KR20120007294A - Light emitting diode and liquid crystal display device including the same - Google Patents

Abstract

PURPOSE: A light emitting diode and a liquid crystal display apparatus including the same are provided to prevent the display quality of a liquid crystal display apparatus from falling according to brightness unevenness by controlling the generation of an arm part, in which light does not reach, between neighboring LED areas. CONSTITUTION: A heat slug(115) includes a settling part which is leaded from a surface at a predetermined depth. An LED chip(111) is loaded on the heat slug. A case(113) includes sidewalls(200a, 200b, 200c, 200d) which are projected along a side of the heat slug. The sidewall blocks light, which comes out from the LED chip to a lateral part, or reflects the light to the front. A transparent resin(119) including a fluorescent substance is filled inside the sidewall.

Description

Light emitting diode and liquid crystal display device including same

The present invention relates to a light emitting diode, and more particularly, to a light emitting diode having an improved directivity angle of light.

Recently, the use of light emitting diodes (LEDs), which combines small size, low power consumption, high reliability, and the like, is increasing. Such LEDs are used for various lighting purposes, and the use range of the electronic devices to display devices, vehicle lighting devices, etc. is gradually increasing.

In particular, LEDs artificially generate white light to replace fluorescent lamps for general lighting, and LEDs that implement white light are spotlighted as backlight units of liquid crystal displays.

1 is a cross-sectional view of a typical LED for implementing white light.

As shown, the LED chip 11 is seated on the heat dissipation slug 15 and the heat dissipation slug 15 is surrounded by a case 13 of a housing role.

The case 13 is provided with a pair of positive / cathode electrode leads 17a and 17b electrically connected to each other through the LED chip 11 and the wire 18, and are exposed to the outside of the case 13.

The pair of positive / cathode electrode leads 17a and 17b are electrically connected to current supply means (not shown) for supplying an operating current provided externally for light emission of the LED chip 11.

The case 13 is configured to have a sidewall 13a that protrudes highly upward along the side surface of the heat dissipation slug 15, and the inner surface of the sidewall 13a forms a reflective surface.

The side wall 13a serves to block or reflect light generated from the side from the LED chip 11 to the front, and form an area in which the transparent resin 19 is filled.

The transparent resin 19 is made of a mixture of silicon (not shown) and a phosphor (not shown), and the light emitted from the LED chip 11 and the light emitted by the phosphor (not shown) of the transparent resin 19 are mixed. White light is emitted to the outside.

That is, the transparent resin 19 filled in the sidewall 13a protects the LED chip 11 and controls the angle of the main outgoing light generated from the LED chip 11.

At this time, when the LED chip 11 generates blue light, and the phosphor (not shown) of the transparent resin 19 is a yellow phosphor, the light ultimately generated from the LED 10 becomes white light.

On the other hand, according to the structure of the LED 10, the light generated from the LED chip 11 is absorbed and scattered inside the LED 10, the external light of the LED 10 compared to the amount of light generated from the LED chip 11 The amount of light emitted to the lower.

Therefore, the light efficiency of the LED 10 is lowered.

In addition, the light emitted from the LED 10 is emitted so as to have a constant directivity angle, the LED emitting the light emitted to have a constant directivity angle is the light emitted from the neighboring two to three LED (10) to each other In the process of being superimposed and mixed and then incident to the light guide plate (not shown), the light guide plate (not shown) is a dark portion that the light does not reach the area between the adjacent LED (10).

As a result, an LED mura phenomenon occurs, and furthermore, a problem of deterioration of display quality of the liquid crystal display device due to luminance unevenness is caused.

Thus, to solve this problem by reducing the distance between the LED 10 and the adjacent LED 10, which causes a cost increase problem and heat dissipation problem according to the increase in the number of LED (10), Furthermore, it is a factor that increases the power consumption.

In addition, it is not possible to implement a lightweight and thin liquid crystal display device.

The present invention is to solve the above problems, it is a first object to provide an LED with improved light efficiency.

In addition, the second object of the present invention is to provide a light weight and thin liquid crystal display device, and to solve a defect such as LED mura, and to prevent a problem of deterioration of display quality due to uneven brightness of the liquid crystal display device. It is for the third purpose.

In order to achieve the object as described above, the present invention and the heat dissipation slug; An LED chip mounted on the heat dissipation slug; A case disposed on the heat dissipation slug and having first to fourth sidewalls protruding upward from the edge of the LED chip; Located on the LED chip and filled in the first to fourth sidewalls, the transparent resin including phosphors, and the first and third sidewalls facing each other are concave toward the LED chip. The second and fourth sidewalls perpendicular to the first and third sidewalls and facing each other provide a convex light emitting diode toward the LED chip.

In this case, the first to fourth sidewalls have a curvature, and the first and third sidewalls have a length longer than that of the second and fourth sidewalls.

In addition, the directing angle of light viewed toward the direction in which the second and fourth sidewalls are formed is narrower than the directing angle of light viewed toward the direction in which the first and third sidewalls are formed, and the transparent resin is epoxy resin or silicon. The phosphor is mixed with one selected.

Here, the LED chip is a blue LED chip, the phosphor is a yellow phosphor, the LED chip is a UV LED chip, the phosphor is a red (R), green (G), blue (B) phosphor.

In addition, the present invention cover cover; A reflection plate seated on the cover top; A light guide plate mounted on the reflection plate; A printed circuit board having a bar shape corresponding to the light receiving part of the light guide plate and disposed on the same plane; A heat dissipation slug mounted on the printed circuit board at predetermined intervals; An LED chip mounted on the heat dissipation slug; A case disposed on the heat dissipation slug and having first to fourth sidewalls protruding upward from the edge of the LED chip; Located on the LED chip and filled in the first to fourth sidewalls, the transparent resin including phosphors, and the first and third sidewalls facing each other are concave toward the LED chip. An LED assembly comprising light emitting diodes convex toward the LED chip, the second and fourth side walls perpendicular to the first and third side walls; A plurality of optical sheets interposed on the light guide plate; A support main covering the edges of the reflective plate, the light guide plate, and the plurality of optical sheets; A liquid crystal panel positioned on the plurality of optical sheets; a top cover covering an upper edge of the liquid crystal panel, the top cover coupled to the support main and the cover bottom, and the first and third sidewalls of the light emitting diodes. The length direction of the liquid crystal display module corresponding to the longitudinal direction of the light incident portion of the light guide plate.

Here, the directing angle of the light viewed toward the direction in which the first and third sidewalls are formed corresponds to the light incident part of the light guide plate, and the directing angle of the light toward the direction in which the second and fourth sidewalls are formed is the second angle. It is narrow compared to the directing angle of light viewed toward the direction in which the first and third sidewalls are formed.

As described above, according to the present invention, by forming the sidewall of the long axis of the LED sidewall concave toward the LED chip, and by forming the sidewall of the short side convex toward the LED chip, it is possible to improve the light efficiency of the LED, There is an effect to improve the directing angle of light viewed from the long axis direction of.

In addition, there is an effect that can prevent the dark portion that the light does not reach the area between the LED adjacent to each other in the light guide plate incident part.

Therefore, there is an effect of preventing the occurrence of LED mura phenomenon, and furthermore, there is an effect of preventing the problem of deterioration of the display quality of the liquid crystal display device due to luminance unevenness.

1 is a cross-sectional view of a typical LED for implementing white light.
2 is a perspective view of an LED according to an embodiment of the present invention.
3A to 3B are cross-sectional views of LEDs according to the exemplary embodiment of the present invention as viewed in the long axis and the short axis direction.
Figures 4a to 4b is a simulation result showing the optical orientation angle of the short axis of the LED and the LED according to the embodiment of the present invention.
5 is a cross-sectional view of a liquid crystal display module including an LED according to an embodiment of the present invention.
6a to 6b schematically illustrate a state in which light emitted from an LED and an LED according to an exemplary embodiment of the present invention is generally incident into the light guide plate through the light guide plate incident part.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

2 is a perspective view of an LED according to an embodiment of the present invention.

As shown, the LED 100 is composed of a LED chip 111 that emits large light and a lens unit 120 that controls the angle of the main outgoing light generated from the LED chip 111.

More specifically, first, the LED chip 111 is seated on the heat dissipation slug 115, and the heat dissipation slug 115 is a part that conducts and discharges the high temperature heat accompanying the light emission of the LED chip 111 to the outside. Is done.

The heat dissipation slug 115 is provided to have a seating portion drawn in a predetermined depth from the surface so that the LED chip 111 is seated.

The heat dissipation slug 115 is surrounded by a case 113 serving as a housing, and a pair of positive / cathode electrode leads electrically connected to the case 113 through an LED chip 111 and a wire 118. 117a and 117b are provided and exposed outside the case 113.

 At this time, a current supply means (not shown) for supplying a power (+) and a ground power (-) for emitting light of the LED chip 111 is provided outside, and is electrically connected to the positive and negative lead 117a and 117b. .

In addition, the case 113 is configured to have sidewalls 200a, 200b, 200c, and 200d protruding highly upward along the side of the heat dissipation slug 115, and the inner side of the sidewalls 200a, 200b, 200c, and 200d is half. Amnesty

The sidewalls 200a, 200b, 200c, and 200d may be made of a transparent material having high reflection efficiency, a translucent diffused material, or an opaque reflective material, wherein the transparent materials forming the sidewalls 200a, 200b, 200c, and 200d Transparent synthetic resins such as acrylic having a transmittance of 90% or more can be used.

In addition, a synthetic resin molded article having a transmittance of about 50 to 90% may be used as the translucent diffusion material. For example, it is prepared by adding a diffusing agent of material particles having reflective properties during injection molding of PMMA (Poly Methyl Meth Acrylate). It can represent the form.

As the opaque reflective material, a metal having high surface reflectivity such as Al may be used.

Therefore, the side walls 200a, 200b, 200c, and 200d serve to block or reflect forward light emitted from the LED chip 111 laterally, where the side walls 200a, 200b, 200c, and 200d are more. In detail, the sidewalls 200a, 200b, 200c, and 200d may be formed of the first to fourth sidewalls 200a, 200b, 200c, and 200d to surround the LED chip 111, and may be parallel to the long axis of the LED 100. The first and third sidewalls 200a and 200c positioned at one edge (hereinafter, referred to as long axis edge) are formed to have a constant curvature concave toward the LED chip 111, and parallel to the short axis of the LED 100. The second and fourth sidewalls 200b and 200d positioned at edges (hereinafter, referred to as short axis edges) are formed to have a convex constant curvature toward the LED chip 111.

Through this, the LED 100 of the present invention can improve the directivity angle of the light viewed in the long axis direction, and further improves the light efficiency. We will discuss this in more detail later.

In addition, the first to fourth sidewalls 200a, 200b, 200c, and 200d serve to block or reflect light emitted from the LED chip 111 laterally, and at the same time, the transparent resin 119 is filled therein. To form an area.

That is, the storage space is defined above the LED chip 111 by the first to fourth sidewalls 200a, 200b, 200c, and 200d formed to surround the LED chip 111, and the transparent resin ( 119 is filled to form a lens unit 120 for controlling the angle of the main outgoing light of the LED (100).

In this case, the transparent resin 119 may include a phosphor (not shown), and a mixture of the phosphor (not shown) with a transparent epoxy resin (not shown) or a silicone resin (not shown) may be used at a predetermined ratio.

Here, the epoxy resin (not shown) causes disconnection of the wire 118 electrically connecting the LED chip 111 and the anode and cathode leads 117a and 117b by a relatively large hardness value and the epoxy resin (not shown). It causes light degradation or yellowing due to light absorption of short wavelength visible light.

Therefore, in recent years, since the hardness is small and the restoring force is large, the occurrence of disconnection of the wire 118 is reduced, and silicon (not shown) which does not show a yellowing tendency with long time use is used.

Phosphor (not shown) is a yellow phosphor when the LED chip 111 is a blue LED chip, and the yellow phosphor is a yttrium (Y) aluminum (Al) garnet doped with cerium (Ce) having a wavelength of 530 to 570 nm. It is preferable to use YAG: Ce (T3Al5O12: Ce) series phosphor which is phosphorus.

In addition, when the LED chip 111 is a UV LED chip, the phosphor (not shown) is composed of three color phosphors of red (R), green (G), and blue (B), and red (R), green (G), and blue. The emission color can be selected by adjusting the compounding ratio of the phosphor 240 in (B).

In this case, the red phosphor is a YOX (Y 2 O 3: EU) -based phosphor made of yttrium oxide (Y 2 O 3) and europium (EU) compound having a 611 nm wavelength, and the green (G) phosphor is a 544 nm wavelength. Is a LAP (LaPo4: Ce, Tb) -based phosphor which is a compound of phosphoric acid (Po4), lanthanum (La), and terbium (Tb), and the blue (B) phosphor has a barium wavelength of 450 nm. It is preferable to use BAM blue (BaMgAl 10 O 17: EU) -based phosphor, which is a compound of Ba), magnesium (Mg), aluminum oxide-based material, and europium (EU).

Here, the dominant wavelength is referred to as the wavelength of the phosphor that generates the highest luminance in each of red (R), green (G), and blue (B).

Therefore, when the power supply (+) and ground power supply (-) are supplied to the LED chip 111 through the pair of lead frames 117a and 117b, the LED chip 111 emits light, and thus the LED chip 111 A portion of the emitted light excites the phosphor (not shown) of the transparent resin 119, and is mixed with the light emitted by the phosphor (not shown) to emit white light, the white light is emitted to the outside of the LED (100) do.

As described above, the LED 100 according to the embodiment of the present invention is formed by concave sidewalls (200a, 200c) of the long axis edge of the LED 100 toward the LED chip 111, the shortening of the LED 100 By forming the sidewalls 200b and 200d at the edges convexly toward the LED chip 111, the light efficiency of the LED 100 can be improved, and the directing angle of light viewed from the long axis direction of the LED 100 can be improved. have.

3A is a cross-sectional view of the LED according to the exemplary embodiment of the present invention of FIG. 2 viewed from a long axis direction, and FIG. 3B is a cross-sectional view of the LED according to the exemplary embodiment of the present invention of FIG. 2 viewed from a short axis direction.

As shown, the LED 100 according to the embodiment of the present invention is the LED chip 111 is seated on the heat dissipation slug 115 and the heat dissipation slug 115 is by the case 113 of the housing (housing) role Enclosed.

The case 113 is provided with a pair of positive / cathode electrode leads 117a and 117b electrically connected to each other through the LED chip 111 and the wire 118. The case 113 is exposed to the outside of the case 113. The side wall 200a, 200b, 200c, 200d protrudes along the side of the heat radiation slug 115, and the side walls 200a, 200b, 200c, 200d define an accommodation space, and an inner side thereof It forms a reflective surface.

The transparent space 119 in which the phosphors are mixed is filled in the storage space defined by the side walls 200a, 200b, 200c, and 200d to control the angle of the main output light of the LED 100.

In this case, as illustrated in FIG. 3A, the second and fourth sidewalls 200b and 200d which are short edges of the LED 100 among the sidewalls 200a, 200b, 200c and 200d of the LED 100 may be connected to the LED chip 111. First and third sidewalls 200a which are formed to have a convex constant curvature, and which are long axis edges of the LEDs 100 among the sidewalls 200a, 200b, 200c, and 200d of the LEDs 100, as shown in FIG. 3B. , 200c is formed to have a constant curvature concave toward the LED chip 111, the light generated from the LED chip 111 has a further improved light efficiency than the general LED (100).

In more detail, as the first and third sidewalls 200a and 200c, which are edges of the long axis of the LED 100, are formed to have a constant curvature concave toward the LED chip 111, the short axis direction of the LED 100. It narrows the angle of incidence of light as seen from.

Thus, by narrowing the directing angle of the light viewed from the short axis direction of the LED (100), through this, more light generated from the LED chip 111 toward the center of the LED 100, and also of the LED 100 The directing angle of light viewed from the long axis direction can be widened.

Here, by directing the light generated from the LED chip 111 toward the center of the LED 100, some of the light generated from the LED chip 111 is the first and third sidewalls (200a, 200c) of the LED 100 ) To prevent absorption and scattering.

Therefore, since the total amount of light emitted from the LED 100 is improved, the light efficiency of the LED 100 is increased.

In addition, the LED 100 of the present invention is the LED chip 111 to the second and fourth sidewalls (200b, 200d) which are short edges of the LED 100 of the sidewalls (200a, 200b, 200c, 200d) of the LED (100) By forming a convex constant curvature toward the (), it is possible to widen the directing angle of the light viewed from the long axis direction of the LED.

Therefore, when the LED 100 of the present invention is used as a light source of the liquid crystal display device, the color mixing space of the light emitted from the plurality of LEDs 100 may be increased.

Accordingly, the light emitted from the plurality of LEDs 100 do not overlap and mix with each other, thereby preventing the dark portion that does not reach the region between the LEDs 100 adjacent to each other in the light guide plate (not shown). have.

As a result, the LED mura phenomenon can be prevented from occurring. Furthermore, it is possible to prevent a problem of deterioration of display quality of the liquid crystal display device due to luminance unevenness.

In addition, by narrowing the directing angle of the light viewed from the short axis direction of the LED 100, the light generated from the LED chip 111 is directed toward the center of the LED 100, thereby providing more light through the light guide plate (not shown) Positive light may be incident into the light guide plate (not shown), thereby realizing a backlight unit having improved light efficiency.

4A to 4B are simulation results showing light directing angles seen from a short direction of a general LED and an LED according to an exemplary embodiment of the present invention.

4A and 4B, the light directing angle seen from the short axis direction of the LED is compared to the light directing angle seen from the short axis direction of the general LED of FIG. 4A. You can see that it is narrow.

Through this, it can be seen that the LED of the present invention directs some of the light directed toward the long axis edge of the LED toward the center of the LED.

Accordingly, the LED of the present invention prevents some of the light generated from the LED chip from being absorbed and scattered by the first and third sidewalls of the LED, thereby improving the total amount of light emitted from the LED, thereby improving the light efficiency of the LED. It can be seen that increases the.

 In addition, a greater amount of light may be incident into the light guide plate (not shown) through the light guide plate (not shown), thereby realizing a backlight unit having improved light efficiency.

5 is a cross-sectional view of a liquid crystal display module including an LED according to an embodiment of the present invention.

As illustrated, the liquid crystal display module includes a liquid crystal panel 310, a backlight unit 320, a support main 330, a cover bottom 350, and a top cover 340.

First, the liquid crystal panel 310 plays a key role in image expression and includes a first substrate 312 and a second substrate 314 bonded to each other with the liquid crystal layer interposed therebetween.

At this time, under the premise of an active matrix method, a plurality of gate lines and data lines intersect each other, and pixels are defined on an inner surface of the first substrate 312, which is generally referred to as a lower substrate or an array substrate. Thin film transistors (TFTs) are provided at the intersections of the transistors and are in one-to-one correspondence with transparent pixel electrodes formed in each pixel.

In addition, the inner surface of the second substrate 314 called the upper substrate or the color filter substrate may correspond to each pixel, for example, a color filter of red (R), green (G), and blue (B) color, and each of them. A black matrix covering the non-display elements such as gate lines, data lines, and thin film transistors is provided. In addition, a transparent common electrode covering them is provided.

In addition, polarizing plates 319a and 319b for selectively transmitting only specific light are attached to the outer surfaces of the first and second substrates 312 and 314, respectively.

In addition, a printed circuit board (not shown) is modularized by connecting at least one edge of the liquid crystal panel 310 through a connecting member (not shown) such as a flexible circuit board or a tape carrier package (TCP). During the process, the side of the support main 330 or the cover bottom 350 is properly folded to be in close contact.

In the liquid crystal panel 310 having the above-described structure, when the thin film transistor selected for each gate line is turned on by the on / off signal of the gate driver circuit which is scanned and transmitted, the signal voltage of the data driver circuit becomes data. The liquid crystal molecules are arrayed by the electric field between the pixel electrode and the common electrode.

In addition, the liquid crystal display module according to the present invention is provided with a backlight unit 320 for supplying light from the rear surface of the liquid crystal panel 310 so that the difference in transmittance is expressed to the outside.

The backlight unit 320 may include an LED assembly 329, a white or silver reflector 325, a light guide plate 323 seated on the reflector 325, and a plurality of optical sheets 321 interposed thereon. Include.

The above-described LED assembly 329 is located on one side of the light guide plate 323 to face the light-receiving portion of the light guide plate 323, and the LED assembly 329 includes a plurality of LEDs 100 and a plurality of LEDs 100. Includes a PCB 329a that is mounted at regular intervals.

At this time, each LED 100 has a long axis edge is parallel to the longitudinal direction of the PCB 329a, the short axis edge of the LED 100 is mounted on the PCB 329a perpendicular to the longitudinal direction of the PCB 329a.

At this time, each LED 100 is largely formed around the LED chip (111 in FIG. 3B) and the LED chip (111 in FIG. 3B) (200a, 200b, 200c, 200d in FIG. 3B) and the sidewall (in FIG. 3B). It is made of a transparent resin (119 of FIG. 3b) is filled in the inside (200a, 200b, 200c, 200d), in particular the LED 100 used in the liquid crystal display device of the present invention is located at the edge of the long axis of the LED (100) The first and third sidewalls 200a and 200c of FIG. 3B are formed to have a constant curvature concave toward the LED chip 111 of FIG. 3B, and the second and fourth sidewalls positioned at the short edges of the LED 100. 200B and 200D of FIG. 3A are formed to have a convex constant curvature toward the LED chip (111 of FIG. 3B).

At this time, as each LED 100 is mounted on the PCB 329a such that the long axis edge is parallel to the longitudinal direction of the PCB 329a, the LED 100 has a long axis along the longitudinal direction of the light incident portion of the light guide plate 323. The edges face in parallel.

Therefore, the LED 100 of the present invention can improve the directivity angle of the light viewed in the long axis direction, it is possible to obtain a result that the color mixing space of the light emitted from the plurality of LED (100) is increased.

Accordingly, since the light emitted from the plurality of LEDs 100 does not overlap and mix with each other, it is possible to prevent the dark portion from which light does not reach the area between the LEDs 100 adjacent to each other in the light guide plate 323. .

As a result, the occurrence of the LED mura phenomenon can be prevented, and the problem of deterioration of the display quality of the liquid crystal display device due to the luminance unevenness can be prevented from occurring.

In addition, by directing the light generated from the LED chip (111 in FIG. 3B) toward the center of the LED 100, some of the light generated from the LED chip (111 in FIG. 3B) is the first and second of the LED (100) By preventing the absorption and scattering by the three sidewalls (200a and 200c of FIG. 3b), the total amount of light emitted from the LED 100 is improved.

Through this, the light efficiency of the LED 100 is increased.

In addition, by narrowing the directing angle of the light viewed from the short axis direction of the LED 100, more light can be incident into the light guide plate 323 through the light guide plate 323, thereby improving light efficiency. The backlight unit 320 may be implemented.

At this time, the light guide plate 323 evenly spreads the light incident from the plurality of LEDs 100 to a large area of the light guide plate 323 while traveling in the light guide plate 323 by a plurality of total reflections to provide a surface light source to the liquid crystal panel 310. to provide.

The light guide plate 323 may include a pattern of a specific shape on the rear surface to supply a uniform surface light source.

The reflecting plate 325 is positioned on the rear surface of the light guide plate 323, and reflects light passing through the rear surface of the light guide plate 323 toward the liquid crystal panel 310 to improve the brightness of the light.

The plurality of optical sheets 321 on the light guide plate 323 include a diffusion sheet and at least one light collecting sheet, and diffuse or condense the light passing through the light guide plate 323 to make the surface more uniform with the liquid crystal panel 310. Allow the light source to enter.

The liquid crystal panel 310 and the backlight unit 320 are modularized through the top cover 340, the support main 330, and the cover bottom 350. The top cover 340 is the top and side surfaces of the liquid crystal panel 310. A rectangular frame having a cross section bent in a shape of “a” so as to cover an edge thereof is configured to open an entire surface of the top cover 340 to display an image implemented in the liquid crystal panel 310.

In addition, the liquid crystal panel 310 and the backlight unit 320 are seated, and the cover bottom 350, which is the basis for assembling the entire structure of the LCD device module, has a rectangular plate shape and vertically bends the four edges thereof. Configure.

In addition, a square frame-shaped support main 330 seated on the cover bottom 350 and surrounding the edges of the liquid crystal panel 310 and the backlight unit 320 may include a top cover 340 and a cover bottom 350. Combined.

Here, the top cover 340 may be referred to as a case top or a top case, the support main 330 may be referred to as a guide panel or a main support, a mold frame, and the cover bottom 350 may be referred to as a bottom cover.

6A through 6B are views schematically illustrating a state in which light emitted from an LED and an LED according to an exemplary embodiment of the present invention is incident into the light guide plate through the light guide plate incident part.

FIG. 6A is a view schematically illustrating a state in which light emitted from the general LED 10 is incident into the light guide plate 323 through the light guide plate 323, and the general LED 10 may have a long axis direction and a short axis direction. The aiming angle of the light seen is similar.

When the light emitted from the general LED 10 is incident to the light guide plate 323 through the light guide plate 323, the directivity angle of the light viewed from the short axis direction of the LED is wide, and the light emitted from the LED 10 is increased. As the light is emitted to a region other than the light incident portion of the light guide plate 323, light loss is generated.

On the contrary, as shown in FIG. 6B, the LED 100 of the present invention narrows the directing angle of light viewed in the short axis direction, thereby preventing the loss of light as compared with the general LED 10 shown in FIG. 6A. can do.

In addition, by narrowing the directing angle of the light viewed from the short axis direction, a greater amount of light is directed toward the center of the LED 100, thereby allowing a greater amount of light to pass through the light guide plate 323 into the light guide plate 323. It may be made to be incident, it is possible to implement a backlight unit (320 of FIG. 5) with improved light efficiency.

Meanwhile, in the above description, the sidewalls (200a and 200c of FIG. 3B) of the long-axis edges of the sidewalls (200a, 200b, 200c and 200d of FIG. 2) of the LED (100 of FIG. 3B) are replaced with the LED chips (111 of FIG. 3B). Formed concave from the side, and the sidewalls (200b, 200d of Figure 3a) of the short edge has been described as forming convex from the LED chip (111 of Figure 3b), this is because the LED (100 of Figure 3b) It can be variously changed depending on which direction is mounted on 329a).

That is, the LED (100 in FIG. 3B) of the present invention may concave sidewalls of the edge parallel to the longitudinal direction of the PCB (329a in FIG. 5), and may form convex sidewalls perpendicular thereto.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

100: LED, 111: LED chip, 113: case, 115: heat dissipation slug
117a, 117b: positive / cathode electrode lead, 118: wire, 119: transparent resin
120: lens part, 200: sidewalls 200a, 200b, 200c, 200d: first to fourth sidewalls

Claims (10)

Heat dissipation slugs;
An LED chip mounted on the heat dissipation slug;
A case disposed on the heat dissipation slug and having first to fourth sidewalls protruding upward from the edge of the LED chip;
Located on the LED chip and filled in the first to fourth sidewalls, the transparent resin comprising a phosphor
Wherein the first and third sidewalls facing each other are concave toward the LED chip, and the second and fourth sidewalls perpendicular to the first and third sidewalls and facing each other are convex toward the LED chip. Light emitting diode.
The method of claim 1,
The first to fourth sidewalls have a curvature.
The method of claim 1,
The first and third sidewalls are longer than the second and fourth sidewalls.
The method of claim 3, wherein
The light emitting diode facing the direction in which the second and fourth sidewalls are formed is narrower than the light beam facing the direction in which the first and third sidewalls are formed.
The method of claim 1,
The transparent resin is a light emitting diode mixed with a phosphor selected from one of epoxy resin or silicon.
The method of claim 1,
The LED chip is a blue LED chip, the phosphor is a yellow phosphor light emitting diode.
The method of claim 1,
The LED chip is a UV LED chip, the phosphor is a red (R), green (G), blue (B) phosphor of the light emitting diode.
Covertum;
A reflection plate seated on the cover top;
A light guide plate mounted on the reflection plate;
A printed circuit board having a bar shape corresponding to the light receiving part of the light guide plate and disposed on the same plane; A heat dissipation slug mounted on the printed circuit board at predetermined intervals; An LED chip mounted on the heat dissipation slug; A case disposed on the heat dissipation slug and having first to fourth sidewalls protruding upward from the edge of the LED chip; Located on the LED chip and filled in the first to fourth sidewalls, the transparent resin including phosphors, and the first and third sidewalls facing each other are concave toward the LED chip. An LED assembly comprising light emitting diodes convex toward the LED chip, the second and fourth side walls perpendicular to the first and third side walls;
A plurality of optical sheets interposed on the light guide plate;
A support main covering the edges of the reflective plate, the light guide plate, and the plurality of optical sheets;
A liquid crystal panel positioned on the plurality of optical sheets;
A top cover that covers an upper edge of the liquid crystal panel and is coupled to the support main and the cover bottom
And a length direction of the first and third sidewalls of the light emitting diode corresponding to a length direction of the light incident part of the light guide plate.
The method of claim 8,
And a directing angle of light viewed toward a direction in which the first and third sidewalls are formed corresponds to the light incident part of the light guide plate.
The method of claim 9,
And a direction of the light viewed toward the direction in which the second and fourth sidewalls are formed is narrower than a direction of the light viewed toward the direction in which the first and third sidewalls are formed.

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