KR20120024466A - Inspection device - Google Patents

Abstract

PURPOSE: An inspection device is provided to prevent interference of an exit part and a holding stage because the exit part of a transmission lighting device illuminates to a viewing surface in the exterior of the holding stage. CONSTITUTION: An inspection device(10) comprises an observation optical system(11), a reflective lighting unit(12), a transmission lighting unit(14), and a holding stage(34). The observation optical system determines a viewing surface on an observation optical axis. The reflective lighting unit illuminates the viewing surface from the observation optical system. The transmission lighting unit illuminates the viewing surface from the opposite side of the observation optical system. The holding stage keeps a tape(42) in the transmission lighting unit side and the inner surface of an annular member(43) keeping the tape where an inspection target object is attached. The holding stage is a cylindrical shape.

Description

Inspection device {INSPECTION DEVICE}

The present invention relates to an inspection apparatus for inspecting a semiconductor element as an inspection object.

An inspection apparatus for inspecting a semiconductor element as an inspection object by observing the semiconductor element with an observation optical system while irradiating various kinds of illumination light to a semiconductor element such as an LED chip is known (see Patent Document 1, for example). In this inspection apparatus, as one of various illumination lights, the transmission light from the transmission lighting apparatus which illuminates the inspection object on the opposite side to the observation optical system seen from the inspection object is used.

Here, it can be seen that the semiconductor element is cut off from the wafer while attached to a tape (film), and the tape is treated in a state where the tape is held by an annular member. For this reason, in the inspection apparatus, in order to perform the inspection while maintaining the state, it may be considered to provide a cylindrical holding stage for holding the tape inside the annular member on the side opposite to the observation optical system.

In the state where the tape is held by a holding stage, warpage may occur in the tape depending on the material of the tape, the weight of the inspection object, or the like, and it may be difficult to properly observe the observation optical system. For this reason, in the conventional inspection apparatus, an exit section having a long stick shape and having a flat end surface as an exit surface is provided in the transmission lighting device, and the tape held by the holding stage is pushed up from the exit surface of the exit section. According to this, it may be considered to perform the inspection by placing the inspection object at an appropriate observation position (observation surface) by the observation optical system.

Japanese Patent Publication No. 2010-107254

However, it is necessary for the output section as the transmission lighting mechanism to have an optical element for emitting the transmitted light and an outer frame portion for holding and protecting the optical element, so that the holding stage is prevented by the interference between the outer frame portion and the inner wall of the holding stage. The irradiation area that can properly irradiate the tape held by the transmitted light with the transmitted light, that is, the effective inspection area using the transmitted light, becomes smaller than the area inside the holding stage. In other words, the inside of the holding stage cannot be used as an effective inspection area to the maximum, and the working stage of the inspection decreases due to the holding stage holding the tape.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an inspection apparatus capable of efficiently inspecting an inspection object attached to a tape held in an annular member using transmission lighting.

The invention according to claim 1 includes an observation optical system having a predetermined position on an observation optical axis as an observation surface, a reflection illumination mechanism that illuminates the observation surface from the observation optical system side, and the observation optical system. And a transmissive luminaire for illuminating the observation surface on the opposite side of the apparatus, and a cylindrical holding stage capable of holding the tape on the side of the transmissive lighting apparatus inside the annular member holding the tape to which the inspection object is attached. The transmissive lighting device has a light emitting portion that emits transmitted light guided by a light source from the outside of the holding stage toward the viewing surface, and the holding stage defines a plane along the viewing surface on the viewing optical system side. A transmissive member having an installed plate shape and allowing transmission of the transmitted light emitted from the exit section; The position adjustment of the observation optical axis direction enables to whether characterized by having a position regulator for maintaining the transmission component.

The invention according to claim 2 is the inspection device according to claim 1, wherein the position adjustment with respect to the observation optical axis direction is a position in the observation optical axis direction and an inclination with respect to the observation optical axis direction.

The invention according to claim 3 is the inspection apparatus according to claim 1 or 2, wherein the positioning mechanism is configured to transmit the flat surface toward the viewing optical system rather than the holding position of the tape on the holding stage in a viewing optical direction. It is possible to position the member.

The invention according to claim 4 is the inspection device according to any one of claims 1 to 3, wherein the pressure mechanism presses the tape toward the exit portion in the direction of the observation optical axis at an outer position of the transmission member. It is characterized by including (押 壓 機構).

The invention according to claim 5 is the inspection apparatus according to claim 4, wherein the pressing mechanism presses the annular member at an outer position of the holding stage.

The invention according to claim 6 is the inspection device according to claim 4, wherein the pressurizing mechanism sucks between the permeable member and the place holding the tape to surround the permeable member in the holding stage.

The invention according to claim 7 is the inspection apparatus according to any one of claims 1 to 6, wherein the exit portion is focused to reduce the diffusion of the transmitted light guided to enter the transmitted light at a predetermined spot region into the transmission member. It is characterized by having an optical member.

The invention according to claim 8 is the inspection apparatus according to claim 7, wherein the light converging optical member is a rod integrator optical member which also has a function of equalizing the light quantity distribution seen in a cross section perpendicular to the transmission optical axis.

According to the inspection apparatus of the present invention, it is possible to reliably prevent the exit portion and the maintenance stage from interfering with the configuration in which the exit portion of the transmission illumination mechanism irradiates the observation surface from the outside of the maintenance stage. For this reason, transmitted light can be irradiated to all the areas inside the holding stage, so that the inside of the holding stage can be an effective inspection area over the whole, and the effective inspection area can be secured to the maximum.

In addition, in the inspection apparatus, the tape held by the holding stage can be brought into a flat state by the flat surface of the penetrating member provided on the holding stage, and the inspection object attached thereto can be placed on the observation surface. Appropriate observation can be performed by an observation optical system as a structure which irradiates an observation surface from the outside of a stage.

In addition, in the inspection apparatus, the transmissive member is capable of adjusting the position of the observation optical axis with respect to the holding stage by the position adjustment mechanism, so that the inspection object attached to the tape is more appropriately positioned on the observation surface according to the amount and state of warpage of the tape. You can.

In addition to the above-described configuration, if the positional adjustment with respect to the observation optical axis direction is a position in the observation optical axis direction and an inclination with respect to the observation optical axis direction, the inspection object attached to the tape in correspondence with the amount of warpage deformation and the state of the tape is properly observed. Can be placed on the phase.

In addition to the above-described configuration, if the positioning mechanism is capable of positioning the transmissive member so that the flat surface is directed toward the observation optical system rather than the holding position of the tape on the holding stage in the direction of the observation optical axis, The inspection object attached to the tape can be more appropriately positioned on the viewing surface.

In addition to the above-described configuration, a pressurizing mechanism for pressing the tape toward the exit portion in the direction of the observation optical axis in the position outside of the transmissive member is further provided. It can be fixed while flattening. For this reason, the inspection object attached to a tape can be examined suitably.

In addition to the above-described configuration, if the pressurizing mechanism presses the annular member at a position outside the holding stage, the pressurizing mechanism can reliably fix the tape along the flat surface of the permeable member by pressurizing the pressurizing mechanism. .

In addition to the above-described configuration, if the pressing mechanism sucks in between the permeation member and the position holding the tape so as to surround the permeation member, the pressurizing mechanism can draw in an excess due to the bending deformation in the tape. As such, the inspection object attached to the tape can be properly positioned on the viewing surface.

In addition to the above-described configuration, the emitting unit irradiates an appropriate area with respect to the observation optical system on the observation surface, provided that the light emitting unit has a condensing optical member that reduces the diffusion of the transmitted light guided to allow the transmitted light to enter the predetermined spot region. It is possible to enable proper observation by the observation optical system more efficiently.

In addition to the above-described configuration, if the condensing optical member is a rod integrator optical member which also has a function of equalizing the light quantity distribution seen from the cross section perpendicular to the transmission optical axis, more suitable observation by the observation optical system can be made possible.

1 is an explanatory diagram schematically showing the configuration of an inspection apparatus 10 of Embodiment 1 related to the present invention;
2 is a block diagram showing the functional configuration of the inspection apparatus 10,
3 is a perspective view schematically showing the holding stage 34 of the inspection apparatus 10,
FIG. 4 is an explanatory diagram for explaining the type of the workpiece 40 to be inspected, (a) shows a state in which each semiconductor element 44 is cut at each boundary while being attached to the tape 42, and (b) shows a tape 42 is stretched to show a state in which each semiconductor element 44 is divided into each,
5 is a perspective view schematically showing the holding mechanism 13 and the transmission lighting mechanism 14 of the inspection apparatus 10.
FIG. 6 is an explanatory diagram showing a portion along a line I-I shown in FIG. 5 in a partial cross section; FIG.
Fig. 7 is an explanatory diagram schematically showing the configuration of the holding mechanism 13 'and the transmission lighting mechanism 14' of the inspection apparatus 10 'as a comparative example for explaining the technical problem,
FIG. 8 is an explanatory diagram for explaining how to position the inspection object on the observation surface Fp in the inspection apparatus 10 ',
FIG. 9 is an explanatory view for explaining the narrowing of the effective inspection area Sa 'in the inspection apparatus 10', showing the state where the holding stage 34 'is seen from the observation optical system from above, and upward from below. Shows a cross section taken along the line II-II of
FIG. 10 is an explanatory diagram for explaining the fact that the effective inspection area Sa 'is widened in the inspection apparatus 10, and shows the state where the holding stage 34 is seen from the observation optical system side from above, and III- above from below. The cross section obtained along the III line is shown,
FIG. 11 is an explanatory diagram schematically showing the configuration of the inspection apparatus 10A of Example 2. FIG.
12 is an explanatory diagram schematically showing the configuration of the holding mechanism 13B of the inspection apparatus 10B of the third embodiment.

Hereinafter, each embodiment of the inspection apparatus related to the present invention will be described with reference to the drawings.

First, a schematic configuration of an inspection apparatus 10 of Embodiment 1 related to the present invention will be described. 1 is an explanatory diagram schematically showing the configuration of an inspection apparatus 10 as an example of an inspection apparatus according to the present invention. 2 is a block diagram showing the functional configuration of the inspection apparatus 10. In addition, in FIG. 5, the wafer 41 and the tape 42 in the test | inspection workpiece | work 40 are abbreviate | omitted and shown for clarity.

As shown in Figs. 1 and 2, the inspection apparatus 10 includes the observation mechanism 11, the reflection lighting mechanism 12, the holding mechanism 13, the transmission lighting mechanism 14, and the control mechanism 15. It is roughly composed. This inspection apparatus 10 has a main body portion 21 as shown in FIG. Although not shown in the drawing, the main body portion 21 is provided with a relay lens or a revolver type turret portion, and a plurality of objective lens barrels 22 are provided on the turret portion. The objective lens 23 is provided in each objective lens barrel 22. An imaging camera 24 is provided above the main body 21. The imaging camera 24 passes through the objective lens 23 and the main body portion 21 (relay lens) according to the magnification determined by the set objective lens 23, and the predetermined position on the optical axis (observation optical axis Oa). Image data can be obtained. For this reason, the imaging camera 24, the main body 21, each objective lens barrel 22, and the objective lens 23 function as an observation optical system in the observation mechanism 11, and the optical axis is the observation optical axis Oa. ) In addition, a plane (image-forming image plane on the object side) orthogonal to the observation optical axis Oa, including the position where the imaging camera 24 on the observation optical axis Oa can acquire an appropriate image, that is, the focusing position in the observation optical system, It becomes an observation surface Fp. Below, the direction of observation optical axis Oa is made into the Z-axis direction, and the surface orthogonal to it is made into the X-Y plane. The image data acquired by this imaging camera 24 can be displayed on the monitor 39 while being properly interpreted by the image control section 61 described later (see Fig. 2).

Inside the main body portion 21, a reflection member 25 composed of a half mirror or prism is provided on the observation optical axis Oa. In the main body part 21, the light guide fiber 27 is provided through the connector part 26 in the reflection direction from the observation optical axis Oa by the reflection member 25. As shown in FIG. This light guide fiber 27 can guide light irradiated from the coaxial light source 28 to the reflection member 25. The coaxial light source 28 is capable of selectively emitting both the halogen lamp 28a and the stove 28b as shown in Fig. 2, and it is possible to emit the light to the light guide fiber 27 regardless of which light is emitted. It consists of. The illumination light emitted from the coaxial light source 28 travels on the observation optical axis Oa through the light guide fiber 27 and the reflecting member 25 as shown in FIG. 1 and the objective lens of each objective lens barrel 22. The observation surface Fp can be illuminated on the observation optical axis Oa via (23). For this reason, the coaxial light source 28, the light guide fiber 27, and the reflecting member 25 cooperate with the objective lens 23 of each objective lens barrel 22, and the inspection object 44 mentioned later about an observation optical system It functions as a reflection illumination mechanism 12, ie, a coaxial falloff illumination mechanism 29, for generating reflected light in the coaxial direction in.

The main body portion 21 is movable in the observation optical axis Oa direction (Z direction) by a Z-axis drive mechanism 66 (see Fig. 2) described later. For this reason, the observation optical system and the coaxial fall lighting fixture 29 in the observation mechanism 11 can move to the observation optical axis Oa direction (Z direction) integrally.

In addition, the main body portion 21 is provided with a ring panel 30 for deriving illumination light while surrounding the outer circumference of the objective lens barrel 22 as shown in FIG. Although not shown, the ring panel 30 for guiding the illumination light is provided with a plurality of light emitting units so as to surround the observation optical axis Oa at a predetermined interval from the observation optical axis Oa, and each light emitting unit is disposed on the observation optical axis Oa. It is possible to illuminate toward the observation surface Fp in a direction inclined with respect to. The light guide fiber 31 is provided in the ring panel 30 for illuminating light. This light guide fiber 31 is capable of guiding the irradiation light emitted from the ring light source 32 to each light emitting portion (not shown) of the ring panel 30 for deriving the illumination light. The ring light source 32 is capable of selectively emitting both the halogen lamp 32a and the strobe 32b as shown in Fig. 2, and it is possible to emit the light to the light guide fiber 31 even when either of them is emitted. consist of. The irradiation light emitted from the ring light source 32 is inclined with respect to the observation optical axis Oa at each light emitting part (not shown) of the ring panel 30 for illuminating light through the light guide fiber 31 as shown in FIG. 1. It is possible to illuminate the observation surface Fp. For this reason, the ring light source 32, the light guide fiber 31, and the illumination light guide ring board 30 (each light emitting part) are inclined to the observation optical axis Oa in the inspection object 44 mentioned later with respect to the observation optical system. It functions as a reflecting lighting device 12, i.e., a luminescent lighting device 33, for producing the reflected light in the light source. This illumination light derivation ring board 30 is made to be movable in the observation optical axis Oa direction (Z-axis direction) by the Z-axis drive mechanism 66 (refer FIG. 2) mentioned later. The movement in the direction of the observation optical axis Oa may be integral with the main body portion 21, or may be independent of each other.

The holding mechanism 31 is provided below the main body 21 and the ring panel 30 for deriving the illumination light. This holding mechanism 13 has a holding stage 34. This holding stage 34 has a cylindrical shape with a stage as shown in Fig. 3, and constitutes a holding portion of the inspection object 44 described later in the annular tip portion 34a. In this tip portion 34a, a circular annular groove 34b is provided, and a suction hole 34c for forming a vacuum state is provided in the groove. For this reason, in the holding stage 34, the tape 42 (refer FIG. 4) mounted as mentioned later can be adsorbed-supported by the front-end | tip part 34a. In this holding stage 34, the permeation stage 35 is provided in the inside.

The transmissive stage 35 has a disk shape as shown in Figs. 1, 3, 5, and 6, and the upper surface 35a of the upper side (observation optical system side) is made of a flat surface, and the lower side (transmission lighting apparatus ( The lower end surface 35b of the irradiation mechanism part 16 side mentioned later (14) is a scattering surface. In the first embodiment, the upper end surface 35a is a polished flat surface, and the lower end surface 35b is set in consideration of the diffusion rate and the like in view of obtaining a scattering effect as described later. The transmission stage 35 is formed of at least a transparent member (transmission member) that allows transmission of transmitted light emitted from the irradiation mechanism portion 16 (its output portion 53), which will be described later, of the transmission lighting mechanism 14, In Example 1, it is formed of glass. The transmissive stage 35 is supported by the lower end of the periphery part through the support frame 36 (refer FIG. 6). The support frame 36 has a round ring shape as shown in FIG. 6, and is supported downward by a plurality of Z-axis screwing members 37 (only one is shown in FIG. 6) and a plurality of orthogonal shaft screwing members. 38 (only one is shown in FIG. 6), the movement to the upper side of the Z-axis direction (observation optical measurement) is limited. Each Z-axis screwing member 37 penetrates the holding stage 34 in the Z-axis direction, and the nut 37a enables positioning in the Z-axis direction. This Z-axis screwing member 37 is provided at least 3 points or more so that a predetermined space | interval may be seen from the rotation direction centering on a Z-axis. Each orthogonal shaft screwing member 38 has a conical tip, and can be engaged with the inclined surface at the upper end position of the support frame 36. For this reason, in the holding stage 34, the support position by each Z-axis screwing member 37 is changed suitably, and the position (height position) of the transmission stage 35 seen from the Z-axis direction, ie, the observation optical axis Oa direction, The transmissive stage 35 is provided so that the inclination and both sides of the transmissive stage 35 (upper end surface 35a) with respect to the observation optical axis Oa can be adjusted. From this, each of the Z-axis screwing members 37 and each of the orthogonal shaft screwing members 38 is a position for holding the transmission stage 35 with respect to the holding stage 34 so as to enable position adjustment with respect to the observation optical axis Oa. Function as an adjustment mechanism.

The transmissive stage 35 has a thickness dimension, that is, a gap between the upper surface 35a and the lower surface 35b, which is set in consideration of the following three surfaces while considering the optical and hardness characteristics of the transmissive stage 35. have. In Example 1, the thickness of the transmission stage 35 is made to be generally uniform in the range of 5cm ~ 15cm.

First, a predetermined amount of light can be secured in the transmitted light emitted from the irradiation mechanism unit 16, which will be described later, of the transmission lighting mechanism 14, incident on the lower surface 35b, and emitted from the upper surface 35a. This is because, in the transmission stage 35, the inspection object 44 to be described later needs to be properly illuminated as viewed from an image acquired by the imaging camera 24 via the observation optical system. This mainly affects the upper limit of the thickness dimension of the transmission stage 35.

Second, due to the lower end of the periphery being supported from below, the amount of deformation of the bending deformation that appears to sag at the central position is within a predetermined range. In the transmission stage 35, as described later, the upper surface 35a has a function of positioning the inspection object 44, which will be described later, on the observation surface Fp, which is an appropriate position in the observation optical system, and thus the upper surface 35a. It is necessary to make it follow the observation surface Fp over the whole surface. For this reason, the predetermined range in the above-described amount of deformation is at most the depth of field in the observation optical system. This point mainly affects the lower limit of the thickness dimension of the transmission stage 35.

Third, the scattering effect by the lower end surface 35b serving as the scattering surface is sufficiently obtained in the transmitted light emitted from the upper end surface 35a. Specifically, the degree of scattering surface at the lower surface 35b to enable a predetermined scattered state of the transmitted light irradiating the tape 42 on the observation surface Fp, that is, the transmitted light emitted from the upper surface 35a. It is set in consideration of (度 面 度). Here, the predetermined scattering state means that a plurality of shadow portions of the tape 42 are not generated in the image data of the imaging camera 24, that is, the observation surface to which the transmitted light is irradiated from the transmission lighting mechanism 14. When the tape 42 on (Fp) is acquired by the imaging camera 24 via the observation optical system, it means that the tape 42 will be in a uniformly bright state in the image data.

The holding stage 34 holding this transmission stage 35 is XY orthogonal to the observation optical axis Oa (observation optical system) by the XY driving mechanism 64 (see FIG. 2) described later as in FIG. It is movable on a plane. In addition, the holding stage 34 is rotatable about the Z-axis by the rotating drive mechanism 65 (refer FIG. 2) mentioned later. The inspection target work 40 is sucked and held on the holding stage 34.

The inspection target workpiece 40 is configured by holding a tape (film) 42 on which a wafer 41 (including a glass substrate, etc.) is attached, as shown in FIG. 4, inside the annular member 43. In this inspection target workpiece 40, as shown in (a), the plurality of semiconductor elements 44 formed of the wafer 41 are cut (dicing) at each boundary while being attached to the tape 42, and As shown in (b), the tape 42 is stretched and cut into pieces after being cut and pasted to the tape 42. Here, the annular member 43 has a diameter larger than the tip portion 34a (see FIG. 1) of the holding stage 34 regardless of the state difference (type of workpiece 40 to be inspected). In the inspection apparatus 10, it is used to inspect whether or not each semiconductor element 44 is properly formed in any of them. For this reason, it can test | inspect the said test target object, maintaining the state of the test target workpiece | work 40 as each semiconductor element 44 as a test target. In this inspection target workpiece 40, as in FIGS. 1, 5, and 6, the holding stage 34 is positioned inside the annular member 43, and the tape 42 is placed on the tip portion 34a. The tape 42 is adsorbed and held by the tip portion 34a by the action of the annular groove 34b and the suction hole 34c. At this time, when the upper end surface 35a of the transmission stage 35 is positioned above the tip portion 34a (adsorption holding position) (observation optical measurement) in the holding stage 34, adsorption by the tape 42 is performed. Since the area located inward from the held portion is pulled by the upper end surface 35a of the transmission stage 35, the area is flattened so as to stick to the upper end surface 35a (see Fig. 1). For this reason, by adjusting the transmission stage 35 with respect to the observation optical axis Oa, the inspection object (each semiconductor element 44) attached to the tape 42 can be positioned on the observation surface Fp in an appropriate state. Under the holding stage 34, an irradiating mechanism part 16 serving as the transmission lighting mechanism 14 is provided (see Fig. 1).

The transmission illumination mechanism 14 irradiates the transmitted light from the side opposite to the observation optical system (observation mechanism 11) to the inspection object (each semiconductor element 44) adsorbed and held by the holding stage 34 as shown in FIG. will be. The transmission illumination mechanism 14 has an irradiation mechanism portion 16. The irradiating mechanism 16 can be guided to the emitting unit 53 described later through the light guide unit 52 described later and the transmitted light emitted from the transmitting light source 51. As shown in Fig. 2, the transmissive light source 51 can selectively emit both the halogen lamp 51a and the strobe 51b, and the light source 51 can emit light to the light guide 52 no matter which light is emitted. It is supposed to be done.

This irradiation mechanism part 16 has a light guide part 52, an output part 53, and a support part 54 in addition to the above-mentioned transmission light source 51 (refer FIG. 2) like FIG. Although not shown, the light guide portion 52 is provided with an entrance surface provided at one end thereof to receive light (transmission light) emitted from the halogen lamp 51a and the strobe 51b of the light source 51 (see FIG. 2). It is provided so as to face each other, and guides the transmitted light from the transmission light source 51 (refer FIG. 2) incident on the said incident surface to the emission surface 52a (refer FIG. 6) provided in the other end side. This light guide portion 52 is formed of optical fiber in the first embodiment. The emission part 53 is connected to the emission surface 52a of the light guide part 52 (refer FIG. 6).

The output unit 53 is configured by accommodating at least one or more optical elements 53b in a cylindrical case body 53a. This optical element 53b comprises an incidence surface 53c facing the emission surface 52a of the light guide portion 52 and an emission surface 53d for emitting the transmitted light incident thereon. The optical element 53b has a predetermined optical characteristic so that the transmitted light incident on the incident surface 53c exits the exit surface 53d in a desired state. The rotational symmetry axis which becomes the center axis position of this optical element 53b is set to the transmission optical axis Pa (refer FIG. 1) of the irradiation mechanism part 16 (transmission illumination mechanism 14 (transmission illumination system)). In the irradiation mechanism unit 16, when the transmitted light is incident from the light guide unit 52 to the exit unit 53, the exit unit 53 emits the transmitted light along the transmitted light axis Pa. The predetermined optical characteristic in the optical element 53b means that the light quantity distribution seen from the cross section orthogonal to the transmission optical axis Pa which becomes the advancing direction is uniform, and that spreading (diffusion) of the irradiation area is suppressed. This optical element 53b is composed of an optical element having the above-described predetermined optical characteristics (an integrator function and a diffusion prevention (condensing) function). In Embodiment 1, the optical element 53b is a rod integrator optical member. Consists of.

In addition, in Example 1, the lower end part 53e located below the incidence surface 53c of the optical element 53b in the case body 53a has a cylindrical shape, and the other end of the light guide part 52 (output) The end part of the side in which the surface 52a is provided can be inserted inside. For this reason, the light emission part 53 and the light guide part 52 fit the other end part of the light guide part 52 to the lower end part 53e of the light emission part 53, and the exit surface 52a and the light exit part of the light guide part 52 are emitted. The incident surface 53c of the part 53 abuts and is connected (connected). In this state, the light guide portion 52 and the emission portion 53 are fixedly supported by the support portion 54.

For this reason, the irradiation mechanism part 16 propagates the transmitted light emitted from the light source 51 for transmission to the output part 53 through the light guide part 52, and is transmitted by the output part 53 as substantially parallel light of a uniform light quantity distribution. The lower end surface 53b of the transmission stage 35 can be irradiated by emitting toward the optical axis Pa (see FIG. 1). This transmitted light becomes scattered light by the lower surface 35b which became a scattering surface, and irradiates the observation surface Fp from the back surface side. The transmitted light at least penetrates through the tape 42 of the inspection target work 40 held by the holding stage 34 and is observable by the observation optical system (imaging camera 24) (see Fig. 1). For this reason, the irradiation mechanism part 16 (transmission light source 51, the light guide part 52, and the emission part 53) cooperates with the lower end surface 35b of the transmission stage 35 which became a scattering surface, 2 functions as a transmission illumination mechanism 14 that generates transmitted light for irradiating the observation surface Fp (inspection object (semiconductor element 44) on the opposite side. In Example 1, the transmitted light axis Pa is in the Z-axis direction. It is set in parallel and the position of the irradiation mechanism part 16 with respect to the observation optical system is set so that the transmission optical axis Pa and the observation optical axis Oa may coincide. In addition, the transmission illumination mechanism 14 is a rod integrator optical member. The optical element 53b of the irradiating mechanism section 16 is configured to satisfy the observation area observable by the observation optical system (imaging camera 24) in the irradiation area of the transmitted light seen on the observation plane Fb. have.

In this inspection apparatus 10, the observation mechanism 11, the reflection lighting mechanism 12, the holding mechanism 13, and the transmission lighting mechanism 14, which are configured as described above, are formed of the control mechanism 15 (see Fig. 2). It is controlled collectively under control. This control mechanism 15 has an image control unit 61, an illumination control unit 62, and a drive control unit 63 as shown in FIG.

The image control unit 61 properly analyzes the image data acquired by the imaging camera 24. This analysis is to recognize the outlines of the plurality of inspection objects (semiconductor element 44) attached to the tape 42, to determine the focus state at the observation point, or to recognize a defect in each inspection object, Recognizing the defectiveness of the electrode, wiring, etc. provided in each test | inspection object, the recognition of the cutting | disconnection defect of each test object (semiconductor element 44) in the wafer 41, etc. are mentioned. In addition, the image control unit 61 causes the monitor 39 to display an image based on the image data acquired by the imaging camera 24.

The lighting control unit 62 controls the coaxial light source 28, the ring light source 32, and the transmission light source 51 to turn off and on appropriately. That is, the lighting controller 62 selectively selects halogen lamps 28a, 32a, 51a or strobes 28b, 32b, 51b in the coaxial light source 28, the ring light source 32, and the transmission light source 51. The coaxial light source 28, the ring light source 32, and the transmissive light source 51 are turned on and off simultaneously or individually while being properly turned off. The halogen lamps 28a, 32a, 51a are used as illumination for observation, and the strobes 28b, 32b, 51b are used as inspection light. In addition, the illumination control part 62 is able to adjust the brightness of the strobes 28b, 32b, and 51b as inspection illumination in each light source 28,32,51. This brightness adjustment can be realized, for example, by appropriately selecting any of the plurality of ND filters.

The drive control unit 63 controls the XY drive mechanism 64, the rotation drive mechanism 65, and the Z axis drive mechanism 66 as appropriate. That is, the drive control unit 63 drives the Z-axis drive mechanism 66 to control the observation optical system and the coaxial fall-off lighting fixture 29 in the observation optical axis Oa direction (Z-axis direction) by driving control of the Z-axis drive mechanism 66. While being able to move easily, the oblique light illuminating device 33 can be suitably moved in the observation optical axis Oa direction (Z-axis direction). This makes it possible to properly observe the inspection object (each semiconductor element 44) of the inspection target workpiece 40 held by the holding stage 34 under appropriate illumination. In addition, the drive control unit 63 controls the XY drive mechanism 64 and the rotation drive mechanism 65 to observe the holding stage 34, that is, the inspection target workpiece 40 adsorbed and held thereon, by observing the optical axis Oa (observation). The optical system) and the transmission optical axis Pa (irradiation mechanism part 16) can be appropriately rotated around the observation optical axis Oa (transmission optical axis Pa (Z-axis direction)) while being appropriately moved on the XY plane orthogonal thereto. You can. This makes it possible to inspect the inspection object (semiconductor element 44) at an arbitrary position on the inspection object workpiece 40 held by the holding stage 34 by suction.

In addition to the control mechanism 15, the above-described control of the adsorption operation on the holding stage 34 can be performed, and comparison of image data for inspection and the like is possible.

In this inspection apparatus 10, the position adjustment with respect to the observation optical axis Oa of the transmission stage 35 is performed along the inspection object workpiece | work 40 with which the inspection object made into an inspection object was attached. This is by In the inspection apparatus 10, the tape 42 at the inward position of the annular member 43 is adsorbed and held by the tip portion 34a of the holding stage 34, and the peripheral edge of the tape 42 is supported below. Flexural deformation may occur as the center position sags. As a result, the bending deformation causes each semiconductor element 44 on the tape 42 to deviate from the observation surface Fp, so that proper observation by the observation optical system (the imaging camera 24) may not be possible. The amount and state of warpage of the tape 42 vary depending on the material of the tape 42, the position and the number of the semiconductor elements 44 attached thereto, and so on, depending on the type of the workpiece 40 to be inspected. For this reason, in the state which the workpiece | work inspection object 40 made into the target is attracted and held by the holding | maintenance stage 34, the tape 42 so that each semiconductor element 44 on the tape 42 may be located on the observation surface Fp. The position (height position) seen from the Z axis of the transmission stage 35, that is, the direction of the observation optical axis Oa, and the transmission stage 35 with respect to the observation optical axis Oa (upper end face 35a) Adjust the tilt and both sides of the).

At this time, the larger the deflection deformation of the tape 42, the upper surface 35a of the transmissive stage 35 is positioned above the distal end portion 34a (adsorption holding position) of the holding stage 34 (observation optical measurement). This is based on the following. When the upper end surface 35a of the transmission stage 35 is positioned above the tip portion 34a of the holding stage 34, the region located inward from the suction-held portion of the tape 42 is located in the transmission stage 35. Since it is pulled upward by the upper surface (35a) of the planarized so that the tape 42 is attached to the upper surface (35a). For this reason, the inspection object (each semiconductor element 44) affixed to the tape 42 is observed in a more appropriate state by placing the upper end surface 35a of the transmission stage 35 upward according to the bending deformation of the tape 42. It can be located on the surface Fp. At this time, along the height position on the upper surface 35a of the transmissive stage 35, the luminaire 16 of the observation mechanism 11, the reflection illuminator 12, and the transmissive illumination mechanism 14 is properly in the Z-axis direction. Not to mention moving. The amount of warpage deformation and the state of the tape 42 can be obtained, for example, by analyzing the image data of the imaging camera 24 in the image control unit 61.

In the inspection apparatus 10, the holding | maintenance stage 34 adsorb | sucks and hold | maintains the test | inspection workpiece | work 40, and a chip scan is performed. In this chip scan, the drive control unit 63 scans the inside position of the front end portion 34a of the holding stage 34, that is, the position inside the front end of the holding portion 34 (tape 42) from the inside of the suction-held portion 40 (tape 42). ) Moves the holding stage 34 with respect to the observation optical axis Oa. In this scanning, the image acquisition by the imaging camera 24 is performed, irradiating the transmitted light from the transmission illumination mechanism 14.

Next, a chip map is created. This chip map shows the position and attitude | position of each test object (semiconductor element 44) in the test | inspection workpiece | work 40 (tape 42). The control mechanism 15 analyzes the image data of the imaging camera 24 by chip scanning in the image control unit 61 to recognize the outline and attach the plurality of inspection objects (semiconductor element 44) attached to the tape 42. While discriminating, the position and attitude of each inspection object (semiconductor element 44) are acquired by adding the movement position information by the drive control part 63. FIG.

Next, the inspection object (semiconductor element 44) is determined. In this determination, the observation position by an observation optical system is determined based on the created chip map, and the holding stage 34 is moved by the drive control part 63 according to the determination. Thereafter, the inspection object (semiconductor element 44) at the observation position is compared with the good data of the inspection object to determine whether the inspection object (semiconductor element 44) is good or bad. This determination is made by analyzing the image data in the imaging camera 24 in the image control section 61.

Based on the chip map on which the determination of the inspection object (semiconductor element 44) is made, all inspection objects (semiconductor element 44) on the inspection target work 40 (tape 42) are sequentially performed to perform the inspection object. The inspection on the workpiece 40 ends. This inspection can also be performed by visually viewing an image based on image data acquired by the imaging camera 24 displayed on the monitor 39 under the control of the image control unit 61.

(Technical Challenges)

Next, the technical problem will be described with reference to FIGS. 7 to 9. Fig. 7 is an explanatory diagram showing the configuration of the holding mechanism 13 'and the transmission lighting mechanism 14' of the inspection apparatus 10 'for explaining the technical problem. This inspection apparatus 10 'is not provided with the transmission stage 35 in the holding stage 34' with respect to the inspection apparatus 10 of Example 1, and is also provided with the transmission illumination mechanism 14 '(the irradiation mechanism part 16). ′)) Usage and its function is an example of wrong. Since the inspection apparatus 10 'has the same basic structure as the inspection apparatus 10 mentioned above, the same code | symbol is attached | subjected to the part of an equivalent structure, and the detailed description is abbreviate | omitted.

First, in the semiconductor device to be inspected in general, the inspected workpiece 40 (see FIG. 4) as it is while the tape (film) 42 to which the wafer 41 is attached is held inside the annular member 43. Since many cases can be seen, it is preferable that the inspection of the plurality of semiconductor elements 44 also be handled as the inspection target work 40 (see Fig. 4). For this reason, in the inspection apparatus 10 ', as mentioned above, the tape 42 at the inner position of the annular member 43 is sucked and held at the tip portion 34a of the holding stage 43', and the observation mechanism 11, It is assumed that each semiconductor element 44 attached to the tape 42 is inspected using the reflection lighting mechanism 12 (see FIG. 1) and the transmission lighting mechanism 14 '.

At this time, each semiconductor element 44 to be inspected is positioned to be placed on the observation plane Fp, which is an appropriate position in the observation mechanism 11 (observation optical system (imaging camera) 24 (see Fig. 1)). It is necessary to hold the tape 42 with the semiconductor element 44 attached thereto in a flat state. This is to hold and hold the tape 42 at the inward position of the annular member 43 at the distal end 34a of the holding stage 34 'so that the center position sags due to the support of the peripheral edge of the tape 42 from below. As shown in FIG. 2, the bending deformation may occur and the semiconductor elements 44 on the tape 42 may deviate from the observation surface Fp due to this bending deformation. However, in the inspection apparatus 10 ', the permeation stage 35 is not provided in the holding stage 34'. Therefore, the use method and the function of the transmission illumination mechanism 14 '(irradiation mechanism part 16') are different from the inspection apparatus 10. FIG.

In detail, in the inspection apparatus 10 ', as shown in FIG. 7, the upper side of the optical element 53b' of the exit portion 53 'of the irradiation mechanism portion 16' of the transmission illumination mechanism 14 '(observation optical measurement) The emitting surface 53d 'of is a flat surface. In this inspection apparatus 10 ', when the tape 42 in the inward position of the annular member 43 is adsorbed and held by the tip portion 34a of the holding stage 34', the irradiation mechanism portion (as shown in Figs. Press the exit surface 53d 'of the exit part 53' of 16 'against the back surface (surface of the irradiation mechanism part 16' side) of the tape 42, lift the contact part, and lift the test object. Observation optical system (positioned on the observation surface Fp, which is an appropriate position in the imaging camera 24 (see Fig. 1). Thus, in the inspection apparatus 10 ', the irradiation mechanism portion 16' serving as the transmission illumination mechanism 14 '. The emitting surface 53d 'of the emitting part 53' has a function of positioning a test object on the observation surface Fp which is an appropriate position in the observation optical system (imaging camera 24).

However, in the output part 53 'of the irradiation mechanism part 16', the optical element 53b 'is accommodated in the cylindrical case body 53a', and the irradiated area | region is emitted from the optical element 53b '. It becomes substantially equivalent to surface 53d '(the area). On the other hand, the relatively movable region of the irradiating mechanism part 16 'in the inside of the holding stage 34' as viewed from the direction orthogonal to the transmission optical axis Pa (Z-axis direction) is retained with the case body 53a '. It is limited by the interference with the inner wall of the stage 34 '(see Fig. 9). For this reason, in the irradiation mechanism part 16 '(transmission lighting mechanism 14'), as shown in Fig. 9, the case body 53a 'is brought into contact with the inner circumferential wall surface of the holding stage 34' (exactly, as shown in Fig. 9). The area where the position of the optical element 53b 'at the position immediately before the contact is the outermost position becomes an area (effective inspection area Sa') which can effectively irradiate the transmitted light, and the holding stage 34 ' ), The transmitted light cannot be irradiated to all the regions inside the tip portion 34a that adsorb and hold the tape 42. In other words, the inner side of the tip portion 34a 'of the holding stage 34' cannot be used as the inspection area to the maximum, and the holding stage 34 'holding the tape 42 may cause a decrease in the work efficiency of the inspection. There is.

(Operation according to the transmission lighting mechanism 14 and the transmission stage 35)

In the inspection apparatus 10, the holding | maintenance mechanism part 16 (its exit part 53) in the permeation | transmission lighting mechanism 14 is hold | maintained in the position (outside of the holding stage 34) away from the holding stage 34. It is set as the structure which irradiates the test | inspection object (each semiconductor element 44) adsorbed-held by the stage 34 (refer FIG. 5). For this reason, even if the holding stage 34 and the irradiation mechanism part 16 (its exit part 53) are moved relatively in the direction orthogonal to the transmission optical axis Pa, the holding stage 34 and the irradiation mechanism part 16 (its exit) Section 53) does not interfere (see Fig. 10). For this reason, although the case body 53a is provided in the output part 53 of the irradiation mechanism part 16 as shown in FIG. 10, it is seen from the direction orthogonal to the transmission optical axis Pa with the transmitted light radiate | emitted from the optical element 53b. Since light can be irradiated to a position reaching the inner circumferential wall surface of the holding stage 34, the transmitted light is transmitted to the entire area (see symbol Sa) in the inner side of the tip portion 34a which adsorbs and holds the tape 42 in the holding stage 34. Can be investigated. For this reason, the inside of the holding | maintenance stage 34 can be made into the effective test | inspection area | region Sa over the whole, and the said inner side (inner) area can be utilized to the maximum.

At this time, the upper end surface 35a of the transmission stage 35 provided on the holding stage 34 is attached to it while the tape 42 (inspection workpiece 40) adsorbed and held on the holding stage 34 is in a flat state. The inspection object (each semiconductor element 44) is placed on the observation surface Fp (see Figs. 1 and 6). For this reason, the inspection object (each semiconductor element 44) can be appropriately observed by the observation mechanism 11 (observation optical system (imaging camera 24)).

Thus, in the inspection apparatus 10 which concerns on this invention, the position in which the irradiation mechanism part 16 (its exit part 53) of the permeation | transmission lighting mechanism 14 was separated from the holding stage 34 (outside of the holding stage 34). ) Irradiates and holds the inspection object (each semiconductor element 44) adsorbed and held by the holding stage 34, so that the irradiation mechanism section 16 (its exit section 53) and the holding stage 34 interfere with each other. It can be reliably prevented. For this reason, although the case body 53a is provided in the output part 53 of the irradiation mechanism part 16, the holding stage 34 is seen from the direction orthogonal to the transmission optical axis Pa with the transmitted light radiate | emitted from the optical element 53b. Since it can irradiate to the position which reaches the inner peripheral wall surface of (), transmitted light can be irradiated to the whole area | region of the inner side of the front-end | tip part 43a which adsorbs-holds the tape 24 in the holding stage 34. As shown in FIG. Thereby, the inside of the holding stage 34 can be irradiated to the whole area | region. Thereby, the inside of the holding stage 34 can be made into the effective test | inspection area | region Sa over the whole, and the effective test | inspection area can be ensured to the maximum.

In addition, in the inspection apparatus 10, the tape 42 (inspection workpiece 40) adsorbed and held on the holding stage 34 by the upper end surface 35a of the transmission stage 35 provided on the holding stage 34 is provided. Since the inspection object (each semiconductor element 44) attached thereto can be placed on the observation surface Fp, the irradiation mechanism portion 16 (the exit portion 53) of the transparent irradiation mechanism 14 can be brought into a flat state. The observation mechanism 11 (observation optical system (imaging camera 24)) can also perform appropriate observation as a configuration in which the inspection object (each semiconductor element 44) is irradiated at a position away from the holding stage 34.

In addition, in the inspection apparatus 10, when the inspection target workpiece 40 (the tape 42) is adsorbed and held by the holding stage 34, the upper surface 35a of the permeation stage 35 of the holding stage 34 Since it can be located above the tip portion 34a (adsorption holding position) (observation optical measurement), the inspection object (each semiconductor element 44) attached to the tape 42 is more appropriately observed from the observation surface Fp. Can be placed on the phase.

In the inspection apparatus 10, the transmissive stage 35 is capable of adjusting the position relative to the observation optical axis Oa with respect to the holding stage 34 by the positioning mechanism, so that the amount and state of the bending deformation of the tape 42 can be adjusted. Therefore, the inspection object (each semiconductor element 44) pasted on the tape 42 can be located on the observation surface Fp more appropriately.

In the inspection apparatus 10, the irradiation mechanism part 16 (its output part 53) of the transmission illumination mechanism 14 has an optical performance (an integrator function) which suppresses the spread (diffusion) of the irradiation area, Since the appropriate area with respect to the observation optical system (imaging camera 24) on (Fp) can be irradiated, appropriate observation by the observation optical system (imaging camera 24) can be made more efficient.

In the inspection apparatus 10, the optical performance for equalizing the light amount distribution seen from the cross section orthogonal to the transmission optical axis Pa in which the irradiation mechanism portion 16 (its exit portion 53) of the transmission illumination mechanism 14 is in the traveling direction ( Having a diffusion prevention (condensing) function, it is possible to enable more appropriate observation by the observation optical system (imaging camera 24).

In the inspection apparatus 10, the lower end surface 35b of the transmission stage 35 is a scattering surface, and transmitted light from the transmission illumination mechanism 14 in the image data of the observation optical system (the imaging camera 24). Since a plurality of shadow portions of the tape 42 irradiated from the irradiating mechanism part 16 and passing through the scattering surface can be prevented from being generated, it is possible to use the transmissive lighting mechanism 14 to the tape 42. The information of the attached inspection object (each semiconductor element 44 in Example 1) can be obtained correctly. This is based on the following. In the tape 42, when the transmission light is irradiated to observe the image data from the observation optical system (imaging camera 24), even if no member is attached, it is not always bright but is partially dark in the shape of lines or dots. (The shadow part mentioned above) exists. This shadow portion may be considered to be due to dust or the like adhering to the tape 42 or staining of the adhesive. Such a shadow portion acts as a noise component when inspecting the inspection object (each semiconductor element 44) attached to the tape 42 using the transmission lighting mechanism 14, thereby reducing the inspection precision of the inspection object. It may cause. On the other hand, in the inspection apparatus 10, in the transmission illumination mechanism 14, the transmitted light from the irradiation mechanism part 16 (its output part 53) passes through the lower end 35b of the transmission stage 35 which is a scattering surface. Since it is scattered light, when the tape 42 on the observation surface Fp irradiated with the transmitted light from the transmission illumination mechanism 14 was acquired by the imaging camera 24 through the observation optical system, the tape in the image data The plurality of shadow portions in (42) can be made almost unrecognizable. This may be considered to be due to irradiating transmitted light in various angular directions with respect to adhered dust or adhesive stain of the tape 42. In this way, since the noise component in the image data of the observation optical system (the imaging camera 24) can be removed, the inspection object I attached to the tape 42 using the transmission lighting mechanism 14 (each semiconductor element 44). Information can be obtained accurately.

In the inspection apparatus 10, the lower end surface 35b serving as the scattering surface is installed at a predetermined interval from the upper end surface 35a of the transmission stage 35 defining the observation surface Fp when viewed from the transmission optical axis Pa direction. Since the scattering effect due to the scattering surface can be reliably obtained, in the tape 42 irradiated with the transmitted light from the transmission illumination mechanism 14 in the image data of the observation optical system (the imaging camera 24). It is possible to reliably prevent the occurrence of a plurality of shadows. And the upper surface 35a of the transparent stage 35 made of glass was used as the observation surface Fp, and the lower surface 35b was experimented as a scattering surface, and the space | interval of observation surface Fp and a scattering surface is 3 cm or more. The desired scattering effect could be obtained.

The inspection apparatus 10 constitutes a scattering surface as the transmission illumination device 14 on the lower surface 35b of the transmission stage 35 provided with the upper surface 35a for positioning the inspection object on the observation surface Fp. The position of the scattering surface (lower surface 35b) viewed from the direction of transmission optical axis Pa with respect to the observation surface Fp (upper surface 35a), which is an appropriate observation point in the observation optical system (observation mechanism 11), that is, The distance between the observation surface Fp and the scattering surface viewed from the transmission optical axis Pa direction can be set easily and surely.

In the inspection apparatus 10, a scattering surface serving as the transmission illumination device 14 is formed on the lower surface 35b of the transmission stage 35 on which the upper surface 35a is provided, thereby placing the inspection object on the observation surface Fp. Since the function and the function of removing the noise component on the image data can be realized only by providing the transmission stage 35, it can be achieved with a simple structure.

In the inspection apparatus 10, the interval between the upper surface 35a and the lower surface 35b (thickness dimension of the transmission stage 35) viewed from the transmission optical axis Pa direction is the irradiation mechanism portion 16 (the exit portion 53). The amount of light in the transmitted light emitted from the light passing through the transmissive stage 35 is also set in consideration, so that the transmitted light can be irradiated to the inspection object on the observation surface Fp at a predetermined amount of light. Thus, the information of the inspection object (each semiconductor element 44 in the first embodiment) can be obtained more accurately.

In the inspection apparatus 10, the amount of deformation of the bending deformation of the transmission stage 35 is determined by the distance between the upper surface 35a and the lower surface 35b viewed from the direction of the transmission optical axis Pa (thickness dimension of the transmission stage 35). The viscosity within this predetermined range is set, and it can observe suitably by the observation optical system (imaging camera 24).

Therefore, in the inspection apparatus 10 according to the present invention, the inspection object (each semiconductor element 44) attached to the data 42 held in the annular member 43 can be efficiently and efficiently inspected using transmission light. .

Next, an inspection apparatus 10A according to Embodiment 2 of the present invention will be described with reference to FIG. In the second embodiment, the configuration of the position adjusting mechanism in the holding stage 34A (the holding mechanism 13A) is different from that of the inspection target 10 of the first embodiment. In the inspection apparatus 10A of the second embodiment, since the basic configuration is the same as the inspection apparatus 10 of the above-described embodiment (1), the same components are denoted by the same reference numerals, and detailed description thereof is omitted.

In the inspection apparatus 10A, as shown in Fig. 11, a plurality of Z-axis adjusting mechanisms 71 are provided in place of the respective Z-axis screwing members 37 as position adjusting mechanisms in the holding stage 34A of the holding mechanism 13A. It is. The Z-axis adjustment mechanism 71 is provided at least three points or more similarly to the Z-axis screwing member 37 (only two are shown in FIG. 11). Each Z-axis adjustment mechanism 71 has a drive motor 72, a cam member 73 provided on the rotational shaft 72a, and a Z-axis support portion 74 that is varied by it. The drive motor 72 is a drive source in the Z-axis adjusting mechanism 71 and outputs rotational driving force from the rotation shaft 72a. The cam member 73 is connected to the rotating shaft 72a. The cam member 73 has a disk shape and is connected to the rotation shaft 72a at an eccentric position on the axis line. The cam member 73 is able to abut on the Z-axis support portion 74 on the outer surface. The Z-axis support portion 74 has a rod shape, and is provided by penetrating the holding stage 34A in the Z-axis direction from the upper side (transmission stage 35 side) of the cam member 73 as viewed in the Z-axis direction. It is free to move in the Z-axis direction. One end of the upper side (observation optical system side) of the Z-axis support portion 74 supports the support frame 36 from below, and the other end of the lower side is in contact with the outer surface of the cam member 73.

In this Z-axis adjustment mechanism 71, the drive motor 72 is appropriately driven and controlled to move the Z-axis support portion 74 in the Z-axis direction according to the rotational posture around the rotation axis 72a of the cam member 73. Can be. For this reason, the holding stage 34A drives each Z-axis adjustment mechanism 71 appropriately, and changes the support position by each Z-axis support part 74 appropriately, and it sees it from the Z-axis direction, ie, the observation optical axis Oa direction. The transmission stage 35 is provided so that both the position (height position) of the transmission stage 35 and the inclination of the transmission stage 35 (upper end surface 35a) with respect to the observation optical axis Oa can be adjusted. From this, each Z-axis screwing member 37 functions as a position adjusting mechanism for holding the transmission stage 35 with respect to the holding stage 34A so as to enable position adjustment with respect to the observation optical axis Oa. In the inspection apparatus 10A, it is possible for the drive control unit 63 of the control mechanism 15 to appropriately drive control each Z axis adjustment mechanism 71, that is, the drive motor 72 thereof.

In the inspection apparatus 100A, the image control unit 61 of the control mechanism 15 stores the image data of the imaging device 24 in a state in which the inspection target workpiece 40 is held by the holding stage 34A. ), The bending deformation amount and state of the tape 42 are acquired. Subsequently, the drive control unit 63 of the control mechanism 15 causes the respective semiconductor elements 44 on the tape 42 to be positioned on the observation surface Fp in accordance with the bending deformation amount and state of the tape 42. By appropriately controlling the drive motor 72 of the axis adjustment mechanism 71 to the position (height position) of the transmission stage 35 as viewed in the Z-axis direction, that is, the direction of the observation optical axis Oa, and the observation optical axis Oa. The inclination and both sides of the transmission stage 35 (upper end surface 35a) are adjusted. Subsequently, the inspection object (each semiconductor element 44) pasted on the tape 42 on the top surface 35a of the transmission stage 35 whose position with respect to the observation optical axis Oa is adjusted on the observation surface Fp. The drive control unit 63 of the control mechanism 15 appropriately positions the observation mechanism 11, the reflection illumination mechanism 12, and the transmission illumination mechanism 14 (the irradiation mechanism portion 16) in the Z-axis direction so as to be positioned. Move it. As a result, the inspection object (each semiconductor element 44) attached to the tape 42 is positioned on the observation surface Fp in an appropriate state. For this reason, in the inspection apparatus 10A, the inspection object (each semiconductor element 44) can be inspected similarly to the inspection apparatus 10 of Example 1. As shown in FIG.

In the inspection apparatus 10A of the second embodiment, the configuration is basically the same as that of the inspection apparatus 10 of the first embodiment, and basically the same effects as those of the first embodiment can be obtained.

In addition, in the inspection apparatus 10A of Example 2, the inspection object (each semiconductor element 44 in Example 2) on the tape 42 of the inspection target workpiece 40 is automatically imaged on the observation surface Fp. Since it can be located in the above, the inspection object (each semiconductor element 44 can be inspected quickly and appropriately).

Therefore, in the inspection apparatus 10A according to the present invention, the inspection object (each semiconductor element 44) attached to the tape 42 held by the annular member 43 can be efficiently and efficiently inspected using transmission light. .

And in Example 2, although each Z-axis adjustment mechanism 71 is comprised by the drive motor 72 (rotation shaft 72a), the cam member 73, and the Z-axis support part 74, the control mechanism ( As long as it is possible to adjust the position of the transmission stage 35 with respect to the observation optical axis Oa with respect to the holding stage 34A by the drive control by the drive control part 63 of 15, it is limited to the structure of Example 2 It doesn't happen.

Next, the inspection apparatus 10B which concerns on Example 3 of this invention is demonstrated using FIG. The third embodiment is another example in which the holding mechanism 13B is different from the inspection apparatus 10A related to the second embodiment. In the inspection apparatus 10B of the third embodiment, since the basic configuration is the same as that of the inspection apparatus 10A of the second embodiment, the same components are denoted by the same reference numerals, and detailed description thereof is omitted.

In the inspection apparatus 10B, the pressurizing mechanism 81 is provided in the holding mechanism 13B as shown in FIG. This pressing mechanism 81 enables holding of the inspection target work 40 placed on the transmission stage 35 (upper end surface 35a) of the holding stage 34A. In detail, the pressurizing mechanism 81 holds the holding stage 34A such that the upper end surface 35a of the transmission stage 35 is located above (observation optical measurement) above the tip portion 34a (adsorption holding position) of the holding stage 34A. When the position in the Z-axis direction of the transmissive stage 35 with respect to) is adjusted, the inspection object (each semiconductor) attached to the tape 42 in cooperation with the transmissive stage 35 (the upper end face 35a thereof). It is possible to hold the inspection target workpiece 40 while properly positioning the element 44 on the observation surface Fp.

In the third embodiment, the pressing mechanism 81 is free to move in the Z-axis direction by the slide support portion 82 provided at an outer position of the holding stage 34A and the slide support portion 82 in the direction perpendicular to the Z axis. It has the supported arm part 83 supported. At least two or more of these press mechanisms 81 are provided (two are shown in FIG. 12). Each pressurizing arm portion 83 is directed inward from the slide support portion 82, and presses the annular member 43 of the workpiece 40 to be inspected from above (observation optical measurement) around the holding stage 34A. It is possible. In other words, each pressurizing arm part 83 is provided so that at least the front-end | tip part may overlap with the annular member 43 of the workpiece | work to be examined 40 seen from the Z-axis direction.

In the inspection apparatus 10B, the tape 42 of the workpiece | work 40 to be examined is sucked and held | maintained basically at the front-end | tip part 34a of the holding stage 34A. Here, the transmissive stage 35 with respect to the holding stage 34A so that the upper end surface 35a of the transmissive stage 35 is located above (observation optical measurement) above the tip part 34a (adsorption holding position) of the holding stage 34A. ), When the position in the Z-axis direction is adjusted, the tape 42 placed on the upper end surface 35a may not be adsorbed and held at the tip portion 34a of the holding stage 34A. This is due to the fact that the bending deformation of the tape 42 is limited, and is caused by a large difference between the position of the top surface 35a and the position of the tip portion 34a viewed in the Z-axis direction. At this time, in the inspection apparatus 10B, in each pressurizing mechanism 81, the pressurizing arm part 83 provided in each slide support part 82 is pushed down (to move to the irradiation mechanism part 16 side (refer FIG. 11 etc.)), ) And press the annular member 43 of the inspection target workpiece 40 downward from each of the pressurizing arm portions 83 from above (observation optical measurement (see Fig. 11, etc.). Since the center of the tape 42 is pushed up by the top surface 35a of the transmission stage 35, the tape 42 is fixed in a flattened state so that the tape 42 adheres to the top surface 35a. The pressing position (height position) in the arm part 83 is set individually according to the inclination with respect to the observation optical axis Oa of the transmission stage 35 (its upper end surface 35a), and each pressurizing arm part ( The pressing position in 83 may be the same height position (the position with respect to the transmission stage 35 viewed in the Z-axis direction). For this reason, the inspection object (each semiconductor element 44) is suitably positioned on the observation surface Fp which is an appropriate position in the observation optical system. The positional movement of the pressurizing arm part 83 on each slide support part 82 is made under the control of the control mechanism 15 (its drive control part 63). In addition, the positional movement of the pressurizing arm part 83 on each slide support part 82 may be performed manually. In each of these pressurizing mechanisms 81, the inspection target workpiece 40 is prevented from being placed on the holding stage 34A (transmission stage 35) in a scene in which the annular member 43 of the inspection target workpiece 40 is not pressed. The pressing arm part 83 is retracted to the upward position by the slide support part 82 so as not to. In addition, the pressurizing arm part 83 may be comprised by the structure which can expand and contract | stretch freely in the direction of direction for this retraction, and may be comprised by the structure which can be rotated around the slide support part 82. As shown in FIG.

Since the inspection apparatus 10B of the third embodiment is basically the same as the inspection apparatus 10A of the second embodiment, the same effects as those of the second embodiment can be obtained basically.

In addition, in the inspection apparatus 10B of Example 3, the inspection object (each semiconductor element 44) attached to the tape 42 is transmitted to the holding stage 34A so as to properly position it on the observation surface Fp. Due to the positioning of the stage 35 in the Z-axis direction, even if the inspection target workpiece 40 cannot be adsorbed and held at the tip portion 34a of the holding stage 34A, it is caused by the pressurization in the pressing mechanism 81. Since the tape 42 can be fixed while being flattened along the upper surface 35a of the transmission stage 35, the inspection object (each semiconductor element 44) attached to the tape 42 can be properly inspected. have.

In addition, in the inspection apparatus 10B, since the pressurizing mechanism 81 presses the annular member 43 of the workpiece | work object 40 to be examined, the tape 42 of the said workpiece | work object 40 and the test | inspection object attached thereto are provided. The tape 42 (inspection object (each semiconductor element 44)) can be pressed against the upper end surface 35a of the transmission stage 35 while suppressing the load on each semiconductor element 44.

Therefore, in the inspection apparatus 10B which concerns on this invention, the inspection object (each semiconductor element 44) affixed on the tape 42 hold | maintained at the annular member 43 can be efficiently and efficiently examined using transmission light. .

In addition, although the inspection apparatus 10B which installed the pressurization mechanism 81 in the inspection apparatus 10A of Example 2 is shown in Example 3, this pressurization mechanism 81 is attached to the inspection apparatus 10 of Example 1, You may apply and it is not limited to the structure of Example 3 mentioned above.

In addition, although the pressurizing mechanism 81 consists of the structure which has the slide support part 82 and the pressurizing arm part 83 in Example 3, it is on the permeation | transmission stage 35 (upper end surface 35a) of the holding stage 34A. The inspection object workpiece 40 mounted on the tape 42 may be held as long as the inspection object attached to the tape 42 (each semiconductor element 44) can be appropriately positioned on the observation surface Fp. It is not limited to the structure of Example 3. For example, the pressurizing mechanism seals the inward position of the tip portion 34a and the transmissive member 35 and the support frame 36 in the holding stage 34A, and the inward position of the tip portion 34a and the permeable member 35. ) And the annular groove formed by the support frame 36 can be realized by a configuration capable of making a vacuum. In such a configuration, the tape 42 of the inspection target workpiece 40 placed on the upper end surface 35a of the penetrating member 35 can be adsorbed over the entire circumference at the position surrounding the upper end surface 35a. . Therefore, regardless of whether or not the tape 42 can be adsorbed and held by the tip portion 34a of the holding stage 34A, the excess due to the bending deformation in the tape 42 can be drawn into the annular groove. The inspection object (each semiconductor element 44) attached to 42 can be appropriately positioned on the observation surface Fp.

And in Example 3, although the press arm arm 83 of the press mechanism 81 consists of the structure which presses the annular member 43 of the test | inspection workpiece 40 from above (observation optical measurement), the tape 42 is hold | maintained. It is good to pressurize, and it is not limited to the structure of Example 3 mentioned above.

Although each of the above embodiments has been described with respect to each example of the inspection apparatus according to the present invention, an observation optical system having a predetermined position on an observation optical axis as an observation surface, and a reflection light illuminating the observation surface by the observation optical measurement. A cylindrical holder capable of holding the tape on the side of the transmission illuminator inside the annular member holding the instrument, a transmission illumination mechanism for illuminating the observation surface on the side opposite to the observation optical system, and a tape to which the inspection object is attached. An inspection apparatus having a stage, wherein the transmission illumination mechanism has an exit portion for emitting transmitted light guided by a light source from the outside of the holding tape toward the observation surface, and the holding stage follows the observation surface on the observation optical measurement. It has a plate shape provided with a flat surface defining a plane, and the transmitted light emitted from the exit portion And a transmissive member which permits the transmission of light, and a positioning mechanism for holding the transmissive member in such a manner that the transmissive member can be adjusted with respect to the holding optical axis direction relative to the holding stage. It doesn't happen.

In each of the above-described embodiments, a diffusion portion (diffusion surface) is provided in the transmission lighting mechanism. However, the diffusion portion may not be provided and is not limited to the above-described embodiments.

In addition, in each of the above-described embodiments, the holding stages 34 and the like are configured to adsorb and hold the tape 42 at the tip portion 3a. What is necessary is just to hold | maintain the test | inspection workpiece | work 40 while maintaining a state, and is not limited to each said Example.

As mentioned above, although the inspection apparatus of this invention was demonstrated based on each Example, the specific structure is not limited to each of these Examples and each Example, A design change or addition is carried out, unless the summary of the present invention departs. And the like will be allowed.

10,10A, 10B; Inspection device
11; Observation Mechanism (as Observation Optics)
12; Reflective lighting equipment
14; Transmission lighting equipment
24; Imaging Camera (as Observation Optics)
34,34A; Maintenance stage
34a; Tip part (which is the holding position of the tape)
35; Transmission stage (as penetrating member)
35a; Top surface (as flat surface)
37; Z-axis screwing member (as positioning mechanism)
38; Orthogonal Shaft Screw Coupling (as Positioning Mechanism)
42; tape
43; Annular member
44; Semiconductor element (as test object)
51; Light source for transmission
53; Exit
71; Z-axis adjusting mechanism (as positioning mechanism)
81; Pressurization
Fp; Observation plane
Oa; Observation
Pa; Transmitted optical axis

Claims (8)

An observation optical system having a predetermined position on the observation optical axis as an observation surface, a reflection illumination mechanism that illuminates the observation surface by the observation optical measurement, a transmission illumination mechanism that illuminates the observation surface on the opposite side to the observation optical system, and an inspection An inspection apparatus comprising: a cylindrical holding stage capable of holding the tape on the side of the transmission lighting apparatus inside an annular member holding a tape to which an object is attached;
The transmission lighting device has an output unit for emitting the transmitted light guided from the light source toward the observation surface from the outside of the holding stage,
The holding stage has a plate shape having a flat surface defining a plane along the observation surface on the observation optical system side, and a transmission member for allowing transmission of transmitted light emitted from the emission section, and observation of the holding stage. And a positioning device for holding the transmission member in such a manner as to enable positioning in the optical axis direction.
The inspection apparatus according to claim 1, wherein the position adjustment with respect to the observation optical axis direction is a position in the observation optical axis direction and an inclination with respect to the observation optical axis direction.
3. The position adjusting mechanism according to claim 1 or 2, wherein the positioning mechanism makes it possible to position the transmissive member so that the flat surface is in the observation optical system side rather than the holding position of the tape in the holding stage in the direction of the observation optical axis. Inspection device characterized in that.
The inspection apparatus according to any one of claims 1 to 3, further comprising a pressing mechanism for pressing the tape toward the exit portion in the direction of the observation optical axis at an outer position of the transmission member.
5. The inspection apparatus according to claim 4, wherein the pressing mechanism presses the annular member at an outer position of the holding stage.
The method of claim 4, wherein
And said pressure mechanism sucks between said permeation member and a portion holding said tape to surround said permeation member in said holding stage.
The method according to any one of claims 1 to 6,
And said exit portion has a condensing optical member for reducing the diffusion of the transmitted light guided to enter the transmitted light in a predetermined spot region into said transmissive member.
The method of claim 7, wherein
And said condensing optical member is a rod integrator optical member which also has a function of equalizing the light quantity distribution seen in a cross section perpendicular to the transmission optical axis.

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