KR20120091460A - 복사 방출 반도체 소자 - Google Patents

복사 방출 반도체 소자 Download PDF

Info

Publication number
KR20120091460A
KR20120091460A KR1020127019084A KR20127019084A KR20120091460A KR 20120091460 A KR20120091460 A KR 20120091460A KR 1020127019084 A KR1020127019084 A KR 1020127019084A KR 20127019084 A KR20127019084 A KR 20127019084A KR 20120091460 A KR20120091460 A KR 20120091460A
Authority
KR
South Korea
Prior art keywords
layer
radiation
functional layer
light emitting
conversion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127019084A
Other languages
English (en)
Korean (ko)
Inventor
크리스터 베르게넥
미카엘 알슈테트
우테 리폴트
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20120091460A publication Critical patent/KR20120091460A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/8215Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
KR1020127019084A 2009-12-21 2010-12-13 복사 방출 반도체 소자 Withdrawn KR20120091460A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102009059878.2 2009-12-21
DE102009059878 2009-12-21
DE102010005169A DE102010005169A1 (de) 2009-12-21 2010-01-20 Strahlungsemittierendes Halbleiterbauelement
DE102010005169.1 2010-01-20

Publications (1)

Publication Number Publication Date
KR20120091460A true KR20120091460A (ko) 2012-08-17

Family

ID=43589405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019084A Withdrawn KR20120091460A (ko) 2009-12-21 2010-12-13 복사 방출 반도체 소자

Country Status (7)

Country Link
US (1) US9842972B2 (enExample)
EP (1) EP2517270B1 (enExample)
JP (1) JP2013515364A (enExample)
KR (1) KR20120091460A (enExample)
CN (1) CN102656713A (enExample)
DE (1) DE102010005169A1 (enExample)
WO (1) WO2011085889A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037968A1 (ko) * 2013-09-16 2015-03-19 주식회사 엘지화학 광 산란 시트, 이를 포함하는 전자 소자 및 이의 제조방법
KR20180111555A (ko) * 2017-03-31 2018-10-11 이노럭스 코포레이션 디스플레이 장치

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011113777A1 (de) * 2011-09-19 2013-03-21 Osram Opto Semiconductors Gmbh Wellenlängenkonversionselement und Licht emittierendes Halbleiterbauelement mit Wellenlängenkonversionselement
DE102011114641B4 (de) 2011-09-30 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102011116230B4 (de) 2011-10-17 2018-10-25 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Halbleiterbauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements
DE102012206970A1 (de) * 2012-04-26 2013-10-31 Osram Gmbh Optische vorrichtung und beleuchtungseinrichtung
DE102012216552A1 (de) * 2012-09-17 2014-03-20 Osram Gmbh Herstellen einer LED-Leuchtvorrichtung mit Konverterschicht
US20150333233A1 (en) * 2012-12-28 2015-11-19 Takashi Washizu Light emitting device
JP6622090B2 (ja) * 2013-01-16 2019-12-18 ルミレッズ ホールディング ベーフェー 発光サファイアをダウンコンバータとして使用するled
DE202013101400U1 (de) * 2013-04-02 2014-07-03 Zumtobel Lighting Gmbh Anordnung zum Konvertieren des von einer LED-Lichtquelle emittierten Lichts
TWI581462B (zh) * 2013-06-03 2017-05-01 晶元光電股份有限公司 發光元件及其製造方法
CN104241491B (zh) * 2013-06-07 2018-12-28 晶元光电股份有限公司 发光元件及其制造方法
JP7068771B2 (ja) * 2013-07-08 2022-05-17 ルミレッズ ホールディング ベーフェー 波長変換式半導体発光デバイス
US20150144975A1 (en) * 2013-11-25 2015-05-28 Epistar Corporation Light-emitting device
DE102014116205B4 (de) * 2014-11-06 2022-09-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Leuchtdiode und Leuchtdiode
JP6609917B2 (ja) * 2014-12-02 2019-11-27 ウシオ電機株式会社 蛍光光源用発光素子の製造方法
DE102015208462A1 (de) * 2015-05-07 2016-11-10 Osram Gmbh Beleuchtungsvorrichtung
DE102015116595A1 (de) 2015-09-30 2017-03-30 Osram Opto Semiconductors Gmbh Bauelement mit einem Licht emittierenden Halbleiterchip
DE102016114474A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden Bauelement
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
US10686158B2 (en) 2017-03-31 2020-06-16 Innolux Corporation Display device
EP3382754B1 (en) * 2017-03-31 2021-06-30 InnoLux Corporation Display device
JP2018186170A (ja) * 2017-04-25 2018-11-22 株式会社ディスコ 発光ダイオードチップの製造方法及び発光ダイオードチップ
JP2018186171A (ja) * 2017-04-25 2018-11-22 株式会社ディスコ 発光ダイオードチップの製造方法及び発光ダイオードチップ
DE102019100624A1 (de) * 2019-01-11 2020-07-16 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauelement mit erster und zweiter dielektrischer schicht und verfahren zur herstellung des optoelektronischen halbleiterbauelements
US20220102583A1 (en) * 2019-01-29 2022-03-31 Osram Opto Semiconductors Gmbh µ-LED, µ-LED DEVICE, DISPLAY AND METHOD FOR THE SAME
WO2023077502A1 (zh) * 2021-11-08 2023-05-11 重庆康佳光电技术研究院有限公司 发光二极管芯片及其制备方法、显示装置
FR3160912A1 (fr) * 2024-04-03 2025-10-10 Universite D'aix Marseille Procédé de soudure laser

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29724582U1 (de) 1996-06-26 2002-07-04 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US7078735B2 (en) * 2003-03-27 2006-07-18 Sanyo Electric Co., Ltd. Light-emitting device and illuminator
DE10351397A1 (de) 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
US7161188B2 (en) * 2004-06-28 2007-01-09 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element, semiconductor light emitting device, and method for fabricating semiconductor light emitting element
DE102004052456B4 (de) * 2004-09-30 2007-12-20 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
JP4275718B2 (ja) 2006-01-16 2009-06-10 パナソニック株式会社 半導体発光装置
DE102006051746A1 (de) 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht
US7521862B2 (en) * 2006-11-20 2009-04-21 Philips Lumileds Lighting Co., Llc Light emitting device including luminescent ceramic and light-scattering material
DE102006061175A1 (de) * 2006-12-22 2008-06-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
DE102008021436A1 (de) 2008-04-29 2010-05-20 Schott Ag Optik-Konverter-System für (W)LEDs
DE102008021621A1 (de) 2008-04-30 2009-11-05 Osram Opto Semiconductors Gmbh Strahlung emittierender Dünnfilm-Halbleiterchip
DE102008030751A1 (de) 2008-06-27 2009-12-31 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037968A1 (ko) * 2013-09-16 2015-03-19 주식회사 엘지화학 광 산란 시트, 이를 포함하는 전자 소자 및 이의 제조방법
US9945991B2 (en) 2013-09-16 2018-04-17 Lg Chem, Ltd. Light-scattering sheet, electronic device comprising same, and method for producing same
KR20180111555A (ko) * 2017-03-31 2018-10-11 이노럭스 코포레이션 디스플레이 장치

Also Published As

Publication number Publication date
EP2517270B1 (de) 2018-09-12
WO2011085889A1 (de) 2011-07-21
JP2013515364A (ja) 2013-05-02
EP2517270A1 (de) 2012-10-31
DE102010005169A1 (de) 2011-06-22
CN102656713A (zh) 2012-09-05
US9842972B2 (en) 2017-12-12
US20120286313A1 (en) 2012-11-15

Similar Documents

Publication Publication Date Title
KR20120091460A (ko) 복사 방출 반도체 소자
CN101297412B (zh) 发射辐射的光电子器件
JP4666891B2 (ja) ナノ粒子を用いる発光デバイス
CN103190003B (zh) 光电半导体芯片及其制造的方法
RU2639565C2 (ru) Светоизлучающий прибор с преобразующим длину волны боковым покрытием
US20070012940A1 (en) Wavelength-convertible light emitting diode package
EP4042483B1 (en) Optical coupling layer to improve output flux in light emitting diode arrays
KR101383357B1 (ko) 발광 소자 패키지 및 그 제조방법
KR20100017677A (ko) 각도 필터 부재를 포함한 발광 다이오드칩
JP6852066B2 (ja) テクスチャ基板を有する波長変換式発光デバイス
US10418529B2 (en) Conversion element, method of producing a conversion element, optoelectronic device comprising a conversion element
US20120228653A1 (en) Light emitting device
US20080121917A1 (en) High efficiency white, single or multi-color light emitting diodes (leds) by index matching structures
CN109935674A (zh) 一种倒装led芯片及其制作方法
TW202339309A (zh) 多晶片發光二極體封裝件的配置
US9997671B2 (en) Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips
CN103715319B (zh) 一种发光二极管及其制作方法
KR101974365B1 (ko) 발광소자의 광흡수율 및 광변환 효율 향상 방법
JP2007329177A (ja) 光素子および発光装置
US20200388729A1 (en) Method for producing a conversion element, and conversion element
WO2025142694A1 (ja) 発光装置
JP7638540B2 (ja) 光電子デバイスを製造するための方法
US20240079531A1 (en) Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device
CN118661352A (zh) 光电子半导体激光器构件及光电子装置
KR20130051095A (ko) 리드 프레임, 그 제조방법 및 이를 이용한 발광 다이오드 패키지

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120719

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid