KR101765797B1 - Light emitting diode and method for fabricating of the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode, and more particularly, to a light emitting diode having an improved light directing angle.
A feature of the present invention is that an LED is mounted in a reverse shape so that the light generated from the LED chip is reflected through the reflection surface of the LED and then emitted to the outside of the LED.
As a result, it is possible to improve the directivity angle of the light emitted from the LED, thereby preventing the LED mura phenomenon from occurring and reducing the thickness of the backlight unit.
In addition, since the LED of the present invention does not require a lens, it is possible to prevent the occurrence of color spots, and the process of forming the lens can be eliminated, thereby improving the efficiency of the LED manufacturing process.

Description

TECHNICAL FIELD The present invention relates to a light emitting diode (LED)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode, and more particularly, to a light emitting diode having an improved light directing angle.

2. Description of the Related Art Recently, display devices capable of visually displaying information together with development of information technology and mobile communication technology have been developed, and display devices are classified into a self-luminous display having a luminescent characteristic and an image Emitting display that can be used as a display device.

Examples of the non-light emitting type display include an LCD (Liquid Crystal Display).

Here, the LCD requires an additional light source since it is an element that does not have its own light emitting element. Accordingly, a backlight unit having a light source on the back surface is provided, and light is irradiated toward the front surface of the LCD, thereby realizing an image which can be identified only through the backlight unit.

The backlight unit uses a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED) as a light source.

In particular, LEDs are widely used as light sources for displays, having characteristics such as small size, low power consumption, and high reliability.

Meanwhile, a general backlight unit is divided into a side light type and a direct light type according to the arrangement structure of the lamp. In the sidelight type, one or a pair of lamps are disposed on one side of the light guide plate Or two or two pairs of lamps are disposed on both side portions of the light guide plate, and the direct light type lamp has a structure in which several lamps are disposed under the optical sheet.

In recent years, research on liquid crystal display devices that are large-sized according to the demand of consumers has been actively conducted, and the direct light type is more suitable for a large-screen liquid crystal display device than the sidelight type.

FIG. 1 is a cross-sectional view of a direct light type liquid crystal display device using a general LED as a light source, and FIG. 2 is a cross-sectional view of the LED shown in FIG.

3 is a view schematically showing an emission angle at which light is emitted from the LED of FIG.

As shown in Fig. 1, a general liquid crystal display device is provided with a liquid crystal panel 10 composed of first and second substrates 12 and 14 and a backlight unit 20 behind the liquid crystal panel 10.

Here, the backlight unit 20 includes a reflection plate 22, and a plurality of LEDs 30 are arranged in parallel on the upper surface of the backlight unit 20. A plurality of optical sheets 27 are disposed on the LEDs 30.

At this time, the lights emitted from the two or three neighboring LEDs 30 are superimposed and mixed with each other, and then incident on the liquid crystal panel 10 to provide a surface light source.

Referring to FIG. 2, the structure of the LED 30 will be described in more detail. The LED 30 includes an LED chip 31 and a lens 38 covering the LED chip 31.

The LED chip 31 is placed on the heat dissipating slug 33 and the heat dissipating slug 33 is surrounded by the case 35 serving as a housing. The case 35 is provided with a pair of positive and negative electrode leads 36a and 36b which are electrically connected to each other through the LED chip 31 and the wire 37 and are exposed to the outside of the case 35. [

The pair of positive / negative electrode leads 36a and 36b are electrically connected to current supplying means (not shown) for supplying an operating current for emitting light of the LED chip 31 provided outside.

The upper surface of the case 35 covers and protects the reflection surfaces of the LED chip 31 and the heat dissipating slug 33 and the wires 37 and controls the angle of the main emission light generated from the LED chip 31 The lens 38 is located.

At this time, the lens 38 is made of a mixture of silicon (not shown) and a phosphor 39, thereby generating light of a specific color. For example, when the LED chip 31 generates blue light and the phosphor 39 mixed in the lens 38 is a yellow phosphor, the light ultimately generated from the LED chip 31 becomes white light.

When current is applied to the LED chip 31, light is emitted, and the emitted light is mixed with the light emitted by the phosphor 39 mixed with the lens 38, so that the white light is emitted to the outside.

A plurality of the LEDs 30 are provided, and the LEDs 30 are turned on at once to achieve a uniform planar light source through color mixing.

The backlight unit 20 including the LED 30 and the liquid crystal panel 10 are modularized through the top cover 60, the support main 50 and the cover bottom 70, that is, the liquid crystal panel 10 and the backlight A top cover 60 for covering the front edge of the liquid crystal panel 10 and a cover bottom 70 for covering the back surface of the backlight unit 20 in a state in which the edge of the unit 20 is covered with a square main support main body 50 And are integrated at the front and rear sides via the support main body 50.

In recent years, the liquid crystal display device has been used in a wide range such as a desktop computer monitor and a wall-mounted television as well as a portable computer, and a thin liquid crystal display device has been actively studied with a wide display area.

Accordingly, an attempt has been made to provide a thin liquid crystal display device by reducing the interval A between the LED 30 of the backlight unit 20 and the plurality of optical sheets 27. [

However, in order to supply a high-quality surface light source, which is the most important role of the backlight unit 20, to the liquid crystal panel 10, various optical designs for this purpose are considered. One of them is the LED 30 and a plurality of optical sheets 27) is an important factor.

In particular, in the case of the LED 30 having a certain orientation angle, light emitted from two or three neighboring LEDs 30 are superimposed and mixed with each other and then incident on the liquid crystal panel 10 to provide a surface light source, A hot spot is generated in a region corresponding to the LED 30 when the distance A between the LED 30 and the plurality of optical sheets 27 is small as shown in FIG. Between the LED 30 and the adjacent LED 30, the light emitted from the LED 30 is not overlapped or mixed with each other.

As a result, an LED mura phenomenon occurs, and further, the display quality of the liquid crystal display device deteriorates due to unevenness in luminance.

In order to solve this problem, it is necessary to increase the number of the LEDs 30 to increase the cost of the LED 30 and reduce the heat dissipation, And furthermore, the power consumption is increased.

Further, a lightweight liquid crystal display device can not be realized.

Particularly, due to the structural characteristics of the lens 38, the LED 30 generates a color deviation depending on the direction angle of the emitted light. That is, the light emitted from the LED 30 is concentrated at the center of the upper portion of the LED 30 The center portion is bright, but a dark color spot phenomenon occurs in the periphery.

As a result, the LED mura phenomenon is further exacerbated, which further increases the luminance unevenness, which further degrades the display quality of the liquid crystal display device.

SUMMARY OF THE INVENTION It is a first object of the present invention to provide an LED having improved directional angles and no color deviation.

Another object of the present invention is to provide a lightweight and thin liquid crystal display device and to solve defects such as LED mura or the like and to prevent a problem of deterioration of display quality due to uneven brightness of the liquid crystal display device This is the third purpose.

According to an aspect of the present invention, there is provided an image display apparatus comprising: a case defining a storage space opened toward the front and having an inner surface as a reflection surface, the storage space being filled with a transparent resin including a phosphor; An LED chip located on the transparent resin and emitting light toward the reflection surface; And a cathode electrode lead and a cathode electrode lead which are exposed to the outside of the case and are electrically connected to the LED chip through a wire. Light emitted from the LED chip is reflected by the reflection surface, To the outside of the light emitting diode.

At this time, the case has a bottom surface facing the front and a side bent perpendicularly to the four sides of the bottom surface, the storage space is in the form of a dome convex toward the bottom surface, A groove protruding forward is formed.

The transparent resin may be a mixture of a phosphor and a selected one of epoxy resin or silicone, the LED chip is a blue LED chip, and the phosphor is a yellow phosphor.

The LED chips are UVLED chips, and the phosphors are red (R), green (G), and blue (B) phosphors.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method comprising the steps of: preparing a case defining a storage space opened toward the front and having an inner surface as a reflection surface; Placing the LED chip on the front side of the opening of the case with the light emitted from the LED chip facing the reflective surface and locating the grooved base substrate; Injecting a transparent resin mixed with the phosphor into the storage space through the groove; Curing the transparent resin filled in the storage space; And etching and removing the base substrate with the upper portion of the cured transparent resin.

The LED chip, the anode lead, and the cathode lead are electrically connected to each other through a wire after the base substrate is positioned in front of the case, and an anode lead and a cathode lead are provided outside the case. .

The present invention also provides a printed circuit board comprising: a bar-shaped printed circuit board; A case which is mounted on the printed circuit board at a predetermined distance and which is open toward the front and defines a storage space having an inner surface as a reflection surface and the storage space is filled with a transparent resin including a fluorescent material; An LED chip located on the transparent resin and emitting light toward the reflection surface; And a cathode electrode lead and a cathode electrode lead which are exposed to the outside of the case and are electrically connected to the LED chip through a wire. Light emitted from the LED chip is reflected by the reflection surface, A light emitting diode (LED) that emits light toward the outside; A backlight unit including the LED assembly and an optical sheet seated on the LED assembly; A liquid crystal panel mounted on the backlight unit; A backlight unit and a support main body surrounding an edge of the liquid crystal panel; A cover bottom formed in close contact with the support main back surface; And a top cover which rims the edge of the liquid crystal panel and is assembled with the support main and cover bottoms.

The light guide plate is disposed on the same plane as the LED assembly, and further includes a light guide plate disposed under the optical sheet.

As described above, according to the present invention, the LED chip is mounted in a reverse shape so that the light generated from the LED chip is reflected through the reflection surface of the LED and then emitted to the outside of the LED, It is possible to improve the directivity angle of the emitted light, prevent the occurrence of LED mura phenomenon, and reduce the thickness of the backlight unit.

Further, since the LED of the present invention does not require a lens, it is possible to prevent a color spot from being generated due to color deviation, and the process of forming a lens can be eliminated, There is an effect that can be improved.

1 is a sectional view of a direct light type liquid crystal display device using a general LED as a light source.
Figure 2 is a cross-sectional view of the LED of Figure 1;
Fig. 3 is a view schematically showing an emission angle at which light is emitted from the LED of Fig. 1; Fig.
4 is an exploded perspective view illustrating a liquid crystal display device according to an embodiment of the present invention.
5 is a partial cross-sectional view of a backlight unit including an LED according to the present invention.
FIG. 6A is a perspective view schematically showing an LED according to an embodiment of the present invention, and FIG. 6B is a sectional view of FIG. 6A.
FIG. 7 is a schematic view showing a simulation result of a directivity angle of light emitted from the LEDs of FIGS. 6A to 6B; FIG.
8A to 8B are simulation results showing color deviations according to the orientation angle of the conventional LED and the LED according to the embodiment of the present invention.
9A to 9B and 10A to 10B are photographs for comparing illuminance of a conventional LED with an LED according to an embodiment of the present invention.
11A to 11D are process cross-sectional views schematically showing a manufacturing process of an LED according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

4 is an exploded perspective view illustrating a liquid crystal display device according to an embodiment of the present invention.

As shown in the figure, the liquid crystal display comprises a liquid crystal panel 110, a backlight unit 120, a support main 150, a cover bottom 170, and a top cover 160.

First, the liquid crystal panel 110 plays a key role in image display and includes first and second substrates 112 and 114 which are bonded to each other with a liquid crystal layer interposed therebetween.

At this time, a plurality of gate lines and data lines intersect to define a pixel on the inner surface of the first substrate 112, which is usually referred to as a lower substrate or an array substrate, although not clearly shown in the drawing, And a thin film transistor (TFT) is provided at each intersection point, and is connected to the transparent pixel electrode formed in each pixel in a one-to-one correspondence manner.

On the inner surface of the second substrate 114 called an upper substrate or a color filter substrate, a color filter of red (R), green (G), and blue (B) And a black matrix for covering non-display elements such as a gate line, a data line, and a thin film transistor. In addition, a transparent common electrode covering these elements is provided.

The printed circuit boards 118a and 118b are connected to each other along at least one edge of the liquid crystal panel 110 via a connection member 116 such as a flexible circuit board so that the side surfaces or the cover bottoms 170).

Although not clearly shown in the drawing, an upper and a lower alignment film (not shown) for determining the initial alignment direction of the liquid crystal are interposed between the two substrates 112 and 114 of the liquid crystal panel 110 and the liquid crystal layer A seal pattern is formed along the edges of both substrates 112 and 114 to prevent leakage of the liquid crystal layer filled therebetween.

At this time, upper and lower polarizers (not shown) are attached to the outer surfaces of the first and second substrates 112 and 114, respectively.

A backlight unit 120 for supplying light is provided on a back surface of the liquid crystal panel 110 so that a difference in transmittance represented by the liquid crystal panel 110 is externally expressed.

The backlight unit 120 includes an LED assembly 128, a transparent window 124 interposed on the LED assembly 128, and a plurality of optical sheets 127 interposed therebetween.

The LED assembly 128 described above includes a PCB 121 arranged to have a constant spacing along the longitudinal inner surface of the cover bottom 150 and a plurality of LEDs 200 mounted on each of the PCBs.

The backlight unit 120 includes a plurality of through holes 123 through which a plurality of LEDs 200 can pass so that the entire inner surface of the PCB 121 and the cover bottom 170 except for the plurality of LEDs 200 And a reflective white or silver reflective sheet 122.

A transparent window 124 having reflective dots 125 corresponding to a plurality of LEDs 200 is formed on the LED 200 exposed through the through hole 123 of the reflective sheet 122, A diffusion plate 126 for uniformity of brightness and a plurality of optical sheets 127 are interposed.

Here, the light emitted from the plurality of LEDs 200 of the present invention is uniformly irradiated toward the liquid crystal panel 110 through color mixing.

At this time, the reflective dot 125 of the transparent window 124 reflects and diffuses the linear light emitted from the plurality of LEDs 200, thereby realizing a more uniform surface light source and increasing color mixing. The reflective dots 125 may be made of white or silver sheet material and may correspond one-to-one with at least one LED 200. [

In addition, the plurality of optical sheets 127 include diffusion sheets, at least one light collecting sheet, etc., and various functional sheets such as a reflection type polarizing film called DBEF (dual brightness enhancement film).

A PCB 121 on which a plurality of LEDs 200 are mounted is a metal core printed circuit board having a heat dissipating function and a heat sink (not shown) is provided on the back surface of the MCPCB 121, The heat can be transferred from the heat exchanger 200 to the outside.

Accordingly, the white light emitted from the plurality of LEDs 200 passes through the transparent window 124, the diffusion plate 126, and the plurality of optical sheets 127, to which the reflective dots 125 are attached, So that the liquid crystal panel 110 can display a high-luminance image externally.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 160, the support main 150 and the cover bottom 170. The top cover 160 covers the upper surface and the side surface of the liquid crystal panel 110, And the front cover 160 is opened to display an image to be displayed on the liquid crystal panel 110. The liquid crystal panel 110 may be a liquid crystal display.

The cover bottom 170, which is based on the assembly of the liquid crystal display device and the liquid crystal panel 110 and the backlight unit 120, is formed in a rectangular plate shape, And a pair of side supports 129 in the form of a pair of bars joined to the edges of the cover bottom 170. The remaining two edges of the cover bottom 170 are raised obliquely to have a height equal to the height, Thereby forming a predetermined space in which the base 120 can be seated.

A support main body 150 having a rectangular frame shape and resting on the cover bottom 170 and covering the edges of the liquid crystal panel 110 and the backlight unit 120 is combined with the top cover 160 and the cover bottom 170.

The top cover 160 may be referred to as a case top or a top case. The support main 150 may be referred to as a guide panel or a main support or a mold frame. The cover bottom 170 may be referred to as a bottom cover.

At this time, each LED 200 of the present invention is configured such that light generated from an LED chip (not shown) is emitted in a direction toward the transparent window 124, that is, toward the liquid crystal panel 110, (Not shown) of the LED 200, and is emitted in a direction toward the liquid crystal panel 110. The light emitted from the LED 200 is reflected by the reflecting surface (not shown)

As a result, the directivity angle of the light emitted from each LED 200 can be improved.

Accordingly, the color mixing space in the backlight unit 120 can be substantially increased, and the color mixture light can be transmitted to the optical sheet 127 including the transparent window 124 together with the light reflected by the reflection sheet 122 The light is supplied to the liquid crystal panel 110 in the form of a more uniform planar light source.

Even if the distance between the transparent window 124 and the LED 200 to which the reflective dot 125 is attached is minimized, the LED mura phenomenon occurs due to the wider directional angle of the light emitted from the LED 200 Can be prevented.

5 is a partial cross-sectional view of a backlight unit 120 including an LED 200 according to the present invention. In FIG. 5, a part of a cross section cut along the longitudinal direction of the liquid crystal panel 110, A side support 129 and a cover bottom 170 are shown together.

The LED 200 according to the present invention diffuses the light emitted from the LED 200 to the side of the conventional LED 30 (see FIG. 3) for convenience of explanation. The directional angle of light is substantially increased as compared with the directional angle emitted from the light source.

Therefore, even when the distance A between the LED 200 and the plurality of optical sheets 127 is reduced for the light weight and thinness of the liquid crystal display of the present invention, a hot spot is formed in the area corresponding to the LED 200, It is possible to prevent the occurrence of dark portions (B in FIG. 3) in which light emitted from the LED 200 is not superimposed and mixed with each other between the LED 200 and the adjacent LED 200 .

This prevents LED mura phenomenon from occurring.

Particularly, since the LED 200 according to the embodiment of the present invention does not require the lens (38 in Fig. 2), it is possible to prevent the problem that the color spot is generated due to the structural characteristic of the lens (38 in Fig. 2) .

The efficiency of the manufacturing process of the LED 200 can also be improved. Let me take a closer look at this later.

6A is a perspective view schematically showing an LED according to an embodiment of the present invention, FIG. 6B is a cross-sectional view of FIG. 6A, and FIG. 7 is a schematic view of a simulation result of a directivity angle of light emitted from the LEDs of FIGS. Fig.

As shown in the figure, the LED 200 according to the embodiment of the present invention includes an LED chip 210 that emits light and a control unit 220 that controls the angle of the main emission light generated from the LED chip 210.

More specifically, the LED chip 210 is first placed on the control unit 220, and the control unit 220 is defined by the storage space 230a of the case 230. That is, the case 230 is formed in a rectangular box shape having a rectangular bottom surface and four sides thereof vertically bent at a predetermined height so as to have a storage space 230a filled with a transparent resin (not shown) And the light generated from the LED chip 210 is emitted to the outside of the LED 200 through the front opening with the front facing the bottom.

That is, the storage space 230a is shaped like a dome convex from the front of the case 230 toward the bottom, and the reflection surface 270 is formed along the inner surface of the storage space 230a. A transparent resin (not shown) is filled in the storage space 230a of the case 230 and then cured to form the control unit 220. [

Here, a specific shape of the groove 231 is formed at the center of the dome-shaped receiving space 230a.

The recess 231 may be formed in a conical shape having a predetermined angle from the bottom of the case 230 toward the forward direction, and the light emitted from the LED 200 has a wide directivity angle.

At this time, the transparent resin (not shown) includes the fluorescent material 260, and the fluorescent material 260 may be mixed with transparent epoxy resin or silicone resin at a certain ratio.

Here, the epoxy resin (not shown) has a relatively large hardness value to cause disconnection of the wire 250 electrically connecting the LED chip 210 to the anode and the anode leads 240a and 240b, and epoxy resin (not shown) Which causes a reduction in light flux or yellowing due to the absorption of light by the short-wavelength visible light ray caused by the light.

Recently, silicon (not shown) has been used which has a small hardness and a large restoring force to reduce the occurrence of disconnection of the wire 250 and does not exhibit a yellowing tendency due to long-time use.

The phosphor 260 is a yellow phosphor when the LED chip 210 is a blue LED chip and the yellow phosphor is YAG: YAG (Al) garnet doped with cerium (Ce) doped with a wavelength of 530 to 570 nm. Ce (T3Al5O12: Ce) based phosphor is preferably used.

When the LED chip 210 is a UVLED chip, the phosphor 260 is composed of three phosphors of red (R), green (G), and blue (B) B) by adjusting the compounding ratio of the phosphor (260) of the phosphor (B).

Here, the red (R) phosphor is a YOX (Y2O3: EU) based phosphor composed of a compound of yttrium oxide (Y2O3) and europium (EU) having a main wavelength of 611 nm and the green (G) (LaPo4: Ce, Tb) phosphor, which is a compound of phosphorus (Po4) and lanthanum (La) and terbium (Tb) having a dominant wavelength as a main wavelength, and a blue phosphor (B) BAM blue (BaMgAl 10 O 17: EU) based phosphor which is a compound of Eu and Eu and a substance of magnesium oxide and aluminum oxide are preferably used.

Here, the dominant wavelength is the wavelength at which the highest luminance is generated in red (R), green (G), and blue (B), respectively, as the dominant wavelength of the phosphor.

The LED chip 210 is positioned on the cured transparent resin (not shown) of the control unit 220. The LED chip 210 is disposed on the reflective surface 270 of the storage space 230a, (Not shown).

The case 230 is provided with a pair of positive and negative electrode leads 240a and 240b which are electrically connected to each other through the LED chip 210 and the wire 250 and are exposed to the outside of the case 230.

At this time, a current supply means (not shown) for supplying a power source (+) for emitting light of the LED chip 210 and a ground power source (-) is provided outside and is electrically connected to the anode and the cathode leads 240a and 240b .

Accordingly, when the power source (+) and the ground power source (-) are supplied to the LED chip 210 through the pair of lead frames 240a and 240b, the LED chip 210 emits light. The generated light is emitted toward the reflecting surface 270 of the receiving space 230a of the case 230. The fluorescent material 260 of the transparent resin (not shown) filled in the receiving space 230a of the case 230, And is mixed with the light emitted by the phosphor 260 to emit white light.

The white light is then reflected by the reflecting surface 270 of the storage space 230a and then emitted to the outside of the LED 200 through the opened front of the case 230. [

At this time, referring to FIG. 7, the light emitted to the outside of the LED 200 has a wider steering angle.

This is because the light path of the light generated from the LED chip 210 is longer than that of the general LED (30 in FIG. 2) where the lens (38 in FIG. 2) Because it has advantageous characteristics.

As described above, since the LED 200 according to the present invention has a wider light directing angle than the conventional LED (30 in FIG. 2), the color mixing space in the backlight unit 120 can be increased.

Accordingly, it is possible to prevent a hot spot from being generated in an area corresponding to the LED 200 even when the distance A between the LED 200 and the plurality of optical sheets 127 is reduced, (B in FIG. 3) in which light emitted from the LED 200 is not superimposed and mixed with each other between the LED 200 adjacent to the LED 200 and the LED 200 adjacent to the LED 200 can be prevented.

This prevents the LED mura phenomenon from occurring and the thickness of the backlight unit 120 can be reduced.

Particularly, since the LED 200 according to the embodiment of the present invention does not require the lens (38 in Fig. 2), it is possible to prevent the problem that the color spot is generated due to the structural characteristic of the lens (38 in Fig. 2) .

In addition, the process of forming the lens (38 in FIG. 2) can be eliminated, and the efficiency of the manufacturing process of the LED 200 can be improved. In other words, the lens (38 in FIG. 2) The process is very difficult and the process cost is high. Therefore, the LED 200 of the present invention can eliminate the process of forming the lens (38 in FIG. 2), so that the LED (200 in FIG. 2) 200) manufacturing process can be improved, and the process cost can also be reduced.

In addition, the LED 200 of the present invention can eliminate the heat dissipation slug (33 in FIG. 2) which must be provided for the heat dissipation of the LED chip 210 in which a lot of heat is generated. That is, the LED 200 according to the present invention can heat a large amount of heat generated from the LED chip 210 through a transparent resin (not shown) by locating the LED chip 210 on the transparent resin (not shown) Therefore, a separate heat dissipation slug (33 in Fig. 2) can be eliminated.

8A to 8B are simulation results showing color deviations according to the conventional LED and the orientation angle of the LED according to the embodiment of the present invention. Here, FIG. 8A is a photograph showing a color deviation of a general LED, and FIG. 8B is a simulation result showing a color deviation according to a directivity angle of an LED according to an embodiment of the present invention.

Referring to FIGS. 8A and 8B, it can be seen that FIG. 8B shows no change in color depending on the orientation angle as compared with FIG. 8A.

In other words, the LED 200 according to the present invention achieves a uniform color without color variation according to the angle of the light emitted from the LED 200, compared with a general LED (30 in FIG. 2).

FIGS. 9A to 9B and FIGS. 10A to 10B are photographs for comparing illuminance of a conventional LED with an LED according to an embodiment of the present invention. FIGS. 9A and 10A are photographs showing illuminance of a typical LED, 10b are photographs showing the illuminance of the LED according to the embodiment of the present invention.

9A and 9B, it can be seen that the photograph of FIG. 9B is formed to have a wider illuminance at the central portion than the photograph of FIG. 9A. In addition to the illuminance at the central portion, the illuminance of the photograph of FIG. As shown in Fig.

This is because the LED chip (210 in FIG. 6B) is mounted in a reverse shape and the light generated from the LED chip (210 in FIG. 6B) is reflected on the reflecting surface of the case The light path of the light generated from the LED chip 210 (shown in FIG. 6B) becomes long, and the LED chip (210 of FIG. 6B) The light directing angle is improved to a wider range as compared with a general LED (30 in Fig. 2) where the lens (38 in Fig. 2) is located.

Therefore, when reducing the distance (A in FIG. 5) between the LED 200 and the plurality of optical sheets (127 in FIG. 5), the general LED (30 in FIG. 2) A dark portion (B in FIG. 3) having a lower luminance than the central portion of the LED (30 in FIG. 2) is generated between the LEDs (30 in FIG. 2) The LED of the present invention (200 of FIG. 6B) improves the directional angle of light so that the brightness of neighboring LEDs (also referred to as " LEDs " (200 in FIG. 6B) between the light emitting diodes (LEDs) 200a and 200b of the light emitting diodes (LEDs) 6a and 6b.

Furthermore, it is possible to prevent the display quality of the liquid crystal display device from deteriorating due to the luminance unevenness.

Therefore, the liquid crystal display device of the present invention can reduce the thickness of the backlight unit (120 in Fig. 5).

Further, it is possible to prevent the occurrence of color spots due to the structural characteristics of the lens (38 in Fig. 2) and to eliminate the lens (38 in Fig. 2) and the heat dissipating slug (33 in Fig. 2) 200) can be improved.

11A to 11D are process cross-sectional views schematically showing a manufacturing process of an LED according to an embodiment of the present invention.

As shown in FIG. 11A, a case 230 constituting a control unit 220 of the LED 200 of the present invention is provided. The case 230 has a rectangular shape having a bottom surface and four sides of the bottom surface, And a front space facing the bottom surface is opened to form a storage space 230a therein.

At this time, the storage space 230a has a convex dome shape toward the bottom of the case 230. The inner surface of the storage space 230a is formed to form the reflection surface 270, and the storage space 230a, A groove 231 protruding forward from the bottom surface is formed.

In this case 230, positive / negative electrode leads 240a and 240b are formed so as to be exposed to the outside.

Next, as shown in FIG. 11B, the LED chip 210 is positioned in front of the opened case 230. The LED chip 210 is mounted on the base substrate 300 on which the groove 310 is formed And a wire 250 are connected.

The LED chip 210 has a reverse shape in front of the opening of the case 230 so that the light generated from the LED chip 210 is emitted toward the reflecting surface 270 of the receiving space 230a of the case 230. [ .

At this time, the base substrate 300 uses an insulating substrate, and examples of the material include glass and plastic.

The wire 250 connected to the LED chip 210 is electrically connected to the positive / negative electrode leads 240a and 240b formed to be exposed to the outside of the case 230.

Next, as shown in FIG. 11C, a transparent resin (not shown) mixed with the phosphors 260 is injected into the receiving space 230a of the case 230 through the groove 310 formed in the base substrate 300 (Not shown) in which the phosphor 260 is mixed.

Then, as shown in FIG. 11D, the base substrate 300 is etched and removed to complete the manufacturing process of the LED 200 according to the embodiment of the present invention.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

200: LED
210: LED chip, 220: control unit, 230: case, 230a: storage space, 231: groove
240a, 240b: positive and negative electrode lead, 250: wire, 260: fluorescent material
270: Reflecting surface

Claims (10)

A case which is open toward the front and in which a storage space is defined, the inner surface of which is made of a reflective surface, the storage space being filled with a transparent resin including a phosphor;
An LED chip positioned at a central portion of the case on the transparent resin and emitting light toward the reflection surface;
And an anode electrode lead and a cathode electrode lead which are exposed to the outside of the case and are respectively disposed at edge portions of the case and spaced apart from the LED chip and electrically connected to the LED chip through a wire,
/ RTI >
Wherein the phosphor is filled with a selected one of an epoxy resin or a silicone resin to fill the entire storage space,
A conical recess protruding from the bottom of the case toward the front is disposed at the center of the storage space,
The light emitted from the LED chip is reflected by the reflecting surface and does not pass through the opening area of the center portion of the case corresponding to the LED chip and passes through the case corresponding to the positive electrode lead and the negative electrode lead, Is emitted to the outside only through the opening region of the edge portion of the light emitting diode.
The method according to claim 1,
Wherein the case has a vertically curved side surface and a bottom surface facing the front side, and the storage space is in the form of a dome convex toward the bottom surface.
delete delete The method according to claim 1,
Wherein the LED chip is a blue LED chip, and the phosphor is a yellow phosphor.
The method according to claim 1,
Wherein the LED chip is a UVLED chip, and the phosphor is a red (R), green (G), and blue (B) phosphor.
Preparing a case in which a storage space defined by a front surface and a back surface is defined;
Mounting the LED chip on the base substrate on which the grooves are formed by locating the LED chip in front of the center of the case with the light emitted from the LED chip facing the reflective surface;
Injecting a transparent resin mixed with the phosphor into the storage space through the groove;
Curing the transparent resin filled in the storage space;
Etching the base substrate with the upper portion of the cured transparent resin
Lt; / RTI >
And a cathode electrode lead and a cathode electrode lead, which are exposed to the outside of the case and are disposed at the edge portion of the case,
Wherein the phosphor is filled with a selected one of an epoxy resin or a silicone resin to fill the entire storage space,
A conical recess protruding from the bottom of the case toward the front is disposed at the center of the storage space,
Wherein the light emitted from the LED chip is reflected by the reflecting surface and does not pass through the opening area of the central portion of the case corresponding to the LED chip but passes through the case corresponding to the positive electrode lead and the negative electrode lead And the light is emitted externally toward the front through only the opening region of the edge portion.
8. The method of claim 7,
Wherein the LED chip, the anode lead, and the cathode lead are electrically connected through a wire after positioning the base substrate in front of the case.
A bar-shaped printed circuit board; A case which is mounted on the printed circuit board at a predetermined distance and which is open toward the front and defines a storage space having an inner surface as a reflection surface and the storage space is filled with a transparent resin including a fluorescent material; An LED chip positioned at a central portion of the case on the transparent resin and emitting light toward the reflection surface; And a cathode electrode lead and a cathode electrode lead that are exposed to the outside of the case and are respectively disposed at edge portions of the case and spaced apart from the LED chip and electrically connected to the LED chip through a wire, Wherein the housing space is filled with a selected one of an epoxy resin and a silicone resin, and a conical groove protruding from the bottom of the case toward the front is disposed in the center of the storage space, Wherein the opening portion of the center portion of the case corresponding to the LED chip does not pass through after the light is reflected by the reflective surface and the opening portion of the edge portion of the case corresponding to the positive electrode lead and the negative electrode lead, And a light emitting diode which is externally emitted toward the front through only the region LED assembly and;
A backlight unit including the LED assembly and an optical sheet seated on the LED assembly;
A liquid crystal panel mounted on the backlight unit;
A backlight unit and a support main body surrounding an edge of the liquid crystal panel;
A cover bottom formed in close contact with the support main back surface;
A cover main body and a cover bottom,
And the liquid crystal display device.
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