201231547 六、發明說明： 【發明所屬之技術臂域】 發明領域 本發明涉及-種用於封裝半導體元件的環 物以及由該環氧樹脂組合物封裝的半導體元 g組合 地’本發明涉及-_於職铸體元件具更具體 結構的環氧樹脂的環氧樹脂組合物，以及由节产:有特定 合物封裝的半導體元件。 樹腊級 發明背景 在半導體領域，通常要求用於封裝半導體 樹脂組合物具有約為UL94 V0的阻燃性水準 的％氧 種程度阻燃性，會利用函素和無機阻燃劑來製備得這 半導體7G件的環氧樹脂組合物。尤其是，通常會用：裝 環氧樹脂和三氧㈣來製制於龍半導體元 2 脂組合物以確保阻燃性。 衣乳树 然而’利用含函阻燃劑來確保阻燃性的環氧樹脂组合 物在燃燒時會產生有毒致癌物，如戴奥辛或H而且， 在燃燒時，該含鹵關劑會產生對人财毒且雜半導體 晶片或電線以及引線框架的氣體，如HBr和HC1。 為了解決k些問題，已經提出了無齒有機阻燃劑和無 齒無機阻燃劑。對於有機阻燃劑，已研究了包括含填阻燃 劑(如填腈和磷酸醋）和含氮樹脂的新賴阻燃劑。然而，由於 含氮樹脂錢出_雜不充足，料個過量的樹脂。 201231547 有機含磷阻燃劑具有優異的阻燃性和良好的熱性能，因此 能夠適合於應用到用於封裝半導體元件的環氧樹脂組合物 中。而且，有機含磷阻燃劑不會產生磷酸和多磷酸。然而， 由於無機含磷阻燃劑與水發生反應會形成磷酸和多磷酸並 從而使可靠性變差的問題，半導體工業會限制使用有機含 填阻燃劑。 另外，雖然已研究了新穎無機阻燃劑，如氫氧化鎂或 硼酸鋅，但使用這種無機阻燃劑會使環氧樹脂組合物的固 化特性變差，並進而又會使成型性變差。 而且，因為半導體元件不僅使用由金屬（如銅和鐵)構成 的引線框架，而且還使用藉由以選自由鎳、纪、銀和金中 的至少一種材料預鍍得到的金屬引線框架，對於與這樣的 引線框架具有良好黏附性並具有良好可靠性的環氧樹脂組 合物的需求日益增加。 因此，要求用於封裝半導體元件的環氧樹脂組合物在 不使用阻燃劑時也能夠確保優異的阻燃性，同時還要求其 表現出適當的流動性以及與各種引線框架的良好黏附性和 可靠性。 【發明内容】 發明概要 本發明的一個態樣提供了 一種用於封裝半導體元件的 環氧樹脂組合物，該組合物包括環氧樹脂、固化劑、固化 促進劑、無機填料、以及填料，其中，該環氧樹脂包括由 化學式1表示的芳烴曱酿樹脂（aromatic hydrocarbon - 201231547 formakiehyde resin)改性的綠形酚醛環氧樹脂： 八 h2c—C—CH2 /°\ Η 丄 H2C —C—CH2 0 w丨201231547 VI. INSTRUCTIONS: [Technical arm field to which the invention pertains] Field of the Invention The present invention relates to a ring for encapsulating a semiconductor element and a semiconductor element g packaged by the epoxy resin composition. The present invention relates to -_ The epoxy resin composition of the epoxy resin having a more specific structure, and the semiconductor component of the specific compound package. BACKGROUND OF THE INVENTION In the field of semiconductors, it is generally required to encapsulate a semiconductor resin composition having a flame retardancy level of about UL94 V0. The degree of flame retardancy of the oxygen species is determined by using a functional element and an inorganic flame retardant. An epoxy resin composition of a semiconductor 7G piece. In particular, epoxy resin and trioxane (tetra) are usually used to prepare a long-range semiconductor resin composition to ensure flame retardancy. However, the epoxy resin composition which uses a flame retardant to ensure flame retardancy produces toxic carcinogens such as dioxin or H when burned, and when it is burned, the halogen-containing agent will produce a pair of people. Gases and miscellaneous semiconductor wafers or wires and lead frame gases such as HBr and HC1. In order to solve some of the problems, a toothless organic flame retardant and a dentless inorganic flame retardant have been proposed. For organic flame retardants, new Lai flame retardants including flame retardants (such as nitrile and phosphoric acid) and nitrogen-containing resins have been studied. However, due to the insufficient amount of nitrogen-containing resin, an excess of resin is expected. 201231547 Organic phosphorus-containing flame retardants have excellent flame retardancy and good thermal properties, and thus can be suitably applied to epoxy resin compositions for encapsulating semiconductor components. Moreover, organic phosphorus-containing flame retardants do not produce phosphoric acid and polyphosphoric acid. However, the semiconductor industry may limit the use of organic filler-containing flame retardants due to the problem that inorganic phosphorus-containing flame retardants react with water to form phosphoric acid and polyphosphoric acid and thereby degrade reliability. In addition, although novel inorganic flame retardants such as magnesium hydroxide or zinc borate have been studied, the use of such an inorganic flame retardant deteriorates the curing characteristics of the epoxy resin composition, and further deteriorates moldability. . Moreover, since the semiconductor element uses not only a lead frame composed of a metal such as copper and iron, but also a metal lead frame which is obtained by pre-plating from at least one material selected from the group consisting of nickel, nickel, silver, and gold, The demand for such an epoxy resin composition in which the lead frame has good adhesion and good reliability is increasing. Therefore, an epoxy resin composition for encapsulating a semiconductor element is required to ensure excellent flame retardancy without using a flame retardant, and it is also required to exhibit appropriate fluidity and good adhesion to various lead frames. reliability. SUMMARY OF THE INVENTION An aspect of the present invention provides an epoxy resin composition for encapsulating a semiconductor element, the composition comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a filler, wherein The epoxy resin includes a green phenolic epoxy resin modified by an aromatic hydrocarbon resin represented by Chemical Formula 1 (aromatic hydrocarbon - 201231547 formakiehyde resin): 八h2c—C—CH2 /°\ Η 丄H2C —C—CH2 0 w丨
其中，Rl和R2各自獨立地代表氫或Cl至C4直鏈或支鍵 烧基，k的平輕範圍為〇至2，以及丨的平均值範圍為⑻。 在種貫施方式中，環氧樹脂組合物中存在的由化學 式1表示的環氧樹脂的量可以為lwt%L3wt%。 在另一種實施方式巾，環氧樹脂中存在的由化學式1表 示的環氧樹脂的量可以為4〇 wt%或更多。 在一種實施方式中，所述環氧樹脂組合物可包含2wt% 至15wt%的環氧樹脂、心成至⑽％的固化劑、〇 至2wt%的固化促進劑、7_%至95鐵的無機填料、以及 0_lwt%至5wt%的添加劑。 本發明另-態樣提供了一種以用於封裝半導體元件的 環氧樹脂組合物封裝的半導體元件。 C實施方式3 具體實施方式 環氧樹脂 根據本發明一個態樣的用於封裝半導體元件的環氧樹 脂組合物，其包括環氧樹脂、固化劑、固化催化劑、無機 填料、以及添加劑，其中，所述環氧樹脂包括由化學式1表 不的芳烴甲醛樹脂改性的線形酚醛環氧樹脂： 201231547Wherein R1 and R2 each independently represent hydrogen or a Cl to C4 linear or branched group, k has a flat range of from 〇 to 2, and 丨 has an average range of (8). In the embodiment, the amount of the epoxy resin represented by Chemical Formula 1 present in the epoxy resin composition may be 1 wt% L 3 wt%. In another embodiment, the amount of the epoxy resin represented by Chemical Formula 1 present in the epoxy resin may be 4% by weight or more. In one embodiment, the epoxy resin composition may comprise 2 wt% to 15 wt% of an epoxy resin, a core to (10)% curing agent, a rubbing to 2 wt% of a curing accelerator, and an inorganic of 7 to 95% iron. Filler, and 0 to 1 wt% to 5 wt% of the additive. Another aspect of the invention provides a semiconductor component packaged in an epoxy resin composition for encapsulating a semiconductor component. C Embodiment 3 DETAILED DESCRIPTION An epoxy resin composition for encapsulating a semiconductor element according to an aspect of the present invention, which comprises an epoxy resin, a curing agent, a curing catalyst, an inorganic filler, and an additive, wherein The epoxy resin includes a novolac epoxy resin modified by an aromatic hydrocarbon formaldehyde resin represented by Chemical Formula 1: 201231547
其中，Rj〇R2各自獨立地代表氫或Cl至C4直鏈或支鏈 烷基，k的平均值範圍為0至2，以及1的平均值範圍為1至9。 特別是，在化學式1中，心和尺2代表曱基，該環氧樹脂 則具有由化學式2表示的結構：Wherein Rj〇R2 each independently represents hydrogen or Cl to a C4 straight or branched alkyl group, the average value of k ranges from 0 to 2, and the average value of 1 ranges from 1 to 9. In particular, in Chemical Formula 1, the core and the rule 2 represent a mercapto group, and the epoxy resin has a structure represented by Chemical Formula 2:
其中，k的平均值範圍為0至2,以及1的平均值範圍為1至9。 在化學式1的環氧樹脂中，心和!^可位於鄰位、間位或 對位。尤其是，化學式1的環氧樹脂可具有由化學式3表示 的結構：Wherein, the average value of k ranges from 0 to 2, and the average value of 1 ranges from 1 to 9. In the epoxy resin of Chemical Formula 1, the core and the ? can be located in the ortho, meta or para position. In particular, the epoxy resin of Chemical Formula 1 may have a structure represented by Chemical Formula 3:
其中，k的平均值範圍為0至2，以及1的平均值範圍為1 至9。 201231547 該環氧樹脂具有優異的吸濕性能、韌性、抗氧化性能 和抗裂性以及較低的交聯密度，並藉由在高溫下燃燒時形 成的焦炭層來提供阻燃性。 該環氧樹脂的環氧當量為1〇〇至35〇g/eq。在該範圍内， 該環氧樹脂組合物在固化性能、阻燃性和流動性之間能夠 達到優異平衡。尤其是’該環氧當量重可以是2〇〇至3〇〇g/eq。 該環氧樹脂的軟化點為4〇至12〇。<3，在150°C的熔體黏 度為0.1至3.0泊。在該範圍内，熔融時的流動性不會變差並 且該環氧樹脂組合物的成型性也不會變差。 可以藉由常規方法合成該環氧樹脂，也可以由可商購 的產品獲得。例如，可以使用YL 7683 (Mitsubishi Chemical)，但不限於此。 該環氧樹脂組合物中存在的該環氧樹脂的量可以為 lwt%至13wt%。在該範圍内，該環氧樹脂組合物能夠具有 良好的流動性、阻燃性、黏附性、以及可靠性。尤其是， 該環氧樹脂組合物中存在的環氧樹脂的量為2wt%至9wt%。 該環氧樹脂組合物可包括通常與以化學式1表示之環 氧樹脂一起使用於生產環氧樹脂組合物的環氧樹脂。例 如’這樣的環氧樹脂可為（但不限於)任何具有至少兩個環氧 基的環氧樹脂，並且可以包括選自由單體、寡聚物和聚合 物組成的組群中的至少一種。 尤其是’該環氧樹脂可包括(但不限於)選自以下的至少 一種：藉由酚類或烷基酚類與羥基苯甲醛的縮合物的環氧 化反應得到的環氧樹脂、苯酚線形酚醛型環氧樹脂(phenol 201231547 novolac type epoxy resin)、曱酚線形酚醛型環氧樹脂、多官 能基環氧樹脂、萘酚線形酚醛型環氧樹脂、雙酚A/雙酚f/ 雙齡AD線形祕型環氧樹脂、妙A/雙鮮/雙盼Αβ縮水甘 油醚、二羥基聯笨基環氧樹脂、二環戊二烯環氧樹脂、聯 苯型環氧樹脂、多環芳煙改性的環氧樹脂、雙盼A環氧樹 月曰、鄰曱酚線形酚醛型環氧樹脂、苯酚芳烷基型環氧樹脂 (phenol aralkyl type epoxy resjn)、以及萘環氧樹脂。 尤其是，可以使用包括由化學式4表示的聯笨衍生物的 苯酚芳烷基線形酚醛環氧樹脂、由化學式5表示的聯苯環氧 樹脂、或由化學式6表示的新酚環氧樹脂（xyU)c ep〇xy resin)：Wherein, the average value of k ranges from 0 to 2, and the average value of 1 ranges from 1 to 9. 201231547 The epoxy resin has excellent moisture absorption properties, toughness, oxidation resistance and crack resistance, and low crosslink density, and provides flame retardancy by forming a coke layer when burned at a high temperature. The epoxy resin has an epoxy equivalent of from 1 Å to 35 Å/eq. Within this range, the epoxy resin composition can achieve an excellent balance between curing properties, flame retardancy, and fluidity. In particular, the epoxy equivalent weight may be from 2 Torr to 3 〇〇 g/eq. The epoxy resin has a softening point of 4 to 12 Å. <3, the melt viscosity at 150 ° C is 0.1 to 3.0 poise. Within this range, the fluidity at the time of melting does not deteriorate and the moldability of the epoxy resin composition does not deteriorate. The epoxy resin can be synthesized by a conventional method or can be obtained from a commercially available product. For example, YL 7683 (Mitsubishi Chemical) can be used, but is not limited thereto. The amount of the epoxy resin present in the epoxy resin composition may range from 1 wt% to 13 wt%. Within this range, the epoxy resin composition can have good fluidity, flame retardancy, adhesion, and reliability. In particular, the amount of the epoxy resin present in the epoxy resin composition is from 2% by weight to 9% by weight. The epoxy resin composition may include an epoxy resin which is usually used together with an epoxy resin represented by Chemical Formula 1 to produce an epoxy resin composition. For example, such an epoxy resin may be, but is not limited to, any epoxy resin having at least two epoxy groups, and may include at least one selected from the group consisting of monomers, oligomers, and polymers. In particular, the epoxy resin may include, but is not limited to, at least one selected from the group consisting of epoxy resins obtained by epoxidation of phenols or condensates of alkylphenols with hydroxybenzaldehyde, and phenol novolacs. Epoxy resin (phenol 201231547 novolac type epoxy resin), nonylphenol novolac epoxy resin, polyfunctional epoxy resin, naphthol novolac epoxy resin, bisphenol A / bisphenol f / double age AD linear Secret type epoxy resin, Miao A/double fresh/double anti-β-glycidyl ether, dihydroxy-linked epoxy resin, dicyclopentadiene epoxy resin, biphenyl type epoxy resin, polycyclic aromatic smoke modification Epoxy resin, bismuth A epoxy tree, phthalocyanine novolac type epoxy resin, phenol aralkyl type epoxy resin, and naphthalene epoxy resin. In particular, a phenol aralkyl novolak epoxy resin including a biphenyl derivative represented by Chemical Formula 4, a biphenyl epoxy resin represented by Chemical Formula 5, or a neophenol epoxy resin represented by Chemical Formula 6 (xyU) can be used. )c ep〇xy resin):
[化學式5][Chemical Formula 5]
201231547 其中’ η的平均值範圍為1至9。 該環氧樹脂可包括藉由使這些環氧樹脂與其他添加劑 的預反應仔到的加合物，如熔體母料(ΜΜΒ)，所述添加劑 如固化劑、固化促進劑、脫模劑、偶聯劑等。 如果該環氧樹脂組合物同時包括由化學式W示的環 氧f脂和前面提及的其他環氧樹脂，縣於該環氧樹脂的 〜里由化學式1表示的環氧樹脂的存在量可以為或 更多。在這個範圍内，能夠確保該環氧樹脂組合物的阻燃 性，並且具有良好的黏附性、可靠性、以及流動性。尤其 是’含量可以為5〇Wt%或更多，較佳為⑻至觸㈣。 該環氧樹脂組合4勿中化學式！的環氧樹脂本身或其混 合物的存在量可以為2至i5wt%。 固化劑 固化劑可包括通常用於半導體封裝並含有至少兩個酚 羥基的任何固化劑。該固化劑可選自由單體、寡聚物和聚 合物組成的組群。 固化劑的實例可包括，但不限於，苯酚芳烷基型酚醛 樹脂，酌·線形酚醛型酚醛樹脂(phen〇i nov〇iactypephen〇lic resin) ’新酚型酚醛樹脂(xyi〇c type phen〇lic郎⑻，曱酚線 开’紛酿型盼搭樹脂，萘酌型酴酿樹脂，萜烯型齡搭樹脂， 多g此基紛越樹脂，多環芳烴型紛搭樹脂，二環戊二烯紛 醛樹脂，祐烯改性的酚醛樹脂，二環戊二烯改性的酚醛樹 脂，由雙酚A與可溶性酚醛樹脂(res〇l)合成的線形酚醛型酚 醛樹脂，包括三(羥苯基）甲烷、二羥基聯苯基的多羥基酚醛 201231547 化合物，包括馬來酸酐和鄰苯二曱酸酐的酸酐，以及包括 間-苯二胺、二氨基二苯基甲烷和二氨基氨苯砜的芳香胺。 尤其是，可使用由化學式7表示的含有聯苯衍生物的線 形酚醛結構的苯酚芳烷基型酚醛樹脂或由化學式8表示的 新紛型酌·酿樹脂作為固化劑： [化學式7]201231547 where ' η has an average value ranging from 1 to 9. The epoxy resin may include an adduct obtained by pre-reacting these epoxy resins with other additives, such as a melt masterbatch, such as a curing agent, a curing accelerator, a release agent, Coupling agent, etc. If the epoxy resin composition includes both the epoxy f grease represented by the chemical formula W and the other epoxy resins mentioned above, the epoxy resin represented by the chemical formula 1 in the epoxy resin may be present in an amount of Or more. Within this range, the flame retardancy of the epoxy resin composition can be ensured, and good adhesion, reliability, and fluidity can be obtained. In particular, the content may be 5 〇 Wt% or more, preferably (8) to touch (4). The epoxy resin combination 4 is not in the chemical formula! The epoxy resin itself or a mixture thereof may be present in an amount of from 2 to i5 wt%. Curing Agent The curing agent may comprise any curing agent typically used in semiconductor packages and containing at least two phenolic hydroxyl groups. The curing agent may be selected from the group consisting of monomers, oligomers, and polymers. Examples of the curing agent may include, but are not limited to, a phenol aralkyl type phenol resin, a phenol phenolic phenol resin (phen 〇 〇 〇 phenol phenol resin) (new phenol type phenol resin) Liclang (8), phenolic line open 'mixed type is looking for resin, naphthalene type brewing resin, terpene type ageing resin, more g this base more resin, polycyclic aromatic hydrocarbon type resin, dicyclopentane Alkene-formaldehyde resin, olefin-modified phenolic resin, dicyclopentadiene-modified phenolic resin, novolac type phenolic resin synthesized from bisphenol A and soluble phenolic resin (res〇l), including tris(hydroxybenzene) a polyhydroxyphenolic aldehyde having a methane, dihydroxybiphenyl group 201231547 compound, including an anhydride of maleic anhydride and phthalic anhydride, and including m-phenylenediamine, diaminodiphenylmethane, and diamino dapsone In particular, a phenol aralkyl phenol resin having a novolac structure containing a biphenyl derivative represented by Chemical Formula 7 or a novel styrene resin represented by Chemical Formula 8 can be used as a curing agent: [Chemical Formula 7] ]
OH OHOH OH
其中，η的平均值範圍為1至7。 這些固化劑可單獨使用或以組合物的形式使用。而 且，該固化劑也可以是加合物，例如藉由使這些固化劑與 環氧樹脂、固化促進劑、以及其他添加劑發生預反應得到 的 ΜΜΒ。 基於環氧樹脂與固化劑之間的比率，該環氧樹脂中的 環氧基的當量重與固化劑中的酚羥基的當量重的比率為 0.5 : 1至2 : 1。在這個範圍内，能夠確保樹脂組合物的流 動性並且不會延遲固化過程。尤其是，該當量重比可以是 0.8 : 1至 1.6 :卜 10 201231547 該環氧樹脂組合物中存在的該固化劑的量為0.5wt%至 12wt%。尤其是，該環氧樹脂組合物中存在的固化劑的量 為 1 wt% 至 10wt%。 固化促進劑 固化促進劑是一種能夠促進該環氧樹脂與該固化劑之 間反應的物質。所述固化促進劑可包括至少一種本領域已 知的固化促進劑。例如，該固化促進劑可包括叔胺、有機 金屬化合物、有機填化合物、D米α坐化合物、侧化合物等。 尤其是，該叔胺的實例可包括苄基二曱胺、三羥乙基 胺、三亞乙基二胺、二曱氨基乙醇、三（二曱氨基曱基）苯酚、 2,2-(二曱氨基甲基）苯酚、2,4,6-三（二氨基甲基）苯酚、以及 三-2-乙基己酸的鹽，但不限於此。該有機金屬化合物實例 可包括乙醯丙酮鉻、乙醯丙酮鋅、以及乙醯丙酮鎳，但不 限於此。該有機磷化合物實例可包括三-4-甲氧基膦、四丁 基溴化鱗、丁基三苯基溴化鱗、苯基膦、二苯基膦、三苯 基膦、三苯基膦三苯基硼、以及三苯基-膦-1,4-苯醌加合 物，但不限於此。該咪唑化合物實例可包括2-曱基咪唑、 2-苯基咪唑、2-氨基咪唑、2-曱基-1-乙烯基咪唑、2-乙基-4-甲基咪唑、以及2-十七基咪唑，但不限於此。該硼化合物 實例可包括四苯基鱗-四苯基硼酸酯/鹽、三苯基膦三苯基硼 酸酯/鹽、四苯硼鹽、三氟硼烷-正己胺、三氟硼烷單乙胺、 四氟硼烷三乙胺、以及四氟硼烷胺，但不限於此。另外， 可以使用1,5-二氮雜二環[4.3.0]壬-5-烯(DBN)、1,8-二氮雜 <9 二環[5.4.0]十一碳-7-烯(DBU)以及酚線形酚醛樹脂鹽。 11 201231547 此外，該固化促進劑還可以為藉由與該環氧樹月旨或該 固化劑發生預反應得到的加合物。 該環氧樹脂組合物中存在的該固化促進劑的量為 O.Olvvt%至2wt%。尤其是，該環氧樹脂組合物中存在=該 固化促進劑的量為〇.〇2wt%至i.5wt%。 無機填料 無機填料常用於改善該環氧樹脂組合物的機械性能並 同時減小應力。無機填料的實例可包括溶融二氧化石夕、'士 晶二氧切、碳酸L議、氧傾、氧化鎂、勘土 了 滑石、矽酸鈣、氧化鈦、氧化銻、以及玻璃纖維，但不限 於此。尤其是，可以使用具有低線膨脹係數㈣融（ 矽以減小應力。 —乳 2其是’該炼融二氧切是指具有&重為約23或更小 的非晶形二氧化矽(am〇rph〇us —a) ’其可藉由熔化結晶形 -氧化♦或自各種原料合成來製備。 用中’可用選自由環氧矽烷、氨基矽烷、矽 说、燒基料以狀氧基㈣組成的組中的 劑對該無機填料進行表面處理。 種偶聯 e對於4無機填料的形狀和粒徑沒有特別限制可 二使，融二氧切、平均粒徑約為麵㈣至尊①的球 ,^ 氧化矽。該無機填料也可以是具有不同粒徑的球 :溶:—氧化分的混合物。在這種情況下，該，熔融二氧化 夕展0物包括約5Gwt%至99wt%的·平均粒徑為約5μπι至 30μπι的球形炫_ * 峨一氧化矽以及約1 wt%至50wt%的平均粒 12 201231547 徑為約Ο.ΟΟΙμιη至Ιμπι的球形熔融二氧化矽。 而且，可將該無機填料的粒徑調整為45μπι、55μηι和 75μπι中之一的最大值，這取決於樹脂組合物的應用和引線 框架的組成。 考慮到物理性質，如該環氧樹脂組合物的成型性、應 力以及财溫性，可以適當的比率添加無機填料。例如，該 環氧樹脂組合物中存在的該無機填料的量可以為70wt%至 95wt%。尤其是，該環氧樹脂組合物中存在的該無機填料 的量可以為75wt%至92wt%。 添加劑 該環氧樹脂組合物可進一步包括添加劑，如著色劑、 偶聯劑、應力減小劑、阻燃劑、交聯促進劑、阻燃助劑、 流平劑（leveling agent)、以及脫模劑。 該著色劑的實例可包括炭黑、有機染料、或無機染料， 但不限於此。該偶聯劑的實例可包括選自由環氧矽烷、氨 基石夕烧、输基石夕炫<、炫基石夕烧、以及院氧基石夕院組成的組 中的至少一種，但不限於此。該應力減小劑可包括選自由 改性矽油、矽酮彈性體、矽酮滑石粉以及有機矽樹脂組成 的組群中的至少一種，但不限於此。這裡，改性矽油，即 具有優異耐熱性的矽酮聚合物是適合的，並且其可與具有 環氧基的矽油、具有胺基的矽油、以及具有羧基的矽油中 的至少一種混合，但不限於此。該環氧樹脂組合物中存在 的應力減小劑的量為0.01 Wt%至2wt%。該阻燃劑實例可包 括有機和無機阻燃劑，如含溴或含磷阻燃劑、磷肌酸 13 201231547 (phosphagen)、删酸辞、氫氧化|g、以及氫氧化鎮。該脫模 劑實例可包括高級脂肪酸、高級脂肪酸金屬鹽、以及酯蠟。 該環氧樹脂組合物中存在的添加劑的量可以為0.1 wt% 至 5wt%。 對於製備該環氧樹脂組合物的方法沒有特別限制，該 環氧樹脂組合物可以藉由使用Henschel或Redige混合器將 該組合物組分均勻混合，利用輥式研磨機或捏合機在90°C 至110°C下熔融捏合，以及冷卻並研磨該混合物來製備。對 於利用該環氧樹脂組合物封裝半導體元件的方法，可以採 用低壓轉移成型。另外，也可以使用注射成型或澆鑄成型。 利用這些方法，可以製造具有一銅引線框架，一鐵引線框 架，一藉由以選自由鎳、銅和纪組成的組群中的至少一物 質預鍍引線框架而得到的引線框架，或一有機層壓框架的 半導體元件。 本發明的另一態樣提供了 一種利用該環氧樹脂組合物 封裝的半導體元件。利用該組合物封裝半導體的方法是公 知的。 接下來，將參照以下實施例對本發明的構成和功能作 更為詳盡地闡述。所提供的這些實施例僅以說明為目的， 在任何情況下都不能認為是對本發明的限制。 本文中省略了對本領域技術人員而言是顯而易見的細 節的描述。 . 實施例1至3和比較例1至3中使用的組分的詳細情況描 述如下。 14 201231547 (A) 環氧樹脂 (al)芳烴曱醛（樹脂）改性的線形酚醛環氧樹脂， YL-7683(Mitsubishi Chemical) (a2)苯紛芳烧基環氧樹脂，NC-3000(NipponKayaku) (a3)聯苯環氧樹脂，YH-4000H(Mitsubishi Chemical) (a4)新酚環氧樹脂，NC-2000-l(NipponKayaku) (B) 固化劑 (bl)笨酚芳烷基酚醛樹脂，MEH-7851SS(MeiwaKasei) (b2)新酚酚醛樹脂，MEH-7800SS(MeiwaKasei) (C) 無機填料：平均粒徑為ΐ8μιη的球形熔融二氧化矽和 平均粒徑為0·5μηι的球形熔融二氧化矽以9 : 1的重量比混 合。 (D) 固化促進劑：三苯基膦(Hokko) (E) 偶聯劑 (el)魏基石夕烧 ’ KBM-803(Shinetsu) (e2)烧氧基石夕烧 ’ sz-6070(Dow Corning chemical) (F) 脫模劑：巴西棕橺蠟 (G) 著色劑.厌黑 ’ MA-600(Matsushita Chemical) 實施例1至3 根據表1列出組成加入環氧樹脂、固化劑、固化促進 劑、無機填料、偶聯劑、著色劑 '以及脫模劑，並利用Henschel 混合器將其混合均勻。在9 5 °C至110。(：下利用連續捏合機將 該混合物炼融捏合，然後冷卻並研磨，由此得到用於封裝 半導體元件的環氧樹脂組合物。 15 201231547 比較例1至3 除了根據在表1中列出的組成使用的環氧樹脂、固化 劑、固化促進劑、無機填料、偶聯劑、著色劑、以及脫模 劑之外，利用與實施例相同的方式製備用於封裝半導體元 件的環氧樹脂組合物。在表1中，單位是Wt%。 表1 實施例 比較例 1 2 3 1 2 3 (A) (al) 芳烴曱醛樹脂改性的 線形酚醛環氧樹脂 7.15 6.72 3.22 - - - (a2) 苯盼芳烧基盼酸樹 脂 - - - 6.72 - - (a3) 聯苯環氧樹脂 - - 3.22 - 5.89 - (a4) 酚醛樹脂 - - - - - 6.44 (B) (bl) 苯盼芳烧基盼醒樹 脂 - 4.98 2.63 4.98 5.81 5.26 (b2) 酚醛樹脂 4.55 - 2.63 - - - (C) 熔融二氧化矽 87.00 87.00 87.00 87.00 87.00 87.00 (D) 三苯基膦 0.20 0.20 0.20 0.20 0.20 0.20 (E) (el) 巯基矽烷 0.20 0.20 0.20 0.20 0.20 0.20 (e2) 烷氧基矽烷 0.30 0.30 0.30 0.30 0.30 0.30 (F) 巴西棕橺蠟 0.30 0.30 0.30 0.30 0.30 0.30 (G) 炭黑 0.30 0.30 0.30 0.30 0.30 0.30 試驗：環氧樹脂組合物的物理性能的評價 根據表2中列出的以下特性對實施例和比較例中製備 的每一種環氧樹脂組合物進行評價，其結果示於表2中。 <評價方法> 1. 流動性 依據EMMI-1-66，利用測量模具和轉移模壓機在175°C 和70 kgf/cm2測量出每一種組合物的流長(flow length)。 2. 阻燃性 16 201231547 依據UL94V-0，利用厚度為1/8英寸的試樣對阻燃性進 行評價。 ~ 3. 黏合強度 製備具有適合於用來測量黏合強度的模具的尺寸的銅 基板，並以鎳-鈀-金和鎳-鈀-金/銀預鍍該銅樣品而製備成試 樣。在170至180°C的成型溫度、1〇〇〇psi的轉移壓力、以及 0.5至lem/s的轉移速率下，將實施例和比較例中製備的每一 種樹脂組合物與每一試樣一起固化12〇秒成型，從而得到固 化樣品。將此樣品放入170至i8〇°C的烘箱中，使其經歷後成 型固化(PMC)4h，然後立刻進行預處理(pre_c〇nditi〇ning)， 即使該樣品在260°C下在30秒内藉由一次紅外線回流焊（IR reflow) ’隨後測量黏合強度。另外，在PMC之後，將樣品在 60°C和60%RH下放置120小時，然後以同樣的方式進行預處 理，隨後測量黏合強度。此處，環氧樹脂組合物與樣品接觸 的面積為40±lmm2，藉由萬能試驗機(UTM)測得每一過程的 12個樣品並計算它們的平均值來得到黏合強度。 4. 可靠性 在H5°C，利用多柱塞系統(MPS)將實施例和比較例中 製備的環氧樹脂組合物進行轉移成型60秒，從而分別製備 包括銅基板的256薄型方型扁平式封裝（LQFP， 28mmx28mmxl.4mm)和包括其中銅基板用鎳-鈀-金或鎳-鈀-金/銀進行預鍍的引線框架的256LQFP (28mm x28mm xl_4mm)。該封裝在175°C經歷PMC持續4小時，並在25°C冷 卻。然後，在125°C乾燥該封裝24小時，接著經歷5次熱衝 17 201231547 擊試驗迴圈（1次迴圈意味著將該封裝在-65°C放置10分鐘， 在25°C放置10分鐘以及在150°C放置10分鐘）。隨後，對該 封裝進行預處理，也就是說，將該封裝在60°C和60%RH下 放置120小時，再完成三次在260°C持續30秒的IR回流焊， 接著用光學顯微鏡觀察該封裝以鑒別是否出現裂紋。使用 非破壞性試驗機，如掃描聲學顯微鏡(SAM)，對環氧樹脂 組合物與引線框架發生剝離的情況進行評價。 表2 ί 『施例 t 較例 1 2 3 1 2 3 流動性（英寸） 50 54 62 50 80 48 阻燃性 V-0 V-0 V-0 V-0 V-l V-l 對Cu引線框架的黏合 強度(kgf) PMC，回流焊 82 86 85 74 82 68 PMC，在 60°C /60%RH儲存 120小時並經回流焊 78 83 81 69 85 62 對Ni-Pd-Au引線框架 的黏合強度(kgf) PMC，回流焊 63 64 61 62 60 54 PMC，在 60°C /60%RH儲存 120小時，回流焊 54 52 50 50 50 40 對 Ni-Pd-Au/Ag 引線 框架的黏合強度(kgf) PMC，回流焊 78 82 75 68 76 62 PMC，在60°C/60%RH儲存 120小時，回流焊 72 75 70 64 68 53 可 靠 性 Cu引線框架 裂縫數 0 0 0 0 0 0 剝離數 0 0 0 0 12 42 測試所用的半導體元件總數 80 80 80 80 80 80 Ni-Pd-Au 引線框架 裂縫數 0 0 0 0 0 0 剝離數 0 0 0 0 32 80 測試所用的半導體元件總數 80 80 80 80 80 80 Ni-Pd-Au/Ag 引線框架 裂縫数 0 0 0 0 0 0 剝離数 0 0 0 3 12 測試所用的半導體元件總數 80 80 80 80 80 80 如表2所示，根據本發明的包括環氧樹脂的組合物與各 種引線框架具有良好的黏附性，並且與不包括根據本發明 的環氧樹脂的組合物相比具有良好的阻燃性。而且，與包 括根據比較例3的具有與化學式1相似Μ構的新酚環氧樹脂 的組合物相比，包括依據本發明的環氧樹脂的組合物能夠 18 201231547 保證v-o阻燃性。由於具有適當的抗剝離性，這些組合物還 具有良好的可靠性。 儘管本發明彼露了 一些實施方式，但應該理解，提供 這些實施方式僅僅是以說明為目的，在不背離本發明的精 神和範圍的前提下，可進行各種修飾、改變、以及變化。 因此，本發明的範圍僅由所附申請專利範圍及其等同替代限 定。 I：圖式簡單說明3 (無） 【主要元件符號說明】 (無） 19Wherein, the average value of η ranges from 1 to 7. These curing agents can be used singly or in the form of a composition. Further, the curing agent may be an adduct such as ruthenium obtained by pre-reacting these curing agents with an epoxy resin, a curing accelerator, and other additives. The ratio of the equivalent weight of the epoxy group in the epoxy resin to the equivalent weight of the phenolic hydroxyl group in the curing agent is from 0.5:1 to 2:1, based on the ratio between the epoxy resin and the curing agent. Within this range, the fluidity of the resin composition can be ensured without delaying the curing process. In particular, the equivalent weight ratio may be from 0.8:1 to 1.6:b 10 201231547 The amount of the curing agent present in the epoxy resin composition is from 0.5% by weight to 12% by weight. In particular, the amount of the curing agent present in the epoxy resin composition is from 1 wt% to 10 wt%. Curing accelerator The curing accelerator is a substance that promotes the reaction between the epoxy resin and the curing agent. The curing accelerator may include at least one curing accelerator known in the art. For example, the curing accelerator may include a tertiary amine, an organometallic compound, an organic filler compound, a D-methane compound, a side compound, and the like. In particular, examples of the tertiary amine may include benzyldiamine, trishydroxyethylamine, triethylenediamine, dimercaptoaminoethanol, tris(diaminoaminodecyl)phenol, 2,2-(difluorene). A salt of aminomethyl)phenol, 2,4,6-tris(diaminomethyl)phenol, and tris-2-ethylhexanoic acid, but is not limited thereto. Examples of the organometallic compound may include, but are not limited to, chromium acetonitrile, zinc acetoacetate, and nickel acetonitrile. Examples of the organophosphorus compound may include tris-methoxyphosphine, tetrabutyl bromide, butyl triphenyl bromide, phenylphosphine, diphenylphosphine, triphenylphosphine, triphenylphosphine. Triphenyl boron, and triphenyl-phosphine-1,4-benzoquinone adduct, but are not limited thereto. Examples of the imidazole compound may include 2-mercaptoimidazole, 2-phenylimidazole, 2-aminoimidazole, 2-mercapto-1-vinylimidazole, 2-ethyl-4-methylimidazole, and 2-seven Imidazole, but is not limited thereto. Examples of the boron compound may include tetraphenylsulfonium-tetraphenyl borate, triphenylphosphine triphenyl borate, tetraphenylboron, trifluoroborane-n-hexylamine, trifluoroborane Monoethylamine, tetrafluoroborane triethylamine, and tetrafluoroborane amine, but are not limited thereto. Further, 1,5-diazabicyclo[4.3.0]non-5-ene (DBN), 1,8-diaza <9 bicyclo[5.4.0]undec-7- can be used. Alkene (DBU) and phenol novolak resin salt. 11 201231547 Further, the curing accelerator may be an adduct obtained by pre-reacting with the epoxy resin or the curing agent. The amount of the curing accelerator present in the epoxy resin composition is from O.Olvvt% to 2% by weight. In particular, the amount of the curing accelerator present in the epoxy resin composition is from 〇2〇% to i.5% by weight. Inorganic Fillers Inorganic fillers are commonly used to improve the mechanical properties of the epoxy resin composition while reducing stress. Examples of the inorganic filler may include molten silica, celestial dioxygen, carbonic acid, oxygen, magnesium oxide, talc, calcium citrate, titanium oxide, cerium oxide, and glass fiber, but not Limited to this. In particular, it is possible to use a low coefficient of linear expansion (four) melting (矽 to reduce stress. - milk 2 which is 'this smelting dioxo refers to amorphous cerium oxide having & weight of about 23 or less ( Am〇rph〇us —a) 'It can be prepared by melting crystalline form-oxidation ♦ or synthesizing from various raw materials. In use, it can be selected from epoxy decane, amino decane, oxime, and oxylate. (4) The agent in the group of the surface is subjected to surface treatment of the inorganic filler. The coupling e is not particularly limited to the shape and particle diameter of the 4 inorganic filler, and the divalent cut and the average particle diameter are about the surface (four) to the first one. Ball, ^ cerium oxide. The inorganic filler may also be a mixture of spheres having different particle sizes: solute: - oxidizing component. In this case, the molten cerium oxide comprises about 5 Gwt% to 99 wt% - spherical spheroidal yttrium having an average particle diameter of about 5 μm to 30 μm and an average particle of about 1 wt% to 50 wt% 12 201231547 A spherical molten cerium oxide having a diameter of about Ο.ΟΟΙμιη to Ιμπι. The particle size of the inorganic filler is adjusted to 45 μm, 55 μm, and 75 μm The maximum value of one of them depends on the application of the resin composition and the composition of the lead frame. In consideration of physical properties such as moldability, stress and richness of the epoxy resin composition, an inorganic filler may be added in an appropriate ratio. For example, the amount of the inorganic filler present in the epoxy resin composition may be from 70% by weight to 95% by weight. In particular, the amount of the inorganic filler present in the epoxy resin composition may be from 75% by weight to 92% by weight. Additives The epoxy resin composition may further include additives such as color formers, coupling agents, stress reducing agents, flame retardants, crosslinking accelerators, flame retardant aids, leveling agents, and demolding agents. Examples of the coloring agent may include, but are not limited to, carbon black, an organic dye, or an inorganic dye. Examples of the coupling agent may include those selected from the group consisting of epoxy decane, amino sulphide, and sylvestite At least one of the group consisting of, and not limited to, the group consisting of modified eucalyptus oil, fluorenone elastomer, fluorenone talc powder and organic eucalyptus At least one of the constituent groups, but is not limited thereto. Here, a modified eucalyptus oil, that is, an anthrone polymer having excellent heat resistance, is suitable, and it can be combined with an eucalyptus oil having an epoxy group and an eucalyptus oil having an amine group. And at least one of the eucalyptus oil having a carboxyl group is mixed, but is not limited thereto. The amount of the stress reducing agent present in the epoxy resin composition is 0.01 Wt% to 2% by weight. Examples of the flame retardant may include organic and inorganic Flame retardant, such as bromine- or phosphorus-containing flame retardant, phosphocreatine 13 201231547 (phosphagen), sulphate, hydroxide|g, and oxyhydroxide. Examples of the release agent may include higher fatty acid, higher fatty acid metal Salt, and ester wax. The amount of the additive present in the epoxy resin composition may range from 0.1 wt% to 5 wt%. There is no particular limitation on the method of preparing the epoxy resin composition, which can be uniformly mixed by using a Henschel or Redige mixer, using a roll mill or a kneader at 90 ° C. It was prepared by melt-kneading at 110 ° C, and cooling and grinding the mixture. For the method of encapsulating a semiconductor element using the epoxy resin composition, low pressure transfer molding can be employed. In addition, injection molding or casting molding can also be used. With these methods, it is possible to manufacture a lead frame having a copper lead frame, an iron lead frame, a pre-plated lead frame by at least one substance selected from the group consisting of nickel, copper and ge, or an organic A semiconductor component of a laminated frame. Another aspect of the present invention provides a semiconductor component packaged using the epoxy resin composition. Methods of encapsulating semiconductors using such compositions are well known. Next, the constitution and function of the present invention will be explained in more detail with reference to the following examples. The examples are provided for illustrative purposes only and are not to be considered as limiting the invention in any way. Descriptions of details that will be apparent to those skilled in the art are omitted herein. The details of the components used in Examples 1 to 3 and Comparative Examples 1 to 3 are described below. 14 201231547 (A) Epoxy resin (al) aromatic hydrocarbon furfural (resin) modified novolac epoxy resin, YL-7683 (Mitsubishi Chemical) (a2) benzene aryl aromatic epoxy resin, NC-3000 (NipponKayaku (a3) biphenyl epoxy resin, YH-4000H (Mitsubishi Chemical) (a4) neophenol epoxy resin, NC-2000-l (NipponKayaku) (B) curing agent (bl) phenol aralkyl phenolic resin, MEH-7851SS(MeiwaKasei) (b2) Neophenol phenolic resin, MEH-7800SS (MeiwaKasei) (C) Inorganic filler: spherical molten cerium oxide with an average particle size of ΐ8μιη and spherical molten oxidized with an average particle size of 0.5 μm混合 Mix in a weight ratio of 9:1. (D) Curing accelerator: Triphenylphosphine (Hokko) (E) Coupling agent (el) Wei Ke Shi Xia' KBM-803 (Shinetsu) (e2) Oxygen-based Xi'an sz-6070 (Dow Corning chemical (F) Release agent: Brazilian brown enamel wax (G) Colorant. Black-resistant 'MA-600 (Matsushita Chemical) Examples 1 to 3 According to Table 1, the composition is added with an epoxy resin, a curing agent, and a curing accelerator. , inorganic fillers, coupling agents, colorants' and release agents, and they are evenly mixed using a Henschel mixer. At 9 5 °C to 110. (The mixture was smelted and kneaded by a continuous kneader, and then cooled and ground, thereby obtaining an epoxy resin composition for encapsulating a semiconductor element. 15 201231547 Comparative Examples 1 to 3 Except according to the contents listed in Table 1 An epoxy resin composition for encapsulating a semiconductor element is prepared in the same manner as in the embodiment except for using an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a coupling agent, a colorant, and a releasing agent. In Table 1, the unit is Wt%. Table 1 Example Comparative Example 1 2 3 1 2 3 (A) (al) Aromatic furfural resin modified novolac epoxy resin 7.15 6.72 3.22 - - - (a2) Benzene aryl benzoic acid resin - - - 6.72 - - (a3) Biphenyl epoxy resin - - 3.22 - 5.89 - (a4) Phenolic resin - - - - - 6.44 (B) (bl) Benzene aryl base Rescuing Resin - 4.98 2.63 4.98 5.81 5.26 (b2) Phenolic Resin 4.55 - 2.63 - - - (C) Fused cerium oxide 87.00 87.00 87.00 87.00 87.00 87.00 (D) Triphenylphosphine 0.20 0.20 0.20 0.20 0.20 0.20 (E) ( El) decyl decane 0.20 0.20 0.20 0.20 0.20 0.20 (e2) alkoxy decane 0.30 0. 30 0.30 0.30 0.30 0.30 (F) Brazilian brown wax 0.30 0.30 0.30 0.30 0.30 0.30 (G) Carbon black 0.30 0.30 0.30 0.30 0.30 0.30 Test: Evaluation of the physical properties of the epoxy resin composition according to the following characteristics listed in Table 2 Each of the epoxy resin compositions prepared in the examples and the comparative examples was evaluated, and the results are shown in Table 2. <Evaluation method> 1. Flowability According to EMMI-1-66, measurement mold and transfer mold were used. The flow length of each composition was measured at 175 ° C and 70 kgf/cm 2 . 2. Flame Retardancy 16 201231547 According to UL94V-0, flame retardant was tested with a thickness of 1/8 inch. Evaluation of properties. ~ 3. Adhesive strength Preparation of a copper substrate having a size suitable for the mold used to measure the bond strength, and pre-plating the copper sample with nickel-palladium-gold and nickel-palladium-gold/silver to prepare a test Each of the resin compositions prepared in the examples and the comparative examples was tested with a molding temperature of 170 to 180 ° C, a transfer pressure of 1 psi, and a transfer rate of 0.5 to lem/s. The samples were cured together for 12 sec seconds to obtain a cured sample. The sample was placed in an oven at 170 to i8 ° C, subjected to post-forming cure (PMC) for 4 h, and immediately pretreated (pre_c〇nditi〇ning), even though the sample was at 260 ° C for 30 seconds. The adhesion strength was subsequently measured by IR reflow. Further, after the PMC, the sample was allowed to stand at 60 ° C and 60% RH for 120 hours, and then pretreated in the same manner, and then the adhesive strength was measured. Here, the area where the epoxy resin composition was in contact with the sample was 40 ± 1 mm 2 , and 12 samples of each process were measured by a universal testing machine (UTM) and their average values were calculated to obtain an adhesive strength. 4. Reliability The epoxy resin composition prepared in the examples and the comparative examples was subjected to transfer molding at H5 ° C for 60 seconds using a multi-plunger system (MPS) to prepare a 256 thin square flat type including a copper substrate, respectively. A package (LQFP, 28 mm x 28 mm x 1.4 mm) and a 256 LQFP (28 mm x 28 mm x l_4 mm) including a lead frame in which a copper substrate is pre-plated with nickel-palladium-gold or nickel-palladium-gold/silver. The package was subjected to PMC at 175 ° C for 4 hours and cooled at 25 ° C. Then, the package was dried at 125 ° C for 24 hours, followed by 5 hot passes 17 201231547 hit test loop (1 loop means that the package was placed at -65 ° C for 10 minutes and at 25 ° C for 10 minutes) And placed at 150 ° C for 10 minutes). Subsequently, the package was pretreated, that is, the package was placed at 60 ° C and 60% RH for 120 hours, and three times of IR reflow at 260 ° C for 30 seconds, followed by observation with an optical microscope. Package to identify if cracks have occurred. The peeling of the epoxy resin composition and the lead frame was evaluated using a non-destructive testing machine such as a scanning acoustic microscope (SAM). Table 2 ί "Example t Comparative Example 1 2 3 1 2 3 Fluidity (inches) 50 54 62 50 80 48 Flame Retardancy V-0 V-0 V-0 V-0 Vl Vl Bond Strength to Cu Lead Frame (kgf) PMC, reflow soldering 82 86 85 74 82 68 PMC, stored at 60 ° C / 60% RH for 120 hours and reflowed 78 83 81 69 85 62 adhesion strength (kgf) to Ni-Pd-Au lead frame PMC, reflow soldering 63 64 61 62 60 54 PMC, stored at 60 ° C / 60% RH for 120 hours, reflow soldering 54 52 50 50 50 40 bonding strength (kgf) PMC for Ni-Pd-Au/Ag lead frame, Reflow 78 82 75 68 76 62 PMC, stored at 60 ° C / 60% RH for 120 hours, reflow 72 75 70 64 68 53 Reliability Cu lead frame crack number 0 0 0 0 0 0 Peel number 0 0 0 0 12 42 Total number of semiconductor components used in the test 80 80 80 80 80 80 Ni-Pd-Au Lead frame crack number 0 0 0 0 0 0 Peel number 0 0 0 0 32 80 Total number of semiconductor components used for testing 80 80 80 80 80 80 Ni- Pd-Au/Ag lead frame crack number 0 0 0 0 0 0 peeling number 0 0 0 3 12 Total number of semiconductor components used for the test 80 80 80 80 80 80 As shown in Table 2, the epoxy tree according to the present invention is included. The composition has good adhesion with various kinds of the lead frame, and that does not include having good flame retardancy compared to the epoxy resin composition of the present invention. Moreover, the composition comprising the epoxy resin according to the present invention is capable of ensuring v-o flame retardancy as compared with the composition comprising the novel phenol epoxy resin having the constitution similar to that of Chemical Formula 1 according to Comparative Example 3. These compositions also have good reliability due to their appropriate peel resistance. While the invention has been described with respect to the preferred embodiments of the embodiments of the invention Therefore, the scope of the invention is limited only by the scope of the appended claims and their equivalents. I: Simple description of the figure 3 (none) [Explanation of main component symbols] (None) 19