KR102063199B1 - Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same - Google Patents

Abstract

상기 화학식 5에서, R1 및 R2는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C2 내지 C20 알케닐기, 치환 또는 비치환된 C2 내지 C20 알키닐기, 치환 또는 비치환된 C3 내지 C30 사이클로알킬기, 치환 또는 비치환된 C3 내지 C30 사이클로알케닐기, 치환 또는 비치환된 C3 내지 C30 사이클로알키닐기, 또는 치환 또는 비치환된 C6 내지 C30 아릴기이다.The present invention includes an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an adhesion enhancer, and the adhesion enhancer relates to an epoxy resin composition for sealing a semiconductor device comprising a compound represented by Formula 5 below, wherein the epoxy resin composition Has excellent adhesion to the leadframe and excellent package reliability:
[Formula 5]

In Formula 5, R1 and R2 are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C3 To C30 cycloalkyl group, substituted or unsubstituted C3 to C30 cycloalkenyl group, substituted or unsubstituted C3 to C30 cycloalkynyl group, or substituted or unsubstituted C6 to C30 aryl group.

Description

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME}

The present invention relates to an epoxy resin composition for sealing a semiconductor device and a semiconductor device sealed using the same, and more particularly, an epoxy resin composition for sealing a semiconductor device having excellent adhesion to a lead frame and excellent package reliability, and sealing using the same. It relates to a semiconductor device.

The method of sealing a semiconductor element with an epoxy resin composition is commercially performed for the purpose of protecting a semiconductor element from external environments, such as moisture and a mechanical shock.

In general, the semiconductor industry requires UL-94 V-0 flame retardant grades for epoxy resin compositions for semiconductor encapsulation. In order to secure the flame retardant grade, the halogenated epoxy resin, which is the main flame retardant, and the antimony trioxide, which is the auxiliary flame retardant, have been used in combination, but antimony trioxide is very harmful to the human body as a carcinogenic substance, and the halogen-based flame retardant is also incinerated or dioxin (in case of fire). Toxic carcinogens, such as dioxin) and difuran, are known to be released. In addition, the ozone layer may be destroyed by gases such as HBr and HCl generated during combustion. As a countermeasure against this, phosphorus-based flame retardants such as phosphazene and phosphate esters and novel flame retardants such as nitrogen-containing resins have been considered. However, phosphoric acid and polyphosphoric acid produced when the phosphorus-based flame retardant is combined with water deteriorate the reliability of the semiconductor, and in the case of a nitrogen element-containing resin, there is a problem that the flame retardancy is not sufficiently secured.

A flame retardant method using a resin having self-extinguishing property has been in the spotlight in order to secure sufficient flame retardancy even without using the halogenated resin or the phosphorus-based flame retardant. However, the epoxy resin composition requires not only flame retardancy but also excellent adhesion to the lead frame, but self-extinguishing resin is very effective in improving flame retardancy, but has a disadvantage in that adhesion to copper lead frame is inferior to conventional biphenyl resins. It is an obstacle to the high reliability of the semiconductor element sealed using this.

In addition, a method of adding a triazine-based modified phenol novolak resin has been attempted to improve adhesion with the copper lead frame. However, in the case of a semiconductor package using a copper lead frame, the oxidation of copper is inevitable because heat is applied from the outside during the attachment of the semiconductor chip and the bonding of the gold wire, and when the copper lead frame is oxidized in the air, the adhesion force is sharply lowered. have.

An object of the present invention is to provide an epoxy resin composition for sealing semiconductor devices excellent in flame retardancy.

An object of the present invention is to provide an epoxy resin composition for sealing semiconductor elements excellent in adhesion with various members such as semiconductor chips and lead frames.

Still another object of the present invention is to provide an epoxy resin composition for sealing semiconductor devices excellent in crack resistance and peeling resistance.

One aspect of the present invention comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an adhesion enhancer, wherein the adhesion enhancer relates to an epoxy resin composition for sealing a semiconductor device comprising a compound represented by Formula 5 below:

[Formula 5]

In Formula 5, R1 and R2 are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C3 To C30 cycloalkyl group, substituted or unsubstituted C3 to C30 cycloalkenyl group, substituted or unsubstituted C3 to C30 cycloalkynyl group, or substituted or unsubstituted C6 to C30 aryl group.

The adhesion promoter may be included in an amount of 0.01 to 2% by weight of the epoxy resin composition.

The epoxy resin composition is 2 to 17% by weight of the epoxy resin, 0.5 to 13% by weight of the curing agent, 0.01 to 2% by weight of the curing accelerator, 70 to 95% by weight of the inorganic filler, and 0.01 to 2% by weight of the adhesion promoter It may include.

The epoxy resin may include at least one of a biphenyl type epoxy resin represented by Formula 1 and a phenol aralkyl type epoxy resin represented by Formula 2 below:

[Formula 1]

In Formula 1, R is an alkyl group having 1 to 4 carbon atoms, the average value of n is 0 to 7.

[Formula 2]

In Formula 2, the average value of n is 1 to 7.

The curing agent may include one or more of a xylox phenol resin represented by Formula 3 and a phenol aralkyl type phenol resin represented by Formula 4 below:

[Formula 3]

In Formula 3, the average value of n is 0 to 7.

[Formula 4]

In Formula 4, the average value of n is 1 to 7.

The curing accelerator may include one or more tertiary amines, organometallic compounds, organophosphorus compounds, imidazole and boron compounds.

The inorganic filler may include 50 to 99 wt% of spherical molten silica having an average particle diameter of 5 to 30 μm and 1 to 50 wt% of spherical molten silica having an average particle diameter of 0.001 to 1 μm.

The composition may further include one or more colorants, coupling agents, mold release agents, stress relaxation agents, crosslinking promoters and leveling agents.

Another aspect of the present invention relates to a semiconductor device sealed using the epoxy resin composition for sealing a semiconductor device.

The semiconductor device may include a copper lead frame.

The epoxy resin composition for semiconductor element sealing of this invention is excellent in flame retardancy, adhesiveness, and reliability in sealing of the semiconductor element containing a copper lead frame.

The present invention relates to an epoxy resin composition for sealing semiconductor elements comprising an epoxy resin (A), a curing agent (B), a curing accelerator (C), an inorganic filler (D), and an adhesive force improving agent (E). Hereinafter, each component will be described in detail.

(A) epoxy resin

The epoxy resin is not particularly limited as long as it is an epoxy resin that is generally included for sealing semiconductor devices. In embodiments, the epoxy resin may be an epoxy compound containing two or more epoxy groups in the molecule.

For example, epoxy resins are epoxy resins obtained by epoxidizing condensates of phenol or alkyl phenols with hydroxybenzaldehyde, phenol novolak type epoxy resins, cresol novolak type epoxy resins, biphenyl type epoxy resins, and phenol aralkyl type. Epoxy resin, polyfunctional epoxy resin, naphthol novolac epoxy resin, novolac epoxy resin of bisphenol A / bisphenol F / bisphenol AD, glycidyl ether of bisphenol A / bisphenol F / bisphenol AD, bishydroxy biphenyl type Epoxy resin, dicyclopentadiene type epoxy resin, etc. are mentioned.

Preferably, the epoxy resin may include at least one of an ortho cresol novolak type epoxy resin, a biphenyl type epoxy resin, and a phenol aralkyl type epoxy resin.

For example, a biphenyl type epoxy resin represented by the following Chemical Formula 1 may be used:

[Formula 1]

In Formula 1, R is an alkyl group having 1 to 4 carbon atoms, the average value of n is 0 to 7.

Preferably R may be a methyl group or an ethyl group, more preferably a methyl group.

For example, a phenol aralkyl type epoxy resin represented by the following Chemical Formula 2 may be used:

[Formula 2]

In Formula 2, the average value of n is 1 to 7.

The phenol aralkyl type epoxy resin of Chemical Formula 2 forms a structure having a biphenyl in the middle based on a phenol skeleton, and thus has excellent hygroscopicity, toughness, oxidation resistance, and crack resistance, and has a low crosslinking density, so when burning at high temperature While forming a carbon layer (char), there is an advantage in that it can secure a certain level of flame retardancy in itself.

The epoxy resins may be used alone or in combination of two or more thereof.

The epoxy resin may be used alone, or may be used as an addition compound made by a linear reaction such as a melt master batch with other components such as a curing agent, a curing accelerator, a releasing agent, a coupling agent, and a stress relaxation agent. In addition, it may be preferable to use low chlorine ions, sodium ions, and other ionic impurities contained in the epoxy resin to improve the moisture resistance reliability.

The epoxy resin may be included in 2 to 17% by weight, preferably 3 to 15% by weight, more preferably 3 to 12% by weight of the epoxy resin composition for sealing semiconductor elements. In the above range, the flowability, flame retardancy, reliability of the epoxy resin composition may be good.

(B) curing agent

The curing agent is generally used for sealing a semiconductor device and is not particularly limited as long as it has two or more reactors.

As a specific example, a hardening | curing agent is a phenol aralkyl type phenol resin, a phenol phenol novolak type phenol resin, a xylox phenol resin, a cresol novolak type phenol resin, a naphthol type phenol resin, a terpene type phenol resin, a polyfunctional phenol resin, dicyclopentadiene Novolak-type phenol resin synthesized from bisphenol A and resol, polyhydric phenol compound including tris (hydroxyphenyl) methane, dihydroxybiphenyl, acid anhydride including maleic anhydride and phthalic anhydride, and metaphenyl And aromatic amines such as rendiamine, diaminodiphenylmethane and diaminodiphenylsulfonone.

For example, one or more of phenol novolak-type resin, xylox phenol resin, and phenol aralkyl type phenol resin can be used.

For example, a xylox phenol resin represented by the following formula (3) may be used:

[Formula 3]

In Formula 3, the average value of n is 0 to 7.

For example, a phenol aralkyl type phenol resin represented by the following formula (4) may be used:

[Formula 4]

In Formula 4, the average value of n is 1 to 7.

Curing agents may be used alone or in combination of two or more thereof.

The curing agent may also be used as an addition compound made by preliminary reactions such as melt master batches with other components such as epoxy resins, curing accelerators, release agents, coupling agents, and stress relief agents.

The curing agent may be included in 0.5 to 13% by weight, preferably 1 to 10% by weight, more preferably 2 to 8% by weight of the epoxy resin composition for sealing semiconductor elements. In the above range, a large amount of unreacted epoxy groups and phenolic hydroxyl groups do not occur, so the reliability may be excellent.

The mixing ratio of the epoxy resin and the curing agent can be adjusted according to the requirements of the mechanical properties and the moisture resistance reliability in the package. In an embodiment, the chemical equivalent ratio of the epoxy resin to the curing agent may be 0.95 to 2, preferably 1 to 1.75.

(C) curing accelerator

A hardening accelerator is a substance which accelerates reaction of an epoxy resin and a hardening | curing agent.

For example, a hardening accelerator can use a tertiary amine, an organometallic compound, an organophosphorus compound, an imidazole, a boron compound, etc. Tertiary amines include benzyldimethylamine, triethanolamine, triethylenediamine, diethylaminoethanol, tri (dimethylaminomethyl) phenol, 2-2- (dimethylaminomethyl) phenol, 2,4,6-tris (diaminomethyl ) Phenol and tri-2-ethylhexyl acid salt. Organometallic compounds include chromium acetylacetonate, zinc acetylacetonate, nickel acetylacetonate, and the like. Organophosphorus compounds include tris-4-methoxyphosphine, tetrabutylphosphonium bromide, tetraphenylphosphonium bromide, phenylphosphine, diphenylphosphine, triphenylphosphine, triphenylphosphine triphenylborane, triphenylphosphate And pin-1,4-benzoquinones adducts. Imidazoles include 2-methylimidazole, # 2-phenylimidazole, # 2-aminoimidazole, 2-methyl-1-vinylimidazole, 2-ethyl-4-methylimidazole, and 2-heptadecyl. Imidazole. Boron compounds include tetraphenylphosphonium-tetraphenylborate, triphenylphosphine tetraphenylborate, tetraphenylboron salt, trifluoroborane-n-hexylamine, trifluoroborane monoethylamine, tetrafluoroboranetriethylamine And tetrafluoroboraneamine. In addition, 1,5- diazabicyclo [4.3.0] non-5-ene (1, 5- diazabicyclo [4.3.0] non-5-ene: DBN), 1, 8- diazabicyclo [5.4. 0] undec-7-ene (1,8-diazabicyclo [5.4.0] undec-7-ene: DBU) and phenol novolac resin salts may be used. As a particularly preferable hardening accelerator, organophosphorus compound, a boron compound, an amine type, or imidazole series hardening accelerator can be used individually or in mixture. The curing accelerator may use an epoxy resin or an adduct made by preliminary reaction with the curing agent.

The curing accelerator may be included in an epoxy resin composition of 0.01 to 2% by weight, preferably 0.02 to 1.5% by weight, more preferably 0.05 to 1.5% by weight. In the above range, the curing reaction time is not delayed, and the fluidity of the composition can be ensured.

(D) inorganic filler

Inorganic fillers are materials used for improving the mechanical properties and reducing the stress of the epoxy resin composition. Examples of commonly used inorganic fillers include at least one of molten silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, and glass fiber. It may include.

Preferably, for low stress, a molten silica having a low coefficient of linear expansion is used. Molten silica refers to amorphous silica having a specific gravity of 2.3 kW or less, and also includes amorphous silica made by melting crystalline silica or synthesized from various raw materials. The shape and particle size of the molten silica are not particularly limited, but the molten silica includes 50 to 99% by weight of spherical molten silica having an average particle diameter of 5 to 30 µm and 1 to 50% by weight of spherical molten silica having an average particle diameter of 0.001 to 1 µm. The mixture may preferably comprise from 40 to 100% by weight relative to the total filler. Moreover, according to a use, the maximum particle diameter can be adjusted and used in any one of 45 micrometers, 55 micrometers, and a 75 micrometers. In the spherical molten silica, conductive carbon may be included as a foreign material on the silica surface, but it is also important to select a material containing less polar foreign matter.

The amount of the inorganic filler used depends on the required physical properties such as formability, low stress, and high temperature strength. In embodiments, the inorganic filler may be included in 70 to 95% by weight, preferably 75 to 92% by weight of the epoxy resin composition for sealing semiconductor devices. Within this range, flame retardancy, fluidity and reliability of the epoxy resin composition can be ensured.

(E) Adhesion Enhancer

The epoxy resin composition for sealing a semiconductor device of the present invention may include a thiadiazole compound represented by the following Chemical Formula 5 in order to prevent a decrease in adhesion force during oxidation of the copper lead frame.

[Formula 5]

In Formula 5, R1 and R2 are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C3 To C30 cycloalkyl group, substituted or unsubstituted C3 to C30 cycloalkenyl group, substituted or unsubstituted C3 to C30 cycloalkynyl group, or substituted or unsubstituted C6 to C30 aryl group.

In one embodiment, R1 and R2 are preferably alkyl groups of C2 to C20 from the viewpoint of dispersibility because of good compatibility with the epoxy resin.

The adhesive force improving agent may be used alone when preparing the epoxy resin composition, and in advance to the melt of the epoxy resin or the curing agent through a method such as a melt master batch (MBM) before the epoxy resin composition is prepared for uniform dispersion. After dissolving and dispersing, it may be added to the composition and used. Moreover, it can also use, after mixing with coupling agents, such as an epoxy silane, an amino silane, a mercapto silane, an alkyl silane, and an alkoxysilane.

Adhesion enhancers may be included in the epoxy resin composition of 0.01 to 1% by weight, preferably 0.01 to 0.5% by weight, more preferably 0.01 to 0.1% by weight. In the above range, it is excellent in adhesion improvement property, the dispersibility in the composition can be sufficiently secured, and is preferable in view of mechanical strength after packaging.

additive

The epoxy resin composition may further include conventional additives included in the epoxy resin composition. In embodiments, additives such as colorants, coupling agents, release agents, stress relaxers, crosslinking enhancers, leveling agents, and the like may further be included.

The coupling agent may use one or more selected from the group consisting of epoxysilane, aminosilane, mercaptosilane, alkylsilane and alkoxysilane, but is not limited thereto. The coupling agent may be included in 0.1 to 1% by weight of the epoxy resin composition.

The release agent may use one or more selected from the group consisting of paraffin wax, ester wax, higher fatty acid, higher fatty acid metal salt, natural fatty acid and natural fatty acid metal salt. The release agent may be included in 0.1 to 1% by weight of the epoxy resin composition.

The stress relieving agent may use one or more selected from the group consisting of modified silicone oils, silicone elastomers, silicone powders and silicone resins, but is not limited thereto. The stress relieving agent is preferably contained in 0 to 6.5% by weight, for example 0 to 1% by weight, for example 0.1 to 1% by weight, in the epoxy resin composition, may be optionally contained, or both. . At this time, the modified silicone oil is preferably a silicone polymer having excellent heat resistance, and the total epoxy resin composition by mixing one or two or more kinds of a silicone oil having an epoxy functional group, a silicone oil having an amine functional group, and a silicone oil having a carboxyl functional group. 0.05 to 1.5% by weight can be used. However, when the silicone oil exceeds 1.5% by weight or more, surface contamination is likely to occur and the resin bleed may be long, and when used below 0.05% by weight, there may be a problem that a sufficient low modulus of elasticity cannot be obtained. have. In addition, it is particularly preferable that the silicon powder has a central particle diameter of 15 μm or less, which does not act as a cause of the deterioration of moldability, and may be contained in an amount of 0 to 5 wt%, for example, 0.1 to 5 wt% based on the total resin composition. .

The additive may be included in 0.1 to 10% by weight, for example 0.1 to 3% by weight of the epoxy resin composition.

The method for producing the epoxy resin composition is not particularly limited, but each component contained in the composition is uniformly mixed by using a Henschel mixer or a Lodige mixer, followed by melt kneading at 90 to 120 ° C. with a roll mill or kneader. It can be prepared through the cooling and grinding process. As a method of sealing a semiconductor device using an epoxy resin composition, a low pressure transfer molding method may be most commonly used. However, it can also be molded by an injection molding method or a casting method. By the above method, a semiconductor device of a copper lead frame, an iron lead frame, or a lead frame pre-plated with at least one material selected from the group consisting of palladium with nickel and copper on the lead frame, or an organic laminate frame can be manufactured. Can be.

The sealed semiconductor device which is another aspect of the present invention may be sealed using the epoxy resin composition for sealing the semiconductor device. The method of sealing a semiconductor element using an epoxy resin composition can use a conventionally well-known method.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to Examples.

Example

Specifications of the components used in the following Examples and Comparative Examples are as follows.

(A) epoxy resin

(a1) Phenolic aralkyl type epoxy resin (NC-3000, Nippon Kayaku Co., Ltd.)

(a2) Biphenyl type epoxy resin (YX-4000, Japan Epoxy Resin)

(B) curing agent

(b1) Phenolic aralkyl type phenol resin (MEH-7851SS, Meiwa Corporation)

(b2) Xylox type phenolic resin (MEH-7800SS, Meiwa Corporation)

(C) curing accelerator

Triphenylphosphine: TPP, Hokko Chemical

(D) inorganic filler

Silica: A spherical molten silica having an average particle diameter of 18 µm and a spherical molten silica having an average particle diameter of 0.5 µm were mixed and used in a weight ratio of 9: 1.

(E) Adhesion Enhancer

(e1) 2,5-Bis (tert-nonyldithio) -1,3,4-thiadiazole (Yan Tai Heng Nuo Chemical Co., Ltd.) represented by the following Chemical Formula 6 was used.

[Formula 6]

(e2) 1,2,5-thiadiazole (Sigma-Aldrich's reagent grade) represented by the following formula (7) was used.

[Formula 7]

(e3) 2,5-dimercapto-1,3,4-thiadiazole (Sigma-Aldrich's reagent grade) represented by the following formula (8) was used.

[Formula 8]

(e4) 5-Amino-1,3,4-thiadiazole-2-thiol (Sigma-Aldrich's reagent grade) represented by the following formula (9) was used.

[Formula 9]

(e5) 1,2,5-thiadiazole-3-carboxylic acid (Sigma-Aldrich's reagent grade) represented by the following Chemical Formula 10 was used.

[Formula 10]

(F) Coupling agent

(f1) mercapto propyl trimethoxy silane: KBM-803, Shin Etsu silicon

(f2) Methyl trimethoxy silane: SZ-6070, Dow Corning chemical

(G) colorant

Carbon Black: Mitsubishi Chemical, MA-600

(H) Release agent

Montan wax: Clariant company Licowax E

Example  1-3 and Comparative example  1-8

According to the composition shown in Table 1 below, the mixture was uniformly mixed using a Henschel mixer (KEUM SUNG MACHINERY CO.LTD (KSM-22)), and then cooled and pulverized after melting and kneading at 90 to 110 ° C. using a continuous kneader. An epoxy resin composition for device sealing was prepared. After the measurement of physical properties based on the following physical property evaluation method, the results are shown in Table 2 and Table 3, respectively.

Property evaluation method

(1) adhesion

A copper metal element to be measured was prepared in a standard suitable for a measurement measuring mold, and a copper metal test piece which was not heat treated separately and left for 2 hours at 125 ° C. were prepared to oxidize a copper surface.

After the epoxy resin composition shown in Table 1 on the prepared metal test specimens at a mold temperature of 170 ~ 180 ℃, a feed pressure of 1000psi, a feed rate of 0.5 ~ 1cm / sec, a curing time of 120 seconds to obtain a cured specimen, the specimen 170 ~ 180 Immediately after post-cure (PMC) for 4 hours in an oven at < RTI ID = 0.0 > C, < / RTI > The adhesion force under the preconditioning condition which repeated three times and repeated three times was measured, respectively. At this time, the area of the epoxy resin composition in contact with the metal specimen is 40 ± 1mm2 and the adhesion was measured using a universal testing machine (UTM) for 12 specimens for each measurement process, and then the average value was calculated.

(2) reliability

The epoxy resin composition of Table 1 was molded by transfer molding at 175 ° C. for 60 seconds using an MPS (Multi Plunger System) molding machine, and the surface was oxidized by being left at 125 ° C. with a copper metal element leadframe which was not heat treated separately. A 256-LQFP (Low-profile Quad Flat Package) (28 mm × 28 mm × 1.4 mm) package was prepared, each containing the copper metal element lead frame. After curing at 175 ℃ for 4 hours and then cooled to room temperature. Thereafter, the package was dried at 125 ° C. for 24 hours, and then subjected to a thermal shock test of 5 cycles (1 cycle means 10 minutes at −65 ° C., 5 minutes at 25 ° C., and 10 minutes at 150 ° C.). It was. Thereafter, the package was allowed to stand at 60 ° C. and 60% relative humidity for 120 hours, and then after the preconditioning condition of repeating three times of IR reflow for 30 seconds at 260 ° C. Observation was carried out with an optical microscope. Thereafter, the presence of peeling between the epoxy resin composition and the lead frame was evaluated using C-SAM (Scanning Acoustical Microscopy).

TABLE 1

TABLE 2

TABLE 3

From the above results, it was confirmed that the epoxy resin composition according to the present invention is excellent in adhesion to the oxidized copper lead frame and can produce a semiconductor device having high reliability when sealing the semiconductor device.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and a person of ordinary skill in the art to which the present invention pertains has the technical idea of the present invention. However, it will be understood that other specific forms may be practiced without changing the essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (10)

2 to 17 wt% epoxy resin;
0.5 to 13 weight percent of hardener;
0.01 to 2 wt% of a curing accelerator;
70 to 95% by weight of an inorganic filler; And
0.01 to 0.1% by weight of an adhesive enhancer,
The adhesive force improver is an epoxy resin composition for sealing a semiconductor device comprising a compound represented by the following formula (5):
[Formula 5]

Wherein R1 and R2 are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C3 to C30 A cycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C3 to C30 cycloalkynyl group, or a substituted or unsubstituted C6 to C30 aryl group.
delete delete The method of claim 1,
The epoxy resin is an epoxy resin composition for sealing a semiconductor device comprising at least one of a biphenyl epoxy resin represented by the following formula (1) and a phenol aralkyl type epoxy resin represented by the following formula (2):
[Formula 1]

In Formula 1, R is an alkyl group having 1 to 4 carbon atoms, the average value of n is 0 to 7,
[Formula 2]

In Formula 2, the average value of n is 1 to 7.
The method of claim 1,
The curing agent is an epoxy resin composition for sealing a semiconductor device comprising at least one of a xylock type phenol resin represented by the following formula (3) and a phenol aralkyl type phenol resin represented by the following formula (4):
[Formula 3]

In Formula 3, the average value of n is 0 to 7,
[Formula 4]

In Formula 4, the average value of n is 1 to 7.
The method of claim 1,
The curing accelerator is an epoxy resin composition for sealing a semiconductor device, characterized in that it comprises at least one kind of tertiary amine, organometallic compound, organophosphorus compound, imidazole and boron compound.
The method of claim 1,
The inorganic filler is an epoxy resin composition for semiconductor element sealing, characterized in that it comprises 50 to 99% by weight of the spherical molten silica having an average particle diameter of 5 to 30㎛ and 1 to 50% by weight of the spherical molten silica having an average particle diameter of 0.001 to 1㎛.
The method of claim 1,
The composition is an epoxy resin composition for sealing a semiconductor device, characterized in that it further comprises at least one of a colorant, a coupling agent, a release agent, a stress relaxer, a crosslinking enhancer and a leveling agent.
The semiconductor element sealed using the epoxy resin composition for sealing a semiconductor element of any one of Claims 1-4.
The method of claim 9,
The semiconductor device is characterized in that it comprises a copper lead frame.