JP2013024584A - Inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection apparatus which is capable of obtaining accurate information through an observation optical system while illuminating an inspection target adhered to a tape with transmissive illumination.SOLUTION: An inspection apparatus 10 includes an observation optical system (11) to which an observation plane Fp is set, a reflection illumination mechanism 12 which illuminates the observation plane Fp from a side of the observation optical system, a transmissive illumination mechanism 14 which illuminates the observation plane Fp from a side opposed to the observation optical system, and a hold mechanism 13 which forms a flat surface (35a) along with the observation plane Fp. The hold mechanism 13 includes a transmission member (35) which allows illumination light from the transmissive illumination mechanism 14 to be transmitted and forms at least a portion of the flat surface and a hold member (34) which encloses and holds the transmission member. The hold member includes an annular projection 34h which encloses the flat surface while being projected to the observation optical system side and a suction hole 38 communicating an inward recess 34l specified by the annular projection and the flat surface to the outside. A suction device 36 which sucks air in the inward recess 34l is connected to the suction hole 38.

Description

  The present invention relates to an inspection apparatus for inspecting a semiconductor element as an inspection object.

  An inspection apparatus that inspects a semiconductor element such as an LED chip as an inspection object by irradiating the semiconductor element with an observation optical system while irradiating various illumination lights (for example, patents) is known. Reference 1). In this inspection apparatus, transmitted illumination from a transmission illumination mechanism that illuminates the inspection object from the side opposite to the observation optical system when viewed from the inspection object is used as one of various illumination lights.

  Here, it is often seen that the semiconductor element is cut out from the wafer while being stuck to a tape (film) and is handled in a state where the tape is held by the annular member. For this reason, in the inspection apparatus mentioned above, using the light which permeate | transmits a tape as transmission illumination, irradiating various illumination light with respect to the test target object in the state affixed on the tape hold | maintained at the annular member Inspect the inspection object.

JP 2010-107254 A

  Here, in the observation optical system, in order to appropriately observe the inspection object, it is necessary to appropriately arrange the inspection object at the in-focus position. However, as described above, when the inspection object is affixed to the tape held by the annular member, the tape is bent by its own weight including the inspection object. It is difficult to arrange properly.

  For this reason, it is made of a material that allows transmission of transmitted illumination, and uses a transmission member that forms a flat mounting surface having a size and size on which substantially the entire tape to which the inspection object is attached can be placed, and It is conceivable that the tape is sucked on the mounting surface by suction.

  However, since the transmission member needs to be formed of a material that allows transmission of transmitted illumination, it is difficult to provide a structure for suction on the entire mounting surface. For this reason, it is conceivable that the space between the mounting surface and the tape is sucked from the vicinity of the annular member. However, since an air pool is generated between the mounting surface and the tape, the tape is placed along the mounting surface. It is difficult to properly arrange the inspection object at the in-focus position.

  The present invention has been made in view of the above circumstances, and its purpose is an inspection apparatus capable of obtaining accurate information by an observation optical system while illuminating an inspection object attached to a tape with transmitted illumination. Is to provide.

  The invention according to claim 1 is an observation optical system having a predetermined position on the observation optical axis as an observation surface, a reflection illumination mechanism for illuminating the observation surface from the observation optical system side, and the observation optical system. An inspection apparatus comprising: a transmission illumination mechanism that illuminates the observation surface from the opposite side; and a holding mechanism that forms a flat surface along the observation surface between the transmission illumination mechanism and the observation optical system, The holding mechanism has a transmissive member that allows transmission of illumination light from the transmissive illumination mechanism and forms at least a part of the flat surface, and a holding member that surrounds and holds the transmissive member, and the holding member Is a suction hole that communicates to the outside an annular protrusion that surrounds the flat surface while projecting to the observation optical system side from the flat surface, and an inward recess defined by the annular protrusion and the flat surface And the suction hole has air in the inner recess. Wherein the suction device for sucking is connected.

  Invention of Claim 2 is an inspection apparatus of Claim 1, Comprising: The said suction hole opens the inner peripheral surface which faces the said inward recess in the said cyclic | annular protrusion, and the said inward recess It is characterized by that.

  A third aspect of the present invention is the inspection apparatus according to the first or second aspect, wherein the holding member is an annular bottom surface that forms the other part of the flat surface outside the transmitting member. It is characterized by having.

  A fourth aspect of the present invention is the inspection apparatus according to the third aspect, wherein the suction hole opens the annular bottom surface and communicates with the inward recess.

  Invention of Claim 5 is an inspection apparatus of any one of Claim 1 to 4, Comprising: In the said holding mechanism, the protrusion amount of the said annular protrusion with respect to the said flat surface is inspection object. When the tape to which an object is attached is disposed on the projecting end surface of the annular protrusion, the tape can be prevented from coming into contact with the flat surface by being bent and deformed by its own weight. The tape is set so as to be able to come into contact with a predetermined region from the center position of the flat surface by being bent and deformed by suction of air by a suction device.

  According to the inspection apparatus of the present invention, accurate information can be obtained by the observation optical system while illuminating the inspection object attached to the tape with transmitted illumination.

  In addition to the above-described configuration, when the suction hole opens the inner peripheral surface facing the inner recess in the annular protrusion and communicates with the inner recess, Even if the tape is attracted to the flat surface toward the outside, it is possible to prevent the portion (opening) leading to the inward recess of the suction hole from being blocked by the tape, so a wider area on the tape Can be adsorbed on a flat surface.

  In addition to the above-described configuration, when the holding member has an annular bottom surface that forms the other part of the flat surface outside the transmission member, the holding member is formed by the transmission member of the flat surface. The tape can be adsorbed over the entire area.

  In addition to the above-described configuration, if the suction hole opens the annular bottom surface and communicates with the inner recess, it is easy to form a suction hole for sucking air in the inner recess. can do.

  In addition to the above-described configuration, in the holding mechanism, when the protruding amount of the annular protrusion with respect to the flat surface is arranged on the protruding end surface of the annular protrusion, the tape is attached to the inspection object. It is possible to prevent the tape from coming into contact with the flat surface by being bent and deformed by its own weight, and a predetermined region from the center position of the flat surface by being deformed by the suction of air by the suction device. If the tape is set so as to be able to come into contact with each other, the pressing force due to the pressure drop in the space defined by the inner recess of the annular convex portion and the tape is used. Further, it is possible to more reliably adsorb the tape to the flat surface while extruding air between the tape and the flat surface formed by the transmission member from the central position of the tape toward the outside in the radial direction.

It is explanatory drawing which shows typically the structure of the test | inspection apparatus 10 of the present Example which concerns on this invention. 2 is a block diagram showing a functional configuration of the inspection apparatus 10. FIG. 3 is a perspective view schematically showing a holding stage 34 and a transmission stage 35 in the holding mechanism 13 of the inspection apparatus 10. FIG. It is sectional drawing which shows the cross section obtained along the II line | wire of FIG. It is explanatory drawing for demonstrating the kind of test | inspection workpiece | work 40, (a) shows the state cut | disconnected at each boundary surface, with each semiconductor element 44 affixed on the tape 42, (b) shows the tape 42. Is stretched and each semiconductor element 44 is divided into individual pieces. 2 is a perspective view schematically showing a holding mechanism 13 and a transmission illumination mechanism 14 of the inspection apparatus 10. FIG. It is explanatory drawing which shows the location which follows the II-II line shown in FIG. 6 with a partial cross section. It is explanatory drawing similar to FIG. 4 which shows the holding mechanism 91 in the inspection apparatus 90 of the other structure for a comparison. FIG. 5 is an explanatory view similar to FIG. 4 showing a process of sucking and holding the inspection target workpiece 40 by the holding mechanism 13, wherein (a) shows a state where the inspection target workpiece 40 is placed on the holding mechanism 13, and (b) shows suction. Shows a state after starting, and (c) shows a state in which suction is continued after (b). FIG. 5 is an explanatory view similar to FIG. 4, illustrating a state in which the inspection target workpiece 40 is sucked and held in the holding mechanism 13.

  Hereinafter, an example of an inspection apparatus according to the present invention will be described with reference to the drawings.

Example

  First, a schematic configuration of an inspection apparatus 10 according to an embodiment of the present invention will be described. FIG. 1 is an explanatory view schematically showing a configuration of an inspection apparatus 10 as an example of an inspection apparatus according to the present invention. FIG. 2 is a block diagram illustrating a functional configuration of the inspection apparatus 10. In FIG. 6, the wafer 41 and the tape 42 in the inspection target workpiece 40 are omitted for easy understanding.

  As shown in FIGS. 1 and 2, the inspection apparatus 10 is generally configured by an observation mechanism 11, a reflection illumination mechanism 12, a holding mechanism 13, a transmission illumination mechanism 14, and a control mechanism 15. As shown in FIG. 1, the inspection apparatus 10 has a main body 21. Although not shown, the main body 21 is provided with a relay lens and a revolver turret, and the turret is provided with a plurality of objective lens barrels 22 (only one is shown in FIG. 1). It has been. Each objective lens barrel 22 is provided with an objective lens 23.

  An imaging camera 24 is attached to the upper part of the main body 21. The imaging camera 24 passes through the objective lens 23 and the main body portion 21 (relay lens) according to the magnification determined by the set objective lens 23, and image data at a predetermined position on the optical axis (observation optical axis Oa). Can be obtained. For this reason, the imaging camera 24, the main body 21, the objective lens barrel 22, and the objective lens 23 function as an observation optical system in the observation mechanism 11, and the optical axis thereof becomes the observation optical axis Oa. This observation mechanism 11 (observation optical system) is arranged with the observation optical axis Oa aligned with the vertical direction. In addition, a plane (object-side imaging plane) that includes the position where the imaging camera 24 can acquire an appropriate image on the observation optical axis Oa, that is, the focal position in the observation optical system and is orthogonal to the observation optical axis Oa is the observation plane Fp. It becomes. In the following, the direction of the observation optical axis Oa is the Z-axis direction, and the plane orthogonal to the direction is the XY plane. Image data acquired by the imaging camera 24 is appropriately analyzed by an image control unit 61 described later and can be displayed on the monitor 39 (see FIG. 2).

  A reflection member 25 is provided on the observation optical axis Oa inside the main body 21. The reflecting member 25 can be constituted by a half mirror or a prism. In the main body portion 21, a light guide fiber 27 is attached via a connector portion 26 in the direction of reflection from the observation optical axis Oa by the reflecting member 25. The light guide fiber 27 can guide the irradiation light emitted from the coaxial light source 28 to the reflection member 25. As shown in FIG. 2, the coaxial light source 28 can selectively emit both the halogen lamp 28 a and the strobe light 28 b, and the light is emitted to the light guide fiber 27 regardless of which light is emitted. It is possible to make it. As shown in FIG. 1, the irradiation light emitted from the coaxial light source 28 travels on the observation optical axis Oa through the light guide fiber 27 and the reflecting member 25, and passes through the objective lens 23 of each objective lens barrel 22. Then, the observation surface Fp can be illuminated on the observation optical axis Oa. For this reason, the coaxial light source 28, the light guide fiber 27, and the reflection member 25 cooperate with the objective lens 23 of each objective lens barrel 22 from the inspection object (44) described later with respect to the observation optical system. It functions as the reflective illumination mechanism 12 for generating the reflected light in the coaxial direction, that is, the coaxial incident illumination mechanism 29.

  The main body 21 is movable in the observation optical axis Oa direction (Z-axis direction) by a Z-axis drive mechanism 67 (see FIG. 2) described later. For this reason, the observation optical system in the observation mechanism 11 and the coaxial incident illumination mechanism 29 are integrally movable in the observation optical axis Oa direction (Z-axis direction).

  Further, as shown in FIG. 1, the main body 21 is provided with a ring plate 30 for illuminating light so as to surround the outer periphery of the objective lens barrel 22. Although not shown, the illumination light deriving ring board 30 is provided with a plurality of light emitting portions so as to surround the observation optical axis Oa at a predetermined interval from the observation optical axis Oa. Irradiation is possible from the direction inclined with respect to the axis Oa toward the observation surface Fp. A light guide fiber 31 is attached to the ring plate 30 for illuminating light. The light guide fiber 31 can guide the irradiation light emitted from the ring light source 32 to each light emitting unit (not shown) of the illumination light deriving ring board 30. As shown in FIG. 2, the ring light source 32 can selectively emit both the halogen lamp 32 a and the strobe 32 b, and the light is emitted to the light guide fiber 31 regardless of which light is emitted. It is possible to make it. As shown in FIG. 1, the irradiation light emitted from the ring light source 32 passes through the light guide fiber 31, and from each light emitting portion (not shown) of the illumination light deriving ring board 30 to the observation optical axis Oa. Thus, the observation surface Fp can be illuminated in a tilting direction. For this reason, the ring light source 32, the light guide fiber 31, and the illumination light deriving ring board 30 (the respective light emitting portions) are arranged on the observation optical axis Oa from the inspection object (44) described later with respect to the observation optical system. It functions as the reflective illumination mechanism 12 for generating the reflected light in the inclined direction, that is, the oblique illumination mechanism 33. The illumination light deriving ring board 30 is movable in the observation optical axis Oa direction (Z-axis direction) by a Z-axis drive mechanism 67 (see FIG. 2) described later. The movement in the direction of the observation optical axis Oa may be integrated with the main body 21 or may be independent of each other.

  A holding mechanism 13 is provided below the main body 21 and the illumination light derivation ring board 30. The holding mechanism 13 includes a holding stage 34, a transmission stage 35, and a suction device 36. As shown in FIGS. 3 and 4, the holding stage 34 has a cylindrical shape as a whole, and the outer shape is relatively larger in the radial direction (in the direction of the observation optical axis Oa) at one end side which is the upper side (observation mechanism 11 side). It is a stepped shape having a small outer diameter dimension with respect to the observation optical axis Oa as viewed in the orthogonal direction (radial direction). In the holding stage 34, a plurality of fixing members 34a are provided in the enlarged diameter portion having a large diameter. Each fixing member 34a fixes the holding stage 34 to a base (not shown).

  The holding stage 34 is provided with a through hole 34b that penetrates the center position along the direction of the observation optical axis Oa in order to hold the transmission stage 35. As shown in FIG. 4, the through hole 34b has an upper side (observation mechanism 11 side) having a large inner diameter part 34c having an inner diameter larger than that of the transmission stage 35, and a lower side having an inner diameter smaller than that of the large inner diameter part 34c. The inner diameter portion 34d has an inner diameter size that is suitable for the transmission stage 35, and the lower side is a small inner diameter portion 34e that has a smaller inner diameter than the medium inner diameter portion 34d (transmission stage 35). In the through hole 34b, an annular bottom surface 34f surrounding the observation optical axis Oa is formed due to a difference in inner diameter between the large inner diameter portion 34c and the middle inner diameter portion 34d, and a difference in inner diameter between the inner inner diameter portion 34d and the small inner diameter portion 34e. Thus, an annular engagement surface 34g surrounding the observation optical axis Oa is formed. The annular bottom surface 34f and the annular engagement surface 34g exist along a plane orthogonal to the observation optical axis Oa.

  For this reason, in the holding stage 34, when the annular bottom surface 34f is used as a reference, an annular convex portion 34h that surrounds the annular bottom surface 34f while projecting to the observation mechanism 11 side from the annular bottom surface 34f is formed by the wall portion defining the large inner diameter portion 34c. Will be. A projecting end surface 34 i orthogonal to the observation optical axis Oa is provided at the projecting end of the annular projection 34 h, that is, at a position facing the holding stage 34 closest to the illumination light deriving ring disk 30. In the holding stage 34, the difference between the set positions of the annular bottom surface 34f and the projecting end surface 34i viewed in the direction of the observation optical axis Oa (height dimension of the annular convex portion 34h) is the inspection target workpiece 40 (the tape 42) as described later. ), And is set appropriately, and in this embodiment is 2.5 mm. In the holding stage 34, a sealing member 37 is provided in an annular engagement surface 34g (an inner recess 341 described later). The sealing member 37 is an annular seal member.

  In the holding stage 34, a suction hole 38 is provided. The suction hole 38 is formed by drilling the holding stage 34. In this embodiment, the suction hole 38 is orthogonal to the observation optical axis Oa when viewed in a direction along a plane orthogonal to the observation optical axis Oa. There are four locations in the direction (two locations are shown in FIGS. 3 and 4). Each suction hole 38 has a peripheral hole 38a, a bottom hole 38b, and a merging hole 38c. One end of the peripheral surface hole portion 38a opens the inner peripheral surface 34j of the large inner diameter portion 34c, and the other end communicates with the junction hole portion 38c. One end of the bottom hole 38b opens the annular bottom 34f, and the other end communicates with the merge hole 38c. The merge hole 38c opens the lower end surface 34k of the holding stage 34 after the circumferential hole 38a and the bottom hole 38b merge. For this reason, each suction hole 38 communicates the space (inward recess 34l described later) inside the large inner diameter portion 34c (annular convex portion 34h) to the outside of the holding stage 34 through the inside of the holding stage 34. I am letting.

  As shown in FIG. 1, the holding stage 34 is moved on an XY plane orthogonal to the observation optical axis Oa (observation optical system) by an XY drive mechanism 65 (see FIG. 2) described later. It is possible. The holding stage 34 can be rotated around the Z axis by a rotation drive mechanism 66 (see FIG. 2) described later. The holding stage 34 is provided with a transmission stage 35 on the inside thereof.

  As shown in FIGS. 1, 3, 4, 6, and 7, the transmission stage 35 has a disk shape, and an upper end surface 35a on the upper side (observation optical system side) is a flat surface. The lower end surface 35b on the side (transmission illumination mechanism 14 side) is a scattering surface. In the present embodiment, the upper end surface 35a is a polished flat surface, and the lower end surface 35b is set in consideration of the diffusivity and the like from the viewpoint of obtaining a scattering effect as described later. The transmission stage 35 is formed of a transparent member (transmission member) that allows transmission of transmitted light emitted from at least the transmission illumination mechanism 14 (the emission portion 53). In this embodiment, the transmission stage 35 is formed of glass. Yes. The transmission stage 35 is inserted from the opening on the large inner diameter portion 34c side (observation mechanism 11 side) of the holding stage 34 into the through hole 34b, and is fitted into the inner inner diameter portion 34d, while the lower end of the peripheral portion is an annular engagement surface 34g. Is accommodated in the through hole 34b. At this time, the sealing member 37 is appropriately compressed by the lower end surface 35b of the transmission stage 35 and the annular engagement surface 34g (its recess), so that the lower end surface 35b and the annular engagement surface 34g (its recess) are compressed. ), That is, the air is prevented from entering and exiting between the transmission stage 35 and the holding stage 34. For this reason, the holding stage 34 has sufficient sealing performance around the transmission stage 35.

  At this time, the upper end surface 35a of the transmission stage 35 forms the same flat surface as the annular bottom surface 34f. Therefore, in the holding mechanism 13, a flat surface perpendicular to the observation optical axis Oa of the observation optical system (parallel to the observation surface Fp) is defined by the upper end surface 35a of the transmission stage 35 and the annular bottom surface 34f of the holding stage 34. The Further, in the holding mechanism 13, a holding surface as a mounting surface on which the tape 42 is mounted as described later is formed in the space inside the large inner diameter portion 34 c by the flat surface and the annular convex portion 34 h of the holding stage 34. An inward recess 34l is defined that is recessed inward of the protruding end surface 34i of the annular protrusion 34h of the stage 34.

  In the transmission stage 35, the thickness dimension, that is, the distance between the upper end surface 35a and the lower end surface 35b (the length dimension of the inner diameter part 34d of the through-hole 34b) takes into consideration the optical characteristics and hardness characteristics of the transmission stage 35. These are set to be uniform in consideration of the following three points.

  The first point is that a predetermined amount of light can be secured in the transmitted light emitted from the transmitted illumination mechanism 14 and incident on the lower end surface 35b and emitted from the upper end surface 35a. This is because the inspection stage (44), which will be described later, needs to be appropriately illuminated in the transmission stage 35 when viewed from an image acquired by the imaging camera 24 via the observation optical system. This point mainly affects the upper limit value of the thickness dimension of the transmission stage 35.

  The second point is that the deformation amount of the bending deformation that falls at the center position is within a predetermined range due to the lower end of the peripheral edge portion being supported from below. In the transmission stage 35, as will be described later, the upper end surface 35a has a function of causing an inspection target (44) described later to exist (arrange) on an observation surface Fp that is an appropriate position in the observation optical system. This is because the upper end surface 35a needs to be along the observation surface Fp over the entire surface. For this reason, the predetermined range in the deformation amount described above is the maximum depth of field in the observation optical system. This point mainly affects the lower limit value of the thickness dimension of the transmission stage 35.

  The third point is that the scattering effect by the lower end surface 35b as a scattering surface is sufficiently obtained in the transmitted light emitted from the upper end surface 35a. This scattering effect will be described later, in which image data from the imaging camera 24 obtained by obtaining the observation surface Fp through the observation optical system is irradiated with transmitted light from the transmission illumination mechanism 14 on the observation surface Fp. The tape 42 is uniformly bright. This is because, in the tape 42 described later, when the transmitted illumination is observed with image data from the observation optical system (imaging camera 24), even if no member is attached, it is uniform. This is due to the presence of partially dark portions such as lines or dots rather than a bright state. This dark portion is considered to be caused by dust or the like adhering to the tape 42 or the presence of adhesive spots. In the inspection apparatus 10, by sufficiently obtaining the above-described scattering effect, it is possible to prevent a shadow portion from being generated on the tape 42, so that noise components on the image data can be removed.

  In the holding mechanism 13, as shown in FIG. 1, a suction device 36 is connected to each suction hole 38 of the holding stage 34. The suction device 36 is connected to a location where the lower end surface 34k of the holding stage 34 is opened in the merging hole portion 38c of each suction hole 38. The suction device 36 is capable of sucking (evacuating) air from each suction hole 38 under the control of a holding control unit 64 (see FIG. 2) described later. Therefore, the holding mechanism 13 can evacuate the inner recess 34l (the inner space of the large inner diameter portion 34c (annular convex portion 34h)) through each suction hole 38 by suction by the suction device 36. it can. Each of the suction holes 38 and the suction device 36 function as a suction mechanism capable of sucking air in the inner recess 34l. For this reason, the holding mechanism 13 can suck and hold the workpiece 40 to be inspected placed on the protruding end surface 34 i of the annular convex portion 34 h in a state where the holding stage 34 seals and holds the transmission stage 35. (See FIG. 10 etc.). This adsorption holding and its operation will be described in detail later.

  As shown in FIG. 5, the workpiece 40 to be inspected is configured by holding a tape (film) 42 to which a wafer 41 (including a glass substrate and the like) is attached inside an annular member 43. In this inspection target workpiece 40, as shown in FIG. 6A, a plurality of semiconductor elements 44 formed from the wafer 41 are in a state of being cut (diced) at each boundary surface while being stuck to the tape 42. And, as shown in (b), there is a state where the tape 42 is stretched and divided into individual pieces (expanded) after being attached to the tape 42 and cut. Here, in the present embodiment, the annular member 43 has a larger diameter dimension than the annular convex portion 34h (see FIG. 3) of the holding stage 34, regardless of the difference in state (the type of the workpiece 40 to be inspected). The projecting end surface 34i has a diameter dimension that can partially overlap the outside. The inspection apparatus 10 is used for inspecting whether or not each semiconductor element 44 is appropriately formed in any of these states. For this reason, each semiconductor element 44 can be used as an inspection object, and the inspection object can be inspected while maintaining the state of the inspection object workpiece 40. As described above, the workpiece 40 to be inspected is sucked and held by the holding mechanism 13. At this time, in the work 40 to be inspected, as will be described later, the tape 42 is flattened so as to stick to the upper end surface 35a of the transmission stage 35 and disposed on the observation surface Fp (see FIG. 10 and the like).

  As will be described later, the transmission stage 35 has an inspection object (each semiconductor element 44) attached to the tape 42 flattened so as to stick to the upper end surface 35a at a position on the observation surface Fp. In order to enable this, the position of the observation optical axis Oa is adjusted together with the holding stage 34. A transmission illumination mechanism 14 is provided below the transmission stage 35 (holding stage 34) (see FIG. 1).

  As shown in FIG. 1, the transmitted illumination mechanism 14 is opposite to the observation optical system (observation mechanism 11) with respect to the inspection target (each semiconductor element 44 of the inspection target workpiece 40) attracted and held by the holding stage 34. The transmitted light is irradiated from the side. The transmitted illumination mechanism 14 can guide the transmitted light emitted from the light source 51 for transmission through the light guide unit 52 described later to the output unit 53 described later. As shown in FIG. 2, the transmissive light source 51 can selectively emit both the halogen lamp 51a and the strobe light 51b, and the light is emitted to the light guide 52 regardless of which light is emitted. It is possible to make it.

  In addition to the above-described light source 51 for transmission (see FIG. 2), the transmission illumination mechanism 14 includes a light guide unit 52, an emission unit 53, and a support unit 54 as shown in FIGS. Although not shown, the light guide portion 52 has an incident surface provided on one end side so that light (transmitted light) emitted from the halogen lamp 51a and the strobe light 51b of the transmissive light source 51 (see FIG. 2) can be incident. They are provided so as to face each other, and guide the transmitted light from the transmission light source 51 (see FIG. 2) incident from the incident surface to the emission surface 52a (see FIG. 7) provided on the other end side. In the present embodiment, the light guide portion 52 is formed of an optical fiber. The emission part 53 is connected to the emission surface 52a of the light guide part 52 (see FIG. 7).

  The emission part 53 is configured by accommodating at least one or more optical elements 53b in a cylindrical casing 53a. The optical element 53b includes an incident surface 53c that faces the exit surface 52a of the light guide section 52, and an exit surface 53d that emits transmitted light incident therefrom. The optical element 53b has a predetermined optical characteristic so that the transmitted light incident from the incident surface 53c is emitted from the emission surface 53d in a desired state. A rotationally symmetric axis serving as the central axis position of the optical element 53b is defined as a transmitted optical axis Pa (see FIG. 1) of the transmitted illumination mechanism 14 (transmitted illumination system). In this transmissive illumination mechanism 14, when transmitted light is incident from the light guide unit 52 to the emission unit 53, transmitted light along the transmission optical axis Pa is emitted from the emission unit 53. The predetermined optical characteristics in the optical element 53b are that the light amount distribution seen in a cross section orthogonal to the transmission optical axis Pa, which is the traveling direction, is uniform, and the spread (diffusion) of the irradiation region is suppressed. Say that. This optical element 53b is composed of an optical element having the above-mentioned predetermined optical characteristics (integrator function and diffusion prevention (condensing) function). In this embodiment, the optical element 53b is a rod integrator optical member. It is configured.

  In the present embodiment, the lower end portion 53e below the incident surface 53c of the optical element 53b in the casing 53a is cylindrical, and the other end portion of the light guide portion 52 (the emission surface 52a is provided). Side end) can be fitted inward. For this reason, the light emission part 53 and the light guide part 52 insert the other end part of the light guide part 52 into the lower end part 53e of the light emission part 53, thereby allowing the light emission part 52a and the light emission part 53 to enter. The face 53c is abutted and connected (connected). In this state, the light guide portion 52 and the emission portion 53 are fixedly supported by the support portion 54.

  For this reason, in the transmissive illumination mechanism 14, the transmitted light emitted from the transmissive light source 51 travels through the light guide unit 52 to the emission unit 53, and is transmitted from the emission unit 53 as a substantially parallel light with a uniform light amount distribution. It is possible to irradiate the lower end surface 35b of the transmission stage 35 by emitting the light toward the Pa (see FIG. 1) direction. This transmitted light is scattered by the lower end surface 35b, which is a scattering surface, and irradiates the observation surface Fp from the back surface side. This transmitted light passes through at least the tape 42 of the work 40 to be inspected and held by the holding mechanism 13 and can be observed by the observation optical system (imaging camera 24) (see FIG. 1). For this reason, the transmission illumination mechanism 14 (the transmission light source 51, the light guide unit 52, and the emission unit 53) cooperates with the lower end surface 35b of the transmission stage 35 as a scattering surface, and observes from the side opposite to the observation optical system. Properly scattered transmitted light that irradiates the surface Fp (inspection object (semiconductor element 44)) is generated. In this embodiment, the transmission optical axis Pa is set parallel to the Z-axis direction, and the position of the transmission illumination mechanism 14 with respect to the observation optical system is set so that the transmission optical axis Pa and the observation optical axis Oa coincide with each other. ing. In addition, the transmission illumination mechanism 14 has an observation region that can be observed by the observation optical system (the imaging camera 24) in the irradiation region of the transmitted light viewed on the observation surface Fp by the optical element 53b configured by the rod integrator optical member. It is set so that it can be satisfied.

  In this inspection apparatus 10, the observation mechanism 11, the reflection illumination mechanism 12, the holding mechanism 13 and the transmission illumination mechanism 14 configured as described above are controlled in an integrated manner under the control of the control mechanism 15 (see FIG. 2). . As illustrated in FIG. 2, the control mechanism 15 includes an image control unit 61, an illumination control unit 62, a drive control unit 63, and a holding control unit 64.

  The image control unit 61 appropriately analyzes the image data acquired by the imaging camera 24. This analysis refers to recognizing the contour lines of a plurality of inspection objects (semiconductor elements 44) affixed to the tape 42, determining the focus state at the observation point, and recognizing defects in each inspection object. For example, recognizing defects of electrodes, wirings, etc. provided on each inspection object, recognizing defective cutting of each inspection object (semiconductor element 44) from the wafer 41, and the like. In addition, the image control unit 61 causes the monitor 39 to display a video based on the image data acquired by the imaging camera 24.

  The illumination control unit 62 appropriately turns on / off the coaxial light source 28, the ring light source 32, and the transmission light source 51. That is, the illumination control unit 62 selectively turns on and off the halogen lamps (28a, 32a, 51a) or the strobes (28b, 32b, 51b) appropriately in the coaxial light source 28, the ring light source 32, and the transmissive light source 51. At the same time, the coaxial light source 28, the ring light source 32, and the transmissive light source 51 are turned on and off simultaneously or individually. The halogen lamps (28a, 32a, 51a) are used as observation illumination, and the strobes (28b, 32b, 51b) are used as inspection illumination. In addition, the illumination control unit 62 can adjust the brightness of the strobes (28b, 32b, 51b) as the inspection illumination in each light source (28, 32, 51). This brightness adjustment can be realized, for example, by appropriately selecting one of a plurality of ND filters.

  The drive control unit 63 appropriately drives and controls the XY drive mechanism 65, the rotation drive mechanism 66, and the Z-axis drive mechanism 67. That is, the drive control unit 63 can appropriately move the observation optical system and the coaxial incident illumination mechanism 29 in the observation mechanism 11 in the observation optical axis Oa direction (Z-axis direction) by driving and controlling the Z-axis drive mechanism 67. In addition, the oblique illumination mechanism 33 can be appropriately moved in the observation optical axis Oa direction (Z-axis direction). Thereby, it becomes possible to appropriately observe the inspection object (each semiconductor element 44) of the inspection object workpiece 40 held by suction by the holding mechanism 13 under appropriate illumination. Further, the drive control unit 63 controls the XY drive mechanism 65 and the rotation drive mechanism 66 to control the holding stage 34, that is, the workpiece 40 to be inspected and held on the observation optical axis Oa (observation optical system) and The transmission optical axis Pa (transmission illumination mechanism 14) can be appropriately moved on an XY plane orthogonal to the transmission optical axis Pa (transmission illumination mechanism 14) and appropriately around the observation optical axis Oa (transmission optical axis Pa (Z-axis direction)). Can be rotated. As a result, it is possible to inspect an inspection object (semiconductor element 44) at an arbitrary position on the inspection target work 40 held by suction on the holding stage 34.

  The holding control unit 64 controls driving of the suction device 36 as appropriate. That is, the holding control unit 64 can switch between holding the inspection target workpiece 40 by suction and releasing it by appropriately driving and controlling the suction device 36.

  In addition to this, the control mechanism 15 can compare image data for inspection. In the inspection apparatus 10 that is comprehensively controlled under the control of the control mechanism 15, all inspection objects (semiconductor elements 44) attached to the tape 42 of the inspection object workpiece 40 are inspected as follows.

  In the inspection apparatus 10, first, the suction device 36 is driven by the holding control unit 64, so that the inspection target workpiece 40 is sucked and held by the holding mechanism 13 to perform chip scanning. In this chip scan, the drive control unit 63 scans the upper end surface 35a of the transmission stage 35 in the holding mechanism 13, that is, the portion adsorbed to the upper end surface 35a of the workpiece 40 (tape 42) to be inspected, over the entire surface. The holding stage 34 is moved along a plane (XY plane) orthogonal to the observation optical axis Oa. In this scanning, an image is acquired by the imaging camera 24 while irradiating the transmitted light from the transmission illumination mechanism 14.

  Next, a chip map is created. This chip map indicates the position and orientation of each inspection object (semiconductor element 44) on the inspection object work 40 (tape 42). The control mechanism 15 discriminates a plurality of inspection objects (semiconductor elements 44) affixed to the tape 42 by recognizing the outline by chip scanning, and considers movement position information by the drive control unit 63. Thus, the position and orientation of each inspection object (semiconductor element 44) are acquired.

  Next, the inspection object (semiconductor element 44) is determined. In this determination, an observation position by the observation optical system is determined based on the created chip map, and the holding stage 34 is moved by the drive control unit 63 according to the determination. Thereafter, the inspection object (semiconductor element 44) at the observation position is compared with non-defective data of the inspection object, and the quality of the inspection object (semiconductor element 44) is determined. This quality determination is performed by analyzing image data from the imaging camera 24 by the image control unit 61.

By sequentially determining all the inspection objects (semiconductor elements 44) on the inspection object workpiece 40 (tape 42) based on the created chip map, the inspection object (semiconductor element 44) is determined. The inspection for the inspection target workpiece 40 is completed. This inspection can also be performed by visually observing an image based on image data acquired by the imaging camera 24 displayed on the monitor 39 under the control of the image control unit 61.
(Technical issues)
Next, a technical problem in the conventional inspection apparatus will be described with reference to FIG. FIG. 8 is an explanatory view similar to FIG. 4 showing a holding mechanism 91 in an inspection apparatus 90 having another configuration for comparison. The inspection device 90 is not shown because the other configuration is the same as that of the inspection device 10 except for the configuration of the holding mechanism 91, and the same names and the same names as those of the inspection device 10 are used for other configurations that are not shown. This will be described using reference numerals. In FIG. 8, for the sake of easy understanding, the air reservoir Ap is shown in an emphasized manner, but it does not necessarily coincide with the actually formed air reservoir Ap.

  In the inspection apparatus similar to the inspection apparatus 10, in order to appropriately observe the inspection object with the observation optical system (observation mechanism 11), it is necessary to appropriately arrange the inspection object at the in-focus position. Here, when the inspection target object is inspected while maintaining the state of the inspection target workpiece 40 using each semiconductor element 44 attached to the tape 42 as described above as the inspection target object, the inspection target object is included. Since the tape bends due to its own weight, it is difficult for the tape to be present on the observation surface Fp while being in a state along the observation surface Fp that is the in-focus position of the observation optical system (observation mechanism 11). It is difficult to properly arrange the inspection object on the Fp.

  For this reason, in order to hold the tape 42 of the workpiece 40 to be inspected in a flat state, a mounting table having a flat mounting surface (not shown) is used, and a plurality of suction holes are provided on the mounting surface. It is conceivable to adopt a configuration in which the tape 42 is adsorbed and held on the mounting surface. However, the mounting table is formed of at least a transparent member (transmission member) that allows transmission of the transmitted light emitted from the transmission illumination mechanism 14, and an inspection object (each semiconductor element 44) by the transmission light from the transmission illumination mechanism 14. ) Irradiation is necessary. For this reason, it is difficult to have a configuration in which a plurality of suction holes are provided on the mounting surface of the mounting table.

  For this reason, in the inspection apparatus 90, it is conceivable to use a holding mechanism 91 as shown in FIG. The holding mechanism 91 is configured to hold a transmission stage 92 formed of a transparent member (transmission member) allowing transmission of transmitted light emitted from at least the transmission illumination mechanism 14 with a holding stage 93 having a cylindrical shape as a whole. It is said that. The transmission stage 92 has a flat upper end surface 92a on the upper side (observation mechanism 11 side), and constitutes a mounting surface. In the holding stage 93, the upper end surface 93 a on the upper side (the observation mechanism 11 side) forms the same plane as the upper end surface 92 a of the transmission stage 92. The holding stage 93 is provided with a plurality of suction holes 94 (only two are shown in FIG. 8). Each suction hole 94 has one end opening the upper end surface 93 a and the other end opening the lower end surface 93 b of the holding stage 93. A suction device 95 capable of sucking air (evacuating) is connected to the other end of each suction hole 94. In the holding mechanism 91, the air in each suction hole 94 is sucked by the suction device 95 in a state where the tape 42 of the workpiece 40 to be inspected is placed on the upper end surface 92 a of the transmission stage 92 and the upper end surface 93 a of the holding stage 93. By doing (evacuating), the tape 42 can be adsorbed and held on the upper end surface 92a and the upper end surface 93a.

However, in the holding mechanism 91 having such a configuration, it is difficult to make the tape 42 flat on the upper end surface 92a of the transmission stage 92, that is, to stick the tape 42 while keeping it evenly along the upper end surface 92a. is there. This is because, when sucked from the suction holes 94 of the holding stage 93, a plurality of air pockets Ap are generated between the tape 42 and the upper end surface 92 a of the transmission stage 92. Each air pocket Ap is considered to be caused by the tape 42 adsorbing to the upper end surface 92a from a location close to each suction hole 94. For this reason, in the inspection apparatus 90 using the holding mechanism 91, the tape 42 cannot be made flat by the respective air reservoirs Ap, so that the inspection apparatus 90 on the observation surface Fp serving as a focusing position of the observation optical system (observation mechanism 11). It is difficult to properly arrange inspection objects (each semiconductor element 44), and accurate inspection cannot be performed.
(Operation in the holding mechanism 13)
Next, the effect | action in the holding mechanism 13 of the inspection apparatus 10 is demonstrated using FIG. 9 and FIG. FIG. 9 is an explanatory view similar to FIG. 4 showing the process of attracting and holding the workpiece 40 to be inspected by the holding mechanism 13, and (a) shows a state in which the workpiece 40 to be inspected is placed on the holding mechanism 13. (B) shows a state after the suction is started, and (c) shows a state in which the suction is continued after (b). FIG. 10 is an explanatory view similar to FIG. 4 showing a state in which the held inspection target workpiece 40 is sucked and held in the holding mechanism 13. In FIGS. 9 and 10, the bending state of the tape 42 in the workpiece 40 to be inspected is emphasized for easy understanding, but this does not necessarily match the actual bending state of the tape 42.

  In the holding mechanism 13 of the inspection apparatus 10, as shown in FIG. 9A, each semiconductor element 44 is used as an inspection object, and the inspection target workpiece 40 is maintained on the protruding end surface 34 i of the holding stage 34 while maintaining the state of the inspection target workpiece 40. The tape 42 at the inward position is placed together with a part of the annular member 43 of the work 40. Then, in the work 40 to be inspected, the weight of each semiconductor element 44 (inspection object) pasted on the tape 42 without a large deviation due to the peripheral edge of the tape 42 being supported from below. Due to its own weight, it bends and deforms so that the center position falls. Here, in the holding mechanism 13, an inward recess 34 l is formed, that is, the upper end surface 35 a of the transmission stage 35 and the annular bottom surface 34 f of the holding stage 34 are observed light with respect to the protruding end surface 34 i of the holding stage 34. Since the same flat surface is formed on the lower side of the axis Oa direction (vertical direction), it is possible to bend and deform so that the central position of the tape 42 falls. The inward recess 34l allows the holding mechanism 13 to bend and deform so that the center position of the tape 42 of the workpiece 40 to be inspected placed on the protruding end surface 34i of the holding stage 34 as a placement surface falls. It has a function.

  Thereafter, in the holding mechanism 13, under the control of the holding control unit 64 (see FIG. 2), the suction device 36 is driven and air is sucked (evacuated) from each suction hole 38. At this time, in the holding mechanism 13, the holding stage 34 seals and holds the transmission stage 35, and the tape 42 is placed on the projecting end surface 34 i of the holding stage 34 that is flattened. The air tightness of the space defined by the location 34l and the tape 42 is ensured. Therefore, the space defined by the inward recess 34l and the tape 42, that is, the upper end surface 35a of the transmission stage 35, the annular bottom surface 34f of the holding stage 34, the annular convex portion 34h of the holding stage 34, and the protruding end surface of the holding stage 34 The pressure in the space defined by the tape 42 placed on 34i decreases. Then, the tape 42 sticks to the upper end surface 35a of the transmission stage 35 from the vicinity of the center due to the pressure difference between the space and the surrounding atmosphere (see FIG. 9B), and the region that sticks to the upper end surface 35a of the tape 42. Spreads radially (see FIG. 9C). This can be considered as follows.

  When a pressure difference is generated between the space and the surrounding atmosphere, a pressing force directed from the outside to the inside acts on the member defining the space. As a result, the most flexible tape 42 of the members defining the space is deformed. Here, when the same force acts evenly on the entire surface from the surrounding atmosphere toward the space, the tape 42 is held around the entire circumference by the annular member 43, so that the central portion is displaced the most. Then, it reaches the upper end surface 35 a of the transmission stage 35. Thereafter, when the pressure in the space further decreases, the periphery of the portion of the tape 42 that has reached the upper end surface 35a reaches the upper end surface 35a. For this reason, the tape 42 sticks to the upper end surface 35a of the transmission stage 35 in the order from the center to the annular member 43 (projecting end surface 34i) in the radial direction (see FIGS. 9B to 9C). Then, in the holding mechanism 13, as shown in FIG. 10, the tape 42 sticks from the upper end surface 35 a of the transmission stage 35 to the annular bottom surface 34 f of the holding stage 34 that forms the same flat surface there. . At this time, since the tape 42 sticks to the upper end surface 35a and the annular bottom surface 34f in the radial direction from the vicinity of the center toward the annular member 43 (projecting end surface 34i), the air between the upper end surface 35a and the annular bottom surface 34f is removed. Since it can be pushed out radially outward, that is, to each suction hole 38 side, an air pocket can be prevented from being formed between the upper end surface 35a and the annular bottom surface 34f (from FIG. 9 (b) to (c )reference). Therefore, in the holding mechanism 13, the tape 42 is attached to the upper end surface 35 a of the transmission stage 35 and the annular bottom surface 34 f of the holding stage 34 by sucking the air in the space defined by the inward recess 34 l and the tape 42. Thus, each semiconductor element 44 (inspection object) affixed to the tape 42 can be appropriately arranged on the observation surface Fp.

  The step of the inward recess 34l viewed in the direction of the observation optical axis Oa, that is, the observation optical axis Oa between the protruding end surface 34i of the holding stage 34 and the upper end surface 35a of the transmission stage 35 (the annular bottom surface 34f of the holding stage 34). The difference between the setting positions viewed in the direction is set in consideration of the following two points.

  The first point is that the center position of the tape (42) is in contact with the upper end surface 35a due to bending deformation due to its own weight in a state where the tape (42) of the work to be inspected (40) is placed on the protruding end surface 34i. From the viewpoint of making it possible to push the air between the upper end surface 35a and the outside in the radial direction (each suction hole 38 side), the number of contact points with the upper end surface 35a is reduced. Here, the bending deformation due to its own weight refers to bending deformation due to the weight of the tape (42) and the inspection object (each semiconductor element 44 in this embodiment) attached thereto. This point mainly affects the lower limit value of the step (difference between the set positions) of the inward recess 34l.

  The second point is that at least the center position of the upper end surface 35a is caused by the bending deformation due to air suction by the suction device 36 in a state where the tape (42) of the work to be inspected (40) is placed on the protruding end surface 34i. The tape (42) can be flattened and contacted over a predetermined area. The predetermined area from the center position on the tape (42) refers to an area where an inspection object (each semiconductor element 44 in this embodiment) is affixed. This point mainly affects the upper limit value of the step (difference in the set position) of the inward recess 34l.

  The amount and state of the bending deformation in the tape (42) and the deformable amount are the material of the tape 42, the holding position of the tape 42 by the annular member 43 (the position placed on the protruding end surface 34i of the tape 42). ), Which differs depending on the position and number of the semiconductor elements 44 attached to the tape 42, and therefore differs depending on the type of the workpiece 40 to be inspected. For this reason, it is necessary to appropriately set the difference between the set positions in accordance with the work to be inspected (40) (tape (42)). In the present embodiment, as described above, the difference between the set positions is 2.5 mm. Note that the difference may be other than 2.5 mm and can be set as appropriate.

  As described above, in the inspection apparatus 10 according to the present invention, the tape 42 of the workpiece 40 to be inspected is placed on the annular convex portion 34 h (its projecting end surface 34 i) of the holding stage 34 that surrounds and holds the transmission stage 35 in the holding mechanism 13. At the same time, the suction device 36 sucks air from the suction holes 38 formed in the holding stage 34, whereby the inner recess 34l and the tape 42 on the inner side of the annular convex portion 34h (large inner diameter portion 34c) The tape 42 is pushed out while extruding air between the tape 42 and the upper end surface 35a of the transmission stage 35 from the central position of the tape 42 toward the outside in the radial direction using the pressing force due to the decrease in the pressure of the space defined by Can be adsorbed to the upper end surface 35a. For this reason, it is possible to prevent the formation of air pockets and to flatten the tape 42 so as to stick to the upper end surface 35a. Therefore, the inspection object attached to the tape 42 (in this embodiment, each semiconductor The element 44) can be appropriately arranged on the observation plane Fp, the inspection object can be appropriately observed by the observation optical system, and the information can be obtained accurately.

  Further, in the inspection apparatus 10, the holding mechanism 13 has an inward recess 34 l formed inside the annular convex portion 34 h (large inner diameter portion 34 c) of the holding stage 34 that surrounds and holds the transmission stage 35. The tape 42 of the workpiece 40 to be inspected is placed on the projecting end surface 34i of the annular projection 34h of the holding stage 34, and the air in the inward recess 34l is sucked by the suction device 36, so that the center position of the tape 42 is adjusted. Since it is allowed to bend and deform so as to fall, the tape 42 can be adsorbed to the upper end surface 35a from the central position toward the outside in the radial direction.

  Further, in the inspection apparatus 10, the holding mechanism 13 has an inward recess 34 l formed inward of the annular convex portion 34 h (large inner diameter portion 34 c), so that the holding stage 34 that surrounds and holds the transmission stage 35. When the tape 42 of the workpiece 40 to be inspected is placed on the projecting end surface 34i of the annular convex portion 34h, it can be bent and deformed so that the center position of the tape 42 falls due to its own weight. The suction to the upper end surface 35a from the center position of the tape 42 can be made more reliable.

  In the inspection apparatus 10, the holding mechanism 13 sucks air in the inward recesses 34 l from the suction holes 38 formed in the holding stage 34 that surrounds and holds the transmission stage 35. Even if the upper surface 35a is adsorbed, the pressure in the annular space surrounding the adsorbed portion can be reduced uniformly, so that the upper surface 35a is more adsorbed toward the outer side in the radial direction from the central position of the tape 42. It can be certain.

  In the inspection apparatus 10, since each suction hole 38 of the holding mechanism 13 is formed in the holding stage 34 that surrounds and holds the transmission stage 35, the tape 42 extends from the center position toward the outer side in the radial direction. Since the pressure in the annular space described above can be reduced uniformly until the suction location reaches the holding stage 34 (the position where each suction hole 38 is provided) To the outside in the radial direction, the tape 42 can be adsorbed evenly to the position where each suction hole 38 of the holding stage 34 is provided, and the tape 42 is spread over the entire area of the upper end surface 35a of the transmission stage 35. Adsorption can be ensured.

  In the inspection apparatus 10, each suction hole 38 of the holding mechanism 13 has a peripheral surface hole portion 38 a having one end opening the inner peripheral surface 34 j of the large inner diameter portion 34 c, and therefore, outward from the center position in the radial direction. Even if the tape 42 is adsorbed to the upper end surface 35a, it is possible to prevent the peripheral hole 38a from being blocked by the tape 42, so that a wider area in the tape 42 can be separated from the upper end surface 35a of the transmission stage 35 and It can be adsorbed to the annular bottom surface 34f of the holding stage 34 that forms the same flat surface. This is because the amount of bending deformation of the tape 42 is limited.

  In the inspection apparatus 10, each suction hole 38 of the holding mechanism 13 has a peripheral surface hole portion 38a having one end opening the inner peripheral surface 34j of the large inner diameter portion 34c, and a bottom surface hole portion 38b having one end opening the annular bottom surface 34f. Therefore, the air in the space defined by the inner recess 34l and the tape 42 inside the annular convex portion 34h (large inner diameter portion 34c) can be efficiently sucked.

  In the inspection apparatus 10, each suction hole 38 of the holding mechanism 13 is provided with a bottom hole 38 b whose one end opens the annular bottom 34 f, so that the holding stage 34 that surrounds and holds the transmission stage 35 has an inward recess. The suction holes 38 for sucking the air at the location 34l can be easily formed.

  In the inspection apparatus 10, the holding stage 34 of the holding mechanism 13 has an annular bottom surface 34 f that forms the same flat surface as the upper end surface 35 a of the transmission stage 35. The tape 42 can be adsorbed over the entire region, and the inspection object (in this embodiment, each semiconductor element 44 in the entire region of the transmission stage 35 as viewed in the direction orthogonal to the observation optical axis Oa (transmission optical axis Pa). ) Can be properly inspected. This is because the annular bottom surface 34f is provided, so that the projecting end surface 34i of the annular convex portion 34h of the holding stage 34 on which the tape 42 of the workpiece 40 to be inspected is placed and the outermost end surface 35a of the transmission stage 35 are arranged. Since the position of the tape 42 can be set at a distance from the observation optical axis Oa in a direction perpendicular to the observation optical axis Oa, even the tape 42 having a limit in the amount of deformation is attracted to the upper end surface 35a up to the outermost position. It is possible to make it possible.

  In the inspection apparatus 10, the tape 42 is placed on the projecting end surface 34 i of the annular convex portion 34 h of the holding stage 34 of the holding mechanism 13, whereby an inward recess 34 l on the inner side of the annular convex portion 34 h (large inner diameter portion 34 c). Since the air tightness of the space defined by the tape 42 and the tape 42 is ensured, the configuration can be simplified and the inspection work can be simplified.

  In the inspection apparatus 10, since the holding stage 34 seals and holds the transmission stage 35 in the holding mechanism 13, the inside of the annular convex portion 34 h (large inner diameter portion 34 c) has a simple configuration. The airtightness of the space defined by the recess 34l and the tape 42 can be ensured.

  In the inspection apparatus 10, since the lower end surface 35b of the transmission stage 35 provided with the upper end surface 35a is a scattering surface, the inspection object attached to the transparent tape 42 (in this embodiment, each semiconductor element 44). ), Noise components on the image data of the tape 42 can be removed, so that more appropriate inspection can be performed.

  Therefore, in the inspection apparatus 10 according to the present invention, accurate information can be obtained by the observation optical system while illuminating the inspection object (each semiconductor element 44) attached to the tape 42 with transmitted illumination.

  In the above-described embodiments, an example of the inspection apparatus according to the present invention has been described. However, the observation optical system having a predetermined position on the observation optical axis as the observation surface, and the observation surface from the observation optical system side are illuminated. A reflective illumination mechanism that performs illumination, a transmission illumination mechanism that illuminates the observation surface from the opposite side of the observation optical system, and a holding that forms a flat surface along the observation surface between the transmission illumination mechanism and the observation optical system And a holding member that surrounds and holds the transmissive member, the transmissive member allowing transmission of illumination light from the transmissive illumination mechanism and forming at least a part of the flat surface. A holding member, and the holding member is defined by an annular protrusion that surrounds the flat surface while protruding to the observation optical system side from the flat surface, and the annular protrusion and the flat surface. Suction that communicates the inner recess with the outside Has a hole, and the suction hole may be any inspection device suction device for sucking air of the inner recess is connected, is not limited to the aforementioned embodiments.

  In the above-described embodiment, each suction hole 38 is configured to have the peripheral hole 38a and the bottom hole 38b. However, the suction device 36 causes the inner side of the annular convex portion 34h (large inner diameter portion 34c). As long as it is provided in the holding stage 34 so as to be able to suck air in the space defined by the inward recess 34l and the tape 42, it has only the peripheral hole 38a. However, it may be a configuration having only the bottom hole 38b or another configuration, and is not limited to the above-described embodiment.

  Further, in the above-described embodiment, the suction holes 38 are provided at four positions in the orthogonal direction with the observation optical axis Oa as the center. However, by holding the air in the inner recess 34l, the annular shape of the holding stage 34 is obtained. As long as the tape 42 placed on the protruding end surface 34i of the convex portion 34h can be adsorbed to the upper end surface 35a from the central position toward the outer side in the radial direction, the number and the arrangement position can be appropriately set. Well, it is not limited to the embodiments described above.

  In the above-described embodiment, the holding stage 34 of the holding mechanism 13 has the annular bottom surface 34 f that forms the same flat surface as the upper end surface 35 a of the transmission stage 35, but surrounds and holds the transmission stage 35. At the same time, if it has an annular convex portion 34 h (large inner diameter portion 34 c) surrounding the flat surface (upper end surface 35 a) while projecting toward the observation optical system side from the upper end surface 35 a which is a flat surface of the transmission stage 35. Well, it is not limited to the embodiments described above.

  In the above-described embodiment, a part of the annular member 43 and the tape 42 at the inner position thereof are placed on the protruding end surface 34 i of the annular convex portion 34 h of the holding stage 34. If it is possible to ensure the airtightness of the space defined by the inner recess 34l inside the portion 34h (large inner diameter portion 34c) and the tape 42, the entire annular member 43 is projected to the end surface 34i. The tape may be placed on the protruding end face 34i, and is not limited to the above-described embodiment.

  In the above-described embodiment, the annular sealing member 37 is provided between the lower end surface 35 b of the transmission stage 35 and the annular engagement surface 34 g (its recess), but between the transmission stage 35 and the holding stage 34. Any material can be used as long as it can prevent air from entering and exiting, and is not limited to the above-described embodiment.

  As described above, the inspection apparatus of the present invention has been described based on the embodiment. However, the specific configuration is not limited to this embodiment, and design changes, additions, and the like can be made without departing from the gist of the present invention. Permissible.

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 11 Observation mechanism (As observation optical system) 12 Reflection illumination mechanism 13 Holding mechanism 14 Transmission illumination mechanism 24 Imaging camera (As observation optical system) Holding stage 34 (As holding member) Annular bottom face 34h Annular convex part 34i Projection end surface 34j Inner peripheral surface 34l Inward recess 35 Transmission stage 35a (as a transmission member) Upper end surface 36a (as a flat surface) 36 Suction device 38 Suction hole 42 Tape 44 Semiconductor element Fp observation (as inspection object) Surface Oa Observation optical axis

Claims (5)

An observation optical system having a predetermined position on the observation optical axis as an observation surface, a reflection illumination mechanism for illuminating the observation surface from the observation optical system side, and illuminating the observation surface from a side opposite to the observation optical system An inspection apparatus comprising: a transmission illumination mechanism; and a holding mechanism that forms a flat surface along the observation surface between the transmission illumination mechanism and the observation optical system,
The holding mechanism has a transmission member that allows transmission of illumination light from the transmission illumination mechanism and forms at least a part of the flat surface, and a holding member that surrounds and holds the transmission member,
The holding member communicates to the outside an annular protrusion that surrounds the flat surface while projecting to the observation optical system side from the flat surface, and an inward recess defined by the annular protrusion and the flat surface. A suction hole for allowing
An inspection device, wherein a suction device for sucking air in the inward recess is connected to the suction hole.   The inspection apparatus according to claim 1, wherein the suction hole opens an inner peripheral surface facing the inner recess in the annular protrusion and communicates with the inner recess.   The inspection apparatus according to claim 1, wherein the holding member has an annular bottom surface that forms the other part of the flat surface outside the transmission member.   The inspection apparatus according to claim 3, wherein the suction hole opens the annular bottom surface and communicates with the inward recess.   In the holding mechanism, the amount of protrusion of the annular protrusion relative to the flat surface is such that the tape is bent and deformed by its own weight when a tape to which an inspection object is attached is disposed on the protrusion end surface of the annular protrusion. It is possible to prevent the tape from coming into contact with the flat surface, and the tape comes into contact with the tape over a predetermined area from the center position of the flat surface as the tape is bent and deformed by the suction of air by the suction device. The inspection apparatus according to any one of claims 1 to 4, wherein the inspection apparatus is set so as to be possible.