KR101696379B1 - Light emitting device package module and backlight unit - Google Patents

Light emitting device package module and backlight unit Download PDF

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Publication number
KR101696379B1
KR101696379B1 KR1020150115350A KR20150115350A KR101696379B1 KR 101696379 B1 KR101696379 B1 KR 101696379B1 KR 1020150115350 A KR1020150115350 A KR 1020150115350A KR 20150115350 A KR20150115350 A KR 20150115350A KR 101696379 B1 KR101696379 B1 KR 101696379B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
light
guide plate
device package
Prior art date
Application number
KR1020150115350A
Other languages
Korean (ko)
Inventor
오승현
김평국
조성식
배형진
한강민
Original Assignee
주식회사 루멘스
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Priority to KR1020150115350A priority Critical patent/KR101696379B1/en
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Publication of KR101696379B1 publication Critical patent/KR101696379B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

The present invention relates to a light emitting package module and a backlight unit, capable of being used as a display or lighting. The present invention includes: a module substrate formed in a longitudinal direction to be matched with a side edge part of a light guide plate to be installed in the edge part; at least one light emitting device or light emitting device package embedded in the module substrate; and a metal reflector including a reflecting cup part reflecting light, generated from the light emitting device or light emitting device package, in a direction to the light guide plate, and installed to surround the light emitting device or light emitting device package. The metal reflector includes: a first reflecting surface having a first internal spread angle in a major axis direction of the reflecting cup part to induce the light, generated from the light emitting device or light emitting device package, to relatively widely spread in a widthwise direction of the light guide plate; a third reflecting surface placed opposite the first reflecting surface; a second reflecting surface having a second internal spread angle, smaller than the first internal spread angle, in a minor axis direction of the reflecting cup part to induce the light, generated from the light emitting device or light emitting device package, to relatively narrowly spread in a thickness direction of the light guide plate; and a fourth reflecting surface placed opposite the second reflecting surface.

Description

A light emitting device package module and a backlight unit

The present invention relates to a light emitting device package module and a backlight unit, and more particularly, to a light emitting device package module and a backlight unit which can be used for display or illumination.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be modularized for various purposes and used as a backlight unit A lighting device, and the like.

A light emitting device package or a light emitting device package module applied to a conventional edge type backlight unit includes a light emitting device or a white EMC disposed around the light emitting device package to guide light generated in the light emitting device package toward the light guide plate. A reflective molding material made of a resin material such as polyimide is applied.

However, since the reflection molding material of the resin material of the light emitting device package module applied to the conventional edge type backlight unit is widened more than necessary due to the reflection characteristic according to the material, the light leakage phenomenon occurs in the thickness direction of the light guide plate, There was a problem that was difficult.

In addition, the light emitting device package module used in the conventional edge type backlight unit is a resin material having a low thermal conductivity, so that heat generated from the light emitting device is difficult to be released to the outside air, so that the thermal stress of the product can not be solved. The thermal durability is poor.

Also, the conventional reflective molding material has poor mechanical strength and durability, so that it is easily broken or collapsed when it collides with the light guide plate, and the optical axis is distorted by the collision with the light guide plate.

The present invention is to solve various problems including the above problems, and it is possible to precisely control the directivity angle in the major axis direction and the minor axis direction by using the metal reflector, thereby preventing light leakage and precise light distribution control The metal reflector with high thermal conductivity can easily dissipate heat to the outside air to prevent the thermal stress of the product, thereby improving the thermal durability of the product. Also, since the product is excellent in mechanical strength and durability And to provide a light emitting device package module and a backlight unit which can prevent damage or deformation of light emitting diodes and improve light distribution efficiency and light uniformity. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package module comprising: a module substrate having a longitudinal length corresponding to an edge portion of a light guide plate; At least one light emitting device or light emitting device package mounted on the module substrate; A metal reflector formed of a metallic material and provided with a reflection cup part for reflecting the light generated from the light emitting device or the light emitting device package toward the light guide plate and surrounding the light emitting device or the light emitting device package; And an alignment protrusion formed on the front surface of the metal reflector so as to be in contact with the light guide plate and aligning the optical axis, wherein the metal reflector is configured such that light emitted from the light emitting device or the light emitting device package is relatively broad A first reflecting surface having a first internal angle of incidence inward in the major axis direction of the reflecting cup portion and a third reflecting surface located on the opposite side of the first reflecting surface are formed so as to be dispersed, A second reflecting surface having a second directing inner angle smaller than the first directing inner angle in a short axis direction of the reflective cup portion so that light generated in the package can be relatively narrowly dispersed in a thickness direction of the light guide plate, A fourth reflection surface located at a position opposite to the second reflection surface is formed, It may include a pair of projection members, and the light guide plate is fitted between the projection member and the pair is fixed to the metal reflector.

According to the present invention, the metal reflector has a generally rectangular parallelepiped shape in which an outgoing opening is formed in the front surface and an input opening is formed in the rear surface, the size of the outflow opening is smaller than the side size of the corresponding light guide plate, The size of the light input port may be larger than the size of the light emitting device package.

Further, according to the present invention, the first directing internal angle may be from 90 degrees to 170 degrees, and the second directing internal angle may be from 70 degrees to 120 degrees.

Also, according to the present invention, at least a part of the mounting surface mounted on the module substrate may be insulated or cut so that a shot can be prevented.

In addition, according to the present invention, the metal reflector may include a heat-radiating material having excellent thermal conductivity so as to discharge heat generated in the module substrate and the light emitting device package to the outside.

The light emitting device package module according to the present invention further includes a thermally conductive bonding medium for bonding the metal reflector to the wiring layer of the module substrate and transferring heat generated from the module substrate and the light emitting device package to the metal reflector. .

Also, according to the present invention, a reflection protrusion or a light absorbing layer may be formed at the center of the second reflection surface and at the center of the fourth reflection surface so as to prevent light from being focused.

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In addition, according to the present invention, the light emitting device package may be any one of a chip scale package (CSP), a wafer level package (WLP), and a flip chip having a photo-conversion material.

According to another aspect of the present invention, there is provided a light emitting device package including: a substrate; A light emitting element mounted on the substrate; And a metal reflector having a reflective cup formed to reflect the light emitted from the light emitting device and surrounding the light emitting device, wherein the metal reflector includes: A first reflecting surface having a first directing inner angle inward in the longitudinal direction of the reflecting cup portion and a third reflecting surface located on the opposite side of the first reflecting surface are formed so that light can be relatively widely dispersed, A second reflecting surface having a second directing inner angle smaller than the first directing inner angle in the short axis direction of the reflecting cup portion so that the light generated in the device can be relatively narrowly dispersed, The fourth reflection surface may be formed.

According to an aspect of the present invention, there is provided a backlight unit including: a light guide plate; A module substrate having a longitudinal length corresponding to the edge portion so as to be installed at a side edge portion of the light guide plate; At least one light emitting device or light emitting device package mounted on the module substrate; And a metal reflector formed of a metallic material and provided with a reflection cup part for reflecting the light generated from the light emitting device or the light emitting device package toward the light guide plate and surrounding the light emitting device or the light emitting device package. And an alignment protrusion formed on the front surface of the metal reflector so as to be in contact with the light guide plate and aligning the optical axis, wherein the metal reflector is configured such that light emitted from the light emitting device or the light emitting device package is relatively broad A first reflecting surface having a first internal angle of incidence inward in the major axis direction of the reflecting cup portion and a third reflecting surface located on the opposite side of the first reflecting surface are formed so as to be dispersed, A second reflecting surface having a second directing inner angle smaller than the first directing inner angle in a short axis direction of the reflective cup portion so that light generated in the package can be relatively narrowly dispersed in a thickness direction of the light guide plate, A fourth reflection surface located at a position opposite to the second reflection surface is formed, It may include a pair of projection members, and the light guide plate is fitted between the projection member and the pair is fixed to the metal reflector.

According to some embodiments of the present invention as described above, it is possible to precisely control the directivity angle in the major axis direction and the minor axis direction, thereby preventing the light leakage phenomenon, enabling accurate light distribution control, , It is possible to prevent the thermal stress of the product and improve the thermal durability of the product, and it is possible to prevent damage or deformation of the product due to excellent mechanical strength and durability, thereby improving the light distribution efficiency and light uniformity It is possible to have effect. Of course, the scope of the present invention is not limited by these effects.

1 is an exploded perspective view of a light emitting device package module and a backlight unit having the same according to some embodiments of the present invention.
2 is a cross-sectional view of a light emitting device package module of FIG. 1 taken along line II-II.
3 is a cross-sectional view of a light emitting device package module of FIG. 1 taken along line III-III.
4 is a front view of the metal reflector of the light emitting device package module of FIG.
5 is a cross-sectional view illustrating a metal reflector of a light emitting device package module according to some embodiments of the present invention.
6 is a cross-sectional view illustrating a metal reflector of a light emitting device package module according to still another embodiment of the present invention.
7 is a front view showing a metal reflector of a light emitting device package module according to still another embodiment of the present invention.
8 is a front view illustrating a metal reflector of a light emitting device package module according to still another embodiment of the present invention.
9 is a perspective view illustrating a metal reflector of a light emitting device package module according to still another embodiment of the present invention.
FIG. 10 is a light distribution diagram showing a comparison of the light distribution distribution according to the orientation angle of the conventional reflective material of EMC material and the metal reflector of the present invention.
FIG. 11 is a diagram showing a light amount distribution diagram and a directivity angle light distribution according to a change in the long-axis directional internal angle of the light emitting device package module according to some embodiments of the present invention.
FIG. 12 is a diagram showing a light amount distribution diagram and a directivity angle light distribution diagram according to a change in a directional interior angle of a short axis of the light emitting device package module of FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

1 is an exploded perspective view of a light emitting device package module 100 and a backlight unit 1000 having the same according to some embodiments of the present invention. 3 is a cross-sectional view of the light emitting device package module 100 of FIG. 1 taken along line III-III, and FIG. 4 is a cross-sectional view of the light emitting device package module 100 of FIG. Is a front view of the metal reflector 30 of the light emitting device package module 100 of FIG.

1 to 4, a light emitting device package module 100 according to some embodiments of the present invention includes a module substrate 10, a light emitting device package 20, and a metal reflector 30 .

For example, as shown in FIGS. 1 to 3, the module substrate 10 is formed in a lengthwise direction corresponding to the edge portion so as to be installed at an edge portion of a side surface 1a of the light guide plate 1a. (bar) type substrate.

1, the module substrate 10 has a plurality of light emitting device packages 20 mounted thereon and includes a printed circuit board (PCB) 12 on which wiring layers 11 and 12 are formed on a substrate base, : Printed Circuit Board) can be applied. However, the module substrate 10 is not necessarily limited to the drawings, and may be a metal substrate on which a surface is subjected to an insulation treatment and a wiring layer is formed. In addition, all of the various types of substrates can be applied to the module substrate 10.

For example, the module substrate 10 is electrically connected to a plurality of the light emitting device packages 20 and may be made of a material having appropriate mechanical strength to support the light emitting device packages 20 have.

More specifically, for example, the module substrate 10 may be a metal substrate in the form of a plate such as aluminum, copper, zinc, tin, lead, gold or silver, or a lead frame. In addition, a flexible printed circuit board (FPCB) or a flexible printed circuit board (FPCB) made of a soft material may be used, and a synthetic resin such as a resin or a glass epoxy may partially be included, or a ceramic material may be included in consideration of thermal conductivity , And materials made by selecting at least one of EMC (Epoxy Mold Compound), PI (polyimide), graphene, glass synthetic fiber, and combinations thereof to improve workability.

Also, as shown in FIGS. 1 to 3, the light emitting device package 20 may include at least one light emitting device mounted on the module substrate 10.

The light emitting device includes a first pad P1 electrically connected to the wiring layer 11 and a second pad P2 connected to the wiring layer 12 to form an upper portion of the electrode separation line L, The LED may be a flip chip type LED mounted on the LED chip.

Here, the light emitting device may be any one of a blue LED, a red LED, and a green LED, or may be an LED that emits light of various wavelengths or an ultraviolet LED. However, the present invention is not limited to this, and various types of light emitting devices including various horizontal or vertical LEDs, various bumps, and signal transmission media such as wire or solder may be applied.

For example, the light emitting element may be made of a semiconductor. For example, the light emitting element may be formed of a material such as InN, AlN, InGaN, AlGaN, InGaAlN or the like on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD The nitride semiconductor can be epitaxially grown. The first light emitting device LED1 and the second light emitting device LDE2 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor including a multiple quantum well structure or a single quantum well structure or a laminated semiconductor of a double hetero structure. In addition, the light emitting device 20 can be selected to have any wavelength depending on applications such as display use and illumination use.

For example, the light emitting device package 20 may be any one of a chip scale package (CSP), a wafer level package (WLP), and a flip chip having a photo-conversion material.

Here, CSP means that the chip area is more than 80% of the package area in order to use the semiconductor process in the packaging process so that the package size can be close to the chip size or to make the mounting area of the semiconductor component as small as possible. It can mean something.

For example, it is also possible to cure phosphors, quantum dots, or encapsulants on a plurality of densely packed chips, singulate them, and manufacture them in individual package units.

In addition, WLP is a new concept of packaging technology that combines silicon semiconductor process technology and light emitting diode (LED) technology, which means a package in which a hole is formed in a silicon wafer and the LED chip is packaged. In addition, the light emitting device package 20 is not limited thereto, and various types of light emitting devices or packages can be applied.

1 to 4, the metal reflector 30 includes a reflection cup portion 31 for reflecting the light generated from the light emitting device package 20 toward the light guide plate 1a, And may be a reflective structure of a metallic material installed in the form of surrounding the light emitting device package 20.

For example, as shown in FIG. 1, the metal reflector 30 is disposed on the light guide plate 1a so that light generated from the light emitting device package 20 can be relatively widely dispersed in the width direction of the light guide plate 1a. A first reflecting surface 31-1 having a first directing inner angle A1 of FIG. 2 on the inner side in the major axis direction X of the first reflecting surface 31 and a second reflecting surface 31-1 located on the opposite side of the first reflecting surface 31-1 The third reflecting surface 31-3 may be formed.

The metal reflector 30 is disposed in the minor axis direction Y of the reflective cup portion 31 so that light generated from the light emitting device package 20 can be relatively narrowly dispersed in the thickness direction of the light guide plate 1a. The second reflective surface 31-2 and the second reflective surface 31-2 having a second oriented internal angle A2 of FIG. 3 smaller than the first oriented internal angle A1 of FIG. 2, The fourth reflection surface 31-4 may be formed at a position opposite to the first reflection surface 31-4.

1, the long axis X may be an axis coinciding with the longitudinal direction of the metal reflector 30, and the minor axis Y may be a height direction of the metal reflector 30, It can mean a matching axis. The long axis X and the short axis Y may be orthogonal to each other.

2, if the first interior angle A1 is too small, the light can not be sufficiently dispersed in the longitudinal direction of the light guide plate 1a, and if the first interior angle A1 is too small, It is necessary to set the optimum angle since the light reflection area is too small to decrease the light concentration. Thus, the first directing internal angle A1 may be between 90 degrees and 170 degrees.

Also, as shown in FIG. 3, when the second internal angle A2 is too small, light may be scattered due to light reflected in the thickness direction of the light guide plate 1a, causing a light leakage phenomenon, It is necessary to set an optimum angle since the second directing angle A2 may be too large to cause a direct light leakage phenomenon. Thus, the second oriented internal angle A2 may be between 70 degrees and 120 degrees.

1 to 4, the metal reflector 30 includes an output port 30b formed on the front surface thereof and a light input port 30a formed on the rear surface thereof, And is a material including metal components such as aluminum, copper, iron, tin, zinc, nickel, chromium, gold, silver and platinum and is used for die-casting, injection, extrusion, press molding, cutting, And can be manufactured through various metal processing.

The metal reflector 30 may include a heat dissipation material having excellent thermal conductivity so as to discharge heat generated from the module substrate 10 and the light emitting device package 20 to the outside.

2, the size S1 of the exit 30b is smaller than the side size S2 of the corresponding light guide plate 1a so as to prevent light leakage, The size S4 of the light emitting device package 30 may be larger than the size S3 of the light emitting device package 20. [ As shown in FIG. 3, the size S5 of the exit 30b may be smaller than the thickness S6 of the light guide plate 1a.

Therefore, the light emitting device package 20 can be inserted into the light input port 30a of the metal reflector 30, and the light passing through the light output port 30b is reflected by the first reflection surface 31-1, The second reflecting surface 31-2, the third reflecting surface 31-3 and the fourth reflecting surface 31-4 are relatively widely dispersed in the major axis X direction, (Y) direction, the light uniformity of the light guide plate 1a is increased and the light leakage phenomenon is prevented, thereby improving the light efficiency.

Therefore, by using the metal reflector 30, it is possible to precisely control the directing angle individually in the long axis (X) direction and the short axis (Y) direction, thereby preventing the light leakage phenomenon, enabling accurate light distribution control, The metal reflector 30 of a high metal material can easily dissipate heat to the outside air, thereby preventing thermal stress of the product, thereby improving the thermal durability of the product and providing excellent mechanical strength and durability, The light distribution efficiency and the light uniformity can be improved.

5 is a cross-sectional view illustrating a metal reflector 30 of a light emitting device package module 200 according to some other embodiments of the present invention.

5, the metal reflector 30 of the light emitting device package module 200 according to some other embodiments of the present invention may be mounted on the module substrate 10 so as to prevent a shot, An insulating processing portion 32 may be formed in which at least part of the insulating processing portion 32 is insulated. Here, the insulating processing unit 32 may be formed by, for example, aluminum anodizing, various oxidizing treatments, or a coating layer.

Here, the insulation processing unit 32 may be formed over the entire surface of the metal reflector 30, and may be partially formed only on the mounting surface.

Therefore, it is possible to prevent the metal reflector 30 from being short-circuited by using the insulation processing unit 32.

5, the metal reflector 30 mechanically bonds the metal reflector 30 to the wiring layers 11 and 12 of the module substrate 10, and the module substrate 10 And a thermally conductive bonding medium M for transferring the heat generated in the light emitting device package 20 to the metal reflector 30.

Here, the thermally conductive bonding medium (M) may be applied with bonding materials or adhesives of various materials and kinds including thermally conductive components such as solder, silver, copper, aluminum, and ceramics.

Accordingly, heat generated in the module substrate 10 and the light emitting device package 20 is transferred to the metal reflector 30 by the thermally conductive bonding medium M, and the transferred heat is transferred to the metal reflector 30, And is discharged to the outside air by the outer surface of the metal reflector 30 to improve the cooling performance of the product, thereby preventing thermal stress.

6 is a cross-sectional view illustrating a metal reflector 30 of a light emitting device package module 300 according to still another embodiment of the present invention.

 6, the metal reflector 30 of the light emitting device package module 300 according to some embodiments of the present invention may be spaced apart from the wiring layer 12 by a distance L The cutting portion 33 may be formed.

Therefore, it is possible to prevent the metal reflector 30 from being short-circuited by using the cut portion 33. Here, the cutout portion 33 may be formed only on a portion corresponding to one of the wiring layers 11 and 12.

Therefore, it is possible to prevent a short-circuit by using the cutting portion 33, and to increase the contact area with the outside air, the heat radiation performance can be further improved.

7 is a front view showing a metal reflector 30 of a light emitting device package module 400 according to still another embodiment of the present invention.

7, the metal reflector 30 of the light emitting device package module 400 according to still another embodiment of the present invention includes the second reflection surface 31 -2, and a reflection protrusion T at the center of the fourth reflection surface 31-4.

Therefore, light concentrated at the center of the second reflection surface 31-2 and at the center of the fourth reflection surface 31-4 can be reflected by the reflection protrusion T and can be dispersed right and left It is possible to prevent the light beam phenomenon or the bright spot phenomenon, and thereby, the light uniformity and the light efficiency can be improved.

8 is a front view showing a metal reflector 30 of a light emitting device package module 500 according to still another embodiment of the present invention.

8, the metal reflector 30 of the light emitting device package module 500 according to still another embodiment of the present invention may include a metal reflector 30, A light absorbing layer K may be formed at the center of the slope 31-2 and at the center of the fourth reflection surface 31-4.

Therefore, light concentrated at the center of the second reflection surface 31-2 and at the center of the fourth reflection surface 31-4 is absorbed by the light absorption layer K, It is possible to improve the light uniformity.

9 is a perspective view showing a metal reflector 30 of a light emitting device package module 600 according to still another embodiment of the present invention.

9, the metal reflector 30 of the light emitting device package module 600 according to some other embodiments of the present invention may be disposed on the front surface of the metal reflector 30 in contact with the light guide plate 1a At least one alignment projection (AL) for aligning the optical axis is formed by fixing the light guide plate (1a) in a fixed position, a part of concentrated light is dispersed by being fitted on the upper surface and the lower surface of the light guide plate (1a) .

The alignment protrusions AL may have two protrusions protruding toward the light guide plate 1a on the upper and lower surfaces of the metal reflector 30, respectively. The protruding member may be, for example, a rectangular plate.

The two protruding members may be formed to have an interval equal to or greater than the thickness of the light guide plate 1a and protrude from the metal reflector 30 so as to be slightly bent upward and downward. In addition to the rectangular plate shape, the shape and the number of such alignment protrusions AL can be changed variously, for example, in a triangular plate shape or a semicircular shape in consideration of dispersion of light.

Accordingly, it is possible to align the light guide plate 1a with the alignment protrusion AL using the alignment protrusion AL, align the optical axis of the light emitting device package 20 at an accurate position, It can be reflected to the left and right sides and dispersed. This can greatly improve light uniformity and light efficiency.

1, a backlight unit 1000 according to some embodiments of the present invention may include a light emitting device package 100 according to some embodiments of the present invention described above, A light guide plate 1a; A module substrate 10 formed in a longitudinal direction corresponding to the edge portion so as to be installed at an edge portion of a side surface 1a of the light guide plate 1a; At least one light emitting device package (20) mounted on the module substrate (10); And a reflection cup portion 31 for reflecting the light generated from the light emitting device package 20 toward the light guide plate 1a. The light emitting device package 20 includes a metallic material And the metal reflector 30 is disposed on the light guide plate 1a so that the light generated from the light emitting device package 20 can be relatively widely dispersed in the width direction of the light guide plate 1a. A first reflecting surface 31-1 having a first internal angle A1 on the inside in the major axis direction of the first reflecting surface 31 and a third reflecting surface 31-1 located on the opposite side of the first reflecting surface 31-1 3) is formed on the inner side of the reflective cup portion (31) so that light generated from the light emitting device package (20) can be dispersed relatively narrowly in the thickness direction of the light guide plate (1a) A second reflecting surface 31-2 having a second directing internal angle A2 smaller than the first directing internal angle A1, And a fourth reflecting surface 31-4 located at the opposite side of the second reflecting surface 31-2.

Here, the light guide plate 1a may be an optical member that can be made of a light-transmitting material to guide light generated from the light emitting device package 20.

The light guide plate 1a may be installed in a path of light generated by the light emitting device package 20 to transmit light generated by the light emitting device package 20 over a wider area.

The light guide plate 1a may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , And various light transmitting resin materials may be applied. The light guide plate 1a may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface thereof, or forming fine bubbles therein.

Although not shown, various diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 1a. In addition, various display panels such as an LCD panel may be installed above the light guide plate 1a.

The module substrate 10 and the light emitting device package 20 and the metal reflector 30 may be mounted on the light emitting device package module 100 according to some embodiments of the present invention shown in FIGS. Components and their configurations and roles may be the same. Therefore, detailed description is omitted.

Meanwhile, a light emitting device package according to some embodiments of the present invention includes a substrate (not shown); A light emitting device (not shown) mounted on the substrate; And a metal reflector 30 formed of a metallic material and having a reflection cup portion 31 for reflecting the light generated from the light emitting device and surrounding the light emitting device, ) Has a first reflecting surface (31-1) having a first directing inner angle (A1) on the inner side in the longitudinal direction of the reflecting cup portion (31) so that the light generated from the light emitting element can be relatively widely dispersed, A third reflecting surface 31-3 located on the opposite side of the first reflecting surface 31-1 is formed and the light emitted from the light emitting device is dispersed relatively narrowly, A second reflecting surface 31-2 having a second directing internal angle A2 smaller than the first directing internal angle A1 on the inner side in the minor axis direction and a second reflecting surface 31-2 located on the opposite side of the second reflecting surface 31-2 The fourth reflection surface 31-4 may be formed.

Here, the substrate may be a general PCB, a FPCB, a lead frame, or a metal substrate, and the light emitting device may be an LED.

In addition, the light emitting device and the metal reflector may have the same configuration and function as those of the light emitting device package module according to some embodiments of the present invention shown in FIGS. 1 to 9. Therefore, detailed description is omitted.

FIG. 10 is a light distribution diagram showing a comparison of the light distribution distribution according to the orientation angle of the conventional reflective material of EMC material and the metal reflector of the present invention.

As shown in the upper graph of FIG. 10, when the EMC material is applied to the reflective encapsulant, for example, a wide distribution distribution diagram with a light distribution directivity angle of 99,92 degrees at a specific reflection angle is shown. It can be seen that, when the metal reflector is applied, for example, a light distribution distribution diagram in which the light distribution directivity angle is narrower than 88.86 degrees at the same reflection angle is obtained. Through this, it can be seen that the metal reflector can easily control light in a desired direction than the reflective encapsulant.

FIG. 11 is a diagram showing a light amount distribution diagram and a directivity angle light distribution diagram according to a change in the directing inner angle of the long axis X of the light emitting device package module 100 according to some embodiments of the present invention.

For example, as shown in the upper graph and the lower graph of Fig. 11, it can be seen that the distribution of light becomes wider at the actual luminous intensity as the first internal angle of the major axis X of the metal reflector is increased.

FIG. 12 is a diagram showing a light amount distribution diagram and a directivity angle light distribution diagram according to a change in the directing internal angle of the short axis Y of the light emitting device package module 100 of FIG.

Similarly, for example, as shown in the upper graph and the lower graph of Fig. 12, it can be seen that the distribution of light becomes narrower at the actual light distribution degree as the second directing internal angle is shortened in the short axis Y of the metal reflector. By using the metal reflector, the distribution of the light can be optimally optimized for both the long and short axes, and the light leakage phenomenon can be effectively prevented.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims (10)

A modular substrate longitudinally formed corresponding to the edge portion so as to be installed at a side edge portion of the light guide plate;
At least one light emitting device or light emitting device package mounted on the module substrate;
A metal reflector formed of a metallic material and provided with a reflection cup part for reflecting the light generated from the light emitting device or the light emitting device package toward the light guide plate and surrounding the light emitting device or the light emitting device package; And
And an alignment protrusion formed on the front surface of the metal reflector to align the optical axis with the light guide plate,
The metal reflector includes:
A first reflection surface having a first directing inner angle in a longitudinal direction of the reflective cup portion so that light emitted from the light emitting device or the light emitting device package can be relatively widely dispersed in a width direction of the light guide plate, A third reflecting surface positioned opposite to the one reflecting surface is formed,
And a second directing inner angle smaller than the first directing inner angle in a minor axis direction of the reflective cup portion so that light generated from the light emitting device or the light emitting device package can be relatively narrowly dispersed in the thickness direction of the light guide plate A fourth reflecting surface located on the opposite side of the second reflecting surface and the second reflecting surface,
Wherein the alignment protrusion includes a pair of projection members having an interval equal to or greater than the thickness of the light guide plate, and the light guide plate is fitted between the pair of projection members and fixed to the metal reflector. The method according to claim 1,
The metal reflector includes:
An exit port is formed on the front surface and an entrance port is formed on the rear surface,
Wherein the size of the outgoing opening is smaller than the side size of the corresponding light guide plate and the size of the inlet is larger than the size of the light emitting device package. The method according to claim 1,
Wherein the first directing internal angle is from 90 degrees to 170 degrees and the second directing internal angle is from 70 degrees to 120 degrees. The method according to claim 1,
Wherein at least a part of a mounting surface mounted on the module substrate is subjected to insulation treatment or cutting treatment so as to prevent a short circuit. The method according to claim 1,
Wherein the metal reflector includes a heat dissipation material having a high thermal conductivity so as to discharge heat generated in the module substrate and the light emitting device package to the outside. The method according to claim 1,
A thermally conductive bonding medium bonding the metal reflector to a wiring layer of the module substrate, and transferring heat generated from the module substrate and the light emitting device package to the metal reflector;
Further comprising a light emitting diode package module. The method according to claim 1,
Wherein a reflection protrusion or a light absorbing layer is formed at a central portion of the second reflection surface and at a central portion of the fourth reflection surface so as to prevent centralization of light. delete The method according to claim 1,
Wherein the light emitting device package is one of a chip scale package (CSP), a wafer level package (WLP), and a flip chip having a light conversion material. A light guide plate;
A module substrate having a longitudinal length corresponding to the edge portion so as to be installed at a side edge portion of the light guide plate;
At least one light emitting device or light emitting device package mounted on the module substrate; And
A metal reflector formed of a metallic material and provided with a reflection cup part for reflecting the light generated from the light emitting device or the light emitting device package toward the light guide plate and surrounding the light emitting device or the light emitting device package; And
And an alignment protrusion formed on the front surface of the metal reflector to align the optical axis with the light guide plate,
The metal reflector includes:
A first reflection surface having a first directing inner angle in a longitudinal direction of the reflective cup portion so that light emitted from the light emitting device or the light emitting device package can be relatively widely dispersed in a width direction of the light guide plate, A third reflecting surface positioned opposite to the one reflecting surface is formed,
And a second directing inner angle smaller than the first directing inner angle in a minor axis direction of the reflective cup portion so that light generated from the light emitting device or the light emitting device package can be relatively narrowly dispersed in the thickness direction of the light guide plate A fourth reflecting surface located on the opposite side of the second reflecting surface and the second reflecting surface,
Wherein the alignment protrusion includes a pair of projection members having an interval equal to or greater than the thickness of the light guide plate, and the light guide plate is fitted between the pair of projection members and fixed to the metal reflector.
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CN109346589A (en) * 2018-10-23 2019-02-15 杭州倾诺光电科技有限公司 A kind of package assembling and packaging technology of LED lamp bead
KR20200030831A (en) * 2018-09-13 2020-03-23 주식회사 루멘스 Quantum dot LED package and Quantum dot LED module comprising the same

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KR20150025219A (en) * 2013-08-28 2015-03-10 삼성디스플레이 주식회사 Light emitting module, backlight unit comprising the same and liquid crystal display comprising the same

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JP2005310680A (en) * 2004-04-23 2005-11-04 Matsushita Electric Works Ltd Light-emitting diode lighting device
KR20120007294A (en) * 2010-07-14 2012-01-20 엘지디스플레이 주식회사 Light emitting diode and liquid crystal display device including the same
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