KR20120065292A - Arrangement and fixing apparatus of carrier-plate for semiconductor - Google Patents

Arrangement and fixing apparatus of carrier-plate for semiconductor Download PDF

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Publication number
KR20120065292A
KR20120065292A KR1020120046949A KR20120046949A KR20120065292A KR 20120065292 A KR20120065292 A KR 20120065292A KR 1020120046949 A KR1020120046949 A KR 1020120046949A KR 20120046949 A KR20120046949 A KR 20120046949A KR 20120065292 A KR20120065292 A KR 20120065292A
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KR
South Korea
Prior art keywords
chip
plate
carrier plate
rotating body
receiving portion
Prior art date
Application number
KR1020120046949A
Other languages
Korean (ko)
Other versions
KR101305311B1 (en
Inventor
우천식
Original Assignee
주식회사 선일기연
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Priority to KR20120046949A priority Critical patent/KR101305311B1/en
Publication of KR20120065292A publication Critical patent/KR20120065292A/en
Application granted granted Critical
Publication of KR101305311B1 publication Critical patent/KR101305311B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip alignment fixing device for a semiconductor carrier plate, wherein a tape attached to one side of a carrier plate for a semiconductor in order to smoothly and reliably fix a chip in a predetermined pattern on a surface of a carrier plate having a tape attached thereto. An apparatus for aligning and fixing chips on a plate, the apparatus comprising: a rotating body having a plate-like structure which is rotated by being coupled to an axis connected to a motor, and has a receiving part opened up and down inside thereof; A guide plate fixed to the upper side of the receiving portion in a plate shape, and having a plurality of chip holes having a pattern, on which a carrier plate is seated; Clamps provided on both sides of the guide plate to fix the carrier plate seated on the guide plate; A chip supply hole provided on the rotating body and spaced apart from the guide plate, the supply hole being formed in communication with the accommodation portion on an upper side of the accommodation portion; Vibrating bodies provided on both sides of the receiving portion in the rotating body for vibrating the rotating body; It is fixed to the lower side of the receiving portion, and comprises a support plate for preventing the departure of the chip supplied into the receiving portion through the chip supply port.

Description

Arrangement and fixing apparatus of carrier-plate for semiconductor

The present invention relates to a chip alignment fixing device for a semiconductor carrier plate, and more particularly, to a chip alignment fixing device for a semiconductor carrier plate which allows the chip to be smoothly and reliably fixed in a predetermined pattern on a surface of a carrier plate having a tape. will be.

Recently, electronic devices such as mobile phones, portable information terminals, liquid crystal display panels, and notebook computers are becoming smaller, lighter, and thinner. As a result, various components including semiconductor equipment mounted on these devices are being manufactured in a similar size, weight, and thickness. To this end, semiconductor components are also manufactured as a package. In this case, the semiconductor package includes semiconductor chips such as single devices and integrated circuits formed by stacking various electronic circuits and wirings from various external environments such as dust, moisture, electrical, and mechanical loads. In order to protect and optimize and maximize the electrical performance of semiconductor chip, it is molded by molding signal input / output terminals to main board using lead frame or printed circuit board.

As an example of the above configuration, a carrier plate is used, and the carrier plate is a terminal of electronic devices such as a chip capacitor, a register, a multi-layered ceramic capacitor (MLCC), and the like. It is used to support a plurality of electronic devices in the process of forming a contact by dipping method.

In order to perform the function of the carrier plate, a chip should be attached to a predetermined pattern on one side, but in the past, it has been done by a roller method or by hand, but this takes a long time or decreases accuracy, thus reducing overall work efficiency. There was a problem floating down.

The present invention has been invented to solve the problems of the prior art as described above, the chip alignment fixing device of the carrier plate for a semiconductor to ensure that the chip on the surface of the carrier plate attached to the tape smoothly and reliably fixed in a predetermined pattern The purpose is to provide.

In order to achieve the above object, the present invention, in the device for aligning and fixing the chip on the tape attached to one side of the carrier plate for semiconductor, coupled to the shaft connected to the motor rotated, the upper and lower receiving A rotating body having an additional plate-shaped structure; A guide plate fixed to the upper side of the receiving portion in a plate shape, and having a plurality of chip holes having a pattern, on which a carrier plate is seated; Clamps provided on both sides of the guide plate to fix the carrier plate seated on the guide plate; A chip supply hole provided on the rotating body and spaced apart from the guide plate, the supply hole being formed in communication with the accommodation portion on an upper side of the accommodation portion; Vibrating bodies provided on both sides of the receiving portion in the rotating body for vibrating the rotating body; It is fixed to the lower side of the receiving portion, and provides a chip alignment fixing device of the semiconductor carrier plate, characterized in that comprises a support plate for preventing the departure of the chip supplied into the receiving portion through the chip supply port.

The chip alignment fixing device of the carrier plate for semiconductors according to the present invention made in this way is all the processes are performed automatically at once when only the chip is supplied into the receiving portion of the rotating body through the chip supply port, thereby reducing the working time and increasing the accuracy and overall work efficiency. There is an advantage that can raise.

1 is a plan view of a chip alignment fixing device of a carrier plate for a semiconductor according to the present invention,
2 is a bottom view of FIG. 1;
Figure 3 is a side cross-sectional view showing the chip supply state according to the present invention,
Figure 4 is a side cross-sectional view showing the movement and seating state of the carrier plate according to the present invention,
5 to 8 is a state diagram used in accordance with the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 8, the chip alignment fixing device for a semiconductor carrier plate according to the present invention aligns and fixes a chip 4 on a tape 3 attached to one side of a semiconductor carrier plate 2. In the apparatus, the rotating body 10, the guide plate 20, the clamp 30, the chip supply port 40, the vibration body 50 and the support plate 60.

The rotating body 10 is coupled to the shaft 14 connected to the motor 12, as shown in Figure 1 is rotated, as shown in Figure 3 has a plate-like structure in which the upper and lower receiving portion 16 is formed therein is formed. .

The reducer 13 is connected to the motor 12, and the shaft 14 is supported by the shaft support 7 provided on both sides of the rotating body 10.

The guide plate 20 is fixed to the upper side of the receiving portion 16 formed inside the rotating body 10. The guide plate 20 is formed in a plate shape, and a plurality of chip holes 21 having a pattern in which the chip 4 is seated and fixed are formed on the guide plate 20.

The carrier plate 2 is seated on the outer surface of the guide plate 20, and the guide plate 20 is disposed between the chip hole 21, which is the periphery of the plurality of chip holes 21 formed in the guide plate 20, and the edge of the guide plate 20. A plurality of air holes 23 are formed to facilitate attachment and detachment of the carrier plate 2 in close contact.

Both sides of the guide plate 20 are provided with a clamp 30 for fixing the carrier plate 2 seated on the guide plate 20, respectively. When the carrier plate 2 is seated on the guide plate 20, and then the support plate 85, which is in close contact with the upper part of the carrier plate 2, is fixed on the guide plate 20, the carrier 30 is mounted on the guide plate 20. The upper sides of both side portions of the plate 2 and the support plate 85 are tightly fixed.

A chip supply port 40 is provided spaced apart from the guide plate 20 on the rotating body 10. 1 and 3, the chip supply port 40 is formed with a supply hole 41 communicating with the accommodating portion 16 on the upper side of the accommodating portion 16 on which the guide plate 20 is installed. At this time, the chip supply port 40 can be used by installing a separate opening and closing device (not shown) as needed.

The rotating body 10 is provided with a vibrating body 50 for vibrating the rotating body 10. The vibrator 50 is a component for allowing the chip 4 to be evenly inserted into the chip hole 21 of the guide plate 20. The vibrator 50 in the rotating body 10 provides uniform vibration. It is preferable to provide them symmetrically on both sides.

At this time, the vibrating body 50 is composed of a metal material as an example, it is installed so as to enable elastic operation, and equipped with an electromagnet 55 on the rotating body 10 of the position spaced apart from the vibrating body 50 vibrating body ( 50 is configured to vibrate by the on-off operation of the electromagnet 55.

Support plate 60 is fixed to the lower side of the receiving portion 16 in the rotating body (10). The supporting plate 60 is installed to prevent the external departure of the chip 4 supplied into the receiving portion 16 through the chip supply hole 40, and the transparent glass or the transparent resin plate to enable observation from the outside. It is preferable to be formed of a transparent material, including.

On the other hand, the chip (4) supplied into the receiving portion 16 through the chip supply hole 40 is discharged through the chip supply hole 40 which is the upper side of the receiving portion 16 during the axial rotation of the rotating body 10 The separation plate 70 is provided between the guide plate 20 and the inner side of the receiving portion 16 of the chip supply port 40.

Operation of the chip alignment fixing device of the carrier plate for semiconductors according to the present invention configured as described above is as follows.

First, as shown in FIG. 4, the carrier plate 2 having the tape 3 attached to the lower surface is adsorbed and transferred to the adsorption plate 82 of the vacuum conveyer 81 through the preliminary process to the upper surface of the guide plate 20. The carrier plate 2 and the support plate 85 are fixed by both clamps 30 after the support plate 85 is seated on the upper surface of the carrier plate 2 seated on the guide plate 20.

In the above state, when the chip 4 is supplied from the outside to the receiving portion 16 in the rotating body 10 through the chip supply port 40, the chip 4 is the chip supply port 40 as shown in FIG. The guide plate 20 is located at the lower side, and the support plate 60 is positioned at the lower side by rotating the separator plate 70 in a direction to be rotated toward the upper side so as not to be discharged through).

The chip 4 is inserted into the plurality of chip holes 21 formed in the guide plate 20 in the above state, and the chip 4 is attached to the adhesive surface of the tape 3 of the carrier plate 2 in close contact with the lower side of the guide plate 20. ) Is attached. However, since the chip 4 does not easily adhere to the adhesive surface of the tape 3 of the carrier plate 2 only by the simple supply of the chip 4, as shown in FIG. Impart vibration.

The vibrator 50 is vibrated by the on-off operation of the electromagnet 55 as described above.

When the chip 4 is evenly inserted into the chip hole 21 as shown in FIG. 7 by vibrating operation of the vibrating body 50, the rotating body 10 as shown in FIG. 8 is opposite to the direction in FIG. 5. Rotate 180 degrees so that the carrier plate 2 to which the chip 4 is attached is located on the upper side of the rotating body 10.

When the process is completed, the vacuum transfer unit 81 in which the adsorption plate 82 is installed enters and transfers the carrier plate 2, or the operator manually removes the carrier plate 2.

2 carrier plate 3 tape
4 chip 7 shaft support
10: rotating body 12: motor
13: reducer 14: shaft
16: accommodating part 20: information board
21: chip ball 23: air ball
30: clamp 40: chip supply port
41: supply hole 50: vibrating body
55 electromagnet 60 supporting plate
70: separation plate 81: vacuum transfer machine
82: adsorption plate 85: support plate

Claims (5)

In the apparatus for aligning and fixing the chip (4) on the tape (3) attached to one side of the carrier plate (2) for semiconductors,
A rotating body (10) having a plate-like structure which is coupled to the shaft (14) connected to the motor (12) and is rotated and has a receiving portion (16) opened up and down therein;
A guide plate 20 fixed to the upper side of the receiving portion 16 in a plate shape, and having a plurality of chip holes 21 having a pattern, on which a carrier plate 2 is seated;
A clamp 30 provided on both sides of the guide plate 20 to fix the carrier plate 2 seated on the guide plate 20;
A chip supply hole 40 spaced apart from the guide plate 20 on the rotating body 10 and having a supply hole 41 formed in communication with the accommodation portion 16 on an upper side of the accommodation portion 16;
Vibrating body 50 provided on both sides of the receiving portion 16 in the rotating body 10 for vibrating the rotating body 10;
It is fixed to the lower side of the receiving portion 16, and comprises a support plate 60 for preventing the departure of the chip 4 supplied into the receiving portion 16 through the chip supply port 40 A chip alignment fixing device for a carrier plate for semiconductors. The method of claim 1,
A carrier plate for a semiconductor, characterized in that a plurality of air holes 23 are formed between the plurality of chip holes 21 and the edges of the guide plate 20 so that the carrier plate 2 closely attached to the guide plate 20 can be easily attached and detached. Chip alignment fixture. The method of claim 1,
The guide plate 20 and the chip supply hole (4) so that the chip (4) supplied into the receiving portion 16 through the chip supply hole 40 is not discharged to the chip supply hole 40 during the axial rotation of the rotating body 10 ( Separating plate 70 is provided between the receiving portion (16) inside of the (40) chip alignment fixing device for a semiconductor carrier plate. The method of claim 1,
The vibrator 50 is made of metal, and the electromagnet 55 is fixed on the rotating body 10 at a position spaced apart from the vibrator 50 so that the vibrator 50 is used for the on-off operation of the electromagnet 55. Chip alignment fixing device of a carrier plate for a semiconductor, characterized in that configured to be vibrated by. The method of claim 1,
The support plate 60 is a chip alignment fixing device of the carrier plate for a semiconductor, characterized in that formed from a transparent glass or transparent resin plate to be observed from the outside.
KR20120046949A 2012-05-03 2012-05-03 Arrangement and fixing apparatus of carrier-plate for semiconductor KR101305311B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20120046949A KR101305311B1 (en) 2012-05-03 2012-05-03 Arrangement and fixing apparatus of carrier-plate for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20120046949A KR101305311B1 (en) 2012-05-03 2012-05-03 Arrangement and fixing apparatus of carrier-plate for semiconductor

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KR20120065292A true KR20120065292A (en) 2012-06-20
KR101305311B1 KR101305311B1 (en) 2013-09-06

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101452964B1 (en) * 2013-11-14 2014-10-22 (주) 피토 Unit for aligning chip for electronic components and apparatus for aligning chip for electronic components having the same
KR20190004444A (en) 2017-07-04 2019-01-14 창신이앤피 주식회사 Automatic alignment apparatus for chip type electronic components
KR20190070744A (en) 2017-12-13 2019-06-21 (주)넥셈 Manufacturing machine fabricating tool for carrier plate and it`s carrier plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0167804B1 (en) * 1994-12-31 1999-02-01 이형도 Chip tray
JP3804520B2 (en) * 2001-11-27 2006-08-02 株式会社村田製作所 Chip parts alignment device
KR100931327B1 (en) * 2007-09-14 2009-12-11 (주)알티에스 Tray Rotator of Semiconductor Package Inspection System
KR100924502B1 (en) * 2008-01-21 2009-11-05 주식회사 진우엔지니어링 An apparatus for suplying an electron parts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101452964B1 (en) * 2013-11-14 2014-10-22 (주) 피토 Unit for aligning chip for electronic components and apparatus for aligning chip for electronic components having the same
WO2015072666A1 (en) * 2013-11-14 2015-05-21 (주)피토 Unit for aligning chips for electronic component and apparatus for aligning chips for electronic component having same
KR20190004444A (en) 2017-07-04 2019-01-14 창신이앤피 주식회사 Automatic alignment apparatus for chip type electronic components
KR20190070744A (en) 2017-12-13 2019-06-21 (주)넥셈 Manufacturing machine fabricating tool for carrier plate and it`s carrier plate

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KR101305311B1 (en) 2013-09-06

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