KR20120013322A - 전도성 라인, 나노입자, 잉크 및 패터닝 - Google Patents
전도성 라인, 나노입자, 잉크 및 패터닝 Download PDFInfo
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- KR20120013322A KR20120013322A KR1020117024088A KR20117024088A KR20120013322A KR 20120013322 A KR20120013322 A KR 20120013322A KR 1020117024088 A KR1020117024088 A KR 1020117024088A KR 20117024088 A KR20117024088 A KR 20117024088A KR 20120013322 A KR20120013322 A KR 20120013322A
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Classifications
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16925409P | 2009-04-14 | 2009-04-14 | |
| US61/169,254 | 2009-04-14 | ||
| PCT/US2010/030928 WO2010120809A1 (en) | 2009-04-14 | 2010-04-13 | Conducting lines, nanoparticles, inks, and patterning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120013322A true KR20120013322A (ko) | 2012-02-14 |
Family
ID=42289105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117024088A Withdrawn KR20120013322A (ko) | 2009-04-14 | 2010-04-13 | 전도성 라인, 나노입자, 잉크 및 패터닝 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100288543A1 (https=) |
| EP (1) | EP2419793A1 (https=) |
| JP (1) | JP2012524411A (https=) |
| KR (1) | KR20120013322A (https=) |
| AU (1) | AU2010236563A1 (https=) |
| CA (1) | CA2754701A1 (https=) |
| WO (1) | WO2010120809A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250091048A (ko) * | 2023-12-13 | 2025-06-20 | 국립금오공과대학교 산학협력단 | 전극 패턴의 형성방법 및 이를 포함하는 전극 |
| KR20250097660A (ko) * | 2023-12-20 | 2025-06-30 | 주식회사 에이아이시티 | 전도성 소재를 활용한 결함부위 감지 및 모니터링 시스템 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8643389B2 (en) * | 2011-01-06 | 2014-02-04 | General Electric Company | Corrosion sensor and method for manufacturing a corrosion sensor |
| US8359728B2 (en) | 2011-01-06 | 2013-01-29 | General Electric Company | Method for manufacturing a corrosion sensor |
| US9297742B2 (en) | 2011-01-06 | 2016-03-29 | General Electric Company | Method for manufacturing a corrosion sensor |
| WO2012158842A1 (en) * | 2011-05-18 | 2012-11-22 | Nuventix, Inc. | Power delivery to diaphragms |
| CN103011185B (zh) * | 2011-09-20 | 2014-12-10 | 中国科学院化学研究所 | 具有纳米结构的云母薄片的制备方法 |
| CN104356741B (zh) * | 2014-11-05 | 2016-08-24 | 广西师范学院 | 将水溶性平面共轭酞菁卟啉二联体作为微接触印刷墨水进行微印刷的方法 |
| US9969001B2 (en) * | 2014-12-10 | 2018-05-15 | Washington State University | Three-dimensional passive components |
| KR102713216B1 (ko) | 2015-06-25 | 2024-10-02 | 로스웰 엠이 아이엔씨. | 바이오분자 센서들 및 방법들 |
| CN113985017A (zh) | 2016-01-14 | 2022-01-28 | 罗斯韦尔生物技术股份有限公司 | 分子传感器及相关方法 |
| KR102763291B1 (ko) | 2016-01-28 | 2025-02-04 | 로스웰 엠이 아이엔씨. | 대량 병렬 dna 시퀀싱 장치 |
| CN109071212A (zh) | 2016-01-28 | 2018-12-21 | 罗斯韦尔生物技术股份有限公司 | 使用大规模分子电子传感器阵列测量分析物的方法和装置 |
| CA3053103A1 (en) * | 2016-02-09 | 2017-08-17 | Roswell Biotechnologies, Inc. | Electronic label-free dna and genome sequencing |
| US10597767B2 (en) | 2016-02-22 | 2020-03-24 | Roswell Biotechnologies, Inc. | Nanoparticle fabrication |
| US9829456B1 (en) | 2016-07-26 | 2017-11-28 | Roswell Biotechnologies, Inc. | Method of making a multi-electrode structure usable in molecular sensing devices |
| CN110431148A (zh) | 2017-01-10 | 2019-11-08 | 罗斯威尔生命技术公司 | 用于dna数据存储的方法和系统 |
| CA3052140A1 (en) | 2017-01-19 | 2018-07-26 | Roswell Biotechnologies, Inc. | Solid state sequencing devices comprising two dimensional layer materials |
| US10508296B2 (en) | 2017-04-25 | 2019-12-17 | Roswell Biotechnologies, Inc. | Enzymatic circuits for molecular sensors |
| EP3615685B1 (en) | 2017-04-25 | 2025-02-19 | Roswell Biotechnologies, Inc | Enzymatic circuits for molecular sensors |
| EP3622086A4 (en) | 2017-05-09 | 2021-04-21 | Roswell Biotechnologies, Inc | BINDING PROBE CIRCUITS FOR MOLECULAR SENSORS |
| WO2018223120A1 (en) * | 2017-06-02 | 2018-12-06 | TERA-print, LLC | Fabrication of micro/nanoscale barcodes using cantilever-free scanning probe lithography |
| CN111373049A (zh) | 2017-08-30 | 2020-07-03 | 罗斯威尔生命技术公司 | 用于dna数据存储的进行性酶分子电子传感器 |
| EP3694990A4 (en) | 2017-10-10 | 2022-06-15 | Roswell Biotechnologies, Inc. | METHODS, DEVICE AND SYSTEMS FOR AMPLIFICATION-FREE DNA DATA STORAGE |
| EP3953491B8 (en) | 2019-04-12 | 2025-09-10 | Roswell Biotechnologies Inc. | Polycyclic aromatic bridges for molecular electronic sensors |
| US12146852B2 (en) | 2019-09-06 | 2024-11-19 | Roswell Biotechnologies, Inc. | Methods of fabricating nanoscale structures usable in molecular sensors and other devices |
| CN111182726A (zh) * | 2020-01-10 | 2020-05-19 | 江苏大学 | 一种激光直写电路板的制造方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705814A (en) * | 1995-08-30 | 1998-01-06 | Digital Instruments, Inc. | Scanning probe microscope having automatic probe exchange and alignment |
| US6635311B1 (en) * | 1999-01-07 | 2003-10-21 | Northwestern University | Methods utilizing scanning probe microscope tips and products therefor or products thereby |
| US20020122873A1 (en) * | 2000-01-05 | 2002-09-05 | Mirkin Chad A. | Nanolithography methods and products therefor and produced thereby |
| US6827979B2 (en) * | 1999-01-07 | 2004-12-07 | Northwestern University | Methods utilizing scanning probe microscope tips and products therefor or produced thereby |
| US7291284B2 (en) * | 2000-05-26 | 2007-11-06 | Northwestern University | Fabrication of sub-50 nm solid-state nanostructures based on nanolithography |
| US6596346B2 (en) * | 2000-09-29 | 2003-07-22 | International Business Machines Corporation | Silicone elastomer stamp with hydrophilic surfaces and method of making same |
| WO2002071412A1 (en) * | 2001-03-02 | 2002-09-12 | Northwestern University | Enhanced scanning probe microscope |
| US6737646B2 (en) * | 2001-06-04 | 2004-05-18 | Northwestern University | Enhanced scanning probe microscope and nanolithographic methods using the same |
| US6642129B2 (en) * | 2001-07-26 | 2003-11-04 | The Board Of Trustees Of The University Of Illinois | Parallel, individually addressable probes for nanolithography |
| JP4570363B2 (ja) * | 2001-10-02 | 2010-10-27 | ノースウエスタン ユニヴァーシティ | タンパク質およびペプチドのナノアレイ |
| US7361310B1 (en) * | 2001-11-30 | 2008-04-22 | Northwestern University | Direct write nanolithographic deposition of nucleic acids from nanoscopic tips |
| AU2002364001B2 (en) * | 2001-12-17 | 2008-09-11 | Northwestern University | Patterning of solid state features by direct write nanolithographic printing |
| US7279046B2 (en) * | 2002-03-27 | 2007-10-09 | Nanoink, Inc. | Method and apparatus for aligning patterns on a substrate |
| US7060977B1 (en) * | 2002-05-14 | 2006-06-13 | Nanoink, Inc. | Nanolithographic calibration methods |
| WO2004033480A2 (en) * | 2002-05-21 | 2004-04-22 | Northwestern University | Peptide and protein arrays and direct-write lithographic printing of peptides and proteins |
| US7102656B2 (en) * | 2002-05-21 | 2006-09-05 | Northwestern University | Electrostatically driven lithography |
| AU2003228259A1 (en) * | 2002-08-08 | 2004-02-25 | Nanoink, Inc. | Protosubstrates |
| US7098056B2 (en) * | 2002-08-09 | 2006-08-29 | Nanoink, Inc. | Apparatus, materials, and methods for fabrication and catalysis |
| US7005378B2 (en) * | 2002-08-26 | 2006-02-28 | Nanoink, Inc. | Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| US8071168B2 (en) * | 2002-08-26 | 2011-12-06 | Nanoink, Inc. | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| JP2006504136A (ja) * | 2002-10-21 | 2006-02-02 | ナノインク インコーポレーティッド | ナノメートル・スケール設計構造、その製造方法および装置、マスク修復、強化、および製造への適用 |
| US7491422B2 (en) * | 2002-10-21 | 2009-02-17 | Nanoink, Inc. | Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate |
| US6916511B2 (en) * | 2002-10-24 | 2005-07-12 | Hewlett-Packard Development Company, L.P. | Method of hardening a nano-imprinting stamp |
| WO2004044552A2 (en) * | 2002-11-12 | 2004-05-27 | Nanoink, Inc. | Methods and apparatus for ink delivery to nanolithographic probe systems |
| EP1855861A4 (en) * | 2003-07-18 | 2010-12-01 | Univ Northwestern | SURFACE POLYMERIZATION AND SITE SPECIFICATION BY DIRECT ENGRAVING LITHOGRAPHY |
| EP1726193A2 (en) * | 2004-02-25 | 2006-11-29 | Nanoink, Inc. | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US7541062B2 (en) * | 2004-08-18 | 2009-06-02 | The United States Of America As Represented By The Secretary Of The Navy | Thermal control of deposition in dip pen nanolithography |
| US7270694B2 (en) * | 2004-10-05 | 2007-09-18 | Xerox Corporation | Stabilized silver nanoparticles and their use |
| US20060254387A1 (en) * | 2005-05-10 | 2006-11-16 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for manufacturing them and conductive ink |
| US7569340B2 (en) * | 2005-08-31 | 2009-08-04 | Northwestern University | Nanoarrays of single virus particles, methods and instrumentation for the fabrication and use thereof |
| EP2013662B1 (en) * | 2006-04-19 | 2013-08-14 | Northwestern University | Article for parallel lithography with two-dimensional pen arrays |
| US8481161B2 (en) * | 2006-06-28 | 2013-07-09 | Samsung Electronics Co., Ltd. | Functionalized metal nanoparticle and method for formation of conductive pattern using the same |
| AU2008225175A1 (en) * | 2007-03-13 | 2008-09-18 | Nanoink, Inc. | Nanolithography with use of viewports |
| US7956102B2 (en) * | 2007-04-09 | 2011-06-07 | The Board Of Trustees Of The University Of Illinois | Sol-gel inks |
| JP5269887B2 (ja) * | 2007-05-09 | 2013-08-21 | ナノインク インコーポレーティッド | 小型ナノファブリケーション装置 |
| KR20100047843A (ko) * | 2007-06-20 | 2010-05-10 | 노쓰웨스턴유니버시티 | 보편적인 매트릭스 |
| KR100935168B1 (ko) * | 2007-09-21 | 2010-01-06 | 삼성전기주식회사 | 비수계 전도성 나노잉크 조성물 |
| US20090181172A1 (en) * | 2007-10-15 | 2009-07-16 | Nanoink, Inc. | Lithography of nanoparticle based inks |
| EP2138896B1 (en) * | 2008-06-25 | 2014-08-13 | Obducat AB | Nano imprinting method and apparatus |
-
2010
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- 2010-04-13 CA CA2754701A patent/CA2754701A1/en not_active Abandoned
- 2010-04-13 JP JP2012506138A patent/JP2012524411A/ja not_active Withdrawn
- 2010-04-13 US US12/759,572 patent/US20100288543A1/en not_active Abandoned
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- 2010-04-13 WO PCT/US2010/030928 patent/WO2010120809A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250091048A (ko) * | 2023-12-13 | 2025-06-20 | 국립금오공과대학교 산학협력단 | 전극 패턴의 형성방법 및 이를 포함하는 전극 |
| KR20250097660A (ko) * | 2023-12-20 | 2025-06-30 | 주식회사 에이아이시티 | 전도성 소재를 활용한 결함부위 감지 및 모니터링 시스템 |
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| EP2419793A1 (en) | 2012-02-22 |
| WO2010120809A1 (en) | 2010-10-21 |
| US20100288543A1 (en) | 2010-11-18 |
| CA2754701A1 (en) | 2010-10-21 |
| JP2012524411A (ja) | 2012-10-11 |
| AU2010236563A1 (en) | 2011-09-22 |
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