip surface 11b of the upper electrode tip 11U and the lower electrode tip 11B is suitable for welding, the control device 3 operates the welding robot 1 to perform the next welding operation, and the upper electrode tip 11U and the lower electrode tip If it is determined that at least one of 11B is defective, the control device 3 inputs a failure signal from the output circuit of the determination unit J, and at least once, the chip dresser 18 uses the upper electrode chip 11U and the lower electrode. The chip 11B is cut again to determine whether it is good or not. If it is determined that the chip 11B is good, the process proceeds to the next welding operation. The servo gun 5 is moved to the tip supply device, the upper electrode tip 11U and the lower electrode tip 11B are exchanged together, and the next welding operation is started.

そして、実施形態の良否判定装置Ｍの検査部Ｓでは、図６に示すように、上側用光センサ２３，下側用光センサ３３の投光部２６，３６と受光部２７，３７が、対向スペースＨ０内に侵入させずに、対向スペースＨ０の周りで、ホルダ４０に保持されている。さらに、ホルダ４０も、少なくとも上下で対向する先端面１１ｂ，１１ｂ相互間に対向スペースＨ０を空けるように、貫通孔４１を設けて、貫通孔４１の周囲を囲む周壁部４２で、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７を保持する構成としている。   And in the inspection part S of the quality determination apparatus M of embodiment, as shown in FIG. 6, the light projection parts 26 and 36 and the light-receiving parts 27 and 37 of the upper side optical sensor 23 and the lower side optical sensor 33 face each other. Without entering the space H0, the holder 40 is held around the opposing space H0. Further, the holder 40 is also provided with a through-hole 41 so as to open a facing space H0 between the tip surfaces 11b, 11b facing each other at least vertically, and the upper side optical sensor includes a peripheral wall portion 42 surrounding the periphery of the through-hole 41. 23, the light projecting units 26 and 36 and the light receiving units 27 and 37 of the lower optical sensor 33 are held.

そのため、上電極チップ１１Ｕの先端１１ａ側に付着しているゴミや水滴ＤＷ（図６参照）が落下しても、それらのゴミや水滴ＤＷは、拡径部１１ｃを伝って、先細りの先端面１１ｂの部位から落下することとなり、貫通孔４１を通過する。その結果、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７には、それらのゴミや水滴ＤＷが付着し難くなって、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７を清掃する等のメンテナンスが不要となり、手間無く、長期間にわたって、良否判定装置Ｍを使用することが可能となる。   Therefore, even if dust or water droplets DW (see FIG. 6) adhering to the tip 11a side of the upper electrode tip 11U fall, the dust or water droplets DW travel along the diameter-enlarged portion 11c and taper the tip surface. It falls from the part 11b and passes through the through hole 41. As a result, it is difficult for the dust and water droplets DW to adhere to the light projecting units 26 and 36 and the light receiving units 27 and 37 of the upper optical sensor 23 and the lower optical sensor 33, and the upper optical sensor 23, Maintenance such as cleaning the light projecting units 26 and 36 and the light receiving units 27 and 37 of the lower optical sensor 33 is not required, and it is possible to use the pass / fail judgment device M for a long time without trouble.

また、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７は、上下で対向する上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂ，１１ｂ相互の間の対向スペースＨ０の周囲、すなわち、ホルダ４０の貫通孔４１の周囲の周壁部４２に、保持されている。換言すれば、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７が、一つの環状のホルダ４０に保持されて、保持部位を共用できることから、検査部Ｓは、その構造をシンプルでコンパクトに構成できる。また、貫通孔４１の内周面４２ａに先端のレンズ部２６ａ，２７ａ，３６ａ，３７ａを露出させて配置させる際、その貫通孔４１の内周面４２ａを、極力、対向スペースＨ０に侵入しない状態で、対向スペースＨ０に接近させる配置とすれば、一層、ホルダ４０自体をコンパクトに構成できて、検査部Ｓは、上下で対向している電極チップ１１，１１の先端面１１ｂ，１１ｂ相互の周囲で、コンパクトに配置できることとなる。   Further, the light projecting portions 26 and 36 and the light receiving portions 27 and 37 of the upper photosensor 23 and the lower photosensor 33 are mutually opposite to the front end surfaces 11b and 11b of the upper electrode chip 11U and the lower electrode chip 11B which are opposed to each other in the vertical direction. Is held by the peripheral wall portion 42 around the through space 41 of the holder 40, that is, around the through hole 41 of the holder 40. In other words, the light projecting portions 26 and 36 and the light receiving portions 27 and 37 of the upper side optical sensor 23 and the lower side optical sensor 33 are held by one annular holder 40 so that the holding portion can be shared. The part S can be configured simply and compactly. In addition, when the tip lens portions 26a, 27a, 36a, and 37a are arranged so as to be exposed on the inner peripheral surface 42a of the through hole 41, the inner peripheral surface 42a of the through hole 41 does not enter the opposing space H0 as much as possible. Thus, if the arrangement is made to approach the facing space H0, the holder 40 itself can be made more compact, and the inspection section S can be arranged around the tip surfaces 11b, 11b of the electrode chips 11, 11 facing each other vertically. Thus, it can be arranged in a compact manner.

特に、実施形態の場合には、投光部２６，３６や受光部２７，３７の先端、すなわち、レンズ部２６ａ，２７ａ，３６ａ，３７ａが、上下で対向する電極チップ１１，１１の元部１１ｄより外方に離れるように位置せず、極力、対向スペースＨ０に接近して、上下で対向する電極チップ１１，１１の拡径部１１ｃ，１１ｃ相互間のスペースＨ１に侵入するように、配置されている。なお、このスペースＨ１は、円柱状の対向スペースＨ０の周囲を囲む円筒状のスペースである。   In particular, in the case of the embodiment, the tip portions of the light projecting portions 26 and 36 and the light receiving portions 27 and 37, that is, the lens portions 26a, 27a, 36a, and 37a are the base portions 11d of the electrode chips 11 and 11 that are vertically opposed to each other. It is arranged so as not to be further away from the outside but to approach the opposing space H0 as much as possible and enter the space H1 between the enlarged diameter portions 11c and 11c of the electrode tips 11 and 11 opposed vertically. ing. The space H1 is a cylindrical space that surrounds the periphery of the columnar opposing space H0.

したがって、実施形態の電極チップの良否判定装置Ｍでは、手間無く使用できるとともに、光センサの投光部２６，３６と受光部２７，３７を配設させる検査部Ｓを、コンパクトに構成できる。   Therefore, the electrode chip quality determination device M of the embodiment can be used without any trouble, and the inspection unit S in which the light projecting units 26 and 36 and the light receiving units 27 and 37 of the optical sensor can be configured compactly.

また、実施形態では、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７が、上側用光センサ２３の投光部２６，受光部２７を下側用光センサ３３の投光部３６，受光部３７より下方に配置させつつ、上下方向で重なるように配置させて、ホルダ４０に保持されている。   In the embodiment, the light projecting units 26 and 36 and the light receiving units 27 and 37 of the upper photosensor 23 and the lower photosensor 33 are lower than the light projecting unit 26 and the light receiving unit 27 of the upper photosensor 23. While being disposed below the light projecting unit 36 and the light receiving unit 37 of the optical sensor 33, the optical sensor 33 is disposed so as to overlap in the vertical direction and is held by the holder 40.

このような構成では、まず、上側用光センサ２３の投光部２６，受光部２７と下側用光センサ３３の投光部３６，受光部３７が、相互に、上下で重なって配置されることから、重なった面（実施形態では左右方向に沿った縦断面となる）と直交する水平方向には、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７が配置されず、その部分のホルダ４０の奥行き寸法ＢＬ（実施形態では前後方向の寸法となる、図７参照）を小さくコンパクトにできる。   In such a configuration, first, the light projecting unit 26 and the light receiving unit 27 of the upper photosensor 23 and the light projecting unit 36 and the light receiving unit 37 of the lower photosensor 33 are arranged so as to overlap each other. Therefore, in the horizontal direction orthogonal to the overlapping surface (in the embodiment, a vertical cross section along the left-right direction), the light projecting units 26 and 36 and the light receiving unit of the upper photosensor 23 and the lower photosensor 33. 27 and 37 are not arranged, and the depth dimension BL (the dimension in the front-rear direction in the embodiment, see FIG. 7) of the holder 40 at that portion can be made small and compact.

さらに、このような構成では、上側用光センサ２３の投光部２６，受光部２７が下側用光センサ３３の投光部３６，受光部３７より下方に配置されている。そのため、図６に示すように、上側用光センサ２３の投光部２６から照射されて上電極チップ１１Ｕの先端面１１ｂで反射し、そして、受光部２７で受光する光の跡（光跡）ＢＬＵと、下側用光センサ３３の投光部３６から照射されて下電極チップ１１Ｂの先端面１１ｂで反射し、そして、受光部３７で受光される光の跡（光跡）ＢＬＢと、は、上側用光センサ２３の投光部２６，受光部２７と下側用光センサ３３の投光部３６，受光部３７との上下で重なった面と直交する水平方向から見て、レンズ部２６ａ，３６ａ付近やレンズ部２７ａ，３７ａ付近で、相互にクロスする状態となる。すなわち、上記と上下を逆にする場合、換言すれば、上側用光センサ２３の投光部２６，受光部２７を下側用光センサ３３の投光部３６，受光部３７より上方に配置させる場合、に比べて、上記の構成では、光跡ＢＬＵ、ＢＬＢのクロスする寸法ＣＬ分、投・受光部を保持するホルダ４０の上下方向の厚さ寸法Ｔを可及的に小さくできて、ホルダ４０の上下方向の寸法をコンパクトできる。   Further, in such a configuration, the light projecting unit 26 and the light receiving unit 27 of the upper photosensor 23 are disposed below the light projecting unit 36 and the light receiving unit 37 of the lower photosensor 33. Therefore, as shown in FIG. 6, a trace (light trace) of light that is irradiated from the light projecting unit 26 of the upper optical sensor 23, reflected by the front end surface 11 b of the upper electrode chip 11 U, and received by the light receiving unit 27. The BLU and the trace (light trace) BLB of the light irradiated from the light projecting portion 36 of the lower optical sensor 33, reflected by the tip surface 11b of the lower electrode chip 11B, and received by the light receiving portion 37 are: When viewed from the horizontal direction perpendicular to the upper and lower surfaces of the light projecting unit 26 and the light receiving unit 27 of the upper optical sensor 23 and the light projecting unit 36 and the light receiving unit 37 of the lower optical sensor 33, the lens unit 26a. , 36a or near the lens portions 27a, 37a. That is, when the above is turned upside down, in other words, the light projecting unit 26 and the light receiving unit 27 of the upper photosensor 23 are disposed above the light projecting unit 36 and the light receiving unit 37 of the lower photosensor 33. As compared with the case, in the above configuration, the vertical dimension T of the holder 40 holding the light projecting / receiving unit can be made as small as possible by the dimension CL of the crossing of the light traces BLU and BLB. The vertical dimension of 40 can be made compact.

したがって、実施形態では、ホルダ４０の上下方向の厚さ寸法Ｔや、センサ相互の重なった面と直交するホルダ４０の奥行き寸法ＢＬを小さくすることができて、一層、検査部Ｓをコンパクトに構成できる。   Therefore, in the embodiment, the thickness dimension T of the holder 40 in the vertical direction and the depth dimension BL of the holder 40 perpendicular to the surface where the sensors overlap each other can be reduced, and the inspection unit S is further compactly configured. it can.

さらに、実施形態では、ホルダ４０に、上電極チップ１１Ｕと下電極チップ１１Ｂとの先端面１１ｂ，１１ｂの良否判定時における先端面１１ｂ，１１ｂ相互の接近時、各拡径部１１ｃ，１１ｃを受け止め可能に、上電極チップ１１Ｕと下電極チップ１１Ｂとの各拡径部１１ｃに対応した凹形状とした受け座４３，４４、を設け、受け座４３，４４の中央に、貫通孔４１を配設している。   Further, in the embodiment, the enlarged diameter portions 11c and 11c are received by the holder 40 when the tip surfaces 11b and 11b approach each other when the tip surfaces 11b and 11b of the upper electrode tip 11U and the lower electrode tip 11B are judged good or bad. The receiving seats 43 and 44 having a concave shape corresponding to the respective enlarged diameter portions 11c of the upper electrode tip 11U and the lower electrode tip 11B are provided, and the through hole 41 is disposed in the center of the receiving seats 43 and 44. is doing.

そのため、実施形態では、良否判定時、上電極チップ１１Ｕと下電極チップ１１Ｂとを相互に接近させて、ホルダ４０の対応する受け座４３，４４に各拡径部１１ｃを当てれば、上電極チップ１１Ｕと下電極チップ１１Ｂとの各先端面１１ｂが、貫通孔４１の上下の開口付近に、安定して配置される。すなわち、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７に対する上電極チップ１１Ｕ，下電極チップ１１Ｂの各先端面１１ｂの配置位置を、判定毎に安定させることができて、良否判定の精度を向上させることができる。換言すれば、判定毎に、投光部２６と受光部２７との軸心Ｕ１，Ｕ２相互の交点を先端面１１ｂの中央１１ｂｕに合致させ、かつ、投光部３６と受光部３７との軸心Ｂ１，Ｂ２相互の交点を先端面１１ｂの中央１１ｂｂに合致させることができて、各受光部２７，３８が的確に反射光を受光できて、良否判定の精度を向上させることができる。   Therefore, in the embodiment, when the quality determination is made, the upper electrode tip 11U and the lower electrode tip 11B are brought close to each other, and the respective enlarged diameter portions 11c are applied to the corresponding receiving seats 43 and 44 of the holder 40. The respective end surfaces 11b of 11U and the lower electrode chip 11B are stably disposed in the vicinity of the upper and lower openings of the through hole 41. That is, for each determination, the arrangement positions of the tip surfaces 11b of the upper electrode chip 11U and the lower electrode chip 11B with respect to the light projecting units 26 and 36 and the light receiving units 27 and 37 of the upper photosensor 23 and the lower photosensor 33 are determined. It can be stabilized, and the accuracy of pass / fail judgment can be improved. In other words, for each determination, the intersection of the axial centers U1 and U2 of the light projecting unit 26 and the light receiving unit 27 is made to coincide with the center 11bu of the tip surface 11b, and the axis of the light projecting unit 36 and the light receiving unit 37 The intersection between the centers B1 and B2 can be made to coincide with the center 11bb of the tip surface 11b, and the respective light receiving portions 27 and 38 can accurately receive the reflected light, thereby improving the accuracy of the quality determination.

さらにまた、実施形態では、上側用光センサ２３，下側用光センサ３３の投光部２６，３６及び受光部２７，３７は、それぞれ、先端のレンズ部２６ａ，２７ａ，３６ａ，３７ａを、ホウ素シリカガラス等のガラス製としている。すなわち、先端のレンズ部２６ａ，２７ａ，３６ａ，３７ａは、ポリカーボネイト等の合成樹脂製とすることもできるが、ホウ素シリカガラス等のガラス製とすれば、耐油性に優れ、また、汚れを拭き取る清掃時等に傷付き難いことから、上側用光センサ２３，下側用光センサ３３の耐久性を向上させることができる。   Furthermore, in the embodiment, the light projecting units 26 and 36 and the light receiving units 27 and 37 of the upper side optical sensor 23 and the lower side optical sensor 33 are respectively connected to the tip lens units 26a, 27a, 36a, and 37a with boron. It is made of glass such as silica glass. That is, the lens portions 26a, 27a, 36a, and 37a at the front end can be made of synthetic resin such as polycarbonate, but if made of glass such as boron silica glass, it is excellent in oil resistance and cleaning to wipe off dirt. Since it is difficult to be damaged at times, the durability of the upper optical sensor 23 and the lower optical sensor 33 can be improved.

なお、実施形態では、上側用光センサ２３と下側用光センサ３３との投光部２６，３６を、貫通孔４１の中心Ｏを中心線として、同じ側に配置させたが、投光部２６，３６は、相互に反対側に配置させてもよい。   In the embodiment, the light projecting portions 26 and 36 of the upper light sensor 23 and the lower light sensor 33 are arranged on the same side with the center O of the through hole 41 as the center line. 26 and 36 may be disposed on opposite sides of each other.

また、実施形態では、上側用光センサ２３，下側用光センサ３３では、光源を赤外線を照射するＬＥＤを使用したが、他の可視光等を照射したり、あるいは、レーザ光を照射するものを使用してもよい。   In the embodiment, the upper side optical sensor 23 and the lower side optical sensor 33 use LEDs that irradiate infrared rays as a light source. However, other visible light or other laser light is emitted. May be used.

５…（溶接ガン）サーボガン、
１１…電極チップ、
１１Ｕ…上電極チップ、
１１Ｂ…下電極チップ、
１１ｂ…（電極チップの）先端面、
１１ｃ…（電極チップの）拡径部、
１１ｄ…（電極チップの）元部、
２３…上側用光センサ、
２６…（上側用光センサの）投光部、
２６ａ…レンズ部、
２７…（上側用光センサの）受光部、
２７ａ…レンズ部、
３３…下側用光センサ、
３６…（下側用光センサの）投光部、
３６ａ…レンズ部、
３７…（下側用光センサの）受光部、
３７ａ…レンズ部、
４０…ホルダ、
４１…貫通孔、
４２…（貫通孔の周囲の部位）周壁部、
４２ａ…内周面、
４３，４４…受け座、
Ｍ…良否判定装置、
Ｓ…検査部、
Ｊ…判定部、
Ｘ…（電極チップの）軸心、
Ｈ０…（先端面１１ｂ間の）対向スペース。 5 ... (Welding gun) Servo gun,
11 ... electrode tip,
11U ... Upper electrode tip,
11B ... lower electrode tip,
11b ... (front end surface of electrode tip),
11c ... enlarged diameter part (of electrode tip),
11d ... the base of the electrode tip,
23 ... Optical sensor for upper side,
26: Light projecting unit (of the upper side optical sensor),
26a ... lens part,
27 ... Light receiving part (of the upper side optical sensor),
27a ... Lens part,
33 ... lower side optical sensor,
36 ... Light projecting part (of the lower side optical sensor),
36a ... Lens part,
37 ... light receiving part (of the lower side optical sensor),
37a ... lens part,
40 ... Holder,
41 ... through hole,
42 ... (part around the through-hole) peripheral wall,
42a ... inner peripheral surface,
43, 44 ...
M: Pass / fail judgment device,
S ... Inspection department,
J: Determination unit,
X ... axis of electrode tip
H0 ... Opposite space (between the end faces 11b).

Claims (4)

溶接ガンに保持される一対の電極チップが、ワークに当接する先端面から元部側にかけて拡径するように、形成され、
前記電極チップの前記先端面の良否を、光センサの投光部からの光を前記先端面に照射して、前記光センサの受光部で受光した反射光の強弱により、判定する電極チップの良否判定装置であって、
前記光センサが、一対の前記電極チップ相互の前記先端面を上下で対向するように配置させた際の上側の上電極チップの先端面の良否判定用の上側用光センサと、下側の下電極チップの先端面の良否判定用の下側用光センサと、の二組使用され、
良否判定時に相互に接近させる前記上電極チップと前記下電極チップとの周囲に、前記上側用，下側用光センサの前記投光部及び前記受光部と、前記上側用，下側用光センサの前記投光部及び前記受光部を保持するホルダと、を備えてなる検査部、を配設させる構成として、
前記上側用光センサの前記投光部と前記受光部とが、前記上電極チップと前記下電極チップとの上下で対向する前記先端面相互間の対向スペース内に侵入させずに、前記対向スペースの周りで、前記上電極チップの先端面に対し、前記電極チップの軸心を中心線として相互に線対称の斜め上向きに、先端のレンズ部を向けた配置として、ホルダに保持され、
前記下側用光センサの前記投光部と前記受光部とが、前記対向スペース内に侵入させずに、前記対向スペースの周りで、前記下電極チップの先端面に対し、前記電極チップの軸心を中心線として相互に線対称の斜め下向きに、先端のレンズ部を向けた配置として、前記ホルダに保持され、
前記ホルダが、少なくとも前記対向スペースを空けるように、貫通孔を設け、かつ、該貫通孔の周囲を囲む部位で、前記上側用，下側用光センサの前記投光部及び前記受光部を、保持する構成としていることを特徴とする電極チップの良否判定装置。 A pair of electrode tips held by the welding gun is formed so as to expand in diameter from the front end surface contacting the workpiece to the base portion side,
The quality of the tip of the electrode chip is judged based on the intensity of the reflected light received by the light receiving portion of the photosensor by irradiating the tip surface with light from the light projecting portion of the photosensor. A determination device,
When the optical sensor is disposed so that the distal end surfaces of the pair of electrode chips are opposed to each other vertically, an upper optical sensor for determining the quality of the distal end surface of the upper upper electrode chip, and a lower lower portion Two sets of the lower side optical sensor for pass / fail judgment of the tip surface of the electrode tip are used,
Around the upper electrode chip and the lower electrode chip that are brought close to each other at the time of pass / fail judgment, the light projecting unit and the light receiving unit of the upper and lower photosensors, and the upper and lower photosensors And a holder for holding the light projecting unit and the light receiving unit, and a configuration for disposing an inspection unit,
The light projecting unit and the light receiving unit of the upper optical sensor do not enter the facing space between the tip surfaces facing the top and bottom surfaces of the upper electrode chip and the lower electrode chip. Around the tip surface of the upper electrode tip, the tip of the lens part is held obliquely upward and symmetrically about the axis of the electrode tip as a center line, and held by the holder,
The light projecting portion and the light receiving portion of the lower photosensor are not intruded into the facing space, but around the facing space with respect to the tip surface of the lower electrode tip. It is held by the holder as an arrangement in which the lens portion at the tip is directed obliquely downward with line symmetry with respect to the center as a center line,
The holder is provided with a through-hole so as to open at least the facing space, and at the portion surrounding the periphery of the through-hole, the light projecting unit and the light receiving unit of the upper and lower photosensors, An electrode chip pass / fail judgment device characterized by having a configuration of holding. 前記上側用，下側用光センサの前記投光部及び前記受光部が、前記上側用光センサの前記投，受光部を前記下側用光センサの前記投，受光部より下方に配置させつつ、上下方向で重なるように配置されて、前記ホルダに保持されていることを特徴とする請求項１に記載の電極チップの良否判定装置。   The light projecting unit and the light receiving unit of the upper and lower light sensors are arranged below the light projecting and light receiving units of the lower light sensor while the light projecting and light receiving units of the upper light sensor are arranged below The electrode chip pass / fail judgment device according to claim 1, wherein the electrode tip pass / fail judgment device is arranged so as to overlap in the vertical direction and is held by the holder. 前記ホルダが、前記上電極チップと前記下電極チップとの先端面の良否判定時における先端面相互の接近時、前記各拡径部を受け止め可能に、前記上電極チップと前記下電極チップとの前記各拡径部に対応した凹形状とした受け座、を備え、該受け座の中央に、前記貫通孔を配設していることを特徴とする請求項１若しくは請求項２に記載の電極チップの良否判定装置。   When the holders are close to each other at the front end surfaces when determining the quality of the front end surfaces of the upper electrode tip and the lower electrode tip, the holder can receive the respective enlarged diameter portions, and the upper electrode tip and the lower electrode tip The electrode according to claim 1, further comprising a receiving seat having a concave shape corresponding to each of the enlarged diameter portions, wherein the through hole is disposed at a center of the receiving seat. Chip pass / fail judgment device. 前記上側用，下側用光センサの前記投，受光部が、それぞれ、先端の前記レンズ部を、ガラス製としていることを特徴とする請求項１乃至請求項３のいずれか１項に記載の電極チップの良否判定装置。   4. The light emitting and receiving portions of the upper and lower photosensors each have a lens portion at the tip made of glass, respectively. 5. Electrode chip pass / fail judgment device.
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KR1020110067733A KR101859091B1 (en) 2011-02-22 2011-07-08 Apparatus of determining normal/defective condition of electrode chip
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