KR20120078578A - Epoxy resin composition for encapsulating semiconductor - Google Patents

Abstract

PURPOSE: An epoxy resin composition is provided to have excellent flame retardance without using a flame retardant, and to have excellent flexability, adhesion, and reliability. CONSTITUTION: An epoxy resin composition comprises 2-15 weight% of an epoxy resin, 0.5-12 weight% of curing agent, 0.01-2 weight% of a curing accelerator, and 70-95 weight% of inorganic filler. As the epoxy resin, aromatic hydrocarbon formaldehyde resin-modified novolak type epoxy resin in chemical formula 1. In chemical formula 1, R1 and R2 is respectively and independently a C1-4 linear or branched alkyl group, the average K value is 0-2, and the average l value is 1-9.

Description

Epoxy resin composition for semiconductor sealing and semiconductor device sealed using the same {Epoxy resin composition for encapsulating semiconductor}

The present invention relates to an epoxy resin composition for semiconductor sealing and a semiconductor device sealed using the same. More specifically, the present invention relates to an epoxy resin composition for semiconductor encapsulation comprising an epoxy resin of a specific structure and a semiconductor device sealed using the same.

In general, flame retardancy is required in preparing an epoxy resin composition for semiconductor sealing, and most semiconductor companies require UL94 V-0 as flame retardant. In order to secure such flame retardancy, halogen-based and inorganic flame retardants are used to manufacture an epoxy resin composition for semiconductor encapsulation, and brominated epoxy resins and antimony trioxide are mainly used for preparing an epoxy resin composition for semiconductor encapsulation to secure flame retardancy.

However, in the case of incineration or fire, toxic carcinogenic substances such as dioxins and difuran are generated in the case of incineration or fire when the epoxy resin composition for flame retardancy is secured using halogen-based flame retardants, as well as gas such as HBr and HCl generated during combustion. Therefore, there is a problem in that it is toxic to the human body and causes corrosion of semiconductor chips, wires, and lead frames.

As a countermeasure against this, non-halogen organic flame retardants and inorganic flame retardants have been considered. Phosphorus-based flame retardants such as phosphazene or phosphate esters and novel flame retardants such as nitrogen-containing resins have been studied as organic flame retardants, but nitrogen-containing resins have problems of excessive use due to lack of flame retardancy. In the case of organophosphorous flame retardant, there is no problem in applying to epoxy resin composition for semiconductor sealing because of excellent flame retardancy and good thermal properties, but due to the problem of deterioration of reliability by inorganic phosphorus flame retardant, phosphoric acid and Despite the absence of polyphosphoric acid, it is regulated by semiconductor makers, resulting in restrictions on use.

In addition, new inorganic flame retardants such as magnesium hydroxide or zinc borate have been examined, but the use of such inorganic flame retardants has caused problems such as lowering of curability of the epoxy resin composition and continuous moldability due to lowering of curability.

Further, in addition to using a lead frame made of only metal such as copper or iron, a semiconductor such as a lead frame preplated with at least one material selected from the group consisting of nickel, palladium, silver and gold in the lead frame As the devices are used, there is a growing demand for epoxy resin compositions having good adhesion and reliability.

Accordingly, there is a need to develop an epoxy resin composition for semiconductor sealing that can secure excellent flame retardancy without using a flame retardant, has good adhesion and reliability to various lead frames, and has good fluidity.

It is an object of the present invention to provide an epoxy resin composition that can provide flame retardance without the need to use a flame retardant.

Another object of the present invention is to provide an epoxy resin composition having good adhesion and reliability for various lead frames.

Still another object of the present invention is to provide an epoxy resin composition having good fluidity.

The epoxy resin composition for semiconductor encapsulation of the present invention includes an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, and includes the aromatic hydrocarbon formaldehyde resin-modified novolac type epoxy resin of Formula 1 as the epoxy resin.

[Formula 1]

(Wherein R ₁ and R ₂ are independently of each other hydrogen or a linear or branched alkyl group having 1-4 carbon atoms, the average value of k is 0-2 and the average value of l is 1-9.)

In the present invention, R ₁ and R ₂ may be a methyl group (CH ₃ ).

In one embodiment, the epoxy resin of Formula 1 may be included in 1-13% by weight of the epoxy resin composition.

In one embodiment, the epoxy resin of Formula 1 may be included in at least 40% by weight of the epoxy resin.

In one embodiment, the epoxy resin composition may include 2-15% by weight of the epoxy resin, 0.5-12% by weight of the curing agent, 0.01-2% by weight of the curing accelerator and 70-95% by weight of the inorganic filler.

The present invention provides a semiconductor device sealed using the epoxy resin composition for sealing a semiconductor device.

The present invention provides an epoxy resin composition that can provide flame retardance without the need to use a flame retardant. The present invention provides an epoxy resin composition having good adhesion and reliability for various lead frames. The present invention provides an epoxy resin composition having good fluidity.

Epoxy resin

The epoxy resin composition for semiconductor encapsulation of the present invention includes an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, and includes the aromatic hydrocarbon formaldehyde resin-modified novolac type epoxy resin of Formula 1 as the epoxy resin.

[Formula 1]

(Wherein R ₁ and R ₂ are independently of each other hydrogen or a linear or branched alkyl group having 1-4 carbon atoms, the average value of k is 0-2 and the average value of l is 1-9.)

Preferably, in Formula 1, R1 and R2 are methyl groups, and the epoxy resin may have a structure of Formula 2 below.

[Formula 2]

(In the above formula, the average value of k is 0-2 and the average value of 1 is 1-9.)

In the epoxy resin of Chemical Formula 1, R ₁ and R ₂ may be disposed at positions such as ortho, meta, or para. More preferably, the epoxy resin of Chemical Formula 1 may have a structure of Chemical Formula 3 below.

(3)

(In the above formula, the average value of k is 0-2 and the average value of 1 is 1-9.)

The epoxy resin has excellent hygroscopicity, toughness, oxidation resistance, and crack resistance, and has a low crosslinking density, thereby forming a char layer upon combustion at high temperature, thereby providing flame retardancy in itself.

Epoxy equivalent of the epoxy resin may be 100-350g / eq. Within this range, the balance of curability, flame retardancy and fluidity of the epoxy resin composition is good, and preferably 200-300 g / eq.

The softening point of the epoxy resin is 40 ~ 120 ℃, the melt viscosity at 150 ℃ may be 0.1 ~ 3.0 poise (poise). Within the said melt viscosity range, fluidity | liquidity does not fall at the time of melting, and the moldability of an epoxy resin composition does not fall.

The epoxy resin may be synthesized by a conventional method, or may be a commercially available product. For example, YL-7683 (Mitsubishi Chemical) or the like can be used, but is not limited thereto.

The epoxy resin may be included in 1 to 13% by weight of the epoxy resin composition. Within this range, the fluidity, flame retardancy, adhesion and reliability of the epoxy resin composition may be good. Preferably it may be included in 2 to 9% by weight.

In the epoxy resin composition, as the epoxy resin, in addition to the epoxy resin of the formula (1) it may be used together with the epoxy resin commonly used in the epoxy resin composition manufacturing field. For example, the epoxy resin is not particularly limited as long as it has two or more epoxy groups in the molecule, and one or more selected from the group consisting of monomers, oligomers, and polymers can be used.

Specifically, an epoxy resin obtained by epoxidizing a condensate of phenol or alkyl phenols with hydroxybenzaldehyde, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, a polyfunctional epoxy resin, a naphthol novolak type epoxy resin, Novolak-type epoxy resins of bisphenol A / bisphenol F / bisphenol AD, glycidyl ethers of bisphenol A / bisphenol F / bisphenol AD, bishydroxybiphenyl epoxy resins, dicyclopentadiene epoxy resins and biphenyl epoxy One or more selected from the group consisting of resins, polyaromatic modified epoxy resins, bisphenol A epoxy resins, orthocresol novolac epoxy resins, phenol aralkyl type epoxy resins and naphthalene epoxy resins can be used, but not limited thereto. Do not.

Preferably, a phenol aralkyl type epoxy resin having a novolak structure containing a biphenyl derivative or a biphenyl type epoxy resin represented by Formula 5 or a xylock type epoxy resin represented by Formula 6 may be used in a molecule represented by Formula 4 below. Can be.

[Formula 4]

(Average value of n in the above formula is 1 to 7)

[Chemical Formula 5]

(In the above formula, the average value of n is 0 to 7)

[Formula 6]

(Wherein the average value of n is 1 to 9)

Epoxy resins may also be used as additive compounds made by the above-mentioned epoxy resin and a linear reaction such as a melt master batch with an additive such as a curing agent, a curing accelerator, a releasing agent, a coupling agent.

When using the above-mentioned resin in addition to the epoxy resin of the general formula (1) in the epoxy resin composition, the epoxy resin of the general formula (1) is preferably included at least 40% by weight of the total epoxy resin. Within this range, the flame retardancy of the epoxy resin composition can be ensured, and adhesion, reliability and fluidity can be good. Preferably it is 50 weight% or more, More preferably, it contains 60-100 weight%.

Epoxy resin alone or a mixture thereof in the epoxy resin composition may be included in 2 to 15% by weight of the epoxy resin composition.

Hardener

The hardener is not particularly limited as long as it is commonly used for semiconductor sealing and has two or more phenolic hydroxyl groups, and at least one selected from the group consisting of monomers, oligomers, and polymers can be used.

For example, the curing agent is a phenol aralkyl type phenol resin, a phenol novolak type phenol resin, a xylox type phenol resin, a cresol novolak type phenol resin, a naphthol type phenol resin, a terpene type phenol resin, a polyfunctional phenol resin, a polyaromatic phenol resin , Dicyclopentadiene-based phenolic resin, terpene-modified phenolic resin, dicyclopentadiene-modified phenolic resin, novolak-type phenolic resin synthesized from bisphenol A and resol, tris (hydroxyphenyl) methane, dihydroxy biphenyl A polyhydric phenol compound, an acid anhydride including maleic anhydride and phthalic anhydride, aromatic amines such as metaphenylenediamine, diaminoimphenylmethane, diaminoimphenylsulfone, and the like.

In particular, as the curing agent, a phenol aralkyl type phenol resin having a novolak structure containing a biphenyl derivative in a molecule represented by the following formula (7) or a xylloc phenol resin represented by the following formula (8) can be used.

[Formula 7]

(The average value of n in the above is 1 to 7)

[Formula 8]

(In the above, the average value of n is 1 to 7)

The curing agent may be used alone or in combination, and may also be used as an additive compound prepared by preliminary reaction such as a melt master batch with a component such as the epoxy resin, a curing accelerator, and other additives.

The composition ratio of the epoxy resin and the curing agent may be a ratio of the equivalent of the epoxy group of the epoxy resin: the equivalent of the phenolic hydroxyl group contained in the curing agent 0.5: 1 to 2: 1. Within this range, fluidity of the resin composition can be ensured, and the curing time is not delayed. Preferably the equivalent ratio may be 0.8: 1 to 1.6: 1.

The curing agent may be included in an amount of 0.5 to 12% by weight in the epoxy resin composition. Preferably it may be included in 1 to 10% by weight of the epoxy resin composition.

Hardening accelerator

A hardening accelerator is a substance which accelerates reaction of an epoxy resin and a hardening | curing agent. A hardening accelerator can use 1 type or more conventionally known types. For example, a hardening accelerator can use a tertiary amine, an organometallic compound, an organophosphorus compound, an imidazole compound, or a boron compound.

Specifically, tertiary amines include benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri (dimethylaminomethyl) phenol, 2-2- (dimethylaminomethyl) phenol, 2,4,6-tris (dia) Salts of minomethyl) phenol and tri-2-ethylhexyl acid, and the like, but are not limited thereto. Organometallic compounds include, but are not limited to, chromium acetylacetonate, zinc acetylacetonate, nickel acetylacetonate, and the like. Organophosphorus compounds include tris-4-methoxyphosphine, tetrabutylphosphonium bromide, butyltriphenylphosphonium bromide, phenylphosphine, diphenylphosphine, triphenylphosphine, triphenylphosphine triphenylborane, triphenyl Phosphine-1,4-benzoquinone adducts and the like, but is not limited thereto. Imidazole is 2-methylimidazole, 2-phenylimidazole, 2-aminoimidazole, 2-methyl-1-vinylimidazole, 2-ethyl-4-methylimidazole, 2-heptadecyl. Midazoles and the like, but are not limited thereto. The boron compound is tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, tetraphenylboron salt, trifluoroborane-n-hexylamine, trifluoroborane monoethylamine, tetrafluoroboranetriethylamine, Tetrafluoroboraneamine and the like, but are not limited thereto. In addition, 1, 5- diazabicyclo [4.3.0] non-5-ene, 1, 8- diazabicyclo [5.4.0] undec-7-ene, phenol novolak resin salt, etc. can be used.

In addition, the curing accelerator may use an adduct made by pre-reacting with an epoxy resin and / or a curing agent.

The curing accelerator may be included in an amount of 0.01 to 2% by weight in the epoxy resin composition. Preferably it may be included in 0.02 ~ 1.5% by weight.

Inorganic filler

Inorganic fillers are used to improve mechanical properties and lower stresses in epoxy resin compositions. Examples of inorganic fillers include, but are not limited to, fusible silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, glass fibers, and the like. In order to reduce the stress, it is preferable to use fused silica having a low coefficient of linear expansion.

In particular, the fused silica refers to amorphous silica having a specific gravity of 2.3 or less, and may include amorphous silica made by melting crystalline silica or synthesized from various raw materials.

The inorganic filler may be used after surface treatment with one or more coupling agents selected from the group consisting of epoxysilanes, aminosilanes, mercaptosilanes, alkylsilanes, and alkoxysilanes.

Although the shape and particle diameter of an inorganic filler especially fused silica are not specifically limited, Spherical fused silica with an average particle diameter of 0.001-30 micrometers can be used. The inorganic filler may also use a mixture of spherical fused silica having different particle diameters. In this case, a mixture containing 50 to 99% by weight of spherical fused silica having an average particle diameter of 5 to 30 µm and 1 to 50% by weight of spherical fused silica having an average particle diameter of 0.001 to 1 µm can be used.

In addition, depending on the use of the resin composition and the composition of the lead frame, the particle size may be adjusted to one of up to 45 µm, 55 µm and 75 µm.

The inorganic filler may be included in an appropriate ratio depending on physical properties such as moldability, low stress and high temperature strength of the epoxy resin composition. For example, the inorganic filler may be included in 70 to 95% by weight of the epoxy resin composition. Preferably, it may be included in 75 to 92% by weight of the epoxy resin composition.

additive

The epoxy resin composition may further include additives such as colorants, coupling agents, stress relieving agents, flame retardants, crosslinking enhancers, flame retardant aids, leveling agents, and release agents as additives in addition to the above components.

As the colorant, carbon black, or an organic or inorganic dye may be used, but is not limited thereto. As the coupling agent, one or more selected from the group consisting of epoxysilane, aminosilane, mercaptosilane, alkylsilane and alkoxysilane can be used, but is not limited thereto. The stress relieving agent may use one or more selected from the group consisting of modified silicone oils, silicone elastomers, silicone powders and silicone resins, but is not limited thereto. The modified silicone oil is preferably a silicone polymer having excellent heat resistance, and may be used by mixing one or more of silicone oil having an epoxy functional group, silicone oil having an amine functional group and silicone oil having a carboxy functional group. The stress relaxation agent may be included in an amount of 0.01 to 2% by weight in the epoxy resin composition. As the flame retardant, organic or inorganic flame retardants such as bromine or phosphorus, phosphazene, zinc borate, aluminum hydroxide, and magnesium hydroxide can be used. As the release agent, higher fatty acids, higher fatty acid metal salts, ester waxes and the like can be used.

In the epoxy resin composition, the additive may be included in 0.1 to 5% by weight of the epoxy resin composition.

The method for producing the epoxy resin composition is not particularly limited, but the components contained in the composition are uniformly mixed using a Henschel mixer or a Lodige mixer, and then melted at a temperature of 90 to 110 ° C. with a roll mill or kneader. It can be prepared by kneading, cooling and grinding. As a method of sealing a semiconductor device using an epoxy resin composition, a low pressure transfer molding method may be most commonly used. However, it can also be molded by an injection molding method or a casting method. By the above method, a semiconductor device of a copper lead frame, an iron lead frame, or a lead frame pre-plated with at least one material selected from the group consisting of palladium with nickel and copper on the lead frame, or an organic laminate frame can be manufactured. Can be.

The present invention provides a semiconductor device sealed using the epoxy resin composition for sealing a semiconductor device. Methods of sealing a semiconductor using the composition are commonly known.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Specific specifications of the components used in the following examples and comparative examples are as follows.

(A) epoxy resin

(a1) YL-7683 (Mitsubishi Chemical), which is an aromatic hydrocarbon formaldehyde-modified novolac epoxy resin,

(a2) NC-3000 (Nippon kayaku), a phenol aralkyl type epoxy resin,

(a3) YH-4000H (Mitsubishi Chemical) which is a biphenyl type epoxy resin,

(a4) NC-2000-L (Nippon kayaku), which is a xylock type epoxy resin, was used.

(B) curing agent

(b1) MEH-7851SS (Meiwa kasei), which is a phenol aralkyl type phenol resin,

(b2) MEH-7800SS (Meiwa kasei), a xylox phenolic resin

Was used.

(C) inorganic filler

A 9: 1 (weight ratio) mixture of spherical molten silica having an average particle diameter of 18 µm and spherical molten silica having an average particle diameter of 0.5 µm was used.

(D) curing accelerator

Triphenylphosphine (Hokko) was used.

(E) coupling agent

(e1) mercaptosilane KBM-803 (Shinetsu)

(e2) SZ-6070 (Dow Corning chemical), which is an alkoxysilane, was used.

(F) release agent

Carnauba wax was used.

(G) colorant

Carbon black MA-600 (Matsusita Chemical) was used.

Examples 1 to 3

Epoxy resins, curing agents, curing accelerators, inorganic fillers, coupling agents, coloring agents and release agents are added in the amounts shown in Table 1 below, and uniformly mixed using a Henschel mixer, followed by 95 to 110 ° C using a continuous kneader. After melt kneading at, the mixture was cooled and pulverized to prepare an epoxy resin composition for semiconductor sealing.

Comparative Examples 1 to 3

An epoxy resin composition for semiconductor encapsulation was prepared in the same manner as in Example except that the epoxy resin, the curing agent, the curing accelerator, the inorganic filler, the coupling agent, the coloring agent, and the release agent were changed to the contents shown in Table 1 below. In Table 1 the units are weight percent.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 (A) (a1) Aromatic Hydrocarbon Formaldehyde Resin Modified Novolac Type 7.15 6.72 3.22 - - - (a2) Phenolic Aralkyl Type - - - 6.72 - - (a3) Biphenyl type - - 3.22 - 5.89 - (a4) Xylock - - - - - 6.44 (B) (b1) Phenolic Aralkyl Type - 4.98 2.63 4.98 5.81 5.26 (b2) Xylock 4.55 - 2.63 - - - (C) Fused silica 87.00 87.00 87.00 87.00 87.00 87.00 (D) Triphenylphosphine 0.20 0.20 0.20 0.20 0.20 0.20 (E) (e1) Mercaptosilane 0.20 0.20 0.20 0.20 0.20 0.20 (e2) Alkoxysilane 0.30 0.30 0.30 0.30 0.30 0.30 (F) Carnauba Wax 0.30 0.30 0.30 0.30 0.30 0.30 (G) Carbon black 0.30 0.30 0.30 0.30 0.30 0.30

Experimental Example: Evaluation of Physical Properties of Epoxy Resin Composition

The physical properties described in Table 2 below were evaluated for the epoxy resin compositions prepared in Examples and Comparative Examples, and the results are shown in Table 2 below.

Property evaluation method

1. Fluidity: The flow length was measured using a transfer molding press at 175 ° C. and 70 kgf / cm 2 using an evaluation mold according to EMMI-1-66. The higher the measured value, the better the fluidity.

2. Flame retardancy: Based on the UL 94 V-0 standard was evaluated based on 1/8 inch thickness.

3. Adhesive force: The copper metal element was prepared to the specification suitable for the adhesion measurement mold, and the test piece which pre-plated nickel-palladium-gold and nickel-palladium-gold / silver was prepared in the prepared copper specimen, respectively. The resin compositions prepared in Examples and Comparative Examples were molded on the test specimens thus prepared under conditions of a mold temperature of 170 ° C. to 180 ° C., a transfer pressure of 1000 psi, a feed rate of 0.5 to 1 cm / s, and a curing time of 120 seconds to obtain a cured specimen. Pre-conditioning condition in which the obtained specimen is placed in an oven at 170 ° C. to 180 ° C., and then once passed through an IR reflow for 30 seconds at 260 ° C. immediately after post-cure (PMC) for 4 hours. The adhesion at the bottom was measured. Further, after leaving for 60 hours at 60 ° C. and 60% relative humidity conditions after PMC (post molding cure), adhesion was measured under precondition conditions in the same manner. At this time, the area of the epoxy resin composition in contact with the specimen is 40 ± 1mm2, the adhesion was measured by the average value after measuring by using a universal testing machine (UTM) for 12 specimens for each measurement process.

4. Reliability: 256LQFP (Low-profile Quad Flat Package, 28mm) of copper metal device by molding by transfer molding at 175 ° C. for 60 seconds using MPS (Multi Plunger System) molding machine with the composition prepared in Example and Comparative Example X 28 mm x 1.4 mm) and a 256 LQFP (28 mm x 28 mm x 1.4 mm) package including lead frames pre-plated with nickel-palladium-gold and nickel-palladium-gold / silver on copper metal elements respectively. Post-cure at 175 ° C. for 4 hours and then cooled to 25 ° C. The package was then dried at 125 ° C. for 24 hours and then subjected to a thermal shock test of 5 cycles (1 cycle indicates 10 minutes at −65 ° C., 10 minutes at 25 ° C., and 10 minutes at 150 ° C.). It was. Thereafter, the package was allowed to stand at 60 ° C. and 60% relative humidity for 120 hours and then subjected to IR reflow for 30 seconds at 260 ° C. three times. Observation with an optical microscope. Thereafter, the presence of delamination between the epoxy resin composition and the lead frame was evaluated using a non-destructive test C-SAM (Scanning Acoustical Microscopy).

Example Comparative example One 2 3 One 2 3 Inch 50 54 62 50 80 48 Flammability V-0 V-0 V-0 V-0 V-1 V-1 Adhesion to Cu Leadframe (kgf) PMC, after reflow 82 86 85 74 82 68 PMC, 60/60% RH, 120 hours left and after reflow 78 83 81 69 85 62 Ni-Pd-Au
Adhesion to leadframe (kgf) MC, after reflow 63 64 61 62 60 54 PMC, 60/60% RH, 120 hours left and after reflow 54 52 50 50 50 40 Ni-Pd-Au / Ag
Adhesion to leadframe (kgf) PMC, after reflow 78 82 75 68 76 62 PMC, 60/60% RH, 120 hours left and after reflow 72 75 70 64 68 53 responsibility Cu lead frame Number of appearance cracks 0 0 0 0 0 0 Detachment Number 0 0 0 0 12 42 Total tested semiconductors 80 80 80 80 80 80 Ni-Pd-Au Leadframe Number of appearance cracks 0 0 0 0 0 0 Detachment Number 0 0 0 0 32 80 Total tested semiconductors 80 80 80 80 80 80 Ni-Pd-Au / Ag Leadframe Number of appearance cracks 0 0 0 0 0 0 Detachment Number 0 0 0 One 3 12 Total tested semiconductors 80 80 80 80 80 80

As shown in Table 2, the composition comprising the epoxy resin of the present invention can be seen that the adhesion and flame retardancy is good for various lead frames compared to the composition not containing the epoxy resin of the present invention. In addition, it can be seen that V-0 flame retardancy compared to the composition of Comparative Example 3 including a xylock type epoxy resin having a structure similar to that of Formula 1, and good peeling resistance is good reliability.

Claims (8)

An epoxy resin composition for semiconductor sealing comprising an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, wherein the epoxy resin comprises an aromatic hydrocarbon formaldehyde resin-modified novolak type epoxy resin of Formula 1 below:

[Formula 1]

(Wherein R ₁ and R ₂ are independently of each other hydrogen or a linear or branched alkyl group having 1-4 carbon atoms, the average value of k is 0-2 and the average value of l is 1-9.)
The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein R ₁ and R ₂ are methyl groups (CH ₃ ).
The epoxy resin composition of claim 1, wherein the epoxy resin has a structure of Formula 3 below:

(3)

(In the above formula, the average value of k is 0-2 and the average value of 1 is 1-9.)
The epoxy resin composition for semiconductor encapsulation of claim 1, wherein the epoxy resin of Chemical Formula 1 is included in an amount of 1 to 13% by weight of the epoxy resin composition.
The epoxy resin composition for semiconductor encapsulation of claim 1, wherein the epoxy resin of Chemical Formula 1 is contained in 40 wt% or more of the epoxy resin.
2. The epoxy resin of claim 1, wherein the epoxy resin is obtained by epoxidizing a condensate of phenol or alkyl phenols with hydroxybenzaldehyde, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, a polyfunctional epoxy resin, and naphthol. Novolak-type epoxy resin, bisphenol A / bisphenol F / bisphenol AD novolak-type epoxy resin, glycidyl ether of bisphenol A / bisphenol F / bisphenol AD, bishydroxybiphenyl epoxy resin, dicyclopentadiene epoxy At least one selected from the group consisting of resins, biphenyl epoxy resins, polyaromatic modified epoxy resins, bisphenol A epoxy resins, orthocresol novolac epoxy resins, phenol aralkyl epoxy resins and naphthalene epoxy resins Epoxy resin composition for semiconductor sealing comprising a.
The semiconductor of claim 1, wherein the epoxy resin composition comprises 2-15 wt% of the epoxy resin, 0.5-12 wt% of the curing agent, 0.01-2 wt% of the curing accelerator, and 70-95 wt% of the inorganic filler. Epoxy resin composition for sealing.
The semiconductor element sealed using the epoxy resin composition for semiconductor element sealing in any one of Claims 1-7.