KR20120009783A - Mold, Manufacturing Method thereof and Apparatus for Manufacturing Mold - Google Patents

Abstract

PURPOSE: A mold, and mold manufacturing method and device are provided to block the impact of bubbles on a pattern layer even if bubbles are generated between a mold member and a second resin layer. CONSTITUTION: A mold manufacturing method is as follows. A first resin layer is formed in a master mold(20), and the first resin layer is cured to form a pattern layer(11). A second resin layer(12) is formed on the pattern layer. The second resin layer makes contact with a mold member(13). The mold member, the second resin layer, and the pattern layer are laminated.

Description

Mold, Manufacturing Method, and Mold Manufacturing Apparatus {Mold, Manufacturing Method, and Apparatus for Manufacturing Mold}

The present invention relates to a mold used for forming a pattern on a substrate, a method for manufacturing the same, and a mold manufacturing apparatus.

Display devices such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), plasma display panels (PDPs), and electrophoretic displays (EPDs) are manufactured through various processes. Such a manufacturing process includes an imprinting process of forming a pattern on a substrate used in the display device.

The imprinting process may form a pattern on the substrate using a mold. The mold includes a mold member and a pattern layer. The pattern layer is formed on the mold member, and the pattern layer is formed in a shape corresponding to a pattern to be formed on the substrate. This mold is prepared as follows using a master mold.

First, a resin layer for forming the pattern layer is formed on the master mold. Next, the mold member is brought into contact with the resin layer, and the mold member and the resin layer are bonded together. One surface on which the resin layer is formed in the master mold is formed in a form corresponding to the pattern layer.

Here, bubbles may be generated between the mold member and the resin layer while the mold member and the resin layer are in contact with each other. The bubbles generated in this way may increase in size in the process of bonding the mold member and the resin layer, thereby causing a problem in the pattern layer.

In order to prevent a defect from occurring in the pattern layer as described above, a method of adhering the mold member and the resin layer to each other has been proposed. However, this approach has a problem of increasing the process cost for manufacturing the mold. In addition, since the resin layer may be vaporized in a high vacuum state, a method of adhering the mold member and the resin layer in a high vacuum atmosphere has a limit in preventing generation of bubbles. There is.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a mold, a method for manufacturing the same, and a mold manufacturing apparatus capable of preventing a defect from occurring in a pattern layer by bubbles.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

The mold according to the present invention may include a pattern layer formed using the first resin layer, a mold member on which the pattern layer is formed, and a second resin layer formed between the pattern layer and the mold member.

The mold manufacturing method according to the present invention comprises the steps of forming a first resin layer in the master mold and curing the first resin layer to form a pattern layer, forming a second resin layer on the pattern layer, the second And contacting the resin layer and the mold member, and bonding the mold member, the second resin layer, and the pattern layer.

In the mold manufacturing method according to the present invention, forming a first resin layer on the master mold and curing the first resin layer to form a pattern layer, forming a second resin layer on the mold member, the second resin layer Contacting the pattern layer on the surface, and bonding the mold member, the second resin layer, and the pattern layer to each other.

The mold manufacturing method according to the present invention comprises the steps of forming a first resin layer on the master mold, curing the first resin layer to form a pattern layer, forming a second resin layer on the mold member, the second water The method may include forming an adhesive layer on the ground layer, contacting the adhesive layer with the pattern layer, and bonding the mold member, the second resin layer, and the pattern layer together.

In the mold manufacturing apparatus according to the present invention, the first resin layer is cured pattern layer is formed and the second mold layer formed on the pattern layer, the master mold, the first stage to which the mold member is attached, the second resin layer is And a second stage in which the master mold is supported to face a mold member, and a chamber unit for bonding the mold member, the second resin layer, and the pattern layer to each other.

The mold manufacturing apparatus according to the present invention includes a master mold having a pattern layer on which a first resin layer is cured, a first stage to which the master mold is attached, a second stage to support a mold member on which a second resin layer is formed, and the mold. The chamber unit may include a process of bonding the member, the second resin layer, and the pattern layer.

According to the present invention can achieve the following effects.

The present invention is implemented in a dual structure including a pattern layer and a second resin layer, it is possible to prevent the occurrence of defects in the pattern layer by bubbles, and to reduce the process cost for forming a pattern layer having improved quality You can get the effect.

1A to 1E are schematic process cross-sectional views showing a mold manufacturing method according to a first embodiment of the present invention.
2A and 2B are schematic process cross-sectional views showing a mold manufacturing method according to a modified first embodiment of the present invention.
3A to 3E are schematic process cross-sectional views showing a mold manufacturing method according to a second embodiment of the present invention.
4A and 4B are schematic process cross-sectional views showing a mold manufacturing method according to a second modified embodiment of the present invention.
5 is a schematic side cross-sectional view of a mold according to the present invention.
6 is a schematic side cross-sectional view of a mold according to a modified embodiment of the present invention.
7 is a schematic side cross-sectional view of a mold manufacturing apparatus according to the present invention.
8 is a schematic side cross-sectional view of a mold manufacturing apparatus according to a modified embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a mold manufacturing method according to the present invention will be described in detail. The mold manufacturing method according to the present invention includes a first embodiment and a second embodiment, which will be described below in detail with reference to the accompanying drawings, preferred embodiments of the mold manufacturing method according to the first embodiment of the present invention. do.

1A to 1E are schematic process cross-sectional views illustrating a mold manufacturing method according to a first embodiment of the present invention, and FIGS. 2A and 2B illustrate a mold manufacturing method according to a modified first embodiment of the present invention. A schematic process cross section.

1A to 1D, the mold manufacturing method according to the first embodiment of the present invention is for manufacturing a mold 10 (shown in FIG. 1D) using the master mold 20, and the following configuration is as follows. It may include.

First, as shown in FIG. 1A, a first resin layer 11a is formed on the master mold 20, and the first resin layer 11a is cured to form a pattern layer 11 (shown in FIG. 1B). To form. This process is performed by applying the first resin layer 11a to the master mold 20 and irradiating the first resin layer 11a with light for curing the first resin layer 11a. Can be done. The first resin layer 11a may be formed of an ultraviolet curable resin, and may be cured by irradiating ultraviolet rays with a UV lamp that emits ultraviolet rays. By this process, the first resin layer 11a may be formed in a form corresponding to one surface 20a of the master mold 20. One surface 20a of the master mold 20 may be formed in a shape substantially coinciding with a pattern to be formed on a substrate (not shown) by using the mold 10 (shown in FIG. 1D).

Next, as shown in FIG. 1B, a second resin layer 12 is formed on the pattern layer 11. This process may be performed by applying the second resin layer 12 on the pattern layer 11. The second resin layer 12 may be formed of an ultraviolet curable resin. By this process, the pattern layer 11 is positioned between the master mold 20 and the second resin layer 12.

Next, as shown in FIG. 1C, the second resin layer 12 is brought into contact with the mold member 13. This process may be performed by moving at least one of the master mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved in a direction closer to each other. By this process, the pattern layer 11 and the second resin layer 12 are positioned between the master mold 20 and the mold member 13. In this process, at least one of the mold member 13 and the master mold 20 is raised and lowered with the mold member 13 positioned on the master mold 20 when referring to FIG. 1C. This can be done by.

Next, as shown in FIG. 1D, the mold member 13, the second resin layer 12, and the pattern layer 11 are bonded to each other. The bonding process may be performed by moving at least one of the master mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved in a direction closer to each other. When the bonding process is performed, the second resin layer 12 is positioned between the pattern layer 11 and the mold member 13. That is, the pattern layer 11 is not in direct contact with the mold member 13. In addition, the pattern layer 11 is in a hardened state before the bonding process is performed. Therefore, in the mold manufacturing method according to the first embodiment of the present invention, even if bubbles are generated between the mold member 13 and the second resin layer 12, such bubbles affect the pattern layer 11. Can be blocked. Accordingly, according to the mold manufacturing method according to the first embodiment of the present invention, it is possible to manufacture a mold 10 having improved quality without proceeding the bonding process under a high vacuum atmosphere, to manufacture the mold 10 Can reduce the process cost.

1D and 1E, the method of manufacturing a mold according to the first embodiment of the present invention includes a step of curing the second resin layer 12 and the pattern layer 11 and the master mold 20. The process may further include separating.

First, the process of curing the second resin layer 12 may be performed by irradiating the second resin layer 12 with light for curing the second resin layer 12. The second resin layer 12 may be formed of an ultraviolet curable resin, and may be cured by irradiating ultraviolet rays with a UV lamp that emits ultraviolet rays. This process may be performed in a state in which the mold member 13, the second resin layer 12, the pattern layer 11, and the master mold 20 are in contact with each other, as shown in FIG. 1D. .

Next, the process of separating the pattern layer 11 and the master mold 20 may be performed by moving at least one of the mas mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved away from each other. By this process, as shown in FIG. 1E, the mold 10 to which the mold member 13, the second resin layer 12, and the pattern layer 11 are bonded is removed from the master mold 20. Can be separated.

2A and 2B, in the mold manufacturing method according to the first modified embodiment of the present invention, the process of forming the second resin layer 12 on the pattern layer 11 is as follows. It can include a configuration.

First, the adhesive layer 14 is formed on the pattern layer 11. This process may be performed by applying the adhesive layer 14 on the pattern layer 11. The adhesive layer 14 may be formed of a material having a predetermined adhesive force so that the pattern layer 11 and the second resin layer 12 may be firmly bonded.

Next, the second resin layer 12 is formed on the adhesive layer 14. This process may be performed by applying the second resin layer 12 on the adhesive layer 14. By this process, the adhesive layer 14 is positioned between the pattern layer 11 and the second resin layer 12.

After the second resin layer 12 is formed on the adhesive layer 14, the second resin layer 12 is brought into contact with the mold member 13, the mold member 13, and the second resin. A step of bonding the resin layer 12, the adhesive layer 14, and the pattern layer 11, a step of curing the second resin layer 12, and the pattern layer 11 and the master mold ( 20) can be separated. By these processes, the mold 10 to which the mold member 13, the second resin layer 12, the adhesive layer 14, and the pattern layer 11 are bonded as shown in FIG. 2B. May be separated from the master mold 20. Thus, according to the mold manufacturing method according to the modified first embodiment of the present invention, it is possible to manufacture a mold 10 firmly bonded by the adhesive layer (14).

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a mold manufacturing method according to a second embodiment of the present invention will be described in detail.

3A to 3E are schematic cross-sectional views illustrating a mold manufacturing method according to a second embodiment of the present invention, and FIGS. 4A and 4B illustrate a mold manufacturing method according to a second modified embodiment of the present invention. A schematic process cross section.

3A to 3D, the mold manufacturing method according to the second embodiment of the present invention is for manufacturing a mold 10 (shown in FIG. 3D) using the master mold 20, and the following configuration is as follows. It may include.

First, as shown in FIG. 3A, the first resin layer 11a is formed on the master mold 20, and the first resin layer 11a is cured to show the pattern layers 11 and 3B. Form). This process is performed by applying the first resin layer 11a to the master mold 20 and irradiating the first resin layer 11a with light for curing the first resin layer 11a. Can be done. The first resin layer 11a may be formed of an ultraviolet curable resin, and may be cured by irradiating ultraviolet rays with a UV lamp that emits ultraviolet rays. By this process, the first resin layer 11a may be formed in a form corresponding to one surface 20a of the master mold 20. One surface 20a of the master mold 20 may be formed to have a shape substantially coincident with a pattern to be formed on a substrate (not shown) using the mold 10 (shown in FIG. 3D).

Next, as shown in FIG. 3B, the second resin layer 12 is formed on the mold member 13. This process may be performed by applying the second resin layer 12 to the mold member 13. The second resin layer 12 may be formed of an ultraviolet curable resin. This process may be performed by applying the second resin layer 12 to the upper surface of the mold member 13 based on FIG. 3B.

Next, as shown in FIG. 3C, the second resin layer 12 is brought into contact with the pattern layer 11. This process may be performed by moving at least one of the master mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved in a direction closer to each other. By this process, the pattern layer 11 and the second resin layer 12 are positioned between the master mold 20 and the mold member 13. In this process, at least one of the master mold 20 and the mold member 13 is raised and lowered with the master mold 20 positioned on the mold member 13 when referring to FIG. 3C. This can be done by.

Next, as shown in FIG. 3D, the mold member 13, the second resin layer 12, and the pattern layer 11 are bonded to each other. The bonding process may be performed by moving at least one of the master mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved in a direction closer to each other. When the bonding process is performed, the second resin layer 12 is positioned between the pattern layer 11 and the mold member 13. That is, the pattern layer 11 is not in direct contact with the mold member 13. In addition, the pattern layer 11 is in a hardened state before the bonding process is performed. Therefore, in the mold manufacturing method according to the second embodiment of the present invention, even if bubbles are generated between the mold member 13 and the second resin layer 12, such bubbles affect the pattern layer 11. Can be blocked. Accordingly, according to the mold manufacturing method according to the second embodiment of the present invention, it is possible to manufacture a mold 10 having an improved quality without proceeding the bonding process under a high vacuum atmosphere, to manufacture the mold 10 Can reduce the process cost.

Referring to FIGS. 3D and 3E, the mold manufacturing method according to the second embodiment of the present invention is a step of curing the second resin layer 12 and the pattern layer 11 and the master mold 20. The process may further include separating.

First, the process of curing the second resin layer 12 may be performed by irradiating the second resin layer 12 with light for curing the second resin layer 12. The second resin layer 12 may be formed of an ultraviolet curable resin, and may be cured by irradiating ultraviolet rays with a UV lamp that emits ultraviolet rays. This process may be performed in a state where the mold member 13, the second resin layer 12, the pattern layer 11, and the master mold 20 are in contact with each other, as shown in FIG. 3D. .

Next, the process of separating the pattern layer 11 and the master mold 20 may be performed by moving at least one of the mas mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved away from each other. By this process, as shown in FIG. 3E, the mold 10 to which the mold member 13, the second resin layer 12, and the pattern layer 11 are bonded is removed from the master mold 20. Can be separated.

4A and 4B, in the mold manufacturing method according to the second modified embodiment of the present invention, the process of contacting the second resin layer 12 and the pattern layer 11 is as follows. It may include.

First, an adhesive layer 14 is formed on the second resin layer 12. This process may be performed by applying the adhesive layer 14 on the second resin layer 12. The adhesive layer 14 may be formed of a material having a predetermined adhesive force so that the second resin layer 12 and the pattern layer 11 may be firmly bonded.

Next, the adhesive layer 14 and the pattern layer 11 are contacted. This process may be performed by moving at least one of the master mold 20 and the mold member 13. In this case, the master mold 20 and the mold member 13 may be moved in a direction closer to each other. By this process, the pattern layer 11, the adhesive layer 14, and the second resin layer 12 are positioned between the master mold 20 and the mold member 13.

After contacting the adhesive layer 14 and the pattern layer 12, the mold member 13, the second resin layer 12, the adhesive layer 14, and the pattern layer 11 are bonded together. The step of hardening, the step of curing the second resin layer 12, and the step of separating the pattern layer 11 and the master mold 20 may be made. By these processes, the mold 10 to which the mold member 13, the second resin layer 12, the adhesive layer 14, and the pattern layer 11 are bonded as shown in FIG. 4B. May be separated from the master mold 20. Therefore, according to the mold manufacturing method according to the modified second embodiment of the present invention, it is possible to manufacture a mold 10 firmly bonded by the adhesive layer (14).

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the mold according to the present invention will be described in detail.

5 is a schematic side cross-sectional view of a mold according to the present invention, and FIG. 6 is a schematic side cross-sectional view of a mold according to a modified embodiment of the present invention.

Referring to FIG. 5, the mold 10 according to the present invention may include a pattern layer 11, a second resin layer 12, and a mold member 13.

The pattern layer 11 may be formed using the first resin layer 11a (shown in FIG. 1A). The pattern layer 11 deforms the first resin layer 11a (shown in FIG. 1A) into a shape corresponding to the master mold 20, and the first resin layer 11a (shown in FIG. 1A). It can be formed by curing.

The second resin layer 12 is formed between the pattern layer 11 and the mold member 13. That is, the mold 10 according to the present invention has a dual structure including the second resin layer 12 and the pattern layer 11, between the mold member 13 and the second resin layer 12. Even if bubbles are generated, the bubbles may be prevented from affecting the pattern layer 11. Accordingly, the mold 10 according to the present invention may include a pattern layer 11 having improved quality without being manufactured under a high vacuum atmosphere.

The second resin layer 12 and the pattern layer 11 are formed on the mold member 13. The mold member 13 may be formed of a material through which light for curing the second resin layer 12 may be transmitted. For example, the mold member 13 may be formed of glass, plastic, or the like.

Referring to FIG. 6, the mold 10 according to the modified embodiment of the present invention may further include an adhesive layer 14. The adhesive layer 14 is formed between the pattern layer 11 and the second resin layer 12. The adhesive layer 14 may be formed of a material having a predetermined adhesive force so that the pattern layer 11 and the second resin layer 12 may be firmly bonded. Accordingly, in the mold 10 according to the modified embodiment of the present invention, the pattern layer 11 and the second resin layer 12 may be firmly bonded to each other by the adhesive layer 14. It can have improved durability.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a mold manufacturing apparatus according to the present invention will be described in detail.

Figure 7 is a schematic side cross-sectional view of a mold manufacturing apparatus according to the present invention, Figure 8 is a schematic side cross-sectional view of a mold manufacturing apparatus according to a modified embodiment of the present invention.

Referring to FIG. 7, the mold manufacturing apparatus 1 according to the present invention may manufacture the mold 10 (shown in FIG. 5) by using the master mold 20. The mold manufacturing apparatus 1 according to the present invention includes a chamber unit 2, a first stage 3, and a second stage 4.

In the chamber unit 2, a process of bonding the mold member 13, the second resin layer 12, and the pattern layer 11 to each other is performed. The master mold 20 has a pattern layer 11 on which the first resin layer 11a (shown in FIG. 1A) is cured, and the second resin layer 12 is formed on the pattern layer 11. Is formed. By using the master mold 20, the mold member 13 may be bonded to the second resin layer 12 and the pattern layer 11.

The chamber unit 2 may include a first chamber 21 and a second chamber 22. The first chamber 21 and the second chamber 22 may be moved in contact with or spaced apart from each other. When the first chamber 21 and the second chamber 22 are spaced apart from each other, the mold member 13 may be carried in or out of the chamber unit 2. When the first chamber 21 and the second chamber 22 contact each other, the mold unit 13, the second resin layer 12, and the pattern layer 11 may be disposed in the chamber unit 2. The joining process can be made. Although not shown, the chamber unit 2 may include an opening / closing mechanism, and the mold member 13 may be carried into or out of the chamber unit 2 through the opening / closing mechanism. Can be. The mold member 13 may be carried in or out of the chamber unit 2 by a transfer mechanism (not shown).

Referring to FIG. 7, the mold member 13 may be attached to the first stage 3. The first stage 3 may be installed to be located inside the chamber unit 2. As shown in FIG. 7, the first stage 3 may be installed in the chamber unit 2 to be positioned above the second stage 4.

Referring to FIG. 7, the mold member 13 may be attached to the first stage 3 by suction. To this end, the first stage 3 may be coupled to a first suction mechanism (not shown) that provides a suction force. The first suction mechanism may attach the mold member 13 to the first stage 3 by sucking the fluid through a first suction hole (not shown) formed in the first stage 3. The mold member 13 may be attached to the first stage 3 by static electricity. In this case, the first stage 3 may be an electrostatic chuck (ESC). In the state in which the mold member 13 is attached to the first stage 3, a process of aligning the positions of the mold member 13 and the master mold 20 may be performed. The process of aligning the position of the mold member 13 and the master mold 20 may be performed by moving at least one of the first stage 3 or the second stage 4.

The mold member 13 may contact the second resin layer 12 by being spaced apart from the first stage 3. In this case, the second resin layer 12 may be formed in the master mold 20 supported by the second stage 4. By removing the suction force provided by the first suction mechanism to attach the mold member 13 to the first stage 3, the mold member 13 can be spaced apart from the first stage 3. . The mold member 13 may be spaced apart from the first stage 3 by removing the electrostatic force provided by the first stage 3 to the mold member 13. The mold member 13 spaced apart from the first stage 3 may move in a direction approaching the master mold 20 supported by the second stage 4 by its own weight, and thus the second number It may be in contact with the strata 12.

Although not shown, the mold manufacturing apparatus 1 according to the present invention may further include a first lifting mechanism. The first raising and lowering mechanism may raise and lower the first stage 3, thereby raising and lowering the mold member 13 attached to the first stage 3. As the first raising and lowering mechanism raises and lowers the first stage 3, the mold member 13 may move closer to or farther from the master mold 20 located on the second stage 4. Can be. The first lifting mechanism is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a motor and a rack gear and a pinion gear, a ball screw method using a motor and a ball screw, a motor, a pulley and a belt, etc. The first stage 3 can be raised and lowered using a belt method or the like. In this case, the first stage 3 may be installed to the chamber unit 2 to be lowered.

Referring to FIG. 7, the master mold 20 may be supported by the second stage 4. The master mold 20 may be supported by the second stage 4 so that the second resin layer 12 faces the mold member 13. As shown in FIG. 7, the second stage 4 may be installed in the chamber unit 2 to be positioned below the first stage 3. The master mold 20 may be supported by the second stage 4 in a state where the pattern layer 11 and the second resin layer 12 are formed.

The master mold 20 may be attached to the second stage 4 by suction. To this end, the second stage 4 may be coupled to a second suction mechanism (not shown) that provides a suction force. A second suction hole may be formed in the second stage 4, and the second suction mechanism attaches the master mold 20 to the second stage 4 by sucking the fluid through the second suction hole. You can. The master mold 20 may be attached to the second stage 4 by static electricity. In this case, the second stage 4 may be an electrostatic chuck (ESC). In the state in which the master mold 20 is attached to the second stage 4, a process of aligning the positions of the mold member 13 and the master mold 20 may be performed. The process of aligning the position of the mold member 13 and the master mold 20 may be performed by moving at least one of the first stage 3 or the second stage 4.

Although not shown, the mold manufacturing apparatus 1 according to the present invention may further include a second lifting mechanism. The second raising and lowering mechanism may raise and lower the second stage 4, thereby raising and lowering the master mold 20 supported by the second stage 4. As the second elevating mechanism raises and lowers the second stage 4, the master mold 20 is moved closer to or farther away from the mold member 13 located on the first stage 3. Can be. The second lifting mechanism is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a motor and a rack gear and a pinion gear, a ball screw method using a motor and a ball screw, a motor, a pulley and a belt, etc. The second stage 4 can be raised and lowered using a belt method or the like. In this case, the second stage 4 may be installed in the chamber unit 2 to be lowered.

Referring to FIG. 7, the mold manufacturing apparatus 1 according to the present invention may further include a pressure regulating mechanism 5.

The pressure regulator 5 may adjust the pressure inside the chamber unit 2. The pressure regulating mechanism 5 may adjust the pressure inside the chamber unit 2 by sucking the fluid in the chamber unit 2 or injecting the fluid into the chamber unit 2. The pressure regulator 5 may be installed in the chamber unit 2.

The pressure regulating mechanism 5 may adjust the pressure inside the chamber unit 2 to a first pressure. The first pressure may be a vacuum to a pressure close to the vacuum. The pressure regulating mechanism 5 adjusts the pressure in the chamber unit 2 to the first pressure, so that the mold member 13 is brought into contact with the second resin layer 12. It is possible to reduce the generation of bubbles and the like between the 13) and the second resin layer (12). Accordingly, the mold manufacturing apparatus 1 according to the present invention can manufacture a mold 10 (shown in FIG. 5) in which a pattern layer 11 having improved quality is formed. In addition, since the mold manufacturing apparatus 1 according to the present invention can manufacture a mold 10 (shown in FIG. 5) having a dual structure including the second resin layer 12 and the pattern layer 11. In addition, even if bubbles are generated between the mold member 13 and the second resin layer 12, the bubbles may be prevented from affecting the pattern layer 11. Accordingly, the mold manufacturing apparatus 1 according to the present invention can manufacture the mold 10 (shown in FIG. 5) in which the pattern layer 11 having improved quality is formed without adjusting the first pressure to a high vacuum. .

The pressure regulating mechanism 5 may adjust the pressure inside the chamber unit 2 from the first pressure to the second pressure. The second pressure may be a pressure greater than the first pressure, and may be a pressure close to atmospheric pressure. The pressure regulating mechanism 5 adjusts the pressure in the chamber unit 2 to the second pressure, and thus, the mold member 13, the second resin layer 12, and the pattern layer due to the pressure difference. (11) can be bonded.

Referring to FIG. 8, in the mold manufacturing apparatus 1 according to the modified embodiment of the present invention, the master mold 20 having the pattern layer 11 is attached to the first stage 3, and the second mold is attached to the first stage 3. The mold member 13 on which the second resin layer 12 is formed may be supported on the stage 4.

Hereinafter, a process of manufacturing the mold 10 (shown in FIG. 5) using the mold manufacturing apparatus 1 according to the modified embodiment of the present invention will be described in detail with reference to FIGS. 1 to 8. Hereinafter, the mold member 13 having the master mold 20 having the pattern layer 11 formed thereon is attached to the first stage 3 and the second resin layer 12 having the second stage 4 formed thereon. ), But as described above, the mold member 13 is attached to the first stage 3, and the second resin layer () is attached to the second stage 4. 12) and the embodiment in which the master mold 20 on which the pattern layer 11 is formed may be supported. In addition, the embodiment in which the adhesive layer 14 is formed between the pattern layer 11 and the second resin layer 12 may be obviously derived.

First, as illustrated in FIGS. 3B and 8, the master mold 20 having the pattern layer 11 is attached to the first stage 3, and the second number is attached to the second stage 4. The mold member 13 on which the ground layer 12 is formed is supported. In this state, the pressure regulating mechanism 5 adjusts the pressure inside the chamber unit 2 to the first pressure. In addition, by moving at least one of the first stage 3 or the second stage 4, the position of the mold member 13 and the master mold 20 can be aligned.

3C and 8, the pattern layer 11 formed on the master mold 20 and the second resin layer 12 formed on the mold member 13 are brought into contact with each other. Since the master mold 20 is separated from the first stage 3 and moved by its own weight, the pattern layer 11 and the second resin layer 12 may contact each other. The master mold 20 is spaced apart from the first stage 3 to remove the suction force provided by the first suction mechanism to attach the mold member 13 to the first stage 3, The first stage 3 may be made by removing the electrostatic force provided to the mold member 13. The pattern layer 11 and the second resin layer 12 are in contact with each other so that the master mold 20 and the mold member 13 come closer to each other, so that the first stage 3 or the second stage ( At least one of 4) may be made by raising and lowering.

Next, when the pattern layer 11 and the second resin layer 12 are in contact, the pressure regulating mechanism 5 adjusts the pressure inside the chamber unit 2 from the first pressure to the second pressure. do. Accordingly, the pressure of the surface where the pattern layer 11 and the second resin layer 12 are in contact is a pressure approximately equal to the first pressure, and the outside of the master mold 20 and the mold member 13. The pressure of may be the second pressure. Accordingly, as shown in FIGS. 3D and 8, the master mold 20 and the mold member 13 may move in a direction closer to each other due to a pressure difference, and thus, the mold member 13 and the The second resin layer 12 and the pattern layer 11 may be bonded to each other.

Next, the second resin layer 12 is cured while the mold member 13, the second resin layer 12, the pattern layer 11, and the master mold 20 are in contact with each other. Irradiate light. The master mold 20 and the mold member 13 may be formed of a material through which light for curing the second resin layer 12 may be transmitted. For example, the master mold 20 and the mold member 13 may be formed of glass, plastic, or the like. The second resin layer 12 may be formed of an ultraviolet curable resin. Although not shown, the mold manufacturing apparatus 1 according to the present invention may include a luminaire for emitting light for curing the second resin layer 12, the luminaire is a UV lamp for emitting ultraviolet light. Can be used.

Next, when the second resin layer 12 is cured, the master mold 20 is separated from the second resin layer 12 as shown in FIG. 3E. This may be accomplished by lifting up and down at least one of the first stage 3 or the second stage 4. In this case, at least one of the first stage 3 or the second stage 4 may be lowered in a direction away from the master mold 20 and the mold member 13. Accordingly, the mold 10 to which the mold member 13, the second resin layer 12, and the pattern layer 11 are bonded may be separated from the master mold 20.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It will be clear to those who have knowledge.

Reference Signs List 1 mold manufacturing apparatus 2 chamber unit 3 first stage 4 second stage
5 pressure control mechanism 10 mold 11 pattern layer 11a first resin layer
DESCRIPTION OF SYMBOLS 12 Second resin layer 13 Mold member 14 Adhesive layer 20 Master mold

Claims (10)

Forming a first resin layer on the master mold and curing the first resin layer to form a pattern layer;
Forming a second resin layer on the pattern layer;
Contacting the second resin layer and a mold member; And
And bonding the mold member, the second resin layer, and the pattern layer together. The method of claim 1, wherein the forming of the second resin layer on the pattern layer comprises:
Forming an adhesive layer on the pattern layer; And
And forming the second resin layer on the pressure-sensitive adhesive layer. Forming a first resin layer on the master mold and curing the first resin layer to form a pattern layer;
Forming a second resin layer on the mold member;
Contacting the pattern layer on the second resin layer; And
And bonding the mold member, the second resin layer, and the pattern layer together. Forming a first resin layer on the master mold and curing the first resin layer to form a pattern layer;
Forming a second resin layer on the mold member;
Forming an adhesive layer on the second resin layer;
Contacting the adhesive layer with the pattern layer; And
And bonding the mold member, the second resin layer, and the pattern layer together. 5. The method according to any one of claims 1 to 4,
Curing the second resin layer; And
Mold manufacturing method further comprises the step of separating the pattern layer and the master mold. A pattern layer formed using the first resin layer;
A mold member on which the pattern layer is formed; And
And a second resin layer formed between the pattern layer and the mold member. The mold of claim 6, further comprising an adhesive layer formed between the pattern layer and the second resin layer. A master mold having a first resin layer cured thereon and a second resin layer formed on the pattern layer;
A first stage to which the mold member is attached;
A second stage on which the master mold is supported such that the second resin layer faces the mold member; And
And a chamber unit having the first stage and the second stage installed thereon, wherein the mold unit, the second resin layer, and the pattern layer are bonded to each other. A master mold having a pattern layer on which the first resin layer is cured;
A first stage to which the master mold is attached;
A second stage on which a mold member on which a second resin layer is formed is supported; And
And a chamber unit having the first stage and the second stage installed thereon, wherein the mold unit, the second resin layer, and the pattern layer are bonded to each other. The method according to claim 8 or 9,
A pressure regulating mechanism for regulating the pressure inside the chamber unit;
The pressure control mechanism is a mold manufacturing, characterized in that for adjusting the pressure in the chamber unit from the first pressure to a second pressure greater than the first pressure so that the mold member, the second resin layer, the pattern layer is bonded. Device.

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