KR20140083792A - Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same - Google Patents
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same Download PDFInfo
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- KR20140083792A KR20140083792A KR1020120153917A KR20120153917A KR20140083792A KR 20140083792 A KR20140083792 A KR 20140083792A KR 1020120153917 A KR1020120153917 A KR 1020120153917A KR 20120153917 A KR20120153917 A KR 20120153917A KR 20140083792 A KR20140083792 A KR 20140083792A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
The present invention relates to an epoxy resin composition for sealing semiconductor devices and a semiconductor device sealed by the epoxy resin composition. Wherein the epoxy resin composition for sealing a semiconductor element comprises an epoxy resin; Curing agent; Curing accelerator; And an inorganic filler, wherein the curing agent comprises a curing agent represented by the following Formula 4:
[Chemical Formula 4]
(Wherein R 1 to R 4 are independently of each other hydrogen or a linear or branched alkyl group having 1 to 4 carbon atoms, and an average value of n is 1 to 9.)
Description
The present invention relates to an epoxy resin composition for sealing semiconductor devices and a semiconductor device sealed by the epoxy resin composition. More particularly, the present invention relates to an epoxy resin composition for encapsulating semiconductor devices comprising a phenolic resin curing agent having a specific structure and a semiconductor element sealed by the epoxy resin composition.
In general, flame retardancy is required in the production of epoxy resin compositions for semiconductor device encapsulation, and most semiconductor companies require UL94 V-0 as a flame retardant. In order to ensure such flame retardancy, epoxy resin compositions for semiconductor encapsulation are manufactured using halogen-based or inorganic flame retardants. Flame retardancy is secured by using brominated epoxy resin and antimony trioxide in the epoxy resin composition for semiconductor encapsulation.
However, in the epoxy resin composition for semiconductor encapsulation which ensures flame retardancy by using such a halogen-based flame retardant, toxic carcinogens such as dioxins and di-furan are generated during incineration or fire, and also by gases such as HBr and HCl Toxic to the human body and cause corrosion of semiconductor chip, wire and lead frame.
Non-halogenated organic flame retardants and inorganic flame retardants have been studied as countermeasures thereto. A novel flame retardant such as a phosphorus flame retardant such as phosphazene or phosphoric acid and a nitrogen element-containing resin such as phosphazene or phosphoric acid ester has been studied as an organic flame retardant, but the nitrogen element-containing resin has a problem of insufficient flame retardancy and excessive use. Organophosphorus flame retardants are excellent in flame retardancy and good in thermal properties, so there is no problem in applying them to epoxy resin compositions for semiconductor encapsulation. However, due to the problem of lower reliability due to inorganic phosphorus flame retardants in the past, Despite the fact that polyphosphoric acid is not produced, it is regulated by semiconductor makers, resulting in restrictions on use.
In addition, new inorganic flame retardants such as magnesium hydroxide or zinc borate have been investigated. However, such inorganic flame retardants have been used to lower the curability of the epoxy resin composition and to lower the curability of the epoxy resin composition.
Further, it is possible to use a lead frame made of a metal such as copper or iron, a semiconductor such as a lead frame pre-plated with at least one material selected from the group consisting of nickel, palladium, silver and gold There is a growing demand for an epoxy resin composition having good adhesion and reliability.
Therefore, there is a need to develop an epoxy resin composition for semiconductor device encapsulation which is capable of ensuring excellent flame retardancy without using a flame retardant, has excellent adhesion and reliability to various lead frames, and has excellent flowability.
An object of the present invention is to provide an epoxy resin composition which can provide excellent flame retardancy without using a flame retardant.
Another object of the present invention is to provide an epoxy resin composition excellent in adhesion and reliability to various lead frames.
It is still another object of the present invention to provide a semiconductor device sealed with the above epoxy resin composition.
One aspect of the present invention relates to an epoxy resin composition for sealing a semiconductor device. Wherein the epoxy resin composition for sealing a semiconductor element comprises an epoxy resin; Curing agent; Curing accelerator; And an inorganic filler, wherein the curing agent comprises a curing agent represented by the following Formula 4:
[Chemical Formula 4]
(Wherein R 1 to R 4 are independently of each other hydrogen or a linear or branched alkyl group having 1 to 4 carbon atoms, and an average value of n is 1 to 9.)
In one embodiment, the curing agent may comprise a curing agent represented by Formula 5:
[Chemical Formula 5]
(In the above formula, the average value of n is 1 to 9.)
The curing agent may be contained in an amount of 0.5 to 13 wt% of the entire epoxy resin composition.
The curing agent represented by Formula 4 may be contained in an amount of 30 to 100% by weight of the total curing agent.
The epoxy resin may be an epoxy resin obtained by epoxidizing a condensate of phenol or alkyl phenol and hydroxybenzaldehyde, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, a multifunctional epoxy resin, a naphthol novolak type epoxy resin, Novolak type epoxy resins such as bisphenol A / bisphenol F / bisphenol AD, glycidyl ether of bisphenol A / bisphenol F / bisphenol AD, bishydroxybiphenyl epoxy resin, dicyclopentadiene epoxy resin, biphenyl type epoxy At least one selected from the group consisting of a resin, a multi-aromatic modified epoxy resin, a bisphenol A type epoxy resin, an orthocresol novolak type epoxy resin, a phenol aralkyl type epoxy resin and a naphthalene type epoxy resin.
The epoxy equivalent of the epoxy resin may be in the range of 0.5: 1 to 2: 1 in terms of the phenolic hydroxyl equivalent in the curing agent.
The curing accelerator may be a tertiary amine, an organometallic compound, an organic phosphorus compound, an imidazole compound, or a boron compound.
The inorganic filler may include 50 to 99% by weight of spherical fused silica having an average particle diameter of 5 to 30 占 퐉 and 1 to 50% by weight of spherical fused silica having an average particle diameter of 0.001 to 1 占 퐉.
In an embodiment, the epoxy resin composition may include 0.1 to 15% by weight of the epoxy resin, 0.5 to 13% by weight of a curing agent, 0.001 to 2% by weight of a curing accelerator, and 70 to 95% by weight of an inorganic filler.
The epoxy resin composition may further comprise additives selected from a colorant, a coupling agent, a stress relaxation agent, a flame retardant, a crosslinking promoter, a flame retardant aid, a leveling agent, and a mold release agent.
Another aspect of the present invention relates to a semiconductor device sealed with the epoxy resin composition.
INDUSTRIAL APPLICABILITY The epoxy resin composition for semiconductor devices according to the present invention can provide excellent flame retardancy without using a flame retardant, excellent adhesion and reliability to various lead frames, and excellent fluidity.
One aspect of the present invention relates to an epoxy resin composition for sealing a semiconductor device. The epoxy resin composition comprises an epoxy resin; Curing agent; Curing accelerator; And an inorganic filler, wherein the curing agent comprises a curing agent represented by the following Formula 4:
[Chemical Formula 4]
(Wherein R 1 to R 4 are independently of each other hydrogen or a linear or branched alkyl group having 1 to 4 carbon atoms, and an average value of n is 1 to 9.)
Epoxy resin
The epoxy resin used in the epoxy resin composition of the present invention may be an epoxy resin which is commonly used in the field of epoxy resin production. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in the molecule. For example, at least one selected from the group consisting of monomers, oligomers and polymers can be used.
Specifically, there may be mentioned an epoxy resin obtained by epoxidating a condensate of phenol or alkyl phenol and hydroxybenzaldehyde, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, a multifunctional epoxy resin, a naphthol novolak type epoxy resin, A / bisphenol F / bisphenol AD novolac epoxy resins, bisphenol A / bisphenol F / bisphenol AD glycidyl ether, bishydroxybiphenyl epoxy resin, dicyclopentadiene epoxy resin, biphenyl type epoxy resin , A polyaromatic modified epoxy resin, a bisphenol A type epoxy resin, an orthocresol novolak type epoxy resin, a phenol aralkyl type epoxy resin and a naphthalene type epoxy resin may be used, but not limited thereto .
In the epoxy resin of the present invention, a phenol aralkyl type epoxy resin having a novolak structure containing a biphenyl derivative in the molecule represented by the following formula (1), a biphenyl type epoxy resin represented by the formula (2) or a xylyl type An epoxy resin can be used. These may be used alone or in combination of two or more.
[Chemical Formula 1]
(Wherein the average value of n is 1 to 7.)
(2)
(Wherein the average value of n is 0 to 7).
(3)
(Wherein the average value of n is 1 to 7.)
As the epoxy resin, an additive compound prepared by subjecting the above epoxy resin to a linear reaction such as a curing agent, a curing accelerator, a releasing agent, a coupling agent, and a melt master batch may be used.
The epoxy resin may be contained in an amount of 0.1 to 15% by weight based on the whole epoxy resin composition. And preferably 0.5 to 13% by weight. More preferably 2 to 11% by weight. Within the above range, the flowability, flame retardancy, adhesion, and reliability of the epoxy resin composition of the present invention can be excellent.
Hardener
In the epoxy resin composition of the present invention, the curing agent includes an aromatic hydrocarbon formaldehyde resin-modified novolak type curing agent represented by the following Formula 4:
[Chemical Formula 4]
(Wherein R 1 to R 4 are independently of each other hydrogen or a linear or branched alkyl group having 1 to 4 carbon atoms, and an average value of n is 1 to 9.)
The curing agent represented by the formula (4) is excellent in hygroscopicity, toughness, oxidation resistance and crack resistance, and has a low crosslinking density, so that it forms a char layer upon combustion at a high temperature, .
In one embodiment, the curing agent of Formula 4 may have the structure of Formula 5 wherein R 1 to R 4 are each a methyl group.
[Chemical Formula 5]
(In the above formula, the average value of n is 1 to 9.)
The curing agents represented by the formulas (4) and (5) may be contained in an amount of 30 to 100% by weight of the total curing agent. In this range, the flame retardancy is excellent and the curing time can not be delayed.
The hydroxyl group equivalent of the curing agent may be 80 to 350 g / eq. Preferably 100 to 300 g / eq. Within the above range, the epoxy resin composition of the present invention can have excellent balance of curability, flame retardancy and fluidity.
The curing agent may have a softening point of 40 to 120 ° C and a melt viscosity at 150 ° C of 0.1 to 3.0 poise. Within the melt viscosity range, the flowability upon melting is not lowered and the moldability of the epoxy resin composition is not lowered.
There is no particular limitation as long as it has two or more phenolic hydroxyl groups, which are conventionally used for semiconductor encapsulation, in addition to the curing agents represented by the above-mentioned formulas (4) and (5). For example, at least one selected from the group consisting of monomers, oligomers and polymers can be used.
Specific examples of the curing agent include phenol aralkyl type phenol resin, phenol novolak type phenol resin, xylock type phenol resin, cresol novolak type phenol resin, naphthol type phenol resin, terpene type phenol resin, , Dicyclopentadiene-based phenol resin, terpene-modified phenol resin, dicyclopentadiene-modified phenol resin, novolak-type phenol resin synthesized from bisphenol A and resole, tris (hydroxyphenyl) methane and dihydroxybiphenyl Such as polyhydric phenol compounds, acid anhydrides including maleic anhydride and phthalic anhydride, aromatic amines such as metaphenylenediamine, diaminophenylmethane, and diaminophenylsulfone, and the like.
In one embodiment, the curing agent is selected from phenol aralkyl type phenol resins having a novolak structure containing a biphenyl derivative in the molecule represented by the following formula (6) or xylock type phenol resins represented by the following formula (7) You can use:
[Chemical Formula 6]
(Wherein the average value of n is 1 to 7)
(7)
(Wherein the average value of n is 1 to 7)
The curing agent may be used alone or in combination. The curing agent may be added to the epoxy resin, the curing accelerator, other additives, and the like as an additional compound prepared by a linear reaction such as a melt master batch.
The composition ratio of the epoxy resin and the curing agent may be such that the equivalent ratio of the epoxy group of the epoxy resin to the equivalent of the phenolic hydroxyl group contained in the curing agent is 0.5: 1 to 2: 1. Preferably, the equivalence ratio may be from 0.8: 1 to 1.6: 1. Within the above range, the fluidity of the resin composition can be ensured and the curing time may not be delayed.
The curing agent may be contained in an amount of 0.5 to 13 wt% of the entire epoxy resin composition. Preferably 1 to 11% by weight. And more preferably 2 to 9% by weight. Within the above range, unreacted epoxy groups and phenolic hydroxyl groups are not generated in a large amount, so that the reliability can be excellent.
Hardening accelerator
The curing accelerator is a substance that promotes the reaction between the epoxy resin and the curing agent. As the curing accelerator, one or more kinds commonly known can be used. For example, the curing accelerator may be a tertiary amine, an organometallic compound, an organic phosphorus compound, an imidazole compound or a boron compound.
Specific examples of the tertiary amine include benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri (dimethylaminomethyl) phenol, 2-2- (dimethylaminomethyl) phenol, 2,4,6-tris Diaminomethyl) phenol and tri-2-ethylhexyl acid, and the like. The organometallic compounds include, but are not limited to, chromium acetylacetonate, zinc acetylacetonate, nickel acetylacetonate, and the like. The organophosphorus compound is preferably selected from the group consisting of tris-4-methoxyphosphine, tetrabutylphosphonium bromide, butyltriphenylphosphonium bromide, phenylphosphine, diphenylphosphine, triphenylphosphine, triphenylphosphine triphenylborane, Phosphine-1,4-benzoquinone adduct, and the like, but are not limited thereto. The imidazole may be selected from the group consisting of 2-methylimidazole, 2-phenylimidazole, 2-aminoimidazole, 2-methyl-1-vinylimidazole, But are not limited thereto. Examples of the boron compound include tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, tetraphenylboron salt, trifluoroborane-n-hexylamine, trifluoroborane monoethylamine, tetrafluoroborantriethylamine, Tetrafluoroborane amine, and the like, but are not limited thereto. In addition, 1,5-diazabicyclo [4.3.0] non-5-ene, 1,8-diazabicyclo [5.4.0] undec-7-ene and phenol novolac resin salts can be used.
The curing accelerator may be an adduct prepared by linearly reacting with an epoxy resin and / or a curing agent.
The curing accelerator may be contained in an amount of 0.001 to 2% by weight in the epoxy resin composition. Preferably 0.01 to 1.5% by weight. Within this range, the curing reaction time is not delayed and the fluidity of the epoxy resin composition can be ensured.
Inorganic filler
The inorganic filler is used for improving the mechanical properties and lowering the stress in the epoxy resin composition. Examples of the inorganic filler include, but are not limited to, fumed silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide and glass fiber. It is preferable to use fused silica having a low coefficient of linear expansion for low stress.
In particular, the fused silica refers to amorphous silica having a specific gravity of 2.3 or less, and may include amorphous silica obtained by melting crystalline silica or synthesized from various raw materials.
The inorganic filler may be used after surface treatment with at least one coupling agent selected from the group consisting of epoxy silane, aminosilane, mercaptosilane, alkylsilane, and alkoxysilane.
The shape and the particle diameter of the inorganic filler are not particularly limited. For example, those having an average particle diameter of 0.001 to 30 mu m can be used. Preferably, spherical fused silica having an average particle diameter of 0.001 to 30 mu m can be used.
The inorganic filler may also be a mixture of spherical fused silica having different particle diameters. For example, a mixture containing 50 to 99% by weight of spherical fused silica having an average particle diameter of 5 to 30 占 퐉 and 1 to 50% by weight of spherical fused silica having an average particle diameter of 0.001 to 1 占 퐉 may be used.
The inorganic filler may be used by adjusting the particle diameter to a maximum of 45 μm, 55 μm or 75 μm according to the use of the resin composition and the composition of the lead frame.
The inorganic filler may be contained in an appropriate ratio depending on physical properties such as moldability, low stress and high temperature strength of the epoxy resin composition. For example, the inorganic filler may be contained in an amount of 70 to 95% by weight in the epoxy resin composition. Preferably, it may be contained in an amount of 75 to 92% by weight in the epoxy resin composition. Within this range, the reliability of the package is excellent, and the fluidity and moldability can be excellent.
additive
The epoxy resin composition of the present invention may further contain additives such as a coloring agent, a coupling agent, a stress relieving agent, a flame retardant, a crosslinking promoter, a flame retardant aid, a leveling agent and a releasing agent as additives in addition to the above components.
As the colorant, carbon black or an organic or inorganic dye can be used, but the present invention is not limited thereto.
As the coupling agent, at least one selected from the group consisting of an epoxy silane, an aminosilane, a mercaptosilane, an alkylsilane, and an alkoxysilane can be used, but the present invention is not limited thereto.
The stress relieving agent may be at least one selected from the group consisting of modified silicone oil, silicone elastomer, silicone powder, and silicone resin, but is not limited thereto. As the modified silicone oil, a silicone polymer having excellent heat resistance is preferable, and one or more of silicone oil having an epoxy functional group, silicone oil having an amine functional group and silicone oil having a carboxy functional group can be mixed and used. The stress relieving agent may be contained in an amount of 0.01 to 2% by weight based on the epoxy resin composition.
As the flame retardant, an organic or inorganic flame retardant such as bromine or phosphorus, phosphazene, zinc borate, aluminum hydroxide, magnesium hydroxide and the like can be used. As the release agent, a higher fatty acid, a higher fatty acid metal salt, an ester wax and the like can be used.
In the epoxy resin composition, the additive may be contained in an amount of 0.01 to 5% by weight based on the whole epoxy resin composition. Preferably 0.5 to 4% by weight.
Another aspect of the present invention relates to a method for producing the epoxy resin composition. The method for producing the epoxy resin composition is not particularly limited. However, the components contained in the composition may be homogeneously mixed using a Henschel mixer or a Loedige mixer, and then mixed with a roll mill or a kneader at a temperature of 90 to 110 ° C Melt-kneading, cooling, and pulverizing processes. As a method of sealing a semiconductor element using an epoxy resin composition, a low pressure transfer molding method is most commonly used. However, it can also be formed by a method such as an injection molding method or a casting method. According to the above method, a lead frame pre-plated with a copper lead frame, an iron lead frame, or at least one material selected from the group consisting of nickel and palladium on the lead frame, or a semiconductor element of an organic laminate frame is manufactured .
Another aspect of the present invention relates to a semiconductor element sealed with the epoxy resin composition. Here, the sealing process is not particularly limited, and a molding machine is appropriately selected in accordance with a molding method, a semiconductor device is sealed with an epoxy resin composition and then cured by using a molding machine, and after the molded semiconductor device package is completed, A semiconductor device can be provided. The sealing molding temperature and time are preferably from 160 to 190 DEG C for 40 to 300 seconds, and the post curing temperature and time are preferably from 160 to 190 DEG C for from 0 to 8 hours.
Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.
The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.
Examples and Comparative Examples
Specific specifications of the components used in Examples and Comparative Examples are as follows.
(A) an epoxy resin
NC-3000 (Nippon Kayaku), a phenol aralkyl novolak type epoxy resin, and HP-4770 (DIC), a polyfunctional epoxy resin containing a (a2) naphthalene skeleton were used.
(B) Curing agent
(b1) A phenol resin of formula 5 (softening point 68 캜, hydroxyl equivalent 204) was used.
(b2) MEH-7800SS (Meiwa kasei), a xylock type phenol resin, was used.
(b3) Multifunctional phenol resin MEH-7500-3S (Meiwa kasei) was used.
(b4) phenol novolac resin HF-1M (Meiwa kasei) was used.
(C) Curing accelerator: triphenylphosphine TPP (Hokko) was used. At this time, the catalyst was added in an amount of 3 phr (part per hundred resin) to the epoxy resin.
(D) Inorganic filler: Spherical fused silica having an average particle diameter of 18 탆 and spherical fused silica having an average particle diameter of 0.5 탆 in a 9: 1 (weight ratio) mixture were used.
(E) Coupling agent
(e1) KBM-803 (Shinetsu) and SZ-6070 (Dow Corning chemical), which are methyltrimethoxysilane, were used.
(F) Additive
Carbon black MA-600 (Matsusita Chemical Co.) was used as (f1) carnauba wax and (f2) colorant.
Examples 1 to 3 and Comparative Examples 1 to 6
Each of the above components was weighed according to the composition shown in the following Table 1, and then uniformly mixed using a Henschel mixer to prepare a powdery primary composition. Thereafter, the mixture was melt kneaded at 95 DEG C using a continuous kneader, followed by cooling and pulverization, thereby preparing an epoxy resin composition for sealing a semiconductor device.
(Unit: wt%)
Suzy
Property evaluation method
(1) Moisture absorption rate (wt%): The resin compositions prepared in Examples and Comparative Examples were molded under conditions of a mold temperature of 170 to 180 占 폚, a conveying pressure of 1000 psi, a conveying speed of 0.5 to 1 cm / s, and a curing time of 120 seconds, 50 mm, and a thickness of 1.0 mm. The obtained specimens were placed in an oven at 170 to 180 ° C. and post-cured for 4 hours. The samples were allowed to stand for 168 hours at 85 ° C. and 85 RH% relative humidity, and the weight change due to moisture absorption was measured. 1, the moisture absorption rate was calculated.
[Formula 1]
* Moisture absorption rate = (weight of test piece after moisture absorption - weight of test piece before moisture absorption) ÷ (weight of test piece before moisture absorption) × 100
(2) Flammability: Evaluation was made on the basis of 1/8 inch thickness according to UL-94V standard.
(3) Adhesive force (kgf): A copper metal element was prepared in accordance with the mold for measurement of attachment, and the resin composition prepared in the above Examples and Comparative Examples was transferred to a prepared test piece at a mold temperature of 170 to 180 DEG C, A speed of 0.5 to 1 cm / s, and a curing time of 120 seconds to obtain a cured specimen. The obtained specimen was post-cured (PMC) in an oven at 170 to 180 ° C for 4 hours. In this case, the area of the epoxy resin composition contacting the specimen was 40 ± 1 mm 2, and the adhesion was measured by using a universal testing machine (UTM) for 12 specimens per each measuring step, and then the average value was calculated.
(4) Reliability: The eTQFP package for evaluating the flexural characteristics was dried at 125 캜 for 24 hours, and then allowed to stand for 5 cycles (one cycle consisted of 10 minutes at -65 캜, 10 minutes at 25 캜, ) Were subjected to a thermal shock test. Thereafter, the package was allowed to stand for 168 hours at 85 ° C and 60% relative humidity, and then passed through the IR reflow once for 30 seconds at 260 ° C. After the pre-conditioning condition was repeated three times, And observed with an optical microscope. Then, the occurrence of peeling between the epoxy resin composition and the lead frame was evaluated using a non-destructive inspection C-SAM (Scanning Acoustic Microscopy). When the appearance of the package is cracked or the peeling between the epoxy resin composition and the lead frame occurs, the reliability of the package can not be secured.
The epoxy resin composition having the composition shown in Table 1 was measured according to the above physical property evaluation method, and the results are shown in Table 2 below.
Properties
evaluation
Occurrences
The compositions of Examples 1 to 3 using the curing agent represented by Chemical Formula 5 of the present invention had a low moisture absorption rate and a high adhesive force as compared with the compositions using the other curing agents of Comparative Examples 1 to 6, have. In addition, flame retardancy could be ensured without addition of any flame retardant.
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.
Claims (11)
Wherein the curing agent comprises a curing agent represented by the following formula (4): < EMI ID =
[Chemical Formula 4]
(Wherein R 1 to R 4 are independently of each other hydrogen or a linear or branched alkyl group having 1 to 4 carbon atoms, and an average value of n is 1 to 9.)
[Chemical Formula 5]
(In the above formula, the average value of n is 1 to 9.)
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020120153917A KR20140083792A (en) | 2012-12-26 | 2012-12-26 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
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| KR1020120153917A KR20140083792A (en) | 2012-12-26 | 2012-12-26 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
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| KR1020120153917A KR20140083792A (en) | 2012-12-26 | 2012-12-26 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220034463A (en) * | 2020-09-11 | 2022-03-18 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| CN114437508A (en) * | 2022-03-24 | 2022-05-06 | 昆山兴凯半导体材料有限公司 | High-low temperature resistant high-fluidity epoxy resin composition for industrial control and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220034463A (en) * | 2020-09-11 | 2022-03-18 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| CN114437508A (en) * | 2022-03-24 | 2022-05-06 | 昆山兴凯半导体材料有限公司 | High-low temperature resistant high-fluidity epoxy resin composition for industrial control and application thereof |
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